SAMSUNG K5N1229ACD-BQ12

Rev. 1.0, Jun. 2010
K5N1229ACD-BQ12
MCP Specification
512Mb (32M x16) Muxed Burst, Multi Bank SLC NOR Flash
+ 128Mb (8M x16) Multiplexed Synchronous Burst UtRAM2
datasheet
SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND
SPECIFICATIONS WITHOUT NOTICE.
Products and specifications discussed herein are for reference purposes only. All information discussed
herein is provided on an "AS IS" basis, without warranties of any kind.
This document and all information discussed herein remain the sole and exclusive property of Samsung
Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property
right is granted by one party to the other party under this document, by implication, estoppel or otherwise.
Samsung products are not intended for use in life support, critical care, medical, safety equipment, or
similar applications where product failure could result in loss of life or personal or physical harm, or any
military or defense application, or any governmental procurement to which special terms or provisions
may apply.
For updates or additional information about Samsung products, contact your nearest Samsung office.
All brand names, trademarks and registered trademarks belong to their respective owners.
ⓒ 2009 Samsung Electronics Co., Ltd. All rights reserved.
-1-
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
Revision History
Revision No.
History
Draft Date
Remark
Editor
0.0
Initial issue.
- 512M Bit SLC Mux NOR Flash C-die_Ver 1.0
- 128M Bit Mux UtRAM2 C-die_Ver 1.0
Jun. 1, 2010
Preliminary
H.Y.Min
1.0
<Common>
- Finalized.
Jun. 22, 2010
Final
H.Y.Min
-2-
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
1. Features
<Common>
• Operating Temperature : -25°C ~ 85°C
• Package : 56Ball FBGA Type - 8mm x 9.2mm x 1.2mmt
0.5mm ball pitch
<NOR Flash>
• This device has the Sync MRS option only
(Extended Configuration Register)
• Single Voltage, 1.7V to 1.95V for Read and Write operations
• Organization
- 33,554,432 x 16 bit ( Word Mode Only)
• Multiplexed Data and Address for reduction of interconnections
- A/DQ0 ~ A/DQ15
• Read While Program/Erase Operation
• Multiple Bank Architecture
- 16 Banks (32Mb Partition)
• OTP Block : Extra 512-Word block
• Read Access Time (@ CL=30pF)
- Asynchronous Random Access Time : 100ns
- Synchronous Random Access Time :95ns
- Burst Access Time :7ns (108MHz)
• Burst Length :
- Continuous Linear Burst
- Linear Burst : 8-word & 16-word with Wrap
• Block Architecture
- Uniform block part : Five hundred twelve 64Kword blocks
- Boot block part : Four 16Kword blocks and five hundred eleven
64Kword blocks (Bank 0 contains four 16 Kword blocks and thirty-one
64Kword blocks, Bank 1 ~ Bank 15 contain four hundred eighty 64Kword
blocks)
<UtRAM2>
• Process technology: CMOS
• Organization: 8M x 16 bit
• Power supply voltage: 1.7V~1.95V
• Three state outputs
• Supports Configuration Register Set
- CRE pin set up
- Software set up
• Supports power saving modes
- PAR (Partial Array Refresh)
- Internal TCSR (Temperature Compensated Self Refresh)
• Supports driver strength optimization
• Support 2 operation modes
- Asynchronous mode
- Synchronous mode
• Random access time:70ns
• Synchronous burst operation
- Max. clock frequency : 108MHz
- Fixed and Variable read latency
- 4 / 8 / 16 / 32 and Continuous burst
- Wrap / No-wrap
- Latency :3(Variable) @ 108MHz
- Burst stop
- Burst read suspend
- Burst write data masking
• Reduce program time using the VPP
• Support 512-word Buffer Program
• Power Consumption (Typical value, CL=30pF)
- Synchronous Read Current : 35mA at 133MHz
- Program/Erase Current : 25mA
- Read While Program/Erase Current : 45mA
- Standby Mode/Auto Sleep Mode : 30uA
• Block Protection/Unprotection
- Using the software command sequence
- Last two boot blocks are protected by WP=VIL (Boot block part)
- Last one block (BA511) is protected by WP=VIL (Uniform block part)
- All blocks are protected by VPP=VIL
• Handshaking Feature
- Provides host system with minimum latency by monitoring RDY
• Erase Suspend/Resume
• Program Suspend/Resume
• Unlock Bypass Program/Erase
• Blank Check Feature
• Hardware Reset (RESET)
• Data Polling and Toggle Bits
- Provides a software method of detecting the status of program
or erase completion
• Endurance
- 100K Program/Erase cycles
• Support Common Flash Memory Interface
• Low Vcc Write Inhibit
• Output Driver Control by Configuration Register
-3-
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
2. General Description
The K5N1229ACD is a Multi Chip Package Memory which combines 512Mb SLC MuxNOR Flash Memory and 128Mb Multiplexed Synchronous Burst
Uni-Transistor Random Access Memory2.
The 512Mb Muxed NOR Flash featuring single 1.8V power supply is a 512Mbit Muxed Burst Multi Bank Flash Memory organized as 32Mx16. The memory architecture of the device is designed to divide its memory arrays into 512blocks(Uniform block part)/515 blocks(Boot block part) with independent
hardware protection. This block architecture provides highly flexible erase and program capability. The NOR Flash consists of sixteen banks. This device
is capable of reading data from one bank while programming or erasing in the other bank. Regarding read access time, the device(for 66/83MHz) provides an 11ns burst access time and an 95ns initial access time at 66MHz. At 83MHz, the device(for 66/83MHz) provides an 9ns burst access time and an
95ns initial access time. At 108MHz, the device(for 108/133MHz) provides an 7ns burst access time and an 95ns initial access time. At 133MHz, the
device(for 108/133MHz) provides an 6ns burst access time and an 95ns initial access time. The device performs a program operation in units of 16 bits
(Word) and erases in units of a block. Single or multiple blocks can be erased. The block erase operation is completed within typically 0.6sec. The device
requires 25mA as program/erase current in the extended temperature ranges.
SAMSUNG’s UtRAM products are designed to meet the request from the customers who want to cope with the fast growing mobile applications that need
high-speed random access memory. UtRAM is the solution for the mobile market with its low cost, high density and high performance feature. device is
fabricated by SAMSUNG′s advanced CMOS technology using one transistor memory cell. The device supports the traditional SRAM like asynchronous
operation (asynchronous read and asynchronous write), the fully synchronous operation (synchronous burst read and synchronous burst write). These
operation modes are defined through the configuration register setting. It supports the special features for the standby power saving. Those are the
PAR(Partial Array Refresh) mode, and internal TCSR(Temperature Compensated Self Refresh). It also supports variable and fixed latency, driver
strength settings, Burst sequence (wrap or No-wrap) options and a device ID register (DIDR).
The K5N1229ACD is suitable for use in data memory of mobile communication system to reduce not only mount area but also power consumption. This
device is available in 56-ball FBGA Type.
-4-
Rev. 1.0
datasheet
K5N1229ACD-BQ12
MCP Memory
3. Pin Configuration
-
1
2
3
4
5
6
7
8
9
10
11
12
13
14
A
NC
-
-
-
-
-
-
-
-
-
-
-
-
NC
B
-
-
-
-
-
-
-
-
-
-
-
-
-
-
C
-
-
NC
DNU
-
-
/LBc
/UBc
-
-
A24r
NC
-
-
D
-
-
RDYr
/WAITc
A21rc
VSSrc
CLKrc
VCCrc
/WErc
VPPr
A19rc
A17rc
A22rc
-
-
E
-
-
VCCQrc
A16rc
A20rc
/AVDrc
A23r
/RESETr
/WPr
A18rc
/CEr
VSSQrc
-
-
F
-
-
VSSrc
ADQ7rc
ADQ6rc
ADQ13rc
ADQ12rc
ADQ3rc
ADQ2rc
ADQ9rc
ADQ8rc
/OErc
-
-
G
-
-
ADQ15rc
ADQ14rc
VSSQrc
ADQ5rc
ADQ4rc
ADQ11rc
ADQ10rc
VCCQrc
ADQ1rc
ADQ0rc
-
-
H
-
-
NC
VCCrc
-
-
/CSc
CREc
-
-
DNU
NC
-
-
J
-
-
-
-
-
-
-
-
-
-
-
-
-
-
K
NC
-
-
-
-
-
-
-
-
-
-
-
-
NC
56 FBGA: Top View (Ball Down)
NOR + UtRAM
NOR Flash
UtRAM2
Power
Ground
NC/DNU
-5-
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
4. Pin Description
Pin Name
A23r, A24r
Pin Function(NOR Flash)
Pin Name
Address Input(NOR only)
ADQ0rc ~ ADQ15rc
Pin Function(Common)
Multiplexed Address/Data Input/Output
/CEr
Chip Enable
A16rc ~ A22rc
/WPr
Write Enable
CLKrc
Clock
Hardware Reset
/OErc
Output Enable
/RESETr
VPPr
Pin Name
/LBc,/UBc
Accelerates Programming
Pin Function(UtRAM2)
Lower Byte Enable, Upper Byte Enable
CREc
Control Register Enable
/CSc
Chip Enable
Address Input
/WErc
Write Enable
/AVDrc
Address Valid Input
RDYr
/WAITc
Ready Out(NOR)
VCCrc
Power Supply
VCCQrc
VSSrc
Data Availability (UtRAM)
Data Input/Output Power
Ground
Pin Name
DNU
NC
-6-
Pin Function
Do Not Use
No Connection
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
5. Ordering Information
K5
N
12
29
A
C
Samsung MCP Memory
2Chip MCP
D - B
Q
12
UtRAM2 Access Time
12 : 108MHz
Device Type
N : Muxed NOR + Muxed UtRAM2
Flash Access Time
Q : 108MHz
NOR Flash Density
12 : 512Mb, x16
Package
B : FBGA(HF, OSP LF)
Version
D : 5rd Generation
UtRAM2 Density, (Organization)
29 : 128Mb, x16,(Ut2)
Block Architecture
C :Uniform Boot Block
Operating Voltage
A : 1.8V/1.8V
-7-
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
6. Functional Block Diagram
VSSrc VCCrc VCCQrc
Address(A16rc to A22rc)
Address(A23r,A24r)
CLKrc
/OErc
/WErc
/AVDrc
RDYr,/WAITc
/CEr
/WPr
/RESETr
VPPr
512Mb NOR
Flash Memory
VSSrc VCCrc VCCQrc
128Mb
UtRAM2
/CSc
/LBc,/UBc
CREc
-8-
ADQ0rc to ADQ15rc
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
7. Package Dimension
0.08 MAX
56-Ball Fine pitch Ball Grid Array Package (measured in millimeters)
Units:millimeters
#A1 INDEX MARK
8.00±0.10
8.00±0.10
A
0.50 x 13 = 6.50
B
14 13 12 11 10 9 8 7 6 5 4 3 2 1
(Datum A)
(Datum B)
#A1
A
D
E
F
G
H
1.00
J
0.23±0.05
K
1.00
0.50
1.10±0.10
3.25
56-∅0.30±0.05
∅ 0.20 M A B
BOTTOM VIEW
TOP VIEW
-9-
9.20±0.10
0.50 x 9 = 4.50
9.20±0.10
2.25
B
C
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
512Mb (32M x16) Mux NOR Flash C-die
- 10 -
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
1.0 FUNCTIONAL BLOCK DIAGRAM
Bank 0
Address
X
Dec
Vcc
Vss
Vpp
CLK
CE
OE
WE
WP
RESET
RDY
AVD
I/O
Interface
&
Bank
Control
Bank 0
Cell Array
Y Dec
Latch &
Control
Y Dec
Latch &
Control
Bank 1
Address
X
Dec
Bank 1
Cell Array
Bank 15
Address
X
Dec
Bank 15
Cell Array
Latch &
Control
Y Dec
A16~A24
A/DQ0~
A/DQ15
Erase
Control
Block
Inform
High
Voltage
Gen.
Program
Control
[Table 1] PRODUCT LINE-UP
Mode
Synchronous/Burst
VCC=1.7V
-1.95V
Asynchronous
1C
(66MHz)
1D
(83MHz)
1E
(108MHz)
1F
(133MHz)
Max. Initial Access Time (tIAA, ns)
95
95
95
95
Max. Burst Access Time (tBA, ns)
11
9
7
6
Max. Access Time (tAA, ns)
100
100
100
100
Max. CE Access Time (tCE, ns)
100
100
100
100
Max. OE Access Time (tOE, ns)
15
15
15
15
Speed Option
- 11 -
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
[Table 2] DEVICE BANK DIVISIONS
Bank 0 ~ Bank 15
Type
Block Sizes
512Mbit (Boot block part)
Four 16Kword blocks and five hundred eleven 64Kword blocks
512Mbit (Uniform block part)
Five hundred twelve 64Kword blocks
[Table 3] DEVICE BANK DIVISIONS (Uniform block)
Bank
Bank size
Quantity of Blocks
Block Size
0
32Mb
32
64 Kwords
1
32Mb
32
64 Kwords
2
32Mb
32
64 Kwords
3
32Mb
32
64 Kwords
4
32Mb
32
64 Kwords
5
32Mb
32
64 Kwords
6
32Mb
32
64 Kwords
7
32Mb
32
64 Kwords
8
32Mb
32
64 Kwords
9
32Mb
32
64 Kwords
10
32Mb
32
64 Kwords
11
32Mb
32
64 Kwords
12
32Mb
32
64 Kwords
13
32Mb
32
64 Kwords
14
32Mb
32
64 Kwords
15
32Mb
32
64 Kwords
Quantity of Blocks
Block Size
4
16 Kwords
31
64 Kwords
[Table 4] DEVICE BANK DIVISIONS (Top Boot block)
Bank
Bank size
0
32Mb
1
32Mb
32
64 Kwords
2
32Mb
32
64 Kwords
3
32Mb
32
64 Kwords
4
32Mb
32
64 Kwords
5
32Mb
32
64 Kwords
6
32Mb
32
64 Kwords
7
32Mb
32
64 Kwords
8
32Mb
32
64 Kwords
9
32Mb
32
64 Kwords
10
32Mb
32
64 Kwords
11
32Mb
32
64 Kwords
12
32Mb
32
64 Kwords
13
32Mb
32
64 Kwords
14
32Mb
32
64 Kwords
15
32Mb
32
64 Kwords
- 12 -
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
[Table 5] DEVICE BANK DIVISIONS (Bottom Boot block)
Bank
Bank size
Quantity of Blocks
Block Size
15
32Mb
32
64 Kwords
14
32Mb
32
64 Kwords
13
32Mb
32
64 Kwords
12
32Mb
32
64 Kwords
11
32Mb
32
64 Kwords
10
32Mb
32
64 Kwords
9
32Mb
32
64 Kwords
8
32Mb
32
64 Kwords
7
32Mb
32
64 Kwords
6
32Mb
32
64 Kwords
5
32Mb
32
64 Kwords
4
32Mb
32
64 Kwords
3
32Mb
32
64 Kwords
2
32Mb
32
64 Kwords
1
32Mb
32
64 Kwords
0
32Mb
31
64 Kwords
4
16 Kwords
- 13 -
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
2.0 PRODUCT INTRODUCTION
The device is an 512Mbit (536,870,912 bits) NOR-type Burst Flash memory. The device features 1.8V single voltage power supply operating within the
range of 1.7V to 1.95V. The device is programmed by using the Channel Hot Electron (CHE) injection mechanism which is used to program EPROMs.
The device is erased electrically by using Fowler-Nordheim tunneling mechanism. To provide highly flexible erase and program capability, the device
adapts a block memory architecture that divides its memory array into 512 blocks (64-Kword x 512 blocks, Uniform block part) / 515 blocks (16-Kword x
4 + 64-Kword x 511, Boot block part). Programming is done in units of 16 bits (Word). All bits of data in one or multiple blocks can be erased when the
device executes the erase operation. To prevent the device from accidental erasing or over-writing the programmed data, 512 / 515 memory blocks can
be hardware protected. Regarding read access time, at 66MHz, the device(for 66/83MHz) provides a burst access of 11ns with initial access times of
95ns at 30pF. At 83MHz, the device(for 66/83MHz) provides a burst access of 9ns with initial access times of 95ns at 30pF. At 108MHz, the device(for
108/133MHz) provides a burst access of 7ns with initial access times of 95ns at 30pF. At 133MHz, the device(for 108/133MHz) provides a burst access of
6ns with initial access times of 95ns at 30pF. The command set of device is compatible with standard Flash devices. The device uses Chip Enable (CE),
Write Enable (WE), Address Valid(AVD) and Output Enable (OE) to control asynchronous read and write operation. For burst operations, the device additionally requires Ready (RDY) and Clock (CLK). Device operations are executed by selective command codes. The command codes to be combined with
addresses and data are sequentially written to the command registers using microprocessor write timing. The command codes serve as inputs to an internal state machine which controls the program/erase circuitry. Register contents also internally latch addresses and data necessary to execute the program and erase operations. The device is implemented with Internal Program/Erase Routines to execute the program/erase operations. The Internal
Program/Erase Routines are invoked by program/erase command sequences. The Internal Program Routine automatically programs and verifies data at
specified addresses. The Internal Erase Routine automatically pre-programs the memory cell which is not programmed and then executes the erase
operation. The device has means to indicate the status of completion of program/erase operations. The status can be indicated via Data polling of DQ7,
or the Toggle bit (DQ6). Once the operations have been completed, the device automatically resets itself to the read mode. The device requires only
35mA as burst and asynchronous mode read current and 25mA for Buffer program/erase operations.
[Table 6] Device Bus Operations
Operation
Asynchronous Read Operation
Write
Standby
Hardware Reset
Load Initial Burst Address
Burst Read Operation
Terminate Burst Read Cycle
Terminate Burst Read Cycle via RESET
Terminate Current Burst Read Cycle and Start
New Burst Read Cycle
CE
OE
WE
A16-24
A/DQ0-15
RESET
CLK
L
L
H
Add In
Add In/DOUT
H
L
L
H
L
Add In
Add In / DIN
H
L
H
X
X
X
High-Z
H
X
X
X
X
X
X
High-Z
L
X
X
L
H
H
Add In
Add In
H
L
L
H
X
Burst
DOUT
H
H
X
X
X
High-Z
H
X
X
X
X
X
X
High-Z
L
X
X
L
H
H
Add In
Add In
H
NOTE : L=VIL (Low), H=VIH (High), X=Don’t Care.
- 14 -
AVD
H
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
3.0 COMMAND DEFINITIONS
The device operates by selecting and executing its operational modes. Each operational mode has its own command set. In order to select a certain
mode, a proper command with specific address and data sequences must be written into the command register. Writing incorrect information which
include address and data or writing an improper command will reset the device to the read mode. The defined valid register command sequences are
stated in Table 8.
[Table 7] Command Sequences
Command Definitions
Asynchronous Read
Reset5),20)
Cycle
Add
Data
Add
Data
Autoselect
Add
Manufacturer ID6)
Data
Autoselect
Add
Device ID6)
Data
Autoselect
Add
Block Protection Verify7)
Data
Autoselect
Add
Handshaking 6), 8)
Data
Program
Unlock Bypass
Unlock Bypass Program 9)
Unlock Bypass Block Erase9)
Unlock Bypass Chip Erase9)
Unlock Bypass Reset
Chip Erase
Block Erase
Erase Suspend 10)
Erase Resume11)
Program Suspend 12)
Program Resume 11)
Block Protection/Unprotection 13)
CFI Query 14)
Blank check
Add
Data
Add
Data
Add
Data
Add
Data
Add
Data
Add
Data
Add
Data
Add
Data
Add
Data
Add
Data
Add
Data
Add
Data
Add
Data
Add
Data
Add
Data
1
1
4
4
4
4
4
3
2
2
2
2
6
6
1
1
1
1
3
1
4
1st Cycle
2nd Cycle 3rd Cycle
4th Cycle
5th Cycle
6th Cycle
RA
RD
XXXH
F0H
555H
2AAH
(DA)555H
(DA)X00H
AAH
55H
90H
ECH
555H
2AAH
(DA)555H
(DA)X01H
AAH
55H
90H
NOTE6
555H
2AAH
(BA)555H
AAH
55H
90H
555H
2AAH
(DA)555H
(DA)X03H
AAH
55H
90H
0H/1H
555H
2AAH
555H
PA
AAH
55H
A0H
PD
555H
2AAH
555H
AAH
55H
20H
XXX
PA
A0H
PD
(BA)X02H
00H / 01H
XXX
BA
80H
30H
XXXH
XXXH
80H
10H
XXXH
XXXH
90H
00H
555H
2AAH
555H
555H
2AAH
555H
AAH
55H
80H
AAH
55H
10H
555H
2AAH
555H
555H
2AAH
BA
AAH
55H
80H
AAH
55H
30H
XXX
XXX
ABP
60H
60H
60H
(DA)XXXH
B0H
(DA)XXXH
30H
(DA)XXXH
B0H
(DA)XXXH
30H
(DA)X55H
98H
555H
2AAH
BA
BA
AAH
55H
BCH
D0H
- 15 -
K5N1229ACD-BQ12
datasheet
Command Definitions
Write to Buffer 15)
Program buffer to Flash 15)
Write to Buffer Abort Reset 16),20)
Set Burst Mode Configuration Register 17),18)
Set Extended Configuration Register 17),19)
Enter OTP Block Region
Exit OTP Block Region
Rev. 1.0
Cycle
Add
Data
Add
Data
Add
Data
Add
Data
Add
Data
Add
Data
Add
Data
3
1
3
3
3
3
4
MCP Memory
1st Cycle
2nd Cycle
3rd Cycle
4th Cycle
5th Cycle
6th Cycle
555H
2AAH
BA
AAH
55H
25H
BA
PA
WBL
WC
PD
PD
555H
2AAH
XXX
AAH
55H
F0H
555H
2AAH
NOTE 18
AAH
55H
C0H
555H
2AAH
NOTE 19
AAH
55H
C5H
555H
2AAH
XXX
AAH
55H
70H
555H
2AAH
555H
XXX
AAH
55H
75H
00H
BA
29H
NOTE :
1) RA : Read Address , PA : Program Address, RD : Read Data, PD : Program Data , BA : Block Address (A24 ~ A14), DA : Bank Address (A24 ~ A21)
ABP : Address of the block to be protected or unprotected , DI :Die revision ID, CR : Configuration Register Setting,
WBL : Write Buffer Location, WC : Word Count
2) The 4th cycle data of autoselect mode and RD are output data. The others are input data.
3) Data bits DQ15–DQ8 are don’t care in command sequences, except for RD, PD, WC and Device ID.
4) Unless otherwise noted, address bits A24–A11 are don’t cares.
5) The reset command is required to return to read mode.
If a bank entered the autoselect mode during the erase suspend mode, writing the reset command returns that bank to the erase suspend mode.
If a bank entered the autoselect mode during the program suspend mode, writing the reset command returns that bank to the program suspend mode.
If DQ5 goes high during the program or erase operation, writing the reset command returns that bank to read mode or erase suspend mode if that
bank was in erase suspend mode.
6) The 3rd and 4th cycle bank address of autoselect mode must be same.
Device ID Data : Top(3010H), Bottom(3011H), Uniform(3012H)
7) Normal Block Protection Verify : 00H for an unprotected block and 01H for a protected block.
OTP Block Protect verify (with OTP Block Address after Entering OTP Block) : 00H for unlocked, and 01H for locked.
8) 0H for handshaking, 1H for non-handshaking
9) The unlock bypass command sequence is required prior to this command sequence.
10) The system may read and program in non-erasing blocks when in the erase suspend mode.
The system may enter the autoselect mode when in the erase suspend mode.
The erase suspend command is valid only during a block erase operation, and requires the bank address.
11) The erase/program resume command is valid only during the erase/program suspend mode, and requires the bank address.
12) This mode is used only to enable Data Read by suspending the Program operation.
13) Set ABP(Address of the block to be protected or unprotected) as either A6 = VIH, A1 = VIH and A0 = VIL for unprotected or A6 = VIL, A1 = VIH
and A0 = VIL for protected.
14) Command is valid when the device is in Read mode or Autoselect mode.
15) For Buffer Program, Firstly Enter "Write to Buffer" Command sequence and then Enter Block Address and Word Count which is the number of word
data will be programmed. Word Count is smaller than the number of data wanted to program by one, Example if 15 words are wanted to program
then WC (Word Count) is 14. After Entering Command, Enter PA/PD’s (Program Addresses/ Program Data). Finally Enter "Program buffer to Flash"
Command sequence, This starts a buffer program operation. This Device supports 512-word Buffer Program.
There is some caution points.
- The number of PA/PD’s which are entered must be same to WC+1
- PA’s which are entered must be same A24~A9 address bits because Buffer Address is A24~A9 address and decided by PA entered firstly.
- If PA which are entered isn’t same Buffer Address, then PA/PD which is entered may be ignored and this buffer programming operation is aborted.
To return to normal operation, hardware reset or "Write to Buffer Abort Reset" command is issued.
- Overwrite for program buffer is also prohibited.
16) Command sequence resets device for next command after aborted write-to-buffer operation.
17) See "Set Burst Mode Configuration Register" for details.
18) On the third cycle, the data should be "C0h", address bits A10-A0 should be 101_0101_0101b, and address bits A21-A11 set the code to be latched.
19) On the third cycle, the data should be "C5h", address bits A10-A0 should be 101_0101_0101b, and address bits A21-A11 set the code to be latched.
20) After software reset and write to buffer abort reset command, min. 5us recovery time is needed for normal read mode.
- 16 -
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
4.0 DEVICE OPERATION
The device has inputs/outputs that accept both address and data information. To write a command or command sequence (which includes programming
data to the device and erasing blocks of memory), the system must drive CLK, AVD and CE to VIL and OE to VIH when providing an address to the device,
and drive CLK, WE and CE to VIL and OE to VIH when writing commands or data.
The device provides the unlock bypass mode to save its program time for program operation. Unlike the standard program command sequence which is
comprised of four bus cycles, only two program cycles are required to program a word in the unlock bypass mode. One block, multiple blocks, or the
entire device can be erased. Table 17 indicates the address space that each block occupies. The device’s address space is divided into sixteen banks. A
“bank address” is the address bits required to uniquely select a bank. Similarly, a “block address” is the address bits required to uniquely select a block.
ICC2 in the DC Characteristics table represents the active current specification for the write mode. The AC Characteristics section contains timing specification tables and timing diagrams for write operations.
4.1 Read Mode
The device automatically enters to asynchronous read mode after device power-up. No commands are required to retrieve data in asynchronous mode.
After completing an Internal Program/Erase Routine, each bank is ready to read array data. The reset command is required to return a bank to the read(or
erase-suspend-read)mode if DQ5 goes high during an active program/erase operation, or if the bank is in the autoselect mode.
Sync MRS option (Extended Configuration Register)
The synchronous(burst) mode will automatically start on the rising edge of the CLK input while AVD is held low after Extended Mode Register
Setting to A13=0, A12=1. If several CLKs exist in AVD low, the last rising edge is valid CLK.
4.1.1. Asynchronous Read Mode
For the asynchronous read mode a valid address should be asserted on A/DQ0-A/DQ15 and A16-A24, while driving CLK and AVD and CE to VIL. WE and
OE should remain at VIH. Note that CLK must remain low for asynchronous read mode. The address is latched at the rising edge of AVD, and then the
system can drive OE to VIL. The data will appear on A/DQ0-A/DQ15. Since the memory array is divided into sixteen banks, each bank remains enabled
for read access until the command register contents are altered.
Address access time (tAA) is equal to the delay from valid addresses to valid output data. The chip enable access time(tCE) is the delay from the falling
edge of CE to valid data at the outputs. The output enable access time(tOE) is the delay from the falling edge of OE to valid data at the output. The asynchronous access time is measured from a valid address, falling edge of AVD or falling edge of CE whichever occurs last. To prevent the memory content
from spurious altering during power transition, the initial state machine is set for reading array data upon device power-up, or after a hardware reset.
4.1.2. Synchronous (Burst) Read Mode
The device is capable of continuous linear burst operation and linear burst operation of a preset length. For the burst mode, the system should
determine how many clock cycles are desired for the initial word(tIAA) of each burst access and what mode of burst operation is desired using
"Burst Mode Configuration Register" command sequences. See "Set Burst Mode Configuration" for further details. The status data also can be
read by synchronous read mode with a bank address which is programming or erasing. This status data by synchronous read mode can be
output and sustained until the system asserts CE high or RESET low or AVD low in conjunction with a new address. To initiate the synchro
nous read again, a new address and AVD pulse is needed after the host has completed status reads or the device has completed the pro
gram or erase operation.
4.1.2.1 . Continuous Linear Burst Read
Sync MRS option (Extended Configuration Register)
The synchronous(burst) mode will automatically start on the rising edge of the CLK input while AVD is held low after Extended Mode Register
Setting to A13=0, A12=1. If several CLKs exist in AVD low, the last rising edge is valid CLK.
The initial word is output tIAA after the rising edge of the last CLK cycle. Subsequent words are output tBA after the rising edge of each successive clock
cycle, which automatically increments the internal address counter. Note that the device has internal address boundary that occurs every 16 words. When
the device is crossing the first word boundary, additional clock cycles are needed before data appears for the next address. The number of additional
clock cycle can vary from zero to thirteen cycles, and the exact number of additional clock cycle depends on not olny the starting address of burst read but
also programmable wait state setting. The RDY output indicates this condition to the system by pulsing low. The device will continue to output sequential
burst data, wrapping around to address 000000h after it reaches the highest addressable memory location until the system asserts CE high or RESET
low or AVD low in conjunction with a new address.(See Table 7.) The reset command does not terminate the burst read operation. When it accesses the
bank is programming or erasing, continuous burst read mode will output status data. And status data will be sustained until the system asserts CE high or
RESET low or AVD low in conjunction with a new address. Note that at least 10ns is needed to start next burst read operation from terminating previous burst read operation in the case of asserting CE high.
- 17 -
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
8-, 16-Word Linear Burst Read
As well as the Continuous Linear Burst Mode, there are two(8 & 16 word) linear wrap mode, in which a fixed number of words are read from consecutive
addresses. In these modes, the addresses for burst read are determined by the group within which the starting address falls. The groups are sized
according to the number of words read in a single burst sequence for a given mode.(See Table. 9)
[Table 8] Burst Address Groups(Wrap mode only)
Burst Mode
Group Size
Group Address Ranges
8 word
8 words
0-7h, 8-Fh, 10-17h, ....
16 word
16 words
0-Fh, 10-1Fh, 20-2Fh, ....
As an example: In wrap mode case, if the starting address in the 8-word mode is 2h, the address range to be read would be 0-7h, and the wrap burst
sequence would be 2-3-4-5-6-7-0-1h. The burst sequence begins with the starting address written to the device, but wraps back to the first address in the
selected group. In a similar manner, 16-word wrap mode begins its burst sequence on the starting address written to the device, and then wrap back to
the first address in the selected address group.
4.2 Programmable Wait State
The programmable wait state feature indicates to the device the number of additional clock cycles that must elapse after AVD is driven from low to high for
burst read mode. Upon power up, the number of total initial access cycles defaults to fourteen.
4.3 Handshaking
The handshaking feature allows the host system to simply monitor the RDY signal from the device to determine when the initial word of burst data is ready
to be read. To set the number of initial cycle for optimal burst mode, the host should use the programmable wait state configuration.(See "Set Burst Mode
Configuration Register" for details.) The rising edge of RDY after OE goes low indicates the initial word of valid burst data. (RDY can be low active by
Extended configuration register A11 settng : RDY low indicates data valid) Using the autoselect command sequence, the handshaking feature will be verified in the device.
4.4 Set Burst Mode Configuration Register
The device uses a configuration register to set the various burst parameters : the number of initial cycles for burst and burst read mode. The burst mode
configuration register must be set before the device enters burst mode. The burst mode configuration register is loaded with a three-cycle command
sequences. On the third cycle, the data should be C0h, address bits A10-A0 should be 101_0101_0101b, and address bits A21-A11 set the code to be
latched. The device returns to default setting after power up or hardware reset.
4.4.1. Programmable Wait State Configuration
This feature informs the device the number of clock cycles that must elapse after AVD is driven from low to high before data will be available. This value
is determined by the input frequency of the device. Address bits A14-A11 determine the setting. (See Configuration Register table 10.) The Programmable wait state setting instructs the device to set a particular number of clock cycles for the initial access in burst mode. Note that hardware reset will revert
the wait state to the default setting, that is 14 initial cycles.
4.4.2. Burst Read Mode Setting
The device supports three different burst read modes : continuous linear mode, 8 and 16 word linear burst modes with wrap.
- 18 -
Rev. 1.0
datasheet
K5N1229ACD-BQ12
MCP Memory
4.4.3. RDY Configuration
By default, the RDY pin will be high whenever there is valid data on the output. (RDY can be low active by Extended configuration register A11 settng :
RDY low indicates data valid) The device can be set so that RDY goes active one data cycle before active data. Address bit A18 determines this setting.
The RDY pin behaves same way in word boundary crossing case.
