FAIRCHILD FDH45N50F_08

UniFET
FDH45N50F_F133
TM
500V N-Channel MOSFET, FRFET
Features
Description
• 45A, 500V, RDS(on) = 0.12Ω @VGS = 10 V
These N-Channel enhancement mode power field effect transistors are produced using Fairchild’s proprietary, planar stripe,
DMOS technology.
• Low gate charge ( typical 105 nC)
• Low Crss ( typical 62 pF)
This advanced technology has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulse in the avalanche and
commutation mode. These devices are well suited for high efficient switched mode power supplies and active power factor
correction.
• Fast switching
• 100% avalanche tested
• Improved dv/dt capability
D
G
TO-247
G D
S
FDH Series
S
Absolute Maximum Ratings
Symbol
Parameter
FDH45N50F_F133
Unit
500
V
45
28.4
A
A
180
A
±30
V
VDSS
Drain-Source Voltage
ID
Drain Current
- Continuous (TC = 25°C)
- Continuous (TC = 100°C)
IDM
Drain Current
- Pulsed
VGSS
Gate-Source voltage
EAS
Single Pulsed Avalanche Energy
(Note 2)
1868
mJ
IAR
Avalanche Current
(Note 1)
45
A
EAR
Repetitive Avalanche Energy
(Note 1)
62.5
mJ
dv/dt
Peak Diode Recovery dv/dt
(Note 3)
50
V/ns
PD
Power Dissipation
625
5
W
W/°C
-55 to +150
°C
300
°C
(Note 1)
(TC = 25°C)
- Derate above 25°C
TJ, TSTG
Operating and Storage Temperature Range
TL
Maximum Lead Temperature for Soldering Purpose,
1/8” from Case for 5 Seconds
Thermal Characteristics
Symbol
Parameter
RθJC
Thermal Resistance, Junction-to-Case
RθCS
Thermal Resistance, Case-to-Sink
RθJA
Thermal Resistance, Junction-to-Ambient
©2008 Fairchild Semiconductor Corporation
FDH45N50F_F133 Rev. C
1
Min.
Max.
Unit
--
0.2
°C/W
0.24
--
°C/W
--
40
°C/W
www.fairchildsemi.com
FDH45N50F_F133 500V N-Channel MOSFET, FRFET
October 2008
Device Marking
Device
Package
Reel Size
Tape Width
Quantity
FDH45N50F_F133
FDH45N50F_F133
TO-247
-
-
30
Electrical Characteristics
Symbol
TC = 25°C unless otherwise noted
Parameter
Conditions
Min.
Typ.
Max Units
500
--
--
V
Off Characteristics
BVDSS
Drain-Source Breakdown Voltage
VGS = 0V, ID = 250μA
ΔBVDSS
/ ΔTJ
Breakdown Voltage Temperature
Coefficient
ID = 250μA, Referenced to 25°C
--
0.5
--
V/°C
IDSS
Zero Gate Voltage Drain Current
VDS = 500V, VGS = 0V
VDS = 400V, TC = 125°C
---
---
25
250
μA
μA
IGSSF
Gate-Body Leakage Current, Forward
VGS = 30V, VDS = 0V
--
--
100
nA
IGSSR
Gate-Body Leakage Current, Reverse
VGS = -30V, VDS = 0V
--
--
-100
nA
On Characteristics
VGS(th)
Gate Threshold Voltage
VDS = VGS, ID = 250μA
3.0
--
5.0
V
RDS(on)
Static Drain-Source
On-Resistance
VGS = 10V, ID = 22.5A
--
0.105
0.12
Ω
gFS
Forward Transconductance
VDS = 40V, ID = 22.5A
--
49.0
--
S
--
5100
6630
pF
--
790
1030
pF
(Note 4)
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
VDS = 25V, VGS = 0V,
f = 1.0MHz
Crss
Reverse Transfer Capacitance
--
62
--
pF
Coss
Output Capacitance
VDS = 400V, VGS = 0V, f = 1.0MHz
--
161
--
pF
Coss eff.
