STPS16170C High voltage power Schottky rectifier Main product characteristics A1 K IF(AV) 2x8A VRRM 170 V Tj 175° C VF (typ) 0.70 V A2 ■ High junction temperature capability ■ Good trade-off between leakage current and forward voltage drop ■ Low leakage current ■ Avalanche capability specified A2 A2 K A1 Features and benefits TO-220AB STPS16170CT K A1 K 2 I PAK STPS16170CR K Description A2 A2 Dual centre tab Schottky rectifier designed for high frequency switch mode power supplies. A1 A1 DPAK STPS16170CB D2PAK STPS16170CG Order codes July 2006 Part Number Marking STPS16170CT STPS16170CT STPS16170CG STPS16170CG STPS16170CG-TR STPS16170CG STPS16170CR STPS16170CR STPS16170CB-TR PS16170CB STPS16170CB PS16170CB Rev 1 1/10 www.st.com Characteristics STPS16170C 1 Characteristics Table 1. Absolute ratings (limiting values per diode, Tamb = 25° C unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 170 V IF(RMS) RMS forward current 20 A IF(AV) Average forward current, δ = 0.5 Tc = 150° C IFSM Surge non repetitive forward current tp = 10 ms Sinusoidal PARM Releative peak avalanche power Tj = 25° C Tstg Tj dV/dt Table 2. 8 Total package 16 A 75 A 4700 W -65 to + 175 °C 175 °C 10 000 V/µs tp = 1µs Storage temperature range Maximum operating junction temperature(1) Critical rate of rise of reverse voltage dP tot 1 --------------- < -------------------------dT j R th ( j – a ) 1. Per diode thermal runaway condition for a diode on its own heatsink Thermal parameters Symbol Parameter Value Per diode Rth(j-c) Junction to case Rth(c) Coupling Table 3. Symbol IR(1) 1.8 °C/W 0.6 Static electrical characteristics Parameter Reverse leakage current Test conditions Tj = 25° C Tj = 125° C Forward voltage drop Tj = 125° C Tj = 25° C Tj = 125° C Min. Typ VR = VRRM Max. Unit 15 µA 15 mA 0.92 IF = 8 A 0.70 0.75 V 1 IF = 16 A 1. Pulse test: tp = 5 ms, δ < 2 % 2. Pulse test: tp = 380 µs, δ < 2 % To evaluate the conduction losses use the following equation: P = 0.64 x IF(AV) + 0.014 x IF2(RMS) 2/10 3 Total Tj = 25° C VF(2) Unit 0.8 0.86 STPS16170C Figure 1. Characteristics Conduction losses versus average Figure 2. forward current (per diode) PF(AV)(W) IF(av)(A) 8 δ=0.2 δ=0.1 δ=0.05 7 9 8 7 6 5 4 3 2 1 0 δ=1 δ=0.5 6 5 4 3 2 T 1 δ =tp/T IF(AV)(A) tp 0 0 1 Figure 3. Average forward current versus ambient temperature (δ = 0.5, per diode) 2 3 4 5 6 7 8 9 10 Normalized avalanche power derating versus pulse duration Rth(j-a)=Rth(j-c) Rth(j-a)=15°C/W T δ=tp/T 0 25 Figure 4. PARM(tp) PARM(1µs) Tamb(°C) tp 50 75 100 125 150 175 Normalized avalanche power derating versus junction temperature PARM(tp) PARM(25°C) 1 1.2 0.1 0.8 1 0.6 0.4 0.01 0.2 0.001 0.01 0.1 Figure 5. 120 Tj(°C) tp(µs) 1 0 10 100 25 1000 Non repetitive surge peak forward current versus overload duration (maximum values, per diode) 50 Figure 6. 75 100 125 150 Relative variation of thermal impedance junction to case versus pulse duration Zth(j-c)/Rth(j-c) IM(A) 1.0 Single pulse TO-220AB DPAK I²PAK D²PAK 100 80 TC=50°C 60 TC=75°C 40 20 TC=125°C IM t δ =0.5 0 1.E-03 t(s) 1.E-02 tp(s) 1.E-01 1.E+00 0.1 1.E-03 1.E-02 1.E-01 1.E+00 3/10 Characteristics Figure 7. STPS16170C Reverse leakage current versus reverse voltage applied (typical values, per diode) Figure 8. C(pF) IR(µA) 1.E+05 Junction capacitance versus reverse voltage applied (typical values, per diode) 1000 F=1MHz VOSC=30mVRMS Tj=25°C Tj=175°C 1.E+04 Tj=150°C 1.E+03 Tj=125°C 1.E+02 100 Tj=75°C 1.E+01 1.E+00 Tj=25°C 0 25 Figure 9. 