TESDC24V Bi-directional ESD Protection Diode Small Signal Diode SOD-323 Features Meet IEC61000-4-2 (ESD) ±15kV (air), ±8kV (contact) Meet IEC61000-4-4 (EFT) rating. 40A (5/50ήs) Protects one birectional I/O line Working Voltage : 24V Pb free version, RoHS compliant, and Halogen free Unit (mm) Dimensions Mechanical Data Unit (inch) Min Max Min Max A 1.20 1.40 0.047 0.055 0.106 Case : SOD-323 small outline plastic package B 2.50 2.70 0.098 Terminal: Matte tin plated, lead free., solderable per MIL-STD-202, Method 208 guaranteed C 0.25 0.35 0.010 0.014 D 1.60 1.80 0.063 0.071 High temperature soldering guaranteed: 260°C/10s E 0.80 0.90 0.031 0.035 Mounting position: Any F 0.08 0.15 0.003 0.006 Weight : 4.85±0.5 mg G 0.19 REF 0.475 REF Marking Code : 2H Applications Pin Configutation Cell Phone Handsets and Accessories Notebooks, Desktops, and Servers Keypads, Side Keys, Portable Instrumentation Suggested PAD Layout Microprocessor based equipment 0.63 Ordering Information Part No. Package code Package TESDC5V0 RRG Packing SOD-323 3K / 7" Reel Marking 0.83 2H 1.60 Maximum Ratings and Electrical Characteristics 2.85 Rating at 25°C ambient temperature unless otherwise specified. Unit : mm Maximum Ratings Type Number Symbol Value Units Peak Pulse Power (tp=8/20μs waveform) PPP 500 W ESD per IEC 61000-4-2 (Air) ESD per IEC 61000-4-2 (Contact) VESD ±15 ±8 KV Junction and Storage Temperature Range TJ, TSTG . -55 to + 150 °C . Electrical Characteristics Type Number Reverse Stand-Off Voltage Reverse Breakdown Voltage IR= 1mA VR= 24V IPP= 5A IPP= 7A Reverse Leakage Current Clamping Voltage Junction Capacitance VR=0V, f=1.0MHz Symbol VRWM Min - Max 24 Units V V(BR) 26.7 - V IR - 1 40 52 uA Vc CJ 50 (Typ.) V pF Notes: 1. The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary despending on application. Version :A11 TESDC24V Bi-directional ESD Protection Diode Small Signal Diode Rating and Characteristic Curves FIG 1 Non-Repetitive Peak Pulse Power vs. Pulse Time FIG 2 Pulse Waveform 110 10 Waveform Parameters: tr = 8μs, td = 20μs 90 Percent of IPP Peak Pulse Power Ppp (KW) 100 1 80 70 60 50 e 0.1 30 td=Ipp/2 20 10 0 0.01 0.1 1 10 100 0 1000 5 10 15 20 25 30 Time (us) Pulse Duration (us) FIG 3 Admissible Power Dissipation Curve FIG 4 Typical Junction Capacitance 50 120 Normalized Capacitance 100 Power Rating (%) -1 40 80 60 40 20 40 30 20 10 f = 1.0MHz 0 0 0 20 40 60 80 100 120 140 160 180 o Ambient Tempeatature ( C) 0 1 2 3 4 5 Reverse Voltage (V) FIG 5 Clamping Voltage vs. Peak Pulse Current) Clamping Voltage (V) 60 50 40 30 20 10 Waveform Parameters: tr = 8μs, td = 20μs 0 0 2 4 6 8 10 Peak Pulse Current (A) Version : A11 TESDC24V Bi-directional ESD Protection Diode Small Signal Diode Applications Information Designed to protect one data, I/O, or power supply line. Designed to protect sensitive electronics from damage or latch-up due to ESD Designed to replace multilayer varistors (MLVs) in portable applications Offers superior electrical characteristics such as lower clamping voltage and no device degradation when compared to MLVs The combination of small size and high ESD surge capability makes them ideal for use in portable applications. Circuit Board Layout Recommendations Good circuit board layout is critical for the suppression of ESD induced transients. Place the ESD Protection Diode near the input terminals or connectors to restrict transient coupling. Minimize the path length between the ESD Protection Diode and the protected line. Minimize all conductive loops including power and ground loops. The ESD transient return path to ground should be kept as short as possible. Tape & Reel specification TSC label Item Top Cover Tape Symbol Carrier depth K 2.40 Max. Sprocket hole D 1.50 +0.10 Reel outside diameter Carieer Tape Any Additional Label (If Required) 10 Pitches Cumulative Tolerance on Tape ±2.0mm ( ±0.008") P D P1 T E F K0 W BB0 0 B1 D' Top Cover Tape See Note1 K For Components 2.0mm X 1.2mm and Larger A0 Dimension (mm) A 178 ± 1 Reel inner diameter D1 50 Min. Feed hole width D2 13.0 ± 0.5 Sprocke hole position E 1.75 ±0.10 Punch hole position F 3.50 ±0.05 Sprocke hole pitch P0 4.00 ±0.10 Embossment center P1 2.00 ±0.10 Overall tape thickness T 0.6 Max. Tape width W 8.30 Max. Reel width W1 14.4 Max. Center Lines of Cavity Embossment For Machine Reference Only Including Draft and RADLL Concentric Around B 0 W1 A D2 D1 Direction of Feed Note 1: A0, B0, and K0 are determined by component size. The clearance between the components and the cavity must be within 0.05 mm min. to 0.5 mm max. The component cannot rote more than 10o within the determined cavity. Note 2: If B1 exceeds 4.2 mm(0.165'') for 8 mm embossed tape, the tape may not feed through all tape feeders. Version : A11