Effective Output Capacitance
VDS = 0V to 400V, VGS = 0V
--
342
--
pF
VDD = 250V, ID = 48A
RG = 25Ω
--
140
290
ns
--
500
1010
ns
--
215
440
ns
--
245
500
ns
--
105
137
nC
--
33
--
nC
--
45
--
nC
Switching Characteristics
td(on)
Turn-On Delay Time
tr
Turn-On Rise Time
td(off)
Turn-Off Delay Time
tf
Turn-Off Fall Time
Qg
Total Gate Charge
Qgs
Gate-Source Charge
Qgd
Gate-Drain Charge
(Note 4, 5)
VDS = 400V, ID = 48A
VGS = 10V
(Note 4, 5)
Drain-Source Diode Characteristics and Maximum Ratings
IS
Maximum Continuous Drain-Source Diode Forward Current
--
--
45
A
ISM
Maximum Pulsed Drain-Source Diode Forward Current
--
--
180
A
VSD
Drain-Source Diode Forward Voltage
VGS = 0V, IS = 45A
--
--
1.4
V
trr
Reverse Recovery Time
188
--
ns
Reverse Recovery Charge
VGS = 0V, IS = 45A
dIF/dt =100A/μs
--
Qrr
--
0.64
--
μC
(Note 4)
NOTES:
1. Repetitive Rating: Pulse width limited by maximum junction temperature
2. L = 1.46mH, IAS = 48A, VDD = 50V, RG = 25Ω, Starting TJ = 25°C
3. ISD ≤ 45A, di/dt ≤ 200A/μs, VDD ≤ BVDSS, Starting TJ = 125°C
4. Pulse Test: Pulse width ≤ 300μs, Duty Cycle ≤ 2%
5. Essentially Independent of Operating Temperature Typical Characteristics
FDH45N50F_F133 Rev. C
2
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FDH45N50F_F133 500V N-Channel MOSFET, FRFET
Package Marking and Ordering Information
FDH45N50F_F133 500V N-Channel MOSFET, FRFET
Typical Performance Characteristics
Figure 1. On-Region Characteristics
VGS
15.0 V
10.0 V
8.0 V
7.0 V
6.5 V
6.0 V
Bottom : 5.5 V
Top :
2
10
ID, Drain Current [A]
2
10
ID, Drain Current [A]
Figure 2. Transfer Characteristics
1
10
o
150 C
1
10
o
25 C
o
-55 C
∝ Notes :
1. VDS = 40V
2. 250レs Pulse Test
∝ Notes :
1. 250レs Pulse Test
2. TC = 25∩
0
10
0
-1
0
10
10
1
10
10
2
4
VDS, Drain-Source Voltage [V]
6
8
10
12
VGS, Gate-Source Voltage [V]
Figure 3. On-Resistance Variation vs.
Drain Current and Gate Voltage
Figure 4. Body Diode Forward Voltage
Variation vs. Source Current
and Temperatue
0.30
IDR, Reverse Drain Current [A]
RDS(ON) [ヘ ],
Drain-Source On-Resistance
2
10
0.25
0.20
VGS = 10V
0.15
0.10
VGS = 20V
0.05
∝ Note : TJ = 25∩
0.00
150∩
1
10
25∩
∝ Notes :
1. VGS = 0V
2. 250レs Pulse Test
0
0
20
40
60
80
100
120
140
10
160
0.2
0.4
0.6
ID, Drain Current [A]
Figure 5. Capacitance Characteristics
12000
8000
1.2
1.4
1.6
1.8
12
Ciss = Cgs + Cgd (Cds = shorted)
Coss = Cds + Cgd
Crss = Cgd
Coss
1.0
Figure 6. Gate Charge Characteristics
VDS = 100V
VGS, Gate-Source Voltage [V]
Capacitances [pF]
10000
0.8
VSD, Source-Drain voltage [V]
Ciss
6000
4000
* Note :
1. VGS = 0 V
2. f = 1 MHz
Crss
2000
VDS = 250V
10
VDS = 400V
8
6
4
2
Note : ID = 48A
0
-1
10
0
0
10
1
10
20
40
60
80
100
120
QG, Total Gate Charge [nC]
VDS, Drain-Source Voltage [V]
FDH45N50F_F133 Rev. C
0
3
www.fairchildsemi.com
Figure 7. Breakdown Voltage Variation
vs. Temperature
Figure 8. On-Resistance Variation
vs. Temperature
2.5
RDS(ON), (Normalized)
Drain-Source On-Resistance
BVDSS, (Normalized)
Drain-Source Breakdown Voltage
1.2
1.1
1.0
Notes :
1. VGS = 0 V
2. ID = 250 μA
0.9
0.8
-100
-50
0
50
100
150
2.0
1.5
1.0
Notes :
1. VGS = 10 V