100.0 VR(V) VR(V) 1.E-01 50 75 100 125 10 150 175 Forward voltage drop versus forward current (per diode) 1 10 Rth(j-a) (°C/W) IFM(A) 100 DPAK 90 80 80.0 70.0 70 Tj=125°C (Maximum values) 60 60.0 50.0 50 Tj=125°C (Typical values) 40.0 40 30.0 30 Tj=25°C (Maximum values) 20.0 20 10.0 10 VFM(V) SCU(cm²) 0.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 0 0 Figure 11. Thermal resistance junction to ambient versus copper surface under tab (epoxy printed board FR4, Cu = 35 µm - D2PAK) Rth(j-a) (°C/W) 80 D²PAK 70 60 50 40 30 20 10 SCU(cm²) 0 4/10 1000 Figure 10. Thermal resistance junction to ambient versus copper surface under tab (epoxy printed board FR4, Cu = 35 µm - DPAK) 90.0 0 100 5 10 15 20 25 30 35 40 5 10 15 20 25 30 35 40 STPS16170C 2 Package information Package information Epoxy meets UL94, V0 Table 4. T0-220AB dimensions Dimensions Ref. A H2 Dia C L5 L7 L6 L2 F2 F1 D L9 L4 Millimeters Inches Min. Max. Min. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 F2 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 G1 2.40 2.70 0.094 0.106 H2 10 L2 Max. 10.40 0.393 0.409 16.4 typ. 0.645 typ. F M G1 E L4 13 14 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 G M Diam. 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 5/10 Package information Table 5. STPS16170C I2PAK dimensions Dimensions Ref. A E c2 L2 D L1 A1 b1 L b c Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 A1 2.40 2.72 0.094 0.107 b 0.61 0.88 0.024 0.035 b1 1.14 1.70 0.044 0.067 c 0.49 0.70 0.019 0.028 c2 1.23 1.32 0.048 0.052 D 8.95 9.35 0.352 0.368 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.195 0.203 E 10 10.40 0.394 0.409 L 13 14 0.512 0.551 L1 3.50 3.93 0.138 0.155 L2 1.27 1.40 0.050 0.055 e e1 6/10 STPS16170C Package information Table 6. DPAK dimensions Dimensions Ref. E A B2 C2 L2 D R H L4 A1 B R G C A2 Millimeters Inches Min. Max Min. Max. A 2.20 2.40 0.086 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 B 0.64 0.90 0.025 0.035 B2 5.20 5.40 0.204 0.212 C 0.45 0.60 0.017 0.023 C2 0.48 0.60 0.018 0.023 D 6.00 6.20 0.236 0.244 E 6.40 6.60 0.251 0.259 G 4.40 4.60 0.173 0.181 H 9.35 10.10 0.368 0.397 0.60 MIN. L2 V2 0.80 typ. 0.031 typ. L4 0.60 1.00 0.023 0.039 V2 0° 8° 0° 8° Figure 12. DPAK footprint (dimensions in mm) 6.7 3 3 1.6 2.3 6.7 2.3 1.6 7/10 Package information Table 7. STPS16170C D2PAK dimensions Dimensions Ref. A E C2 L2 D Millimeters Inches Min. Max Min. Max. A 4.40 4.60 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 1.14 1.70 0.045 0.067 C 0.45 0.60 0.017 0.024 C2 1.23 1.36 0.048 0.054 D 8.95 9.35 0.352 0.368 E 10.00 10.40 0.393 0.409 G 4.88 5.28 0.192 0.208 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069 M 2.40 3.20 0.094 0.126 L L3 A1 B2 R C B G A2 M * V2 * FLAT ZONE NO LESS THAN 2mm R V2 0.40 typ. 0° 8° 0.016 typ. 0° 8° Figure 13. D2PAK footprint (dimensions in mm) 16.90 10.30 5.08 1.30 8.90 3.70 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 8/10 STPS16170C 3 4 Ordering information Ordering information Part Number Marking Package Weight Base qty Delivery mode STPS16170CT STPS16170CT TO-220ABB 2.23 g 50 Tube 2 STPS16170CG STPS16170CG D PAK 1.48 g 50 Tube STPS16170CG-TR STPS16170CG D2PAK 1.48 g 1000 Tape and reel 2 STPS16170CR STPS16170CR I PAK 1.49 g 50 Tube STPS16170CB-TR PS16170CB DPAK 0.3 g 2500 Tape and reel STPS16170CB PS16170CB DPAK 0.3 g 75 Tube Revision history Date Revision 13-Jul-2006 1 Description of Changes First issue 9/10 STPS16170C Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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