XE3005/XE3006 VSSD VSSA VSSA VDD VREF VREG11 VREG16 Microphone Bias Power supply management XE3006 RESET VDDPA Σ∆ modulator AIN Amp. PWM DAC Decimator Power amplifier AOUTP AOUTN VSSPA SPI Sandman Functions Serial Audio Interface Clock mgt MISO SS SCK MOSI SMAD SMDA BCLK SDI SDO FSYNC MCLK XE3005 / XE3006 Low-Power Audio CODEC FEATURES GENERAL DESCRIPTION • • • The XE3005 is an ultra low-power CODEC (Analog to Digital and Digital to Analog Converter) for voice and audio applications. It includes microphone supply, preamplifier, 16-bit ADC, 16-bit DAC, serial audio interface, power management and clock management for the ADC and the DAC. The sampling frequency of the ADC and of the DAC can be adjusted from 4 kHz to 48 kHz. • • • • • • • The XE3006 also includes the Sandman™ function, which signals whether a relevant voice or audio signal is present for the ADC or DAC. Ultra low-power consumption, below 2 mW Low-voltage operation down to 1.8 V Sandman™ function to reduce system power consumption (XE3006) Single supply voltage Adjustable sampling frequency: 4 – 48 kHz Digital format: 16 bit 2s complement Requires a minimum number of external components Easy interfacing to various DSPs Direct connection to microphone and speaker Various programming options QUICK REFERENCE DATA • • • • • APPLICATIONS • • • • • • Wireless Headsets Bluetooth™ headset Hands-free telephony Digital hearing instruments Consumer and multimedia applications All battery-operated portable audio devices supply voltage current (@20 kHz sampling) sampling frequency Typical dynamic range ADC Typical dynamic range DAC 1.8 – 3.6 V 0.4 mA 4 – 48 kHz 78 dB 78 dB ORDERING INFORMATION Part XE3005 XE3005 XE3006 Rev 1 August 2005 Package TSSOP 20 pins Lead free uCSP® 20 balls TSSOP 24 pins Ext. part no. XE3005I033TRLF Temp. range -20 to 70° C XE3005I064TRLF -20 to 70° C XE3006I019 -20 to 70° C www.semtech.com 1 XE3005/XE3006 Table of Contents 1 Device Description ...................................................................................................................................................3 1.1 Terminals Description XE3005/6................................................................................................................................4 2 Functional Description ............................................................................................................................................5 2.1 2.2 Device Functions ........................................................................................................................................................5 Power-Down Functions ........................................................................................................................................... 12 3 Serial Communications......................................................................................................................................... 13 3.1 3.2 3.3 Serial Audio Interface .............................................................................................................................................. 13 Register Programming ............................................................................................................................................ 14 Serial Peripheral Interface - SPI.............................................................................................................................. 15 4 Sandman™ Function (XE3006) ............................................................................................................................ 17 5 Specifications ........................................................................................................................................................ 19 5.1 5.2 5.3 Absolute Maximum Ratings..................................................................................................................................... 19 Recommended Operating Conditions ..................................................................................................................... 19 Electrical Characteristics ......................................................................................................................................... 20 6 Application Information ........................................................................................................................................ 27 6.1 Application Schematics – XE3006 .......................................................................................................................... 27 7 Register Description ............................................................................................................................................. 28 7.1 7.2 Register Functional Summary ................................................................................................................................. 28 Register Definitions ................................................................................................................................................. 29 8 Mechanical Information ........................................................................................................................................ 33 8.1 8.2 8.3 XE3005 package size (TSSOP20) .......................................................................................................................... 33 XE3005 package size (5x4 uCSP®) ........................................................................................................................ 34 XE3006 Package size (TSSOP24).......................................................................................................................... 35 9 XE3005 Land pattern recommendations (5x4 uCSP®)....................................................................................... 