FAIRCHILD FDMC8878_12

FDMC8878
N-Channel Power Trench® MOSFET
30V, 16.5A, 14m:
Features
General Description
„ Max rDS(on) = 14m: at VGS = 10V, ID = 9.6A
This N-Channel MOSFET is a rugged gate version of
advanced
Power
Trench
Fairchild Semiconductor‘s
process. It has been optimized for power management
applications.
„ Max rDS(on) = 17m: at VGS = 4.5V, ID = 8.7A
„ Low Profile - 0.8 mm max in MLP 3.3X3.3
„ RoHS Compliant
Application
„ DC - DC Conversion
Bottom
Top
8
1
7
D D D D
6 5
2 3 4
G S S S Pin 1
D
5
4 G
D
6
3 S
D
7
2 S
D
8
1 S
MLP 3.3x3.3
MOSFET Maximum Ratings TA = 25°C unless otherwise noted
Symbol
VDS
Drain to Source Voltage
Parameter
VGS
Gate to Source Voltage
Drain Current -Continuous (Package limited)
ID
TC = 25°C
-Continuous (Silicon limited)
TC = 25°C
-Continuous
TA = 25°C
TJ, TSTG
Units
V
±20
V
16.5
38
(Note 1a)
-Pulsed
PD
Ratings
30
9.6
A
60
Power Dissipation
TC = 25°C
Power Dissipation
TA = 25°C
31
(Note 1a)
Operating and Storage Junction Temperature Range
2.1
-55 to +150
W
°C
Thermal Characteristics
RTJC
Thermal Resistance, Junction to Case
RTJA
Thermal Resistance, Junction to Ambient
4
(Note 1a)
60
°C/W
Package Marking and Ordering Information
Device Marking
FDMC8878
Device
FDMC8878
©2012 Fairchild Semiconductor Corporation
FDMC8878 Rev.D4
Package
MLP 3.3X3.3
1
Reel Size
13 ”
Tape Width
12 mm
Quantity
3000 units
www.fairchildsemi.com
FDMC8878 N-Channel Power Trench® MOSFET
July 2012
Parameter
Symbol
Test Conditions
Min
Typ
Max
Units
Off Characteristics
BVDSS
Drain to Source Breakdown Voltage
ID = 250PA, VGS = 0V
'BVDSS
'TJ
Breakdown Voltage Temperature
Coefficient
30
ID = 250PA, referenced to 25°C
IDSS
Zero Gate Voltage Drain Current
IGSS
Gate to Source Leakage Current
V
20
mV/°C
VDS = 24V,
VGS = 0V
1
TJ = 125°C
100
VGS = ±20V, VDS = 0V
PA
±100
nA
3
V
On Characteristics
VGS(th)
Gate to Source Threshold Voltage
VGS = VDS, ID = 250PA
'VGS(th)
'TJ
Gate to Source Threshold Voltage
Temperature Coefficient
ID = 250PA, referenced to 25°C
VGS = 10V, ID = 9.6A
9.6
14.0
rDS(on)
Drain to Source On Resistance
VGS = 4.5V, ID = 8.7A
12.1
17.0
VGS = 10V, ID = 9.6A , TJ = 125°C
13.5
20.0
gFS
VDS = 5V, ID = 9.6A
Forward Transconductance
1
1.7
-5.7
mV/°C
35
m:
S
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate Resistance
VDS = 15V, VGS = 0V,
f = 1MHz
f = 1MHz
1000
1230
pF
183
255
pF
118
180
pF
:
1.1
Switching Characteristics
td(on)
Turn-On Delay Time
tr
Rise Time
td(off)
Turn-Off Delay Time
tf
Fall Time
Qg(TOT)
Total Gate Charge
Qgs
Gate to Source Gate Charge
Qgd
Gate to Drain “Miller” Charge
VDD = 15V, ID = 9.6A
VGS = 10V, RGEN = 6:
VGS = 10V , VDD = 15V ,
ID = 9.6A
8
16
ns
4
10
ns
20
36
ns
3
10
ns
18
26
nC
2.8
nC
3.9
nC
Drain-Source Diode Characteristics
VSD
Source to Drain Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
VGS = 0V, IS = 9.6A
(Note 2)
IF = 9.6A, di/dt = 100A/Ps
0.8
1.2
V
23
35
ns
14
21
nC
Notes:
1: RTJA is determined with the device mounted on a 1in2 pad 2 oz copper pad on a 1.5 x 1.5 in. board of FR-4 material. RTJC is guaranteed by design while RTCA is determined by
the user's board design.
