PIC16F526 Data Sheet 14-Pin, 8-Bit Flash Microcontroller 2010 Microchip Technology Inc. DS41326D Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2010, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-60932-044-7 Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. DS41326D-page 2 2010 Microchip Technology Inc. PIC16F526 14-Pin, 8-Bit Flash Microcontroller High-Performance RISC CPU: Low-Power Features/CMOS Technology: • Only 33 Single-Word Instructions • All Single-Cycle Instructions except for Program Branches which are Two-Cycle • Two-Level Deep Hardware Stack • Direct, Indirect and Relative Addressing modes for Data and Instructions • Operating Speed: - DC – 20 MHz crystal oscillator - DC – 200 ns instruction cycle • On-chip Flash Program Memory: - 1024 x 12 • General Purpose Registers (SRAM): - 67 x 8 • Flash Data Memory: - 64 x 8 • Standby current: - 100 nA @ 2.0V, typical • Operating current: - 11 A @ 32 kHz, 2.0V, typical - 175 A @ 4 MHz, 2.0V, typical • Watchdog Timer current: - 1 A @ 2.0V, typical - 7 A @ 5.0V, typical • High Endurance Program and Flash Data Memory cells: - 100,000 write Program Memory endurance - 1,000,000 write Flash Data Memory endurance - Program and Flash Data retention: >40 years • Fully Static Design • Wide Operating Voltage Range: 2.0V to 5.5V: - Wide temperature range - Industrial: -40C to +85C - Extended: -40C to +125C Special Microcontroller Features: • 8 MHz Precision Internal Oscillator: - Factory calibrated to ±1% • In-Circuit Serial Programming™ (ICSP™) • In-Circuit Debugging (ICD) Support • Power-On Reset (POR) • Device Reset Timer (DRT) • Watchdog Timer (WDT) with Dedicated On-Chip RC Oscillator for Reliable Operation • Programmable Code Protection • Multiplexed MCLR Input Pin • Internal Weak Pull-ups on I/O Pins • Power-Saving Sleep mode • Wake-Up from Sleep on Pin Change • Selectable Oscillator Options: - INTRC: 4 MHz or 8 MHz precision Internal RC oscillator - EXTRC: External low-cost RC oscillator - XT: Standard crystal/resonator - HS: High-speed crystal/resonator - LP: Power-saving, low-frequency crystal - EC: High-speed external clock input Device PIC16F526 Program Memory Peripheral Features: • 12 I/O Pins: - 11 I/O pins with individual direction control - 1 input-only pin - High current sink/source for direct LED drive - Wake-up on change - Weak pull-ups • 8-bit Real-time Clock/Counter (TMR0) with 8-bit Programmable Prescaler • Two Analog Comparators: - Comparator inputs and output accessible externally - One comparator with 0.6V fixed on-chip absolute voltage reference (VREF) - One comparator with programmable on-chip voltage reference (VREF) • Analog-to-Digital (A/D) Converter: - 8-bit resolution - 3-channel external programmable inputs - 1-channel internal input to internal absolute 0.6 voltage reference Data Memory Flash (words) SRAM (bytes) Flash (bytes) 1024 67 64 2010 Microchip Technology Inc. I/O Comparators Timers 8-bit 8-bit A/D Channels 12 2 1 3 DS41326D-page 3 PIC16F526 VDD 1 RB5/OSC1/CLKIN 2 3 RB4/OSC2/CLKOUT RC5/T0CKI 4 5 RC4/C2OUT 6 RC3 7 RB3/MCLR/VPP VSS 12 RB1/C1IN-/AN1/ICSPCLK 11 RB2/C1OUT/AN2 10 RC0/C2IN+ 9 RC1/C2IN- 8 RC2/CVREF RB0/C1IN+/AN0/ICSPDAT 3 RC5/T0CKI 4 NC GND RB1/C1IN-/AN1/ICSPCLK 10 RB2/C1OUT/AN2 9 5 6 7 8 RC1/C2IN- 2 RB3/MCLR/VPP RB0/C1IN+/AN0/ICSPDAT 11 RC2/CVREF RB4/OSC2/CLKOUT PIC16F526 16 15 14 13 12 RC3 1 RC4/C2OUT RB5/OSC1/CLKIN DS41326D-page 4 14 13 16-PIN QFN DIAGRAM VDD FIGURE 1-2: PIC16F526 14-PIN PDIP, SOIC, TSSOP DIAGRAM NC FIGURE 1-1: RC0/C2IN+ 2010 Microchip Technology Inc. PIC16F526 Table of Contents 1.0 General Description..................................................................................................................................................................... 7 2.0 PIC16F526 Device Varieties ...................................................................................................................................................... 9 3.0 Architectural Overview .............................................................................................................................................................. 11 4.0 Memory Organization ................................................................................................................................................................ 15 5.0 Flash Data Memory Control ...................................................................................................................................................... 23 6.0 I/O Port ...................................................................................................................................................................................... 27 7.0 Timer0 Module and TMR0 Register .......................................................................................................................................... 