ST3DV520 High bandwidth analog switch with 16-to-8 bit MUX/DEMUX Preliminary Data Features ■ Low RON: 5.5 Ω typical ■ VCC operating range: 3.0 to 3.6 V ■ Low current consumption: 20 µA ■ ESD HBM model: > 2 kV ■ Channel on capacitance: 7.5 pf typical ■ Switching time speed: 9 ns ■ Near to zero propagation delay: 250 ps ■ Very low cross talk: -40 db at 250 MHz ■ Bit-to-bit skew: 200 ps ■ > 450 MHz -3db typical bandwidth ■ Package: QFN56 ■ Pb free QFN56 Description The ST3DV520 is a 16-to-8 bit bidirectional multiplexer/demultiplexer low RON and high bandwidth switch suitable for analog video applications. The ST3DV520 supports high definition (HD) analog video switching standards and is also suitable for general purpose switching that requires high signal integrity. The device is designed for very low crosstalk, low bit-to-bit skew and low I/O capacitance. The signal from each input is multiplexed into one of two selected outputs while the unselected switch goes to HI-Z status. Table 1. Device summary Order code Package Packing ST3DV520QTR QFN56 Tape and reel October 2008 Rev 2 This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. 1/10 www.st.com 10 Pin description Pin description '.$ ! " 6$$ .# '.$ # $ '.$ 6$$ % & '.$ ' ( '.$ 3%, 6$$ Pin connection (top through view) .# Figure 1. .# 1 ST3DV520 '.$ 6$$ .# '.$ .# .# '.$ '.$ .# .# .# .# ! " ! " '.$ # $ # $ '.$ 6$$ % & % & '.$ ' ( '.$ ( 6$$ '.$ ' 6$$ !-6 Table 2. 2/10 Pin description Pin number Symbol Name and function 2, 3, 7, 8, 11, 12, 14, 15 A, B, C, D, E, F, G, H 31, 32, 36, 37, 42, 43, 47, 48 A0, B0, C0, D0, E0, F0, G0, H0 8 bit multiplexed to bus 0 29, 30, 35, 40, 41, 45, 46 A1, B1, C1, D1, E1, F1, G1, H1 8 bit multiplexed to bus 1 17 SEL Bus switch selection 5, 19, 20, 22, 23, 25, 26, 51, 52, 54 N/C Not connected 4, 10, 18, 27, 38, 50, 56 VDD Supply voltage 1, 6, 9, 13, 16, 21, 24, 28, 33, 39, 44, 49, 53, 55 GND Ground 8 bit bus ST3DV520 Pin description Figure 2. Input equivalent circuit AM00755V1 Table 3. Switch function table SE Function L 8 bit bus to 8 bit multiplexed bus 0 H 8 bit bus to 8 bit multiplexed bus 1 3/10 Maximum rating 2 ST3DV520 Maximum rating Stressing the device above the rating listed in the “Absolute Maximum Ratings” table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality documents. 2.1 Absolute maximum rating Table 4. Absolute maximum ratings Symbol Parameter Value Unit VCC Supply voltage to ground -0.5 to 4 V VI DC input voltage -0.5 to 4 V VIC DC control input voltage -0.5 to 4 V 120 mA 0.5 W -65 to 150 °C 300 °C current(1) IO DC output PD Power dissipation Tstg Storage temperature TL Lead temperature (10 sec) 1. If VIO x IO does not exceed the maximum limit of PD. Table 5. Symbol 4/10 DC electrical characteristics (TA = -40 to 85°C, VCC = 3.3 V ±10%) Parameter Test conditions Min VIH Voltage input high High level guaranteed 2 VIL Voltage input low Low level guaranteed -0.5 VIK Clamp diode voltage VCC = 3.6 V, IIN = -18 mA IIH Input high current IIL Typ Max Unit V 0.8 V -1.2 V VCC = 3.6 V, VIN = VCC ±5 μA Input low current VCC = 3.6 V, VIN = GND ±5 μA IOFF Power down leakage current VCC = 0 V, A to H V = 0 V, A0 to H0 and A1 to H1 ≤ 3.6 V ±5 μA RON Switch ON