FAIRCHILD MM74HCU04_08

MM74HCU04
Hex Inverter
Features
General Description
■ Typical propagation delay: 7ns
The MM74HCU04 inverters utilize advanced silicon-gate
CMOS technology to achieve operating speeds similar to
LS-TTL gates with the low power consumption of standard CMOS integrated circuits.
■ Fanout of 15 LS-TTL loads
■ Quiescent power consumption: 10µA maximum at
room temperature
Low
input current: 1µA maximum
■
The MM74HCU04 is an unbuffered inverter. It has high
noise immunity and the ability to drive 15 LS-TTL loads.
The 74HCU logic family is functionally as well as pin-out
compatible with the standard 74LS logic family. All inputs
are protected from damage due to static discharge by
internal diode clamps to VCC and ground.
Ordering Information
Package
Number
Package Description
MM74HCU04M
M14A
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
MM74HCU04SJ
M14D
14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Order Number
MM74HCU04MTC
MM74HCU04N
MTC14
N14A
14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number.
All packages are lead free per JEDEC: J-STD-020B standard.
©1983 Fairchild Semiconductor Corporation
MM74HCU04 Rev. 1.4.0
www.fairchildsemi.com
MM74HCU04 — Hex Inverter
February 2008
MM74HCU04 — Hex Inverter
Connection Diagram
Pin Assignments for DIP, SOIC, SOP and TSSOP
Top View
Schematic Diagram
©1983 Fairchild Semiconductor Corporation
MM74HCU04 Rev. 1.4.0
www.fairchildsemi.com
2
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
Parameter
Rating
VCC
Supply Voltage
VIN
DC Input Voltage
–1.5 to VCC+1.5V
DC Output Voltage
–0.5 to VCC+0.5V
VOUT
IIK, IOK
–0.5 to +7.0V
Clamp Diode Current
±20mA
IOUT
DC Output Current, per pin
±25mA
ICC
DC VCC or GND Current, per pin
±50mA
TSTG
PD
Storage Temperature Range
–65°C to +150°C
Power Dissipation
Note 2
600mW
S.O. Package only
TL
500mW
Lead Temperature (Soldering 10 seconds)
260°C
Notes:
1. Unless otherwise specified all voltages are referenced to ground.
2. Power Dissipation temperature derating — plastic “N” package: –12mW/°C from 65°C to 85°C.
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to absolute maximum ratings.
Symbol
VCC
VIN, VOUT
TA
Parameter
Min.
Max.
Units
Supply Voltage
2
6
V
DC Input or Output Voltage
0
VCC
V
–40
+85
°C
Operating Temperature Range
©1983 Fairchild Semiconductor Corporation
MM74HCU04 Rev. 1.4.0
www.fairchildsemi.com
3
MM74HCU04 — Hex Inverter
Absolute Maximum Ratings(1)
TA = –40°C
to 85°C
TA = 25°C
Symbol
VIH
VIL
VOH
VOL
Parameter
VCC (V)
Conditions
Typ.
TA = –55°C
to 125°C
Guaranteed Limits
Minimum HIGH
Level Input
Voltage
2.0
1.7
1.7
1.7
4.5
3.6
3.6
3.6
6.0
4.8
4.8
4.8
Maximum LOW
Level Input
Voltage
2.0
0.3
0.3
0.3
4.5
0.8
0.8
0.8
6.0
1.1
1.1
1.1
2.0
1.8
1.8
1.8
4.5
4.0
4.0
4.0
6.0
5.5
5.5
5.5
Minimum HIGH
Level Output
Voltage
Maximum LOW
Level Output
Voltage
2.0
4.5
VIN = VIL,
|IOUT| ≤ 20µA
6.0
4.5
VIN = GND,
|IOUT| ≤ 4.0mA
4.2
3.98
3.84
3.7
6.0
VIN = GND,
|IOUT| ≤ 5.2mA
5.7
5.48
5.34
5.2
2.0
VIN = VIH,
|IOUT| ≤ 20µA
0
0.2
0.2
0.2
0
0.5
0.5
0.5
0
0.5
0.5
0.5
4.5
6.0
4.5
VIN = VCC,
|IOUT| ≤ 6.0mA
0.2
0.26
0.33
0.4
6.0
VIN = VCC,
|IOUT| ≤ 7.8mA
0.2
0.26
0.33
0.4
Units
V
V
V
V
IIN
Maximum Input
Current
6.0
VIN = VCC or GND
±0.1
±1.0
±1.0
µA
ICC
Maximum
Quiescent
Supply Current
6.0
VIN = VCC or GND,
IOUT = 0µA
2.0
20
40
µA
Note:
3. For a power supply of 5V ±10% the worst case output voltages (VOH, and VOL) occur for HC at 4.5V. Thus the 4.5V
values should be used when designing with this supply. Worst case VIH and VIL occur at VCC = 5.5V and 4.5V
respectively. (The VIH value at 5.5V is 3.85V.) The worst case leakage current (IIN, ICC, and IOZ) occur for CMOS at
the higher voltage and so the 6.0V values should be used.
AC Electrical Characteristics
VCC = 5V, TA = 25°C, CL = 15pF, tr = tf = 6ns
Symbol
Parameter
Conditions
tPHL, tPLH Maximum Propagation Delay
©1983 Fairchild Semiconductor Corporation
MM74HCU04 Rev. 1.4.0
Typ.
Guaranteed
Limit
Units
7
13
ns
www.fairchildsemi.com
4
MM74HCU04 — Hex Inverter
DC Electrical Characteristics
TA=25°C
Symbol
tPHL, tPLH
tTLH, tTHL
Parameter
Conditions VCC (V) Typ.
