FAIRCHILD FGY75N60SMD

FGY75N60SMD
600V, 75A Field Stop IGBT
Features
General Description
• High Current Capability
Using Novel Field Stop IGBT Technology, Fairchild’s new series
of Field Stop IGBTs offer the optimum performance for Solar
Inverter, UPS, Welder, SMPS and PFC applications where low
conduction and switching losses are essential.
• Low Saturation Voltage: VCE(sat) = 1.9V @ IC = 75A
• High Input Impedance
• Fast Switching
• RoHS Compliant
Application
• Solar Inverter, UPS, Welder, SMPS, PFC
C
G
G
C
E
Power-247
E
Absolute Maximum Ratings
Symbol
Description
Ratings
Units
VCES
Collector to Emitter Voltage
600
V
VGES
Gate to Emitter Voltage
± 20
V
IC
ICM (1)
IF
IFM (1)
PD
TJ
Collector Current
@ TC = 25oC
150
A
Collector Current
@ TC = 100oC
75
A
Pulsed Collector Current
@ TC = 25oC
225
A
25oC
75
A
50
A
225
A
750
W
Diode Forward Current
@ TC =
Diode Forward Current
@ TC = 100oC
Pulsed Diode Maximum Forward Current
Maximum Power Dissipation
@ TC = 25oC
Maximum Power Dissipation
o
@ TC = 100 C
Operating Junction Temperature
Tstg
Storage Temperature Range
TL
Maximum Lead Temp. for soldering
Purposes, 1/8” from case for 5 seconds
375
W
-55 to +175
o
-55 to +175
oC
300
o
C
C
Notes:
1: Repetitive rating: Pulse width limited by max. junction temperature.
©2010 Fairchild Semiconductor Corporation
FGY75N60SMD Rev. A2
1
www.fairchildsemi.com
FGY75N60SMD 600V, 75A Field Stop IGBT
March 2011
Symbol
Parameter
Typ.
Max.
Units
RθJC(IGBT)
Thermal Resistance, Junction to Case
-
0.2
o
RθJC(Diode)
Thermal Resistance, Junction to Case
-
0.7
oC/W
RθJA
Thermal Resistance, Junction to Ambient
-
40
oC/W
C/W
Package Marking and Ordering Information
Device Marking
Device
Package
Packaging Type
Qty per Tube
FGY75N60SMD
FGY75N60SMD
Power-247
Tube
30ea
Electrical Characteristics of the IGBT
Symbol
Parameter
TC = 25°C unless otherwise noted
Test Conditions
Min.
Typ.
Max.
Units
600
-
-
V
-
V/oC
Off Characteristics
BVCES
Collector to Emitter Breakdown Voltage VGE = 0V, IC = 250μA
ΔBVCES
ΔTJ
Temperature Coefficient of Breakdown
Voltage
VGE = 0V, IC = 250μA
-
0.67
ICES
Collector Cut-Off Current
VCE = VCES, VGE = 0V
-
-
250
μA
IGES
G-E Leakage Current
VGE = VGES, VCE = 0V
-
-
±400
nA
IC = 250μA, VCE = VGE
On Characteristics
VGE(th)
VCE(sat)
G-E Threshold Voltage
Collector to Emitter Saturation Voltage
3.5
5.0
6.5
V
IC = 75A, VGE = 15V
-
1.90
2.50
V
IC = 75A, VGE = 15V,
TC = 175oC
-
2.14
-
V
-
3800
-
pF
-
390
-
pF
-
105
-
pF
24
32
ns
Dynamic Characteristics
Cies
Input Capacitance
Coes
Output Capacitance
Cres
Reverse Transfer Capacitance
VCE = 30V, VGE = 0V,
f = 1MHz
Switching Characteristics
td(on)
Turn-On Delay Time
-
tr
Rise Time
-
56
73
ns
td(off)
Turn-Off Delay Time
-
136
177
ns
tf
Fall Time
Eon
Turn-On Switching Loss
Eoff
Ets
VCC = 400V, IC = 75A,
RG = 3Ω, VGE = 15V,