resistance(1) VCC = 3.0 V, VIN = 1.5 to VCC IIN = -40mA 7.5 Ω -0.8 5.5 ST3DV520 Maximum rating Table 5. DC electrical characteristics (TA = -40 to 85°C, VCC = 3.3 V ±10%) (continued) Symbol Parameter Test conditions Min Typ RFLAT ON resistance flatness(1)(2) VCC = 3.0 V, VIN at 1.5 and VCC IIN = -40mA 0.8 ΔRON ON resistance match between channel ΔRON = RONMAX-RONMIN (1)(3) VCC = 3.0 V, VIN = 1.5 to VCC IIN = -40mA 0.5 Max Unit Ω Ω 1 1. Measured by voltage drop between channels at indicated current trough the switch. ON resistance is determined by the lower of the voltage. 2. Flatness is defined as the difference between the RONMAX and RONMIN of ON resistance over the specified range. 3. ΔRON measured at same VCC, temperature and voltage level. Table 6. Capacitance specifications (TA = 25°C, f = 1 MHz) Symbol Parameter Test conditions Min Typ Max Unit Input capacitance(1) VIN = 0 V 2 3 pF COFF Port x0 to Port x1, switch off VIN = 0 V 4 6 pF CON Capacitance switch on (x to x0 or x to x1) VIN = 0 V 7.5 11 pF Typ Max Unit 150 500 µA CIN 1. x = A to H, x0 = A0 to H0, x1 = A1 to H1 Table 7. Power supply characteristics (TA = -40 to 85°C) Symbol ICC Quiescent power supply Table 8. Symb ol Parameter Test conditions Min VCC = 3.6 V VIN = VCC or GND Dynamic electrical characteristics (TA = -40 to 85°C, VCC = 3.3V ±10%) Parameter Test Conditions Min Typ Max Unit Xtalk Crosstalk RL= 100 Ω, f = 250 MHz -40 dB OIRR Off isolation RL= 100 Ω, f = 250 MHz -36 dB BW -3dB bandwidth RL= 100 Ω 450 MHz 5/10 Maximum rating ST3DV520 Table 9. Symb ol Switching characteristics (TA = -40 to 85°C, VCC = 3.3V ±10%) Parameter Test conditions Typ Max 0.25 Unit Propagation delay VCC = 3 V to 3.6 V tPZH, tPZL Line enable time, SE to x to x0 or x to x1 VCC = 3 V to 3.6 V 0.5 6.5 9 ns tPHZ, tPLZ Line disable time, SE to x to x0 or x to x1 VCC = 3 V to 3.6 V 0.5 6.5 8.5 ns tPD ns Output skew between tSK(O) center port to any other port VCC = 3 V to 3.6 V 0.1 0.2 ns Skew between opposite tSK(P) transition of the same output (tPHL, tPLH) VCC = 3 V to 3.6 V 0.1 0.2 ns Note 4: x = A to H, x0 = A0 to H0, x1 = A1 to H1. 6/10 Min Figure 3. Bandwidth Figure 4. Schematic bandwidth ST3DV520 3 Package mechanical data Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 5. QFN56 (11 x 5 mm) package outline 7576329-A 7/10 Package mechanical data Table 10. ST3DV520 QFN56 (11 x 5 mm) mechanical data millimeters inches Symbol A Min Typ Max Min Typ Max 0.70 0.75 0.80 0.028 0.030 0.031 A1 0.05 A3 0.20 0.008 b 0.20 0.25 0.30 0.008 0.010 0.012 D 10.90 11.00 11.10 0.429 0.433 0.437 D2 8.30 8.40 8.50 0.327 0.331 0.335 D3 9.50 0.374 E 4.90 5.00 5.10 0.193 0.197 0.201 E2 2.30 2.40 2.50 0.091 0.094 0.098 E3 3.50 0.138 e 0.50 0.020 L Figure 6. 8/10 0.002 0.30 0.40 Footprint recommendation 0.50 0.012 0.016 0.020 ST3DV520 4 Revision history Revision history Table 11. Document revision history Date Revision Changes 12-Jun-2007 1 Initial release. 09-Oct-2008 2 Modified: title and pinout configuration. Added: Figure 6: Footprint recommendation on page 8. 9/10 ST3DV520 Please Read Carefully: Information in this document is provided solely in connection with ST products. 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