36 © Semtech 2005 www.semtech.com 2 XE3005/XE3006 1 2 MCLK MOSI 24 1 MCLK SMAD SS 23 2 SS SCK 22 3 VDD MISO 21 4 NRESET 3 SMDA 4 VDD 5 NRESET 6 VSSA 7 VREG16 SDI 20 5 VREG16 SDO 19 6 VREF 18 7 VSSA BCLK XE3005 DEVICE DESCRIPTION XE3006 1 MOSI 20 SCK 19 SDI 18 SDO 17 BCLK 16 FSYNC 15 AOUTP 14 13 8 VREF FSYNC 17 8 VSSD VDDPA 9 VSSA AOUTP 16 9 VREG11 AOUTN 12 10 VSSD VDDPA 15 10 AIN VSSPA 11 11 VREG11 AOUTN 14 VSSPA 13 12 AIN Figure 1: Pin layout of the XE3006 and XE3005 in TSSOP XEMICS XE3005 SCK SDI BCLK AOUTP AOUTN MOSI SDO FSYNC VDDPA VSSPA MCLK SS VREG16 VSSD VREG11 VDD NRESET VREF VSSA AIN BOTTOM VIEW TOP VIEW Figure 2: Pin layout of the XE3005 in uCSP® The XE3006 is available in a TSSOP24 package. The XE3005 is available in a TSSOP20 and uCSP® package. Detailed information is found in chapter 8, Mechanical Information. © Semtech 2005 www.semtech.com 3 XE3005/XE3006 1.1 TERMINALS DESCRIPTION XE3005/6 Terminals XE3006 XE3005 Description Name Type 1 uCSP TSSOP24 TSSOP20 1 1 A2 MCLK DI 2 N/A N/A SMAD DO Master Clock. MCLK derives the internal clocks of ADC and DAC Sandman output ADC 3 N/A N/A SMDA DO Sandman output DAC 4 3 A1 VDD AI Digital power supply 5 4 B1 NRESET ZI/O 6 N/A N/A VSSA AI 7 5 C2 VREG16 AO 8 6 C1 VREF AO Regulator voltage 1.6 V. Can be used to supply the microphone Reference voltage 9 7 D1 VSSA AI Analog ground 10 8 D2 VSSD AI Digital ground 11 9 E2 VREG11 AO ADC Regulated microphone output supply voltage 1.1 V 12 10 E1 AIN AI ADC Analog input signal 13 11 E3 VSSPA AI DAC Power Amplifier Ground 14 12 E4 AOUTN AO DAC Analog Output negative 15 13 D3 VDDPA AI DAC Power Amplifier Supply 16 14 D4 AOUTP AO DAC Analog Output positive 17 15 C3 FSYNC DI/O Serial audio interface Frame Synchronization 18 16 C4 BCLK DI/O Serial audio interface Bit Clock 19 17 B3 SDO ZO 20 18 B4 SDI DI PD 21 N/A N/A MISO ZO 22 19 A4 SCK DI PD SPI Serial Clock 23 2 B2 SS DI PU SPI Slave Select 24 20 A3 MOSI DI PD SPI Master Out Slave In Note: (1) ® Reset signal generated by the CODEC. If required, the reset signal can be applied externally to initialize all the internal CODEC registers Analog ground Serial audio interface Data Output Serial audio interface Data Input SPI Master In Slave Out AI = Analog Input AO = Analog Output DI = Digital Input DO = Digital Output DI/O = Digital In or Out ZO = Hi Impedance or Output PU = internal Pull Up PD = internal Pull Down ZI/O = Hi impedance In or Out © Semtech 2005 www.semtech.com 4 XE3005/XE3006 2 FUNCTIONAL DESCRIPTION A CODEC is typically used for voice and audio applications as an interface between a Digital Signal processor (DSP) or microcontroller and the analogue interfaces like a microphone and loudspeaker. DAC ADC Power Amplifier MIC-Amplifier Serial Audio Interface SPI CODEC DSP / Microcontroller Digital wireless transmission – Bluetooth™ Voice recognition / speech synthesis Figure 3: Typical usage of CODEC This chapter provides a brief description of the CODEC features relating to the CODEC configuration. The configuration of the CODEC is defined by programming registers through a serial interface. A detailed description of the registers defining details of the CODEC setup can be found in chapter 3 and 7. Digital voice and audio samples are passed through the Serial Audio Interface. 2.1 2.1.1 DEVICE FUNCTIONS ADC Signal Channel The ADC channel is a chain of programmable amplifier, band-pass filter, sigma-delta modulator and a decimation filter. The amplifier gain is programmable to 5x (default) and 20x. The band-pass filter has cut-off frequencies proportional to the sampling rate. The sigma-delta modulator operates at a frequency of 64 times the sampling rate. The analog modulator is followed by a digital decimation filter. The digital output data (16 bits, 2’s complement format) is made available through the Serial Audio Interface. The format of the Serial Audio interface can be selected through register J. With the default register settings the ADC can run at a sampling frequency up to 20 kHz. When used with a sampling frequency higher than 20 kHz, then register C has to be changed. The whole ADC chain can be powered-down through register I. © Semtech 2005 www.semtech.com 5 XE3005/XE3006 2.1.2 MIC Input The programmable pre-amplifier and the microphone bias sources VREG11 or VREG16 are optimized to operate with electret microphones. VREG11 provides a 1.1 V reference voltage. The VREG11 can deliver up to 50 µA. VREG11 is enabled through control register E. VREG16 is a regulated voltage of typically 1.6V and can deliver up to 1 mA.VREG16 is always enabled. 0.1µF 4 VDD 5 NRESET 6 VSSA 7 VREG16 8 VREF VSSA 9 VSSD 10 VREG11 11 390kΩ 1µF 1kΩ AIN 12 1µF XE3006 Vcc 50 pF (gain is 5) 200 pF (gain is 20) GND Figure 4: Typical microphone interface (1.1 V / 50 uA bias through VREG11) Vcc 1kΩ * VDD 5 NRESET 6 VSSA 7 VREG16 8 VREF 9 VSSA 10 VSSD 11 VREG11 12 XE3006 4 0.1µF AIN 50 pF (gain is 5) 200 pF (gain is 20) 1µF 390kΩ 1µF * depends on microphone type GND Figure 5: Typical microphone interface (1.6 V / 1 mA bias through VREG16) © Semtech 2005 www.semtech.com 6 XE3005/XE3006 2.1.3 DAC Signal Channel The DAC is based on a multi bit sigma-delta modulator, which operates at a frequency of 8 times the sampling rate. The outputs of the modulator are 2’s complement words of 6 bit. A pulse-width modulator (PWM) converts the 6 bit words into 2 single bit streams at 256 times the sampling frequency. Finally the 2 bit streams are supplied to the power amplifier. The Power Amplifier is a Class D amplifier, which offers higher efficiency than the traditional Class AB topologies. It uses a three-state unbalanced PWM. This means that both channels of the PA (AOUTP and AOUTN) will not switch at the same time, therefore the outputs are not purely differential (see figure 5 and 6) XE3005/6 VDDPA From Serial Audio Interface Interpolator & Modulator dac_in(15:0) @ Fsync P P Pulse Width Modulator N AOUTP Power Amplifier N AOUTN pwm_in(5:0) @ 8xFsync bit streams @ 256xFsync P N VSSPA s s=1 s=0 Figure 6: DAC block diagram Figure 6 shows the relation of input and output samples of the PWM (The timing diagram is not to scale in the time-axis). 1 0 pwm_in(5:0) = 1 pwm_in(5:0) = -1 pwm_in(5:0) = 0 pwm_in(5:0) = 2 P 1 0 N 1/(256 x Fsync) VDDPA VSSPA -VDDPA 1/(256 x Fsync) OUTP-OUTN 1/(8 x Fsync) 2/(256 x Fsync) Figure 7: Examples PWM in and out (not to scale) The DAC receives 16-bit wide 2’s complement format through the Serial Audio Interface. The protocol can be selected through register J. The complete DAC and PA amplifier chain can be powered-down through register I. © Semtech 2005 www.semtech.com 7 XE3005/XE3006 2.1.4 Digital Loop Back In digital loop back mode, the ADC output is routed directly to the DAC input. This allows in-circuit system level tests. The digital loop back mode can be selected through register J. 2.1.5 Operating Frequency A master clock (MCLK) has to be applied to the XE3005/3006. The clock frequency of the signal applied to the MCLK pin may vary between 1.024 MHz minimum and 33.9 MHz maximum. The maximum internal clock signal frequency (MCLK/div_factor) should not exceed 12.288 MHz. The div_factor can be set by the user in register I to 1,2 or 4. The default value for div_factor is ‘1’. 