FAIRCHILD FDD6637_10

FDD6637_F085
®
P-Channel PowerTrench MOSFET
-35V, -21A, 18mΩ
Features
Applications
„ Typ rDS(on) = 9.7mΩ at VGS = -10V, ID =- 14A
„ Inverter
„ Typ rDS(on) = 14.4mΩ at VGS = -4.5V, ID =- 11A
„ Power Supplies
„ Typ Qg(10) = 45nC at VGS = -10V
„
„ High performance trench technology for extremely low
rDS(on).
„
„ Qualified to AEC Q101
®
„ RoHS Compliant
FDD6637_F085 P-Channel PowerTrench
December 2010
MOSFET
©2010 Fairchild Semiconductor Corporation
FDD6637_F085 Rev. C
1
www.fairchildsemi.com
Symbol
VDSS
Parameter
Ratings
-35
Drain to Source Voltage
VDS(Avalanche) Drain to Source Avalanche Voltage (maximum)
VGS
ID
EAS
PD
TJ, TSTG
Gate to Source Voltage
Units
V
-45
V
±25
V
Drain Current Continuous (TC < 155oC, VGS = 10V)
-21
Pulsed
A
See Figure 4
Single Pulse Avalanche Energy
(Note 1)
61
mJ
Power Dissipation
68
W
Dreate above 25oC
0.46
W/oC
Operating and Storage Temperature
o
-55 to + 175
C
Thermal Characteristics
RθJC
Maximum Thermal Resistance Junction to Case
2.2
o
C/W
RθJA
Maximum Thermal Resistance Junction to Ambient TO-252, 1in2 copper pad area
40
o
C/W
Package Marking and Ordering Information
Package
TO-252
Reel Size
13”
Tape Width
12mm
Quantity
2500 units
Electrical Characteristics TC = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
Off Characteristics
BVDSS
Drain to Source Breakdown Voltage
ID = 250μA, VGS = 0V
-35
-
-
V
IDSS
Zero Gate Voltage Drain Current
VDS = -28V, VGS = 0V
-
-
-1
μA
IGSS
Gate to Source Leakage Current
VGS = ±25V
-
-
±100
nA
VGS = VDS, ID = -250μA
-1
-1.6
-3
V
-
9.7
11.6
On Characteristics
VGS(th)
Gate to Source Threshold Voltage
ID = -14A, VGS= -10V
rDS(on)
gFS
Drain to Source On Resistance
Forward Transconductance
ID = -11A, VGS= -4.5V
-
14.4
18
ID = -14A, VGS= -10V, TC = 150oC
-
15.3
18
VDS = -5V, ID = -14A
-
35
-
VDS = -20V, VGS = 0V,
f = 1MHz
-
2370
-
pF
-
470
-
pF
pF
mΩ
S
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
-
250
-
RG
Gate Resistance
f = 1MHz
-
3.6
-
Ω
Qg(TOT)
Total Gate Charge at -10V
VGS = 0 to -10V
-
45
63
nC
Qg(5)
Total Gate Charge at -5V
VGS = 0 to -5V
Qgs
Gate to Source Gate Charge
Qgd
Gate to Drain “Miller“ Charge
FDD6637_F085 Rev. C
2
VDD = -20V
ID = -14A
-
25
35
nC
-
7
-
nC
-
10
-
nC
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MOSFET
Device
FDD6637_F085
®
Device Marking
FDD6637
FDD6637_F085 P-Channel PowerTrench
MOSFET Maximum Ratings TC = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
-
18
32
ns
-
10
20
ns
-
62
100
ns
-
36
58
ns
Switching Characteristics
td(on)
Turn-On Delay Time
tr
Rise Time
td(off)
Turn-Off Delay Time
tf
Fall Time
VDD = -20V, ID = -1A,
VGS = -10V,
RGEN = 6Ω
Drain-Source Diode Characteristics
VSD
Source to Drain Diode Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
ISD = -14A
IF = -14A, dISD/dt = 100A/μs
-
-0.8
-1.2
V
-
28
37
ns
-
15
20
nC
Notes:
1: Starting TJ = 25oC, L = 1mH, IAS = -11A, VGS=10V, VDD=-35V during the inductor charging time and 0V during the time in avalanche
®
FDD6637_F085 P-Channel PowerTrench
Electrical Characteristics TC = 25oC unless otherwise noted
MOSFET
This product has been designed to meet the extreme test conditions and environment demanded by the automotive industry. For
a copy of the requirements, see AEC Q101 at: http://www.aecouncil.com/
All Fairchild Semiconductor products are manufactured, assembled and tested under ISO9000 and QS9000 quality systems
certification.