37 8.0 Special Features of the CPU..................................................................................................................................................... 43 9.0 Analog-to-Digital (A/D) Converter.............................................................................................................................................. 59 10.0 Comparator(s) ........................................................................................................................................................................... 63 11.0 Comparator Voltage Reference Module.................................................................................................................................... 69 12.0 Instruction Set Summary ........................................................................................................................................................... 71 13.0 Development Support................................................................................................................................................................ 79 14.0 Electrical Characteristics ........................................................................................................................................................... 83 15.0 DC and AC Characteristics Graphs and Charts ........................................................................................................................ 97 16.0 Packaging Information............................................................................................................................................................. 107 The Microchip Web Site .................................................................................................................................................................... 115 Customer Change Notification Service ............................................................................................................................................. 115 Customer Support ............................................................................................................................................................................. 115 Reader Response ............................................................................................................................................................................. 116 Index .................................................................................................................................................................................................. 117 Product Identification System................ ........................................................................................................................................... 119 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at [email protected] or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: • Microchip’s Worldwide Web site; http://www.microchip.com • Your local Microchip sales office (see last page) • The Microchip Corporate Literature Center; U.S. FAX: (480) 792-7277 When contacting a sales office or the literature center, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com/cn to receive the most current information on all of our products. 2010 Microchip Technology Inc. DS41326D-page 5 PIC16F526 NOTES: DS41326D-page 6 2010 Microchip Technology Inc. PIC16F526 1.0 GENERAL DESCRIPTION The PIC16F526 device from Microchip Technology is low-cost, high-performance, 8-bit, fully-static, Flashbased CMOS microcontrollers. It employs a RISC architecture with only 33 single-word/single-cycle instructions. All instructions are single cycle (200 s) except for program branches, which take two cycles. The PIC16F526 device delivers performance an order of magnitude higher than their competitors in the same price category. The 12-bit wide instructions are highly symmetrical, resulting in a typical 2:1 code compression over other 8-bit microcontrollers in its class. The easy-to-use and easy to remember instruction set reduces development time significantly. The PIC16F526 product is equipped with special features that reduce system cost and power requirements. The Power-on Reset (POR) and Device Reset Timer (DRT) eliminate the need for external Reset circuitry. There are four oscillator configurations to choose from, including INTRC Internal Oscillator mode and the power-saving LP (Low-Power) Oscillator mode. Power-Saving Sleep mode, Watchdog Timer and code protection features improve system cost, power and reliability. 