2.1.6 Serial Audio Interface The Serial Audio Interface is a 4-wire interface for bi-directional communication of audio data. It operates on the bit serial clock BCLK and the frame synchronization signal FSYNC. The sampling frequency of the CODEC corresponds to the rate at which the Audio Serial Interface will put out succeeding frames. One frame always corresponds to one sample. One frame always contains 2 channels. Synchronizing the Serial Audio Interface to the MCLK is recommended. FSYNC and MCLK must have a fixed ratio as defined by the following relation: FSYNC = Sampling frequency = frame rate = MCLK/(256 x div_factor). The pin BCLK defines the time when the data must be presented to the serial audio interface and shifted into (pin SDI) or out of (pin SDO) the CODEC. The number of BCLK periods in one FSYNC period is 32. The user can select to use the first 16 clock cycles (channel 1) or the second 16 clock cycles (channel 2) of BLCK to shift in or out the data samples. The table below shows some examples of the relationships between MCLK, BCLK and FSYNC MCLK 2048 kHz 8192 kHz 5120 kHz 22579.2 kHz Div_factor 1 4 1 2 BCLK 256 kHz 256 kHz 640 kHz 1411.2 kHz FSYNC 8 kHz 8 kHz 20 kHz 44.1 kHz The table below shows the possible functional configurations of the serial audio interface CODEC master slave supported protocol LFS (Long Frame Sync) LFS, LFS Optimization and SFS (Short Frame Sync) By default the Serial Audio Interface operates in slave, SFS mode. In slave mode the user needs to generate the signals BLCK, FSYNC and supply to the CODEC. In master mode the CODEC generates the BLCK and FSYNC signals. In that case the BLCK operates at 32 times the frequency of FSYNC. The CODEC master mode can be used with the LFS protocol only. The register J is used for the different setups of the serial audio interface. © Semtech 2005 www.semtech.com 8 XE3005/XE3006 2.1.7 Serial Peripheral Interface - SPI The SPI interface is used to control register values. It is a serial communications interface that is independent of the rest of the CODEC. It allows the device to communicate synchronously with a microprocessor or DSP. The CODEC interface only implements a slave controller. A detailed description can be found in chapter 3.3. 2.1.8 Sandman™ ADC Function The Sandman™ function monitors the signals, which are processed in the ADC signal channel and the DAC signal channel. The logic output signal SMAD indicates whether the ADC signal channel has processed an audio signal or only noise, and for how long. The reference signal amplitude can be selected through register O, the time window parameters are the off time and on time (registers L, M and N). AIN Amp. Σ∆ modulator Serial Audio Interface FSYNC BCLK SDO Decimator Sandman Interface SMAD Figure 8: Implementation of the Sandman function for the ADC (SMAD) The logic output SMAD can be used to power-down or reduce clock speed in other devices in the application, such as a microcontroller, DSP or wireless link. Also, SMAD can be used as phone pick-up indicator. The Sandman™ function is illustrated in Figure 9 and is valid for both SMAD (related to the ADC signal) and SMDA (related to the DAC signal). Initially, SMAD is inactive (low), which means that “noise” is processed by the ADC, i.e. no audio signal amplitude above the Reference. The Sandman™ Interface compares every output sample of the ADC signal channel to the Reference value. If the signal is lower than the Reference value, SMAD remains inactive (low). As soon as the signal passes the reference (time = 1), the on-time counter is started. (for the moment defined by time=’x’ see Figure 9). However, as the signal returns below the reference (time = 2) before the on-time counter has reached the on time, the on-time counter is reset and the SMAD signal remains inactive (low). The next time the signal gets higher than the Reference (time = 3), the on-time counter is started again and when it reaches the on time, the SMAD signal becomes active (high), indicating that an audio signal is present (time = 4). As long as the signal remains above the Reference, nothing happens and the SMAD signal remains active (high). When the signal falls below the Reference (time = 5), the off-time counter is started, but as it does not reach the off time before the signal passes again the Reference (time = 6), SMAD remains active (high). Also during the period from time = 7 to time = 8, the off time counter does not reach the off time. When the signal falls below the Reference (time = 9) and remains below the Reference until the off-time counter has reached the off-time, the SMAD signal is changed into the inactive (low) state (time = 10). © Semtech 2005 www.semtech.com 9 XE3005/XE3006 2.1.9 Sandman™ DAC Function The Sandman™ function monitors the signals, which are processed in the ADC signal, channel and the DAC signal channel. The logic output signal SMDA indicates whether the DAC signal channel processes an audio signal or only noise, and this for certain duration. The reference signal amplitude can be selected through register P, the time window parameters are the off time and on time (registers L, M and N). Reg I, bit 4 Sandman Interface SMDA VDDPA FSYNC BCLK PWM DAC Serial Audio Interface Power amplifier AOUTP AOUTN SDI VSSPA Figure 9: Implementation of the Sandman function for the DAC (SMDA) The logic output SMDA can be employed to power-down other devices in the application, such as an external audio power amplifier. By setting bit 4 in register I, the on-chip DAC signal channel can be powered-down through SMDA too. The Sandman™ function is illustrated in Figure 9 and is valid for both SMAD (related to the ADC signal) and SMDA (related to the DAC signal). AIN/SDO (AOUT/SDI) + reference - reference On-time counter Time step = 1/fs = 1/FSYNC Off-time counter on-time off-time SMAD (SMDA) 1 2 3 4 5 6 7 8 9 10 time Figure 10: Illustration of the Sandman™ function. © Semtech 2005 www.semtech.com 10 XE3005/XE3006 The above illustration is valid for either the SMAD output as a result of AIN/SDO or for the SMDA output as a function of AOUT/SDI. 2.1.10 Start-up and Initialization The CODEC generates its own power on reset signal after a power supply is connected to the VDD pin. The reset signal is made available for the user at the pin NRESET. The rising edge of the NRESET indicates that the startup sequence of the CODEC has finished. In most applications the NRESET pin can be left open. The NRESET signal generated by the CODEC is used to initialize the various blocks in the device and guarantees a correct start-up of the circuit. The start-up sequence that is automatically carried out upon power-up of the device is listed below and illustrated in Figure 10. 