Inductive Load, TC = 25oC
-
22
29
ns
-
2.3
2.99
mJ
Turn-Off Switching Loss
-
0.77
1.00
mJ
Total Switching Loss
-
3.07
3.99
mJ
td(on)
Turn-On Delay Time
-
23
-
ns
tr
Rise Time
-
53
-
ns
td(off)
Turn-Off Delay Time
-
146
-
ns
tf
Fall Time
-
15
-
ns
VCC = 400V, IC = 75A,
RG = 3Ω, VGE = 15V,
Inductive Load, TC = 175oC
Eon
Turn-On Switching Loss
-
3.60
-
mJ
Eoff
Turn-Off Switching Loss
-
1.11
-
mJ
Ets
Total Switching Loss
-
4.71
-
mJ
FGY75N60SMD Rev. A2
2
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FGY75N60SMD 600V, 75A Field Stop IGBT
Thermal Characteristics
Qg
Total Gate Charge
Qge
Gate to Emitter Charge
Qgc
Gate to Collector Charge
VCE = 400V, IC = 75A,
VGE = 15V
Electrical Characteristics of the Diode
Symbol
TC = 25°C unless otherwise noted
Parameter
-
248
370
nC
-
28
42
nC
-
129
195
nC
TC = 25°C unless otherwise noted
Test Conditions
Min.
o
Typ.
Max
TC = 25 C
-
1.75
2.1
TC = 175oC
-
1.35
-
Reverse Recovery Energy
TC = 175oC
-
0.14
-
trr
Diode Reverse Recovery Time
TC = 25oC
-
41
55
TC = 175oC
-
126
-
Qrr
Diode Reverse Recovery Charge
TC = 25oC
-
81
115
o
-
736
-
VFM
Diode Forward Voltage
Erec
IF = 50A
IF = 50A, dIF/dt = 200A/μs
VR=400V
FGY75N60SMD Rev. A2
TC = 175 C
3
Units
V
mJ
ns
nC
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FGY75N60SMD 600V, 75A Field Stop IGBT
Electrical Characteristics of the IGBT
Figure 1. Typical Output Characteristics
225
Figure 2. Typical Output Characteristics
225
o
TC = 25 C
20V
o
20V
TC = 175 C
15V
15V
12V
180
Collector Current, IC [A]
Collector Current, IC [A]
12V
10V
135
90
VGE = 8V
45
180
10V
135
90
VGE = 8V
45
0
0
1
2
3
4
Collector-Emitter Voltage, VCE [V]
0
5
0
Figure 3. Typical Saturation Voltage
Characteristics
225
Common Emitter
VCE = 20V
Common Emitter
VGE = 15V
180 TC = 25oC
Collector Current, IC [A]
Collector Current, IC [A]
5
Figure 4. Transfer Characteristics
225
o
TC = 175 C
135
90
o
180 TC = 25 C
o
TC = 175 C
135
45
90
45
0
0
1
2
3
4
Collector-Emitter Voltage, VCE [V]
0
5
2
Figure 5. Saturation Voltage vs. Case
Temperature at Variant Current Level
4
6
8
10
Gate-Emitter Voltage,VGE [V]
12
Figure 6. Saturation Voltage vs. VGE
3.5
20
Common Emitter
VGE = 15V
Collector-Emitter Voltage, VCE [V]
Collector-Emitter Voltage, VCE [V]
1
2
3
4
Collector-Emitter Voltage, VCE [V]
3.0
150A
2.5
75A
2.0
IC = 40A
1.5
Common Emitter
o
TC = -40 C
16
12
8
150A
4
75A
IC = 40A
1.0
25
0
50
75
100
125
150
175
o
Collector-EmitterCase Temperature, TC [ C]
FGY75N60SMD Rev. A2
4
4
8
12
16
Gate-Emitter Voltage, VGE [V]
20
www.fairchildsemi.com
FGY75N60SMD 600V, 75A Field Stop IGBT
Typical Performance Characteristics
Figure 7. Saturation Voltage vs. VGE
20
20
Common Emitter
Common Emitter
o
o
TC = 25 C
Collector-Emitter Voltage, VCE [V]
Collector-Emitter Voltage, VCE [V]
Figure 8. Saturation Voltage vs. VGE
16