[Table 9] Burst Mode Configuration Register Table
Address Bit
Function
Settings(Binary)
A21
000 = setting 0
001 = setting 1
010 = setting 2 (Reserve)
011 = setting 3 (Reserve)
100 = setting 4 (default)
101 = setting 5 (Reserve)
110 = setting 6 (Reserve)
111 = setting 7
A20
Output Driver Control
A19
A18
0 = RDY active with data(default)
1 = RDY active one clock cycle before data
RDY Active
000 = Continuous(default)
001 = 8-word linear with wrap
010 = 16-word linear with wrap
011 ~ 111 = Reserve
A17
A16
Burst Read Mode
A15
A14
A13
A12
Programmable Wait State
A11
0000 = Data is valid on the 4th active CLK edge after AVD transition to VIH
0001 = Data is valid on the 5th active CLK edge after AVD transition to VIH (40Mhz*)
0010 = Data is valid on the 6th active CLK edge after AVD transition to VIH (50/54Mhz*)
0011 = Data is valid on the 7th active CLK edge after AVD transition to VIH (60/66Mhz*)
0100 = Data is valid on the 8th active CLK edge after AVD transition to VIH (70Mhz*)
0101 = Data is valid on the 9th active CLK edge after AVD transition to VIH (80/83Mhz*)
0110 = Data is valid on the 10th active CLK edge after AVD transition to VIH (90/100Mhz*)
0111 = Data is valid on the 11th active CLK edge after AVD transition to VIH (108/110Mhz*)
1000 = Data is valid on the 12th active CLK edge after AVD transition to VIH (120Mhz*)
1001 = Data is valid on the 13th active CLK edge after AVD transition to VIH (133Mhz*,default)
1010 = Data is valid on the 14th active CLK edge after AVD transition to VIH
1011 = Data is valid on the 15th active CLK edge after AVD transition to VIH
1100 ~1111 = Reserve
NOTE :
Initial wait state should be set according to it’s clock frequency. Table 10 recommend the program wait state for each clock frequencies.
Not 100% tested
[Table 10] Extended Configuration Register Table
Address Bit
Function
A13
A12
A11
Settings(Binary)
Read Mode
00 = Asynchronous Read Mode(default)
01 = Synchronous Burst Read Mode
10 ~ 11 = Reserve
RDY Polarity
0 = RDY signal is active high (default)
1 = RDY signal is active low
NOTE :
Default mode is asynchronous read mode. (A13=0, A12=0) In this mode device is still in asynchronous read even if it is in CLK rising while AVD low condition.
To use synchronous read mode, user should set Extended Configuration Register (A13=0, A12=1). In this mode both of asynchronous and synchronous read mode is available.
The synchronous(burst) mode should be started on the last rising edge of the CLK input while AVD is held low after Extended Mode Register Setting to A13=0, A12=1.
[Table 11] Burst Address Sequences
Wrap
Burst Address Sequence
Start
Addr.
Continuous Burst
0
1
8-word Burst
16-word Burst
0-1-2-3-4-5-6...
0-1-2-3-4-5-6-7
0-1-2-3 ... -D-E-F
1-2-3-4-5-6-7...
1-2-3-4-5-6-7-0
1-2-3-4 ... -E-F-0
2
2-3-4-5-6-7-8...
2-3-4-5-6-7-0-1
2-3-4-5 ... -F-0-1
.
.
.
.
.
.
.
.
- 19 -
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
4.5 Output Driver Setting
The device supports four kinds of output driver setting for matching the system chracteristics. The users can tune the output driver impedance of the data
and RDY outputs by address bits A21-A19. (See Configuration Register Table) Table 13 shows which output driver would be tuned and the strength
according to A21-A19. Upon power-up or reset, the register will revert to the default setting.
[Table 12] Output Driver setting Table
Address Bits
A21-A19
Value
Function
000
Driver Multiplier : 1/3
001
Driver Multiplier : 1/2
010
Reserve
011
Reserve
100
Driver Multiplier : 1 (default)
101
Reserve
110
Reserve
111
Driver Multiplier : 1.5
4.6 Autoselect Mode
By writing the autoselect command sequences to the system, the device enters the autoselect mode. This mode can be read only by asynchronous read
mode. The system can then read autoselect codes from the internal register(which is separate from the memory array). Standard asynchronous read
cycle timings apply in this mode. The device offers the Autoselect mode to identify manufacturer and device type by reading a binary code. In addition,
this mode allows the host system to verify the block protection or unprotection. Table 14 shows the address and data requirements. The autoselect command sequence may be written to an address within a bank that is in the read mode, erase-suspend-read mode or program-suspend-read mode. The
autoselect command may not be written while the device is actively programming or erasing in the device. The autoselect command sequence is initiated
by first writing two unlock cycles. This is followed by a third write cycle that contains the address and the autoselect command. Note that the block
address is needed for the verification of block protection. The system may read at any address within the same bank any number of times without initiating another autoselect command sequence. And the burst read should be prohibited during Autoselect Mode. To terminate the autoselect operation, write
Reset command(F0H) into the command register.
[Table 13] Autoselect Mode Description
Description
Address
Read Data
Manufacturer ID
(DA) + 00H
ECH
Device ID
(DA) + 01H
Top boot(3010H), Bottom boot(3011H), Uniform block(3012H)
Block Protection/Unprotection
(BA) + 02H
01H (protected), 00H (unprotected)
Handshaking
(DA) + 03H
0H : handshaking, 1H : non-handshaking
4.7 Standby Mode
When the CE inputs is held at VCC ± 0.2V, and the system is not reading or writing, the device enters Stand-by mode to minimize the power consumption.
In this mode, the device outputs are placed in the high impedence state, independent of the OE input. When the device is in either of these standby
modes, the device requires standard access time (tCE) for read access before it is ready to read data. If the device is deselected during erasure or programming, the device draws active current until the operation is completed. ICC5 in the DC Characteristics table represents the standby current specification.
4.8 Automatic Sleep Mode
The device features Automatic Sleep Mode to minimize the device power consumption during both asynchronous and burst mode. When addresses
remain stable for tAA+60ns, the device automatically enables this mode. The Automatic sleep mode is depends on the CE, WE and OE signal, so CE, WE
and OE signals are held at any state. In a sleep mode, output data is latched and always available to the system. When OE is active, the device provides
new data without wait time. Automatic sleep mode current is equal to standby mode current.
4.9 Output Disable Mode
When the OE input is at VIH , output from the device is disabled. The outputs are placed in the high impedance state.
- 20 -
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
4.10 Block Protection & Unprotection
To protect the block from accidental writes, the block protection/unprotection command sequence is used. On power up, all blocks in the device are protected. To unprotect a block, the system must write the block protection/unprotection command sequence. The first two cycles are written: addresses are
don’t care and data is 60h. Using the third cycle, the block address (ABP) and command (60h) is written, while specifying with addresses A6, A1 and A0
whether that block should be protected (A6 = VIL, A1 = VIH, A0 = VIL) or unprotected (A6 = VIH, A1 = VIH, A0 = VIL). After the third cycle, the system can
continue to protect or unprotect additional cycles, or exit the sequence by writing F0h (reset command).
The device offers three types of data protection at the block level:
• The block protection/unprotection command sequence disables or re-enables both program and erase operations in any block.
• When WP is at VIL, the two outermost blocks are protected.(Boot block part)
• When WP is at VIL, the last one block (BA511) is protected.(Uniform block part)
• When VPP is at VIL, all blocks are protected.
Note that user never float the Vpp and WP, that is, Vpp is always connected with VIH, VIL or VID and WP is VIH or VIL.
4.11 Hardware Reset
The device features a hardware method of resetting the device by the RESET input. When the RESET pin is held low(VIL) for at least a period of tRP, the
device immediately terminates any operation in progress, tristates all outputs, and ignores all read/write commands for the duration of the RESET pulse.
The device also resets the internal state machine to asynchronous read mode. To ensure data integrity, the interrupted operation should be reinitiated
once the device is ready to accept another command sequence. The RESET pin may be tied to the system reset pin. If a system reset occurs during the
Internal Program or Erase Routine, the device will be automatically reset to the asynchronous read mode; this will enable the systems microprocessor to
read the boot-up firmware from the Flash memory. If RESET is asserted during a program or erase operation, the device requires a time of tREADY (during Internal Routines) before the device is ready to read data again. If RESET is asserted when a program or erase operation is not executing, the reset
operation is completed within a time of tREADY (not during Internal Routines). tRH is needed to read data after RESET returns to VIH. Refer to the AC
Characteristics tables for RESET parameters and to Figure 12 for the timing diagram. When RESET is at logic high, the device is in standard operation.
4.12 Software Reset
The reset command provides that the bank is reseted to read mode, erase-suspend-read mode or program-suspend-read mode. The addresses are in
Don’t Care state. The reset command may be written between the sequence cycles in an erase command sequence before erasing begins, or in an program command sequence before programming begins. If the device begins erasure or programming, the reset command is ignored until the operation is
completed. If the program command sequence is written to a bank that is in the Erase Suspend mode, writing the reset command returns that bank to the
erase-suspend-read mode. The reset command valid between the sequence cycles in an autoselect command sequence. In an autoselect mode, the
reset command must be written to return to the read mode. If a bank entered the autoselect mode while in the Erase Suspend mode, writing the reset
command returns that bank to the erase-suspend-read mode. Also, if a bank entered the autoselect mode while in the Program Suspend mode, writing
the reset command returns that bank to the program-suspend-read mode. If DQ5 goes high during a program or erase operation, writing the reset command returns the banks to the read mode. (or erase-suspend-read mode if the bank was in Erase Suspend)
4.13 Program
The device can be programmed in units of a word. Programming is writing 0's into the memory array by executing the Internal Program Routine. In order
to perform the Internal Program Routine, a four-cycle command sequence is necessary. The first two cycles are unlock cycles. The third cycle is assigned
for the program setup command. In the last cycle, the address of the memory location and the data to be programmed at that location are written. The
device automatically generates adequate program pulses and verifies the programmed cell margin by the Internal Program Routine. During the execution
of the Routine, the system is not required to provide further controls or timings. During the Internal Program Routine, commands written to the device will
be ignored.
4.14 Accelerated Program
The device provides accelerated program operations through the Vpp input. Using this mode, faster manufacturing throughput at the factory is possible.
When VID is asserted on the Vpp input, the device automatically enters the Unlock Bypass mode, temporarily unprotects any protected blocks, and uses
the higher voltage on the input to reduce the time required for program operations. In accelerated program mode, the system would use a two-cycle program command sequence for only a word program. By removing VID returns the device to normal operation mode.
Note that Read While Accelerated Program(Erase) and Program suspend(Erase suspend) mode are not guaranteed.
• Program/Erase cycling must be limited below 100cycles for optimum performance.
• Ambient temperature requirements : TA = 30°C±10°C
- 21 -
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
4.15 Write Buffer Programming
Write Buffer Programming allows the system write to a maximum of 512-word in one programming operation. This results in faster effective programming
time than the standard programming algorithms. The Write Buffer Programming command sequence is initi-ated by first writing two unlock cycles. This is
followed by a third write cycle containing the Write Buffer Load command written at the block address in which programming will occur. The fourth cycle
writes the block address and the number of word locations, minus one, to be programmed. For example, if the system will program 19 unique address
locations, then 12h should be written to the device. This tells the device how many write buffer addresses will be loaded with data. The number of locations to program cannot exceed the size of the write buffer or the operation will abort. The fifth cycle writes the first address location and data to be programmed. The write-buffer-page is selected by address bits A24(max.) ~ A9 entered at fifth cycle. All subsequent address/ data pairs must fall
within the selected write-buffer-page, so that all subsequent addresses must have the same address bit A24(max.) ~ A9 as those entered at
fifth cycle. Write buffer locations may be loaded in any order.
Once the specified number of write buffer locations have been loaded, the system must then write the "Program Buffer to Flash" com mand at the block
address. Any other command address/data combination aborts the Write Buffer Programming operation. The device then begins programming. Data polling should be used while monitoring the last address location loaded into the write buffer. DQ7, DQ6, DQ5, and DQ1 should be monitored to determine
the device status during Write Buffer Programming. The write-buffer programming operation can be suspended using the standard program suspend/
resume commands. Upon successful completion of the Write Buffer Programming operation, the device is ready to execute the next command.
Note also that an address loaction cannot be loaded more than once into the write-buffer-page.
The Write Buffer Programming Sequence can be aborted in the following ways:
• Loading a value that is greater than the buffer size(512-word) during then number of word locations to Program step.
(In case, WC > 1FFH @Table 8)
• The number of Program address/data pairs entered is different to the number of word locations initially defined with WC (@Table 8)
• Writing a Program address to have a different write-buffer-page with selected write-buffer-page
( Address bits A24(max) ~ A9 are different)
• Writing non-exact "Program Buffer to Flash" command
The abort condition is indicated by DQ1 = 1, DQ7 = DATA (for the last address location loaded), DQ6 = toggle, and DQ5=0. A "Write-to-Buffer-Abort
Reset" command sequence must be written to reset the device for the next operation. Note that the third cycle of Write-to-Buffer-Abort Reset command
sequence is required when using Write-Buffer-Programming features in Unlock Bypass mode.
And from the third cycle to the last cycle of Write to Buffer command is also required when using Write-Buffer-Programming features in Unlock Bypass
mode. A bit cannot be programmed from “0” back to a “1.” Attempting to do so may cause the DQ7 and DQ6 status bits to indicate the operation was successful. However, a succeeding read will show that the data is still “0.” Only erase operations can convert a “0” to a “1."
4.16 Accelerated Write Buffer Programming
The device provides accelerated Write Buffer Program operations through the Vpp input. Using this mode, faster manufacturing throughput at the factory
is possible. When VID is asserted on the Vpp input, the device temporarily unprotects any protected blocks, and uses the higher voltage on the input to
reduce the time required for program operations. In accelerated Write Buffer Program mode, the system must enter "Write to Buffer" and "Program Buffer
to Flash" command sequence to be same as them of normal Write Buffer Programming. Note that the third cycle of "Write to Buffer Abort Reset" command sequence is required in an accelerated mode.
Note that Read While Accelerated Write Buffer Program and Program suspend mode are not guaranteed.
• Program/Erase cycling must be limited below 100cycles for optimum performance.
• Ambient temperature requirements : TA = 30°C±10°C
4.17 Chip Erase
To erase a chip is to write 1′s into the entire memory array by executing the Internal Erase Routine. The Chip Erase requires six bus cycles to write the
command sequence. The erase set-up command is written after first two "unlock" cycles. Then, there are two more write cycles prior to writing the chip
erase command. The Internal Erase Routine automatically pre-programs and verifies the entire memory for an all zero data pattern prior to erasing. The
automatic erase begins on the rising edge of the last WE pulse in the command sequence and terminates when DQ7 is "1". After that the device returns
to the read mode.
- 22 -
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
4.18 Block Erase
To erase a block is to write 1′s into the desired memory block by executing the Internal Erase Routine. The Block Erase requires six bus cycles to write the
command sequence shown in Table 8. After the first two "unlock" cycles, the erase setup command (80H) is written at the third cycle. Then there are two
more "unlock" cycles followed by the Block Erase command. The Internal Erase Routine automatically pre-programs and verifies the entire memory prior
to erasing it. The block address is latched on the rising edge of AVD , while the Block Erase command is latched on the rising edge of WE. Multiple blocks
can be erased sequentially by writing the sixth bus-cycle. Upon completion of the last cycle for the Block Erase, additional block address and the Block
Erase command (30H) can be written to perform the Multi-Block Erase. For the Multi-Block Erase, only sixth cycle(block address and 30H) is
needed.(Similarly, only second cycle is needed in unlock bypass block erase.) An 50us (typical) "time window" is required between the Block Erase command writes. The Block Erase command must be written within the 50us "time window", otherwise the Block Erase command will be ignored. The 50us
"time window" is reset when the falling edge of the WE occurs within the 50us of "time window" to latch the Block Erase command. During the 50us of
"time window", any command other than the Block Erase or the Erase Suspend command written to the device will reset the device to read mode. After
the 50us of "time window", the Block Erase command will initiate the Internal Erase Routine to erase the selected blocks. Any Block Erase address and
command following the exceeded "time window" may or may not be accepted. No other commands will be recognized except the Erase Suspend command during Block Erase operation.
The device provides accelerated erase operations through the Vpp input. When VID is asserted on the Vpp input, the device automatically enters the
Unlock Bypass mode, temporarily unprotects any protected blocks, and uses the higher voltage on the input to reduce the time required for erase. By
removing VID returns the device to normal operation mode.
4.19 Blank check
The Blank Check operation is used one block at a time to check whether a block is completely erased or not. It is not available during Program Suspend
or Erase Suspend. For using Blank Check, first issue the command which has 4-cycle and check the status. The Bank addressed in Blank Check Command is automatically changed to Status check mode, until Reset command (XXXH / F0H) is issued.
During a blank check operation, DQ status flags indicates a busy status (DQ6, DQ2 = toggle / DQ5=0). Upon completion, the DQ status flags indicates
that Blank check operation is passed (DQ6 = toggle , DQ5=1 and DQ1=1). That means the block is completely erased.
In Blank check operation failure case, the DQ status flags indicates DQ6 = toggle , DQ5=1 and DQ1=0. The block is not completely erased.
No other commands will be recognized except status read operation during Blank Check operation. Blank Check cannot be suspended. After the completion of the Blank Check operation, any valid command can be issued after Reset command (XXXH / F0H).
NOTE that, unexpected power off or hardware reset during internal write routine may make blank check operation unavailable. And Blank check cannot
be used in OTP block area.
4.20 Unlock Bypass
The device provides the unlock bypass mode to save its operation time. This mode is possible for program, block erase, chip erase, write to buffer and
write to buffer abort reset operation.. There are two methods to enter the unlock bypass mode. The mode is invoked by the unlock bypass command
sequence or the assertion of VID on VPP pin. Unlike the standard program/erase command sequence that contains four bus cycles, the unlock bypass program/erase command sequence comprises only two bus cycles. The unlock bypass mode is engaged by issuing the unlock bypass command sequence
which is comprised of three bus cycles. Writing first two unlock cycles is followed by a third cycle containing the unlock bypass command (20H). Once the
device is in the unlock bypass mode, the unlock bypass program/erase command sequence is necessary. The unlock bypass program command
sequence is comprised of only two bus cycles; writing the unlock bypass program command (A0H) is followed by the program address and data. This
command sequence is the only valid one for programming the device in the unlock bypass mode. Also, The unlock bypass erase command sequence is
comprised of two bus cycles; writing the unlock bypass block erase command(80H-30H) or writing the unlock bypass chip erase command(80H-10H).
This command sequences are the only valid ones for erasing the device in the unlock bypass mode. The unlock bypass reset command sequence is the
only valid command sequence to exit the unlock bypass mode. The unlock bypass reset command sequence consists of two bus cycles. The first cycle
must contain the data (90H). The second cycle contains only the data (00H). Then, the device returns to the read mode.
To enter the unlock bypass mode in hardware level, the VID also can be used. By assertion VID on the VPP pin, the device enters the unlock bypass mode.
Also, the all blocks are temporarily unprotected when the device using the VID for unlock bypass mode. To exit the unlock bypass mode, just remove the
asserted VID from the VPP pin.(Note that user never float the Vpp, that is, Vpp is always connected with VIH, VIL or VID.).
4.21 Erase Suspend / Resume
The Erase Suspend command interrupts the Block Erase to read or program data in a block that is not being erased. Also, it is possible to protect or
unprotect of the block that is not being erased in erase suspend mode. The Erase Suspend command is only valid during the Block Erase operation
including the time window of 50us. The Erase Suspend command is not valid while the Chip Erase or the Internal Program Routine sequence is running.
When the Erase Suspend command is written during a Block Erase operation, the device requires a maximum of 30us(recovery time) to suspend the
erase operation. Therefore system must wait for 30us(recovery time) to read the data from the bank which include the block being erased. Otherwise,
system can read the data immediately from a bank which don’t include the block being erased without recovery time(max. 30us) after Erase Suspend
command. And, after the maximum 30us recovery time, the device is availble for programming data in a block that is not being erased. But, when the
Erase Suspend command is written during the block erase time window (50us), the device terminates the block erase time window and suspends the
erase operation in about 2us. The system may also write the autoselect command sequence when the device is in the Erase Suspend mode. When the
Erase Resume command is executed, the Block Erase operation will resume. When the Erase Suspend or Erase Resume command is executed, the
addresses are in the bank address which is operating in Erase Suspend or Erase Resume. While erase can be suspended and resumed multiple
times, a minimum 30us is required from resume to the next suspend.
- 23 -
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
4.22 Program Suspend / Resume
The device provides the Program Suspend/Resume mode. This mode is used to enable Data Read by suspending the Program operation. The device
accepts a Program Suspend command in Program mode(including Program operations performed during Erase Suspend) but other commands are
ignored. After input of the Program Suspend command, 10us is needed to enter the Program Suspend Read mode. Therefore system must wait for
10us(recovery time) to read the data from the bank which include the block being programmed. Otherwise, system can read the data immediately from a
bank which don't include block being programmed without recovery time(max.10us) after Program Suspend command. Like an Erase Suspend mode, the
device can be returned to Program mode by using a Program Resume command. While program can be suspended and resumed multiple times, a
minimum 30us is required from resume to the next suspend.
In the program suspend mode, protect/unprotect command is prohibited.
4.23 Read While Write Operation
The device is capable of reading data from one bank while writing in the other banks. This is so called the Read While Write operation. An erase operation may also be suspended to read from or program to another location within the same bank(except the block being erased). The Read While Write
operation is prohibited during the chip erase operation. Figure 19 shows how read and write cycles may be initiated for simultaneous operation with zero
latency. Refer to the DC Characteristics table for read-while-write current specifications.
4.24 OTP Block Region
The OTP Block feature provides a 512-word Flash memory region that enables permanent part identification through an Electronic Serial Number (ESN).
The OTP Block is customer lockable and shipped with itself unlocked, allowing customers to untilize the that block in any manner they choose. The customer-lockable OTP Block has the Protection Verify Bit (DQ0) set to a "0" for Unlocked state or a "1" for Locked state.
The system accesses the OTP Block through a command sequence (see "Enter OTP Block / Exit OTP Block Command sequence" at Table 8). After the
system has written the "Enter OTP Block" Command sequence, it may read the OTP Block by using the addresses (1FFFE00h~1FFFFFFh : Top Boot
block device/Uniform block device, 0000000h-00001FFh : Bottom Boot block device) normally and may check the Protection Verify Bit (DQ0) by using the
"Autoselect Block Protection Verify" Command sequence with OTP Block address. This mode of operation continues until the system issues the "Exit
OTP Block" Command suquence, a hardware reset or until power is removed from the device. On power-up, or following a hardware reset, the device
reverts to sending commands to main blocks. Note that the Accelerated function and unlock bypass modes are not available when the OTP Block is
enabled.
Customer Lockable
In a Customer lockable device, The OTP Block is one-time programmable and can be locked only once. Note that the Accelerated programming and
Unlock bypass functions are not available when programming the OTP Block. Locking operation to the OTP Block is started by writing the "Enter OTP
Block" Command sequence, and then the "Block Protection" Command seqeunce (Table 8) with an OTP Block address. The Locking operation has to be
above 100us. "Exit OTP Block" commnad sequence and Hardware reset makes locking operation finished and then exiting from OTP Block after 30us.
The OTP Block Lock operation must be used with caution since, once locked, there is no procedure available for unlocking and none of the
bits in the OTP Block space can be modified in any way.
Suspend and resume operation are not supported during OTP protect, nor is OTP protect supported during any suspend operations. After
entering OTP block, program/erase operation on main blocks is prohibited. Enter OTP block command is not allowed while other operation is
excuting.
4.25 Low VCC Write Inhibit
To avoid initiation of a write cycle during Vcc power-up and power-down, a write cycle is locked out for Vcc less than VLKO. If the Vcc < VLKO (Lock-Out
Voltage), the command register and all internal program/erase circuits are disabled. Under this condition the device will reset itself to the read mode.Subsequent writes will be ignored until the Vcc level is greater than VLKO. It is the user’s responsibility to ensure that the control pins are logically correct to
prevent unintentional writes when Vcc is above VLKO.
4.26 Write Pulse “Glitch” Protection
Noise pulses of less than 5ns (typical) on OE, CE, AVD or WE do not initiate a write cycle.
4.27 Logical Inhibit
Write cycles are inhibited by holding any one of OE = VIL , CE = VIH or WE = VIH. To initiate a write cycle, CE and WE must be a logical zero while OE is
a logical one.
- 24 -
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
5.0 FLASH MEMORY STATUS FLAGS
The device has means to indicate its status of operation in the bank where a program or erase operation is in processes. Address must include bank
address being executed internal routine operation. The status is indicated by raising the device status flag via corresponding DQ pins. The status data can
be read during burst read mode by using AVD signal with a bank address. That means status read is supported in synchronous mode. If status read is
performed, the data provided in the burst read is identical to the data in the initial access. To initiate the synchronous read again, a new address and AVD
pulse is needed after the host has completed status reads or the device has completed the program or erase operation. The corresponding DQ pins are
DQ7, DQ6, DQ5, DQ3, DQ2 and DQ1.
[Table 14] Hardware Sequence Flags
Status
Programming
Block Erase or Chip Erase or Blank check
Buffer3)
DQ5
DQ3
DQ2
DQ1
Toggle
0
0
1
0
0
Toggle
0
1
Toggle
0
1
1
0
0
Toggle1)
0
Erase Suspend Read
Erase Suspend Read
Non-Erase Suspended Block
Data
Data
Data
Data
Data
Data
Erase Suspend
Program
Non-Erase Suspended Block
DQ7
Toggle
0
0
1
0
Program Suspend Read
Program Suspended
Block
DQ7
1
0
0
Toggle1)
0
Program Suspend Read
Non- program
Suspended Block
Data
Data
Data
Data
Data
Data
DQ7
Toggle
1
0
No Toggle
0
Block Erase or Chip Erase or Blank check Fail
0
Toggle
1
1
(NOTE 2)
0
Blank check Pass
0
Toggle
1
1
(NOTE 2)
1
Erase Suspend Program
DQ7
Toggle
1
0
No Toggle
0
BUSY state
DQ7
Toggle
0
0
No Toggle
0
Exceeded Timing Limits
DQ7
Toggle
1
0
No Toggle
0
ABORT State
DQ7
Toggle
0
0
No Toggle
1
Programming
Write-to-
DQ6
DQ7
Erase Suspended
Block
In Progress
Exceeded
Time Limits
DQ7
NOTE :
1) DQ2 will toggle when the device performs successive read operations from the erase/program suspended block.
2) If DQ5 is High (exceeded timing limits), successive reads from a problem block will cause DQ2 to toggle.
3) Note that DQ7 during Write-to-Buffer-Programming indicates the data-bar for DQ7 data for the last loaded write-buffer address location.
DQ7 : Data Polling
When an attempt to read the device is made while executing the Internal Program, the complement of the data is written to DQ7 as an indication of the
Routine in progress. When the Routine is completed an attempt to access to the device will produce the true data written to DQ7. When a user attempts
to read the block being erased or bank contains the block, DQ7 will be low. If the device is placed in the Erase/Program Suspend Mode, the status can be
detected via the DQ7 pin. If the system tries to read an address which belongs to a block that is being erase suspended, DQ7 will be high. And, if the system tries to read an address which belongs to a block that is being program suspended, the output will be the true data of DQ7 itself. If a non-erase-suspended or non-program-suspended block address is read, the device will produce the true data to DQ7. If an attempt is made to program a protected
block, DQ7 outputs complements the data for approximately 2us and the device then returns to the Read Mode without changing data in the block. If an
attempt is made to erase a protected block, DQ7 outputs complement data in approximately 100us and the device then returns to the Read Mode without
erasing the data in the block.
DQ6 : Toggle Bit
Toggle bit is another option to detect whether an Internal Routine is in progress or completed. Once the device is at a busy state, DQ6 will toggle. Toggling
DQ6 will stop after the device completes its Internal Routine. If the device is in the Erase/Program Suspend Mode, an attempt to read an address that
belongs to a block that is being erased or programmed will produce a high output of DQ6. If an address belongs to a block that is not being erased or programmed, toggling is halted and valid data is produced at DQ6. If an attempt is made to program a protected block, DQ6 toggles for approximately 2us
and the device then returns to the Read Mode without changing the data in the block. If an attempt is made to erase a protected block, DQ6 toggles for
approximately 100μs and the device then returns to the Read Mode without erasing the data in the block. #OE or #CE should be toggled in each toggle
bit status read.
- 25 -
Rev. 1.0
datasheet
K5N1229ACD-BQ12
MCP Memory
DQ5 : Exceed Timing Limits
If the Internal Program/Erase Routine extends beyond the timing limits, DQ5 will go High, indicating program/erase failure. Also the result of blank check
can be checked by DQ5=1.
DQ3 : Block Erase Timer
The status of the multi-block erase operation can be detected via the DQ3 pin. DQ3 will go High if 50μs of the block erase time window expires. In this
case, the Internal Erase Routine will initiate the erase operation.Therefore, the device will not accept further write commands until the erase operation is
completed. DQ3 is Low if the block erase time window is not expired. Within the block erase time window, an additional block erase command (30H) can
be accepted. To confirm that the block erase command has been accepted, the software may check the status of DQ3 following each block erase command.
DQ2 : Toggle Bit 2
The device generates a toggling pulse in DQ2 only if an Internal Erase Routine or an Erase/Program Suspend is in progress. When the device executes
the Internal Erase Routine, DQ2 toggles if the bank including an erasing block is read. Although the Internal Erase Routine is in the Exceeded Time Limits, DQ2 toggles only if an erasing block in the Exceeded Time Limits is read. When the device is in the Erase/Program Suspend mode, DQ2 toggles only
if an address in the erasing or programming block is read. If a non-erasing or non-programmed block address is read during the Erase/Program Suspend
mode, then DQ2 will produce valid data. DQ2 will go High if the user tries to program a non-erase suspend block while the device is in the Erase Suspend
mode. #OE or #CE should be toggled in each toggle bit status read.
DQ1 : Buffer Program Abort Indicator
DQ1 indocates whether a Write-to-Buffer operation was aborted. Under these conditions DQ1 produces a "1". The system must issue the Write-to-BufferAbort-Reset command sequence to return the device to reading array data. Also DQ1 will go High if the blank check is passed. DQ1 will go low in the
blank check failure.
RDY: Ready
Normally the RDY signal is used to indicate if new burst data is available at the rising edge of the clock cycle or not. If RDY is low state, data is not valid
at expected time, and if high state, data is valid. Note that, if CE is low and OE is high, the RDY is high state.
Start
Read(DQ0~DQ7)
Valid Address
Start
Read(DQ0~DQ7)
Valid Address
Read(DQ0~DQ7)
Valid Address
DQ7 = Data ?
DQ6 = Toggle ?
Yes
No
Yes
No
No
No
DQ5 = 1 ?
DQ5 = 1 ?
Yes
Yes
Read twice(DQ0~DQ7)
Valid Address
Read(DQ0~DQ7)
Valid Address
No
Yes
DQ6 = Toggle ?
DQ7 = Data ?
Yes
No
Fail
Fail
Pass
Figure 1. Data Polling Algorithms
Figure 2. Toggle Bit Algorithms
- 26 -
Pass
Rev. 1.0
datasheet
K5N1229ACD-BQ12
MCP Memory
6.0 Common Flash Memory Interface
Common Flash Memory Interface is contrived to increase the compatibility of host system software. It provides the specific information of the device,
such as memory size and electrical features. Once this information has been obtained, the system software will know which command sets to use to
enable flash writes, block erases, and control the flash component.
When the system writes the CFI command(98H) to address 55H , the device enters the CFI mode. And then if the system writes the address shown in
Table 16, the system can read the CFI data. Query data are always presented on the lowest-order data outputs(DQ0-7) only. In word(x16) mode, the
upper data outputs(DQ8-15) is 00h. To terminate this operation, the system must write the reset command.