1. NRESET is low (0V) when the device is not powered and remains low for a short time when VDD (upper curve in Figure 10) is applied. The low state sustains while VDD, VREG16, VREF are stabilizing. 2. As soon as the MCLK signal is present, a counter is activated that counts 221 periods of the MCLK. After this moment the NRESET is in the high state (VDD). VDD = 1.8..3.3V VREG16 = 1.6V VREF = 1.2V time ... MCLK 977 ms (MCLK=2.048KHz) NRESET main reset Figure 11: Startup sequence and NRESET signal after power-on. The user can use the NRESET pin in 3 different ways and combinations: © Semtech 2005 www.semtech.com 11 XE3005/XE3006 1. Leave the NRESET pin not connected. In this case the CODEC will startup as described in figure 10. 2. Use the NRESET pin as an output to indicate, to e.g. a microcontroller, that the CODEC finished its power up sequence and that the CODEC is ready to operate. 3. Use the NRESET pin to force a re-initialization of the registers to their default values. In this case the user has to force the NRESET to 0V for at least 32 periods of the MCLK. The circuit which forces the NRESET to 0V should be able to sink at least 50 uA. Figure 12 shows the block diagram of the CODEC reset. reset to analog and digital circuitry of codec Power On Reset delay delay counter MCLK XE3005/6 NRESET low drive buffer Figure 12: Codec reset circuitry 2.2 2.2.1 POWER-DOWN FUNCTIONS Software Power-Down Register I allows for the selective power down of the ADC signal channel or the DAC signal channel through SPI control. The wake-up time, after powering down the device is typically 200µs. The maximum standby current is 96µA, depending highly upon the Master clock (MCLK), see 5.3.5.2 Low Power Modes. 2.2.2 Hardware Power-Down The device has no power-down pin. However, by holding down (0 V) the NRESET pin (resetting the device) as well as the pins MCLK, BCLK and FSYNC, the power consumption will reach the standby current of typically 16µA. Use the standard procedure for power up (see start-up and initialization procedure) after a hardware power down and apply your registers setup procedure. © Semtech 2005 www.semtech.com 12 XE3005/XE3006 3 SERIAL COMMUNICATIONS 3.1 SERIAL AUDIO INTERFACE The Serial Audio Interface is a 4-wire interface for bi-directional communication of audio data. The 4 terminals are listed below: • • BCLK: FSYNC: • • SDI: SDO: Bit serial clock, one clock cycle corresponds to one data bit transmitted or received. Frame Synchronization. This signal indicates the start of a data word. The frequency of the FSYNC corresponds to the sample frequency of the CODEC. Serial Data In, data received from external device and sent to DAC. Serial Data Out, data received from ADC and sent to external device. The same clock (BCLK) and synchronization (FSYNC) signals are used for both sending and receiving. The synchronization signal FSYNC must have a fixed ratio with the master clock signal MCLK. The Serial Audio Interface supports two formats that are commonly used for audio/voice CODECs and that are referred to as SFS (Short Frame Synchronization) and LFS (Long Frame Synchronization). Data can be transmitted and received in 2 channels. Which channel is selected depends on the programmed values in the registers. The two interface protocols are shown below. channel 2, no data channel 1, sample n FSYNC channel 1, sample n+1 BCLK SDI n15 n14 n0 - - - n+115 SDO n15 n14 n0 - - - n+115 msb msb lsb Figure 13: Audio interface timing LFS mode, channel 1 channel 1, sample n FSYNC channel 1, sample n+1 channel 2, sample n BCLK SDI n15 n14 n0 - - - n+115 SDO n15 n14 n0 - - - n+115 msb msb lsb Figure 14: Audio interface timing in SFS mode, channel 1 © Semtech 2005 www.semtech.com 13 XE3005/XE3006 SDI Data should be changed on the rising edge of BCLK. The SDI data will be read by the CODEC on the falling edge of BLCK. SDO data will change on the rising edge of the BCLK. The SDO data should be read on the falling edge of the BLCK. Each rising edge of the FSYNC indicates the start of a new sample. 3.1.1 LFS Optimization For transmitting and receiving, 32 clock cycles in one frame are always required (figure 12 and 13). This is even the case when only 16 bits have to be sent or received. In most cases this can be handled easily with a DSP and microcontroller. If the user wants to send a minimum of BLCK cycles, it is possible to shorten channel 1 (channel 2 can not be shortened). In the LFS mode the possibility exists to shorten the number of BLCK cycles to 17 instead of 32. In this case the data is transmitted and received in channel 2. Channel 1 is shortened to one BLCK cycle only. Note! This optimization is possible in slave mode only. The figure 15 shows this special LFS mode. channel 1, no data channel 1, no data channel 2, sample n+1 channel 2, sample n FSYNC BCLK SDI - n15 n14 SDO - n15 n14 n0 n0 lsb msb - n15 n14 - n15 n14 msb Figure 15: Audio interface timing in LFS mode, 17 BLCK cycles, channel 2 3.2 REGISTER PROGRAMMING The control registers define the configuration of the CODEC and define the various modes of operation. During power-up, all registers will be configured with default values. The control register set consists of 16 registers. A detailed description is provided chapter 7. The control registers can be changed in the two following ways: 1. Logic values at SPI pins during power-up There are 3 bits inside the registers which are configured depending on the logic values of the pins SS, SCK and MOSI during the power up startup sequence as described in section 2.1.10 Value at power up SS = 1 SS = 0 SCK = 0 SCK = 1 MOSI = 0 MOSI = 1 Influenced bits of registers Register I(0)=0 Register I(0)=1 Register J(0)=1 Register J(0)=0 Register E(2) = 0 Register E(2) = 1 © Semtech 2005 comments MCLKDIV division by 1 MCLKDIV division by 2 SFS protocol LFS protocol preamplifier gain x5 preamplifier gain x20 www.semtech.com 14 XE3005/XE3006 Using the SPI pins at startup the user is able to configure the CODEC in the corresponding setups without reprogramming through the SPI interface and protocol. In best case the SPI interface can then be completely omitted and the 3 SPI pins can be fixed to ‘0’ or ‘1’. 2. Programming through SPI interface after power-up Once the device has been powered up, the configuration registers can be modified at all times (also when the device is active) through the SPI interface. The following section describes the SPI protocol which is required to change the control registers from their default values. 