FDD6637_F085 Rev. C
3
www.fairchildsemi.com
-ID, DRAIN CURRENT (A)
POWER DISSIPATION MULTIPLIER
70
1.2
1.0
0.8
0.6
0.4
0.2
CURRENT LIMITED
BY PACKAGE
60
50
VGS = -10V
40
30
VGS = -4.5V
20
10
o
RθJC = 2.2 C/W
0.0
0
0
25
50
75
100
125
150
TC, CASE TEMPERATURE(oC)
175
25
50
75
100
125
150
175
o
TC, CASE TEMPERATURE ( C)
Figure 2. Maximum Continuous Drain Current vs
Case Temperature
Figure 1. Normalized Power Dissipation vs Case
Temperature
2
D = 0.50
0.20
0.10
0.05
0.02
0.01
MOSFET
NORMALIZED THERMAL
IMPEDANCE, ZθJC
®
DUTY CYCLE - DESCENDING ORDER
1
PDM
t1
0.1
t2
NOTES:
DUTY FACTOR: D = t1/t2
PEAK TJ = PDM x ZθJA x RθJA + TC
SINGLE PULSE
0.01
-5
10
-4
10
-3
-2
-1
0
10
10
10
t, RECTANGULAR PULSE DURATION(s)
1
10
10
Figure 3. Normalized Maximum Transient Thermal Impedance
1000
VGS = 10V
TC = 25oC
-IDM, PEAK CURRENT (A)
FOR TEMPERATURES
ABOVE 25oC DERATE PEAK
CURRENT AS FOLLOWS:
175 - TC
I = I2
150
100
SINGLE PULSE
10
-5
10
-4
10
-3
-2
-1
10
10
10
t, RECTANGULAR PULSE DURATION(s)
0
10
1
10
Figure 4. Peak Current Capability
FDD6637_F085 Rev. C
FDD6637_F085 P-Channel PowerTrench
Typical Characteristics
4
www.fairchildsemi.com
60
If R = 0
tAV = (L)(IAS)/(1.3*RATED BVDSS - VDD)
If R ≠ 0
tAV = (L/R)ln[(IAS*R)/(1.3*RATED BVDSS - VDD) +1]
-IAS, AVALANCHE CURRENT (A)
-ID, DRAIN CURRENT (A)
300
100
100us
STARTING TJ = 25oC
10
10
1ms
10ms
DC
1
OPERATION IN THIS
AREA MAY BE
LIMITED BY rDS(on)
0.1
0.3
SINGLE PULSE
TJ = MAX RATED
TC = 25oC
1
10
-VDS, DRAIN TO SOURCE VOLTAGE (V)
STARTING TJ = 150oC
1
0.001
90
0.01
0.1
1
10
100
tAV, TIME IN AVALANCHE (ms)
NOTE: Refer to Fairchild Application Notes AN7514 and AN7515
Figure 5. Forward Bias Safe Operating Area
VDD = -5V
-ID, DRAIN CURRENT (A)
80
TJ = -55oC
TJ = 25oC
60
o
TJ = 175 C
40
20
0
0
1
2
3
4
5
-VGS, GATE TO SOURCE VOLTAGE (V)
60
PULSE DURATION = 80μs
DUTY CYCLE = 0.5% MAX
50
40
30
TJ = 175oC
20
10
0
TJ = 25oC
2
4
6
8
10
-VGS, GATE TO SOURCE VOLTAGE (V)
Figure 9. Drain to Source On-Resistance
Variation vs Gate to Source Voltage
FDD6637_F085 Rev. C
60
VGS = -10V
VGS = -6V
VGS = -5V
VGS = -4.5V
VGS = -4V
VGS = -3.5V
VGS = -3V
40
20
0
1
2
3
4
-VDS, DRAIN TO SOURCE VOLTAGE (V)
5
Figure 8. Saturation Characteristics
NORMALIZED
DRAIN TO SOURCE ON-RESISTANCE
rDS(on), DRAIN TO SOURCE
ON-RESISTANCE (mΩ)
ID = -14A
80
0
6
Figure 7. Transfer Characteristics
70
PULSE DURATION = 80μs
DUTY CYCLE = 0.5% MAX
MOSFET
-ID, DRAIN CURRENT (A)
100
PULSE DURATION = 80μs
DUTY CYCLE = 0.5% MAX
®
100
Figure 6. Unclamped Inductive Switching
Capability
1.8
1.6
PULSE DURATION = 80μs
DUTY CYCLE = 0.5% MAX
1.4
1.2
1.0
0.8
0.6
-80
ID = -14A
VGS = -10V
-40
0
40
80
120
160
TJ, JUNCTION TEMPERATURE(oC)
200
Figure 10. Normalized Drain to Source On
Resistance vs Junction Temperature
5
FDD6637_F085 P-Channel PowerTrench
Typical Characteristics
www.fairchildsemi.com
1.3
1.10
NORMALIZED GATE
THRESHOLD VOLTAGE
1.2
NORMALIZED DRAIN TO SOURCE
BREAKDOWN VOLTAGE
VGS = VDS
ID = -250μA
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
-80
-40
0
40
80
120
160
TJ, JUNCTION TEMPERATURE(oC)
200
Figure 11. Normalized Gate Threshold Voltage vs
Junction Temperature
-VGS, GATE TO SOURCE VOLTAGE(V)
CAPACITANCE (pF)
Coss
Crss
100
Figure 13. Capacitance vs Drain to Source
Voltage
FDD6637_F085 Rev. C
0.95
0.90
-80
-40
0
40
80
120
160
TJ, JUNCTION TEMPERATURE (oC)
