STMICROELECTRONICS STPS30L30CG-TR

STPS30L30C
Low drop power Schottky rectifier
Features
■
Very small conduction losses
■
Negligible switching losses
■
Extremely fast switching
■
Low forward voltage drop
■
Low thermal resistance
■
Avalanche capability specified
A1
K
A2
K
K
A2
A1
Description
This dual center tap Schottky rectifier is suited for
switch mode power supplies and high frequency
DC to DC converters.
A2
K
A1
D2PAK
STPS30L30CG
TO-220AB
STPS30L30CT
Packaged in TO-220AB, D2PAK and I2PAK, this
device is intended for use in low voltage, high
frequency inverters, free-wheeling and polarity
protection applications.
A2
A1
K
I2PAK
STPS30L30CR
Table 1.
Device summary
IF(AV)
2 x 15 A
VRRM
30 V
Tj (max)
150 °C
V
VF(typ)
0.37 V
I
Electrical characteristics (a)
Figure 1.
I
"Forward"
2 x IO
X
IF
VRRM
VR
VAR
IO
X
V
IR
VTo VF(Io) VF VF(2xIo)
"Reverse"
IAR
a. VARM and IARM must respect the reverse safe
operating area defined in Figure 12 VAR and IAR are
pulse measurements (tp < 1 µs). VR, IR, VRRM and VF,
are static characteristics
April 2010
Doc ID 5506 Rev 6
1/9
www.st.com
9
Characteristics
STPS30L30C
1
Characteristics
Table 2.
Absolute ratings (limiting values per diode)
Symbol
Parameter
Value
Unit
VRRM
Repetitive peak reverse voltage
30
V
IF(RMS)
Forward rms current
30
A
15
30
A
IF(AV)
Average forward current δ = 0.5
Per diode
Per device
Tc = 140 °C,
IFSM
Surge non repetitive forward current
tp = 10 ms sinusoidal,
220
A
IRRM
Peak repetitive reverse current
tp = 2 µs square, F= 1 kHz square
1
A
IRSM
Non repetitive peak reverse current
tp = 100 µs square
3
A
Repetitive peak avalanche power
tp = 1 µs Tj = 25 °C
5300
W
VARM (2)
Maximum repetitive peak avalanche
voltage
tp < 1 µs Tj < 150 °C
IAR < 35 A
45
V
VASM (2)
Maximum single pulse peak
avalanche voltage
tp < 1 µs Tj < 150 °C
IAR < 35 A
45
V
Tstg
Storage temperature range
-65 to + 175
°C
150
°C
10000
V/µs
PARM
(1)
Maximum operating junction temperature (3)
Tj
dV/dt
Critical rate of rise of reverse voltage
1. For temperature or pulse time duration deratings, refer to Figure 4. and Figure 5.. More details regarding the avalanche
energy measurements and diode validation in the avalanche are provided in the application notes AN1768 and AN2025.
2. Refer to Figure 12
dPtot
--------------dTj
3.
1
- condition to avoid thermal runaway for a diode on its own heatsink
< ------------------------Rth ( j – a )
Table 3.
Thermal resistance(1)
Symbol
Parameter
Rth(j-c)
Junction to case
Rth(c)
Coupling
Value
Unit
1.5
0.8
°C/W
Per diode
Total
0.1
1. When the diodes 1 and 2 are used simultaneously: Δ Tj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c)
Table 4.
Symbol
IR(1)
Static electrical characteristics (per diode)
Parameter
Reverse leakage current
Test conditions
Tj = 25 °C
Tj = 125 °C
Tj = 25 °C
VF(1)
Forward voltage drop
Tj = 125 °C
Tj = 25 °C
Tj = 125 °C
VR = VRRM
IF = 15 A
IF = 30A
1. Pulse test: tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation:
P = 0.24 x IF(AV) + 0.009 x IF2(RMS)
2/9
Doc ID 5506 Rev 6
Min.
Typ.
170
Max.