3.3 SERIAL PERIPHERAL INTERFACE - SPI The serial peripheral interface (SPI) allows the device to communicate synchronously with other devices such as a microprocessor or a DSP. The CODEC interface only implements a slave controller. This section describes the communication from master (e.g. DSP) to slave (CODEC pin MOSI) and from slave (CODEC pin MISO) to a master (e.g. DSP). Four lines are used to transmit data between the slave and master: - MOSI (Master Out, Slave In) data from master to slave, synchronous with the SPI clock (SCK). - MISO (Master In, Slave Out) data from slave to master, synchronous with the SPI clock (SCK). - SCK (Serial Clock) synchronizes the data bits of MOSI and MISO. - SS (Slave Select) Slave devices are selected by activating SS. 3.3.1 Protocol During SPI communication, data is simultaneously transmitted and received. trecovery 1/Fsck tdisable SS SCK MOSI 15 14 … … 1 0 MISO 15 14 … … 1 0 Figure 16: SPI signal timing The master puts data on the MOSI line on the falling edge of SCK; the slave reads the data on the rising edge of SCK. The slave puts data on the MISO line on the falling edge of SCK; the master reads the data on the rising edge of SCK. Transmission in either direction is by 2 bytes with MSB first. The SS pin should be kept low during the whole transfer of data. There are three timing constraints: - Recovery time (t recovery) between the falling edge of SS and the falling edge of SCK. © Semtech 2005 www.semtech.com 15 XE3005/XE3006 - Disable time (t disable) between the last rising edge of SCK and the rising edge of SS. SCK frequency (FSCK) Delay t recover t disable F SCK 3.3.2 Min 125 2 x Tmaster Max 0.5 x Fmaster Unit ns ns Hz Comments Tmaster = clock period of the master clock MCLK Fmaster = frequency of the master clock MCLK SPI Interface Modes There are two SPI modes: read and write. 3.3.2.1 Read Mode Read communication always takes place in pairs of bytes. A read request of 2 bytes is sent on the MOSI line. The content of the addressed register, one byte, is dumped on the MISO line during the transmission of the second byte on the MOSI. The formats of one byte are the following: bit mosi 7 1 6 1 5 0 4 msb 3 2 A (4:0) 1 bit miso 7 msb 6 5 4 3 2 1 0 lsb 0 lsb D(7:0) ss sck mosi 1 1 0 A4 A3 A2 A1 A0 1 0 1 request (read <address A(4:0)>) msb miso lsb read data D(7:0) of address A(4:0) Figure 17: SPI signal timing in read mode 3.3.2.2 Write Mode Write communication always takes place in pairs of bytes. The format of the 2 bytes is: Bit mosi 7 1 6 0 5 0 4 msb 3 2 A(4:0) 1 0 lsb Bit mosi 7 msb 6 5 4 3 2 1 0 lsb D(7:0) © Semtech 2005 www.semtech.com 16 XE3005/XE3006 ss sck mosi 1 0 0 A4 A3 A2 A1 A0 lsb msb write data D(7:0) to address A(4:0) request (write to address A(4:0)) Figure 18: SPI signal timing in write mode 4 SANDMAN™ FUNCTION (XE3006) The Sandman™ function analyzes the audio signals in the ADC and DAC. Its output signals indicate whether an audio signal is present in the ADC or DAC or if the processed signal is just noise. The threshold or reference value between noise and audio signal as well as the minimum duration of an audio signal is user-programmable through the SPI interface. If the XE3006 CODEC is used in a system that includes a microcontroller, a DSP or an RF link, the outputs of the Sandman™ Interface can be used to bring these devices into standby or sleep mode whenever no audio signal is being processed. In this way, the Sandman™ function contributes to significant additional power savings on the system level outside the XE3006 chip. The Sandman™ Interface consists of 2 digital outputs: • The SMAD detects whether the ADC processes an audio signal. The calculation is made with the digital data leaving the ADC. • The SMDA detects whether an audio signal is processed by the DAC. The calculation is made with the digital data entering through the Audio Interface. The Sandman™ Interface is implemented for the ADC and for the DAC in an identical way. It works with a set of 4 userdefined parameters: off time, on-time, ADC-reference and DAC-reference. The on time and the off time are the same for ADC and DAC. However, the reference values for the ADC and the DAC are adjusted separately, as indicated in the table below. Input parameters Off-time1(7:0) Off-time2(15:8) On-time(7:0) ADC_reference(7:0) DAC_reference(7:0) Register L M N O P Sandman ADC X X X X - Sandman DAC X X X X The Sandman™ Interface (for the ADC as well as for the DAC) is configured with three parameters: • Reference (7:0): Absolute value under which the signal is considered noise and above which the signal is considered to be an audio signal. The Sandman™ function is disabled (SMAD or SMDA at logic 1) if this parameter is zero. The ADC and the DAC have separate Reference values. • Off-time (15:0): Time until power down. The number of sequential samples that have to be lower than the Reference for the power down signal to become active. The Sandman™ function is disabled (SMAD or SMDA at logic 1) if this parameter is zero. The ADC and DAC have one common Off-time value. © Semtech 2005 www.semtech.com 17 XE3005/XE3006 • On-time (7:0): Time until wakeup. The number of sequential samples that have to be higher than the Reference for the power down signal to become inactive. The Sandman™ function is disabled (SMAD or SMDA at logic 1) if this parameter is zero. The ADC and DAC have one common On-time value. All these parameters are set in the registers L, M, N, O and P. Reference(7:0) 0 don’t care don’t care 1.-.255 corresponds to 128.-.32640 On-time(7:0) don’t care 0 don’t care 1.-.255 corresponds to 50 µs – 12 ms Off-time(15:0) don’t care don’t care 0 1 - 65535 corresponds to 50 µs - 3.2 sec Sandman (SMAD or SMDA) logic 1 (disable function) logic 1 (disable function) logic 1 (disable function) logic 1 (signal higher than ref) logic 0 (signal lower than ref) Comments Sandman disable Sandman disable Sandman disable all registers ≠ zero time for FSYNC = 20kHz The reference (7:0) value is related to the absolute value of the 16 bits input signal. The following format is used for the comparison: • 16 bit inputs data (2’s-complement) : 0111’1111’1111’1111 = 0x7FFF • 8 bit reference (unsigned) : 0111’1111’1000’0000 = 0xFF00/2 max positive value reference max So the reference is compared to the 8 most significant bits of the absolute value of the input signal: reference(7:0) 0 1 2 M 255 Absolute reference 0 128 256 M 255 × 128 = 32640 AIN (mV) if gain = 4 0.00 1.10 2.20 M 280 AIN (mV) if gain = 20 0.00 0.27 0.55 M 70 The values in this table are amplitude values, RMS values can be derived by dividing the numbers by √2. The working mechanism of the Sandman™ function is the following: The incoming data is compared to