STEVAL-TDR013V1 Demonstration board using the PD84002 for UHF RFID reader Features ■ Excellent thermal stability ■ Frequency: 8 ■ 860 - 960 MHz ■ Supply voltage: 7.2 V ■ Output power: 2 W ■ Power gain: 13.9 ± 0.5 dB ■ Efficiency: 60 % - 63 % ■ Load mismatch: 20:1 ■ BeO-free amplifier Mechanical specification: L = 60 mm, W = 30 mm Description Table 1. The STEVAL-TDR013V1 is an evaluation board using PD84002 LDMOS transistor and designed for UHF RFID reader and 2-way radio applications. Device summary Order code STEVAL-TDR013V1 For additional information on PD84002, please refer to its datasheet. September 2010 Doc ID 18013 Rev 1 1/16 www.st.com 16 Contents STEVAL-TDR013V1 Contents 1 Electrical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 Impedance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 4 Typical performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 5 Test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 6 Circuit layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 7 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 8 2/16 7.1 Thermal pad and via design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 7.2 Soldering profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Doc ID 18013 Rev 1 STEVAL-TDR013V1 Electrical data 1 Electrical data 1.1 Maximum ratings Table 2. Absolute maximum ratings Symbol VDD ID TCASE TA 2 Parameter Supply voltage Drain current Operating case temperature Maximum ambient temperature Value Unit 16 V 0.75 A -20 to +85 °C +55 °C Electrical characteristics TA = +25 oC, VDD = 7.2 V, Idq = 100 mA Table 3. Symbol Freq Electrical specifications Test conditions Frequency range Min Typ 860 POUT Max Unit 960 MHz 2 W Gain @ PIN = 19 dBm 13.9 ± 0.5 dB ND @ PIN = 19 dBm 60 - 63 % H2 2nd harmonic @ POUT = 2 W -31 / -46 dBc H3 3rd harmonic @ POUT = 2 W -62 / -70 dBc VSWR Load mismatch all phases @ POUT = 2 W Doc ID 18013 Rev 1 20:1 3/16 Impedance 3 STEVAL-TDR013V1 Impedance Figure 1. Impedance illustration D ZDL Z ZGS IN G S Table 4. 4/16 Impedance data F(MHz) ZGS ZDL 860 1,80 + j 7,79 3,88 + j 2,41 870 1,84 + j 7,96 3,89 + j 2,69 880 1,83 + j 8,01 4,01 + j 2,96 890 1,76 + j 8,11 4,17 + j 3,16 900 1,70 + j 8,20 4,27 + j 3,32 910 1,63 + j 8,30 4,37 + j 3,40 920 1,57 + j 8,48 4,41 + j 3,46 930 1,43 + j 8,64 4,36 + j 3,51 940 1,41+ j 8,83 4,28 + j 3,51 Doc ID 18013 Rev 1 STEVAL-TDR013V1 Typical performance 4 Typical performance Figure 2. Output power and efficiency vs frequency 7.2 V / 100 mA / Pin = 19 dBm 4.0 Figure 3. 80 Pout Gain vs frequency 7.2 V / 100 mA / Pin = 19 dBm 18 Eff 3.5 70 16 60 50 2.0 40 1.5 30 1.0 840 860 880 900 920 Gain (dB) 2.5 14 Efficiency (%) Pout (W) 3.0 12 10 20 960 940 8 820 840 860 880 Freq (MHz) Figure 4. Gain vs Pout 7.2 V / 100 mA Figure 5. 940 960 980 1000 Harmonics vs frequency 7.2 V / 100 mA / Pin = 19 dBm -10 16 H2 H3 -20 Harmonics (dB) Gain (dB) 920 0 18 14 12 -30 -40 -50 -60 860 MHz 10 0.50 900 Freq (MHz) 0.75 1.00 1.25 900 MHz 1.50 Pout (W) 1.75 -70 960 MHz 2.00 2.25 2.50 -80 820 840 860 880 900 920 940 960 980 1000 Freq (MHz) Doc ID 18013 Rev 1 5/16 Typical performance Figure 6. STEVAL-TDR013V1 Input return loss vs frequency 7.2 V / 100 mA / Pin = 19 dBm 0 -5 IRL (dB) -10 -15 -20 -25 -30 -35 820 840 860 880 900 920 940 960 980 1000 Freq (MHz) 6/16 Doc ID 18013 Rev 1 STEVAL-TDR013V1 Test circuit 5 Test circuit Figure 7. Test circuit schematic Vcc 1+ MSub 2- R3 B2 B1 C3 FR4 H=20 mil R2 C1 L1 C2 R1 TL4 TL5 C9 RFin TL1 C4 C6 Table 5. TL2 C7 TL6 C10 C5 RFout C11 TL3 LDMOS PD84002 C8 