[Table 15] Common Flash Memory Interface Code
Addresses
(Word Mode)
Data
Query Unique ASCII string "QRY"
10H
11H
12H
0051H
0052H
0059H
Primary OEM Command Set
13H
14H
0002H
0000H
Address for Primary Extended Table
15H
16H
0040H
0000H
Alternate OEM Command Set (00h = none exists)
17H
18H
0000H
0000H
Address for Alternate OEM Extended Table (00h = none exists)
19H
1AH
0000H
0000H
Vcc Min. (write/erase)
D7-D4: volt, D3-D0: 100 millivolt
1BH
0017H
Vcc Max. (write/erase)
D7-D4: volt, D3-D0: 100 millivolt
1CH
0019H
Vpp(Acceleration Program) Supply Minimum
00 = Not Supported, D7 - D4 : Volt, D3 - D0 : 100mV
1DH
0085H
Vpp(Acceleration Program) Supply Maximum
00 = Not Supported, D7 - D4 : Volt, D3 - D0 : 100mV
1EH
0095H
Typical timeout per single word write 2N us
1FH
0007H
Typical timeout for Max buffer write 2N us(00H = not supported)
20H
000AH
Typical timeout per individual block erase 2N ms
21H
000AH
Typical timeout for full chip erase 2N ms(00H = not supported)
22H
0013H
Max. timeout for word write 2 times typical
23H
0003H
Max. timeout for buffer write 2 times typical
24H
0003H
Max. timeout per individual block erase 2N times typical
25H
0003H
Description
N
N
Max. timeout for full chip erase 2 times typical(00H = not supported)
26H
0003H
Device Size = 2N byte
27H
001AH
Flash Device Interface description
28H
29H
0000H
0000H
Max. number of byte in multi-byte write = 2N
2AH
2BH
000AH
0000H
Number of Erase Block Regions within device1)
2CH
0002H
Erase Block Region 1 Information (Boot block part)
Bits 0~15: y+1=block number
Bits 16~31: block size= z x 256bytes
2DH
2EH
2FH
30H
0003H
0000H
0080H
0000H
N
- 27 -
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
Addresses
(Word Mode)
Data
Erase Block Region 1 Information (Uniform block part)
Bits 0~15: y+1=block number
Bits 16~31: block size= z x 256bytes
2DH
2EH
2FH
30H
00FFH
0001H
0000H
0002H
Erase Block Region 2 Information (Boot block part)
31H
32H
33H
34H
00FEH
0001H
0000H
0002H
31H
32H
33H
34H
0000H
0000H
0000H
0000H
Erase Block Region 3 Information
35H
36H
37H
38H
0000H
0000H
0000H
0000H
Erase Block Region 4 Information
39H
3AH
3BH
3CH
0000H
0000H
0000H
0000H
Query-unique ASCII string "PRI"
40H
41H
42H
0050H
0052H
0049H
Major version number, ASCII
43H
0031H
Minor version number, ASCII
44H
0031H
Address Sensitive Unlock(Bits 1-0)
0 = Required, 1= Not Required
Silcon Revision Number(Bits 7-2)
45H
0000H
Erase Suspend
0 = Not Supported, 1 = To Read Only, 2 = To Read & Write
46H
0002H
Block Protect
00 = Not Supported, 01 = Supported
47H
0001H
Block Temporary Unprotect 00 = Not Supported, 01 = Supported
48H
0000H
Block Protect/Unprotect scheme 00 = Not Supported, 01 = Supported
49H
0001H
Simultaneous Operation
00 = Not Supported, 01 = Supported
4AH
0001H
Burst Mode Type 00 = Not Supported, 01 = Supported
4BH
0001H
Page Mode Type
00 = Not Supported, 01 = 4 Word Page, 02 = 8 Word Page, 03 = 16 Word Page
4CH
0000H
Top/Bottom Boot/Uniform Block Flag
02H = Bottom Boot Device, 03H = Top Boot Device, 04H = Uniform Device
4DH
0003H
Max. Operating Clock Frequency (MHz ) 2)
4EH
0085H
RWW(Read While Write) Functionality Restriction (00H = non exists , 01H = exists)
4FH
0000H
Handshaking
00 = Not Supported at both mode, 01 = Supported at Sync. Mode
10 = Supported at Async. Mode, 11 = Supported at both Mode
50H
0001H
Description
Erase Block Region 2 Information (Uniform block part)
NOTE :
1) Uniform block part : Data is 01H
Boot block part : Data is 02H
2) Max. Operating Clock Frequency : Data is 85H in 108/133Mhz part , Data is 53H in 66/83Mhz part
- 28 -
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
7.0 ABSOLUTE MAXIMUM RATINGS
Parameter
Vcc
Voltage on any pin relative to VSS
VPP
All Other Pins
Symbol
Rating
Vcc
-0.5 to +2.5
VIN
-0.5 to +9.5
Unit
V
-0.5 to +2.5
Storage Temperature
Tstg
-65 to +100
°C
Short Circuit Output Current
IOS
5
mA
Operating Temperature
TA
-25 to + 85
°C
NOTE :
1) Minimum DC voltage is -0.5V on Input/ Output pins. During transitions, this level may fall to -2.0V for periods <20ns.
Maximum DC voltage is Vcc+0.6V on input / output pins which, during transitions, may overshoot to Vcc+2.0V for periods <20ns.
2) Minimum DC input voltage is -0.5V on VPP . During transitions, this level may fall to -2.0V for periods <20ns.
Maximum DC input voltage is +9.5V on VPP which, during transitions, may overshoot to +12.0V for periods <20ns.
3) Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. Functional operation should be restricted to the conditions
detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
- 29 -
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
8.0 RECOMMENDED OPERATING CONDITIONS
Parameter
Symbol
Min
Typ.
Max
Unit
Supply Voltage
VCC
1.7
1.8
1.95
V
Supply Voltage
VSS
0
0
0
V
NOTE : Voltage reference to GND
1) Data retention is not guaranteed on Operating condition Extended temperature(-25’C~85’C) over.
9.0 DC CHARACTERISTICS
Parameter
Input Leakage Current
Symbol
ILI
VPP Leakage Current
ILIP
Output Leakage Current
ILO
Test Conditions
Min
Typ
Max
Unit
VIN=VSS to VCC, VCC=VCCmax
- 1.0
-
+ 1.0
μA
VCC=VCCmax , VPP=VCCmax
- 1.0
-
+ 1.0
μA
VCC=VCCmax , VPP=9.5V
VOUT=VSS to VCC, VCC=VCCmax, OE=VIH
-
-
35
μA
- 1.0
-
+ 1.0
μA
-
35
55
mA
-
35
55
mA
Active Burst Read Current
ICCB1
CE=VIL, OE=VIH (@133MHz)
Active Asynchronous
Read Current
ICC1
CE=VIL, OE=VIH
Active Write Current 2)
ICC2
CE=VIL, OE=VIH, WE=VIL, VPP=VIH
-
25
40
mA
Read While Write Current
ICC3
CE=VIL, OE=VIH
-
45
70
mA
Accelerated Program Current
ICC4
CE=VIL, OE=VIH , VPP=9.5V
-
20
30
mA
Standby Current
ICC5
CE= RESET=VCC ± 0.2V
-
30
120
μA
Standby Current During Reset
ICC6
RESET = VSS ± 0.2V
-
30
120
μA
Automatic Sleep Mode 3)
ICC7
CE=VSS ± 0.2V, Other Pins=VIL or VIH
VIL = VSS ± 0.2V, VIH = VCC ± 0.2V
-
30
120
μA
Input Low Voltage
VIL
-0.5
-
0.4
V
Input High Voltage
VIH
VCC-0.4
-
VCC+0.4
V
Output Low Voltage
VOL
IOL = 100 μA , VCC=VCCmin
-
-
0.1
V
Output High Voltage
VOH
IOH = -100 μA , VCC=VCCmin
VCC-0.1
-
-
V
8.5
9.0
9.5
V
1.4
V
Voltage for Accelerated Program
Low VCC Lock-out Voltage
Vpp current in program/erase
10MHz
VID
VLKO
Ivpp
-
-
VPP = 9.5V
-
0.8
5
mA
VPP = 1.95V
-
-
50
μA
NOTE :
1) Maximum ICC specifications are tested with VCC = VCCmax.
2) ICC active while Internal Erase or Internal Program is in progress.
3) Device enters automatic sleep mode when addresses are stable for tAA + 60ns.
- 30 -
Rev. 1.0
datasheet
K5N1229ACD-BQ12
MCP Memory
10.0 VCC POWER-UP
Parameter
All Speed Options
Symbol
Min
Max
Unit
Vcc Setup Time
tVCS
200
-
μs
Time between RESET (high) and CE (low)
tRH
200
-
ns
NOTE : Not 100% tested.
SWITCHING WAVEFORMS
tVCS
tVCCmin
Vcc/Vccq
VIH
RESET
tRH
CE
Figure 3. Vcc Power-up Diagram
11.0 CAPACITANCE(TA = 25 °C, VCC = 1.8V, f = 1.0MHz)
Item
Symbol
Test Condition
Min
Max
Unit
CIN
VIN=0V
-
10
pF
Output Capacitance
COUT
VOUT=0V
-
10
pF
Control Pin Capacitance
CIN2
VIN=0V
-
10
pF
Input Capacitance
- 31 -
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
12.0 AC TEST CONDITION
Parameter
Value
Input Pulse Levels
0V to VCC
Input Rise and Fall Times
3ns(max)@66Mhz, 2.5ns(max)@83Mhz, 1.5ns(max)@108Mhz, 1ns(max)@133Mhz
Input and Output Timing Levels
VCC/2
Output Load
CL = 30pF
Address to Address Skew
3ns(max)
Device
Under
Test
VCC
VCC/2
Input & Output
Test Point
VCC/2
* CL = 30pF including scope
and Jig capacitance
0V
Input Pulse and Test Point (including CLK characterization)
Output Load
13.0 AC CHARACTERISTICS
13.1 Synchronous/Burst Read
Parameter
Symbol
1C
(66 MHz)
1D
(83 MHz)
1E
(108 MHz)
1F
(133 MHz)
Min
Max
Min
Max
Min
Max
Min
Max
Unit
Initial Access Time
tIAA
-
95
-
95
-
95
-
95
ns
Burst Access Time Valid Clock to Output Delay
tBA
-
11
-
9
-
7
-
6
ns
tAVDS
5
-
4
-
3.5
-
2.5
-
ns
AVD Hold Time from CLK
tAVDH
2
-
2
-
2
-
2
-
ns
AVD High to OE Low
tAVDO
0
-
0
-
0
-
0
-
ns
Address Setup Time to CLK
tACS
5
-
4
-
3.5
-
2.5
-
ns
Address Hold Time from CLK
tACH
6
-
5
-
2
-
2
-
ns
Data Hold Time from Next Clock Cycle
tBDH
3
-
3
-
2
-
2
-
ns
Output Enable to RDY valid
tOER
-
11
-
9
-
7
-
6
ns
CE Disable to High Z
tCEZ
-
9
-
9
-
9
-
9
ns
OE Disable to High Z
tOEZ
-
9
-
9
-
9
-
9
ns
CE Setup Time to CLK
tCES
6
-
4.5
-
4
-
3.5
-
ns
CE Enable to RDY active
tRDY
-
11
-
9
-
7
-
6
ns
CLK to RDY Setup Time
tRDYA
-
11
-
9
-
7
-
6
ns
RDY Setup Time to CLK
tRDYS
3
-
3
-
2
-
2
-
ns
tCLK
15.1
-
12.05
-
9.26
-
7.52
-
ns
CLK High or Low Time
tCLKH/L
0.4x
tCLK
0.6x
tCLK
0.4x
tCLK
0.6x
tCLK
0.4x
tCLK
0.6x
tCLK
0.4x
tCLK
0.6x
tCLK
ns
CLK Fall or Rise Time
tCLKHCL
-
3
-
2.5
-
1.5
-
1
ns
AVD Setup Time to CLK
CLK period
- 32 -
Rev. 1.0
datasheet
K5N1229ACD-BQ12
MCP Memory
SWITCHING WAVEFORMS
13 cycles for initial access shown.
CR setting : A14=1, A13=0, A12=0, A11=1
7.5ns typ(133MHz).
tCES
tCEZ
2
1
4
3
5
12
13
≈
≈
≈
tAVDS
tAVDS
tAVDO
AVD
11
≈
CLK
≈
≈
CE
tAVDH
tBA
tACH
Aa
tIAA
≈
tRDYS
≈
RDY
≈
tOER
tRDY
Da+n
tOEZ
Da Da+1 Da+2 Da+3 Da+4 Da+5 Da+6
OE
tRDYA
Hi-Z
≈
Hi-Z
Hi-Z
≈
≈
A/DQ0:
A/DQ15
≈ ≈
A16-A24
tBDH
≈ ≈
tACS
Aa
Figure 4. Continuous Burst Mode Read (133 MHz)
NOTE : In order to avoid a bus conflict the OE signal is enabled on the next rising edge after AVD is going high.
11 cycles for initial access shown.
CR setting : A14=0, A13=1, A12=1, A11=1
9.25ns typ(108MHz).
tCES
tCEZ
CE
≈
≈
2
1
CLK
3
9
10
11
≈
≈
≈
≈
tAVDS
tAVDS
tAVDO
AVD
4
tAVDH
tACH
tIAA
Da+3
Da+4
Da+5
Da+6
Da+n
tOEZ
tRDYS
tRDYA
≈
Hi-Z
Da+2
Figure 5. Continuous Burst Mode Read (108 MHz)
NOTE: In order to avoid a bus conflict the OE signal is enabled on the next rising edge after AVD is going high.
- 33 -
≈
RDY
tOER
Da+1
≈
tRDY
Da
≈
OE
Hi-Z
≈
Aa
tBA
≈ ≈
A/DQ0:
A/DQ15
tBDH
≈ ≈
A16-A24
≈ ≈
tACS
Aa
Hi-Z
Rev. 1.0
datasheet
K5N1229ACD-BQ12
MCP Memory
SWITCHING WAVEFORMS
13 cycles for initial access shown.
CR setting : A14=1, A13=0, A12=0, A11=1
7.5ns typ(133MHz).
tCES
≈
CE
3
4
AVD
11
12
13
≈
tAVDS
tAVDS
tAVDO
≈
2
1
CLK
tAVDH
A16-A24
tACH
Aa
tIAA
tOER
tRDY
RDY
D7
D0
D1
D2
D3
D4
D5
D6
D7
D0
D5
D6
D7
D0
≈
OE
tBA
≈ ≈
A/DQ0:
A/DQ15
tBDH
≈ ≈
tACS
Aa
tRDYS
tRDYA
≈
Hi-Z
Figure 6. 8 word Linear Burst Mode with Wrap Around (133 MHz)
NOTE : In order to avoid a bus conflict the OE signal is enabled on the next rising edge after AVD is going high.
13 cycles for initial access shown.
CR setting : A14=1, A13=0, A12=0, A11=1
7.5ns typ(133MHz).
tCES
≈
CE
AVD
4
10
11
12
13
≈
tAVDS
tAVDS
tAVDO
3
≈
2
1
CLK
tAVDH
tACH
Aa
tIAA
tRDY
D0
D1
D2
D3
D4
tRDYS
≈
Hi-Z
tOER
D7
≈
OE
RDY
tBA
≈ ≈
A/DQ0:
A/DQ15
tBDH
≈ ≈
A16-A24
tACS
Aa
tRDYA
Figure 7. 8 word Linear Burst with RDY Set One Cycle Before Data (Wrap Around Mode, CR setting : A18=1)
NOTE : In order to avoid a bus conflict the OE signal is enabled on the next rising edge after AVD is going high.
- 34 -
Rev. 1.0
datasheet
K5N1229ACD-BQ12
MCP Memory
SWITCHING WAVEFORMS
13 cycles for initial access shown.
CR setting : A14=1, A13=0, A12=0, A11=1
7.5ns typ(133MHz).
tCES
tCEZ
CE
2
1
3
4
5
12
11
13
≈ ≈
≈ ≈
≈
Figure 8. 16 word Linear Burst Mode with Wrap Around (133Mhz)
NOTE: In order to avoid a bus conflict the OE signal is enabled on the next rising edge after AVD is going high.
- 35 -
Hi-Z
D6
D0
tOEZ
≈
Hi-Z
D15
≈
tRDYS
tRDYA
D10
≈
RDY
tOER
D9
≈
tRDY
D8
≈
OE
D7
≈ ≈
tIAA
≈ ≈
Aa
tBA
≈ ≈
tACH
A/DQ0:
A/DQ15
tBDH
≈ ≈
A16-A24
≈
tAVDH
tACS
Aa
≈
≈
AVD
≈
≈
tAVDS
tAVDS
tAVDO
≈
CLK
Hi-Z
Rev. 1.0
datasheet
K5N1229ACD-BQ12
MCP Memory
13.2 Asynchronous Read
Parameter
All speed
Symbol
Min
Max
Unit
Access Time from CE Low
tCE
-
100
ns
Asynchronous Access Time
tAA
-
100
ns
tAVDP
12
-
ns
Address Setup Time to rising Edge of AVD
tAAVDS
5
-
ns
Address Hold Time from Rising Edge of AVD
tAAVDH
2
-
ns
tOE
-
15
ns
0
-
ns
10
-
ns
-
9
ns
AVD Low time
Output Enable to Output Valid
Read
Output Enable
Hold Time
tOEH
Toggle and Data Polling
tOEZ
Output Disable to High Z*
NOTE: Not 100% tested.
SWITCHING WAVEFORMS
Asynchronous Mode Read (tCE)
CE
tOE
OE
tOEH
WE
tCE
A/DQ0:
A/DQ15
VA
A16-A24
VA
tAAVDS
tOEZ
Valid RD
tAAVDH
AVD
RDY
Hi-Z
tAVDP
Hi-Z
Figure 9. Asynchronous Mode Read (tCE)
NOTE : VA=Valid Read Address, RD=Read Data.
Asynchronous mode may not support read following four sequential invalid read condition within 200ns.
- 36 -
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
Asynchronous Mode Read (tAA)
Case 1 : Valid Address Transition occurs before AVD is driven to Low
CE
tOE
OE
tOEH
WE
tOEZ
A/DQ0:
A/DQ15
VA
Valid RD
tAA
A16-A24
VA
tAAVDS
tAAVDH
AVD
tAVDP
RDY
Hi-Z
Hi-Z
Case 2 : Valid Address Transition occurs after AVD is driven to Low
CE
tOE
OE
tOEH
WE
tOEZ
A/DQ0:
A/DQ15
VA
Valid RD
tAA
VA
A16-A24
tAAVDS
tAAVDH
AVD
RDY
Hi-Z
tAVDP
Hi-Z
Figure 10. Asynchronous Mode Read (tAA)
NOTE :
1) VA=Valid Read Address, RD=Read Data.
2) Asynchronous mode may not support read following four sequential invalid read condition within 200ns.
- 37 -
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
13.3 Hardware Reset(RESET)
Parameter
All Speed Options
Symbol
Min
Max
Unit
RESET Pin Low(During Internal Routines)
to Read Mode*
tReady
-
20
μs
RESET Pin Low(NOT During Internal Routines)
to Read Mode*
tReady
-
500
ns
RESET Pulse Width
tRP
200
-
ns
Reset High Time Before Read*
tRH
200
-
ns
NOTE : Not 100% tested.
SWITCHING WAVEFORMS
CE, OE
tRH
RESET
tRP
tReady
Reset Timings NOT during Internal Routines
≈
CE, OE
tReady
≈
RESET
tRP
Reset Timings during Internal Routines
Figure 11. Reset Timings
- 38 -
Rev. 1.0
datasheet
K5N1229ACD-BQ12
MCP Memory
13.4 Erase/Program Operation
Parameter
Symbol
All speed options
Min
Typ
Max
Unit
WE Cycle Time1)
tWC
75
-
-
ns
Address Setup Time
tAS
5
-
-
ns
Address Hold Time
tAH
2
-
-
ns
tAVDP
12
-
-
ns
Data Setup Time
tDS
30
-
-
ns
Data Hold Time
tDH
0
-
-
ns
tGHWL
0
-
-
ns
CE Setup Time
tCS
0
-
-
ns
CE Hold Time
tCH
0
-
-
ns
WE High to AVD low
tWEA
30
-
-
ns
WE Pulse Width
tWP
30
-
-
ns
WE Pulse Width High
tWPH
45
-
-
ns
Latency Between Read and Write Operations
tSR/W
0
-
-
ns
tPGM
-
80
-
μs
tPGM_BP
-
250
-
μs
tPGM_BP
-
716.8
-
μs
tACCPGM
-
80
-
μs
tACCPGM_BP
-
0.7
-
μs
tACCPGM_BP
-
358.4
-
μs
Block Erase Operation (64KW block)
tBERS
-
0.6
-
sec
Blank check Operation (64KW block)
tBLANK
-
7
-
ms
VPP Rise and Fall Time
tVPP
500
-
-
ns
VPP Setup Time (During Accelerated Programming)
tVPS
1
-
-
μs
AVD Low Time
Read Recovery Time Before Write
Word Programming Operation
Single word Buffer Program
512-word Buffer
2)
2)
Program 4)
Accelerated Programming Operation
3)
Accelerated Single word Buffer Program
Accelerated 512-word Buffer Program
3)
4)
NOTE :
1) Not 100% tested.
2) Internal programming algorithm is optimized for Buffer Program, so Normal word programming or Single word Buffer Program use Buffer Program algorithm.
3) Internal programming algorithm for supporting Accelerated mode uses a method to double the number of words programmed simultaneously.
4) Typical 512-word Buffer Program time pays due regard to that Each program data pattern ("11", "10". "01", "00") has a same portion in 512-word Buffer.
- 39 -
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
13.5 Erase/Program Performance
Limits
Parameter
Block Erase Time
Min.
Max.
64 Kword
-
0.6
3.0
16 Kword
-
0.3
1.5
Chip Erase Time (3)
Accelerated Block Erase Time
Typ.
-
307.8
1539
64 Kword
-
0.4
3.0
16 Kword
-
0.2
1.5
-
205.2
1026
Accelerated Chip Erase Time (3)
Word Programming Time
-
80
550
512-word Buffer Programming Time
-
1.4
7
Accelerated Word Programming Time
-
80
550
Accelerated 512-word Buffer Programming Time
-
0.7
3.5
Chip Buffer Programming Time
-
46.9
234.5
Accelerated Buffer Chip Programming Time
-
23.4
117
Blank check time
-
7
-
Unit
sec
Comments
Includes 00h programming
prior to erasure
μs / word
Excludes system level overhead
sec
milli sec
NOTE :
1)25°C, VCC = 1.8V, 100,000 cycles, typical pattern.
2) System-level overhead is defined as the time required to execute the two or four bus cycle command necessary to program each word.
3) Chip Erase time & Accel. Chip Erase time for boot block part
- 40 -
Rev. 1.0
datasheet
K5N1229ACD-BQ12
MCP Memory
SWITCHING WAVEFORMS
Program Operations
Program Command Sequence (last two cycles)
tWEA
tAS
Read Status Data
AVD
tAVDP
tAH
A16:A24
PA
555h
A0h
PA
≈ ≈
A/DQ0:
A/DQ15
VA
PD
tDS
≈
tCH
OE
≈
tDH
CE
VA
tWP
≈
WE
tWPH
tPGM
tCS
VIL
tWC
≈
CLK
tVCS
≈
VCC
NOTE :
1) PA = Program Address, PD = Program Data, VA = Valid Address for reading status bits.
2) “In progress” and “complete” refer to status of program operation.
3) A16–A24 are don’t care during command sequence unlock cycles.
4) Status reads in this figure is asynchronous read, but status read in synchronous mode is also supported.
Figure 12. Program Operation Timing
- 41 -
VA
In
Progress
VA
Complete
Rev. 1.0
datasheet
K5N1229ACD-BQ12
MCP Memory
SWITCHING WAVEFORMS
Buffer Program Operations
Buffer Program Command Sequence
tAS
Word Count
Program Address/Data pairs (WC+1) "Buffer to Flash"
≈
AVD
tAH
tAVDP
A/DQ0:
A/DQ15
555h
2AAh
A0h
55h
BA
BA
25h
BA
PA_1
PA_0
WC
PA_0
PD_0
PA_1
PD_1
PA_N
≈
BA
≈
A16:A24
PA_N
BA
PD_N
BA
29h
tDS
≈
CE
≈
OE
tWP
≈
WE
VIL
tWC
≈
CLK
tPGM_BP
tWPH
tCS
tVCS
≈
VCC
NOTE :
1) BA = Block Address, WC = Word Count, PA = Program Address, PD = Program Data, VA = Valid Address for reading status bits.
2) Sequential PA_1, PA_2, ... , PA_N must have same address bits A24(max.) ~ A9 as PA_0 entered firstly
3) The number of Program/Data pairs entered must be same as WC+1 because WC = N.
4) “In progress” and “complete” refer to status of program operation.
5) A16–A24 are don’t care during command sequence unlock cycles.
6) Status reads in this figure is asynchronous read, but status read in synchronous mode is also supported.
Figure 13. Buffer Program Operation Timing
- 42 -
Rev. 1.0
datasheet
K5N1229ACD-BQ12
MCP Memory
SWITCHING WAVEFORMS
Erase Operation
Erase Command Sequence (last two cycles)
tWEA
tAS
Read Status Data
AVD
tAVDP
tAH
A16:A24
BA
2AAh
55h
10h for
chip erase
BA
30h
tDS
≈ ≈
A/DQ0:
A/DQ15
VA
555h for
chip erase
≈
tCH
OE
≈
tDH
CE
VA
tWP
≈
WE
tWPH
tBERS
tCS
VIL
tWC
≈
CLK
tVCS
≈
VCC
NOTE :
1) BA is the block address for Block Erase.
2) Address bits A16–A24 are don’t cares during unlock cycles in the command sequence.
3) Status reads in this figure is asynchronous read, but status read in synchronous mode is also supported.
Figure 14. Chlp/Block Erase Operations
- 43 -
VA
In
Progress
VA
Complete
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
SWITCHING WAVEFORMS
Unlock Bypass Program Operations(Accelerated Program)
CE
AVD
WE
PA
A16:A24
A/DQ0:
A/DQ15
Don’t Care
OE
A0h
PA
PD
Don’t Care
tVPS
VID
tVPP
VPP
VIL or VIH
Unlock Bypass Block Erase Operations
CE
AVD
WE
BA
A16:A24
A/DQ0:
A/DQ15
Don’t Care
OE
80h
555h for
chip erase
10h for
chip erase
BA
30h
Don’t Care
tVPS
VID
tVPP
VPP
VIL or VIH
NOTE :
1) VPP can be left high for subsequent programming pulses.
2) Use setup and hold times from conventional program operations.
3) Conventional Program/Erase commands as well as Unlock Bypass Program/Erase commands can be used when the VID is applied to Vpp.
Figure 15. Unlock Bypass Operation Timings
- 44 -
Rev. 1.0
datasheet
K5N1229ACD-BQ12
MCP Memory
SWITCHING WAVEFORMS
Data Polling Operations
tCES
≈
≈
CE
CLK
≈ ≈
AVD
≈ ≈
tAVDS
tAVDH
tIAA
VA
Status Data
≈
tRDYS
Hi-Z
≈
≈
RDY
Status Data
≈
OE
≈ ≈
VA
≈ ≈
tACH
A/DQ0:
A/DQ15
VA
≈ ≈
A16-A24
≈ ≈
tACS
VA
NOTE :
1) VA = Valid Address. When the Internal Routine operation is complete, and Data Polling will output true data.
Figure 16. Data Polling Timings (During Internal Routine)
Toggle Bit Operations
tCES
≈
≈
CE
CLK
≈ ≈
AVD
≈ ≈
tAVDS
tAVDH
VA
tIAA
VA
≈
tRDYS
Hi-Z
≈
≈
RDY
Status Data
≈
OE
≈ ≈
A/DQ0:
A/DQ15
≈ ≈
tACH
VA
≈ ≈
≈ ≈
A16-A24
tACS
VA
NOTE :
1) VA = Valid Address. When the Internal Routine operation is complete, the toggle bits will stop toggling.
Figure 17. Toggle Bit Timings(During Internal Routine)
- 45 -
Status Data
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
SWITCHING WAVEFORMS
Read While Write Operations
Last Cycle in
Program or
Block Erase
Command Sequence
tWC
tRC
tRC
tWC
≈
CE
≈
OE
tOE
tOEH
tGHWL
≈
WE
tWPH
tAA
tOEH
tDH
PD/30h
RA
RD
RA
≈
PA/BA
tWP
tDS
≈
A/DQ0:
A/DQ15
Begin another
Program or Erase
Command Sequences
Read status in same bank
and/or array data from other bank
RA
RD
555h
AAh
tSR/W
A16-A24
PA/BA
RA
≈
tAS
AVD
tAH
Figure 18. Read While Write Operation
NOTE :
Breakpoints in waveforms indicate that system may alternately read array data from the “non-busy bank” and checking the status of the program or erase operation in the “busy”
bank.
- 46 -
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
14.0 Crossing of First Word Boundary in Burst Read Mode
The additional clock insertion for word boundary is needed only at the first crossing of word boundary. This means that no additional clock cycle is needed
from 2nd word boundary crossing to the end of continuous burst read. Also, the number of additional clock cycle for the first word boundary can vary from
zero to thirteen cycles, and the exact number of additional clock cycle depends on the starting address of burst read and programmable wait state settings.
For example, if the starting address is 16N+15 (the worst case) and programmable wait state setting(A14~A11) is "0011" (which means data is valid on
the 7th active CLK edge after AVD transition to Vih), six additional clock cycle is needed.
Similarly, if the starting address is 16N+15 (the worst case) and programmable wait state setting(A14~A11) is "0010" (which means data is valid on the 6th
active CLK edge after AVD transition to Vih), five additional clock cycle is needed.
Below table shows the starting address vs. additional clock cycles for first word boundary.
Starting Address vs. Additional Clock Cycles for first word boundary
Srarting
Address Group
for
Burst Read
The Residue of
(Address/16)
LSB Bits
of Address
Additional Clock Cycles for First Word Boundary 1)
A14~A11 "0000"
Valid data : 4th CLK
A14~A11 "0001"
Valid data : 5th CLK
A14~A11 "0010"
Valid data : 6th CLK
...
A14~A11 "1010"
Valid data : 14th CLK
16N
0
0000
0 cycle
0 cycle
0 cycle
...
0 cycle
16N+1
1
0001
0 cycle
0 cycle
0 cycle
...
0 cycle
16N+2
2
0010
0 cycle
0 cycle
0 cycle
...
0 cycle
16N+3
3
0011
0 cycle
0 cycle
0 cycle
...
1 cycle
16N+4
4
0100
0 cycle
0 cycle
0 cycle
...
2 cycle
16N+5
5
0101
0 cycle
0 cycle
0 cycle
...
3 cycle
16N+6
6
0110
0 cycle
0 cycle
0 cycle
...
4 cycle
16N+7
7
0111
0 cycle
0 cycle
0 cycle
...
5 cycle
16N+8
8
1000
0 cycle
0 cycle
0 cycle
...
6 cycle
16N+9
9
1001
0 cycle
0 cycle
0 cycle
...
7 cycle
16N+10
10
1010
0 cycle
0 cycle
0 cycle
...
8 cycle
16N+11
11
1011
0 cycle
0 cycle
1 cycle
...
9 cycle
16N+12
12
1100
0 cycle
1 cycle
2 cycle
...
10 cycle
16N+13
13
1101
1 cycle
2 cycle
3 cycle
...
11 cycle
16N+14
14
1110
2 cycle
3 cycle
4 cycle
...
12 cycle
16N+15
15
1111
3 cycle
4 cycle
5 cycle
...
13 cycle
NOTE :
1) Address bit A14~A11 means the programmable wait state on burst mode configuration register. Refer to Table 10.
- 47 -
Rev. 1.0
datasheet
K5N1229ACD-BQ12
MCP Memory
Case 1 : Start from "16N" address group
14th rising edge CLK
CR setting : A14=1, A13=0, A12=1, A11=0
A/DQ0:
A/DQ15
Aa
≈ ≈
Aa
≈≈
A16-A24
0B
0C
0D
0E
0F
10
11
12
≈
CLK
00
0B
0C
0D
0F
0E
10
11
12
13
≈
AVD
No Additional Cycle for First Word Boundary
≈
CE
tOER
≈
OE
tCEZ
tOEZ
≈ ≈
RDY
NOTE :
1) Address boundary occurs every 16 words beginning at address 000000FH , 000001FH , 000002FH , etc.
2) Address 000000H is also a boundary crossing.
3) No additional clock cycles are needed except for 1st boundary crossing.
Figure 19. Crossing of first word boundary in burst read mode.
Case 2 : Start from "16N+3" address group
14th rising edge CLK
CR setting : A14=1, A13=0, A12=1, A11=0
A/DQ0:
A/DQ15
Aa
≈ ≈
Aa
≈ ≈≈
A16-A24
CLK
0D
0D
00
0E
0E
0F
0F
10
10
11
11
12
12
13
13
14
≈
AVD
Additional 1 Cycle for First Word Boundary
≈
CE
tOER
tOEZ
≈≈
RDY
≈
OE
tCEZ
NOTE :
1) Address boundary occurs every 16 words beginning at address 000000FH , 000001FH , 000002FH , etc.
2) Address 000000H is also a boundary crossing.
3) No additional clock cycles are needed except for 1st boundary crossing.
Figure 20. Crossing of first word boundary in burst read mode.