1.1 Applications The PIC16F526 device fits in applications ranging from personal care appliances and security systems to lowpower remote transmitters/receivers. The Flash technology makes customizing application programs (transmitter codes, appliance settings, receiver frequencies, etc.) extremely fast and convenient. The small footprint packages, for through hole or surface mounting, make these microcontrollers perfect for applications with space limitations. Low cost, low power, high performance, ease of use and I/O flexibility make the PIC16F526 device very versatile even in areas where no microcontroller use has been considered before (e.g., timer functions, logic and PLDs in larger systems and coprocessor applications). The PIC16F526 device is available in the cost-effective Flash programmable version, which is suitable for production in any volume. The customer can take full advantage of Microchip’s price leadership in Flash programmable microcontrollers, while benefiting from the Flash programmable flexibility. The PIC16F526 product is supported by a full-featured macro assembler, a software simulator, an in-circuit emulator, a ‘C’ compiler, a low-cost development programmer and a full featured programmer. All the tools are supported on IBM® PC and compatible machines. TABLE 1-1: FEATURES AND MEMORY OF PIC16F526 PIC16F526 Clock Maximum Frequency of Operation (MHz) Memory Flash Program Memory SRAM Data Memory (bytes) Flash Data Memory (bytes) Peripherals Timer Module(s) Wake-up from Sleep on Pin Change Features I/O Pins Input Pins 20 1024 67 64 TMR0 Yes 11 1 Internal Pull-ups Yes In-Circuit Serial ProgrammingTM Yes Number of Instructions Packages 33 14-pin PDIP, SOIC, TSSOP, QFN The PIC16F526 device has Power-on Reset, selectable Watchdog Timer, selectable code-protect, high I/O current capability and precision internal oscillator. The PIC16F526 device uses serial programming with data pin RB0 and clock pin RB1. 2010 Microchip Technology Inc. DS41326D-page 7 PIC16F526 NOTES: DS41326D-page 8 2010 Microchip Technology Inc. PIC16F526 2.0 PIC16F526 DEVICE VARIETIES A variety of packaging options are available. Depending on application and production requirements, the proper device option can be selected using the information in this section. When placing orders, please use the PIC16F526 Product Identification System at the back of this data sheet to specify the correct part number. 2.1 Quick Turn Programming (QTP) Devices 2.2 Serialized Quick Turn ProgrammingSM (SQTPSM) Devices Microchip offers a unique programming service, where a few user-defined locations in each device are programmed with different serial numbers. The serial numbers may be random, pseudo-random or sequential. Serial programming allows each device to have a unique number, which can serve as an entry code, password or ID number. Microchip offers a QTP programming service for factory production orders. This service is made available for users who choose not to program medium-to-high quantity units and whose code patterns have stabilized. The devices are identical to the Flash devices but with all Flash locations and fuse options already programmed by the factory. Certain code and prototype verification procedures do apply before production shipments are available. Please contact your local Microchip Technology sales office for more details. 2010 Microchip Technology Inc. DS41326D-page 9 PIC16F526 NOTES: DS41326D-page 10 2010 Microchip Technology Inc. PIC16F526 3.0 ARCHITECTURAL OVERVIEW The high performance of the PIC16F526 device can be attributed to a number of architectural features commonly found in RISC microprocessors. To begin with, the PIC16F526 device uses a Harvard architecture in which program and data are accessed on separate buses. This improves bandwidth over traditional von Neumann architectures where program and data are fetched on the same bus. Separating program and data memory further allows instructions to be sized differently than the 8-bit wide data word. Instruction opcodes are 12 bits wide, making it possible to have all single-word instructions. A 12-bit wide program memory access bus fetches a 12-bit instruction in a single cycle. A two-stage pipeline overlaps fetch and execution of instructions. Consequently, all instructions (33) execute in a single cycle (200 ns @ 20 MHz, 1 s @ 4 MHz) except for program branches. The PIC16F526 device contains an 8-bit ALU and working register. The ALU is a general purpose arithmetic unit. It performs arithmetic and Boolean functions between data in the working register and any register file. The ALU is 8 bits wide and capable of addition, subtraction, shift and logical operations. Unless otherwise mentioned, arithmetic operations are two’s complement in nature. In two-operand instructions, one operand is typically the W (working) register. The other operand is either a file register or an immediate constant. In single operand instructions, the operand is either the W register or a file register. The W register is an 8-bit working register used for ALU operations. It is not an addressable register. Table 3-1 below lists memory supported by the PIC16F526 device. Depending