ONSEMI BDV65B_08

BDV65B(NPN),
BDV64B(PNP)
Complementary Silicon
Plastic Power Darlingtons
. . . for use as output devices in complementary general purpose
amplifier applications.
• High DC Current Gain − HFE = 1000 (min.) @ 5 Adc
• Monolithic Construction with Built−in Base Emitter Shunt Resistors
• Pb−Free Packages are Available*
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MAXIMUM RATINGS
Rating
Collector−Emitter Voltage
Symbol
Max
Unit
VCEO
100
Vdc
Collector−Base Voltage
VCB
100
Vdc
Emitter−Base Voltage
VEB
5.0
Vdc
IC
10
20
Adc
Base Current
IB
0.5
Adc
Total Device Dissipation @ TC = 25_C
Derate above 25_C
PD
125
1.0
W
W/_C
TJ, Tstg
–65 to
+150
_C
Symbol
Max
Unit
RqJC
1.0
_C/W
Collector Current
− Continuous
− Peak
Operating and Storage Junction Temperature
Range
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10 AMPERE DARLINGTON
COMPLEMENTARY SILICON
POWER TRANSISTORS
60−80−100−120 VOLTS,
125 WATTS
NPN
PNP
COLLECTOR 2,4
COLLECTOR 2
BASE
1
BASE
1
EMITTER 3
BDV65B
EMITTER 3
BDV64B
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction−to−Case
MARKING
DIAGRAM
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
1
SOT−93
(TO−218)
CASE 340D
2
AYWW
BDV6xBG
3
A
Y
WW
G
BDV6xB
=
=
=
=
=
Assembly Location
Year
Work Week
Pb−Free Package
Device Code
x = 4 or 5
ORDERING INFORMATION
Device
BDV65B
BDV65BG
BDV64B
BDV64BG
© Semiconductor Components Industries, LLC, 2008
September, 2008 − Rev. 13
1
Package
Shipping
SOT−93
30 Units / Rail
SOT−93
(Pb−Free)
30 Units / Rail
SOT−93
30 Units / Rail
SOT−93
(Pb−Free)
30 Units / Rail
Publication Order Number:
BDV65B/D
BDV65B (NPN), BDV64B (PNP)
1.0
DERATING FACTOR
0.8
0.6
0.4
0.2
0
0
25
50
100
75
TC, CASE TEMPERATURE (°C)
125
150
Figure 1. Power Derating
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ELECTRICAL CHARACTERISTICS
Characteristic
Symbol
Min
Max
Unit
VCEO(sus)
100
−
Vdc
Collector Cutoff Current
(VCE = 50 Vdc, IB = 0)
ICEO
−
1.0
mAdc
Collector Cutoff Current
(VCB = 100 Vdc, IE = 0)
ICBO
−
0.4
mAdc
Collector Cutoff Current
(VCB = 50 Vdc, IE = 0, TC = 150_C)
ICBO
−
2.0
mAdc
Emitter Cutoff Current
(VBE = 5.0 Vdc, IC = 0)
IEBO
−
5.0
mAdc
hFE
1000
−
−
Collector−Emitter Saturation Voltage
(IC = 5.0 Adc, IB = 0.02 Adc)
VCE(sat)
−
2.0
Vdc
Base−Emitter Saturation Voltage
(IC = 5.0 Adc, VCE = 4.0 Vdc)
VBE(on)
−
2.5
Vdc
OFF CHARACTERISTICS
Collector−Emitter Sustaining Voltage (1)
(IC = 30 mAdc, IB = 0)
ON CHARACTERISTICS
DC Current Gain
(IC = 5.0 Adc, VCE = 4.0 Vdc)
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2
BDV65B (NPN), BDV64B (PNP)
NPN
PNP
10K
hFE , DC CURRENT GAIN
hFE , DC CURRENT GAIN
VCE = 4 V
10K
1K
1K
4
0.1
1
10
1
IC, COLLECTOR CURRENT (A)
0.1
Figure 2. DC Current Gain
V, VOLTAGE (V)
V, VOLTAGE (V)
10
VBE(sat) @ IC/IB = 250
1
0.1
1
IC, COLLECTOR CURRENT (A)
1
0.1
10
VBE(sat) @ IC/IB = 250
0.1
Figure 4. “On” Voltages
IC, COLLECTOR CURRENT (A)
20
5.0 ms 1.0 ms
dc
5
SECONDARY BREAKDOWN
LIMITED @ TJ v 150°C
THERMAL LIMIT @ TC = 25°C
BONDING WIRE LIMIT
1
BDV65B, BDV64B
1
10
There are two limitations on the power handling ability of
a transistor: average junction temperature and second
breakdown. Safe operating area curves indicate IC − VCE
limits of the transistor that must be observed for reliable
operation i.e., the transistor must not be subjected to greater
dissipation than the curves indicate.
The data of Figure 6 is based on TJ(pk) = 150_C, TC is
variable depending on conditions. Second breakdown pulse
limits are valid for duty cycles to 10% provided TJ(pk)
v 150_C. TJ(pk) may be calculated from the data in
Figure 7. At high case temperatures, thermal limitations will
reduce the power that can be handled to values less than the
limitations imposed by second breakdown.
100 μs
50
1
IC, COLLECTOR CURRENT (A)
Figure 5. “On” Voltages
100
10
10
Figure 3. DC Current Gain
10
0.1
1
IC, COLLECTOR CURRENT (A)
10
50
30
VCE, COLLECTOR-EMITTER VOLTAGE (V)
100
Figure 6. Active Region Safe Operating Area
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3
r(t), TRANSIENT THERMAL RESISTANCE
(NORMALIZED)
BDV65B (NPN), BDV64B (PNP)
1.0
D = 0.5
0.5
0.2
0.2
0.1
0.1
P(pk)
ZθJC(t) = r(t) RθJC
RθJC = 1.0°C/W MAX
0.05
0.05
0.02
D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t1
TJ(pk) - TC = P(pk) ZθJC(t)
t1
0.03
t2
0.01
DUTY CYCLE, D = t1/t2
(SINGLE PULSE)
0.01
0.01
0.05
0.1
0.5
1.0
5
t, TIME (ms)
10
50
100
500
1000
Figure 7. Thermal Response
PACKAGE DIMENSIONS
SOT−93 (TO−218)
CASE 340D−02
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
C
Q
B
U
S
E
DIM
A
B
C
D
E
G
H
J
K
L
Q
S
U
V
4
A
L
1
K
2
3
D
J
H
MILLIMETERS
MIN
MAX
--20.35
14.70
15.20
4.70
4.90
1.10
1.30
1.17
1.37
5.40
5.55
2.00
3.00
0.50
0.78
31.00 REF
--16.20
4.00
4.10
17.80
18.20
4.00 REF
1.75 REF
INCHES
MIN
MAX
--0.801
0.579
0.598
0.185
0.193
0.043
0.051
0.046
0.054
0.213
0.219
0.079
0.118
0.020
0.031
1.220 REF
--0.638
0.158
0.161
0.701
0.717
0.157 REF
0.069
V
G
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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4
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BDV65B/D