SD103AXG Low VF SMD Schottky Barrier Diode Small Signal Diode SOD-523F B C A Features Low power loss,high current capability D Low VF, low reverse current Ultra small SMD package E Moisture sensitivity level 1 F Pb free version and RoHS compliant Green compound (Halogen free) with suffix "G" on packing code and prefix "G" on date code Mechanical Data Unit (mm) Unit (inch) Min Max Min Terminal: Matte tin plated, lead free., solderable per MIL-STD-202, Method 208 guaranteed A 0.70 0.90 0.028 0.035 B 1.50 1.70 0.059 0.067 High temperature soldering guaranteed: 260°C/10s C 0.25 0.40 0.010 0.016 Polarity : Indicated by cathode band D 1.10 1.30 0.043 0.051 Weight : 1.50 mg(approach) E 0.60 0.70 0.024 0.028 Marking Code : J F 0.10 0.14 0.004 0.006 Dimensions Case :Flat lead SOD-523F small outline plastic package Ordering Information Max Pin Configuration Part No. SD103AXG RK Package SOD-523F Packing 3K / 7" Reel Marking J SD103AXG RKG SOD-523F 3K / 7" Reel J Suggested PAD Layout Maximum Ratings and Electrical Characteristics Rating at 25°C ambient temperature unless otherwise specified. Maximum Ratings Type Number Symbol Value Reverse Voltage VR 40 V Average Forward Current IF 200 mA Repetitive Peak Forward Current, tp ≦ 1S IFRM 300 mA Non-Repetitive Peak Forward Surge Current, 8.3 ms Single Half Sine-wave. IFSM 1 A RθJA 625 °C/W TJ 150 °C TJ, TSTG -65 ~ 150 °C Thermal Resistance (Junction to Ambient) Junction Temperature Storage Temperature Range Units Notes: The suggested land pattern dimensions have seen provided for reference only,as actual pad layouts may vary despending on application. Version : A10 SD103AXG Low VF SMD Schottky Barrier Diode Small Signal Diode Electrical Characteristics Rating at 25°C ambient temperature unless otherwise specified. Type Number IF= 0.1mA IF= 1mA Forward Voltage IF= 10mA IF= 100mA IF= 200mA Reverse Leakage Current VR= 25V VR=1V, f=1.0MHz Junction Capacitance Symbol VF IR CJ Min - Max 220.00 290.00 360.00 500.00 600.00 0.5 20 Units mV mV mV mV mV μA pF Symbol K D A Dimension(mm) 2.40 Max. 1.50 +0.10 178 ± 1 Tape & Reel specification TSC label Item Carrier depth Sprocket hole Reel outside diameter Top Cover Tape Carieer Tape Any Additional Label (If Required) Reel inner diameter D1 50 Min. Feed hole width Sprocke hole position Punch hole position Sprocke hole pitch Embossment center Overall tape thickness Tape width Reel width D2 E F P0 P1 T W W1 13.0 ± 0.5 1.75 ±0.10 3.50 ±0.05 4.00 ±0.10 2.00 ±0.10 0.6 Max. 8.30 Max. 14.4 Max. W1 A D2 D1 Note 1: A0, B0, and K0 are determined by component size. The clearance between the components and the cavity must be within 0.05 mm min. to 0.5 mm max. The component cannot rote more than 10o within the determined cavity. Note 2: If B1 exceeds 4.2 mm(0.165'') for 8 mm embossed tape, the tape may not feed through all tape feeders. Version : A10 SD103AXG Low VF SMD Schottky Barrier Diode Small Signal Diode Rating and Characteristic Curves FIG 2 Typical Reverse Characteristics FIG 1 Typical Forward Characteristics 1000 o Ta=25oC Ta=25 C Reverse Current (uA) Average Forward Current (mA) 1000 100 10 1 100 10 1 0.1 0.1 0 0.2 0.4 0.6 0.8 1 1.2 0 10 20 30 40 Reverse Voltage (V) Instantanceous Forward Voltage (V) FIG 3 Typical Junction Capacitance Juncation Capacitance (pF) 20 f =1 MHz Ta = 25oC 16 12 8 4 0 0 5 10 15 20 25 30 35 40 Reverse Voltage (V) Version : A10