TSC TSS0230U

TSS0230U
Pb
0.2Amp Surface Mount Schottky Barrier
Diode
RoHS
COMPLIANCE
0603
Features
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Designed for mounting on small surface
Extremely thin/leadless package
Low capacitance
Low forward voltage drop
High temperature soldering:
260oC/10 seconds at terminals
Chip version in 0603
ITEM
L
Mechanical Data
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W
Case: 0603 Standard package, molded plastic
Terminals: Gold plated, solderable per
MIL-STD-750, method 2026.
Polarity: Indicated by cathode band
Mounting position: Any
Package code: BB
Weight: 0.003 gram (approximately)
T
C
D
0603
0.071(1.80)
0.063(1.60)
0.039(1.00)
0.031(0.80)
0.033(0.85)
0.027(0.70)
0.018(0.45)
Typical
0.028(0.70)
Typical
Dimensions in inches and (millimeters)
Maximum Ratings and Electrical characteristics
o
Rating at 25 C ambient temperature unless otherwise specified.
Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%
Symbol
VRRM
0603
35
Units
V
DC Reverse Voltage
VR
30
V
Average Forward Current
IO
200
mA
Type Number
Repetitive Peak Reverse Voltage
Peak Forward Surge Current 8.3ms single half
sine-wave superimposed on rate load (JEDEC method)
Power Dissipation
Forward Voltage @ IF=200mA
Reverse Leakage Current
Typical capacitance between terminals
VR=1V, f =1.0MHz reverse voltage
Storage Temperature
1.0
150
0.6
A
mW
V
CJ
1.0
1.5
uA
pF
TJ
TSTG
-40 to + 125
-40 to + 125
VF
VR=1 0V
Junction Temperature
IFSM
Pd
IR
o
C
C
o
Version: A07