SIPEX SP3222EHCT

®
SP3222EH/3232EH
3.3V, 460 Kbps RS-232 Transceivers
FEATURES
■ Meets true EIA/TIA-232-F Standards
from a +3.0V to +5.5V power supply
■ Interoperable with RS-232 down to +2.7V
power source
■ 1µA Low-Power Shutdown with Receivers
Active (SP3222EH)
■ Enhanced ESD Specifications:
+15kV Human Body Model
+15kV IEC1000-4-2 Air Discharge
+8kV IEC1000-4-2 Contact Discharge
■ 460Kbps Minimum Transmission Rate
■ Ideal for Handheld, Battery Operated
Applications
16 VCC
C1+ 1
V+ 2
15 GND
C1-
3
C2+
4
C2-
5
12 R1OUT
V-
6
11 T1IN
T2OUT
7
10
R2IN
8
9
14 T1OUT
SP3232EH 13 R1IN
T2IN
R2OUT
Now Available in Lead Free Packaging
DESCRIPTION
The SP3222EH and the 3232EH are 2 driver/2 receiver RS-232 transceiver solutions
intended for portable or hand-held applications such as notebook or palmtop computers.
Their data transmission rate of 460Kbps meeting the demands of high speed RS-232
applications. Both ICS have a high-efficiency, charge-pump power supply that requires only
0.1µF capacitors for 3.3V operation. The charge pump allows the SP3222EH and the 3232EH
series to deliver true RS-232 performance from a single power supply ranging from +3.3V
to +5.0V. The ESD tolerance of the SP3222EH/3232EH devices exceeds +15kV for both
Human Body Model and IEC1000-4-2 Air discharge test methods.
The SP3222EH device has a low-power shutdown mode where the devices' driver outputs
and charge pumps are disabled. During shutdown, the supply current is less than 1µA.
SELECTION TABLE
MODEL
Power Supplies
RS-232
Drivers
RS-232
Receivers
External
Components
Shutdown
TTL
3-State
No. of
Pins
SP3222EH
+3.0V to +5.5V
2
2
4
Yes
Yes
18, 20
SP3232EH
+3.0V to +5.5V
2
2
4
No
No
16
Date: 06/22/04
SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers
1
© Copyright 2004 Sipex Corporation
ABSOLUTE MAXIMUM RATINGS
Input Voltages
TxIN, EN .....................................................-0.3V to +6.0V
RxIN.............................................................................±25V
These are stress ratings only and functional operation of the
device at these ratings or any other above those indicated in
the operation sections of the specifications below is not
implied. Exposure to absolute maximum rating conditions
for extended periods of time may affect reliability and cause
permanent damage to the device.
Output Voltages
TxOUT.....................................................................±13.2V
RxOUT..............................................-0.3V to (VCC + 0.3V)
Short-Circuit Duration
TxOUT...............................................................Continuous
VCC................................................................-0.3V to +6.0V
V+ (NOTE 1)................................................-0.3V to +7.0V
V- (NOTE 1)................................................+0.3V to -7.0V
V+ + |V-| (NOTE 1)...................................................+13V
Storage Temperature.................................-65°C to +150°C
Power Dissipation Per Package
20-pin SSOP (derate 9.25mW/oC above +70oC).......750mW
18-pin PDIP (derate 15.2mW/oC above +70oC)......1220mW
18-pin SOIC (derate 15.7mW/oC above +70oC)......1260mW
20-pin TSSOP (derate 11.1mW/oC above +70oC).....890mW
16-pin SSOP (derate 9.69mW/oC above +70oC).......775mW
16-pin PDIP (derate 14.3mW/oC above +70oC)......1150mW
16-pin Wide SOIC (derate 11.2mW/oC above +70oC)....900mW
16-pin TSSOP (derate 10.5mW/oC above +70oC).....850mW
ICC (DC VCC or GND current).................................+100mA
Electrostatic Discharge
HBM ......................................................................15kV
IEC1000-4-2-AirDischarge....................................15kV
IEC1000-4-2 Direct Contact....................................8kV
NOTE 1: V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V.