Maximum Propagation
Delay
Maximum Output Rise
and Fall Time
CPD
Power Dissipation
Capacitance(4)
CIN
Maximum Input
Capacitance
(per gate)
TA = –40°C
to 85°C
TA –55°C
to 125°C
Guaranteed Limits
Units
2.0
49
82
103
120
4.5
9.9
16
21
24
6.0
8.4
14
18
20
2.0
30
75
95
110
4.5
8
15
19
22
6.0
7
13
16
19
90
8
ns
ns
pF
15
15
15
pF
Note:
4. CPD determines the no load dynamic power consumption, PD = CPD VCC2 f + ICC VCC, and the no load dynamic
current consumption, IS = CPD VCC f + ICC.
Typical Applications
Figure 1. Crystal Oscillator
Figure 2. Stable RC Oscillator
Figure 3. Schmitt Trigger
©1983 Fairchild Semiconductor Corporation
MM74HCU04 Rev. 1.4.0
www.fairchildsemi.com
5
MM74HCU04 — Hex Inverter
AC Electrical Characteristics
VCC = 2.0V to 6.0V, CL = 50pF, tr = tf = 6ns (unless otherwise specified)
8.75
8.50
0.65
A
7.62
14
8
B
5.60
4.00
3.80
6.00
PIN ONE
INDICATOR
1
1.70
7
0.51
0.35
1.27
0.25
(0.33)
1.75 MAX
1.50
1.25
1.27
LAND PATTERN RECOMMENDATION
M
C B A
SEE DETAIL A
0.25
0.10
C
0.25
0.19
0.10 C
NOTES: UNLESS OTHERWISE SPECIFIED
A) THIS PACKAGE CONFORMS TO JEDEC
MS-012, VARIATION AB, ISSUE C,
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS DO NOT INCLUDE MOLD
GAGE PLANE
FLASH OR BURRS.
D) LANDPATTERN STANDARD:
SOIC127P600X145-14M
0.36
E) DRAWING CONFORMS TO ASME Y14.5M-1994
F) DRAWING FILE NAME: M14AREV13
0.50 X 45°
0.25
R0.10
R0.10
8°
0°
0.90
0.50
(1.04)
SEATING PLANE
DETAIL A
SCALE: 20:1
Figure 4. 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
©1983 Fairchild Semiconductor Corporation
MM74HCU04 Rev. 1.4.0
www.fairchildsemi.com
6
MM74HCU04 — Hex Inverter
Physical Dimensions
MM74HCU04 — Hex Inverter
Physical Dimensions (Continued)
Figure 5. 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
©1983 Fairchild Semiconductor Corporation
MM74HCU04 Rev. 1.4.0
www.fairchildsemi.com
7
MM74HCU04 — Hex Inverter
Physical Dimensions (Continued)
0.65
0.43 TYP
1.65
6.10
0.45
12.00° TOP
& BOTTOM
R0.09 min
A. CONFORMS TO JEDEC REGISTRATION MO-153,
VARIATION AB, REF NOTE 6
B. DIMENSIONS ARE IN MILLIMETERS
C. DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD FLASH,
AND TIE BAR EXTRUSIONS
D. DIMENSIONING AND TOLERANCES PER ANSI
Y14.5M, 1982
E. LANDPATTERN STANDARD: SOP65P640X110-14M
F. DRAWING FILE NAME: MTC14REV6
1.00
R0.09min
Figure 6. 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
©1983 Fairchild Semiconductor Corporation
MM74HCU04 Rev. 1.4.0
www.fairchildsemi.com
8
MM74HCU04 — Hex Inverter
Physical Dimensions (Continued)
19.56
18.80
14
8
6.60
6.09
1
7
(1.74)
8.12
7.62
1.77
1.14
3.56
3.30
0.35
0.20
5.33 MAX
0.38 MIN
3.81
3.17
0.58
0.35
8.82
2.54
NOTES: UNLESS OTHERWISE SPECIFIED
THIS PACKAGE CONFORMS TO
A) JEDEC MS-001 VARIATION BA
B) ALL DIMENSIONS ARE IN MILLIMETERS.
DIMENSIONS ARE EXCLUSIVE OF BURRS,
C) MOLD FLASH, AND TIE BAR EXTRUSIONS.
D) DIMENSIONS AND TOLERANCES PER
ASME Y14.5-1994
E) DRAWING FILE NAME: MKT-N14AREV7
Figure 7. 14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
©1983 Fairchild Semiconductor Corporation
MM74HCU04 Rev. 1.4.0
www.fairchildsemi.com
9
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PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S
WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.
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FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR
SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body or
(b) support or sustain life, and (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in a significant injury of the user.
2. A critical component in any component of a life support,
device, or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative or In Design
This datasheet contains the design specifications for product
development. Specifications may change in any manner without notice.
Preliminary
First Production
This datasheet contains preliminary data; supplementary data will be
published at a later date. Fairchild Semiconductor reserves the right to
make changes at any time without notice to improve design.
No Identification Needed
Full Production
This datasheet contains final specifications. Fairchild Semiconductor
reserves the right to make changes at any time without notice to improve
the design.
Obsolete
Not In Production
This datasheet contains specifications on a product that has been
discontinued by Fairchild Semiconductor. The datasheet is printed for
reference information only.
Rev. I33
©1983 Fairchild Semiconductor Corporation
MM74HCU04 Rev. 1.4.0
www.fairchildsemi.com
10
MM74HCU04 — Hex Inverter
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