b. 135°C/W when mounted on a
minimum pad of 2 oz copper
a. 60°C/W when mounted on
a 1 in2 pad of 2 oz copper
2: Pulse Test: Pulse Width < 300Ps, Duty cycle < 2.0%.
©2012 Fairchild Semiconductor Corporation
FDMC8878 Rev. D4
2
www.fairchildsemi.com
FDMC8878 N-Channel Power Trench® MOSFET
Electrical Characteristics TJ = 25°C unless otherwise noted
VGS = 10V
50
VGS = 3.5V
40
VGS = 4.5V
VGS = 4V
30
VGS = 3V
20
10
PULSE DURATION = 80Ps
DUTY CYCLE = 0.5%MAX
0
0
1
2
3
VDS, DRAIN TO SOURCE VOLTAGE (V)
2.5
NORMALIZED
DRAIN TO SOURCE ON-RESISTANCE
ID, DRAIN CURRENT (A)
60
PULSE DURATION = 80Ps
DUTY CYCLE = 0.5%MAX
2.0
VGS = 3V
1.0
VGS = 10V
0.5
0
4
20
10
30
40
50
60
ID, DRAIN CURRENT(A)
Figure 2. Normalized On-Resistance
vs Drain Current and Gate Voltage
1.6
30
ID = 9.6A
VGS = 10V
1.4
rDS(on), DRAIN TO
SOURCE ON-RESISTANCE (m:)
NORMALIZED
DRAIN TO SOURCE ON-RESISTANCE
VGS = 3.5V
1.5
Figure 1. On-Region Characteristics
1.2
1.0
0.8
0.6
-75
-50
-25
0
25
50
75
100 125 150
ID = 9.6A
20
TJ = 125oC
15
10
TJ = 25oC
5
3
Figure 3. Normalized On- Resistance
vs Junction Temperature
IS, REVERSE DRAIN CURRENT (A)
PULSE DURATION = 80Ps
DUTY CYCLE = 0.5%MAX
VDD = 5V
40
30
TJ = 25oC
20
TJ = -55oC
TJ = 150oC
10
0
0
1
2
3
10
100
VGS = 0V
10
1
0.1
Figure 5. Transfer Characteristics
TJ = 25oC
TJ = 150oC
TJ = -55oC
0.01
0.001
0.0
4
VGS, GATE TO SOURCE VOLTAGE (V)
©2012 Fairchild Semiconductor Corporation
FDMC8878 Rev. D4
9
4
5
6
7
8
VGS, GATE TO SOURCE VOLTAGE (V)
Figure 4. On-Resistance vs Gate to
Source Voltage
60
50
PULSE DURATION = 80Ps
DUTY CYCLE = 0.5%MAX
25
TJ, JUNCTION TEMPERATURE (oC)
ID, DRAIN CURRENT (A)
VGS = 4V
VGS = 4.5V
0.2
0.4
0.6
0.8
1.0
VSD, BODY DIODE FORWARD VOLTAGE (V)
1.2
Figure 6. Source to Drain Diode
Forward Voltage vs Source Current
3
www.fairchildsemi.com
FDMC8878 N-Channel Power Trench® MOSFET
Typical Characteristics TJ = 25°C unless otherwise noted
VGS, GATE TO SOURCE VOLTAGE(V)
10
3000
ID = 9.6A
VDD = 15V
Ciss
CAPACITANCE (pF)
8
VDD = 10V
6
VDD = 20V
4
2
1000
Coss
50
0.1
0
0
5
10
15
20
1
Figure 7. Gate Charge Characteristics
Figure 8. Capacitance vs Drain
to Source Voltage
12
ID, DRAIN CURRENT (A)
20
IAS, AVALANCHE CURRENT(A)
30
10
VDS, DRAIN TO SOURCE VOLTAGE (V)
Qg, GATE CHARGE(nC)
10
TJ =
25oC
TJ = 125oC
10
8
VGS = 10V
6
VGS = 4.5V
4
2
o
RTJA = 60 C/W
1
0.01
0
80
0.1
1
10
tAV, TIME IN AVALANCHE(ms)
25
P(PK), PEAK TRANSIENT POWER (W)
10
1ms
10ms
1
100ms
1s
10s
DC
SINGLE PULSE
TJ = MAX RATED
TA = 25oC
0.01
0.001
0.1
1
10
80
VDS, DRAIN to SOURCE VOLTAGE (V)
125
150
300
VGS = 10V
TA = 25oC
FOR TEMPERATURES
100
ABOVE 25oC DERATE PEAK
CURRENT AS FOLLOWS:
150 – T A
----------------------125
I = I25
10
SINGLE PULSE
1
0.5
-3
10
-2
10
-1
0
1
10
10
10
t, PULSE WIDTH (s)
2
10
3
10
Figure 12. Single Pulse Maximum
Power Dissipation
Figure 11. Forward Bias Safe
Operating Area
©2012 Fairchild Semiconductor Corporation