12
8
150A
4
75A
IC = 40A
0
4
8
12
16
Gate-Emitter Voltage, VGE [V]
12
8
150A
4
75A
IC = 40A
4
8
12
16
Gate-Emitter Voltage, VGE [V]
20
Figure 10. Gate charge Characteristics
15
8000
Common Emitter
Common Emitter
VGE = 0V, f = 1MHz
Gate-Emitter Voltage, VGE [V]
o
o
TC = 25 C
6000
Capacitance [pF]
16
0
20
Figure 9. Capacitance Characteristics
TC = 175 C
Cies
4000
Coes
2000
TC = 25 C, ICE=75A
300V
12
VCC = 200V
400V
9
6
3
Cres
0
0
1
10
Collector-Emitter Voltage, VCE [V]
Figure 11. Turn-off Characteristics vs.
Gate Resistance
5500
0
30
250
200
o
100
TC = 25 C
o
TC = 175 C
tr
Switching Time [ns]
Switching Time [ns]
100
150
200
Gate Charge, Qg [nC]
Figure 12. Turn-on Characteristics vs.
Gate Resistance
Common Emitter
VCC = 400V, VGE = 15V
IC = 75A
1000
50
td(off)
100
tf
td(on)
Common Emitter
VCC = 400V, VGE = 15V
IC = 75A
o
TC = 25 C
o
TC = 175 C
10
0
10
20
30
40
10
50
0
Gate Resistance, RG [Ω ]
FGY75N60SMD Rev. A2
10
20
30
40
50
Gate Resistance, RG [Ω ]
5
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FGY75N60SMD 600V, 75A Field Stop IGBT
Typical Performance Characteristics
Figure 13. Turn-off Characteristics vs.
Collector Current
Figure 14. Turn-on Characteristics vs.
Collector Current
200
1000
Common Emitter
VGE = 15V, RG = 3Ω
Common Emitter
VGE = 15V, RG = 3Ω
o
o
100
TC = 25 C
o
TC = 175 C
Switching Time [ns]
TC = 175 C
Switching Time [ns]
tr
TC = 25 C
o
td(off)
100
tf
td(on)
10
5
10
0
30
60
90
120
0
150
30
Figure 15. Switching Loss vs. Collector Current
90
120
150
Figure 16. Switching Loss vs. Gate Resistance
30
30
Common Emitter
VCC = 400V, VGE = 15V
Common Emitter
VGE = 15V, RG = 3Ω
10
o
TC = 25 C
IC = 75A
Eon
o
TC = 175 C
1
Eoff
o
10
Switching Loss [mJ]
Switching Loss [mJ]
60
Collector Current, IC [A]
Collector Current, IC [A]
TC = 25 C
o
TC = 175 C
Eon
Eoff
1
0.1
0.5
0
30
60
90
120
150
0
10
20
30
40
50
Gate Resistance, RG [Ω ]
Collector Current, IC [A]
Figure 17. SOA Characteristics
Figure 18. Turn off Switching SOA
Characteristics
500
300
10μs
100
Collector Current, IC [A]
Collector Current, Ic [A]
100
100μs
1ms
10
10 ms
DC
1
*Notes:
o
1. TC = 25 C
10
Safe Operating Area
o
2. TJ = 175 C
3. Single Pulse
0.1
1
FGY75N60SMD Rev. A2
10
100
Collector-Emitter Voltage, VCE [V]
o
1
10
1000
VGE = 15V, TC = 175 C
100
1000
Collector-Emitter Voltage, VCE [V]
6
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FGY75N60SMD 600V, 75A Field Stop IGBT
Typical Performance Characteristics
Figure 19. Current Derating
Figure 20. Load Current vs. Frequency
160
250
o
TJ <= 175 C, D = 0.5, VCE = 400V
Collector Current, IC [A]
140
Collector Current, IC [A]
Square Wave
Common Emitter
VGE = 15V
120
100
80
60
40
VGE = 15/0V, RG = 3Ω
200
150
o
TC = 75 C
100
o
TC = 100 C
50
20
0
25
0
1k
50
75
100
125
150
175
o
Collector-EmitterCase Temperature, TC [ C]