ELECTRICAL CHARACTERISTICS
Unless otherwise noted, the following specifications apply for VCC = +3.0V to +5.0V with TAMB = TMIN to TMAX
PARAMETER
MIN
TYP
MAX
UNITS
CONDITIONS
Supply Current
0.3
1.0
mA
no load, TAMB = +25°C,
VCC = +3.3V, TxIN = VCC or GND
Shutdown Supply Current
1.0
10
µA
SHDN=GND, TAMB = +25°C,
VCC=+3.3V, TxIN=VCC or GND
DC CHARACTERISTICS
LOGIC INPUTS AND RECEIVER OUTPUTS
Input Logic Threshold LOW
Input Logic Threshold HIGH
0.8
2.0
2.4
V
TxIN, EN, SHDN, Note 2
V
VCC=3.3V, Note 2
VCC=5.0V, Note 2
Input Leakage Current
±0.01
±1.0
µA
TxIN, EN, SHDN, TAMB = +25°C
Output Leakage Current
±0.05
±10
µA
receivers disabled
Output Voltage LOW
V
IOUT=1.6mA
VCC-0.6
VCC-0.1
0.4
V
IOUT=-1.0mA
Output Voltage Swing
±5.0
±5.4
V
3kΩ load to ground at all driver outputs,
TAMB=+25°C
Output Resistance
300
Ω
VCC= V+ = V- = 0V, TOUT = ±2V
Output Voltage HIGH
DRIVER OUTPUTS
Output Short-Circuit Current
Output Leakage Current
Date: 06/22/04
±35
±60
mA
VOUT = 0V
±25
µA
VOUT = ±12V, VCC = 0V or 3.0V+5.5V,
drivers disabled
SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers
2
© Copyright 2004 Sipex Corporation
ELECTRICAL CHARACTERISTICS
Unless otherwise noted, the following specifications apply for VCC = +3.0V to +5.0V with TAMB = TMIN to TMAX .
PARAMETER
MIN.
TYP.
MAX.
UNITS
+15
V
CONDITIONS
RECEIVER INPUTS
Input Voltage Range
-15
Input Threshold LOW
0.6
0.8
1.2
1.5
Input Threshold HIGH
1. 5
1.8
Input Hysteresis
0.3
Input Resistance
3
5
2.4
2.4
V
VCC=3.3V
VCC=5.0V
V
VCC=3.3V
VCC=5.0V
V
7
kΩ
TIMING CHARACTERISTICS
Maximum Data Rate
460
Kbps
RL=3kΩ, CL=1000pF, one driver switching
Driver Propagation Delay
1.0
1.0
µs
µs
tPHL, RL = 3KΩ, CL = 1000pF
tPLH, RL = 3KΩ, CL = 1000pF
Receiver Propagation Delay
0.3
0.3
µs
tPHL, RxIN to RxOUT, CL=150pF
tPLH, RxIN to RxOUT, CL=150pF
Receiver Output Enable Time
200
ns
Receiver Output Disable Time
200
ns
Driver Skew
100
500
ns
| tPHL - tPLH |
Receiver Skew
200
1000
ns
| tPHL - tPLH |
Transition-Region Slew Rate
60
Date: 06/22/04
V/µs
SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers
3
VCC = 3.3V, RL = 3KΩ, TAMB = 25oC,
measurements taken from -3.0V to +3.0V
or +3.0V to -3.0V
© Copyright 2004 Sipex Corporation
TYPICAL PERFORMANCE CHARACTERISTICS
Unless otherwise noted, the following performance characteristics apply for VCC = +3.3V, 460Kbps data rates, all drivers
loaded with 3kΩ, 0.1µF charge pump capacitors, and TAMB = +25°C.
14
12
4
10
Vout+
Vout-
2
Slew Rate [V/µs]
Transmitter Output Voltage [V]
6
0
1000
500
0
2000
1500
-2
8
6
4
+Slew
-Slew
-4
2
-6
0
Load Capacitance [pF]
0
Figure 1. Transmitter Output Voltage VS. Load
Capacitance for the SP3222EH and the SP3232EH
500
1000
1500
Load Capacitance [pF]
2000
2330
Figure 2. Slew Rate VS. Load Capacitance for the
SP3222EH and the SP3232EH
40
460Kbps
120Kbps
20Kbps
Supply Current (mA)
35
30
25
20
15
10
5
0
0
500
1000
1500
2000 2500
3000
Load Capacitance (pF)
Figure 3. Supply Current VS. Load Capacitance when
Transmitting Data for the SP3222EH and the SP3232EH
Date: 06/22/04
SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers
4
© Copyright 2004 Sipex Corporation
PIN DESCRIPTION
PIN NUMBER
NAME
SP3222EH
FUNCTION
DIP/SO
SSOP/TSSOP
SP3232EH
EN
Receiver Enable. Apply logic LOW for normal operation.
Apply Logic HIGH to disable the receiver outputs (high-Z state).
1
1
-
C1+
Positive terminal of the voltage doubler charge-pump capacitor.
2
2
1
V+
+5.5V generated by the charge pump.
3
3
2
C1-
Negative terminal of the voltage doubler charge-pump capacitor.
