SD05 and SD12 Single Line TVS Diode for ESD Protection in Portable Electronics PROTECTION PRODUCTS Description Features 350 Watts peak pulse power (tp = 8/20µs) Transient protection for data lines to The SDxx TVS diodes are designed to replace multilayer varistors (MLVs) in portable applications such as cell phones, notebook computers, and PDA’s. They offer superior electrical characteristics such as lower clamping voltage and no device degradation when compared to MLVs. The SDxx series TVS diodes are designed to protect sensitive semiconductor components from damage or upset due to electrostatic discharge (ESD) and other voltage induced transient events. The SDxx is in a SOD-323 package and will protect one unidirectional line. They are available with working voltages of 5 volts (SD05) and 12 volts (SD12). These devices will fit on the same PCB pad area as an 0805 MLV device. They give the designer the flexibility to protect one line in applications where arrays are not practical. Additionally, it may be “sprinkled” around the board in applications where board space is at a premium. IEC 61000-4-2 (ESD) ±25kV (air), ±10kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) IEC 61000-4-5 (Lightning) 24A (8/20µs) Small package for use in portable electronics Suitable replacement for MLV’s in ESD protection applications Protects one I/O or power line Low clamping voltage Working voltages: 5V and 12V Low leakage current Solid-state silicon-avalanche technology Mechanical Characteristics EIAJ SOD-323 package Molding compound flammability rating: UL 94V-0 Marking : Marking code, cathode band Packaging : Tape and Reel per EIA 481 Applications They may be used to meet the ESD immunity requirements of IEC 61000-4-2, Level 4 (±15kV air, ±8kV contact discharge). Cell Phone Handsets and Accessories Microprocessor based equipment Personal Digital Assistants (PDA’s) Notebooks, Desktops, and Servers Portable Instrumentation Pagers Peripherals Schematic & PIN Configuration SOD-323 (Top View) Revision 07/12/04 1 www.semtech.com SD05 and SD12 PROTECTION PRODUCTS Absolute Maximum Rating R ating Symbol Value Units Peak Pulse Power (tp = 8/20µs) Pp k 350 Watts ESD Voltage (HBM Waveform p er IEC 61000-4-2) VESD 30 kV Lead Soldering Temp erature TL 260 (10 sec.) °C Op erating Temp erature TJ -55 to +125 °C TSTG -55 to +150 °C Storage Temp erature Electrical Characteristics SD05 Parameter Symbol Conditions Minimum Typical Maximum Units 5 V Reverse Stand-Off Voltage VRWM Reverse Breakdown Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 5V, T=25°C 10 µA Clamp ing Voltage VC IPP = 5A, tp = 8/20µs 9.8 V Clamp ing Voltage VC IPP = 24A, tp = 8/20µs 14.5 V Peak Pulse Current IP P tp = 8/20µs 24 A Junction Cap acitance Cj VR = 0V, f = 1MHz 350 pF Symbol Conditions Maximum Units 12 V 6 V SD12 Parameter Minimum Typical Reverse Stand-Off Voltage VRWM Reverse Breakdown Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 12V, T=25°C 1 µA Clamp ing Voltage VC IPP = 5A, tp = 8/20µs 19 V Clamp ing Voltage VC IPP = 15A, tp = 8/20µs 25 V Peak Pulse Current IP P tp = 8/20µs 15 A Junction Cap acitance Cj VR = 0V, f = 1MHz 150 pF 2004 Semtech Corp. 2 13.3 V www.semtech.com SD05 and SD12 PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve 10 110 % of Rated Power or PI P Peak Pulse Power - Ppk (kW) 100 1 0.1 90 80 70 60 50 40 30 20 10 0 0.01 0 0.1 1 10 100 25 1000 50 75 100 125 150 Ambient Temperature - TA (oC) Pulse Duration - tp (µs) Pulse Waveform Clamping Voltage vs. Peak Pulse Current 110 80 70 e 60 Clamping Voltage - VC (V) 90 Percent of IPP 30 Waveform Parameters tr = 8µs td = 20µs 100 -t 50 40 td = IPP/2 30 20 10 Waveform Parameters tr = 8µs td = 20µs 25 SD12 20 15 SD05 10 5 0 0 0 0 5 10 15 20 25 5 10 30 15 20 25 30 Peak Pulse Current - IPP (A) Time (µs) Capacitance vs. Reverse Voltage Forward Voltage vs. Forward Current 7.00 350 f =1MHz 6.00 Forward Voltage -VF (V) Capacitance - C j (pF) 300 250 200 SD05 150 100 SD12 50 5.00 SD12 4.00 SD05 3.00 2.00 Waveform Parameters: tr = 8µs td = 10µs 1.00 0.00 0 0 2 4 6 8 10 12 0 14 10 15 20 25 30 35 40 45 Forward Current - IF (A) Reverse Voltage - VR (V) 2004 Semtech Corp. 5 3 www.semtech.com SD05 and SD12 PROTECTION PRODUCTS Applications Information Device Connection Options Device Schematic and Pin Configuration The SDxx TVS diodes are designed to protect one data, I/O, or power supply line. The device is designed to replace multi-layer varistors (MLVs) in portable applications. It is easily implemented on existing 0805 MLV pads and is only slightly larger than 0603 MLV pads. The device is unidirectional and may be used on lines where the signal polarity is above ground. The cathode band should be placed towards the line that is to be protected. Size Comparison to 0805 MLV Circuit Board Layout Recommendations for Suppression of ESD. Good circuit board layout is critical for the suppression of fast rise-time transients such as ESD. The following guidelines are recommended (Refer to application note SI99-01 for more detailed information): z z z z z z z z z Place the TVS near the input terminals or connectors to restrict transient coupling. Minimize the path length between the TVS and the protected line. The ESD transient return path to ground should be kept as short as possible. Place a TVS and decoupling capacitor between power and ground of components that may be vulnerable to electrostatic discharges to the ground plane. Minimize all conductive loops including power and ground loops. Use multilayer boards when possible. Minimize interconnecting line lengths Never run critical signals near board edges. Fill unused portions of the PCB with ground plane. SOD-323 0805 MLV Note: Nominal dimensions in inches Component Placement Comparison 0805 MLV on 0805 Solder Pad Matte Tin Lead Finish SOD-323 on 0805 MLV Pad SOD-323 on Recommended (SOD-323) Solder Pad Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. 2004 Semtech Corp. 4 www.semtech.com SD05 and SD12 PROTECTION PRODUCTS Outline Drawing Land Pattern 2004 Semtech Corp. 5 www.semtech.com SD05 and SD12 PROTECTION PRODUCTS Marking Codes Part Number Marking Code SD05 5U SD12 6U Ordering Information Par t Number Lead Finish Qty per Reel R eel Size SD05.TC SnPb 3,000 7” SD12.TC SnPb 3,000 7” SD05.TCT Pb free 3,000 7” SD12.TCT Pb free 3,000 7” Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 2004 Semtech Corp. 6 www.semtech.com