- 48 -
Rev. 1.0
datasheet
K5N1229ACD-BQ12
MCP Memory
Case3 : Start from "16N+4" address group
14th rising edge CLK
CR setting : A14=1, A13=0, A12=1, A11=0
A/DQ0:
A/DQ15
Aa
≈ ≈
Aa
≈ ≈≈
A16-A24
CLK
00
0F
0E
0E
0F
10
11
10
11
12
12
13
13
14
≈
AVD
Additional 2 Cycle for First Word Boundary
≈
CE
tOER
≈
OE
tCEZ
tOEZ
≈ ≈
RDY
Case 4 : Start from "16N+15" address group
14th rising edge CLK
CR setting : A14=1, A13=0, A12=1, A11=0
A/DQ0:
A/DQ15
Aa
CLK
00
3F
3F
10
≈
Additional 13 Cycle for First Word Boundary
≈
tOER
≈
OE
≈
≈
CE
10
11
≈
AVD
≈
≈≈
RDY
≈ ≈ ≈≈ ≈
Aa
≈ ≈≈
A16-A24
NOTE :
1) Address boundary occurs every 16 words beginning at address 000000FH , 000001FH , 000002FH , etc.
2) Address 000000H is also a boundary crossing.
3) No additional clock cycles are needed except for 1st boundary crossing.
Figure 21. Crossing of first word boundary in burst read mode.
- 49 -
11
12
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
[Table 16] Top Boot Block Address Table
Bank
Bank 0
Bank 1
Block
Block Size
(x16) Address Range
BA514
16 kwords
1FFC000h-1FFFFFFh
BA513
16 kwords
1FF8000h-1FFBFFFh
BA512
16 kwords
1FF4000h-1FF7FFFh
BA511
16 kwords
1FF0000h-1FF3FFFh
BA510
64 kwords
1FE0000h-1FEFFFFh
BA509
64 kwords
1FD0000h-1FDFFFFh
BA508
64 kwords
1FC0000h-1FCFFFFh
BA507
64 kwords
1FB0000h-1FBFFFFh
BA506
64 kwords
1FA0000h-1FAFFFFh
BA505
64 kwords
1F90000h-1F9FFFFh
BA504
64 kwords
1F80000h-1F8FFFFh
BA503
64 kwords
1F70000h-1F7FFFFh
BA502
64 kwords
1F60000h-1F6FFFFh
BA501
64 kwords
1F50000h-1F5FFFFh
BA500
64 kwords
1F40000h-1F4FFFFh
BA499
64 kwords
1F30000h-1F3FFFFh
BA498
64 kwords
1F20000h-1F2FFFFh
BA497
64 kwords
1F10000h-1F1FFFFh
BA496
64 kwords
1F00000h-1F0FFFFh
BA495
64 kwords
1EF0000h-1EFFFFFh
BA494
64 kwords
1EE0000h-1EEFFFFh
BA493
64 kwords
1ED0000h-1EDFFFFh
BA492
64 kwords
1EC0000h-1ECFFFFh
BA491
64 kwords
1EB0000h-1EBFFFFh
BA490
64 kwords
1EA0000h-1EAFFFFh
BA489
64 kwords
1E90000h-1E9FFFFh
BA488
64 kwords
1E80000h-1E8FFFFh
BA487
64 kwords
1E70000h-1E7FFFFh
BA486
64 kwords
1E60000h-1E6FFFFh
BA485
64 kwords
1E50000h-1E5FFFFh
BA484
64 kwords
1E40000h-1E4FFFFh
BA483
64 kwords
1E30000h-1E3FFFFh
BA482
64 kwords
1E20000h-1E2FFFFh
BA481
64 kwords
1E10000h-1E1FFFFh
BA480
64 kwords
1E00000h-1E0FFFFh
BA479
64 kwords
1DF0000h-1DFFFFFh
BA478
64 kwords
1DE0000h-1DEFFFFh
BA477
64 kwords
1DD0000h-1DDFFFFh
BA476
64 kwords
1DC0000h-1DCFFFFh
BA475
64 kwords
1DB0000h-1DBFFFFh
BA474
64 kwords
1DA0000h-1DAFFFFh
BA473
64 kwords
1D90000h-1D9FFFFh
BA472
64 kwords
1D80000h-1D8FFFFh
BA471
64 kwords
1D70000h-1D7FFFFh
BA470
64 kwords
1D60000h-1D6FFFFh
- 50 -
K5N1229ACD-BQ12
Bank
Bank 1
Bank 2
Rev. 1.0
datasheet
MCP Memory
Block
Block Size
(x16) Address Range
BA469
64 kwords
1D50000h-1D5FFFFh
BA468
64 kwords
1D40000h-1D4FFFFh
BA467
64 kwords
1D30000h-1D3FFFFh
BA466
64 kwords
1D20000h-1D2FFFFh
BA465
64 kwords
1D10000h-1D1FFFFh
BA464
64 kwords
1D00000h-1D0FFFFh
BA463
64 kwords
1CF0000h-1CFFFFFh
BA462
64 kwords
1CE0000h-1CEFFFFh
BA461
64 kwords
1CD0000h-1CDFFFFh
BA460
64 kwords
1CC0000h-1CCFFFFh
BA459
64 kwords
1CB0000h-1CBFFFFh
BA458
64 kwords
1CA0000h-1CAFFFFh
BA457
64 kwords
1C90000h-1C9FFFFh
BA456
64 kwords
1C80000h-1C8FFFFh
BA455
64 kwords
1C70000h-1C7FFFFh
BA454
64 kwords
1C60000h-1C6FFFFh
BA453
64 kwords
1C50000h-1C5FFFFh
BA452
64 kwords
1C40000h-1C4FFFFh
BA451
64 kwords
1C30000h-1C3FFFFh
BA450
64 kwords
1C20000h-1C2FFFFh
BA449
64 kwords
1C10000h-1C1FFFFh
BA448
64 kwords
1C00000h-1C0FFFFh
BA447
64 kwords
1BF0000h-1BFFFFFh
BA446
64 kwords
1BE0000h-1BEFFFFh
BA445
64 kwords
1BD0000h-1BDFFFFh
BA444
64 kwords
1BC0000h-1BCFFFFh
BA443
64 kwords
1BB0000h-1BBFFFFh
BA442
64 kwords
1BA0000h-1BAFFFFh
BA441
64 kwords
1B90000h-1B9FFFFh
BA440
64 kwords
1B80000h-1B8FFFFh
BA439
64 kwords
1B70000h-1B7FFFFh
BA438
64 kwords
1B60000h-1B6FFFFh
BA437
64 kwords
1B50000h-1B5FFFFh
BA436
64 kwords
1B40000h-1B4FFFFh
BA435
64 kwords
1B30000h-1B3FFFFh
BA434
64 kwords
1B20000h-1B2FFFFh
BA433
64 kwords
1B10000h-1B1FFFFh
BA432
64 kwords
1B00000h-1B0FFFFh
BA431
64 kwords
1AF0000h-1AFFFFFh
BA430
64 kwords
1AE0000h-1AEFFFFh
BA429
64 kwords
1AD0000h-1ADFFFFh
BA428
64 kwords
1AC0000h-1ACFFFFh
BA427
64 kwords
1AB0000h-1ABFFFFh
BA426
64 kwords
1AA0000h-1AAFFFFh
BA425
64 kwords
1A90000h-1A9FFFFh
- 51 -
K5N1229ACD-BQ12
Bank
Bank 2
Bank 3
Bank 4
Rev. 1.0
datasheet
MCP Memory
Block
Block Size
(x16) Address Range
BA424
64 kwords
1A80000h-1A8FFFFh
BA423
64 kwords
1A70000h-1A7FFFFh
BA422
64 kwords
1A60000h-1A6FFFFh
BA421
64 kwords
1A50000h-1A5FFFFh
BA420
64 kwords
1A40000h-1A4FFFFh
BA419
64 kwords
1A30000h-1A3FFFFh
BA418
64 kwords
1A20000h-1A2FFFFh
BA417
64 kwords
1A10000h-1A1FFFFh
BA416
64 kwords
1A00000h-1A0FFFFh
BA415
64 kwords
19F0000h-19FFFFFh
BA414
64 kwords
19E0000h-19EFFFFh
BA413
64 kwords
19D0000h-19DFFFFh
BA412
64 kwords
19C0000h-19CFFFFh
BA411
64 kwords
19B0000h-19BFFFFh
BA410
64 kwords
19A0000h-19AFFFFh
BA409
64 kwords
1990000h-199FFFFh
BA408
64 kwords
1980000h-198FFFFh
BA407
64 kwords
1970000h-197FFFFh
BA406
64 kwords
1960000h-196FFFFh
BA405
64 kwords
1950000h-195FFFFh
BA404
64 kwords
1940000h-194FFFFh
BA403
64 kwords
1930000h-193FFFFh
BA402
64 kwords
1920000h-192FFFFh
BA401
64 kwords
1910000h-191FFFFh
BA400
64 kwords
1900000h-190FFFFh
BA399
64 kwords
18F0000h-18FFFFFh
BA398
64 kwords
18E0000h-18EFFFFh
BA397
64 kwords
18D0000h-18DFFFFh
BA396
64 kwords
18C0000h-18CFFFFh
BA395
64 kwords
18B0000h-18BFFFFh
BA394
64 kwords
18A0000h-18AFFFFh
BA393
64 kwords
1890000h-189FFFFh
BA392
64 kwords
1880000h-188FFFFh
BA391
64 kwords
1870000h-187FFFFh
BA390
64 kwords
1860000h-186FFFFh
BA389
64 kwords
1850000h-185FFFFh
BA388
64 kwords
1840000h-184FFFFh
BA387
64 kwords
1830000h-183FFFFh
BA386
64 kwords
1820000h-182FFFFh
BA385
64 kwords
1810000h-181FFFFh
BA384
64 kwords
1800000h-180FFFFh
BA383
64 kwords
17F0000h-17FFFFFh
BA382
64 kwords
17E0000h-17EFFFFh
BA381
64 kwords
17D0000h-17DFFFFh
BA380
64 kwords
17C0000h-17CFFFFh
- 52 -
K5N1229ACD-BQ12
Bank
Bank 4
Bank5
Rev. 1.0
datasheet
MCP Memory
Block
Block Size
(x16) Address Range
BA379
64 kwords
17B0000h-17BFFFFh
BA378
64 kwords
17A0000h-17AFFFFh
BA377
64 kwords
1790000h-179FFFFh
BA376
64 kwords
1780000h-178FFFFh
BA375
64 kwords
1770000h-177FFFFh
BA374
64 kwords
1760000h-176FFFFh
BA373
64 kwords
1750000h-175FFFFh
BA372
64 kwords
1740000h-174FFFFh
BA371
64 kwords
1730000h-173FFFFh
BA370
64 kwords
1720000h-172FFFFh
BA369
64 kwords
1710000h-171FFFFh
BA368
64 kwords
1700000h-170FFFFh
BA367
64 kwords
16F0000h-16FFFFFh
BA366
64 kwords
16E0000h-16EFFFFh
BA365
64 kwords
16D0000h-16DFFFFh
BA364
64 kwords
16C0000h-16CFFFFh
BA363
64 kwords
16B0000h-16BFFFFh
BA362
64 kwords
16A0000h-16AFFFFh
BA361
64 kwords
1690000h-169FFFFh
BA360
64 kwords
1680000h-168FFFFh
BA359
64 kwords
1670000h-167FFFFh
BA358
64 kwords
1660000h-166FFFFh
BA357
64 kwords
1650000h-165FFFFh
BA356
64 kwords
1640000h-164FFFFh
BA355
64 kwords
1630000h-163FFFFh
BA354
64 kwords
1620000h-162FFFFh
BA353
64 kwords
1610000h-161FFFFh
BA352
64 kwords
1600000h-160FFFFh
BA351
64 kwords
15F0000h-15FFFFFh
BA350
64 kwords
15E0000h-15EFFFFh
BA349
64 kwords
15D0000h-15DFFFFh
BA348
64 kwords
15C0000h-15CFFFFh
BA347
64 kwords
15B0000h-15BFFFFh
BA346
64 kwords
15A0000h-15AFFFFh
BA345
64 kwords
1590000h-159FFFFh
BA344
64 kwords
1580000h-158FFFFh
BA343
64 kwords
1570000h-157FFFFh
BA342
64 kwords
1560000h-156FFFFh
BA341
64 kwords
1550000h-155FFFFh
BA340
64 kwords
1540000h-154FFFFh
BA339
64 kwords
1530000h-153FFFFh
BA338
64 kwords
1520000h-152FFFFh
BA337
64 kwords
1510000h-151FFFFh
BA336
64 kwords
1500000h-150FFFFh
- 53 -
K5N1229ACD-BQ12
Bank
Bank 5
Bank 6
Rev. 1.0
datasheet
MCP Memory
Block
Block Size
BA335
64 kwords
(x16) Address Range
14F0000h-14FFFFFh
BA334
64 kwords
14E0000h-14EFFFFh
BA333
64 kwords
14D0000h-14DFFFFh
BA332
64 kwords
14C0000h-14CFFFFh
BA331
64 kwords
14B0000h-14BFFFFh
BA330
64 kwords
14A0000h-14AFFFFh
BA329
64 kwords
1490000h-149FFFFh
BA328
64 kwords
1480000h-148FFFFh
BA327
64 kwords
1470000h-147FFFFh
BA326
64 kwords
1460000h-146FFFFh
BA325
64 kwords
1450000h-145FFFFh
BA324
64 kwords
1440000h-144FFFFh
BA323
64 kwords
1430000h-143FFFFh
BA322
64 kwords
1420000h-142FFFFh
BA321
64 kwords
1410000h-141FFFFh
BA320
64 kwords
1400000h-140FFFFh
BA319
64 kwords
13F0000h-13FFFFFh
BA318
64 kwords
13E0000h-13EFFFFh
BA317
64 kwords
13D0000h-13DFFFFh
BA316
64 kwords
13C0000h-13CFFFFh
BA315
64 kwords
13B0000h-13BFFFFh
BA314
64 kwords
13A0000h-13AFFFFh
BA313
64 kwords
1390000h-139FFFFh
BA312
64 kwords
1380000h-138FFFFh
BA311
64 kwords
1370000h-137FFFFh
BA310
64 kwords
1360000h-136FFFFh
BA309
64 kwords
1350000h-135FFFFh
BA308
64 kwords
1340000h-134FFFFh
BA307
64 kwords
1330000h-133FFFFh
BA306
64 kwords
1320000h-132FFFFh
BA305
64 kwords
1310000h-131FFFFh
BA304
64 kwords
1300000h-130FFFFh
BA303
64 kwords
12F0000h-12FFFFFh
BA302
64 kwords
12E0000h-12EFFFFh
BA301
64 kwords
12D0000h-12DFFFFh
BA300
64 kwords
12C0000h-12CFFFFh
BA299
64 kwords
12B0000h-12BFFFFh
BA298
64 kwords
12A0000h-12AFFFFh
BA297
64 kwords
1290000h-129FFFFh
BA296
64 kwords
1280000h-128FFFFh
BA295
64 kwords
1270000h-127FFFFh
BA294
64 kwords
1260000h-126FFFFh
BA293
64 kwords
1250000h-125FFFFh
BA292
64 kwords
1240000h-124FFFFh
BA291
64 kwords
1230000h-123FFFFh
- 54 -
K5N1229ACD-BQ12
Bank
Bank 6
Bank 7
Rev. 1.0
datasheet
MCP Memory
Block
Block Size
(x16) Address Range
BA290
64 kwords
1220000h-122FFFFh
BA289
64 kwords
1210000h-121FFFFh
BA288
64 kwords
1200000h-120FFFFh
BA287
64 kwords
11F0000h-11FFFFFh
BA286
64 kwords
11E0000h-11EFFFFh
BA285
64 kwords
11D0000h-11DFFFFh
BA284
64 kwords
11C0000h-11CFFFFh
BA283
64 kwords
11B0000h-11BFFFFh
BA282
64 kwords
11A0000h-11AFFFFh
BA281
64 kwords
1190000h-119FFFFh
BA280
64 kwords
1180000h-118FFFFh
BA279
64 kwords
1170000h-117FFFFh
BA278
64 kwords
1160000h-116FFFFh
BA277
64 kwords
1150000h-115FFFFh
BA276
64 kwords
1140000h-114FFFFh
BA275
64 kwords
1130000h-113FFFFh
BA274
64 kwords
1120000h-112FFFFh
BA273
64 kwords
1110000h-111FFFFh
BA272
64 kwords
1100000h-110FFFFh
BA271
64 kwords
10F0000h-10FFFFFh
BA270
64 kwords
10E0000h-10EFFFFh
BA269
64 kwords
10D0000h-10DFFFFh
BA268
64 kwords
10C0000h-10CFFFFh
BA267
64 kwords
10B0000h-10BFFFFh
BA266
64 kwords
10A0000h-10AFFFFh
BA265
64 kwords
1090000h-109FFFFh
BA264
64 kwords
1080000h-108FFFFh
BA263
64 kwords
1070000h-107FFFFh
BA262
64 kwords
1060000h-106FFFFh
BA261
64 kwords
1050000h-105FFFFh
BA260
64 kwords
1040000h-104FFFFh
BA259
64 kwords
1030000h-103FFFFh
- 55 -
K5N1229ACD-BQ12
Bank
Bank 7
Bank 8
Bank 9
Rev. 1.0
datasheet
MCP Memory
Block
Block Size
(x16) Address Range
BA258
64 kwords
1020000h-102FFFFh
BA257
64 kwords
1010000h-101FFFFh
BA256
64 kwords
1000000h-100FFFFh
BA255
64 kwords
0FF0000h-0FFFFFFh
BA254
64 kwords
0FE0000h-0FEFFFFh
BA253
64 kwords
0FD0000h-0FDFFFFh
BA252
64 kwords
0FC0000h-0FCFFFFh
BA251
64 kwords
0FB0000h-0FBFFFFh
BA250
64 kwords
0FA0000h-0FAFFFFh
BA249
64 kwords
0F90000h-0F9FFFFh
BA248
64 kwords
0F80000h-0F8FFFFh
BA247
64 kwords
0F70000h-0F7FFFFh
BA246
64 kwords
0F60000h-0F6FFFFh
BA245
64 kwords
0F50000h-0F5FFFFh
BA244
64 kwords
0F40000h-0F4FFFFh
BA243
64 kwords
0F30000h-0F3FFFFh
BA242
64 kwords
0F20000h-0F2FFFFh
BA241
64 kwords
0F10000h-0F1FFFFh
BA240
64 kwords
0F00000h-0F0FFFFh
BA239
64 kwords
0EF0000h-0EFFFFFh
BA238
64 kwords
0EE0000h-0EEFFFFh
BA237
64 kwords
0ED0000h-0EDFFFFh
BA236
64 kwords
0EC0000h-0ECFFFFh
BA235
64 kwords
0EB0000h-0EBFFFFh
BA234
64 kwords
0EA0000h-0EAFFFFh
BA233
64 kwords
0E90000h-0E9FFFFh
BA232
64 kwords
0E80000h-0E8FFFFh
BA231
64 kwords
0E70000h-0E7FFFFh
BA230
64 kwords
0E60000h-0E6FFFFh
BA229
64 kwords
0E50000h-0E5FFFFh
BA228
64 kwords
0E40000h-0E4FFFFh
BA227
64 kwords
0E30000h-0E3FFFFh
BA226
64 kwords
0E20000h-0E2FFFFh
BA225
64 kwords
0E10000h-0E1FFFFh
BA224
64 kwords
0E00000h-0E0FFFFh
BA223
64 kwords
0DF0000h-0DFFFFFh
BA222
64 kwords
0DE0000h-0DEFFFFh
BA221
64 kwords
0DD0000h-0DDFFFFh
BA220
64 kwords
0DC0000h-0DCFFFFh
BA219
64 kwords
0DB0000h-0DBFFFFh
BA218
64 kwords
0DA0000h-0DAFFFFh
BA217
64 kwords
0D90000h-0D9FFFFh
BA216
64 kwords
0D80000h-0D8FFFFh
BA215
64 kwords
0D70000h-0D7FFFFh
BA214
64 kwords
0D60000h-0D6FFFFh
- 56 -
K5N1229ACD-BQ12
Bank
Bank 9
Bank 10
Rev. 1.0
datasheet
MCP Memory
Block
Block Size
(x16) Address Range
BA213
64 kwords
0D50000h-0D5FFFFh
BA212
64 kwords
0D40000h-0D4FFFFh
BA211
64 kwords
0D30000h-0D3FFFFh
BA210
64 kwords
0D20000h-0D2FFFFh
BA209
64 kwords
0D10000h-0D1FFFFh
BA208
64 kwords
0D00000h-0D0FFFFh
BA207
64 kwords
0CF0000h-0CFFFFFh
BA206
64 kwords
0CE0000h-0CEFFFFh
BA205
64 kwords
0CD0000h-0CDFFFFh
BA204
64 kwords
0CC0000h-0CCFFFFh
BA203
64 kwords
0CB0000h-0CBFFFFh
BA202
64 kwords
0CA0000h-0CAFFFFh
BA201
64 kwords
0C90000h-0C9FFFFh
BA200
64 kwords
0C80000h-0C8FFFFh
BA199
64 kwords
0C70000h-0C7FFFFh
BA198
64 kwords
0C60000h-0C6FFFFh
BA197
64 kwords
0C50000h-0C5FFFFh
BA196
64 kwords
0C40000h-0C4FFFFh
BA195
64 kwords
0C30000h-0C3FFFFh
BA194
64 kwords
0C20000h-0C2FFFFh
BA193
64 kwords
0C10000h-0C1FFFFh
BA192
64 kwords
0C00000h-0C0FFFFh
BA191
64 kwords
0BF0000h-0BFFFFFh
BA190
64 kwords
0BE0000h-0BEFFFFh
BA189
64 kwords
0BD0000h-0BDFFFFh
BA188
64 kwords
0BC0000h-0BCFFFFh
BA187
64 kwords
0BB0000h-0BBFFFFh
BA186
64 kwords
0BA0000h-0BAFFFFh
BA185
64 kwords
0B90000h-0B9FFFFh
BA184
64 kwords
0B80000h-0B8FFFFh
BA183
64 kwords
0B70000h-0B7FFFFh
BA182
64 kwords
0B60000h-0B6FFFFh
BA181
64 kwords
0B50000h-0B5FFFFh
BA180
64 kwords
0B40000h-0B4FFFFh
BA179
64 kwords
0B30000h-0B3FFFFh
BA178
64 kwords
0B20000h-0B2FFFFh
BA177
64 kwords
0B10000h-0B1FFFFh
BA176
64 kwords
0B00000h-0B0FFFFh
BA175
64 kwords
0AF0000h-0AFFFFFh
BA174
64 kwords
0AE0000h-0AEFFFFh
BA173
64 kwords
0AD0000h-0ADFFFFh
BA172
64 kwords
0AC0000h-0ACFFFFh
BA171
64 kwords
0AB0000h-0ABFFFFh
BA170
64 kwords
0AA0000h-0AAFFFFh
BA169
64 kwords
0A90000h-0A9FFFFh
- 57 -
K5N1229ACD-BQ12
Bank
Bank 10
Bank 11
Bank 12
Rev. 1.0
datasheet
MCP Memory
Block
Block Size
(x16) Address Range
BA168
64 kwords
0A80000h-0A8FFFFh
BA167
64 kwords
0A70000h-0A7FFFFh
BA166
64 kwords
0A60000h-0A6FFFFh
BA165
64 kwords
0A50000h-0A5FFFFh
BA164
64 kwords
0A40000h-0A4FFFFh
BA163
64 kwords
0A30000h-0A3FFFFh
BA162
64 kwords
0A20000h-0A2FFFFh
BA161
64 kwords
0A10000h-0A1FFFFh
BA160
64 kwords
0A00000h-0A0FFFFh
BA159
64 kwords
09F0000h-09FFFFFh
BA158
64 kwords
09E0000h-09EFFFFh
BA157
64 kwords
09D0000h-09DFFFFh
BA156
64 kwords
09C0000h-09CFFFFh
BA155
64 kwords
09B0000h-09BFFFFh
BA154
64 kwords
09A0000h-09AFFFFh
BA153
64 kwords
0990000h-099FFFFh
BA152
64 kwords
0980000h-098FFFFh
BA151
64 kwords
0970000h-097FFFFh
BA150
64 kwords
0960000h-096FFFFh
BA149
64 kwords
0950000h-095FFFFh
BA148
64 kwords
0940000h-094FFFFh
BA147
64 kwords
0930000h-093FFFFh
BA146
64 kwords
0920000h-092FFFFh
BA145
64 kwords
0910000h-091FFFFh
BA144
64 kwords
0900000h-090FFFFh
BA143
64 kwords
08F0000h-08FFFFFh
BA142
64 kwords
08E0000h-08EFFFFh
BA141
64 kwords
08D0000h-08DFFFFh
BA140
64 kwords
08C0000h-08CFFFFh
BA139
64 kwords
08B0000h-08BFFFFh
BA138
64 kwords
08A0000h-08AFFFFh
BA137
64 kwords
0890000h-089FFFFh
BA136
64 kwords
0880000h-088FFFFh
BA135
64 kwords
0870000h-087FFFFh
BA134
64 kwords
0860000h-086FFFFh
BA133
64 kwords
0850000h-085FFFFh
BA132
64 kwords
0840000h-084FFFFh
BA131
64 kwords
0830000h-083FFFFh
BA130
64 kwords
0820000h-082FFFFh
BA129
64 kwords
0810000h-081FFFFh
BA128
64 kwords
0800000h-080FFFFh
BA127
64 kwords
07F0000h-07FFFFFh
BA126
64 kwords
07E0000h-07EFFFFh
BA125
64 kwords
07D0000h-07DFFFFh
BA124
64 kwords
07C0000h-07CFFFFh
- 58 -
K5N1229ACD-BQ12
Bank
Bank 12
Bank13
Rev. 1.0
datasheet
MCP Memory
Block
Block Size
(x16) Address Range
BA123
64 kwords
07B0000h-07BFFFFh
BA122
64 kwords
07A0000h-07AFFFFh
BA121
64 kwords
0790000h-079FFFFh
BA120
64 kwords
0780000h-078FFFFh
BA119
64 kwords
0770000h-077FFFFh
BA118
64 kwords
0760000h-076FFFFh
BA117
64 kwords
0750000h-075FFFFh
BA116
64 kwords
0740000h-074FFFFh
BA115
64 kwords
0730000h-073FFFFh
BA114
64 kwords
0720000h-072FFFFh
BA113
64 kwords
0710000h-071FFFFh
BA112
64 kwords
0700000h-070FFFFh
BA111
64 kwords
06F0000h-06FFFFFh
BA110
64 kwords
06E0000h-06EFFFFh
BA109
64 kwords
06D0000h-06DFFFFh
BA108
64 kwords
06C0000h-06CFFFFh
BA107
64 kwords
06B0000h-06BFFFFh
BA106
64 kwords
06A0000h-06AFFFFh
BA105
64 kwords
0690000h-069FFFFh
BA104
64 kwords
0680000h-068FFFFh
BA103
64 kwords
0670000h-067FFFFh
BA102
64 kwords
0660000h-066FFFFh
BA101
64 kwords
0650000h-065FFFFh
BA100
64 kwords
0640000h-064FFFFh
BA99
64 kwords
0630000h-063FFFFh
BA98
64 kwords
0620000h-062FFFFh
BA97
64 kwords
0610000h-061FFFFh
BA96
64 kwords
0600000h-060FFFFh
BA95
64 kwords
05F0000h-05FFFFFh
BA94
64 kwords
05E0000h-05EFFFFh
BA93
64 kwords
05D0000h-05DFFFFh
BA92
64 kwords
05C0000h-05CFFFFh
BA91
64 kwords
05B0000h-05BFFFFh
BA90
64 kwords
05A0000h-05AFFFFh
BA89
64 kwords
0590000h-059FFFFh
BA88
64 kwords
0580000h-058FFFFh
BA87
64 kwords
0570000h-057FFFFh
BA86
64 kwords
0560000h-056FFFFh
BA85
64 kwords
0550000h-055FFFFh
BA84
64 kwords
0540000h-054FFFFh
BA83
64 kwords
0530000h-053FFFFh
BA82
64 kwords
0520000h-052FFFFh
BA81
64 kwords
0510000h-051FFFFh
BA80
64 kwords
0500000h-050FFFFh
- 59 -
K5N1229ACD-BQ12
Bank
Bank 13
Bank 14
Rev. 1.0
datasheet
MCP Memory
Block
Block Size
BA79
64 kwords
04F0000h-04FFFFFh
BA78
64 kwords
04E0000h-04EFFFFh
BA77
64 kwords
04D0000h-04DFFFFh
BA76
64 kwords
04C0000h-04CFFFFh
BA75
64 kwords
04B0000h-04BFFFFh
BA74
64 kwords
04A0000h-04AFFFFh
BA73
64 kwords
0490000h-049FFFFh
BA72
64 kwords
0480000h-048FFFFh
BA71
64 kwords
0470000h-047FFFFh
BA70
64 kwords
0460000h-046FFFFh
BA69
64 kwords
0450000h-045FFFFh
BA68
64 kwords
0440000h-044FFFFh
BA67
64 kwords
0430000h-043FFFFh
BA66
64 kwords
0420000h-042FFFFh
BA65
64 kwords
0410000h-041FFFFh
BA64
64 kwords
0400000h-040FFFFh
BA63
64 kwords
03F0000h-03FFFFFh
BA62
64 kwords
03E0000h-03EFFFFh
BA61
64 kwords
03D0000h-03DFFFFh
BA60
64 kwords
03C0000h-03CFFFFh
BA59
64 kwords
03B0000h-03BFFFFh
BA58
64 kwords
03A0000h-03AFFFFh
BA57
64 kwords
0390000h-039FFFFh
BA56
64 kwords
0380000h-038FFFFh
BA55
64 kwords
0370000h-037FFFFh
BA54
64 kwords
0360000h-036FFFFh
BA53
64 kwords
0350000h-035FFFFh
BA52
64 kwords
0340000h-034FFFFh
BA51
64 kwords
0330000h-033FFFFh
BA50
64 kwords
0320000h-032FFFFh
BA49
64 kwords
0310000h-031FFFFh
BA48
64 kwords
0300000h-030FFFFh
BA47
64 kwords
02F0000h-02FFFFFh
BA46
64 kwords
02E0000h-02EFFFFh
BA45
64 kwords
02D0000h-02DFFFFh
BA44
64 kwords
02C0000h-02CFFFFh
BA43
64 kwords
02B0000h-02BFFFFh
BA42
64 kwords
02A0000h-02AFFFFh
BA41
64 kwords
0290000h-029FFFFh
BA40
64 kwords
0280000h-028FFFFh
BA39
64 kwords
0270000h-027FFFFh
BA38
64 kwords
0260000h-026FFFFh
BA37
64 kwords
0250000h-025FFFFh
BA36
64 kwords
0240000h-024FFFFh
BA35
64 kwords
0230000h-023FFFFh
- 60 -
(x16) Address Range
K5N1229ACD-BQ12
Bank
Bank 14
Bank 15
Rev. 1.0
datasheet
MCP Memory
Block
Block Size
(x16) Address Range
BA34
64 kwords
0220000h-022FFFFh
BA33
64 kwords
0210000h-021FFFFh
BA32
64 kwords
0200000h-020FFFFh
BA31
64 kwords
01F0000h-01FFFFFh
BA30
64 kwords
01E0000h-01EFFFFh
BA29
64 kwords
01D0000h-01DFFFFh
BA28
64 kwords
01C0000h-01CFFFFh
BA27
64 kwords
01B0000h-01BFFFFh
BA26
64 kwords
01A0000h-01AFFFFh
BA25
64 kwords
0190000h-019FFFFh
BA24
64 kwords
0180000h-018FFFFh
BA23
64 kwords
0170000h-017FFFFh
BA22
64 kwords
0160000h-016FFFFh
BA21
64 kwords
0150000h-015FFFFh
BA20
64 kwords
0140000h-014FFFFh
BA19
64 kwords
0130000h-013FFFFh
BA18
64 kwords
0120000h-012FFFFh
BA17
64 kwords
0110000h-011FFFFh
BA16
64 kwords
0100000h-010FFFFh
BA15
64 kwords
00F0000h-00FFFFFh
BA14
64 kwords
00E0000h-00EFFFFh
BA13
64 kwords
00D0000h-00DFFFFh
BA12
64 kwords
00C0000h-00CFFFFh
BA11
64 kwords
00B0000h-00BFFFFh
BA10
64 kwords
00A0000h-00AFFFFh
BA9
64 kwords
0090000h-009FFFFh
BA8
64 kwords
0080000h-008FFFFh
BA7
64 kwords
0070000h-007FFFFh
BA6
64 kwords
0060000h-006FFFFh
BA5
64 kwords
0050000h-005FFFFh
BA4
64 kwords
0040000h-004FFFFh
BA3
64 kwords
0030000h-003FFFFh
BA2
64 kwords
0020000h-002FFFFh
BA1
64 kwords
0010000h-001FFFFh
BA0
64 kwords
0000000h-000FFFFh
Block Address
A24 ~ A8
Block Size
(x16) Address Range*
1FFFFh
512 words
1FFFE00h-1FFFFFFh
[Table 17] Top Boot OTP Block Addresses
OTP
After entering OTP Block, any issued addresses should be in the range of OTP block address.