Figure 21. Forward Characteristics
10000
Reverse Current, ICES [μA]
100
o
o
TC = 25 C
TC = 175 C
o
TC = 75 C
o
TC = 125 C
10
o
TC = 25 C
o
TC = 75 C
o
1000
o
TC = 175 C
100
o
TC = 125 C
10
1
o
TC = 75 C
0.1
TC = 125 C
o
o
TC = 25 C
TC = 175 C
1
0
1
2
Forward Voltage, VF [V]
0.01
0
3
Figure 23. Stored Charge
500
600
o
TC = 25 C
Reverse Recovery Time, trr [ns]
o
750 TC = 175 C
600
450
di/dt = 200A/μs
di/dt = 100A/μs
300
150
0
20
40
60
o
TC = 175 C
160
---
120
di/dt = 100A/μs
di/dt = 200A/μs
80
40
0
80
0
Forward Current, IF [A]
FGY75N60SMD Rev. A2
200
300
400
Reverse Voltage, VR [V]
200
o
TC = 25 C
0
100
Figure 24. Reverse Recovery Current
900
Stored Recovery Charge, Qrr [nC]
1M
Figure 22. Reverse Current
400
Forward Current, IF [A]
10k
100k
Switching Frequency, f [Hz]
20
40
60
80
Forward Current, IF [A]
7
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FGY75N60SMD 600V, 75A Field Stop IGBT
Typical Performance Characteristics
FGY75N60SMD 600V, 75A Field Stop IGBT
Typical Performance Characteristics
Figure 25. Transient Thermal Impedance of IGBT
Thermal Response [Zthjc]
0.3
0.1
0.5
0.2
0.1
0.05
0.01
0.02
0.01
PDM
t1
single pulse
t2
Duty Factor, D = t1/t2
Peak Tj = Pdm x Zthjc + TC
1E-3
1E-5
1E-4
1E-3
0.01
0.1
1
Rectangular Pulse Duration [sec]
Figure 26. Transient Thermal Impedance of Diode
Thermal Response [Zthjc]
1
0.5
0.2
0.1
0.1
0.05
PDM
0.02
0.01
0.01
t1
t2
Duty Factor, D = t1/t2
Peak Tj = Pdm x Zthjc + TC
single pulse
0.005
1E-5
1E-4
1E-3
0.01
0.1
1
Rectangular Pulse Duration [sec]
FGY75N60SMD Rev. A2
8
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FGY75N60SMD 600V, 75A Field Stop IGBT
Mechanical Dimensions
Power-247
Dimensions in Millimeters
FGY75N60SMD Rev. A2
9
www.fairchildsemi.com
tm
tm
tm
*Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
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2.
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Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative / In Design
Datasheet contains the design specifications for product development. Specifications
may change in any manner without notice.
Preliminary
First Production
Datasheet contains preliminary data; supplementary data will be published at a later
date. Fairchild Semiconductor reserves the right to make changes at any time without
notice to improve design.
No Identification Needed
Full Production
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to
make changes at any time without notice to improve the design.
Obsolete
Not In Production
Datasheet contains specifications on a product that is discontinued by Fairchild
Semiconductor. The datasheet is for reference information only.
Rev. I53
FGY75N60SMD Rev. A2
10
www.fairchildsemi.com
FGY75N60SMD 600V, 75A Field Stop IGBT
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