FDMC8878 Rev. D4
100
Figure 10. Maximum Continuous Drain
Current vs Ambient Temperature
100us
OPERATION IN THIS
AREA MAY BE
LIMITED BY rDS(on)
75
o
80
0.1
50
TA, AMBIENT TEMPERATURE ( C)
Figure 9. Unclamped Inductive
Switching Capability
ID, DRAIN CURRENT (A)
Crss
f = 1MHz
VGS = 0V
100
4
www.fairchildsemi.com
FDMC8878 N-Channel Power Trench® MOSFET
Typical Characteristics TJ = 25°C unless otherwise noted
2
NORMALIZED THERMAL
IMPEDANCE, ZTJA
1
0.1
DUTY CYCLE-DESCENDING ORDER
D = 0.5
0.2
0.1
0.05
0.02
0.01
PDM
t1
t2
0.01
NOTES:
DUTY FACTOR: D = t1/t2
PEAK TJ = PDM x ZTJA x RTJA + TA
SINGLE PULSE
0.003
-3
10
-2
10
-1
0
10
10
1
10
2
10
3
10
t, RECTANGULAR PULSE DURATION (s)
Figure 13. Transient Thermal Response Curve
©2012 Fairchild Semiconductor Corporation
FDMC8878 Rev. D4
5
www.fairchildsemi.com
FDMC8878 N-Channel Power Trench® MOSFET
Typical Characteristics TJ = 25°C unless otherwise noted
FDMC8878 N-Channel Power Trench® MOSFET
Dimensional Outline and Pad Layout
©2012 Fairchild Semiconductor Corporation
FDMC8878 Rev. D4
6
www.fairchildsemi.com
tm
tm
*Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
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PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
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THEREIN, WHICH COVERS THESE PRODUCTS.
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As used here in:
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and (c) whose failure to perform when properly used in accordance with
instructions for use provided in the labeling, can be reasonably
expected to result in a significant injury of the user.
2.
A critical component in any component of a life support, device, or
system whose failure to perform can be reasonably expected to cause
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effectiveness.
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PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Advance Information
Formative / In Design
Datasheet contains the design specifications for product development. Specifications
may change in any manner without notice.
Definition
Preliminary
First Production
Datasheet contains preliminary data; supplementary data will be published at a later
date. Fairchild Semiconductor reserves the right to make changes at any time without
notice to improve design.
No Identification Needed
Full Production
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to
make changes at any time without notice to improve the design.
Obsolete
Not In Production
Datasheet contains specifications on a product that is discontinued by Fairchild
Semiconductor. The datasheet is for reference information only.
Rev. I61
©2012 Fairchild Semiconductor Corporation
FDMC8878 Rev. D4
7
www.fairchildsemi.com
FDMC8878 N-Channel Power Trench® MOSFET
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