- 61 -
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
[Table 18] Bottom Boot Block Address Table
Bank
Bank 15
Bank 14
Block
Block Size
(x16) Address Range
BA514
64 Kwords
1FF0000h-1FFFFFFh
BA513
64 Kwords
1FE0000h-1FEFFFFh
BA512
64 Kwords
1FD0000h-1FDFFFFh
BA511
64 Kwords
1FC0000h-1FCFFFFh
BA510
64 kwords
1FB0000h-1FBFFFFh
BA509
64 kwords
1FA0000h-1FAFFFFh
BA508
64 kwords
1F90000h-1F9FFFFh
BA507
64 kwords
1F80000h-1F8FFFFh
BA506
64 kwords
1F70000h-1F7FFFFh
BA505
64 kwords
1F60000h-1F6FFFFh
BA504
64 kwords
1F50000h-1F5FFFFh
BA503
64 kwords
1F40000h-1F4FFFFh
BA502
64 kwords
1F30000h-1F3FFFFh
BA501
64 kwords
1F20000h-1F2FFFFh
BA500
64 kwords
1F10000h-1F1FFFFh
BA499
64 kwords
1F00000h-1F0FFFFh
BA498
64 kwords
1EF0000h-1EFFFFFh
BA497
64 kwords
1EE0000h-1EEFFFFh
BA496
64 kwords
1ED0000h-1EDFFFFh
BA495
64 kwords
1EC0000h-1ECFFFFh
BA494
64 kwords
1EB0000h-1EBFFFFh
BA493
64 kwords
1EA0000h-1EAFFFFh
BA492
64 kwords
1E90000h-1E9FFFFh
BA491
64 kwords
1E80000h-1E8FFFFh
BA490
64 kwords
1E70000h-1E7FFFFh
BA489
64 kwords
1E60000h-1E6FFFFh
BA488
64 kwords
1E50000h-1E5FFFFh
BA487
64 kwords
1E40000h-1E4FFFFh
BA486
64 kwords
1E30000h-1E3FFFFh
BA485
64 kwords
1E20000h-1E2FFFFh
BA484
64 kwords
1E10000h-1E1FFFFh
BA483
64 kwords
1E00000h-1E0FFFFh
BA482
64 kwords
1DF0000h-1DFFFFFh
BA481
64 kwords
1DE0000h-1DEFFFFh
BA480
64 kwords
1DD0000h-1DDFFFFh
BA479
64 kwords
1DC0000h-1DCFFFFh
BA478
64 kwords
1DB0000h-1DBFFFFh
BA477
64 kwords
1DA0000h-1DAFFFFh
BA476
64 kwords
1D90000h-1D9FFFFh
BA475
64 kwords
1D80000h-1D8FFFFh
BA474
64 kwords
1D70000h-1D7FFFFh
BA473
64 kwords
1D60000h-1D6FFFFh
BA472
64 kwords
1D50000h-1D5FFFFh
BA471
64 kwords
1D40000h-1D4FFFFh
BA470
64 kwords
1D30000h-1D3FFFFh
- 62 -
K5N1229ACD-BQ12
Bank
Bank 14
Bank 13
Rev. 1.0
datasheet
MCP Memory
Block
Block Size
(x16) Address Range
BA469
64 kwords
1D20000h-1D2FFFFh
BA468
64 kwords
1D10000h-1D1FFFFh
BA467
64 kwords
1D00000h-1D0FFFFh
BA466
64 kwords
1CF0000h-1CFFFFFh
BA465
64 kwords
1CE0000h-1CEFFFFh
BA464
64 kwords
1CD0000h-1CDFFFFh
BA463
64 kwords
1CC0000h-1CCFFFFh
BA462
64 kwords
1CB0000h-1CBFFFFh
BA461
64 kwords
1CA0000h-1CAFFFFh
BA460
64 kwords
1C90000h-1C9FFFFh
BA459
64 kwords
1C80000h-1C8FFFFh
BA458
64 kwords
1C70000h-1C7FFFFh
BA457
64 kwords
1C60000h-1C6FFFFh
BA456
64 kwords
1C50000h-1C5FFFFh
BA455
64 kwords
1C40000h-1C4FFFFh
BA454
64 kwords
1C30000h-1C3FFFFh
BA453
64 kwords
1C20000h-1C2FFFFh
BA452
64 kwords
1C10000h-1C1FFFFh
BA451
64 kwords
1C00000h-1C0FFFFh
BA450
64 kwords
1BF0000h-1BFFFFFh
BA449
64 kwords
1BE0000h-1BEFFFFh
BA448
64 kwords
1BD0000h-1BDFFFFh
BA447
64 kwords
1BC0000h-1BCFFFFh
BA446
64 kwords
1BB0000h-1BBFFFFh
BA445
64 kwords
1BA0000h-1BAFFFFh
BA444
64 kwords
1B90000h-1B9FFFFh
BA443
64 kwords
1B80000h-1B8FFFFh
BA442
64 kwords
1B70000h-1B7FFFFh
BA441
64 kwords
1B60000h-1B6FFFFh
BA440
64 kwords
1B50000h-1B5FFFFh
BA439
64 kwords
1B40000h-1B4FFFFh
BA438
64 kwords
1B30000h-1B3FFFFh
BA437
64 kwords
1B20000h-1B2FFFFh
BA436
64 kwords
1B10000h-1B1FFFFh
BA435
64 kwords
1B00000h-1B0FFFFh
BA434
64 kwords
1AF0000h-1AFFFFFh
BA433
64 kwords
1AE0000h-1AEFFFFh
BA432
64 kwords
1AD0000h-1ADFFFFh
BA431
64 kwords
1AC0000h-1ACFFFFh
BA430
64 kwords
1AB0000h-1ABFFFFh
BA429
64 kwords
1AA0000h-1AAFFFFh
BA428
64 kwords
1A90000h-1A9FFFFh
BA427
64 kwords
1A80000h-1A8FFFFh
BA426
64 kwords
1A70000h-1A7FFFFh
BA425
64 kwords
1A60000h-1A6FFFFh
- 63 -
K5N1229ACD-BQ12
Bank
Bank 13
Bank 12
Bank 11
Rev. 1.0
datasheet
MCP Memory
Block
Block Size
(x16) Address Range
BA424
64 kwords
1A50000h-1A5FFFFh
BA423
64 kwords
1A40000h-1A4FFFFh
BA422
64 kwords
1A30000h-1A3FFFFh
BA421
64 kwords
1A20000h-1A2FFFFh
BA420
64 kwords
1A10000h-1A1FFFFh
BA419
64 kwords
1A00000h-1A0FFFFh
BA418
64 kwords
19F0000h-19FFFFFh
BA417
64 kwords
19E0000h-19EFFFFh
BA416
64 kwords
19D0000h-19DFFFFh
BA415
64 kwords
19C0000h-19CFFFFh
BA414
64 kwords
19B0000h-19BFFFFh
BA413
64 kwords
19A0000h-19AFFFFh
BA412
64 kwords
1990000h-199FFFFh
BA411
64 kwords
1980000h-198FFFFh
BA410
64 kwords
1970000h-197FFFFh
BA409
64 kwords
1960000h-196FFFFh
BA408
64 kwords
1950000h-195FFFFh
BA407
64 kwords
1940000h-194FFFFh
BA406
64 kwords
1930000h-193FFFFh
BA405
64 kwords
1920000h-192FFFFh
BA404
64 kwords
1910000h-191FFFFh
BA403
64 kwords
1900000h-190FFFFh
BA402
64 kwords
18F0000h-18FFFFFh
BA401
64 kwords
18E0000h-18EFFFFh
BA400
64 kwords
18D0000h-18DFFFFh
BA399
64 kwords
18C0000h-18CFFFFh
BA398
64 kwords
18B0000h-18BFFFFh
BA397
64 kwords
18A0000h-18AFFFFh
BA396
64 kwords
1890000h-189FFFFh
BA395
64 kwords
1880000h-188FFFFh
BA394
64 kwords
1870000h-187FFFFh
BA393
64 kwords
1860000h-186FFFFh
BA392
64 kwords
1850000h-185FFFFh
BA391
64 kwords
1840000h-184FFFFh
BA390
64 kwords
1830000h-183FFFFh
BA389
64 kwords
1820000h-182FFFFh
BA388
64 kwords
1810000h-181FFFFh
BA387
64 kwords
1800000h-180FFFFh
BA386
64 kwords
17F0000h-17FFFFFh
BA385
64 kwords
17E0000h-17EFFFFh
BA384
64 kwords
17D0000h-17DFFFFh
BA383
64 kwords
17C0000h-17CFFFFh
BA382
64 kwords
17B0000h-17BFFFFh
BA381
64 kwords
17A0000h-17AFFFFh
BA380
64 kwords
1790000h-179FFFFh
- 64 -
K5N1229ACD-BQ12
Bank
Bank 11
Bank 10
Rev. 1.0
datasheet
MCP Memory
Block
Block Size
(x16) Address Range
BA379
64 kwords
1780000h-178FFFFh
BA378
64 kwords
1770000h-177FFFFh
BA377
64 kwords
1760000h-176FFFFh
BA376
64 kwords
1750000h-175FFFFh
BA375
64 kwords
1740000h-174FFFFh
BA374
64 kwords
1730000h-173FFFFh
BA373
64 kwords
1720000h-172FFFFh
BA372
64 kwords
1710000h-171FFFFh
BA371
64 kwords
1700000h-170FFFFh
BA370
64 kwords
16F0000h-16FFFFFh
BA369
64 kwords
16E0000h-16EFFFFh
BA368
64 kwords
16D0000h-16DFFFFh
BA367
64 kwords
16C0000h-16CFFFFh
BA366
64 kwords
16B0000h-16BFFFFh
BA365
64 kwords
16A0000h-16AFFFFh
BA364
64 kwords
1690000h-169FFFFh
BA363
64 kwords
1680000h-168FFFFh
BA362
64 kwords
1670000h-167FFFFh
BA361
64 kwords
1660000h-166FFFFh
BA360
64 kwords
1650000h-165FFFFh
BA359
64 kwords
1640000h-164FFFFh
BA358
64 kwords
1630000h-163FFFFh
BA357
64 kwords
1620000h-162FFFFh
BA356
64 kwords
1610000h-161FFFFh
BA355
64 kwords
1600000h-160FFFFh
BA354
64 kwords
15F0000h-15FFFFFh
BA353
64 kwords
15E0000h-15EFFFFh
BA352
64 kwords
15D0000h-15DFFFFh
BA351
64 kwords
15C0000h-15CFFFFh
BA350
64 kwords
15B0000h-15BFFFFh
BA349
64 kwords
15A0000h-15AFFFFh
BA348
64 kwords
1590000h-159FFFFh
BA347
64 kwords
1580000h-158FFFFh
BA346
64 kwords
1570000h-157FFFFh
BA345
64 kwords
1560000h-156FFFFh
BA344
64 kwords
1550000h-155FFFFh
BA343
64 kwords
1540000h-154FFFFh
BA342
64 kwords
1530000h-153FFFFh
BA341
64 kwords
1520000h-152FFFFh
BA340
64 kwords
1510000h-151FFFFh
BA339
64 kwords
1500000h-150FFFFh
BA338
64 kwords
14F0000h-14FFFFFh
BA337
64 kwords
14E0000h-14EFFFFh
BA336
64 kwords
14D0000h-14DFFFFh
- 65 -
K5N1229ACD-BQ12
Bank
Bank 10
Bank 9
Rev. 1.0
datasheet
MCP Memory
Block
Block Size
(x16) Address Range
BA335
64 kwords
14C0000h-14CFFFFh
BA334
64 kwords
14B0000h-14BFFFFh
BA333
64 kwords
14A0000h-14AFFFFh
BA332
64 kwords
1490000h-149FFFFh
BA331
64 kwords
1480000h-148FFFFh
BA330
64 kwords
1470000h-147FFFFh
BA329
64 kwords
1460000h-146FFFFh
BA328
64 kwords
1450000h-145FFFFh
BA327
64 kwords
1440000h-144FFFFh
BA326
64 kwords
1430000h-143FFFFh
BA325
64 kwords
1420000h-142FFFFh
BA324
64 kwords
1410000h-141FFFFh
BA323
64 kwords
1400000h-140FFFFh
BA322
64 kwords
13F0000h-13FFFFFh
BA321
64 kwords
13E0000h-13EFFFFh
BA320
64 kwords
13D0000h-13DFFFFh
BA319
64 kwords
13C0000h-13CFFFFh
BA318
64 kwords
13B0000h-13BFFFFh
BA317
64 kwords
13A0000h-13AFFFFh
BA316
64 kwords
1390000h-139FFFFh
BA315
64 kwords
1380000h-138FFFFh
BA314
64 kwords
1370000h-137FFFFh
BA313
64 kwords
1360000h-136FFFFh
BA312
64 kwords
1350000h-135FFFFh
BA311
64 kwords
1340000h-134FFFFh
BA310
64 kwords
1330000h-133FFFFh
BA309
64 kwords
1320000h-132FFFFh
BA308
64 kwords
1310000h-131FFFFh
BA307
64 kwords
1300000h-130FFFFh
BA306
64 kwords
12F0000h-12FFFFFh
BA305
64 kwords
12E0000h-12EFFFFh
BA304
64 kwords
12D0000h-12DFFFFh
BA303
64 kwords
12C0000h-12CFFFFh
BA302
64 kwords
12B0000h-12BFFFFh
BA301
64 kwords
12A0000h-12AFFFFh
BA300
64 kwords
1290000h-129FFFFh
BA299
64 kwords
1280000h-128FFFFh
BA298
64 kwords
1270000h-127FFFFh
BA297
64 kwords
1260000h-126FFFFh
BA296
64 kwords
1250000h-125FFFFh
BA295
64 kwords
1240000h-124FFFFh
BA294
64 kwords
1230000h-123FFFFh
BA293
64 kwords
1220000h-122FFFFh
BA292
64 kwords
1210000h-121FFFFh
BA291
64 kwords
1200000h-120FFFFh
- 66 -
K5N1229ACD-BQ12
Bank
Bank 8
Bank 7
Rev. 1.0
datasheet
MCP Memory
Block
Block Size
BA290
64 kwords
(x16) Address Range
11F0000h-11FFFFFh
BA289
64 kwords
11E0000h-11EFFFFh
BA288
64 kwords
11D0000h-11DFFFFh
BA287
64 kwords
11C0000h-11CFFFFh
BA286
64 kwords
11B0000h-11BFFFFh
BA285
64 kwords
11A0000h-11AFFFFh
BA284
64 kwords
1190000h-119FFFFh
BA283
64 kwords
1180000h-118FFFFh
BA282
64 kwords
1170000h-117FFFFh
BA281
64 kwords
1160000h-116FFFFh
BA280
64 kwords
1150000h-115FFFFh
BA279
64 kwords
1140000h-114FFFFh
BA278
64 kwords
1130000h-113FFFFh
BA277
64 kwords
1120000h-112FFFFh
BA276
64 kwords
1110000h-111FFFFh
BA275
64 kwords
1100000h-110FFFFh
BA274
64 kwords
10F0000h-10FFFFFh
BA273
64 kwords
10E0000h-10EFFFFh
BA272
64 kwords
10D0000h-10DFFFFh
BA271
64 kwords
10C0000h-10CFFFFh
BA270
64 kwords
10B0000h-10BFFFFh
BA269
64 kwords
10A0000h-10AFFFFh
BA268
64 kwords
1090000h-109FFFFh
BA267
64 kwords
1080000h-108FFFFh
BA266
64 kwords
1070000h-107FFFFh
BA265
64 kwords
1060000h-106FFFFh
BA264
64 kwords
1050000h-105FFFFh
BA263
64 kwords
1040000h-104FFFFh
BA262
64 kwords
1030000h-103FFFFh
BA261
64 kwords
1020000h-102FFFFh
BA260
64 kwords
1010000h-101FFFFh
BA259
64 kwords
1000000h-100FFFFh
BA258
64 kwords
0FF0000h-0FFFFFFh
BA257
64 kwords
0FE0000h-0FEFFFFh
BA256
64 kwords
0FD0000h-0FDFFFFh
BA255
64 kwords
0FC0000h-0FCFFFFh
BA254
64 kwords
0FB0000h-0FBFFFFh
BA253
64 kwords
0FA0000h-0FAFFFFh
BA252
64 kwords
0F90000h-0F9FFFFh
BA251
64 kwords
0F80000h-0F8FFFFh
BA250
64 kwords
0F70000h-0F7FFFFh
BA249
64 kwords
0F60000h-0F6FFFFh
BA248
64 kwords
0F50000h-0F5FFFFh
BA247
64 kwords
0F40000h-0F4FFFFh
BA246
64 kwords
0F30000h-0F3FFFFh
- 67 -
K5N1229ACD-BQ12
Bank
Bank 7
Bank 6
Rev. 1.0
datasheet
MCP Memory
Block
Block Size
(x16) Address Range
BA245
64 kwords
0F20000h-0F2FFFFh
BA244
64 kwords
0F10000h-0F1FFFFh
BA243
64 kwords
0F00000h-0F0FFFFh
BA242
64 kwords
0EF0000h-0EFFFFFh
BA241
64 kwords
0EE0000h-0EEFFFFh
BA240
64 kwords
0ED0000h-0EDFFFFh
BA239
64 kwords
0EC0000h-0ECFFFFh
BA238
64 kwords
0EB0000h-0EBFFFFh
BA237
64 kwords
0EA0000h-0EAFFFFh
BA236
64 kwords
0E90000h-0E9FFFFh
BA235
64 kwords
0E80000h-0E8FFFFh
BA234
64 kwords
0E70000h-0E7FFFFh
BA233
64 kwords
0E60000h-0E6FFFFh
BA232
64 kwords
0E50000h-0E5FFFFh
BA231
64 kwords
0E40000h-0E4FFFFh
BA230
64 kwords
0E30000h-0E3FFFFh
BA229
64 kwords
0E20000h-0E2FFFFh
BA228
64 kwords
0E10000h-0E1FFFFh
BA227
64 kwords
0E00000h-0E0FFFFh
BA226
64 kwords
0DF0000h-0DFFFFFh
BA225
64 kwords
0DE0000h-0DEFFFFh
BA224
64 kwords
0DD0000h-0DDFFFFh
BA223
64 kwords
0DC0000h-0DCFFFFh
BA222
64 kwords
0DB0000h-0DBFFFFh
BA221
64 kwords
0DA0000h-0DAFFFFh
BA220
64 kwords
0D90000h-0D9FFFFh
BA219
64 kwords
0D80000h-0D8FFFFh
BA218
64 kwords
0D70000h-0D7FFFFh
BA217
64 kwords
0D60000h-0D6FFFFh
BA216
64 kwords
0D50000h-0D5FFFFh
BA215
64 kwords
0D40000h-0D4FFFFh
BA214
64 kwords
0D30000h-0D3FFFFh
BA213
64 kwords
0D20000h-0D2FFFFh
BA212
64 kwords
0D10000h-0D1FFFFh
BA211
64 kwords
0D00000h-0D0FFFFh
BA210
64 kwords
0CF0000h-0CFFFFFh
BA209
64 kwords
0CE0000h-0CEFFFFh
BA208
64 kwords
0CD0000h-0CDFFFFh
BA207
64 kwords
0CC0000h-0CCFFFFh
BA206
64 kwords
0CB0000h-0CBFFFFh
BA205
64 kwords
0CA0000h-0CAFFFFh
BA204
64 kwords
0C90000h-0C9FFFFh
BA203
64 kwords
0C80000h-0C8FFFFh
BA202
64 kwords
0C70000h-0C7FFFFh
BA201
64 kwords
0C60000h-0C6FFFFh
- 68 -
K5N1229ACD-BQ12
Bank
Bank 6
Bank 5
Bank 4
Rev. 1.0
datasheet
MCP Memory
Block
Block Size
(x16) Address Range
BA200
64 kwords
0C50000h-0C5FFFFh
BA199
64 kwords
0C40000h-0C4FFFFh
BA198
64 kwords
0C30000h-0C3FFFFh
BA197
64 kwords
0C20000h-0C2FFFFh
BA196
64 kwords
0C10000h-0C1FFFFh
BA195
64 kwords
0C00000h-0C0FFFFh
BA194
64 kwords
0BF0000h-0BFFFFFh
BA193
64 kwords
0BE0000h-0BEFFFFh
BA192
64 kwords
0BD0000h-0BDFFFFh
BA191
64 kwords
0BC0000h-0BCFFFFh
BA190
64 kwords
0BB0000h-0BBFFFFh
BA189
64 kwords
0BA0000h-0BAFFFFh
BA188
64 kwords
0B90000h-0B9FFFFh
BA187
64 kwords
0B80000h-0B8FFFFh
BA186
64 kwords
0B70000h-0B7FFFFh
BA185
64 kwords
0B60000h-0B6FFFFh
BA184
64 kwords
0B50000h-0B5FFFFh
BA183
64 kwords
0B40000h-0B4FFFFh
BA182
64 kwords
0B30000h-0B3FFFFh
BA181
64 kwords
0B20000h-0B2FFFFh
BA180
64 kwords
0B10000h-0B1FFFFh
BA179
64 kwords
0B00000h-0B0FFFFh
BA178
64 kwords
0AF0000h-0AFFFFFh
BA177
64 kwords
0AE0000h-0AEFFFFh
BA176
64 kwords
0AD0000h-0ADFFFFh
BA175
64 kwords
0AC0000h-0ACFFFFh
BA174
64 kwords
0AB0000h-0ABFFFFh
BA173
64 kwords
0AA0000h-0AAFFFFh
BA172
64 kwords
0A90000h-0A9FFFFh
BA171
64 kwords
0A80000h-0A8FFFFh
BA170
64 kwords
0A70000h-0A7FFFFh
BA169
64 kwords
0A60000h-0A6FFFFh
BA168
64 kwords
0A50000h-0A5FFFFh
BA167
64 kwords
0A40000h-0A4FFFFh
BA166
64 kwords
0A30000h-0A3FFFFh
BA165
64 kwords
0A20000h-0A2FFFFh
BA164
64 kwords
0A10000h-0A1FFFFh
BA163
64 kwords
0A00000h-0A0FFFFh
BA162
64 kwords
09F0000h-09FFFFFh
BA161
64 kwords
09E0000h-09EFFFFh
BA160
64 kwords
09D0000h-09DFFFFh
BA159
64 kwords
09C0000h-09CFFFFh
BA158
64 kwords
09B0000h-09BFFFFh
BA157
64 kwords
09A0000h-09AFFFFh
BA156
64 kwords
0990000h-099FFFFh
- 69 -
K5N1229ACD-BQ12
Bank
Bank 4
Bank 3
Rev. 1.0
datasheet
MCP Memory
Block
Block Size
(x16) Address Range
BA155
64 kwords
0980000h-098FFFFh
BA154
64 kwords
0970000h-097FFFFh
BA153
64 kwords
0960000h-096FFFFh
BA152
64 kwords
0950000h-095FFFFh
BA151
64 kwords
0940000h-094FFFFh
BA150
64 kwords
0930000h-093FFFFh
BA149
64 kwords
0920000h-092FFFFh
BA148
64 kwords
0910000h-091FFFFh
BA147
64 kwords
0900000h-090FFFFh
BA146
64 kwords
08F0000h-08FFFFFh
BA145
64 kwords
08E0000h-08EFFFFh
BA144
64 kwords
08D0000h-08DFFFFh
BA143
64 kwords
08C0000h-08CFFFFh
BA142
64 kwords
08B0000h-08BFFFFh
BA141
64 kwords
08A0000h08AFFFFh
BA140
64 kwords
0890000h-089FFFFh
BA139
64 kwords
0880000h-088FFFFh
BA138
64 kwords
0870000h-087FFFFh
BA137
64 kwords
0860000h-086FFFFh
BA136
64 kwords
0850000h-085FFFFh
BA135
64 kwords
0840000h-084FFFFh
BA134
64 kwords
0830000h-083FFFFh
BA133
64 kwords
0820000h-082FFFFh
BA132
64 kwords
0810000h-081FFFFh
BA131
64 kwords
0800000h-080FFFFh
BA130
64 kwords
07F0000h-07FFFFFh
BA129
64 kwords
07E0000h-07EFFFFh
BA128
64 kwords
07D0000h-07DFFFFh
BA127
64 kwords
07C0000h-07CFFFFh
BA126
64 kwords
07B0000h-07BFFFFh
BA125
64 kwords
07A0000h-07AFFFFh
BA124
64 kwords
0790000h-079FFFFh
BA123
64 kwords
0780000h-078FFFFh
BA122
64 kwords
0770000h-077FFFFh
BA121
64 kwords
0760000h-076FFFFh
BA120
64 kwords
0750000h-075FFFFh
BA119
64 kwords
0740000h-074FFFFh
BA118
64 kwords
0730000h-073FFFFh
BA117
64 kwords
0720000h-072FFFFh
BA116
64 kwords
0710000h-071FFFFh
BA115
64 kwords
0700000h-070FFFFh
BA114
64 kwords
06F0000h-06FFFFFh
BA113
64 kwords
06E0000h-06EFFFFh
BA112
64 kwords
06D0000h-06DFFFFh
BA111
64 kwords
06C0000h-06CFFFFh
- 70 -
K5N1229ACD-BQ12
Bank
Bank 3
Bank 2
Bank 1
Rev. 1.0
datasheet
MCP Memory
Block
Block Size
BA110
64 kwords
(x16) Address Range
06B0000h-06BFFFFh
BA109
64 kwords
06A0000h-06AFFFFh
BA108
64 kwords
0690000h-069FFFFh
BA107
64 kwords
0680000h-068FFFFh
BA106
64 kwords
0670000h-067FFFFh
BA105
64 kwords
0660000h-066FFFFh
BA104
64 kwords
0650000h-065FFFFh
BA103
64 kwords
0640000h-064FFFFh
BA102
64 kwords
0630000h-063FFFFh
BA101
64 kwords
0620000h-062FFFFh
BA100
64 kwords
0610000h-061FFFFh
BA99
64 kwords
0600000h-060FFFFh
BA98
64 kwords
05F0000h-05FFFFFh
BA97
64 kwords
05E0000h-05EFFFFh
BA96
64 kwords
05D0000h-05DFFFFh
BA95
64 kwords
05C0000h-05CFFFFh
BA94
64 kwords
05B0000h-05BFFFFh
BA93
64 kwords
05A0000h-05AFFFFh
BA92
64 kwords
0590000h-059FFFFh
BA91
64 kwords
0580000h-058FFFFh
BA90
64 kwords
0570000h-057FFFFh
BA89
64 kwords
0560000h-056FFFFh
BA88
64 kwords
0550000h-055FFFFh
BA87
64 kwords
0540000h-054FFFFh
BA86
64 kwords
0530000h-053FFFFh
BA85
64 kwords
0520000h-052FFFFh
BA84
64 kwords
0510000h-051FFFFh
BA83
64 kwords
0500000h-050FFFFh
BA82
64 kwords
04F0000h-04FFFFFh
BA81
64 kwords
04E0000h-04EFFFFh
BA80
64 kwords
04D0000h-04DFFFFh
BA79
64 kwords
04C0000h-04CFFFFh
BA78
64 kwords
04B0000h-04BFFFFh
BA77
64 kwords
04A0000h-04AFFFFh
BA76
64 kwords
0490000h-049FFFFh
BA75
64 kwords
0480000h-048FFFFh
BA74
64 kwords
0470000h-047FFFFh
BA73
64 kwords
0460000h-046FFFFh
BA72
64 kwords
0450000h-045FFFFh
BA71
64 kwords
0440000h-044FFFFh
BA70
64 kwords
0430000h-043FFFFh
BA69
64 kwords
0420000h-042FFFFh
BA68
64 kwords
0410000h-041FFFFh
BA67
64 kwords
0400000h-040FFFFh
BA66
64 kwords
03F0000h-03FFFFFh
- 71 -
K5N1229ACD-BQ12
Bank
Bank 1
Bank 0
Rev. 1.0
datasheet
MCP Memory
Block
Block Size
BA65
64 kwords
03E0000h-03EFFFFh
BA64
64 kwords
03D0000h-03DFFFFh
BA63
64 kwords
03C0000h-03CFFFFh
BA62
64 kwords
03B0000h-03BFFFFh
BA61
64 kwords
03A0000h-03AFFFFh
BA60
64 kwords
0390000h-039FFFFh
BA59
64 kwords
0380000h-038FFFFh
BA58
64 kwords
0370000h-037FFFFh
BA57
64 kwords
0360000h-036FFFFh
BA56
64 kwords
0350000h-035FFFFh
BA55
64 kwords
0340000h-034FFFFh
BA54
64 kwords
0330000h-033FFFFh
BA53
64 kwords
0320000h-032FFFFh
BA52
64 kwords
0310000h-031FFFFh
BA51
64 kwords
0300000h-030FFFFh
BA50
64 kwords
02F0000h-02FFFFFh
BA49
64 kwords
02E0000h-02EFFFFh
BA48
64 kwords
02D0000h-02DFFFFh
BA47
64 kwords
02C0000h-02CFFFFh
BA46
64 kwords
02B0000h-02BFFFFh
BA45
64 kwords
02A0000h-02AFFFFh
BA44
64 kwords
0290000h-029FFFFh
BA43
64 kwords
0280000h-028FFFFh
BA42
64 kwords
0270000h-027FFFFh
BA41
64 kwords
0260000h-026FFFFh
BA40
64 kwords
0250000h-025FFFFh
BA39
64 kwords
0240000h-024FFFFh
BA38
64 kwords
0230000h-023FFFFh
BA37
64 kwords
0220000h-022FFFFh
BA36
64 kwords
0210000h-021FFFFh
BA35
64 kwords
0200000h-020FFFFh
BA34
64 kwords
01F0000h-01FFFFFh
BA33
64 kwords
01E0000h-01EFFFFh
BA32
64 kwords
01D0000h-01DFFFFh
BA31
64 kwords
01C0000h-01CFFFFh
BA30
64 kwords
01B0000h-01BFFFFh
BA29
64 kwords
01A0000h-01AFFFFh
BA28
64 kwords
0190000h-019FFFFh
BA27
64 kwords
0180000h-018FFFFh
BA26
64 kwords
0170000h-017FFFFh
BA25
64 kwords
0160000h-016FFFFh
BA24
64 kwords
0150000h-015FFFFh
BA23
64 kwords
0140000h-014FFFFh
BA22
64 kwords
0130000h-013FFFFh
BA21
64 kwords
0120000h-012FFFFh
- 72 -
(x16) Address Range
K5N1229ACD-BQ12
Bank
Bank 0
Rev. 1.0
datasheet
MCP Memory
Block
Block Size
BA20
64 kwords
(x16) Address Range
0110000h-011FFFFh
BA19
64 kwords
0100000h-010FFFFh
BA18
64 kwords
00F0000h-00FFFFFh
BA17
64 kwords
00E0000h-00EFFFFh
BA16
64 kwords
00D0000h-00DFFFFh
BA15
64 kwords
00C0000h-00CFFFFh
BA14
64 kwords
00B0000h-00BFFFFh
BA13
64 kwords
00A0000h-00AFFFFh
BA12
64 kwords
0090000h-009FFFFh
BA11
64 kwords
0080000h-008FFFFh
BA10
64 kwords
0070000h-007FFFFh
BA9
64 kwords
0060000h-006FFFFh
BA8
64 kwords
0050000h-005FFFFh
BA7
64 kwords
0040000h-004FFFFh
BA6
64 kwords
0030000h-003FFFFh
BA5
64 kwords
0020000h-002FFFFh
BA4
64 kwords
0010000h-001FFFFh
BA3
16 kwords
000C000h-000FFFFh
BA2
16 kwords
0008000h-000BFFFh
BA1
16 kwords
0004000h-0007FFFh
BA0
16 kwords
0000000h-0003FFFh
Block Address
A24 ~ A8
Block Size
(x16) Address Range*
00000h
512 words
0000000h-00001FFh
[Table 19] Bottom Boot OTP Block Addresses
OTP
After entering OTP Block, any issued addresses should be in the range of OTP block address.