4
4
3
C2+
Positive terminal of the inverting charge-pump capacitor.
5
5
4
C2-
Negative terminal of the inverting charge-pump capacitor.
6
6
5
V-
-5.5V generated by the charge pump.
7
7
6
T1OUT
RS-232 driver output.
15
17
14
T2OUT
RS-232 driver output.
8
8
7
R1IN
RS-232 receiver input.
14
16
13
R2IN
RS-232 receiver input.
9
9
8
R1OUT
TTL/CMOS receiver output.
13
15
12
R2OUT
TTL/CMOS receiver output.
10
10
9
T1IN
TTL/CMOS driver input.
12
13
11
T2IN
TTL/CMOS driver input.
11
12
10
GND
Ground.
16
18
15
17
19
16
18
20
-
-
11, 14
-
VCC
SHDN
NC
+3.0V to +5.5V supply voltage
Shutdown Control Input. Drive HIGH for normal device operation.
Drive LOW to shutdown the drivers (high-Z output) and the
on-board power supply.
No Connect.
Table 1. Device Pin Description
Date: 06/22/04
SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers
5
© Copyright 2004 Sipex Corporation
EN
1
C1+ 2
20 SHDN
EN
19 VCC
V+
3
18 GND
C1-
4
17
C2+
5
SP3222EH 16
C2-
6
15 R1OUT
V-
7
14
T2OUT
8
13 T1IN
R2IN
9
12 T2IN
R2OUT 10
11
18 SHDN
1
C1+ 2
V+
3
16 GND
C1-
4
15
C2+
5
SP3222EH 14
C2-
6
13 R1OUT
V-
7
12 T1IN
T2OUT
8
11 T2IN
R2IN
9
10
T1OUT
R1IN
NC
NC
17 VCC
T1OUT
R1IN
R2OUT
DIP/SO
SSOP/TSSOP
Figure 4. Pinout Configurations for the SP3222EH
16 VCC
C1+ 1
V+ 2
15 GND
C1-
3
C2+
4
C2-
5
12 R1OUT
V-
6
11 T1IN
T2OUT
7
10
R2IN
8
9
14 T1OUT
SP3232EH 13 R1IN
T2IN
R2OUT
Figure 5. Pinout Configuration for the SP3232EH
Date: 06/22/04
SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers
6
© Copyright 2004 Sipex Corporation
VCC
+
C5
C1
+
VCC
19
VCC
0.1µF
V+
0.1µF
LOGIC
INPUTS
0.1µF
2 C1+
0.1µF
+
C1
V+
3
0.1µF
*C3
4 C1-
SP3222EH
SSOP
TSSOP
6 C2-
V-
13 T1IN
T1OUT
17
12 T2IN
T2OUT
8
R1IN
R2IN
+
0.1µF
+
C2
RS-232
OUTPUTS
LOGIC
INPUTS
RS-232
INPUTS
LOGIC
OUTPUTS
0.1µF
9
C4
12 T1IN
T1OUT
15
11 T2IN
T2OUT
8
R1IN
14
R2IN
9
5kΩ
10 R2OUT
+
0.1µF
7
6 C2-
+
0.1µF
RS-232
OUTPUTS
RS-232
INPUTS
5kΩ
5kΩ
1 EN
V-
13 R1OUT
16
5kΩ
10 R2OUT
SP3222EH
DIP/SO
5 C2+
7
C4
15 R1OUT
LOGIC
OUTPUTS
+
*C3
5 C2+
+
17
VCC
0.1µF
3
4 C1-
C2
+
C5
2 C1+
SHDN
1 EN
20
SHDN
18
GND
GND
*can be returned to
either VCC or GND
18
16
*can be returned to
either VCC or GND
Figure 6. SP3222EH Typical Operating Circuits
VCC
C5
C1
+
+
16
VCC
0.1µF
1 C1+
V+
2
0.1µF
*C3
3 C14 C2+
C2
LOGIC
INPUTS
+
0.1µF
SP3232EH
V-
LOGIC
OUTPUTS
C4
11 T1IN
T1OUT
14
10 T2IN
T2OUT
7
R1IN
13
R2IN
8
5kΩ
9 R2OUT
0.1µF
6
5 C2-
12 R1OUT
+
+
0.1µF
RS-232
OUTPUTS
RS-232
INPUTS
5kΩ
GND
15
*can be returned to
either VCC or GND
Figure 7. SP3232EH Typical Operating Circuit
Date: 06/22/04
SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers
7
© Copyright 2004 Sipex Corporation
DESCRIPTION
The SP3222EH and SP3232EH are 2-driver/
2-receiver devices ideal for portable or hand-held
applications. The SP3222EH features a 1µA
shutdown mode that reduces power consumption
and extends battery life in portable systems.