the reference after each time step (1/FSYNC = 50µs if FSYNC = 20kHz). • During the On-time phase If the input data is higher than the reference, a counter will be incremented otherwise the counter is reset. When the counter reaches the On-time value, then the SMAD or SMDA signal is activated (high level). • During the Off-time phase If the input data is lower than the reference, a counter will be incremented otherwise the counter is reset. When the counter reaches the Off-time value, then the SMAD or SMDA signal is deactivated (low level). In a first approximation, the following points are recommended: • On-time at least 1ms. If the On-time is shorter than 1 ms, the Sandman™ function becomes sensitive to spikes in the audio input signal AIN. • Off-time at least 10ms, the Off-time should be longer than 1/fmin = 10ms, (code = 200). fmin is the minimum audio frequency = 100Hz if FSYNC = 20kHz. The value of fmin scales proportionally with the sampling frequency FSYNC. A high-pass filter in the ADC filters out signals below 100Hz. • Reference should be adjusted just above the noise level. © Semtech 2005 www.semtech.com 18 XE3005/XE3006 The CODEC bandwidth is around 100 Hz to 10 kHz at the nominal system frequency settings (MCLK = 5 MHz, CKDIV = 1, FSYNC = 20 kHz). In digital loop back mode, the data entering into the Audio Interface is not transferred to the DAC. However, the Sandman™ function (if activated) continues to output the SMDA signal based on the data entered into the Audio Interface (input terminal SDI). 5 5.1 SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS Stresses above those listed in the following table may cause permanent failure. Exposure to absolute ratings for extended periods may affect device reliability. The values are in accordance with the Absolute Maximum Rating System (IEC 134). All voltages are referenced to ground (VSSA and VSSD). Analog and digital grounds are equal (VSSA = VSSD). Symbol Parameter Conditions Min Max Unit VDD Supply voltage -0.3 3.65 V Tstg Storage temperature -65 150 °C TA Operating free-air temperature, TA -20 70 °C Ves Electrostatic discharge protection 1) 500 V Ilus Static latchup current 2) 10 98 mA Vlud Dynamic latchup voltage 2) 50 V 1) Tested according MIL883C Method 3015.6, class JEDEC 1B (Standardized Human Body Model: 100 pF, 1500 Ω, 3 pulses, protection related to substrate). 2) Static and dynamic latchup values are valid at 27 °C. 5.2 RECOMMENDED OPERATING CONDITIONS All voltages referenced to ground (VSSA and VSSD). Min Typ Max Unit 1.8 3.0 3.6 V Analog signal peak input voltage, AIN (gain = 20x) 65 mV Analog signal peak input voltage, AIN (gain = 5x) 270 mV Supply voltage, VDD Differential output load resistance 16 Master clock frequency 32 1.024 ADC or DAC conversion rate 20 Operating free-air temperature, TA -20 © Semtech 2005 Ohm 33 MHz 48 kHz 70 °C www.semtech.com 19 XE3005/XE3006 5.3 ELECTRICAL CHARACTERISTICS The operating conditions in this section are: VDD = 3.0 V, T = 25°C. 5.3.1 Digital Inputs and Outputs, FSYNC = 20 kHz, output not loaded Test Conditions Min VOH High-level output voltage, DOUT IO = -360uA VOL Low-level output voltage, DOUT IO = 2mA Parameter Typ Max Unit 2.4 VDD+0.5 V VSSD-0.5 0.4 V IIH High-level input current, any digital input VIH = 3.3 V 10 uA IIL Low-level input current, any digital input VIL = 0.6 V 10 uA Ci Input capacitance 10 pF Co Output capacitance 10 pF Max Unit 5.3.2 ADC Dynamic Performance, FSYNC = 20 kHz Parameter SNR Signal-to-noise ratio Test Conditions Min Typ Pre-amp gain = 5x Vin=250mV (full scale) 72 78 dB 0.5 % THD Total harmonic distortion 1⁄4 full scale Flo Low cut-off frequency (-3 dB), See Note 1 FSYNC = 20 kHz Fhi High cut-off frequency (-3 dB), See Note 2 FSYNC = 20 kHz GD Group delay FSYNC = 20 kHz 60 70 80 10 Hz kHz 150 us Max Unit Note 1) Flo is proportional to FSYNC Note 2) Fhi equals FSYNC/2 5.3.3 ADC Channel Characteristics, FSYNC = 20 kHz Parameter Vip Peak input voltage (single ended) Vneq Equivalent input noise Dynamic range PSRR Power supply rejection ratio, input referred Cin Input capacitor Rin Eg Input resistance VIN – VSSA gain error offset error input noise Integral non linearity INL DNL Differential non linearity Test Conditions Min Typ Pre-amp gain = 5x 270 Pre-amp gain = 20x 65 A-weighted, 100 Hz-10 kHz pre-amp gain = 5x A-weighted, 100 Hz-10 kHz pre-amp gain = 20x Pre-amp gain = 5x Vin=250mV (full scale) 20 mV µV rms 5 72 Up to 1 kHz Preamp-gain = 5x Preamp gain = 20x 78 dB 60 50 200 dB 1 pF VDD 1.8-3.3V VDD 1.8-3.3V VDD 1.8-3.3V VDD 1.8-3.3V +/- 0.1 -60 6.7 +/- 5 MOhm [%] LSB LSB LSB VDD 1.8-3.3V +/- 0.1 LSB © Semtech 2005 www.semtech.com 20 XE3005/XE3006 5.3.4 DAC Dynamic Performance, load is an LC filter at 10 kHz FSYNC = 20 kHz, MCLK = 5 MHz, for info on the LC filter see chapter 6, Application Information. Parameter Test Conditions Min Typ SNR Signal-to-noise ratio Bandwidth 10 kHz THD Total harmonic distortion GD 5.3.5 72 1⁄4 full scale Dynamic range Bandwidth 10 kHz Group delay FSYNC = 20 kHz 72 Max Unit 78 dB 0.5 % 78 dB 150 µs Max Unit Power Supply 5.3.5.1 Regulated supply characteristics @ T = 25°C Test Conditions 1µF capacitor 390 kΩ resistor Parameter VREF reference Voltage Min Typ 1.2 V V VREG11 regulated Voltage 1.1V 1.1 I_vreg11 available current 35 50 µA R_vreg11 output impedance 1 1.5 kOhm VREG16 regulated Voltage 1.6V I_vreg16 available output current VREF PSRR 1µF capacitor 1.5 1.6 V 1 mA power supply rejection ratio, input referred up to 1 kHz 60 dB VREG11 PSRR power supply rejection ratio, input referred up to 1 kHz 60 dB VREG16 PSRR power supply rejection ratio, input referred up to 1 kHz 40 dB 5.3.5.2 Low power mode Stand-by mode @ VDD = 3.0V, T = 25°C Parameter Test Conditions Min Typ Max Unit 28 56 µA Istb1 Supply current in standby mode ADC off, DAC off MCLK = 5 MHz, Istb2 Supply current in standby mode ADC off, DAC off MCLK = 12.2880 MHz 48 96 µA Istb3 Supply current in standby mode NRESET mode MCLK = 0 20 40 µA Typ Max Unit 25 50 µA 31 62 µA 16 32 µA Stand-by mode @ VDD = 1.8V, T = 25°C Parameter Istb1 Supply current in standby mode Istb2 Supply current in standby mode Istb3 Supply current in standby mode Test Conditions ADC off, DAC off MCLK = 5 MHz, ADC off, DAC off MCLK = 12.2880 MHz NRESET mode MCLK = 0 © Semtech 2005 Min www.semtech.com 21 XE3005/XE3006 5.3.5.3 Normal operation, output load consumption is not included. Normal operations @ VDD = 3.0V, FSYNC = 20 kHz, T = 25°C, Register C(7:0) = 0xF0 Parameter IDD Supply current CODEC IADC Supply current ADC IDAC Supply current DAC Test Conditions Min ADC on, DAC on FSYNC = 20 kHz, no load ADC