- 73 -
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
[Table 20] Uniform Block Address Table
Bank
Bank 0
Bank 1
Block
Block Size
(x16) Address Range
BA511
64 kwords
1FF0000h-1FFFFFFh
BA510
64 kwords
1FE0000h-1FEFFFFh
BA509
64 kwords
1FD0000h-1FDFFFFh
BA508
64 kwords
1FC0000h-1FCFFFFh
BA507
64 kwords
1FB0000h-1FBFFFFh
BA506
64 kwords
1FA0000h-1FAFFFFh
BA505
64 kwords
1F90000h-1F9FFFFh
BA504
64 kwords
1F80000h-1F8FFFFh
BA503
64 kwords
1F70000h-1F7FFFFh
BA502
64 kwords
1F60000h-1F6FFFFh
BA501
64 kwords
1F50000h-1F5FFFFh
BA500
64 kwords
1F40000h-1F4FFFFh
BA499
64 kwords
1F30000h-1F3FFFFh
BA498
64 kwords
1F20000h-1F2FFFFh
BA497
64 kwords
1F10000h-1F1FFFFh
BA496
64 kwords
1F00000h-1F0FFFFh
BA495
64 kwords
1EF0000h-1EFFFFFh
BA494
64 kwords
1EE0000h-1EEFFFFh
BA493
64 kwords
1ED0000h-1EDFFFFh
BA492
64 kwords
1EC0000h-1ECFFFFh
BA491
64 kwords
1EB0000h-1EBFFFFh
BA490
64 kwords
1EA0000h-1EAFFFFh
BA489
64 kwords
1E90000h-1E9FFFFh
BA488
64 kwords
1E80000h-1E8FFFFh
BA487
64 kwords
1E70000h-1E7FFFFh
BA486
64 kwords
1E60000h-1E6FFFFh
BA485
64 kwords
1E50000h-1E5FFFFh
BA484
64 kwords
1E40000h-1E4FFFFh
BA483
64 kwords
1E30000h-1E3FFFFh
BA482
64 kwords
1E20000h-1E2FFFFh
BA481
64 kwords
1E10000h-1E1FFFFh
BA480
64 kwords
1E00000h-1E0FFFFh
BA479
64 kwords
1DF0000h-1DFFFFFh
BA478
64 kwords
1DE0000h-1DEFFFFh
BA477
64 kwords
1DD0000h-1DDFFFFh
BA476
64 kwords
1DC0000h-1DCFFFFh
BA475
64 kwords
1DB0000h-1DBFFFFh
BA474
64 kwords
1DA0000h-1DAFFFFh
BA473
64 kwords
1D90000h-1D9FFFFh
BA472
64 kwords
1D80000h-1D8FFFFh
BA471
64 kwords
1D70000h-1D7FFFFh
BA470
64 kwords
1D60000h-1D6FFFFh
- 74 -
K5N1229ACD-BQ12
Bank
Bank 1
Bank 2
Rev. 1.0
datasheet
MCP Memory
Block
Block Size
(x16) Address Range
BA469
64 kwords
1D50000h-1D5FFFFh
BA468
64 kwords
1D40000h-1D4FFFFh
BA467
64 kwords
1D30000h-1D3FFFFh
BA466
64 kwords
1D20000h-1D2FFFFh
BA465
64 kwords
1D10000h-1D1FFFFh
BA464
64 kwords
1D00000h-1D0FFFFh
BA463
64 kwords
1CF0000h-1CFFFFFh
BA462
64 kwords
1CE0000h-1CEFFFFh
BA461
64 kwords
1CD0000h-1CDFFFFh
BA460
64 kwords
1CC0000h-1CCFFFFh
BA459
64 kwords
1CB0000h-1CBFFFFh
BA458
64 kwords
1CA0000h-1CAFFFFh
BA457
64 kwords
1C90000h-1C9FFFFh
BA456
64 kwords
1C80000h-1C8FFFFh
BA455
64 kwords
1C70000h-1C7FFFFh
BA454
64 kwords
1C60000h-1C6FFFFh
BA453
64 kwords
1C50000h-1C5FFFFh
BA452
64 kwords
1C40000h-1C4FFFFh
BA451
64 kwords
1C30000h-1C3FFFFh
BA450
64 kwords
1C20000h-1C2FFFFh
BA449
64 kwords
1C10000h-1C1FFFFh
BA448
64 kwords
1C00000h-1C0FFFFh
BA447
64 kwords
1BF0000h-1BFFFFFh
BA446
64 kwords
1BE0000h-1BEFFFFh
BA445
64 kwords
1BD0000h-1BDFFFFh
BA444
64 kwords
1BC0000h-1BCFFFFh
BA443
64 kwords
1BB0000h-1BBFFFFh
BA442
64 kwords
1BA0000h-1BAFFFFh
BA441
64 kwords
1B90000h-1B9FFFFh
BA440
64 kwords
1B80000h-1B8FFFFh
BA439
64 kwords
1B70000h-1B7FFFFh
BA438
64 kwords
1B60000h-1B6FFFFh
BA437
64 kwords
1B50000h-1B5FFFFh
BA436
64 kwords
1B40000h-1B4FFFFh
BA435
64 kwords
1B30000h-1B3FFFFh
BA434
64 kwords
1B20000h-1B2FFFFh
BA433
64 kwords
1B10000h-1B1FFFFh
BA432
64 kwords
1B00000h-1B0FFFFh
BA431
64 kwords
1AF0000h-1AFFFFFh
BA430
64 kwords
1AE0000h-1AEFFFFh
BA429
64 kwords
1AD0000h-1ADFFFFh
BA428
64 kwords
1AC0000h-1ACFFFFh
BA427
64 kwords
1AB0000h-1ABFFFFh
BA426
64 kwords
1AA0000h-1AAFFFFh
BA425
64 kwords
1A90000h-1A9FFFFh
- 75 -
K5N1229ACD-BQ12
Bank
Bank 2
Bank 3
Bank 4
Rev. 1.0
datasheet
MCP Memory
Block
Block Size
(x16) Address Range
BA424
64 kwords
1A80000h-1A8FFFFh
BA423
64 kwords
1A70000h-1A7FFFFh
BA422
64 kwords
1A60000h-1A6FFFFh
BA421
64 kwords
1A50000h-1A5FFFFh
BA420
64 kwords
1A40000h-1A4FFFFh
BA419
64 kwords
1A30000h-1A3FFFFh
BA418
64 kwords
1A20000h-1A2FFFFh
BA417
64 kwords
1A10000h-1A1FFFFh
BA416
64 kwords
1A00000h-1A0FFFFh
BA415
64 kwords
19F0000h-19FFFFFh
BA414
64 kwords
19E0000h-19EFFFFh
BA413
64 kwords
19D0000h-19DFFFFh
BA412
64 kwords
19C0000h-19CFFFFh
BA411
64 kwords
19B0000h-19BFFFFh
BA410
64 kwords
19A0000h-19AFFFFh
BA409
64 kwords
1990000h-199FFFFh
BA408
64 kwords
1980000h-198FFFFh
BA407
64 kwords
1970000h-197FFFFh
BA406
64 kwords
1960000h-196FFFFh
BA405
64 kwords
1950000h-195FFFFh
BA404
64 kwords
1940000h-194FFFFh
BA403
64 kwords
1930000h-193FFFFh
BA402
64 kwords
1920000h-192FFFFh
BA401
64 kwords
1910000h-191FFFFh
BA400
64 kwords
1900000h-190FFFFh
BA399
64 kwords
18F0000h-18FFFFFh
BA398
64 kwords
18E0000h-18EFFFFh
BA397
64 kwords
18D0000h-18DFFFFh
BA396
64 kwords
18C0000h-18CFFFFh
BA395
64 kwords
18B0000h-18BFFFFh
BA394
64 kwords
18A0000h-18AFFFFh
BA393
64 kwords
1890000h-189FFFFh
BA392
64 kwords
1880000h-188FFFFh
BA391
64 kwords
1870000h-187FFFFh
BA390
64 kwords
1860000h-186FFFFh
BA389
64 kwords
1850000h-185FFFFh
BA388
64 kwords
1840000h-184FFFFh
BA387
64 kwords
1830000h-183FFFFh
BA386
64 kwords
1820000h-182FFFFh
BA385
64 kwords
1810000h-181FFFFh
BA384
64 kwords
1800000h-180FFFFh
BA383
64 kwords
17F0000h-17FFFFFh
BA382
64 kwords
17E0000h-17EFFFFh
BA381
64 kwords
17D0000h-17DFFFFh
BA380
64 kwords
17C0000h-17CFFFFh
- 76 -
K5N1229ACD-BQ12
Bank
Bank 4
Bank5
Rev. 1.0
datasheet
MCP Memory
Block
Block Size
(x16) Address Range
BA379
64 kwords
17B0000h-17BFFFFh
BA378
64 kwords
17A0000h-17AFFFFh
BA377
64 kwords
1790000h-179FFFFh
BA376
64 kwords
1780000h-178FFFFh
BA375
64 kwords
1770000h-177FFFFh
BA374
64 kwords
1760000h-176FFFFh
BA373
64 kwords
1750000h-175FFFFh
BA372
64 kwords
1740000h-174FFFFh
BA371
64 kwords
1730000h-173FFFFh
BA370
64 kwords
1720000h-172FFFFh
BA369
64 kwords
1710000h-171FFFFh
BA368
64 kwords
1700000h-170FFFFh
BA367
64 kwords
16F0000h-16FFFFFh
BA366
64 kwords
16E0000h-16EFFFFh
BA365
64 kwords
16D0000h-16DFFFFh
BA364
64 kwords
16C0000h-16CFFFFh
BA363
64 kwords
16B0000h-16BFFFFh
BA362
64 kwords
16A0000h-16AFFFFh
BA361
64 kwords
1690000h-169FFFFh
BA360
64 kwords
1680000h-168FFFFh
BA359
64 kwords
1670000h-167FFFFh
BA358
64 kwords
1660000h-166FFFFh
BA357
64 kwords
1650000h-165FFFFh
BA356
64 kwords
1640000h-164FFFFh
BA355
64 kwords
1630000h-163FFFFh
BA354
64 kwords
1620000h-162FFFFh
BA353
64 kwords
1610000h-161FFFFh
BA352
64 kwords
1600000h-160FFFFh
BA351
64 kwords
15F0000h-15FFFFFh
BA350
64 kwords
15E0000h-15EFFFFh
BA349
64 kwords
15D0000h-15DFFFFh
BA348
64 kwords
15C0000h-15CFFFFh
BA347
64 kwords
15B0000h-15BFFFFh
BA346
64 kwords
15A0000h-15AFFFFh
BA345
64 kwords
1590000h-159FFFFh
BA344
64 kwords
1580000h-158FFFFh
BA343
64 kwords
1570000h-157FFFFh
BA342
64 kwords
1560000h-156FFFFh
BA341
64 kwords
1550000h-155FFFFh
BA340
64 kwords
1540000h-154FFFFh
BA339
64 kwords
1530000h-153FFFFh
BA338
64 kwords
1520000h-152FFFFh
BA337
64 kwords
1510000h-151FFFFh
BA336
64 kwords
1500000h-150FFFFh
- 77 -
K5N1229ACD-BQ12
Bank
Bank 5
Bank 6
Rev. 1.0
datasheet
MCP Memory
Block
Block Size
BA335
64 kwords
(x16) Address Range
14F0000h-14FFFFFh
BA334
64 kwords
14E0000h-14EFFFFh
BA333
64 kwords
14D0000h-14DFFFFh
BA332
64 kwords
14C0000h-14CFFFFh
BA331
64 kwords
14B0000h-14BFFFFh
BA330
64 kwords
14A0000h-14AFFFFh
BA329
64 kwords
1490000h-149FFFFh
BA328
64 kwords
1480000h-148FFFFh
BA327
64 kwords
1470000h-147FFFFh
BA326
64 kwords
1460000h-146FFFFh
BA325
64 kwords
1450000h-145FFFFh
BA324
64 kwords
1440000h-144FFFFh
BA323
64 kwords
1430000h-143FFFFh
BA322
64 kwords
1420000h-142FFFFh
BA321
64 kwords
1410000h-141FFFFh
BA320
64 kwords
1400000h-140FFFFh
BA319
64 kwords
13F0000h-13FFFFFh
BA318
64 kwords
13E0000h-13EFFFFh
BA317
64 kwords
13D0000h-13DFFFFh
BA316
64 kwords
13C0000h-13CFFFFh
BA315
64 kwords
13B0000h-13BFFFFh
BA314
64 kwords
13A0000h-13AFFFFh
BA313
64 kwords
1390000h-139FFFFh
BA312
64 kwords
1380000h-138FFFFh
BA311
64 kwords
1370000h-137FFFFh
BA310
64 kwords
1360000h-136FFFFh
BA309
64 kwords
1350000h-135FFFFh
BA308
64 kwords
1340000h-134FFFFh
BA307
64 kwords
1330000h-133FFFFh
BA306
64 kwords
1320000h-132FFFFh
BA305
64 kwords
1310000h-131FFFFh
BA304
64 kwords
1300000h-130FFFFh
BA303
64 kwords
12F0000h-12FFFFFh
BA302
64 kwords
12E0000h-12EFFFFh
BA301
64 kwords
12D0000h-12DFFFFh
BA300
64 kwords
12C0000h-12CFFFFh
BA299
64 kwords
12B0000h-12BFFFFh
BA298
64 kwords
12A0000h-12AFFFFh
BA297
64 kwords
1290000h-129FFFFh
BA296
64 kwords
1280000h-128FFFFh
BA295
64 kwords
1270000h-127FFFFh
BA294
64 kwords
1260000h-126FFFFh
BA293
64 kwords
1250000h-125FFFFh
BA292
64 kwords
1240000h-124FFFFh
BA291
64 kwords
1230000h-123FFFFh
- 78 -
K5N1229ACD-BQ12
Bank
Bank 6
Bank 7
Rev. 1.0
datasheet
MCP Memory
Block
Block Size
(x16) Address Range
BA290
64 kwords
1220000h-122FFFFh
BA289
64 kwords
1210000h-121FFFFh
BA288
64 kwords
1200000h-120FFFFh
BA287
64 kwords
11F0000h-11FFFFFh
BA286
64 kwords
11E0000h-11EFFFFh
BA285
64 kwords
11D0000h-11DFFFFh
BA284
64 kwords
11C0000h-11CFFFFh
BA283
64 kwords
11B0000h-11BFFFFh
BA282
64 kwords
11A0000h-11AFFFFh
BA281
64 kwords
1190000h-119FFFFh
BA280
64 kwords
1180000h-118FFFFh
BA279
64 kwords
1170000h-117FFFFh
BA278
64 kwords
1160000h-116FFFFh
BA277
64 kwords
1150000h-115FFFFh
BA276
64 kwords
1140000h-114FFFFh
BA275
64 kwords
1130000h-113FFFFh
BA274
64 kwords
1120000h-112FFFFh
BA273
64 kwords
1110000h-111FFFFh
BA272
64 kwords
1100000h-110FFFFh
BA271
64 kwords
10F0000h-10FFFFFh
BA270
64 kwords
10E0000h-10EFFFFh
BA269
64 kwords
10D0000h-10DFFFFh
BA268
64 kwords
10C0000h-10CFFFFh
BA267
64 kwords
10B0000h-10BFFFFh
BA266
64 kwords
10A0000h-10AFFFFh
BA265
64 kwords
1090000h-109FFFFh
BA264
64 kwords
1080000h-108FFFFh
BA263
64 kwords
1070000h-107FFFFh
BA262
64 kwords
1060000h-106FFFFh
BA261
64 kwords
1050000h-105FFFFh
BA260
64 kwords
1040000h-104FFFFh
BA259
64 kwords
1030000h-103FFFFh
- 79 -
K5N1229ACD-BQ12
Bank
Bank 7
Bank 8
Bank 9
Rev. 1.0
datasheet
MCP Memory
Block
Block Size
(x16) Address Range
BA258
64 kwords
1020000h-102FFFFh
BA257
64 kwords
1010000h-101FFFFh
BA256
64 kwords
1000000h-100FFFFh
BA255
64 kwords
0FF0000h-0FFFFFFh
BA254
64 kwords
0FE0000h-0FEFFFFh
BA253
64 kwords
0FD0000h-0FDFFFFh
BA252
64 kwords
0FC0000h-0FCFFFFh
BA251
64 kwords
0FB0000h-0FBFFFFh
BA250
64 kwords
0FA0000h-0FAFFFFh
BA249
64 kwords
0F90000h-0F9FFFFh
BA248
64 kwords
0F80000h-0F8FFFFh
BA247
64 kwords
0F70000h-0F7FFFFh
BA246
64 kwords
0F60000h-0F6FFFFh
BA245
64 kwords
0F50000h-0F5FFFFh
BA244
64 kwords
0F40000h-0F4FFFFh
BA243
64 kwords
0F30000h-0F3FFFFh
BA242
64 kwords
0F20000h-0F2FFFFh
BA241
64 kwords
0F10000h-0F1FFFFh
BA240
64 kwords
0F00000h-0F0FFFFh
BA239
64 kwords
0EF0000h-0EFFFFFh
BA238
64 kwords
0EE0000h-0EEFFFFh
BA237
64 kwords
0ED0000h-0EDFFFFh
BA236
64 kwords
0EC0000h-0ECFFFFh
BA235
64 kwords
0EB0000h-0EBFFFFh
BA234
64 kwords
0EA0000h-0EAFFFFh
BA233
64 kwords
0E90000h-0E9FFFFh
BA232
64 kwords
0E80000h-0E8FFFFh
BA231
64 kwords
0E70000h-0E7FFFFh
BA230
64 kwords
0E60000h-0E6FFFFh
BA229
64 kwords
0E50000h-0E5FFFFh
BA228
64 kwords
0E40000h-0E4FFFFh
BA227
64 kwords
0E30000h-0E3FFFFh
BA226
64 kwords
0E20000h-0E2FFFFh
BA225
64 kwords
0E10000h-0E1FFFFh
BA224
64 kwords
0E00000h-0E0FFFFh
BA223
64 kwords
0DF0000h-0DFFFFFh
BA222
64 kwords
0DE0000h-0DEFFFFh
BA221
64 kwords
0DD0000h-0DDFFFFh
BA220
64 kwords
0DC0000h-0DCFFFFh
BA219
64 kwords
0DB0000h-0DBFFFFh
BA218
64 kwords
0DA0000h-0DAFFFFh
BA217
64 kwords
0D90000h-0D9FFFFh
BA216
64 kwords
0D80000h-0D8FFFFh
BA215
64 kwords
0D70000h-0D7FFFFh
BA214
64 kwords
0D60000h-0D6FFFFh
- 80 -
K5N1229ACD-BQ12
Bank
Bank 9
Bank 10
Rev. 1.0
datasheet
MCP Memory
Block
Block Size
(x16) Address Range
BA213
64 kwords
0D50000h-0D5FFFFh
BA212
64 kwords
0D40000h-0D4FFFFh
BA211
64 kwords
0D30000h-0D3FFFFh
BA210
64 kwords
0D20000h-0D2FFFFh
BA209
64 kwords
0D10000h-0D1FFFFh
BA208
64 kwords
0D00000h-0D0FFFFh
BA207
64 kwords
0CF0000h-0CFFFFFh
BA206
64 kwords
0CE0000h-0CEFFFFh
BA205
64 kwords
0CD0000h-0CDFFFFh
BA204
64 kwords
0CC0000h-0CCFFFFh
BA203
64 kwords
0CB0000h-0CBFFFFh
BA202
64 kwords
0CA0000h-0CAFFFFh
BA201
64 kwords
0C90000h-0C9FFFFh
BA200
64 kwords
0C80000h-0C8FFFFh
BA199
64 kwords
0C70000h-0C7FFFFh
BA198
64 kwords
0C60000h-0C6FFFFh
BA197
64 kwords
0C50000h-0C5FFFFh
BA196
64 kwords
0C40000h-0C4FFFFh
BA195
64 kwords
0C30000h-0C3FFFFh
BA194
64 kwords
0C20000h-0C2FFFFh
BA193
64 kwords
0C10000h-0C1FFFFh
BA192
64 kwords
0C00000h-0C0FFFFh
BA191
64 kwords
0BF0000h-0BFFFFFh
BA190
64 kwords
0BE0000h-0BEFFFFh
BA189
64 kwords
0BD0000h-0BDFFFFh
BA188
64 kwords
0BC0000h-0BCFFFFh
BA187
64 kwords
0BB0000h-0BBFFFFh
BA186
64 kwords
0BA0000h-0BAFFFFh
BA185
64 kwords
0B90000h-0B9FFFFh
BA184
64 kwords
0B80000h-0B8FFFFh
BA183
64 kwords
0B70000h-0B7FFFFh
BA182
64 kwords
0B60000h-0B6FFFFh
BA181
64 kwords
0B50000h-0B5FFFFh
BA180
64 kwords
0B40000h-0B4FFFFh
BA179
64 kwords
0B30000h-0B3FFFFh
BA178
64 kwords
0B20000h-0B2FFFFh
BA177
64 kwords
0B10000h-0B1FFFFh
BA176
64 kwords
0B00000h-0B0FFFFh
BA175
64 kwords
0AF0000h-0AFFFFFh
BA174
64 kwords
0AE0000h-0AEFFFFh
BA173
64 kwords
0AD0000h-0ADFFFFh
BA172
64 kwords
0AC0000h-0ACFFFFh
BA171
64 kwords
0AB0000h-0ABFFFFh
BA170
64 kwords
0AA0000h-0AAFFFFh
BA169
64 kwords
0A90000h-0A9FFFFh
- 81 -
K5N1229ACD-BQ12
Bank
Bank 10
Bank 11
Bank 12
Rev. 1.0
datasheet
MCP Memory
Block
Block Size
(x16) Address Range
BA168
64 kwords
0A80000h-0A8FFFFh
BA167
64 kwords
0A70000h-0A7FFFFh
BA166
64 kwords
0A60000h-0A6FFFFh
BA165
64 kwords
0A50000h-0A5FFFFh
BA164
64 kwords
0A40000h-0A4FFFFh
BA163
64 kwords
0A30000h-0A3FFFFh
BA162
64 kwords
0A20000h-0A2FFFFh
BA161
64 kwords
0A10000h-0A1FFFFh
BA160
64 kwords
0A00000h-0A0FFFFh
BA159
64 kwords
09F0000h-09FFFFFh
BA158
64 kwords
09E0000h-09EFFFFh
BA157
64 kwords
09D0000h-09DFFFFh
BA156
64 kwords
09C0000h-09CFFFFh
BA155
64 kwords
09B0000h-09BFFFFh
BA154
64 kwords
09A0000h-09AFFFFh
BA153
64 kwords
0990000h-099FFFFh
BA152
64 kwords
0980000h-098FFFFh
BA151
64 kwords
0970000h-097FFFFh
BA150
64 kwords
0960000h-096FFFFh
BA149
64 kwords
0950000h-095FFFFh
BA148
64 kwords
0940000h-094FFFFh
BA147
64 kwords
0930000h-093FFFFh
BA146
64 kwords
0920000h-092FFFFh
BA145
64 kwords
0910000h-091FFFFh
BA144
64 kwords
0900000h-090FFFFh
BA143
64 kwords
08F0000h-08FFFFFh
BA142
64 kwords
08E0000h-08EFFFFh
BA141
64 kwords
08D0000h-08DFFFFh
BA140
64 kwords
08C0000h-08CFFFFh
BA139
64 kwords
08B0000h-08BFFFFh
BA138
64 kwords
08A0000h-08AFFFFh
BA137
64 kwords
0890000h-089FFFFh
BA136
64 kwords
0880000h-088FFFFh
BA135
64 kwords
0870000h-087FFFFh
BA134
64 kwords
0860000h-086FFFFh
BA133
64 kwords
0850000h-085FFFFh
BA132
64 kwords
0840000h-084FFFFh
BA131
64 kwords
0830000h-083FFFFh
BA130
64 kwords
0820000h-082FFFFh
BA129
64 kwords
0810000h-081FFFFh
BA128
64 kwords
0800000h-080FFFFh
BA127
64 kwords
07F0000h-07FFFFFh
BA126
64 kwords
07E0000h-07EFFFFh
BA125
64 kwords
07D0000h-07DFFFFh
BA124
64 kwords
07C0000h-07CFFFFh
- 82 -
K5N1229ACD-BQ12
Bank
Bank 12
Bank13
Rev. 1.0
datasheet
MCP Memory
Block
Block Size
(x16) Address Range
BA123
64 kwords
07B0000h-07BFFFFh
BA122
64 kwords
07A0000h-07AFFFFh
BA121
64 kwords
0790000h-079FFFFh
BA120
64 kwords
0780000h-078FFFFh
BA119
64 kwords
0770000h-077FFFFh
BA118
64 kwords
0760000h-076FFFFh
BA117
64 kwords
0750000h-075FFFFh
BA116
64 kwords
0740000h-074FFFFh
BA115
64 kwords
0730000h-073FFFFh
BA114
64 kwords
0720000h-072FFFFh
BA113
64 kwords
0710000h-071FFFFh
BA112
64 kwords
0700000h-070FFFFh
BA111
64 kwords
06F0000h-06FFFFFh
BA110
64 kwords
06E0000h-06EFFFFh
BA109
64 kwords
06D0000h-06DFFFFh
BA108
64 kwords
06C0000h-06CFFFFh
BA107
64 kwords
06B0000h-06BFFFFh
BA106
64 kwords
06A0000h-06AFFFFh
BA105
64 kwords
0690000h-069FFFFh
BA104
64 kwords
0680000h-068FFFFh
BA103
64 kwords
0670000h-067FFFFh
BA102
64 kwords
0660000h-066FFFFh
BA101
64 kwords
0650000h-065FFFFh
BA100
64 kwords
0640000h-064FFFFh
BA99
64 kwords
0630000h-063FFFFh
BA98
64 kwords
0620000h-062FFFFh
BA97
64 kwords
0610000h-061FFFFh
BA96
64 kwords
0600000h-060FFFFh
BA95
64 kwords
05F0000h-05FFFFFh
BA94
64 kwords
05E0000h-05EFFFFh
BA93
64 kwords
05D0000h-05DFFFFh
BA92
64 kwords
05C0000h-05CFFFFh
BA91
64 kwords
05B0000h-05BFFFFh
BA90
64 kwords
05A0000h-05AFFFFh
BA89
64 kwords
0590000h-059FFFFh
BA88
64 kwords
0580000h-058FFFFh
BA87
64 kwords
0570000h-057FFFFh
BA86
64 kwords
0560000h-056FFFFh
BA85
64 kwords
0550000h-055FFFFh
BA84
64 kwords
0540000h-054FFFFh
BA83
64 kwords
0530000h-053FFFFh
BA82
64 kwords
0520000h-052FFFFh
BA81
64 kwords
0510000h-051FFFFh
BA80
64 kwords
0500000h-050FFFFh
- 83 -
K5N1229ACD-BQ12
Bank
Bank 13
Bank 14
Rev. 1.0
datasheet
MCP Memory
Block
Block Size
BA79
64 kwords
(x16) Address Range
04F0000h-04FFFFFh
BA78
64 kwords
04E0000h-04EFFFFh
BA77
64 kwords
04D0000h-04DFFFFh
BA76
64 kwords
04C0000h-04CFFFFh
BA75
64 kwords
04B0000h-04BFFFFh
BA74
64 kwords
04A0000h-04AFFFFh
BA73
64 kwords
0490000h-049FFFFh
BA72
64 kwords
0480000h-048FFFFh
BA71
64 kwords
0470000h-047FFFFh
BA70
64 kwords
0460000h-046FFFFh
BA69
64 kwords
0450000h-045FFFFh
BA68
64 kwords
0440000h-044FFFFh
BA67
64 kwords
0430000h-043FFFFh
BA66
64 kwords
0420000h-042FFFFh
BA65
64 kwords
0410000h-041FFFFh
BA64
64 kwords
0400000h-040FFFFh
BA63
64 kwords
03F0000h-03FFFFFh
BA62
64 kwords
03E0000h-03EFFFFh
BA61
64 kwords
03D0000h-03DFFFFh
BA60
64 kwords
03C0000h-03CFFFFh
BA59
64 kwords
03B0000h-03BFFFFh
BA58
64 kwords
03A0000h-03AFFFFh
BA57
64 kwords
0390000h-039FFFFh
BA56
64 kwords
0380000h-038FFFFh
BA55
64 kwords
0370000h-037FFFFh
BA54
64 kwords
0360000h-036FFFFh
BA53
64 kwords
0350000h-035FFFFh
BA52
64 kwords
0340000h-034FFFFh
BA51
64 kwords
0330000h-033FFFFh
BA50
64 kwords
0320000h-032FFFFh
BA49
64 kwords
0310000h-031FFFFh
BA48
64 kwords
0300000h-030FFFFh
BA47
64 kwords
02F0000h-02FFFFFh
BA46
64 kwords
02E0000h-02EFFFFh
BA45
64 kwords
02D0000h-02DFFFFh
BA44
64 kwords
02C0000h-02CFFFFh
BA43
64 kwords
02B0000h-02BFFFFh
BA42
64 kwords
02A0000h-02AFFFFh
BA41
64 kwords
0290000h-029FFFFh
BA40
64 kwords
0280000h-028FFFFh
BA39
64 kwords
0270000h-027FFFFh
BA38
64 kwords
0260000h-026FFFFh
BA37
64 kwords
0250000h-025FFFFh
BA36
64 kwords
0240000h-024FFFFh
BA35
64 kwords
0230000h-023FFFFh
- 84 -
K5N1229ACD-BQ12
Bank
Bank 14
Bank 15
Rev. 1.0
datasheet
MCP Memory
Block
Block Size
(x16) Address Range
BA34
64 kwords
0220000h-022FFFFh
BA33
64 kwords
0210000h-021FFFFh
BA32
64 kwords
0200000h-020FFFFh
BA31
64 kwords
01F0000h-01FFFFFh
BA30
64 kwords
01E0000h-01EFFFFh
BA29
64 kwords
01D0000h-01DFFFFh
BA28
64 kwords
01C0000h-01CFFFFh
BA27
64 kwords
01B0000h-01BFFFFh
BA26
64 kwords
01A0000h-01AFFFFh
BA25
64 kwords
0190000h-019FFFFh
BA24
64 kwords
0180000h-018FFFFh
BA23
64 kwords
0170000h-017FFFFh
BA22
64 kwords
0160000h-016FFFFh
BA21
64 kwords
0150000h-015FFFFh
BA20
64 kwords
0140000h-014FFFFh
BA19
64 kwords
0130000h-013FFFFh
BA18
64 kwords
0120000h-012FFFFh
BA17
64 kwords
0110000h-011FFFFh
BA16
64 kwords
0100000h-010FFFFh
BA15
64 kwords
00F0000h-00FFFFFh
BA14
64 kwords
00E0000h-00EFFFFh
BA13
64 kwords
00D0000h-00DFFFFh
BA12
64 kwords
00C0000h-00CFFFFh
BA11
64 kwords
00B0000h-00BFFFFh
BA10
64 kwords
00A0000h-00AFFFFh
BA9
64 kwords
0090000h-009FFFFh
BA8
64 kwords
0080000h-008FFFFh
BA7
64 kwords
0070000h-007FFFFh
BA6
64 kwords
0060000h-006FFFFh
BA5
64 kwords
0050000h-005FFFFh
BA4
64 kwords
0040000h-004FFFFh
BA3
64 kwords
0030000h-003FFFFh
BA2
64 kwords
0020000h-002FFFFh
BA1
64 kwords
0010000h-001FFFFh
BA0
64 kwords
0000000h-000FFFFh
Block Address
A24 ~ A8
Block Size
(x16) Address Range*
1FFFFh
512 words
1FFFE00h-1FFFFFFh
[Table 21] Uniform OTP Block Addresses
OTP
After entering OTP Block, any issued addresses should be in the range of OTP block address.
- 85 -
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
128Mb (8M x16) Mux UtRAM2 C-die
- 86 -
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
1.0 POWER UP SEQUENCE
After VCC and VCCQ reach minimum operating voltage(1.7V), drive CS High. Then the device gets into the Power Up mode. Wait for minimum 150μs to
get into the normal operation mode. During the Power Up mode, the standby current can not be guaranteed. To get the appropriate device operation, be
sure to keep the following power up sequence. Asynch. mode is default mode and is set up after power up.
VCC(Min)
~
VCCQ(Min)
~
VCC
VCCQ
150us
CRE
Min. 0ns
≈
CS
FIX "LOW"
- 87 -
Rev. 1.0
datasheet
K5N1229ACD-BQ12
MCP Memory
2.0 ABSOLUTE MAXIMUM RATINGS
Item
Symbol
Ratings
Unit
Voltage on any pin relative to Vss
VIN, VOUT
-0.2 to VCCQ+0.3V
V
Power supply voltage relative to Vss
VCC, VCCQ
-0.2 to 2.5V
V
Power Dissipation
PD
1.0
W
Storage temperature
TSTG
-55 to 150
°C
Operating Temperature
TA
-25 to 85
°C
NOTE :
1) Stresses greater than "Absolute Maximum Ratings" may cause permanent damage to the device. Functional operation should be restricted to be used under recommended
operating condition. Exposure to absolute maximum rating conditions longer than 1 second may affect reliability.
3.0 RECOMMENDED DC OPERATING CONDITIONS
Item
Symbol
Min
Typ
Max
Unit
Power supply voltage(Core)
VCC
1.7
1.8
1.95
V
Power supply voltage(I/O)
VCCQ
1.7
1.8
1.95
V
Ground
VSS, VSSQ
0
0
0
V
Input high voltage
VIH
VCCQ-0.4
-
VCCQ+0.22)
V
Input low voltage
VIL
-0.23)
-
0.4
V
NOTE :
1) TA= -25 to 85°C, otherwise specified.
2) Overshoot: VCCQ +1.0V in case of pulse width ≤20ns. Overshoot is sampled, not 100% tested.
3) Undershoot: -1.0V in case of pulse width ≤20ns. Undershoot is sampled, not 100% tested.