200
10
VDD = -10V
8
MOSFET
1000
1
10
-VDS, DRAIN TO SOURCE VOLTAGE (V)
1.00
®
Ciss
100
0.1
1.05
Figure 12. Normalized Drain to Source
Breakdown Voltage vs Junction Temperature
10000
f = 1MHz
VGS = 0V
ID = -250μA
VDD = -20V
6
VDD = -30V
4
2
0
0
10
20
30
Qg, GATE CHARGE(nC)
40
50
Figure 14. Gate Charge vs Gate to Source Voltage
6
FDD6637_F085 P-Channel PowerTrench
Typical Characteristics
www.fairchildsemi.com
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY
PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY
THEREIN, WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE
EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used here in:
1. Life support devices or systems are devices or systems which, (a) are
intended for surgical implant into the body or (b) support or sustain life,
and (c) whose failure to perform when properly used in accordance with
instructions for use provided in the labeling, can be reasonably
expected to result in a significant injury of the user.
2.
A critical component in any component of a life support, device, or
system whose failure to perform can be reasonably expected to cause
the failure of the life support device or system, or to affect its safety or
effectiveness.
ANTI-COUNTERFEITING POLICY
Fairchild Semiconductor Corporation’s Anti-Counterfeiting Policy. Fairchild’s Anti-Counterfeiting Policy is also stated on our external website,
www.Fairchildsemi.com, under Sales Support.
Counterfeiting of semiconductor parts is a growing problem in the industry. All manufactures of semiconductor products are experiencing counterfeiting of their
parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed
application, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the
proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild
Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild
Distributors are genuine parts, have full traceability, meet Fairchild’s quality standards for handing and storage and provide access to Fairchild’s full range of
up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address and
warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is
committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative / In Design
Datasheet contains the design specifications for product development. Specifications
may change in any manner without notice.
Preliminary
First Production
Datasheet contains preliminary data; supplementary data will be published at a later
date. Fairchild Semiconductor reserves the right to make changes at any time without
notice to improve design.
No Identification Needed
Full Production
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to
make changes at any time without notice to improve the design.
Obsolete
Not In Production
Datasheet contains specifications on a product that is discontinued by Fairchild
Semiconductor. The datasheet is for reference information only.
Rev. I51
FDD6637_F085 Rev. C
7
www.fairchildsemi.com
® MOSFET
*Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
FDD6637_F085 P-Channel PowerTrench
TRADEMARKS
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not
intended to be an exhaustive list of all such trademarks.
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®
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