Its receivers remain active in shutdown mode,
allowing external devices such as modems to be
monitored using only 1µA supply current.
The slew rate of the driver output is internally
limited to a maximum of 30V/µs in order to meet
the EIA standards (EIA RS-232D 2.1.7,
Paragraph 5). The transition of the loaded output
from HIGH to LOW also meets the monotonicity
requirements of the standard.
Figure 8 shows a loopback circuit used to test the
RS-232 drivers. Figure 9 shows the test results
of the loopback circuit with all drivers active at
120Kbps and RS-232 loads in parallel with
1000pF capacitors. Figure 10 shows the test
results where one driver is active at 460Kbps and
all drivers are loaded with an RS-232 receiver
in parallel with a 1000pF capacitor.
The SP3222EH/3232EH transceivers meet the
EIA/TIA-232 and V.28/V.24 communication
protocols. They feature Sipex's proprietary
on-board charge pump circuitry that generates
2 x VCC for RS-232 voltage levels from a single
+3.0V to +5.5V power supply. The SP3222EH/
3232EH drivers operate at a minimum data
rate of 460Kbps.
The SP3222EH driver's output stages are
tri-stated in shutdown mode. When the power is
off, the SP3222EH device permits the outputs to
be driven up to +12V. Because the driver's
inputs do not have pull-up resistors, unused
inputs should be connected to VCC or GND.
THEORY OF OPERATION
The SP3222EH/3232EH are made up of three
basic circuit blocks: 1. Drivers, 2. Receivers, and 3.
the Sipex proprietary charge pump.
In the shutdown mode, the supply current is less
than 1µA, where SHDN = LOW. When the
SP3222EH device is shut down, the device's
driver outputs are disabled (tri-stated) and the
charge pumps are turned off with V+ pulled
down to VCC and V- pulled to GND. The time
required to exit shutdown is typically 100µs.
SHDN is connected to VCC if the shutdown mode
is not used. SHDN has no effect on RxOUT or
RxOUTB. As they become active, the two driver
outputs go to opposite RS-232 levels: one driver
input is HIGH and the other LOW. Note that the
drivers are enabled only when the magnitude of
V- exceeds approximately 3V.
Drivers
The drivers are inverting level transmitters that
convert TTL or CMOS logic levels to +5.0V
EIA/TIA-232 levels inverted relative to the input
logic levels. Typically, the RS-232 output voltage
swing is +5.5V with no load and at least +5V
minimum fully loaded. The driver outputs are
protected against infinite short-circuits to ground
without degradation in reliability. Driver outputs
will meet EIA/TIA-562 levels of +3.7V with
supply voltages as low as 2.7V.
The drivers have a minimum data rate of
460Kbps fully loaded with 3KΩ in parallel with
1000pF, ensuring compatibility with PC-to-PC
communication software.
Date: 06/22/04
SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers
8
© Copyright 2004 Sipex Corporation
VCC
C5
C1
+
+
0.1µF
VCC
C1+
V+
+
0.1µF
0.1µF
C3
C1-
C2
+
C2+
0.1µF
SP3222EH
SP3232EH
VC4
C2LOGIC
INPUTS
LOGIC
OUTPUTS
+
0.1µF
TxOUT
TxIN
RxIN
RxOUT
5kΩ
EN
*SHDN
VCC
GND
1000pF
* SP3222 only
Figure 8. SP3222EH/3232EH Driver Loopback Test Circuit
T1 IN
T1 IN
T1 OUT
T1 OUT
R1 OUT
R1 OUT
Figure 9. Driver Loopback Test Results at 120Kbps
Date: 06/22/04
Figure 10. Driver Loopback Test Results at 460Kbps
SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers
9
© Copyright 2004 Sipex Corporation
Receivers
The receivers convert EIA/TIA-232 levels to
TTL or CMOS logic output levels. The
SP3222EH receivers have an inverting tri-state
output.Receiver outputs (RxOUT) are tri-stated
when the enable control EN = HIGH. In the
shutdown mode, the receivers can be active or
inactive. EN has no effect on TxOUT. The truth
table logic of the SP3222EH driver and receiver
outputs can be found in Table 2.
In most circumstances, decoupling the power
supply can be achieved adequately using a
0.1µF bypass capacitor at C5 (refer to Figures 6
and 7). In applications that are sensitive to
power-supply noise,VCC and ground can be
decoupled with a capacitor of the same value
as charge-pump capacitor C1. It is always
important to physically locate bypass capacitors
close to the IC.
