SEMIKRON SKCD47C170I

SKCD 47 C 170 I
Absolute Maximum Ratings
Symbol
Conditions
Values
Unit
VRRM
IF(AV)
Tj = 25 °C, IR = 0.2 mA
1700
V
Ts = 80 °C, Tj = 150 °C
40
A
IFSM
10 ms
sin 180°
Tj = 25 °C
720
A
Tj = 150 °C
550
A
150
°C
Tjmax
CAL-DIODE
Electrical Characteristics
Symbol
Conditions
IF = 55 A
i2t
Tj = 150 °C, 10 ms, sin 180°
VRRM = 1700 V
IR
Size: 6,8 mm x 6,8 mm
SKCD 47 C 170 I
min.
typ.
max.
Unit
1500
A2s
Tj = 25 °C, VRRM = 1700 V
0.20
mA
Tj = 125 °C, VRRM = 1700 V
8.00
mA
Tj = 25 °C, IF = 55 A
2.05
2.50
V
Tj = 125 °C, IF = 55 A
1.80
2.30
V
V(TO)
Tj = 125 °C
1.11
V
rT
Tj = 125 °C
1.2
mΩ
VF
Features
Dynamic Characteristics
• low forward voltage drop combined
with a low temperature dependence
• easy paralleling due to a small forward
voltage spread
• very soft recovery behavior
• small switching losses
• high ruggedness
• compatible to thick wire bonding
• compatible to all standard solder
processes
Symbol
Conditions
trr
Tj = 25 °C, 50 A, 1200 V, 800 A/µs
trr
Tj = 125 °C, 50 A, 1200 V, 800 A/µs
Qrr
Tj = 25 °C, 50 A, 1200 V, 800 A/µs
6
µC
Qrr
Tj = 125 °C, 50 A, 1200 V, 800 A/µs
15
µC
Irrm
Tj = 25 °C, 50 A, 1200 V, 800 A/µs
Irrm
Tj = 125 °C, 50 A, 1200 V, 800 A/µs
Typical Applications*
• freewheeling diode for IGBT
• particularly suitable for frequencies > 8
kHz
min.
typ.
max.
Unit
µs
ns
A
45
A
Thermal Characteristics
Symbol
Conditions
min.
typ.
max.
Unit
°C
Tj
-40
150
Tstg
-40
150
°C
Tsolder
10 min.
250
°C
Tsolder
5 min.
320
°C
Rth(j-s)
sold. on 0,38 mm DCB, reference point
on copper heatsink close to the chip
0.7
K/W
Values
Unit
6.8 x 6.8
mm2
47
mm2
Mechanical Characteristics
Symbol
Conditions
Raster
size
Area total
Anode
bondable (Al)
Cathode
solderable (Ag/Ni)
Al, diameter ≤ 500 µm
Wire bond
Package
wafer frame
Chips /
Package
208 (5" Wafer)
pcs
SKCD
© by SEMIKRON
Rev. 1 – 18.02.2010
1
SKCD 47 C 170 I
This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX
* The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested
for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is
subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our personal.
2
Rev. 1 – 18.02.2010
© by SEMIKRON