on, DAC off FSYNC = 20 kHz, no load ADC off, DAC on FSYNC = 20 kHz, no load Typ Max Unit 350 700 µA 240 480 µA 120 240 µA Typ Max Unit 860 1720 µA 600 1200 µA 280 560 µA Typ Max Unit 250 500 µA 200 400 µA 65 130 µA Typ Max Unit 625 1250 µA 505 1010 µA 140 280 µA Normal operations @ VDD = 3.0V, FSYNC = 48 kHz, T = 25°C, Register C(7:0) = 0xC4 Parameter IDD Supply current CODEC IADC Supply current ADC IDAC Supply current DAC Test Conditions Min ADC on, DAC on FSYNC = 48 kHz, no load ADC on, DAC off FSYNC = 48 kHz, no load ADC off, DAC on FSYNC = 48 kHz, no load Normal operations @ VDD = 1.8V, FSYNC = 20 kHz, T = 25°C, Register C(7:0) = 0xF0 Parameter IDD Supply current CODEC IADC Supply current ADC IDAC Supply current DAC Test Conditions Min ADC on, DAC on FSYNC = 20 kHz, no load ADC on, DAC off FSYNC = 20 kHz, no load ADC off, DAC on FSYNC = 20 kHz, no load Normal operations @ VDD = 1.8V, FSYNC = 48 kHz, T = 25°C, Register C(7:0) = 0xC4 Parameter IDD Supply current CODEC IADC Supply current ADC IDAC Supply current DAC Test Conditions ADC on, DAC on FSYNC = 48 kHz, no load ADC on, DAC off FSYNC = 48 kHz, no load ADC off, DAC on FSYNC = 48 kHz, no load © Semtech 2005 Min www.semtech.com 22 XE3005/XE3006 5.3.6 Timing Requirements of serial audio interface Ref. No. * Characteristics Test Conditions Min Typ Max Unit 1024 5.12 33 MHz 55 % 1 Master Clock Frequency for MCLK = 1/ T 1 MCLK Duty Cycle 2 Rise Time for All Digital Signals 10 ns 3 Fall Time for All Digital Signals 10 ns 4 Hold time BCLK or FSYNC high after MCLK low 5 Setup time BCLK or FSYNC high to MCLK low 45 CLoad = 10pF T/4 ns T/4 ns T/4 ns T/4 ns 6 Hold time BCLK or FSYNC low after MCLK low 7 Setup time BCLK or FSYNC low to MCLK low 8 Bit Clock Frequency for BCLK = 1 / TBCLK 9 Setup time data input SDI to BCLK low TBCLK/4 ns 10 Hold time data input SDI after BCLK low TBCLK/4 ns 11 Delay time SDO valid after BCLK high 12 Setup time data input FSYNC to BCLK low TBCLK/4 ns 13 Hold time data input FSYNC after BCLK low TBCLK/4 ns 32xFSYNC MCLK/2 TBCLK/4 MHz ns *see figure 18,19 for LFS and 20, 21 for SFS © Semtech 2005 www.semtech.com 23 XE3005/XE3006 5.3.6.1 Timing diagram of the serial audio interface – LFS mode 1 2 3 MCLK 5 7 BCLK 7 6 4 6 FSYNC SDI Figure 18: LFS, timing diagram MCLK 8 BCLK 11 9 FSYNC 10 SDI D15 D14 D13 D12 SDO D15 D14 D13 D12 D11 D11 D10 D10 D9 D9 D8 D8 D7 D7 D6 D6 D5 D5 D4 D4 D3 D3 D2 D2 D1 D1 D0 D0 Figure 19: LFS, zoom timing diagram © Semtech 2005 www.semtech.com 24 XE3005/XE3006 5.3.6.2 Timing diagram of the serial audio interface – SFS mode 1 2 3 MCLK 6 5 4 7 BCLK FSYNC SDI Figure 20: SFS, timing diagram MCLK 8 BCLK 12 FSYNC 9 13 11 10 SDI D15 D14 D13 D12 SDO D15 D14 D13 D12 D11 D11 D10 D10 D9 D9 D8 D8 D7 D7 D6 D5 D6 D5 D4 D4 D3 D3 D2 D2 D1 D1 D0 D0 Figure 21: SFS zoom timing diagram © Semtech 2005 www.semtech.com 25 XE3005/XE3006 5.3.7 Timing Requirements of the Serial Peripheral Interface Characteristics 1 Serial Clock Frequency for SCK = 1 / TSCK MCLK Duty Cycle 1 Recovery Time 2 Disable Time 3 Setup time MISO valid to SCK high 4 Hold time MISO valid after SCK high 5 Delay time MOSI valid after SCK low 6 * see figure 22 Ref. No.* SS 2 Test Conditions CLoad = 10pF Min Typ 45 125 2T TSCK/4 TSCK/4 TSCK/4 Max MCLK/2 55 Unit MHz % ns ns ns ns ns 3 1 4 SCK 5 MISO M2 M1 M0 A4 6 A3 A2 A1 A0 MOSI D7 D7 D6 D6 D5 D5 D4 D4 D3 D3 D2 D2 D1 D1 D0 D0 Figure 22: Serial Peripheral Interface timing © Semtech 2005 www.semtech.com 26 XE3005/XE3006 6 APPLICATION INFORMATION 6.1 APPLICATION SCHEMATICS – XE3006 6.1.1 Typical Application schematic Sandman output Master Clock 0.1µF 1µF 1µF MCLK MOSI 24 2 SMAD SS 23 3 SMDA SCK 22 4 VDD MISO 21 5 NRESET SDI 20 6 VSSA SDO 19 7 VREG16 BCLK 18 8 VREF 9 VSSA 10 XE3006 Vcc 1 FSYNC 17 AOUTP 16 VSSD VDDPA 15 11 VREG11 AOUTN 14 12 AIN VSSPA 13 390kΩ SPI Serial Audio Interface R L Vcc 2µ2F 4µ7F L R L=680µH R=56Ω lowpass filter, Bluetooth™ voice application MCLK = 2.048 MHz, div_factor =1 GND Figure 23: Typical Application with 3rd order LC output Filter 6.1.2 External components required for optimal performances The following minimum set-up of external components is required: • • • Capacitor for Vref: 1 µF Resistor for Vref: 390 kΩ Capacitor for VREG16: 1 µF The low pass filter between the DAC output and the speaker depends on the CODEC settings and the speaker type. © Semtech 2005 www.semtech.com 27 XE3005/XE3006 7 7.1 REGISTER DESCRIPTION REGISTER FUNCTIONAL SUMMARY The following registers can be programmed by the SPI to configure the operation modes. See also section 3.2 Register Programming. Name Register C Register E Register I Register J Register L Register M Register N Register O Register P Description ADC current setting. The data in this register has the following functions: • Adjust the ADC current for FSYNC > 20kHz • 0xF0 for FSYNC<= 20 kHz, 0xC4 for FSYNC > 20 kHz. Analog Input. The data in this register has the following functions: • Enable/disable microphone bias source of 1.1 V • Gain setting of pre-amplifier. Function enable and clock division. The data in this register has the following functions: • Enable/disable Sandman function of DAC • Enable/disable DAC channel (DAC, power amplifier) • Enable/disable ADC channel (pre-amplifier, ADC, decimation filter) • Division of master clock Audio Interface Configuration. The data in this register has the following functions: • Enable/disable digital loopback • Channel select receive • Select master / slave mode • Output impedance • Channel select transmit • Select short / long frame sync Sandman™ function, Off-time, low byte. The data in this register has the following function: • Define Off-time (low byte) of the Sandman™ function Sandman™ function, Off-time, high byte. The data in this register has the following function: • Define Off-time (high byte) of the Sandman™ function Sandman™ function, On-time. The data in this register has the following function: • Define On-time of the Sandman™ function Sandman™ function, reference for ADC. The data in this register has the following function: • Define reference amplitude for ADC for Sandman™ function Sandman™ function, reference for DAC. The data in this register has the following function: • Define reference amplitude for DAC for Sandman™ function © Semtech 2005 www.semtech.com 28 XE3005/XE3006 7.2 REGISTER DEFINITIONS The complete register setup consists of 24 registers of 8 bits each, as shown in the table below. All registers are preconfigured with the default values and do not have to be programmed by the user if no changes in the setup are required. The registers C, E, I and J can be used to configure