Since receiver input is usually from a transmission line where long cable lengths and system
interference can degrade the signal and inject
noise, the inputs have a typical hysteresis margin
of 300mV. Should an input be left unconnected,
a 5kΩ pulldown resistor to ground forces the
output of the receiver HIGH.
The charge pump operates in a discontinuous
mode using an internal oscillator. If the output
voltage is less than 5.5V, the charge pump is
enabled. If the output voltage exceeds 5.5V,
the charge pump is disabled. An oscillator
controls the four phases of the voltage shifting.
A description of each phase follows.
Charge Pump
Phase 1: VSS Charge Storage (Figure 12)
During this phase of the clock cycle, the positive
side of capacitors C1 and C2 are charged to VCC.
Cl+ is then switched to GND and the charge in
C1– is transferred to C2–. Since C2+ is connected
to VCC, the voltage potential across capacitor C2
is now 2 times VCC.
The Sipex patented charge pump (5,306,954)
uses a four–phase voltage shifting technique to
attain symmetrical 5.5V power supplies and
requires four external capacitors. The internal
power supply consists of a regulated dual charge
pump that provides an output voltage of 5.5V
regardless of the input voltage (VCC) over the
+3.0V to +5.5V range.
SHDN
EN
TxOUT
RxOUT
0
0
Tri-state
Active
0
1
Tri-state
Tri-state
1
0
Active
Active
1
1
Active
Tri-state
Phase 2: VSS Transfer (Figure 13)
Phase two of the clock connects the negative
terminal of C2 to the VSS storage capacitor and
the positive terminal of C2 to GND. This
transfers a negative generated voltage to C3.
This generated voltage is regulated to a
minimum voltage of -5.5V. Simultaneous with
the transfer of the voltage to C3, the positive side
of capacitor C1 is switched to VCC and the
negative side is connected to GND.
Phase 3: VDD Charge Storage (Figure 15)
The third phase of the clock is identical to the
first phase — the charge transferred in C1
produces –VCC in the negative terminal of C1,
which is applied to the negative side of capacitor
C2. Since C2+ is at VCC, the voltage potential
across C2 is 2 times VCC.
Table 2. Truth Table Logic for Shutdown and Enable
Control
Date: 06/22/04
SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers
10
© Copyright 2004 Sipex Corporation
discharge it to an integrated circuit. The
simulation is performed by using a test model as
shown in Figure 17. This method will test the
IC’s capability to withstand an ESD transient
during normal handling such as in manufacturing
areas where the ICs tend to be handled
frequently.
Phase 4: VDD Transfer (Figure 16)
The fourth phase of the clock connects the
negative terminal of C2 to GND, and transfers
this positive generated voltage across C2 to C4,
the VDD storage capacitor. This voltage is
regulated to +5.5V. At this voltage, the internal
oscillator is disabled. Simultaneous with the
transfer of the voltage to C4, the positive side of
capacitor C1 is switched to VCC and the negative
side is connected to GND, allowing the charge
pump cycle to repeat. The charge pump cycle
will continue as long as the operational
conditions for the internal oscillator are present.
The IEC-1000-4-2, formerly IEC801-2, is
used for testing ESD on equipment and
systems. For system manufacturers, they must
guarantee a certain amount of ESD protection
since the system itself is exposed to the outside
environment and human presence. The premise
with IEC1000-4-2 is that the system is required
to withstand an amount of static electricity when
ESD is applied to points and surfaces of the
equipment that are accessible to personnel
during normal usage. In many cases, the RS232
transceiver IC receives most of the ESD current
when the ESD source is applied to the connector
pins. The test circuit for IEC1000-4-2 is shown on
Figure 18. There are two methods within
IEC1000-4-2, the Air Discharge method and the
Contact Discharge method.
Since both V+ and V– are separately generated
from VCC; in a no–load condition V+ and V– will
be symmetrical. Older charge pump approaches
that generate V– from V+ will show a decrease in
the magnitude of V– compared to V+ due to the
inherent inefficiencies in the design.
The charge pump clock rate typically operates
at 250kHz. The external capacitors can be as low
as 0.1µF with a 16V breakdown voltage rating.
ESD Tolerance
With the Air Discharge Method, an ESD
voltage is applied to the equipment under
test (EUT) through air. This simulates an
electrically charged person ready to connect a
cable onto the rear of the system. The high
energy potential on the person discharges
through an arcing path to the rear panel of the
system before he or she touches the system.
This energy, whether discharged directly or
through air, is predominantly a function of the
discharge current rather than the discharge
voltage. Variables with an air discharge such
as approach speed of the object carrying the
ESD potential to the system and humidity will
tend to change the discharge current. For example,
the rise time of the discharge current varies
with the approach speed.