Unit
1.5
mA
350
mA
0.46
0.33
0.37
0.57
0.43
0.5
V
STPS30L30C
Figure 2.
10
9
8
7
6
5
4
3
2
1
0
Characteristics
Average forward power dissipation Figure 3.
versus average forward current
(per diode)
Average forward current per diode
versus ambient temperature
(δ = 0.5)
IF(av)(A)
PF(av)(W)
16
δ = 0.2
δ = 0.1
14
δ = 0.5
δ = 0.05
Rth(j-a)=Rth(j-c)
12
Rth(j-a)=15°C/W
10
δ=1
8
Rth(j-a)=50°C/W
6
T
IF(av) (A)
0
2
4
Figure 4.
6
8
10
δ=tp/T
12
14
16
T
4
2
tp
18
20
Normalized avalanche power
derating versus pulse duration
0
δ=tp/T
0
25
Figure 5.
P ARM (t p )
P ARM (1µs)
1
1.2
Tamb(°C)
tp
50
75
100
125
150
Normalized avalanche power
derating versus junction
temperature
P ARM (T j )
P ARM (25°C)
1
0.1
0.8
0.6
0.4
0.01
0.2
0.001
0.01
0.1
Figure 6.
IM(A)
250
225
200
175
150
125
100
75
50 IM
25
0
1E-3
T j (°C)
t p (µs)
1
0
10
100
25
1000
Non repetitive surge peak forward
current versus overload duration,
(maximum values per diode)
Figure 7.
50
75
100
125
150
Relative variation of thermal
impedance junction to case
versus pulse duration
Zth(j-c)/Rth(j-c)
1.0
0.8
Tc=25°C
Tc=75°C
0.6
0.4
δ = 0.2
Tc=110°C
0.2
t
δ = 0.5
t(s)
δ=0.5
1E-2
1E-1
1E+0
T
δ = 0.1
0.0
1E-4
Doc ID 5506 Rev 6
tp(s)
Single pulse
1E-3
1E-2
δ=tp/T
1E-1
tp
1E+0
3/9
Characteristics
Figure 8.
STPS30L30C
Reverse leakage current versus
reverse voltage applied (typical
values per diode)
Figure 9.
IR(mA)
Junction capacitance versus
reverse voltage applied
(typical values per diode)
C(nF)
1E+3
5.0
Tj=150°C
F=1MHz
Tj=25°C
1E+2
Tj=125°C
1E+1
1.0
1E+0
Tj=25°C
1E-1
1E-2
VR(V)
0
5
10
0.1
15
20
25
30
Figure 10. Forward voltage drop versus
forward current (maximum values
per diode)
VR(V)
1
2
5
10
20
50
Figure 11. Thermal resistance junction to
ambient versus copper surface
under tab
IFM(A)
Rth(j-a) (°C/W)
200
80
100
70
Tj=15 0 °C
(typical values)
Epoxy printed circuit board,
copper thickness = 35 µm
D2PAK
60
50
40
Tj=12 5 °C
10
30
Tj=25 °C
20
10
VFM(V)
1
0.0
0.2
0.4
0.6
0.8
0
1.0
1.2
1.4
1.6
S(Cu) (cm²)
0
4
8
12
16
Figure 12. Reverse safe operating area (tp < 1 µs and Tj < 150 °C)
Iarm (A)
55
50
Forbidden area
45
40
35
30
Operating area
25
Varm (V)
20
30
4/9
35
40
45
50
Doc ID 5506 Rev 6
55
60
20
24
28
32
36
40
STPS30L30C
2
Package information
Package information
●
Epoxy meets UL94, V0
●
Cooling method: by conduction (C)
●
Recommended torque value: 0.4 to 0.6 N·m
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Table 5.
TO-220AB dimensions
Dimensions
Ref.
Dia
Min.
Max.
Min.
Max.