4.0 CAPACITANCE
Item
Symbol
Test Condition
Min
Max
Unit
Input capacitance
CIN
VIN=0V
-
6
pF
Input/Output capacitance
CIO
VIO=0V
-
6
pF
NOTE :
1) Freq.=1MHz, TA=25°C
2) Capacitance is sampled, not 100% tested.
- 88 -
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
5.0 DC AND OPERATING CHARACTERISTICS
Item
Symbol
Test Conditions
Min
Typ
Max
Unit
Input Leakage Current
ILI
VIN=VSS to VCCQ
-2
-
2
μA
Output Leakage Current
ILO
CS=VIH, CRE=VIL, OE=VIH or WE=VIL, VIO=VSS to VCCQ
-5
-
5
μA
Cycle time=min tRC/min tWC, IIO=0mA4), 100% duty, CS=VIL,
CRE=VIL, VIN=VIL or VIH
-
-
30
mA
ICC3I
-
-
30
mA
ICC3R
-
-
40
mA
ICC3W
-
-
35
mA
-
-
30
mA
-
-
40
mA
-
-
35
mA
ICC3I
-
-
30
mA
ICC3R
-
-
40
mA
Average Operating Current (Async)
108Mhz
ICC2 6)
ICC3I
Average Operating
Current (Burst)
80Mhz
ICC3R
ICC3W
66Mhz
VIN = VCCQ or 0V
CS=VIL, IIO=0mA4)
ICC3W
-
-
35
mA
Output Low Voltage
VOL
IOL=0.2mA
-
-
0.2
V
Output High Voltage
VOH
IOH=-0.2mA
0.8xVCCQ
-
-
V
-
-
160
μA
ISB11)
CS and ADV=VCCQ, CRE=0V, Other
inputs=0V or VCCQ
< 40°C
Standby Current(CMOS)
< 85°C
-
-
200
μA
1/2 Block
-
-
150
1/4 Block
-
-
140
1/8 Block
-
-
130
1/2 Block
-
-
180
1/4 Block
-
-
175
1/8 Block
-
-
170
(Toggle is not allowed) 5)
< 40°C
Partial Refresh Current
ISBP 2)
CS and ADV=VCCQ, CRE=0V, Other
inputs=0V or VCCQ
(Toggle is not allowed) 5)
< 85°C
NOTE :
1) ISB1 is measured after 500ms after CS high. CLK should be fixed at high or at Low.
2) Full Array Partial Refresh Current(ISBP) is same as Standby Current(ISB1).
3) Internal TCSR (Temperature Compensated Self Refresh) is used to optimize refresh cycle below 40°C.
4) IIO=0mA; This parameter is specified with the outputs disabled to avoid external loading effects.
5) VIN=0V; all inputs should not be toggle.
6) This parameter is for page disable mode, Clock should not be inserted between ADV low and WE low during Write operation.
- 89 -
μA
μA
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
6.0 CRE (CONTROL REGISTER ENABLE)
The configuration register values are written via A/DQ pins. In an asynchronous WRITE, the values are latched into the configuration register on the rising
edge of ADV, CS, or WE, whichever occurs first; LB and UB are “Don’t Care.” For reads, address inputs other than A[19:18] are “Don’t Care,” and register
bits 15:0 are output as data (ADV HIGH) on A/DQ[15:0]. Immediately after performing a configuration register READ or WRITE operation, reading the
memory array is highly recommended.
6.1 Bus Configuration Register
The BCR defines how the device interacts with the system memory bus. The BCR is accessed with CRE HIGH and A[19:18] = 10b, or through the register
access software sequence with A/DQ = 0001h on the third cycle.
A19~A18
A/DQ15
A/DQ14
A/DQ13~A/DQ11
A/DQ10
A/DQ8
A/DQ5~A/DQ4
A/DQ3
A/DQ2~A/DQ0
RS
OM
IL
LC
WP
WC
DS
BW
BL
Register Select
Operating Mode
A19
A18
RS
A/DQ15
0
0
RCR
0
1
0
BCR
1
0
1
DIDR
Wait Polarity
A/
DQ10
Initial Latency
OM
Latency Count
A/DQ14
IL
Synch.
0
Variable (default)
0
0
0
Reserved
Asynch (default)
1
Fixed
0
0
1
Reserved
0
1
0
2
0
1
1
3 (default)
1
0
0
4
1
0
1
5
1
1
0
6
1
1
1
Reserved
Wait Config.
WP
A/
DQ8
WC
0
Active Low
0
1
Active High
(default)
1
Driver Strength
A/DQ13
A/DQ12
Burst Wrap
A/DQ5
A/
DQ4
DS
A/DQ3
at data
0
0
Full Drive
1 CLK prior
(default)
0
1
1/2 Drive
(default)
1
0
1
1
A/DQ11
LC
Burst Length
BW
A/
DQ2
A/
DQ1
A/
DQ0
BL
0
Wrap
0
0
1
4 word
1
No Wrap
(default)
0
1
0
8 word
1/4 Drive
0
1
1
16 word
1/8 Drive
1
0
0
32 word
1
1
1
Continuous
(default)
NOTE :
1) A/DQ6, A/DQ7, A/DQ9, A16, A17, A20~A22 are reserved and should be ’0’
2) The registers are set automatically to default value.
3) Refresh command will be denied during continuous operation. CS low should not be longer than tBC(tCSM max. 2.5us)
4) If the register code is invalid, register will be set to default value.
- 90 -
Rev. 1.0
datasheet
K5N1229ACD-BQ12
MCP Memory
6.2 Refresh Configuration Register
The refresh configuration register (RCR) defines how the device performs its self refresh. Altering the refresh parameters can reduce current consumption
during standby mode. The RCR is accessed with CRE HIGH and A[19:18] = 00b; or through the register access software sequence with A/DQ = 0000h on
the third cycle.
A19~A18
A/DQ2~A/DQ0
RS
PAR
Register Select
Partial Refresh
A19
A18
RS
A/DQ2
0
0
RCR
0
1
0
BCR
0
0
1
DIDR
A/DQ1
A/DQ0
PAR
0
0
Full Array (default)
0
1
Bottom 1/2 Array
0
1
0
Bottom 1/4 Array
0
1
1
Bottom 1/8 Array
1
0
0
None of Array
1
0
1
Top 1/2 Array
1
1
0
Top 1/4 Array
1
1
1
Top 1/8 Array
NOTE :
1) A/DQ3, A/DQ5~A/DQ15, A16, A17, A20~A22 are reserved and should be ’0’
2) The registers are set automatically to default value.
6.3 Burst Length (BCR[2:0]) Default = Continuous Burst
Burst lengths define the number of words the device outputs during burst READ and WRITE operations. The device supports a burst length of 4, 8, 16, or
32 words or Continuous.
6.4 Burst Wrap (BCR[3]) Default = No Wrap
The burst-wrap option determines if a 4-, 8-, 16-, or 32-word READ or WRITE burst wraps within the burst length, or steps through sequential addresses.
[Table 1] Sequence and Burst Length
Burst Wrap
BCR[3]
WRAP
No
WRAP
Wrap
Yes
No
Starting
Address
4 word
Burst
Length
8 word
Burst Length
16 word
Burst Length
32 word
Burst Length
Continuous
Burst
Decimal
Linear
Linear
Linear
Linear
Linear
0
0-1-2-3
0-1-2-3-4-5-6-7
0-1-2-3-4-5-6-7-8-9-10-11-12-13-14-15
0 - 1 - 2 ~ 29-30-31
0-1-2-3-4-5 ~
1
1-2-3-0
1-2-3-4-5-6-7-0
1-2-3-4-5-6-7-8-9-10-11-12-13-14-15-0
1 - 2 - 3 ~ 30-31 - 0
1-2-3-4-5-6 ~
2
2-3-0-1
2-3-4-5-6-7-0-1
2-3-4-5-6-7-8-9-10-11-12-13-14-15-0-1
2 - 3 - 4 ~ 31 - 0 - 1
2-3-4-5-6-7 ~
3
3-0-1-2
3-4-5-6-7-0-1-2
3-4-5-6-7-8-9-10-11-12-13-14-15-0-1-2
3-4-5~0-1-2
3-4-5-6-7-8 ~
~
~
~
~
~
7
7-0-1-2-3-4-5-6
7-8-9-10-11-12-13-14-15-0-1-2-3-4-5-6
7-8-9 ~4-5-6
7 - 8 - 9 - 10-11-12 ~
~
~
~
~
15
15-0-1-2-3-4-5-6-7-8-9-10-11-12-13-14
15-16-17 ~ 12- 13- 14 15-16-17-18-19-20 ~
~
~
~
31
31- 0 - 1 ~ 28-29-30
31-32-33-34-35-36 ~
0
0-1-2-3
0- 1- 2- 3- 4- 5- 6 -7
0- 1- 2- 3- 4- 5- 6- 7- 8- 9- 10- 11- 12-13-14-15
0 - 1 - 2 ~ 29-30-31
0-1-2-3-4-5 ~
1
1-2-3-4
1- 2- 3- 4- 5- 6- 7- 8
1- 2- 3- 4- 5- 6- 7- 8- 9- 10- 11- 12-13-14-15-16
1 - 2 - 3 ~ 30-31-32
1-2-3-4-5-6 ~
2
2-3-4-5
2- 3- 4- 5- 6- 7- 8- 9
2- 3- 4- 5- 6- 7- 8- 9- 10- 11- 12-13-14-15-16-17
2 - 3 - 4 ~ 31-32-33
2-3-4-5-6-7 ~
3
3-4-5-6
3- 4- 5- 6- 7- 8- 9-10
3- 4- 5- 6- 7- 8- 9- 10- 11- 12-13-14-15-16-17-18
3 - 4 - 5 ~ 32-33-34
3-4-5-6-7-8 ~
~
~
~
~
~
7
7-8-9-10-11-12-13-14
7-8-9-10-11-12-13-14-15-16-17-18-19-20-21-22
7 - 8 - 9 ~ 36-37-38
7 - 8 - 9 - 10-11-12 ~
~
~
~
~
15
15-16-17-18-19-20-21-22-23-24-25-26-27-28-29-30
15-16-17 ~ 44-45-46
15-16-17-18-19-20 ~
~
~
~
31-32-33 ~ 60-61-62
31
- 91 -
31-32-33-34-35-36 ~
Rev. 1.0
datasheet
K5N1229ACD-BQ12
MCP Memory
6.5 Drive Strength (BCR[5:4]) Default = 1/2 Drive Strength
The optimization of output driver strength is possible to adjust for the different data loadings. The device can minimize the noise generated on the data
bus during read operation. The device supports full, 1/2 and 1/4 driver strength. The device’s default mode is 1/2 driver strength. Outputs are configured
at 1/2 drive strength during testing.
[Table 2] Drive Strength
Driver Strength
Full
Impedance(typ.)
Recommendation
1/2
1/4
1/8
25~30Ω
50Ω
100Ω
TBD
CL = 30pF to 50pF
CL = 15pF to 30pF
108 MHz at light load
CL = 15pF or lower
CL = 15pF or lower
NOTE :
1) Impedance values are typical values, not 100% tested.
6.6 WAIT Configuration (BCR[8]) Default = 1 CLK Prior.
The WAIT signal is output signal indicating the status of the data on the bus whether or not it is valid. WAIT configuration is to decide the timing when
WAIT asserts or desserts. WAIT asserts (or desserts) one clock prior to the data when A/DQ8 is set to 1. (WAIT asserts (or desserts) at data clock when
A/DQ8 is set to 0). WAIT polarity is to decide the WAIT signal level at which data is valid or invalid. Data is valid if WAIT signal is high when A/DQ10 is set
to 0. (Data is valid if WAIT signal is low when A/DQ10 is set to 1). All the timing diagrams in this SPEC are illustrated based on following setup; A/DQ[10]:0
and A/DQ[8]:1.
Below timing shows WAIT signal’s movement when word boundary crossing happens in No-wrap mode
6.7 WAIT Polarity (BCR[10]) Default = Active HIGH
The WAIT polarity bit indicates whether an asserted WAIT output should be HIGH or LOW. This bit will determine whether the WAIT signal requires a pullup or pull-down resistor to maintain the de-asserted state.
No-Wrap. Word-line Crossing. LATENCY : 2. WP : Low Enable
0
1
2
3
4
5
6
7
8
9
10
11
12
13
CLOCK
ADV
Word-line Crossing period
(Only exists in No-wrap mode or Continuous mode)
A/DQ
Valid
Address
D509
1CLK
WAIT
A/DQ[8]:1
D511
D512
1CLK
de-assertion
WAIT
A/DQ[8]:0
D510
assertion
de-assertion
D513
D514
D515
D516
D517
D518
1CLK
de-assertion
assertion
de-assertion
Figure 1. WAIT Configuration During Burst Operation
NOTE :
1)Non-default BCR setting: WAIT active LOW.
6.8 Operating Mode (BCR[15]) Default = Asynchronous Operation
The operating mode bit selects either synchronous burst operation or the default asynchronous mode of operation.
6.9 Latency Counter (BCR[13:11]) Default = 3 Clock Latency
The latency counter bits determine how many clocks occur between the beginning of a READ or WRITE operation and the first data value transferred. For
allowable latency codes.
- 92 -
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
6.10 Initial Access Latency (BCR[14]) Default = Variable
Variable initial access latency outputs data after the number of clocks set by the latency counter. However, WAIT must be monitored to detect delays
caused by collisions with refresh operations. Fixed initial access latency outputs the first data at a consistent time that allows for worst-case refresh collisions. The latency counter must be configured to match the initial latency and the clock frequency. It is not necessary to monitor WAIT with fixed initial
latency. The burst begins after the number of clock cycles configured by the latency counter.
[Table 3] Variable Latency Configuration Codes
Latency
Max Input CLK Frequency (MHz)
BCR[13:11]
Latency Configuration
Normal
Refresh Collision
108
80
66
010
2(3 clocks)
2
4
66(15ns)
19,2ns
40(25ns)
011
3(4 clocks)-default
3
6
108(9.26ns)
80(12.5ns)
66(15ns)
Others
Reserved
-
-
-
-
-
[Table 4] Fixed Latency Configuration Codes
BCR[13:11]
Latency Configuration
Latency Count (N)
010
2 (3 clocks)
011
3 (4 clocks)
100
4 (5 clocks)
101
5 (6 clocks)
110
Others
Max Input CLK Frequency (MHz)
108
80
66
2
33 (30ns)
20 (50ns)
20 (50ns)
3
52 (19.2ns)
40 (25ns)
33 (30ns)
4
66 (15ns)
52 (19.2ns)
40 (25ns)
5
80 (12.5ns)
66 (15ns)
52 (19.2ns)
6 (7 clocks)
6
108 (9.26ns)
80 (12.5ns)
66 (15ns)
Reserved
-
-
-
-
NOTE :
1) Latency is the number of clock cycles from the initiation of a burst operation until data appears. Data is transferred on the next clock cycle.
CLK
ADV
A[22:16]
A/DQ[15:0]
VIH
VIL
VIH
VIL
VIH
VIL
VIH
VIL
VALID
ADDRESS
Code 2
VOH
VALID
ADDRESS
VOL
Valid
Output
Valid
Output
VOH
Valid
Output
Valid
Output
Valid
Output
Valid
Output
Valid
Output
Valid
Output
Valid
Output
Valid
Output
Valid
Output
Valid
Output
Code 3 (Default)
A/DQ[15:0]
A/DQ[15:0]
VIH
VIL
VIH
VIL
VALID
ADDRESS
Code 4
VOL
VOH
VALID
ADDRESS
VOL
Don’t Care
Figure 2. Latency Counter (Variable Initial Latency, No Refresh Collision)
- 93 -
Undefined
Rev. 1.0
datasheet
K5N1229ACD-BQ12
N-1 Cycles
CLK
ADV
A[22:16]
CS
MCP Memory
N Cycle
VIH
VIL
tAADV
VIH
VIL
VIH
VALID
ADDRESS
VIL
tCO
VIH
VIL
tACLK
tAA
A/DQ[15:0]
(READ)
VIH
A/DQ[15:0]
(WRITE)
VIH
VALID
ADDRESS
VIL
VOH
Valid
Output
VOL
Valid
Output
Valid
Output
Valid
Output
tSP tHD
VALID
ADDRESS
VIL
Valid
Output
Valid
Input
Valid
Input
Valid
Input
Burst Identified
(ADV = LOW)
Don’t Care
Valid
Input
Valid
Input
Undefined
Figure 3. Latency Counter (Fixed Latency)
6.11 Partial Array Refresh (RCR[2:0] Default = Full Array Refresh
The PAR bits restrict refresh operation to a portion of the total memory array. This feature allows the device to reduce standby current by refreshing only
that part of the memory array required by the host system. The refresh options are full array, one-half array, one-quarter array, one-eighth array, or none
of the array. The mapping of these partitions can start at either the beginning or the end of the address map.
[Table 5] Address Patterns for PAR (RCR[4] = 1)
RCR[2]
RCR[1]
RCR[0]
Active Section
Address Space
Size
Density
0
0
0
Full Die
000000h-7FFFFFh
8 Meg x 16
128Mb
0
0
1
One-half die
000000h-3FFFFFh
4 Meg x 16
64Mb
0
1
0
One-quarter of die
000000h-1FFFFFh
2 Meg x 16
32Mb
0
1
1
One-eighth of die
000000h-0FFFFFh
1 Meg x 16
16Mb
1
0
0
None of die
0
0 Meg x 16
0Mb
1
0
1
One-half of die
400000h-7FFFFFh
4 Meg x 16
64Mb
1
1
0
One-quarter of die
600000h-7FFFFFh
2 Meg x 16
32Mb
1
1
1
One-eighth of die
700000h-7FFFFFh
1 Meg x 16
16Mb
- 94 -
Rev. 1.0
datasheet
K5N1229ACD-BQ12
MCP Memory
6.12 Device Identification Register
The DIDR provides information on the device manufacturer, generation and the specific device configuration. This register is read-only. The DIDR is
accessed with CRE HIGH and A[19:18] = 01b, or through the register access software sequence with A/DQ = 0002h on the third cycle.
[Table 6] Device Identification Register Mapping
Bit Field
DIDR[15]
DIDR[14:11]
DIDR[10:8])
DIDR[7:5]
DIDR[4:0]
Field name
Row Length
Device version
Device density
UtRAM generation
Vendor ID
Options
Length
Bit
Setting
512 words
1b
CRE
Version
Bit
Setting
4th
0110
tAVS
Density
Bit
Setting
128Mb
011b
Generation
Bit
Setting
Bit
Setting
UtRAM2
010b
01100
tAVH
tVP
ADV
A[22:16]
(Except A[19:18])
A[19:18]
OPCODE
ADDRESS
Select Control Register
ADDRESS
Initiate control register access
tCPH
CS
tCW
OE
tWP
WE
Write address bus value to control register
LB/UB
tAVS
A/DQ[15:0]
tAVH
ADDRESS
OPCODE
Data
Valid
Don’t Care
Figure 4. Configuration Register WRITE, Asynchronous Mode, Followed by READ ARRAY Operation
NOTE :
1) A[19:18] = 00b to load RCR, and 10b to load BCR.
- 95 -
Rev. 1.0
datasheet
K5N1229ACD-BQ12
0
CLK
1
tSP
tHD
tSP
tHD
MCP Memory
2
7
8
9
10
CRE
ADV
A[22:16]
(Except A[19:18])
ADDRESS
tAS
A[19:18]
ADDRESS
OPCODE
tAS
tHD
tCSP
tCPH
CS
OE
tSP
tHD
WE
LB/UB
tSP
A/DQ[15:0]
tHD
Latch Control Register Address
OPCODE
DataValid
ADDRESS
Don’t Care
Figure 5. Configuration Register WRITE, Synchronous Mode Followed by READ ARRAY Operation
NOTE :
1) Non-default BCR settings for synchronous mode configuration register WRITE followed by READ ARRAY operation:
WAIT active LOW; WAIT asserted during delay.
2) A[19:18] = 00b to load RCR, and 10b to load BCR.
3) CS must remain LOW to complete a burst-of-one WRITE. WAIT must be monitored—additional WAIT cycles caused by refresh collisions
require a corresponding number of additional CS LOW cycles.
CRE
tAVS
tAVH
tAA
ADV
tVP
tAVS
tAAVD
tAVH
tLZ
A[22:16]
(Except A[19:18])
Address
tAA
A[19:18]
Select Control
Register
Address
tCPH
tCO
CS
Initiate Register Access
tHZ
OE
tOE
WE
tOHZ
tOLZ
LB/UB
A/DQ[15:0]
CR Valid
Address
DATA
VALID
Don’t Care
Figure 6. Register READ, Asynchronous Mode Followed by READ ARRAY Operation
NOTE :
1) A[19:18] = 00b to read RCR, 10b to read BCR, and 01b to read DIDR.
- 96 -
Undefined
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
CLK
tSP
tHD
tSP
tHD
CRE
ADV
tSP
tHD
A[22:16]
(Except A[19:18])
ADDRESS
A[19:18]
ADDRESS
tCSP
ADDRESS
ADDRESS
tCBPH3
tABA
CS
tHZ
OE
tOHZ
tBOE
LB/UB
tOLZ
tKW
WAIT
High-Z
High-Z
tSP
A/DQ[15:0]
tACLK
tHD
ADDRESS
Latch Control Register Address
CR
Valid
tKOH
DATA
VALID
ADDRESS
Don’t Care
Undefined
Figure 7. Register READ, Synchronous Mode Followed by READ ARRAY Operation
NOTE :
1) Non-default BCR settings for synchronous mode register READ followed by READ ARRAY operation: Latency code two (three clocks);
WAIT active LOW; WAIT asserted during delay.
2) A[19:18] = 00b to read RCR, 10b to read BCR, and 01b to read DIDR.
3) CS must remain LOW to complete a burst-of-one WRITE. WAIT must be monitored—additional WAIT cycles caused by refresh collisions
require a corresponding number of additional CS LOW cycles.
- 97 -
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
6.13 Software Access
Software access of the registers uses a sequence of asynchronous READ and asynchronous WRITE operations. The contents of the configuration registers can be modified and all registers can be read using the software sequence. The configuration registers are loaded using a four-step sequence consisting of two asynchronous READ operations followed by two asynchronous WRITE operations. The read sequence is virtually identical except that an
asynchronous READ is performed during the fourth operation. The address used during all READ and WRITE operations is the highest address of the
device being accessed (3FFFFF); the contents of this address are not changed by using this sequence. The data value presented during the third operation (WRITE) in the sequence defines whether the BCR, RCR, or the DIDR is to be accessed. If the data is 0000h, the sequence will access the RCR; if
the data is 0001h, the sequence will access the BCR; if the data is 0002h, the sequence will access the DIDR. During the fourth operation, A/DQ[15:0]
transfer data in to or out of bits 15–0 of the registers. The use of the software sequence does not affect the ability to perform the standard (CRE-controlled) method of loading the configuration registers. However, the software nature of this access mechanism eliminates the need for CRE. If the software
mechanism is used, CRE can simply be tied to VSS. The port line often used for CRE control purposes is no longer required.
READ
READ
WRITE
WRITE
CS
OE
tBSA
tBHA
WE
LB/UB
ADV
A/DQ[15:0]
ADDRESS XXXX
(max)
ADDRESS XXXX
(max)
ADDRESS
(max)
ADDRESS
(max)
RCR: 0000h
BCR: 0001h
CR VALID
IN
Don’t Care
Figure 8. Load Configuration Register
NOTE :
1) /WE should be deasserted before /CS deasserting.
READ
READ
WRITE
READ
CS
OE
WE
LB/UB
ADV
A/DQ[15:0]
ADDRESS XXXX
(max)
ADDRESS XXXX
(max)
ADDRESS
(max)
RCR: 0000h
BCR: 0001h
DIDR: 0002h
Figure 9. Read Configuration Register
NOTE :
1) /WE should be deasserted before /CS deasserting.
2) ALL Write Operation have tBSA, tBHA.
- 98 -
ADDRESS CR VALID
(max)
OUT
Don’t Care
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
7.0 BUS OPERATING MODES
The bus interface supports asynchronous and burst mode read and write transfers. The specific interface supported is defined by the value loaded into
the BCR.
7.1 Asynchronous Mode (default mode)
7.1.1 Asynchronous read operation
Asynchronous read operation starts when CS, OE and UB or LB are asserted. ADV can be taken HIGH to capture the address. First data will be driven
out of the A/DQ bus after random access time(tAA). WE should be de-asserted during read operation. The CLK input must be held static LOW during
read operation. WAIT will be driven while the device is enabled and its state should be ignored.
7.1.2 Asynchronous write operation
Asynchronous write operation starts when CS, WE and UB or LB are asserted. The data to be written is latched on the rising edge of CS, WE, or LB/UB
(whichever occurs first). OE is High during write operation. WE LOW time must be limited to tCSM. The CLK input must be held static LOW during write
operation. WAIT signal is Hi-Z.
CS
A[22:16]
CS
Address
A[22:16]
ADV
Address
ADV
< tCSM
OE
WE
LB/UB
A/DQ[15:0]
LB/UB
Address
High-Z
A/DQ[15:0]
DATA
DATA
Address
Undefined
Don’t Care
Figure 10. READ Operation WE = HIGH).
Figure 11. WRITE Operation OE = HIGH)
7.2 Functional Description (Asynch. mode)
Asynchfonous Mode
BCR[15] = 1
CS
OE
WE
CRE
UB /
LB
WAIT
A/DQ[15:0]
Notes
L
L
L
H
L
L
Low-Z
Data out
1
Active
L
L
H
L
L
L
Low-Z
Data in
1
Standby
L
H
H
X
X
L
X
High-Z
High-Z
2
Idle
L
X
L
X
X
L
X
Low-Z
X
1
Configuration register
write
Active
L
L
L
H
H
X
Low-Z
High-Z
Configuration register
read
Active
L
L
L
H
L
Low-Z
Config.
Reg.out
Power
CLK
Read
Active
Write
Standby
No operation
ADV
L
H
NOTE :
1) The device will consume active power in this mode whenever addresses are changed.
2) When the device is in standby mode, address inputs and data inputs/outputs are internally isolated from any external influence.
- 99 -
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
8.0 Burst Mode Operation
8.1 synchronous Mode
8.1.1 Synchronous Burst Read Operation
Burst Read command is implemented when ADV is detected low at clock rising edge. WE should be de-asserted. Burst operation re-starts whenever ADV
is detected low at clock rising edge even in the middle of operation.
8.1.2 Synchronous Burst Write Operation
Burst Write command is implemented when ADV & WE are detected low at clock rising edge. Burst Write operation re-starts whenever ADV is detected
low at clock rising edge even in the middle of Burst Write operation.
CLK
CS
ADV
Latency Code 3 (4 clocks)
A[22:16]
ADD.
VALID
ADD.
VALID
OE
WE
WAIT
LB/UB
A/DQ[15:0]
ADD.
VALID
D[0]
D[1]
D[2]
ADD.
VALID
D[3]
READ Burst Identified
(WE = HIGH)
Don’t Care
Undefined
Figure 12. Burst Mode READ (4-word burst)
NOTE :
1) Non-default BCR settings for burst mode READ (4-word burst): Fixed or variable latency;
2) Latency code 3 (4 clocks); WAIT active LOW; WAIT asserted during delay.
3) Diagram in the figure above is representative of variable latency with no refresh collision or fixed-latency access.
CLK
CS
ADV
Latency Code 3 (4 clocks)
A[22:16]
ADD.
VALID
ADD.
VALID
WE
WAIT
LB/UB
A/DQ[15:0]
ADD.
VALID
D[0]
D[1]
D[2]
D[3]
ADD.
VALID
Don’t Care
WRITE Burst Identified
(WE = LOW)
Figure 13. Burst Mode WRITE (4-word burst)
NOTE :
1) Non-default BCR settings for burst mode WRITE (4-word burst): Fixed or variable latency;
2) Latency code 3 (4 clocks); WAIT active LOW; WAIT asserted during delay.
3) tAS is need to Burst Write Operation.
- 100
Rev. 1.0
datasheet
K5N1229ACD-BQ12
MCP Memory
The size of a burst can be specified in the BCR either as a fixed length or continuous. Fixed-length bursts consist of four, eight, sixteen, or thirty-two
words. The initial latency for READ operations can be configured as fixed or variable (WRITE operations always use fixed latency). Variable latency
allows minimum latency at high clock frequencies, but the controller must monitor WAIT to detect any conflict with refresh cycles. Fixed latency outputs
the first data word after the worst-case access delay, including allowance for refresh collisions. The initial latency time and clock speed determine the
latency count setting. Fixed latency is used when the controller cannot monitor WAIT. Fixed latency also provides improved performance at lower clock
frequencies.
VIH
CLK
VIL
VIH
A[22:16]
ADV
CS
Valid
VIL
VIH
VIL
VIH
OE
VIL
VIH
WE
VIL
VIH
LB/UB
VIL
WAIT
A/DQ[15:0]
Address
VIL
VIH
VOH
High-Z
VOL
VIH
VOH
Address
Valid
VIL
D[0]
VOL
D[1]
D[2]
D[3]
Don’t Care
Additional WAIT states inserted to allow refresh completion.
Undefined
Figure 14. Refresh Collision During Variable-Latency READ Operation
NOTE :
1) Non-default BCR settings for refresh collision during variable-latency READ operation:
2) Latency code two (three clocks); WAIT active LOW; WAIT asserted during delay.
8.2 Functional Description (Synch. mode)
Burst Mode
BCR[15] = 0
Standby
No operation
Power
CLK
ADV
CS
OE
WE
CRE
UB /
LB
WAIT
A/DQ[15:0]
Notes
Standby
L
H
H
X
X
L
X
High-Z
High-Z
4
Idle
L
X
L
X
X
L
X
Low-Z
X
4
Initial burst read
Active
L
L
X
H
L
L
Low-Z
Address
Initial burst write
Active
L
L
H
L
L
X
Low-Z
Address
Burst continue
Active
H
L
X
X
X
L
Low-Z
Data in or
Data out
3
Burst suspend
Active
X
L
H
X
X
X
Low-Z
High-Z
3
Configuration register
write
Active
L
L
H
L
H
X
Low-Z
High-Z
Configuration register
read
Active
L
L
L
H
H
L
Low-Z
Config.
reg.out
X
NOTE :
1) CLK must be LOW during async read and async write modes.
2) When LB and UB are in select mode (LOW), A/DQ[15:0] are affected. When only LB is in select mode, A/DQ[7:0] are affected. When only UB is in the select mode, A/
DQ[15:8] are affected.
3) The device will consume active power in this mode whenever addresses are changed.
4) When the device is in standby mode, address inputs and data inputs/outputs are internally isolated from any external influence.
- 101
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
8.3 Burst Suspend
To access other devices on the same bus without the timing penalty of the initial latency for a new burst, burst mode can be suspended. Bursts are suspended by stopping CLK. CLK can be stopped HIGH or LOW. If another device will use the data bus while the burst is suspended, OE should be taken
HIGH to disable the outputs. otherwise, OE can remain LOW. Note that the WAIT output will continue to be active, and as a result no other devices should
directly share the WAIT connection to the controller. To continue the burst sequence, OE is taken LOW, then CLK is restarted after valid data is available
on the bus. The CS LOW time is limited by refresh considerations. CS must not stay LOW longer than tCSM. If a burst suspension will cause CS to
remain LOW for longer than tCSM, CS should be taken HIGH and the burst restarted with a new CS LOW/ADV LOW cycle.
8.4 Boundary Crossing
Continuous bursts or No wrap burst have the ability to start at a specified address and burst to the end of the address. It goes back to the first address and
continues the burst operation. WAIT will be asserted at the boundary of the row and be desserted after crossing boundary of the row. There is no limitation
for CS high time during Row Boundary Crossing.
8.5 WAIT Operation
The WAIT output is typically connected to a shared systemlevel WAIT signal. The shared WAIT signal is used by the processor to coordinate transactions
with multiple memories on the synchronous bus. Once a READ or WRITE operation has been initiated, WAIT goes active to indicate that additional time
is required before data can be transferred. For READ operations, WAIT will remain active until valid data is output from the device. For WRITE operations,
WAIT will indicate to the memory controller when data will be accepted into this device. When WAIT transitions to an inactive state, the data burst will
progress on successive clock edges. CS must remain asserted during WAIT cycles (WAIT asserted and WAIT configuration BCR[8] = 1). Bringing CS
HIGH during WAIT cycles may cause data corruption. (Note that for BCR[8] = 0, the actual WAIT cycles end one cycle after WAIT de-asserts. When using
variable initial access latency (BCR[14] = 0), the WAIT output performs an arbitration role for READ operations launched while an on-chip refresh is in
progress. If a collision occurs, WAIT is asserted for additional clock cycles until the refresh has completed. When the refresh operation has completed, the
READ operation will continue normally. WAIT will be asserted but should be ignored during asynchronous READ and WRITE operations. By using fixed
initial latency (BCR[14] = 1), this device can be used in burst mode without monitoring the WAIT signal. However, WAIT can still be used to determine
when valid data is available at the start of the burst.