The SP3222EH/3232EH series incorporates
ruggedized ESD cells on all driver output
and receiver input pins. The improved ESD
tolerance is at least ±15kV without damage or
latch-up.
Three methods of ESD testing are performed:
a) MIL-STD-883, Method 3015.7
b) IEC1000-4-2 Air-Discharge
c) IEC1000-4-2 Direct Contact
The Human Body Model has been the generally
accepted ESD testing method for semiconductors. This method is also specified in MIL-STD883, Method 3015.7 for ESD testing. The premise
of this ESD test is to simulate the human body’s
potential to store electro-static energy and
Date: 06/22/04
SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers
11
© Copyright 2004 Sipex Corporation
VCC = +5V
C4
+5V
+
C1
C2
–
–5V
+
–
–
+
VDD Storage Capacitor
+
–
VSS Storage Capacitor
C3
–5V
Figure 12. Charge Pump — Phase 1
VCC = +5V
C4
+
C1
C2
–
+
–
–
+
VDD Storage Capacitor
+
–
VSS Storage Capacitor
C3
–10V
Figure 13. Charge Pump — Phase 2
[
T
]
+6V
a) C2+
T
GND 1
GND 2
b) C2-
T
-6V
Ch1 2.00V Ch2 2.00V M 1.00µs Ch1 5.48V
Figure 14. Charge Pump Waveforms
VCC = +5V
C4
+5V
C1
+
C2
–
–5V
+
–
–
+
+
–
VDD Storage Capacitor
VSS Storage Capacitor
C3
–5V
Figure 15. Charge Pump — Phase 3
VCC = +5V
C4
+10V
C1
+
–
C2
+
–
–
+
+
–
VDD Storage Capacitor
VSS Storage Capacitor
C3
Figure 16. Charge Pump — Phase 4
Date: 06/22/04
SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers
12
© Copyright 2004 Sipex Corporation
R
RSS
R
RC
C
SW2
SW2
SW1
SW1
Device
Under
Test
C
CSS
DC Power
Source
Figure 17. ESD Test Circuit for Human Body Model
The Contact Discharge Method applies the ESD
current directly to the EUT. This method was
devised to reduce the unpredictability of the
ESD arc. The discharge current rise time is
constant since the energy is directly transferred
without the air-gap arc. In situations such as
hand held systems, the ESD charge can be
directly discharged to the equipment from a
person already holding the equipment. The
current is transferred on to the keypad or the
serial port of the equipment directly and then
travels through the PCB and finally to the IC.
The circuit models in Figures 17 and 18
represent the typical ESD testing circuits used
for all three methods. The CS is initially charged
with the DC power supply when the first
switch (SW1) is on. Now that the capacitor is
charged, the second switch (SW2) is on while
SW1 switches off. The voltage stored in the
capacitor is then applied through RS, the current
limiting resistor, onto the device under test
(DUT). In ESD tests, the SW2 switch is pulsed
so that the device under test receives a duration
of voltage.
Contact-Discharge Module
RSS
RC
C
RV
SW2
SW1
Device
Under
Test
CSS
DC Power
Source
RS and RV add up to 330
330Ω
Ω ffor
or IEC1000-4-2.
Figure 18. ESD Test Circuit for IEC1000-4-2
Date: 06/22/04
SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers
13
© Copyright 2004 Sipex Corporation
I➙
For the Human Body Model, the current
limiting resistor (RS) and the source capacitor
(CS) are 1.5kΩ an 100pF, respectively. For
IEC-1000-4-2, the current limiting resistor (RS)
and the source capacitor (CS) are 330Ω an 150pF,
respectively.
30A
15A
The higher CS value and lower RS value in the
IEC1000-4-2 model are more stringent than the
Human Body Model. The larger storage
capacitor injects a higher voltage to the test
point when SW2 is switched on. The lower
current limiting resistor increases the current
charge onto the test point.