A
4.40
4.60
0.173
0.181
C
1.23
1.32
0.048
0.051
D
2.40
2.72
0.094
0.107
E
0.49
0.70
0.019
0.027
F
0.61
0.88
0.024
0.034
F1
1.14
1.70
0.044
0.066
F2
1.14
1.70
0.044
0.066
G
4.95
5.15
0.194
0.202
G1
2.40
2.70
0.094
0.106
H2
10
10.40
0.393
0.409
C
L5
L7
L6
L2
F2
D
L9
L4
L2
F
M
G1
Inches
A
H2
F1
Millimeters
16.4 typ.
0.645 typ.
L4
13
14
0.511
0.551
L5
2.65
2.95
0.104
0.116
L6
15.25
15.75
0.600
0.620
L7
6.20
6.60
0.244
0.259
L9
3.50
3.93
0.137
0.154
E
G
M
Diam.
Doc ID 5506 Rev 6
2.6 typ.
3.75
3.85
0.102 typ.
0.147
0.151
5/9
Package information
STPS30L30C
Mounting (soldering) the I2PAK metal slug (heatsink) with alloy, like a surface mount device,
IS NOT PERMITTED. A standard through-hole mounting is mandatory.
I2PAK dimensions
Table 6.
Dimensions
Ref.
c2
L2
D
L1
A1
b1
L
b
c
e
e1
6/9
Doc ID 5506 Rev 6
Inches
Min.
Max.
Min.
Max.
A
4.40
4.60
0.173
0.181
A1
2.40
2.72
0.094
0.107
b
0.61
0.88
0.024
0.035
b1
1.14
1.70
0.044
0.067
c
0.49
0.70
0.019
0.028
c2
1.23
1.32
0.048
0.052
D
8.95
9.35
0.352
0.368
e
2.40
2.70
0.094
0.106
e1
4.95
5.15
0.195
0.203
E
10
10.40
0.394
0.409
L
13
14
0.512
0.551
L1
3.50
3.93
0.138
0.155
L2
1.27
1.40
0.050
0.055
A
E
Millimeters
STPS30L30C
Package information
Table 7.
D2PAK dimensions
Dimensions
Ref.
Millimeters
Inches
Min.
Max.
Min.
Max.
A
4.40
4.60
0.173
0.181
A1
2.49
2.69
0.098
0.106
A2
0.03
0.23
0.001
0.009
B
0.70
0.93
0.027
0.037
B2
1.14
1.70
0.045
0.067
C
0.45
0.60
0.017
0.024
C2
1.23
1.36
0.048
0.054
D
8.95
9.35
0.352
0.368
E
10.00
10.40
0.393
0.409
G
4.88
5.28
0.192
0.208
L
15.00
15.85
0.590
0.624
L2
1.27
1.40
0.050
0.055
L3
1.40
1.75
0.055
0.069
M
2.40
3.20
0.094
0.126
A
E
C2
L2
D
L
L3
A1
B2
R
C
B
G
A2
M
*
V2
* FLAT ZONE NO LESS THAN 2mm
R
0.40 typ.
V2
0°
0.016 typ.
8°
0°
8°
Figure 13. D2PAK footprint (dimensions in mm)
16.90
10.30
5.08
1.30
8.90
Doc ID 5506 Rev 6
3.70
7/9
Ordering information
3
STPS30L30C
Ordering information
Table 8.
Ordering information
Order code
Marking
Package
Weight
STPS30L30CT
STPS30L30CT
TO-220AB
STPS30L30CG
4
2.0 g
50
Tube
2
1.8 g
50
Tube
2
D PAK
STPS30L30CG-TR
STPS30L30CG
D PAK
1.8 g
1000
Tape and reel
STPS30L30CG-TR
STPS30L30CG
I2PAK
1.49 g
50
Tube
Revision history
Table 9.
8/9
STPS30L30CR
Base qty Delivery mode
Document revision history
Date
Revision
Jul-2003
5C
29-Apr-2010
6
Changes
Previous issue
Added Figure 1 and Figure 12. Added parameters VARM and VASM
to Table 2.
Doc ID 5506 Rev 6
STPS30L30C
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2010 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
Doc ID 5506 Rev 6
9/9