ONSEMI MJE350G

MJE350
Plastic Medium Power
PNP Silicon Transistor
This device is designed for use in line−operated applications such as
low power, line−operated series pass and switching regulators
requiring PNP capability.
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Features
• High Collector−Emitter Sustaining Voltage −
•
•
•
0.5 AMPERE
POWER TRANSISTOR
PNP SILICON
300 VOLTS, 20 WATTS
VCEO(sus) = 300 Vdc @ IC
= 1.0 mAdc
Excellent DC Current Gain −
hFE = 30−240 @ IC
= 50 mAdc
Plastic Thermopad Package
Pb−Free Package is Available*
MAXIMUM RATINGS
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Rating
Symbol
Value
Unit
VCEO
300
Vdc
VEB
3.0
Vdc
Collector Current − Continuous
IC
500
mAdc
Total Power Dissipation @ TC = 25_C
Derate above 25_C
PD
20
0.16
W
mW/_C
TJ, Tstg
–65 to +150
_C
Characteristic
Symbol
Max
Unit
Thermal Resistance, Junction−to−Case
qJC
6.25
_C/W
Collector−Emitter Voltage
Emitter−Base Voltage
Operating and Storage Junction
Temperature Range
TO−225
CASE 77
STYLE 1
3
2 1
MARKING DIAGRAM
THERMAL CHARACTERISTICS
YWW
JE350G
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
Y
WW
JE350
G
ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted)
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Characteristic
Symbol
Min
Max
Unit
VCEO(sus)
300
−
Vdc
Collector Cutoff Current
(VCB = 300 Vdc, IE = 0)
ICBO
−
100
mAdc
Emitter Cutoff Current
(VEB = 3.0 Vdc, IC = 0)
IEBO
−
100
mAdc
= Year
= Work Week
= Device Code
= Pb−Free Package
OFF CHARACTERISTICS
Collector−Emitter Sustaining Voltage
(IC = 1.0 mAdc, IB = 0)
ON CHARACTERISTICS
DC Current Gain
(IC = 50 mAdc, VCE = 10 Vdc)
hFE
30
240
−
ORDERING INFORMATION
Device
MJE350
MJE350G
Package
Shipping
TO−225
500 Units/Box
TO−225
(Pb−Free)
500 Units/Box
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2007
January, 2007 − Rev. 14
1
Publication Order Number:
MJE350/D
MJE350
hFE , DC CURRENT GAIN
100
1.0
TJ = 150°C
TJ = 25°C
0.8
25°C
70
50
−55 °C
30
20
20
30
10
20
IC/IB = 10
VCE(sat)
50
70
100
200
300
0
500
Figure 1. DC Current Gain
Figure 2. “On” Voltages
100ms
dc
1.0ms
500ms
TJ = 150°C
BONDING WIRE LIMITED
THERMALLY LIMITED @ TC = 25°C
SECOND BREAKDOWN LIMITED
30
50
70
100
200
300 400
VCE, COLLECTOR−EMITTER VOLTAGE (VOLTS)
5.0 7.0
10
IC/IB = 5.0
20 30
50 70 100
IC, COLLECTOR CURRENT (mA)
θV, TEMPERATURE COEFFICIENTS (mV/°C)
IC, COLLECTOR CURRENT (mA)
20
0.4
0.2
200
30
VBE @ VCE = 10 V
IC, COLLECTOR CURRENT (mA)
1000
700
500
100
70
50
0.6
VCE = 2.0 V
VCC = 10 V
10
5.0 7.0 10
300
VBE(sat) @ IC/IB = 10
V, VOLTAGE (VOLTS)
200
200 300
500
+1.2
+0.8
*APPLIES FOR IC/IB < hFE/4
+0.4
0
*qVC for VCE(sat)
−0.4
−0.8
+100 °C to +150°C
+25 °C to +100°C
−55 °C to +25°C
+25 °C to +150°C
−1.2
−1.6
qVB for VBE
−2.0
−55 °C to +25°C
−2.4
−2.8
5.0 7.0
Figure 3. Active−Region Safe Operating Area
10
20 30
50 70 100
IC, COLLECTOR CURRENT (mA)
200 300
500
Figure 4. Temperature Coefficients
There are two limitations on the power handling ability of
a transistor: average junction temperature and second
breakdown. Safe operating area curves indicate IC − VCE
limits of the transistor that must be observed for reliable
operation; i.e., the transistor must not be subjected to greater
dissipation than the curves indicate.
The data of Figure 3 is based on T J(pk) = 150_C; TC is
variable depending on conditions. Second breakdown pulse
limits are valid for duty cycles to 10% provided T J(pk)
v 150_C. At high case temperatures, thermal limitations
will reduce the power that can be handled to values less than
the limitations imposed by second breakdown.
PD, POWER DISSIPATION (WATTS)
20
16
12
8.0
4.0
0
0
20
40
60
80
100
120
TC, CASE TEMPERATURE (°C)
Figure 5. Power Derating
http://onsemi.com
2
140
160
MJE350
PACKAGE DIMENSIONS
TO−225
CASE 77−09
ISSUE Z
−B−
U
F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 077−01 THRU −08 OBSOLETE, NEW STANDARD
077−09.
C
Q
M
−A−
1 2 3
H
DIM
A
B
C
D
F
G
H
J
K
M
Q
R
S
U
V
K
J
V
G
R
S
0.25 (0.010)
M
A
M
B
M
D 2 PL
0.25 (0.010)
M
A
M
B
M
INCHES
MIN
MAX
0.425
0.435
0.295
0.305
0.095
0.105
0.020
0.026
0.115
0.130
0.094 BSC
0.050
0.095
0.015
0.025
0.575
0.655
5_ TYP
0.148
0.158
0.045
0.065
0.025
0.035
0.145
0.155
0.040
−−−
MILLIMETERS
MIN
MAX
10.80
11.04
7.50
7.74
2.42
2.66
0.51
0.66
2.93
3.30
2.39 BSC
1.27
2.41
0.39
0.63
14.61
16.63
5 _ TYP
3.76
4.01
1.15
1.65
0.64
0.88
3.69
3.93
1.02
−−−
STYLE 1:
PIN 1. EMITTER
2. COLLECTOR
3. BASE
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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3
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MJE350/D