2. ID = 22.5 A
0.5
0.0
-100
200
-50
o
0
50
100
150
200
o
TJ, Junction Temperature [ C]
TJ, Junction Temperature [ C]
Figure 9. Maximum Safe Operating Area
Figure 10. Maximum Drain Current
vs. Case Temperature
50
10 μs
2
40
100 μs
ID, Drain Current [A]
ID, Drain Current [A]
10
1 ms
10 ms
100 ms
DC
1
10
Operation in This Area
is Limited by R DS(on)
0
∝ Notes :
10
o
1. TC = 25 C
30
20
10
o
2. TJ = 150 C
3. Single Pulse
-1
10
0
1
10
2
10
0
25
3
10
10
50
125
150
Figure 12. Typical Drain-Source Voltage
Slope vs. Gate Resistance
45
4,000
Notes :
1. VDS = 400 V
2. VGS = 12 V
3. ID = 25A
3,500
3,000
Notes :
1. VDS = 400 V
2. VGS = 12 V
3. ID = 25A
40
35
o
4. TJ = 125 C
o
4. TJ = 125 C
30
2,500
dv/dt [V/nS]
di/dt [A/μS]
100
TC, Case Temperature [ C]
Figure 11. Typical Drain Current Slope
vs. Gate Resistance
di/dt(on)
2,000
1,500
di/dt(off)
1,000
dv/dt(on)
25
20
15
dv/dt(off)
10
500
0
75
o
VDS, Drain-Source Voltage [V]
5
0
5
10
15
20
25
30
35
40
45
0
50
RG, Gate resistance [Ω]
FDH45N50F_F133 Rev. C
0
5
10
15
20
25
30
35
40
45
50
RG, Gate resistance [Ω]
4
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FDH45N50F_F133 500V N-Channel MOSFET, FRFET
Typical Performance Characteristics (Continued)
Figure 13. Typical Switching Losses vs.
Gate Resistance
Figure 14. Unclamped Inductive Switching
Capability
1,000
100
Notes :
1. If R = 0 Ω
tAV = (L)(IAS)/(1.3 Rated BVDSS - VDD)
2. If R ≠ 0 Ω
tAV = (L/R)In[(IAS x R)/(1.3 Rated BVDSS - VDD)+1]
IAS, Avalanche Current [A]
800
Energy [μJ]
Eoff
600
Eon
400
Notes :
1. VDS = 400 V
2. VGS = 12 V
3. ID = 25A
200
o
o
Starting TJ = 150 C
10
Starting TJ = 25 C
o
4. TJ = 125 C
0
0
5
10
15
20
25
30
35
40
45
1
0.01
50
0.1
RG, Gate resistance [Ω]
1
10
100
tAV, Time In Avalanche [ms]
Figure 15. Transient Thermal Resistance Curve
ZθJC(t), Thermal Response
10
-1
D=0.5
0.2
Notes :
o
1. Z θ JC (t) = 0.2 C/W Max.
2. Duty Factor, D=t1 /t2
3. T JM - T C = P DM * Z θJC(t)
0.1
0.05
10
-2
0.02
0.01
PDM
single pulse
10
t1
t2
-3
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
t 1, Square W ave Pulse Duration [sec]
FDH45N50F_F133 Rev. C
5
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FDH45N50F_F133 500V N-Channel MOSFET, FRFET
Typical Performance Characteristics (Continued)
FDH45N50F_F133 500V N-Channel MOSFET, FRFET
Mechanical Dimensions
TO-247AB
Dimensions in Millimeters
FDH45N50F_F133 Rev. C
6
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Datasheet Identification
Product Status
Definition
Advance Information
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Datasheet contains the design specifications for product development. Specifications
may change in any manner without notice.
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First Production
Datasheet contains preliminary data; supplementary data will be published at a later
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Semiconductor. The datasheet is for reference information only.
Rev. I37
7
FDH45N50F_F133 Rev. C
www.fairchildsemi.com
FDH45N50F_F133 500V N-Channel MOSFET, FRFET
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