Part list Component ID Description B1 Value Case size Manufacturer Part code Ferrite Bead Panasonic EXCELDRC35C B2 Ferrite Bead Panasonic EXCELDRC35C C1, C2 Capacitor 120 pF 0603 Murata GRM39-C0G121J50D500 C3 Capacitor 1 uF 0603 Murata GRM39-X5R105K16D52K C4, C5 Capacitor 39 pF 0603 Murata GRM39-C0G390J50D500 C6, C10 Capacitor 3.3 pF 0603 Murata GRM39-C0G3R3C50Z500 C7 Capacitor 8.2 pF 0603 Murata GRM39-C0G8R2D50Z500 C8 Capacitor 22 pF 0603 Murata GRM39-C0G220J50D500 C9 Capacitor 12 pF 0603 Murata GRM39-C0G120J50D500 C11 Capacitor 2.7 pF 0603 Murata GRM39-C0G2R7C50Z500 L1 Inductor 12.55 nH Coilcraft 1606-10 R1 Resistor 150 Ω R2 Potentiometer 10 KΩ R3 Resistor 1K 0603 Tyco electronics Bourns electronics 3214W-1-103E Tyco electronics 01623440-1 0603 Doc ID 18013 Rev 1 7/16 Test circuit Table 5. STEVAL-TDR013V1 Part list (continued) TL1 Transmission line W = 0.92mm L = 13.6 mm Component ID Description Case size TL2 Transmission line W = 0.92mm L = 3.5 mm TL3 Transmission line W = 0.92mm L = 4.2 mm TL4 Transmission line W = 0.92mm L = 3.8 mm TL5 Transmission line W = 0.92mm L = 3.7 mm TL6 Transmission line W = 0.92mm L = 11.3 mm RF in, RF out SMA-CONN PD84002 LDMOS Board Figure 8. 8/16 Value 50 Ω Manufacturer Part code Johnson 142-0701-801 STMicroelectronics PD84002 60 mils FR-4 THk=0.020" 2OZ Cu both sides Demoboard photo Doc ID 18013 Rev 1 STEVAL-TDR013V1 6 Circuit layout Circuit layout Figure 9. Test fixture component layout Figure 10. Test circuit photomaster Doc ID 18013 Rev 1 9/16 Package mechanical data 7 STEVAL-TDR013V1 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 10/16 Doc ID 18013 Rev 1 STEVAL-TDR013V1 Table 6. Package mechanical data SOT-89 mechanical data Dim. mm. Min Typ Inch Max Min Typ Max A 1.4 1.6 55.1 63.0 B 0.44 0.56 17.3 22.0 B1 0.36 0.48 14.2 18.9 C 0.35 0.44 13.8 17.3 C1 0.35 0.44 13.8 17.3 D 4.4 4.6 173.2 181.1 D1 1.62 1.83 63.8 72.0 E 2.29 2.6 90.2 102.4 e 1.42 1.57 55.9 61.8 e1 2.92 3.07 115.0 120.9 H 3.94 4.25 155.1 167.3 L 0.89 1.2 35.0 47.2 Figure 11. Package dimensions Doc ID 18013 Rev 1 11/16 Package mechanical data 7.1 STEVAL-TDR013V1 Thermal pad and via design Thernal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern has been designed to address thermal, power dissipation and electrical requirements of the device. The via pattern is based on thru-hole vias with 0.203mm to 0.330mm finished hole size on a 0.5mm to 1.2mm grid pattern with 0.025 plating on via walls. If micro vias are used in a design, it is suggested that the quantity of vias be increased by a 4:1 ratio to achieve similar results. Figure 12. Pad layout details 12/16 Doc ID 18013 Rev 1 STEVAL-TDR013V1 7.2 Package mechanical data Soldering profile Figure 13 shows the recommeded solder for devices that have Pb-free terminal plating and where a Pb-free solder is used. Figure 13. Recommended solder profile Figure 14 shows the recommeded solder for devices with Pb-free terminal plating used with leaded solder, or for devices with leaded terminal plating used with a leaded solder. Figure 14. Recommended solder profile for leaded devices Doc ID 18013 Rev 1 13/16 Package mechanical data STEVAL-TDR013V1 Figure 15. Reel information 14/16 Doc ID 18013 Rev 1 STEVAL-TDR013V1 8 Revision history Revision history Updated Table 7. Document revision history Date Revision 22-Sep-2007 1 Changes Initial release Doc ID 18013 Rev 1 15/16 STEVAL-TDR013V1 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2010 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 16/16 Doc ID 18013 Rev 1