0A
t=0ns
t=30ns
t➙
Figure 19. ESD Test Waveform for IEC1000-4-2
Device Pin
Tested
Human Body
Model
Air Discharge
Driver Outputs
Receiver Inputs
±15kV
±15kV
±15kV
±15kV
IEC1000-4-2
Direct Contact
±8kV
±8kV
Level
4
4
Table 3. Transceiver ESD Tolerance Levels
Date: 06/22/04
SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers
14
© Copyright 2004 Sipex Corporation
PACKAGE: PLASTIC SHRINK
SMALL OUTLINE
(SSOP)
E
H
D
A
Ø
e
A1
B
DIMENSIONS (Inches)
Minimum/Maximum
(mm)
Date: 06/22/04
L
16–PIN
20–PIN
24–PIN
28–PIN
A
0.068/0.078
(1.73/1.99)
0.068/0.078
(1.73/1.99)
0.068/0.078
(1.73/1.99)
0.068/0.078
(1.73/1.99)
A1
0.002/0.008
(0.05/0.21)
0.002/0.008
(0.05/0.21)
0.002/0.008
(0.05/0.21)
0.002/0.008
(0.05/0.21)
B
0.010/0.015
(0.25/0.38)
0.010/0.015
(0.25/0.38)
0.010/0.015
(0.25/0.38)
0.010/0.015
(0.25/0.38)
D
0.239/0.249
(6.07/6.33)
0.278/0.289
(7.07/7.33)
0.317/0.328
(8.07/8.33)
0.397/0.407
(10.07/10.33)
E
0.205/0.212
(5.20/5.38)
0.205/0.212
(5.20/5.38)
0.205/0.212
(5.20/5.38)
0.205/0.212
(5.20/5.38)
e
0.0256 BSC
(0.65 BSC)
0.0256 BSC
(0.65 BSC)
0.0256 BSC
(0.65 BSC)
0.0256 BSC
(0.65 BSC)
H
0.301/0.311
(7.65/7.90)
0.301/0.311
(7.65/7.90)
0.301/0.311
(7.65/7.90)
0.301/0.311
(7.65/7.90)
L
0.022/0.037
(0.55/0.95)
0.022/0.037
(0.55/0.95)
0.022/0.037
(0.55/0.95)
0.022/0.037
(0.55/0.95)
Ø
0°/8°
(0°/8°)
0°/8°
(0°/8°)
0°/8°
(0°/8°)
0°/8°
(0°/8°)
SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers
15
© Copyright 2004 Sipex Corporation
PACKAGE: PLASTIC
DUAL–IN–LINE
(NARROW)
E1 E
D1 = 0.005" min.
(0.127 min.)
A1 = 0.015" min.
(0.381min.)
D
A = 0.210" max.
(5.334 max).
C
A2
e = 0.100 BSC
(2.540 BSC)
B1
B
Ø
L
eA = 0.300 BSC
(7.620 BSC)
ALTERNATE
END PINS
(BOTH ENDS)
DIMENSIONS (Inches)
Minimum/Maximum
(mm)
16–PIN
18–PIN
A2
0.115/0.195
(2.921/4.953)
0.115/0.195
(2.921/4.953)
B
0.014/0.022
(0.356/0.559)
0.014/0.022
(0.356/0.559)
B1
0.045/0.070
(1.143/1.778)
0.045/0.070
(1.143/1.778)
C
0.008/0.014
(0.203/0.356)
0.008/0.014
(0.203/0.356)
D
Date: 06/22/04
0.780/0.800
0.880/0.920
(19.812/20.320) (22.352/23.368)
E
0.300/0.325
(7.620/8.255)
0.300/0.325
(7.620/8.255)
E1
0.240/0.280
(6.096/7.112)
0.240/0.280
(6.096/7.112)
L
0.115/0.150
(2.921/3.810)
0.115/0.150
(2.921/3.810)
Ø
0°/ 15°
(0°/15°)
0°/ 15°
(0°/15°)
SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers
16
© Copyright 2004 Sipex Corporation
PACKAGE: PLASTIC
SMALL OUTLINE (SOIC)
E
H
D
A
Ø
e
B
A1
L
DIMENSIONS (Inches)
Minimum/Maximum
(mm)
Date: 06/22/04
16–PIN
18–PIN
A
0.090/0.104
(2.29/2.649)
0.090/0.104
(2.29/2.649))
A1
0.004/0.012
(0.102/0.300)
0.004/0.012
(0.102/0.300)
B
0.013/0.020
(0.330/0.508)
0.013/0.020
(0.330/0.508)
D
0.398/0.413
(10.10/10.49)
0.447/0.463
(11.35/11.74)
E
0.291/0.299
(7.402/7.600)
0.291/0.299
(7.402/7.600)
e
0.050 BSC
(1.270 BSC)
0.050 BSC
(1.270 BSC)
H
0.394/0.419
(10.00/10.64)
0.394/0.419
(10.00/10.64)
L
0.016/0.050
(0.406/1.270)
0.016/0.050
(0.406/1.270)
Ø
0°/8°
(0°/8°)
0°/8°
(0°/8°)
SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers
17
© Copyright 2004 Sipex Corporation
PACKAGE:
PLASTIC THIN SMALL
OUTLINE
(TSSOP)
E2
E
D
A
Ø
e
B
A1
L
DIMENSIONS
in inches (mm)
Minimum/Maximum
Date: 06/22/04
16–PIN
20–PIN
A
- /0.043
(- /1.10)
- /0.043
(- /1.10)
A1
0.002/0.006
(0.05/0.15)
0.002/0.006
(0.05/0.15)
B
0.007/0.012
(0.19/0.30)
0.007/0.012
(0.19/0.30)
D
0.193/0.201
(4.90/5.10)
0.252/0.260
(6.40/6.60)
E
0.169/0.177
(4.30/4.50)
0.169/0.177
(4.30/4.50)
e
0.026 BSC
(0.65 BSC)
0.026 BSC
(0.65 BSC)
E2
0.126 BSC
(3.20 BSC)
0.126 BSC
(3.20 BSC)
L
0.020/0.030
(0.50/0.75)
0.020/0.030
(0.50/0.75)
Ø
0°/8°
0°/8°
SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers
18
© Copyright 2004 Sipex Corporation
ORDERING INFORMATION
Part Number
Temperature Range
Package Type
SP3222EHCA .......................................... 0˚C to +70˚C .......................................... 20-Pin SSOP
SP3222EHCA/TR .................................... 0˚C to +70˚C .......................................... 20-Pin SSOP
