Z-Power LED X10490 Technical Data Sheet Specification THB105-69 SSC Drawn Approval CUSTOMER Approval Rev. 00 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet CONTENTS 1. Absolute Maximum Ratings 2. Electro Characteristics 3. Outline Dimension 4. Electro-Optical characteristic Diagram 5. Rank Division 6. Packing 7. Soldering 8. Precaution for use Rev. 00 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet THB105-69 Description - Small size suitable for compact appliances. - Zener Diode for ESD - Surface-mounted chip LED device. - Pb-free and RoHS complaint THB105-69 Features • 1.6 (W) X 0.8 (D) X 0.4 (T) mm • Dominant Wavelength : 470nm component. - Tape and Reel packing. - Increases the life time of battery. Applications • Cellular phone’s keypad lightning • Other decoration lighting • Information Boards • Lighting for Small Size Device. Rev. 00 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 1. Absolute maximum ratings (Ta=25℃) Parameter Symbol Value Unit Power Dissipation Pd 64 ㎽ Forward Current IF 20 ㎃ Peak Forward Current IFM*1 50 ㎃ Reverse Voltage VR 5 V Operating Temperature Topr -35 ~ 85 ℃ Storage Temperature Tstg -40 ~ 100 ℃ *1 IFM conditions: Pulse width Tw≤0.1ms and Duty ratio≤1/10. 2. Electro-Optical Characteristics Parameter (Ta=25℃) Symbol Condition Min Typ Max VF IF=5㎃ 2.7 3.05 3.2 VFm IF=1㎂ 1.8 - 2.7 VF(Z) IF(Z)=10㎃ 0.6 0.8 1.5 V Luminous Intensity*2 IV IF=5㎃ 23 30 55 mcd Wavelength λD IF=5㎃ 465 470 475 ㎚ Spectral Bandwidth ∆λ IF=5㎃ - 25 - ㎚ Viewing angle*3 2θ1/2 IF=5㎃ - 120 - ˚ Forward Voltage Forward Zener Voltage Unit V *2 The luminous intensity IV is measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. *3 θ1/2 is the off-axis where the luminous intensity is 1/2 the peak intensity. ♦ Eelctrical Characteristics of the Zener Diode Parameter Condition Min Typ Max Unit VF IF=10㎃ - - 1.6 V IR VR=5V - - 1.0 ㎂ [Note] All products confirm to the listed minimum and maximum specifications for electric and optical characteristics, when operated at 20mA within the maximum ratings shown above. All measurements were made under the standardized environment of SSC. (Tolerance : Iv ±10 %, λD ±2 nm, VF ±0.1 V) Rev. 00 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) 0.12 0.3 ( Tolerance: ±0.1, Unit: mm ) Polarity Mark Cathode 1.1 1.2 Resin 1.6 PCB Anode 0.3 0.4 ±0.05 0.8 2.4 * Recommanded solder Pattern 0.8 Z-Power LED X10490 Technical Data Sheet 3.Outline Dimension 0.8 * MATERIALS PARTS MATERIALS Package BT_Resin Encapsulating Resin Epoxy Electrodes Au Plating Copper Alloy Rev. 00 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Forward Current vs. Forward Voltage (per die) Forward Current IF(mA) (Ta=25 OC ) 10 1 2.9 3.0 3.1 3.2 3.3 3.4 3.5 Forward Voltage VF(V) Relative Luminous Intensity vs Forward Current (Ta=25 OC ) 400 350 300 Relative Intensity IV [%] Z-Power LED X10490 Technical Data Sheet 4. Electro-Optical characteristic Diagram 250 200 150 100 50 0 5 10 15 20 Forward Current IF [mA] 25 30 Rev. 00 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) 25 20 Forward current IF(mA) Z-Power LED X10490 Technical Data Sheet Ambient Temperature vs. Allowable Forward Current 15 10 5 0 -25 0 25 50 75 100 Ambient temperature Ta(? ) Radiation Diagram (Ta=25 OC ) Rev. 00 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 5. Rank Division IV[mcd] VF[V] λD[nm] at IF=5[mA] at IF=5[mA] at IF=5[mA] 23~38(C) 2.6~2.8(B) 465 ~470(B) CBB 23~38(C) 2.8~3.0(C) 465 ~470(B) CCB 23~38(C) 3.0~3.2(D) 465 ~470(B) CDB 38~55(D) 2.6~2.8(B) 465 ~470(B) DBB 38~55(D) 2.8~3.0(C) 465 ~470(B) DCB 38~55(D) 3.0~3.2(D) 465 ~470(B) DDB 23~38(C) 2.6~2.8(B) 470 ~475 (C) CBC 23~38(C) 2.8~3.0(C) 470 ~475 (C) CCC 23~38(C) 3.0~3.2(D) 470 ~475 (C) CDC 38~55(D) 2.6~2.8(B) 470 ~475 (C) DBC 38~55(D) 2.8~3.0(C) 470 ~475 (C) DCC 38~55(D) 3.0~3.2(D) 470 ~475 (C) DDC BIN Rev. 00 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) ±0.1 0.5 ±0.08 4.0 ±0.1 0.95 ±0.05 ±0.2 8.0 ±0.05 3.5 ±0.05 0.2 1.75 2.0 ±0.05 +0.1 -0 ±0.05 1.5 ±0.1 0.5 (2.75) 4.0 1.85 ±0.05 11.4 180 +0 -3 9 ±0.3 +0.2 -0 2 ±0.2 60 Z-Power LED X10490 Technical Data Sheet 6. Packing 22 13 ±0.2 Label Tolerance: ±0.2, Unit: ㎜ (1) Quantity:4,000pcs./Reel (2) Cumulative Tolerance: Cumulative Tolerance/10pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape: Adhesion strength to be 0.1-0.7N when the over tape is turned off from the carrier tape at10˚angle to be the carrier tape. (4) Package: P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package. Rev. 00 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Reel # # # # # # # # # # : N / P ### 제품명 : SSC-THB105-69 # # # # # # # # # # o N t o L Z-Power LED X10490 Technical Data Sheet ● Reel Packing Structure 수량 : 4000 Aluminum Vinyl Bag # # # # # # # # # # : N / P ### 제품명 : SSC-THB105-69 # # # # # # # # # # o N t o L 수량 : 4000 Outer Box *Material: Paper(SW3B(B)) SIZE(mm) TYPE a 7inch 245 c TUV c b 220 142 CHIP LED MADE IN KOREA Acriche PART : SSC-THB105-69 CODE : Q'YT : 40,000EA Semiconductor EcoLight LOT NO : RoHS b a DATE : SEOUL SEMICONDUCTOR CO.,LTD Rev. 00 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 7. Soldering (1) Lead Solder Lead Solder Lead Solder 2.5~5 o C / sec. Pre-heat 120~150℃ Pre-heat time 120 sec. Max. Peak-Temperature 240℃ Max. Soldering time Condition 10 sec. Max. 2.5~5 C / sec. Pre-heating 120~150 oC 240 oC Max. 10 sec. Max. 60sec. Max. Above 200 oC 120sec. Max. (2) Lead-Free Solder Lead-frame Solder 1~5 o C / sec. Lead Free Solder Pre-heat 150~200℃ Pre-heat time 120 sec. Max. Peak-Temperature 260℃ Max. Soldering time Condition 10 sec. Max. 1~5 o C / sec. Pre-heating 150~200 o C 260 oC Max. 10 sec. Max. 60sec. Max. Above 220 oC 120sec. Max. (3) Hand Soldering conditions Do not exceed 3 seconds at maximum 280ºC under soldering iron. (4) The encapsulated material of the LEDs is silicone. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicone resign should be used. Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products. Rev. 00 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 8. Precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desiccator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5ºC ~30ºC Humidity : maximum 65%RH (2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; a. After opened and mounted the soldering shall be quickly. b. Keeping of a fraction Temperature : 5 ~ 40ºC Humidity : less than 30% (3) In the case of more than 1 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 60±5ºC. (4) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (5) Quick cooling shall be avoided. (6) Components shall not be mounted on warped direction of PCB. (7) Anti radioactive ray design is not considered for the products. (8) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (9) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (10) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. (11) The LEDs must be soldered within seven days after opening the moisture-proof packing. (12) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (13) The appearance and specifications of the product may be modified for improvement without notice. Rev. 00 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00)