STTH20003TV Ultrafast high voltage rectifier Mian product characteristics IF(AV) up to 2 x 100 A VRRM 300 V A1 K1 Tj (max) 150° C A2 K2 VF (typ) 0.95 V trr (max) 90 ns K1 A1 Features and benefits K2 ■ Combines highest recovery and reverse voltage performance ■ Ultrafast, soft and noise-free recovery ■ Package insulation voltage 2500 Vrms ■ low inductance and low capacitance allow simpler layout A2 ISOTOP STTH20003TV Description Dual rectifiers suited for Switch Mode Power Supply and high frequency DC to DC converters. Order codes Packaged in ISOTOP™, this device is intended for use in low voltage, high frequency inverters, free wheeling operation, welding equipment and telecom power supplies. Table 1. Part number Marking STTH20003TV STTH20003TV Absolute ratings (limiting values, per diode, Tc = 25° C unless otherwise stated) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 300 V IF(RMS) RMS forward current 180 A IF(AV) Average forward current IFSM Surge non repetitive forward current Tstg Storage temperature range Tj Tc = 85° C δ = 0.5 tp = 10 ms sinusoidal Maximum operating junction temperature Per diode 100 Per device 200 A 100 A -55 to + 150 °C 150 °C TM: ISOTOP is a registered trademark of STMicroelectronics September 2006 Rev 2 1/7 www.st.com 7 Characteristics 1 STTH20003TV Characteristics Table 2. Thermal resistance Symbol Parameter Rth(j-c) Junction to case Rth(c) Coupling Value (max). Per diode 0.55 Total 0.35 Unit °C/W 0.1 When diodes 1 and 2 are used simultaneously: ∆ Tj(diode 1) = P(diode 1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c) Table 3. Symbol Static electrical characteristics (per diode) Parameter IR(1) Reverse leakage current VF(2) Forward voltage drop Test conditions Tj = 25° C Tj = 125° C Tj = 25° C Tj = 150° C Min. VR = 300 V Typ 0.2 Max. Unit 200 µA 2 mA 1.20 IF = 100 A V 0.8 0.95 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.75 x IF(AV) + 0.0020 IF2(RMS) Table 4. Symbol Parameter trr Reverse recovery time Tj = 25° C Test conditions IRM Reverse recovery current IF = 0.5 A Irr = 0.25 A IR = 1 A Min Typ Max Unit 55 ns IF = 1 A dIF/dt = -50 A/µs VR = 30 V 90 Tj = 125° C VR = 200 V IF = 100 A dIF/dt = -200 A/µs 18 A Softness factor Tj = 125° C IF = 100 A VR = 200 V dIF/dt = -200 A/µs tfr Forward recovery time Tj = 25° C dIF/dt = 200 A/µs IF = 100 A VFR = 1.1 x VFmax 1400 ns VFP Forward recovery voltage Tj = 25° C IF = 100 A dIF/dt = 200 A/µs VFR = 1.1 x VFmax 5 V Sfactor 2/7 Dynamic characteristics (per diode) 0.3 STTH20003TV Figure 1. Characteristics Conduction losses versus Figure 2. average forward current (per diode) P1(W) 120 δ = 0.2 Tj=125°C (Typical values) δ = 0.1 100 δ=1 100 δ = 0.05 80 IFM(A) 500 δ = 0.5 Forward voltage drop versus forward current (per diode) Tj=25°C 60 Tj=125°C 10 40 T 20 IF(av) (A) 0 0 20 Figure 3. 1.0 40 60 δ=tp/T 80 tp 100 1 0.0 120 VFM(V) 0.2 0.4 Relative variation of thermal Figure 4. impedance junction to case versus pulse duration Zth(j-c)/Rth(j-c) 0.8 1.0 1.4 1.6 1.8 2.0 Peak reverse recovery current versus dIF/dt (90% confidence, per diode) VR=200V Tj=125°C 35 IF=2xIF(av) 30 IF=IF(av) 25 0.6 1.2 IRM(A) 40 0.8 0.6 IF=0.5xIF(av) 20 0.4 15 T 10 0.2 Single pulse 0.0 1E-3 1E-2 Figure 5. 260 240 220 200 180 160 140 120 100 80 60 40 20 0 tp(s) 1E-1 δ=tp/T tp 1E+0 5E+0 Reverse recovery time versus dIF/dt (90% confidence, per diode) trr(ns) 5 0 dIF/dt(A/µs) 0 100 150 200 250 300 350 400 450 500 Figure 6. 0.6 VR=200V Tj=125°C 50 Softness factor (tb/ta) versus dIF/dt (typical values, per diode) S factor VR=200V Tj=125°C 0.5 IF=2xIF(av) 0.4 IF=IF(av) IF=0.5xIF(av) 0.3 0.2 0.1 dIF/dt(A/µs) 0 50 100 150 200 250 300 350 400 450 500 0.0 dIF/dt(A/µs) 0 50 100 150 200 250 300 350 400 450 500 3/7 Characteristics Figure 7. Relative variations of dynamic Figure 8. parameters versus junction temperature (reference: Tj = 125° C) 2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 25 8 4/7 Transient peak forward voltage versus dIF/dt (90% confidence, per diode) VFP(V) IF=IF(av) Tj=125°C 7 S factor 6 5 4 3 IRM 2 1 Tj(°C) 50 75 100 125 Forward recovery time versus dIF/dt (90% confidence, per diode) Figure 9. 1000 900 800 700 600 500 400 300 200 100 0 STTH20003TV tfr(ns) VFR=1.1 x VF max. IF=IF(av) Tj=125°C dIF/dt(A/µs) 0 50 100 150 200 250 300 350 400 450 500 0 dIF/dt(A/µs) 0 50 100 150 200 250 300 350 400 450 500 STTH20003TV 2 Package information Package information ● Epoxy meets UL94, V0 ● Cooling method: by conduction (C) ● Recommended torque value: 1.3 Nm ● Maximum torque value: 1.5 Nm Table 5. ISOTOP Dimensions Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 11.80 12.20 0.465 0.480 A1 8.90 9.10 0.350 0.358 B 7.8 8.20 0.307 0.323 C 0.75 0.85 0.030 0.033 C2 1.95 2.05 0.077 0.081 D 37.80 38.20 1.488 1.504 D1 31.50 31.70 1.240 1.248 E 25.15 25.50 0.990 1.004 E1 23.85 24.15 0.939 0.951 E G2 A C A1 C2 E2 F1 F P1 D G S D1 E2 24.80 typ. 0.976 typ. G 14.90 15.10 0.587 0.594 G1 12.60 12.80 0.496 0.504 G2 3.50 4.30 0.138 0.169 F 4.10 4.30 0.161 0.169 F1 4.60 5.00 0.181 0.197 P 4.00 4.30 0.157 0.69 P1 4.00 4.40 0.157 0.173 S 30.10 30.30 1.185 1.193 B ØP G1 E1 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 5/7 Ordering information 3 4 6/7 STTH20003TV Ordering information Ordering type Marking Package STTH20003TV STTH20003TV ISOTOP Weight Base qty 27 g 10 (without screws) (with screws) Delivery mode Tube Revision history Date Revision 1999 2C 5-Sep-2006 2 Description of Changes First issue Reformatted to current standards. Thermal resistance updated in Table 2. STTH20003TV Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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