the XE3005 and XE3006 differently than the default setup. The registers L, M, N, O and P are related to the Sandman™ function available in the XE3006. Register A Address (hex) 0x00 Name Reserved Default value (hex) 0x48 B 0x01 Reserved 0x8F C 0x02 ADC current 0xF0 D 0x03 Reserved 0x00 E 0x04 Analog input F 0x05 Reserved 0x82 0x08/0x0C G 0x06 Reserved 0x00 H 0x07 Reserved 0x00 I 0x08 Block on/off and clock division 0x00/0x01 J 0x09 Audio interface configuration 0x25/0x24 K 0x0A Reserved 0x00 L 0x0B Sandman™ function, off-time byte 1 0x00 M 0x0C Sandman™ function, off-time byte 2 0x00 N 0x0D Sandman™ function, on-time 0x00 O 0x0E Sandman™ function, reference for ADC 0x00 P 0x0F Sandman™ function, reference for DAC 0x00 © Semtech 2005 www.semtech.com 29 XE3005/XE3006 Register C (7:0) address 0x02 7:0 ADC current ADC current Default value: 0xF0 0xF0 Register E (7:0) address 0x04 7 ADC input Default value 0x08/0x0C 0 6:3 2 reserved PREAMP_ GAIN VMIC_EN 0001 0 or 1 Description 0xF0 for FSYNC<= 20 kHz, 0xC4 for FSYNC > 20 kHz. Description Generation of the microphone supply at pin VREG11: 1: enables VREG11 0: disables VREG11 reserved Gain of preamplifier: 0: 5x (270 mV peak) 1: 20x (65 mV peak) The default is depending on the logic value of the pin MOSI during startup (see section 3.2) MOSI=0, default will be set to 0 MOSI=1, default will be set to 1 1:0 reserved 00 reserved Register I (7:0) address 0x08 7:4 3 block on/off and clock division EN_DAC Default value 0x00/0x01 0000 0 2 EN_ADC 0 1:0 MCLKDIV 00 or 01 Description reserved 0: enable 1: disable DA converter (DAC + PA) 0: enable 1: disable AD converter (Preamp + ADC + decimator) Division factor of the master clock: 00: 1 01: 2 10: reserved 11: 4 The default is depending on the logic value of the pin SS during startup (see Section 3.2) SS=0, default will be set to 1 SS=1, default will be set to 0 © Semtech 2005 www.semtech.com 30 XE3005/XE3006 Register J (7:0) address 0x09 Audio interface configuration Default value 0x25/ 0x24 0 7 LOOPBACK 6 RX_FIRST_ SECOND 0 5 4 reserved MASTER 1 0 3 SDO_HI_EN 0 2 TX_FIRST 1 1 TX_SECOND 0 0 PROTOCOL 0 or 1 Description 0: disable loopback, normal mode 1: enable loopback => The CODEC connects internally the ADC output to DAC input 0: Receive audio data in the first 16-bit channel after the frame synchronization. 1: Receive audio data in the second 16-bit channel after the frame synchronization. reserved 1: enable audio interface in master mode (only for LFS) 0: enable audio interface in slave mode (LFS, LFS Optimization or SFS) 0: SDO is continuously in output mode for both data channels. 1: SDO is in output mode when transmitting a channel with data (J(2) or J(1)=1). It is switched automatically into high-impedance state when a channel with no data is transmitted (J(2) or J(1)=0). 1: transmit the audio data in the first 16-bit channel after the frame synchronization. 0: do no transmit data in the first channel. 1: transmit the audio data in the second 16-bit channel after the frame synchronization. 0: do no transmit data in the second channel. 1: Short Frame Synchronization mode (slave mode). 0: Long Frame Synchronization mode (master or slave mode). The default is depending on the logic value of the pin SCK during startup (see Section 3.2) SCK=0, default will be set to 1 SCK=1, default will be set to 0 Register L (7:0) address 0x0B Sandman™ function, off-time, least significant byte SM_OFF_LSB Default value 0x00 Description 00000000 Least significant byte of the off-time of the Sandman™ function Default value 0x00 Description 7:0 Sandman™ function, off-time, most significant byte SM_OFF_MSB 00000000 Most significant byte of the off-time of the Sandman™ function Register N (7:0) address 0x0D 7:0 Sandman™ function, on-time SM_ON Default value 0x00 00000000 Description 7:0 Register M (7:0) address 0x0C © Semtech 2005 On-time of the Sandman™ function www.semtech.com 31 XE3005/XE3006 Register O (7:0) address 0x0E 7:0 Sandman™ function, reference for ADC SMAD_REF Default value 0x00 00000000 Description Register P (7:0) address 0x0F 7:0 Sandman™ function, reference for DAC SMDA _REF Default value 0x00 00000000 Description © Semtech 2005 Reference amplitude for ADC for Sandman™ function Reference amplitude for DAC for Sandman™ function www.semtech.com 32 XE3005/XE3006 8 MECHANICAL INFORMATION 8.1 XE3005 PACKAGE SIZE (TSSOP20) E D A X c HE y v M A Z 11 20 Q A2 A1 pin 1 index (A 3) A Lp L 1 1 0 detail X w M bp e DIMENSIONS (mm are the original dim ensions) UNIT A max. A1 A2 A3 bp c mm 1.10 0.15 0.05 0.95 0.80 0.25 0.30 0.19 0.2 0.1 D E 6.6 6.4 4.5 4.3 e HE L Lp Q v w y Z 0.65 6.6 6.2 1.0 0.75 0.50 0.4 0.3 0.2 0.13 0.1 0.5 0.2 o 8 0o Figure 24: TSSOP20 Plastic Thin Shrink Small Outline Package, 20 leads, body width: 4.4 mm © Semtech 2005 www.semtech.com 33 XE3005/XE3006 8.2 XE3005 PACKAGE SIZE (5X4 UCSP®) PACKAGE GE OUTLINE of the XE300 XE3005 uCSP ® SIDE VIEW XEMICS XE3005 5 TOP P VIEW BOTTOM VIEW Nominal dimensions sion in mm A A1 A2 b D D1 E E1 e1 e2 < 0.8 0.31 0.46 max 0.37 2.745 ± 0.075 1.95 3.225 ± 0.125 2.40 0.65 0.60 SD SE 0.325 0 ± 0.075 ± 0.125 Figure 25: 5x4 uCSP® Ultra Chip Scale Package, 5 x 4 balls array. © Semtech 2005 www.semtech.com 34 XE3005/XE3006 8.3 XE3006 PACKAGE SIZE (TSSOP24) D E A X c HE y v M A Z 13 24 Q A2 (A 3) A1 pin 1 index A Lp L 1 1 2 detail X w M bp e DIMENSIONS (mm are the origina l dimensions) UNIT A max. A1 A2 A3 bp c mm 1.10 0.15 0.05 0.95 0.80 0.25 0.30 0.19 0.2 0.1 D E 7.9 7.7 4.5 4.3 e HE L Lp Q v w y Z 0.65 6.6 6.2 1.0 0.75 0.50 0.4 0.3 0.2 0.13 0.1 0.5 0.2 8o 0o Figure 26: TSSOP24 Plastic Thin Shrink Small Outline Package with 24 leads and a body width of 4.4 mm. © Semtech 2005 www.semtech.com 35 XE3005/XE3006 9 XE3005 LAND PATTERN RECOMMENDATIONS (5X4 UCSP®) Ø 0.25 PAD Ø 0.25 PASTE_MASK SOLDER_MASK Ø 0.35 LAND PATTERN PATT RECOMMENDATION for the XE3005 uCSP ® PLACEMENT OUTLINE Nominal dimensions sion in mm D E e1 e2 SD SE 2.82 3.35 0.65 0.60 0.325 0 Figure 27: Land pattern recommendations (5x4 uCSP®) © Semtech 2005 www.semtech.com 36 XE3005/XE3006 © Semtech 2005 All rights reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. Semtech. assumes no responsibility or liability whatsoever for any failure or unexpected operation resulting from misuse, neglect improper installation, repair or improper handling or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified range. SEMTECH PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF SEMTECH PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE UNDERTAKEN SOLELY AT THE CUSTOMER’S OWN RISK. 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