UtRAM2
External
Pull-Up
Pull-Down
Resistor
WAIT
READY
WAIT
Processor
Other
Device
RDY
Other
Device
Figure 15. Wired or WAIT Configuration
8.6 LB / UB Operation
The LB enable and UB enable signals support byte-wide data WRITEs. During WRITE operations, any disabled bytes will not be transferred to the RAM
array and the internal value will remain unchanged. During an asynchronous WRITE cycle. The data to be written is latched on the rising edge of CS, WE
whichever occurs first and LB, UB must have rising edge after CS or WE go high. LB and UB must be LOW during READ cycles. When both the LB and
UB are disabled (HIGH) during an operation, the device will disable the data bus from receiving or transmitting data. Although the device will seem to be
deselected, it remains in an active mode as long as CS remains LOW.
- 102
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
9.0 LOW-POWER OPERATION
9.1 Temperature Compensated Self Refresh
Temperature compensated self refresh (TCSR) allows for adequate refresh at different temperatures. This UtRAM2 device includes an on-chip temperature sensor that automatically adjusts the refresh rate according to the operating temperature. The device continually adjusts the refresh rate to match
that temperature.
9.2 Partial Array Refresh
Partial array refresh (PAR) restricts refresh operation to a portion of the total memory array. This feature enables the device to reduce standby current by
refreshing only that part of the memory array required by the host system. The refresh options are full array, one-half array, one-quarter array, one-eighth
array, or none of the array. The mapping of these partitions can start at either the beginning or the end of the address map. READ and WRITE operations
to address ranges receiving refresh will not be affected. Data stored in addresses not receiving refresh will become corrupted. When re-enabling additional portions of the array, the new portions are available immediately upon writing to the RCR.
9.3 AC Input/Output Reference Waveform & AC Output Load Circuit
Test Points
VCCQ
Input1
VccQ/22
Test Points
VccQ/22 Output
50Ω
DUT
VccQ/2
30pF
VSSQ
NOTE :
1) AC test inputs are driven at VCCQ for a logic 1 and VSSQ for a logic 0. Input rise and fall times (10% to 90%) <1.6ns.
2) Input timing begins at VCCQ/2 and Output timing ends at VCCQ/2.
3) All tests are performed with the outputs configured for default setting of half drive strength (BCR[5:4] = 01b)
- 103
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
10.0 TIMING REQUIREMENTS
10.1 Asynchronous READ Cycle Timing Requirements
Parameter
Symbol
Min
tAA
Address access time
tAADV
ADV access time
Max
Unit
70
ns
70
Notes
ns
Address setup to ADV HIGH
tAVS
5
Address hold from ADV HIGH
tAVH
2
LB/UB access time
tBA
70
ns
LB/UB disable to DQ High-Z output
tBHZ
8
ns
1
2.5
us
4
7.5
ns
Maximum CS Pulse Width
tCSM
CS or ADV LOW to WAIT valid
tCSW
1
CS HIGH between subsequent Async Operations
tCPH
15
Chip select access time
tCO
CS LOW to ADV HIGH
tCVS
ns
ns
ns
70
7
4
ns
ns
Chip disable to DQ and WAIT High-Z output
tHZ
8
ns
Output enable to valid output
tOE
20
ns
Output disable to DQ High-Z output
tOHZ
8
ns
1
Output ebable to Low-Z output
tOLZ
5
ns
2
READ cycle time
tRC
80
ns
ADV pulse width LOW
tVP
5
ns
1
10.2 Asynchronous WRITE Cycle Timing Requirements
Parameter
Symbol
Min
Max
Unit
Address setup to ADV going HIGH
tAVS
5
ns
Address hold from ADV HIGH
tAVH
2
ns
Address valid to end of WRITE
tAW
70
ns
LB/UB select to end of WRITE
tBW
70
ns
CS HIGH between subsequent async operations
tCPH
15
ns
CS LOW to ADV HIGH
tCVS
7
ns
2
Chip enable to end of WRITE
tCW
70
ns
3
Data HOLD from WRITE time
tDH
0
ns
20
Data WRITE setup time
tDW
Chip disable to WAIT High-Z output
tHZ
End WRITE to Low-Z output
tOW
ADV pulse width
tVP
5
ns
ADV setup to end of WRITE
tVS
70
ns
5
ns
ns
tWHZ
CS or ADV LOW to WAIT valid
tCSW
1
WRITE pulse width
tWP
55
WRITE recovery time
tWR
0
/UB, /LB valid or mask setup time to beginning of write
tBSA
0
-
ns
tBHA
0
-
ns
tSKEW
-
10
ns
Address Skew
NOTE :
1) The High-Z timings measure a 100mV transition from either VOH or VOL toward VCCQ/2.
2) The Low-Z timings measure a 100mV transition away from the High-Z (VCCQ/2) level toward either VOH or VOL.
3) WE LOW time must be limited to tCSM (2.5µs).
4) A refresh opportunity must be provided every tCSM. CS must not remain LOW longer than tCSM.
- 104
1
ns
8
WRITE to DQ High-Z output
/UB, /LB valid or mask hold time to end of write
Notes
8
ns
7.5
ns
ns
ns
2
2
3
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
10.3 Burst READ Cycle Timing Requirements
Parameter
Symbol
108MHz
Min
80MHz
Max
Min
66MHz
Max
Min
Max
Unit
Notes
tAA
70
70
70
ns
4
ADV access time (fixed latency)
tAADV
70
70
70
ns
4
CLK to output delay
tACLK
7
9
11
ns
Burst OE LOW to output delay
tBOE
20
20
20
ns
CS HIGH between subsequent burst or operations
tCBPH
ns
3
Maximum CS pulse width LOW
tCSM
2.5
us
3
CS or ADV LOW to WAIT valid
tCSW
1
7.5
ns
CLK period
tCLK
9.26
Chip select access time (fixed latency)
tCO
70
ns
CS setup time to active CLK edge
tCSP
3
4
5
ns
Hold time from active CLK edge
tHD
2
2
2
ns
Address access time (fixed latency)
Chip desable to DQ and WAIT High-Z output
15
15
15
2.5
2.5
7.5
1
7.5
12.5
15
70
tHZ
1
ns
70
8
8
8
ns
CLK rise or fall time
tKHKL
CLK to WAIT valid
tKHTL
2
Output HOLD from CLK
tKOH
2
2
2
ns
CLK HIGH or LOW time
tKP
3
4
5
ns
1.6
1.8
7
2
Output disable to DQ High-Z output
tOHZ
Output enable to Low-Z output
tOLZ
5
5
Setup time to active CLK edge
tSP
3
3
tADVO
3
tAVH
tAHCR
ADV HIGH to OE LOW
Address setup to ADV HIGH
ADV HIGH to CLK Rising
9
8
2.0
ns
11
ns
2
8
8
4
1
ns
1
5
ns
2
3
ns
4
5
ns
2
2
2
ns
2
2
2
ns
10.4 Burst WRITE Cycle Timing Requirements
Parameter
CS HIGH between subseuent burst or mixed mode
operations
Symbol
tCBPH
108MHz
Min
80MHz
Max
15
Min
66MHz
Max
15
Min
Unit
Notes
ns
3
2.5
us
3
7.5
ns
Max
15
Maximum CS pulse width LOW
tCSM
CS LOW to WAIT valid
tCSW
1
Clock period
tCLK
9.26
12.5
15
ns
CS setup to CLK active edge
tCSP
3
4
5
ns
Hold time from active CLK edge
tHD
2
2
2
ns
Chip disable to WAIT High-Z output
2.5
7.5
tHZ
2.5
1
8
7.5
1
8
8
ns
2.0
ns
11
ns
Last clock to ADV LOW (fixed latency)
tKADV
CLK rise or fall time
tKHKL
Clock to WAIT valid
tKHTL
2
tKP
3
4
5
ns
Setup time to activate CLK edge
tSP
3
3
3
ns
Address Hold from ADV HIGH
tAVH
2
2
2
ns
tAHCR
2
2
2
ns
CLK HIGH or LOW time
ADV HIGH to CLK Rising
15
15
1.6
7
2
NOTE :
1) The High-Z timings measure a 100mV transition from either VOH or VOL toward VCCQ/2.
2) The Low-Z timings measure a 100mV transition away from the High-Z (VCCQ/2) level toward either VOH or VOL.
3) A refresh opportunity must be provided every tCSM. CS must not remain LOW longer than tCSM.
4) tAA, tAADV, tCO guarantee at min set-up time.
- 105
15
1.8
9
2
ns
1
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
11.0 TIMING DIAGRAMS
11.1 Asynchronous READ (CS controlled)
tRC
ADV VIH
VIL
tAADV
tVP
tVP
A[22:16]
VIH
VIL
Valid Address
tAVS
Valid Address
tAVS
tAVH
tCPH
tCVS
CS
VIH
VIL
tCO
tHZ
tBA
VIH
UB/ LB
tAVH
tCVS
VIL
tBHZ
tOE
VIH
OE VIL
tOLZ
WE
A/DQ[15:0]
tOHZ
tOLZ
VIH
VIL
VIH
VIL
tAA
Valid Address
tAVS
VOH
VOL
Valid output
Valid Address
tAVS
tAVH
VOH
VOL
tAVH
Don’t Care
Undefined
NOTE :
1) Don’t care must be in VIL or VIH.
2) tHZ and tOHZ are defined as the time at which the outputs achieve the open circuit conditions and are not referenced to output voltage levels.
3) At any given temperature and voltage condition, tHZ(Max.) is less than tLZ(Min.) both for a given device and from device to device interconnection.
4) tOE(max) is met only when OE becomes enabled after tAA(max).
5) If invalid address signals shorter than min. tRC are continuously repeated for over 2.5us, the device needs a normal read timing(tRC) or needs to sustain standby state for
min. tRC at least once in every 2.5us.
11.1.1 Address Skew for Asynchronous Operation
ADDRESS
ADDRESS
tSKEW
tSKEW
CS
- 106
tSKEW
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
11.2 Asynchronous READ (OE controlled)
tRC
ADV VIH
VIL
A[22:16]
VIH
VIL
tOEADV
tAADV
tVP
tAADV
tVP
Valid Address
tAVS
Valid Address
tAVS
tAVH
tAVH
tCVS
CS
VIH
VIL
tCO
tBA
VIH
UB/ LB
VIL
tBHZ
tOE
VIH
OE VIL
tOLZ
WE
A/DQ[15:0]
tOHZ
tOLZ
VIH
VIL
VIH
VIL
tAA
Valid Address
tAVS
VOH
VOL
Valid output
Valid Address
tAVS
tAVH
VOH
VOL
tAVH
Don’t Care
Undefined
NOTE :
1) Don’t care must be in VIL or VIH.
2) tHZ and tOHZ are defined as the time at which the outputs achieve the open circuit conditions and are not referenced to output voltage levels.
3) At any given temperature and voltage condition, tHZ(Max.) is less than tLZ(Min.) both for a given device and from device to device interconnection.
4) tOE(max) is met only when OE becomes enabled after tAA(max).
5) If invalid address signals shorter than min. tRC are continuously repeated for over 2.5us, the device needs a normal read timing(tRC) or needs to sustain standby state for
min. tRC at least once in every 2.5us.
- 107
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
11.3 Asynchronous READ Followed by Asynchronous WRITE (CS Controlled)
tVP
ADV VIH
VIL
tAADV
tAVS
tVP
A[22:16]
VIH
VIL
Valid Address
Valid Address
tAVS
tAVH
tCPH
tCVS
CS
tCW
VIH
VIL
tCO
tHZ
tBSA
tBA
VIH
UB/ LB
tAVH
tCVP
tBHA
VIL
tOE
tBHZ
VIH
OE VIL
tOLZ
WE
tOHZ
tWP
VIH
VIL
tAW
tAA
A/DQ[15:0]
VIH
VIL
Valid Address
tAVS
VOH
VOL
Valid output
Valid Address
tAVS
tAVH
tAVH
Don’t Care
- 108
Data Valid
tDW
tDH
Undefined
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
11.4 Asynchronous READ Followed by Asynchronous WRITE (OE, WE Controlled)
tVP
ADV VIH
VIL
tAADV
tOEADV
tVP
A[22:16]
VIH
VIL
tAVH
Valid Address
Valid Address
tAVS
tAVS
tAVH
tCVS
CS
VIH
VIL
tCO
VIH
UB/ LB
tBSA
tBHA
tBA
VIL
tOE
tBHZ
tOLZ
tOHZ
VIH
OE VIL
WE
tWP
VIH
VIL
tAW
tAA
A/DQ[15:0]
VIH
VIL
Valid Address
tAVS
VOH
VOL
Valid output
Valid Address
tAVS
tAVH
tAVH
Don’t Care
- 109
Data Valid
tDW
tDH
Undefined
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
11.5 Asynchronous READ Followed by Asynchrous WRITE (UB, LB Controlled)
tVP
ADV VIH
VIL
tAADV
tOEADV
tVP
A[22:16]
VIH
VIL
tAVS
tAVH
Valid Address
Valid Address
tAVS
tAVH
tCVS
CS
VIH
VIL
tCO
VIH
UB/ LB
tBSA
tBHA
tBA
VIL
tOE
tBHZ
tOLZ
tOHZ
VIH
OE VIL
WE
tWP
VIH
VIL
tAW
tAA
A/DQ[15:0]
VIH
VIL
Valid Address
tAVS
VOH
VOL
Valid output
Valid Address
tAVS
tAVH
tAVH
Don’t Care
- 110
Data Valid
tDW
tDH
Undefined
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
11.6 Asynchronous READ Followed by WRITE at the Same Address (UB/LB Controlled)
A[22:16]
VIH
VIL
Valid Address
tAVS
tAADV
ADV
tVP
VIH
VIL
LB/UB
OE
WE
tBHA
VIL
tCVS
CS
tBSA
tBA
VIH
tCO
VIH
tBHZ
VIL
tOE
tOHZ
VIH
VIL
tOLZ
VIH
tWP
VIL
tAA
tAVS
A/DQ[15:0] VIH
IN/OUT
VIL
tAVH
Valid Address
tDW
VOH
VOL
Valid Output
VIH
VIL
Valid Input
Don’t Care
NOTE :
1) Don’t care must be in VIL or VIH.
- 111
tDH
Undefined
Rev. 1.0
datasheet
K5N1229ACD-BQ12
MCP Memory
11.7 Single-Access Burst READ Operation—Variable Latency
tCLK
VIH
CLK
ADV
VIL
tSP
tHD
VIH
VIL
tSP
tHD
VIH
A[22:16]
CS
VIL
VIH
Valid Address
tAVH
tCSP
tHD tHZ
tAHCR
VIL
tBOE
tADVO
OE
WE
LB/UB
WAIT
A/DQ[15:0]
tOHZ
VIH
VIL
tSP
tOLZ
tHD
VIH
VIL
VIH
tHD
tSP
VIL
VOH
VOL
VOH
VOL
tKHTL
tCSW
High-Z
High-Z
tSP
tHD
VOH
tACLK
tKOH
High-Z
Valid
Output
Valid Address
VOL
READ Burst Identified
(WE = HIGH)
Don’t Care
NOTE :
1) Non-default BCR settings: Latency code two (three clocks); WAIT active LOW; WAIT asserted during delay.
2) Don’t care must be in VIL or VIH.
- 112
Undefined
Rev. 1.0
datasheet
K5N1229ACD-BQ12
MCP Memory
11.8 4-Word Burst READ Operation—Variable Latency
tCLK
CLK
VIH
VIL
tSP
ADV
LB/UB
tHD
VIH
VIL
tSP
A[22:16]
tKP tKP
tKHKL
VIH
VIL
VIH
tHD
Valid Address
tAVH
tSP
tHD
tAHCR
VIL
tCSP
CS
OE
VIL
tADVO
WAIT
tHZ
tBOE
VIL
tOHZ
tHD
tKHTL
VIH
VIL
VOH
tCSW
High-Z
VOL
tKOH
tSP
A/DQ[15:0]
tCBPH
VIH
tSP
WE
tHD
tCSM
VIH
VIH
VIL
tACLK
tHD
VOH
Valid Address
VOL
Valid
Output
Valid
Output
Valid
Output
READ Burst Identified
(WE = HIGH)
Valid
Output
Don’t Care
NOTE :
1) Non-default BCR settings: Latency code two (three clocks); WAIT active LOW; WAIT asserted during delay.
2) Don’t care must be in VIL or VIH.
- 113
High-Z
Undefined
Rev. 1.0
datasheet
K5N1229ACD-BQ12
MCP Memory
11.9 Single-Access Burst READ Operation—Fixed Latency
tCLK
VIH
CLK
ADV
A[22:16]
VIL
tHD
tSP
tHD
tAHCR
VIL
VIH
VIL
CS
tSP
VIH
VIH
Valid Address
tCSP
tHD tHZ
tAVH
VIL
tADVO
OE
WE
LB/UB
WAIT
A/DQ[15:0]
tOHZ
tBOE
VIH
VIL
tSP
tOLZ
tHD
VIH
VIL
tHD
tSP
VIH
VIL
VOH
VOL
VIH
VIL
tKHTL
tCSW
High-Z
tSP
tHD
tACLK
High-Z
Valid Address
READ Burst Identified
(WE = HIGH)
tKOH
Valid Output
Don’t Care
NOTE :
1) Non-default BCR settings: Fixed latency; latency code four (five clocks); WAIT active LOW; WAIT asserted during delay.
2) Don’t care must be in VIL or VIH.
- 114
Undefined
Rev. 1.0
datasheet
K5N1229ACD-BQ12
MCP Memory
11.10 4-Word Burst READ Operation—Fixed Latency
tCLK
CLK
VIL
tSP
ADV
tKP tKP
tKHKL
VIH
tHD
VIH
tAHCR
VIL
tAADV
VIH
A[22:16]
VIL
VIH
LB/UB
Valid Address
tAVH
tSP
VIL
tCSP
CS
OE
VIL
tCO
tADVO
VIH
VIL
WAIT
tKHTL
tHD
tOHZ
VIH
VIL
VOH
tCSW
High-Z
VOL
tSP
A/DQ[15:0]
IN/OUT
tHZ
tBOE
tOLZ
tSP
WE
tHD tCBPH
tCSM
VIH
VIH
VIL
tAA
tHD
tKOH
VOH
tACLK
Valid
Output
Valid Address
VOL
READ Burst Identified
(WE = HIGH)
Valid
Output
Valid
Output
Valid
Output
Don’t Care
NOTE :
1) Non-default BCR settings: Fixed latency; latency code two (three clocks); WAIT active LOW; WAIT asserted during delay.
2) Don’t care must be in VIL or VIH.
- 115
High-Z
Undefined
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
11.11 4-Word Burst READ Operation - Row Boundary Crossing
tCLK
CLK
VIL
tSP
ADV
tKP tKP
tKHKL
VIH
tHD
VIH
VIL
tAHCR
tAADV
VIH
A[22:16]
VIL
VIH
LB/UB
Valid Address
tAVH
tSP
VIL
tCSP
CS
OE
VIH
VIL
tCO
tADVO
VIH
VIL
WAIT
tKHTL
tHD
tOHZ
VIH
VIL
VOH
tCSW
High-Z
VOL
tSP
A/DQ[15:0]
IN/OUT
tHZ
tBOE
tOLZ
tSP
WE
tHD tCBPH
tCSM
VIH
VIL
tAA
tHD
tKOH
VOH
Valid Address
VOL
READ Burst Identified
(WE = HIGH)
tACLK
Valid
Output
Valid
Output
End of Row
Valid
Output
Valid
Output
Don’t Care
NOTE :
1) Non-default BCR settings: Fixed latency; latency code two (three clocks); WAIT active LOW; WAIT asserted during delay.
2) Don’t care must be in VIL or VIH.
3) There is no limitation for CS high time during Row Boundary Crossing.
4) There is no ADV low during Row Boundary Crossing.
- 116
High-Z
Undefined
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
11.12 READ Burst Suspend
tCLK
NOTE 2
VIH
CLK VIL
ADV
tSP tHD
VIH
tADVO
VIL
tAHCR
tSP
VIH
A[22:16]
CS
OE
WE
LB/UB
VIL
VIH
tHD
Valid
Address
tCSM
tCSP
tOHZ
VIH
VIL
tOHZ
NOTE 3
tSP tHD
VIH
VIL
VIH
VIL
tBOE
VOH
tOLZ
tCSW
High-Z
VOL
tKOH
tSP
A/DQ[15:0]
tHZ
VIL
tCSW
WAIT
Valid
Address
VIH
VIL
tBOE
tHD
Valid
Address
tOLZ
Valid
Output
Valid
Output
Valid
Output
Valid
Output
High-Z
Valid
Output
Valid
Output
Valid
Address
tACLK
Don’t Care
Undefined
NOTE :
1) Non-default BCR settings for READ burst suspend: Fixed or variable latency; latency code two (three clocks); WAIT active LOW; WAIT asserted during delay.
2) CLK can be stopped LOW or HIGH, but must be static, with no LOW-to-HIGH transitions during burst suspend.
3) OE can stay LOW during burst suspend. If OE is LOW, A/DQ[15:0] will continue to output valid data.
4) Don’t care must be in VIL or VIH.
- 117
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
11.13 Asynchronous WRITE (CS Controlled)
tVS
tVP
tVP
ADV
VIH
VIL
tCVS
tCVP
tAVS
A[22:16]
CS
UB/LB
WE
VIH
VIL
tAVS
tAVH
Valid Address
tCW
VIH
VIL
tCPH
tBHA
tBSA
VIH
VIL
tWP
VIH
VIL
tAW
A/DQ[15:0]
tAVH
Valid Address
VIH
VIL
Valid Address
tAVS
tAVS
Data Valid
tAVH
tDW
tAVH
Valid Address
tDH
Don’t Care
NOTE :
1) Don’t care must be in VIL or VIH.
2) A write occurs during the overlap(tWP) of low CS and low WE. A write begins when CS goes low and WE goes low with asserting UB or LB for single byte
operation or simultaneously asserting UB and LB for double byte operation.
3) tCW is measured from the CS going low to the end of write.
4) tAS is measured from the address valid to the beginning of write.
5) tWR is measured from the end of write to the address change. tWR is applied in case a write ends with CS or WE going high.
- 118
K5N1229ACD-BQ12
Rev. 1.0
datasheet
11.14 Asynchronous WRITE
MCP Memory
(WE, UB/LB Controlled)
tVS
tVP
tVP
ADV
VIH
tWR
VIL
tCVS
tAVS
A[22:16]
CS
UB/LB
WE
VIH
VIL
tAVS
tAVH
Valid Address
Valid Address
VIH
tCW
VIL
tBSA
tBHA
VIH
VIL
tWP
VIH
VIL
tBHZ
tAW
A/DQ[15:0]
tAVH
VIH
VIL
Valid Address
tAVS
Data Valid
tAVH
tDW
tAVS
tAVH
Valid Address
tDH
Don’t Care
NOTE :
1) Don’t care must be in VIL or VIH.
2) A write occurs during the overlap(tWP) of low CS and low WE. A write begins when CS goes low and WE goes low with asserting UB or LB for single byte
operation or simultaneously asserting UB and LB for double byte operation.
3) tCW is measured from the CS going low to the end of write.
4) tAS is measured from the address valid to the beginning of write.
5) tWR is measured from the end of write to the address change. tWR is applied in case a write ends with CS or WE going high.
- 119
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
11.15 Asynchronous WRITE Followed by Asynchronous READ
tVS
(CS Controlled)
tWR
tVP
ADV VIH
VIL
tAADV
tAVS
A[22:16]
CS
VIH
VIL
tAVH
tVP
tCVS
Valid Address
Valid Address
tCPH
tCW
VIH
tAVS
tCVS
VIL
tBSA
tAVH
tCO
tBHA
UB/ LB
tHZ
tBA
VIH
VIL
tOE
tBHZ
VIH
OE VIL
tOLZ
tOHZ
tWP
WE
VIH
VIL
tHZ
tAW
A/DQ[15:0]
tAA
VIH
VIL
Valid Address
tAVS
tAVH
Valid Address
Data Valid
tDW
tDH
tAVS
VOH
VOL
tAVH
Don’t Care
- 120
Valid output
Undefined
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
11.16 Asynchronous WRITE Followed by Asynchronous READ
tVS
(OE, WE Controlled)
tWR
tVP
ADV VIH
VIL
tAVS
A[22:16]
CS
VIH
VIL
tAVH
Valid Address
Valid Address
tAVS
tCVS
tCW
VIH
tAADV
tVP
tCVS
VIL
tBSA
tAVH
tCO
tBHA
UB/ LB
tHZ
tBA
VIH
VIL
tOE
tBHZ
VIH
OE VIL
tOLZ
WE
A/DQ[15:0]
tOHZ
tWP
VIH
VIL
VIL
tBHZ
tAW
VIH
Valid Address
tAVS
tAVH
tAA
Valid Address
Data Valid
tDW
tDH
tAVS
VOH
VOL
tAVH
Don’t Care
- 121
Valid output
Undefined
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
11.17 Burst WRITE Operation—Variable Latency Mode
tCLK
CLK
ADV
tKHKL
tKP
tKP
VIH
VIL
tSP
VIH
tKADV
tHD
VIL
tAHCR
tAVH
A[22:16]
LB/UB
VIH
VIL
Valid Address
tSP
tHD
VIH
VIL
tCSM
CS
OE
WE
WAIT
VIH
tCSP
tCBPH
VIL
VIH
VIL
tSP tHD
VIH
VIL
VOH
VOL
VIH
VIL
tKHTL
tCSW
High-Z
tSP
A/DQ[15:0]
tHD
tHZ
High-Z
NOTE 2
tHD
Valid Address
tSP
tHD
D1
D2
D3
WRITE Burst Identified
(WE = LOW)
D4
Don’t Care
NOTE :
1) Non-default BCR settings for burst WRITE operation in variable latency mode: Latency code two (three clocks); WAIT active LOW;
WAIT asserted during delay; burst length four; burst wrap enabled.
2) WAIT asserts for LC cycles for both fixed and variable latency. LC = Latency Code (BCR[13:11]).
3) Don’t care must be in VIL or VIH.
- 122
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
11.18 Burst WRITE Operation—Fixed Latency Mode
tCLK
CLK
ADV
tKHKL
tKP
tKP
VIH
VIL
tKADV
tSP
VIH
tHD
VIL
tAHCR
tAVH
A[22:16]
LB/UB
VIH
VIL
Valid Address
tSP
tHD
VIH
VIL
tCSM
CS
OE
WE
WAIT
A/DQ[15:0]
VIH
tCSP
tHD
tCBPH
VIL
VIH
VIL
tSP tHD
VIH
VIL
VOH
VOL
VIH
VIL
tKHTL
tCSW
High-Z
tSP
tHZ
High-Z
NOTE 2
tHD
Valid Address
tSP
tHD
D[1]
D[2]
D[3]
D[4]
WRITE Burst Identified
(WE = LOW)
Don’t Care
NOTE :
1) Non-default BCR settings for burst WRITE operation in fixed latency mode: Fixed latency; latency code two (three clocks); WAIT active LOW;
WAIT asserted during delay; burst length four; burst wrap enabled.
2) WAIT asserts for LC cycles for both fixed and variable latency. LC = Latency Code (BCR[13:11]).
3) Don’t care must be in VIL or VIH.
- 123
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
11.19 4-Word Burst WRITE Operation - Row Boundary Crossing
tCLK
CLK
VIL
tSP
ADV
tKP tKP
tKHKL
VIH
tHD
VIH
VIL
tAHCR
tAVS
VIH
A[22:16]
VIL
VIH
LB/UB
Valid Address
tAVH
tSP
tHD
A
VIL
tCSP
CS
OE
VIL
VIH
VIL
tSP
WE
WAIT
tHD
VIH
VIL
VOH
tHZ
tCSW
High-Z
VOL
tSP
A/DQ[15:0]
IN/OUT
tHD tCBPH
VIH
VIH
VIL
tHD
tSP
tHD
VOH
D1
Valid Address
D2
D3
D4
High-Z
VOL
WRITE Burst Identified
(OE = HIGH)
End of Row
Don’t Care
NOTE :
1) Non-default BCR settings: Fixed latency; latency code two (three clocks); WAIT active LOW; WAIT asserted during delay.
2) Don’t care must be in VIL or VIH.
3) D2 can be written when CS goes high at Point A.
4) There is no limitation for CS high time during Row Boundary Crossing.
6) There is no ADV low during Row Boundary Crossing.
- 124
Undefined
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
11.20 Burst WRITE Followed by Burst READ, Variable Latency
tCLK
CLK
A[22:16]
VIH
VIL
VIH
VIL
tSP tHD
tSP tHD
Valid
Address
Valid
Address
tSP tHD
tSP tHD
ADV
LB/UB
VIH
VIL
VIH
CS
tAHCR
VIL
VIH
tSP tHD
tSP
tCSP
tHD
VIL
tAHCR
tCBPH
NOTE2
tCSP
tADVO
tOHZ
VIH
OE
VIL
tSP tHD
VIH
WE
WAIT
A/DQ[15:0]
VIL
tSP tHD
tCSW
VOL
VIH
VIL
tBOE
tCSW
VOH
High-Z
tSP tHD
tSP tHD
Valid
Address
D0
VOH
D1
D2
tSP tHD
Valid
Address
D3
tACLK
tKOH
Valid
Output
Valid
Output
Valid
Output
Valid
Output
VOL
Don’t Care
NOTE :
1) Non-default BCR settings for burst WRITE followed by burst READ: Variable latency; latency code two (three clocks); WAIT active LOW;
WAIT asserted during delay.
2) A refresh opportunity must be provided every tCSM by taking CS HIGH.
3) Don’t care must be in VIL or VIH.
- 125
Undefined
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
11.21 Burst WRITE Followed by Burst READ, Fixed Latency
tCLK
CLK
A[22:16]
VIH
VIL
VIH
VIL
LB/UB
VIH
CS
tAHCR
VIL
VIH
tSP tHD
tKADV
tAVH
VIH
VIL
Valid
Address
Valid
Address
tSP tHD
ADV
tSP tHD
tSP tHD
tSP tHD
tSP
tCSP
tHD
VIL
tAVH
tAHCR
tCBPH
NOTE2
tCSP
tADVO
tOHZ
VIH
OE
VIL
tSP tHD
VIH
WE
WAIT
A/DQ[15:0]
tSP tHD
VIL
VOH
VOL
VIH
VIL
tCSW
tBOE
tCSW
High-Z
tSP tHD
tSP tHD
Valid
Address
D0
VOH
D1
D2
tSP tHD
Valid
Address
D3
tACLK
tKOH
Valid
Output
Valid
Output
Valid
Output
Valid
Output
VOL
Don’t Care
NOTE :
1) Non-default BCR settings for burst WRITE followed by burst READ: fixed latency; latency code two (three clocks); WAIT active LOW;
WAIT asseted during delay.
2) A refresh opportunity must be provided every tCSM by taking CS HIGH.
3) Don’t care must be in VIL or VIH.
- 126
Undefined
Rev. 1.0
datasheet
K5N1229ACD-BQ12
MCP Memory
11.22 Asynchronous WRITE Followed by Asynchronous READ
A[22:16]
VIH
Valid Address
VIL
Valid Address
tAVS
tAVS
tVS
ADV
tVP
VIH
VIL
LB/UB
tBW
VIH
OE
tBA
tHZ
tCO
tBHZ
VIL
tCVP
CS
tAADV
tWR
tCPH
tCW
VIH
VIL
tBHA
tBSA
VIL
tWP
WE
tOE
VIH
VIL
tCSW
tCSW
WAIT
VOH
High-Z
VOL
tAVS
A/DQ[15:0] VIH
IN/OUT
VIL
tOHZ
tOLZ
Note 1
VIH
tAW
tAVH
Valid Address
tAA
tDS
tDH
Valid Input
tAVS
Valid Address
VOH
Valid Output
VOL
Don’t Care
NOTE :
1) CS can stay LOW when transitioning between asynchronous operations. If CS goes HIGH, it must remain HIGH for at least tCPH to schedule the
appropriate internal refresh operation.
2) Don’t care must be in VIL or VIH.
- 127
Undefined
K5N1229ACD-BQ12
Rev. 1.0
datasheet
MCP Memory
11.23 Asynchronous READ Followed by WRITE at the Same Address
A[22:16]
ADV
VIH
Valid Address
VIL
tAVS
tAADV
tVP
VIH
VIL
LB/UB
CS
OE
WE
tBA
VIL
tCPH
tCVP
tCO
VIH
VIL
tOE
tOHZ
VIH
VIL
tOLZ
tWHZ
VIH
VIL
WAIT
tBW
VIH
VOH
High-Z
VOL
tAA
tAVS
A/DQ[15:0] VIH
IN/OUT
VIL
tWP
NOTE2
tCSW
tDS
tAVH
Valid Address
VOH
VOL
Valid Output
VIH
VIL
Valid Input
Don’t Care
NOTE :
1) The end of the WRITE cycle is controlled by CS, LB/UB, or WE, whichever de-asserts first.
2) WE must not remain LOW longer than 2.5µs (tCSM) while the device is selected (CS LOW).
3) Don’t care must be in VIL or VIH.
- 128
tDH
Undefined