DIP POWER CHOKE COIL SHM088HBA SERIES 1. PART NO. EXPRESSION : SHM088HBA-1R2MF (a) (b) (c) (d)(e) (a) Series code (d) Tolerance code : M = ±20% (b) Dimension code (e) F : RoHS Compliant (c) Inductance code : 1R2 = 1.20uH 2. CONFIGURATION & DIMENSIONS : F 1R2 F G C 8.0 B A D 8.0 PCB Pattern ØW Unit:m/m Series A B C D F ØW G SHM088HBA-1R2MF 8.0 Max. 8.0 Max. 8.0 Max. 3.4±0.5 5.0±0.5 0.8±0.1 1.1 Typ. SHM088HBA-1R6MF 8.0 Max. 8.0 Max. 8.0 Max. 3.4±0.5 5.0±0.5 0.7±0.1 1.0 Typ. 3. SCHEMATIC : 4. MATERIALS : (a) Core : Metal Core (b) Wire : Enamelled Copper Wire (c) Solder : Sn99.95%-Cu0.05% 5. GENERAL SPECIFICATION : a) Test Frequency : 100KHz/1.0V b) Operating temp. : -40°C to +125°C c) Ambient temp. : 20°C d) Irms (A) : Will cause an approximately temp. rise ǻT < 40°C e) Isat (A) : Will cause L0 to drop approximately 30% f) Part temperature (ambient + temp. rise) : Should not exceed 125°C under worst case operating conditions. NOTE : Specifications subject to change without notice. Please check our website for latest information. 12.05.2010 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 1 DIP POWER CHOKE COIL SHM088HBA SERIES 6. ELECTRICAL CHARACTERISTICS : Part No. Inductance L0 ( uH ) ±20% @ 0Adc Irms (A) Max. Isat (A) Max. DCR ( mȍ ) ±8% Q Min. SHM088HBA-1R2MF 1.20 12 20 2.7 40 SHM088HBA-1R6MF 1.60 12 18 3.4 40 7. CHARACTERISTICS CURVES : Inductance vs. DC Current SHM088HBA-1R6MF HMPI088HBA-1R6M 4 80 80 70 60 50 40 1 30 0.5 20 INDUCTANCE (uH) 1.5 TEMP. RISE(oC) INDUCTANCE (uH) 70 3 60 50 2 40 30 1 20 10 10 0 0 0 5 10 15 20 TEMP. RISE(oC) SHM088HBA-1R2MF HMPI088HBA-1R2M 2 0 0 0 3 DC CURRENT(A) 6 9 12 15 18 DC CURRENT(A) NOTE : Specifications subject to change without notice. Please check our website for latest information. 12.05.2010 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 2 DIP POWER CHOKE COIL SHM088HBA SERIES 8. RELIABILITY AND TEST CONDITION : ITEM PERFORMANCE TEST CONDITION Electrical Characteristics Test Inductance Refer to standard electrical characteristics list HP4284A or CH3302/1320/1320S DCR HIOKI3540 Heat Rated Current (Irms) Irms(A) will cause an temp rise < 40°C typ. Saturation Current (Isat) Isat(A) will cause Lo to drop approximately 30% Mechanical Performance Test Solderability Test More than 90% of the terminal electrode should be covered with solder. Preheating Dipping 245°C 150°C 60 seconds Natural cooling 4±1 seconds After fluxing, component shall be dipped in a melted solder bath at 245±5°C for 5 seconds Solder Heat Resistance 1. Appearance : No significant abnormality 2. Inductance change : Within ±10% of initial value Preheat : 150°C, 60sec. Solder : lead free Solder Temperature : 260±5°C Flux : rosin 260°C Dip Time : 10±0.5sec. 150°C Preheating Dipping 60 seconds Natural cooling 10±0.5 seconds Reliability Test High Temperature Life Test Low Temperature Life Test Temperature : 85±5°C Time : 500±12 hours Recovery: 4 to 24hrs of recovery under the standard condition after the removal from test chamber 1. Appearance : No damage 2. Inductance : Within ±10% of initial value. Thermal Shock No disconnection or short circuit. Temperature : -20±5°C Time : 500±12 hours Recovery: 4 to 24hrs of recovery under the standard condition after the removal from test chamber Conditions of 1 cycle. Step Temperature (°C) 1 -25±3 30±3 2 Room Temperature Within 3 Times (min.) 3 85±3 30±3 4 Room Temperature Within 3 Total : 5 cycles Recovery: 4 to 24hrs of recovery under the standard condition after the removal from test chamber Humidity Resistance 1. Appearance : No damage 2. Inductance : Within ±10% of initial value. No disconnection or short circuit. Temperature : 40±5°C Humidity : 90% to 95% Applied Current : Rated Current Time : 500±12 hours Recovery: 4 to 24hrs of recovery under the standard condition after the removal from test chamber NOTE : Specifications subject to change without notice. Please check our website for latest information. 12.05.2010 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 DIP POWER CHOKE COIL SHM088HBA SERIES 9. SOLDERIND AND MOUNTING : 9-1. Recommended PC Board Pattern F Unit:m/m Series F G SHM088HBA-1R2MF 5.0±0.5 1.1 Typ. SHM088HBA-1R6MF 5.0±0.5 1.0 Typ. 8.0 G 8.0 9-2. Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. 9-2.1 Solder Re-flow : Recommended temperature profiles for re-flow soldering in Figure 1. 9-2.2 Soldering Iron (Figure 2) : Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Note : a) Preheat circuit and products to 150°C. b) 280°C tip temperature (max) c) Never contact the ceramic with the iron tip d) 1.0mm tip diameter (max) e) Use a 20 watt soldering iron with tip diameter of 1.0mm f) Limit soldering time to 3 secs. Soldering 10s max. Natural cooling 250~260 230 180 150 60~120s 30~60s Preheating TEMPERATURE °C TEMPERATURE °C Preheating 350 Soldering Natural cooling 300 150 Over 1min. Gradual Cooling Within 3secs. Figure 1. Re-flow Soldering Figure 2. Iron Soldering NOTE : Specifications subject to change without notice. Please check our website for latest information. 12.05.2010 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4 DIP POWER CHOKE COIL SHM088HBA SERIES 10. PACKING AND QUANTITY : Size SHM088BHA Styrofoam 162 Inner Box 1134 Carton 2268 Application Notice 1. Storage Conditions : To maintain the solderabililty of terminal electrodes : a) Temperature and humidity conditions : Less than 30°C and 70% RH. b) Recommended products should be used within 6 months from the time of delivery. c) The packaging material should be kept where no chlorine or sulfur exists in the air. 2. Transportation : a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. NOTE : Specifications subject to change without notice. Please check our website for latest information. 12.05.2010 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 5