SP3222EHEA ......................................... -40˚C to +85˚C ........................................ 20-Pin SSOP
SP3222EHEA/TR .................................... -40˚C to +85˚C ........................................ 20-Pin SSOP
SP3222EHCP .......................................... 0˚C to +70˚C ............................................ 18-Pin PDIP
SP3222EHEP ......................................... -40˚C to +85˚C .......................................... 18-Pin PDIP
SP3222EHCT .......................................... 0˚C to +70˚C ........................................ 18-Pin WSOIC
SP3222EHCT/TR ..................................... 0˚C to +70˚C ........................................ 18-Pin WSOIC
SP3222EHET .......................................... -40˚C to +85˚C ...................................... 18-Pin WSOIC
SP3222EHET/TR .................................... -40˚C to +85˚C ...................................... 18-Pin WSOIC
SP3222EHCY .......................................... 0˚C to +70˚C ........................................ 20-Pin TSSOP
SP3222EHCY/TR .................................... 0˚C to +70˚C ........................................ 20-Pin TSSOP
SP3222EHEY ......................................... -40˚C to +85˚C ...................................... 20-Pin TSSOP
SP3222EHEY/TR .................................... -40˚C to +85˚C ...................................... 20-Pin TSSOP
SP3232EHCA .......................................... 0˚C to +70˚C .......................................... 16-Pin SSOP
SP3232EHCA/TR .................................... 0˚C to +70˚C .......................................... 16-Pin SSOP
SP3232EHEA ......................................... -40˚C to +85˚C ........................................ 16-Pin SSOP
SP3232EHEA/TR .................................... -40˚C to +85˚C ........................................ 16-Pin SSOP
SP3232EHCP .......................................... 0˚C to +70˚C ............................................ 16-Pin PDIP
SP3232EHEP ......................................... -40˚C to +85˚C .......................................... 16-Pin PDIP
SP3232EHCT .......................................... 0˚C to +70˚C ........................................ 16-Pin WSOIC
SP3232EHCT/TR ..................................... 0˚C to +70˚C ........................................ 16-Pin WSOIC
SP3232EHET .......................................... -40˚C to +85˚C ...................................... 16-Pin WSOIC
SP3232EHET/TR .................................... -40˚C to +85˚C ...................................... 16-Pin WSOIC
SP3232EHCY .......................................... 0˚C to +70˚C ........................................ 16-Pin TSSOP
SP3232EHCY/TR .................................... 0˚C to +70˚C ........................................ 16-Pin TSSOP
SP3232EHEY ......................................... -40˚C to +85˚C ...................................... 16-Pin TSSOP
SP3232EHEY/TR .................................... -40˚C to +85˚C ...................................... 16-Pin TSSOP
Available in lead free packaging. To order add "-L" suffix to part number.
Example: SP3232EHEY/TR = standard; SP3232EHEY-L/TR = lead free
/TR = Tape and Reel
Pack quantity is 1,500 for WSOIC, SSOP and TSSOP.
Corporation
ANALOG EXCELLENCE
Sipex Corporation
Headquarters and
Sales Office
233 South Hillview Drive
Milpitas, CA 95035
TEL: (408) 934-7500
FAX: (408) 935-7600
Sipex Corporation reserves the right to make changes to any products described herein. Sipex does not assume any liability arising out of the
application or use of any product or circuit described hereing; neither does it convey any license under its patent rights nor the rights of others.
Date: 06/22/04
SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers
19
© Copyright 2004 Sipex Corporation