on the instruction executed, the ALU may affect the values of the Carry (C), Digit Carry (DC) and Zero (Z) bits in the STATUS register. The C and DC bits operate as a borrow and digit borrow out bit, respectively, in subtraction. See the SUBWF and ADDWF instructions for examples. TABLE 3-1: A simplified block diagram is shown in Figure 3-2, with the corresponding device pins described in Table 3-2. Device PIC16F526 PIC16F526 MEMORY Program Memory Data Memory Flash (words) SRAM (bytes) Flash (bytes) 1024 67 64 The PIC16F526 device can directly or indirectly address its register files and data memory. All Special Function Registers (SFR), including the PC, are mapped in the data memory. The PIC16F526 device has a highly orthogonal (symmetrical) instruction set that makes it possible to carry out any operation, on any register, using any Addressing mode. This symmetrical nature and lack of “special optimal situations” make programming with the PIC16F526 device simple, yet efficient. In addition, the learning curve is reduced significantly. 2010 Microchip Technology Inc. DS41326D-page 11 PIC16F526 FIGURE 3-1: PIC16F526 BLOCK DIAGRAM 11 Flash Program Memory 1K x 12 Flash Data Memory 64x8 Program Bus 8 Data Bus Program Counter PORTB RB0/ICSPDAT RB1/ICSPCLK RB2 RB3/MCLR/VPP RB4/OSC2/CLKOUT RB5/OSC1/CLKIN RAM 67 bytes File Registers STACK1 STACK2 12 RAM Addr (1) 9 PORTC Addr MUX Instruction Reg Direct Addr 5 5-7 RC0 RC1 RC2 RC3 RC4 RC5/T0CKI Indirect Addr FSR Reg STATUS Reg 8 Device Reset Timer OSC1/CLKIN OSC2/CLKOUT Instruction Decode and Control Power-on Reset Timing Generation Watchdog Timer Internal RC Clock Comparator 1 3 MUX C1IN+ C1INC1OUT VREF ALU 8 W Reg Comparator 2 C2IN+ C2INC2OUT CVREF CVREF CVREF Timer0 MCLR VDD, VSS 8-bit ADC AN0 AN1 AN2 VREF DS41326D-page 12 2010 Microchip Technology Inc. PIC16F526 TABLE 3-2: PIC16F526 PINOUT DESCRIPTION Name RB0//C1IN+/AN0/ ICSPDAT RB1/C1IN-/AN1/ ICSPCLK RB2/C1OUT/AN2 RB3/MCLR/VPP RB4/OSC2/CLKOUT RB5/OSC1/CLKIN RC0/C2IN+ RC1/C2INRC2/CVREF RC3 RC4/C2OUT RC5/T0CKI Function Input Type RB0 TTL C1IN+ AN Output Type Description CMOS Bidirectional I/O pin. Can be software programmed for internal weak pull-up and wake-up from Sleep on pin change. — Comparator 1 input. — ADC channel input. AN0 AN ICSPDAT ST CMOS ICSP™ mode Schmitt Trigger. RB1 TTL CMOS Bidirectional I/O pin. Can be software programmed for internal weak pull-up and wake-up from Sleep on pin change. C1IN- AN — Comparator 1 input. — ADC channel input. AN1 AN ICSPCLK ST CMOS ICSP mode Schmitt Trigger. RB2 TTL CMOS Bidirectional I/O pin. C1OUT — CMOS Comparator 1 output. AN2 AN — ADC channel input. RB3 TTL — Input pin. Can be software programmed for internal weak pull-up and wake-up from Sleep on pin change. MCLR ST — Master Clear (Reset). When configured as MCLR, this pin is an active-low Reset to the device. Voltage on MCLR/VPP must not exceed VDD during normal device operation or the device will enter Programming mode. Weak pull-up always on if configured as MCLR. VPP HV — Programming voltage input. RB4 TTL OSC2 — XTAL CLKOUT — CMOS EXTRC/INTRC CLKOUT pin (FOSC/4). RB5 TTL OSC1 XTAL CLKIN ST RC0 TTL C2IN+ AN RC1 TTL C2IN- AN RC2 TTL CVREF — RC3 TTL CMOS Bidirectional I/O pin. Can be software programmed for internal weak pull-up and wake-up from Sleep on pin change. Oscillator crystal output. Connections to crystal or resonator in Crystal Oscillator mode (XT, HS and LP modes only, PORTB in other modes). CMOS Bidirectional I/O pin. — Oscillator crystal input. — External clock source input. CMOS Bidirectional I/O port. — Comparator 2 input. CMOS Bidirectional I/O port. — Comparator 2 input. CMOS Bidirectional I/O port. AN Programmable Voltage Reference output. CMOS Bidirectional I/O port. RC4 TTL CMOS Bidirectional I/O port. C2OUT — CMOS Comparator 2 output. CMOS Bidirectional I/O port. RC5 TTL T0CKI ST — Timer0 Schmitt Trigger input pin. VDD VDD — P Positive supply for logic and I/O pins. VSS VSS — P Ground reference for logic and I/O pins. Legend: I = Input, O = Output, I/O = Input/Output, P = Power, — = Not used, TTL = TTL input, ST = Schmitt Trigger input, HV = High Voltage 2010 Microchip Technology Inc. DS41326D-page 13 PIC16F526 3.1 Clocking Scheme/Instruction Cycle 3.2 Instruction Flow/Pipelining An instruction cycle consists of four Q cycles (Q1, Q2, Q3 and Q4). The instruction fetch and execute are pipelined such that fetch takes one instruction cycle, while decode and execute take another instruction cycle. However, due to the pipelining, each instruction effectively executes in one cycle. If an instruction causes the PC to change (e.g., GOTO), then two cycles are required to complete the instruction (Example 3-1). The clock input (OSC1/CLKIN pin) is internally divided by four to generate four non-overlapping quadrature clocks, namely Q1, Q2, Q3 and Q4. Internally, the PC is incremented every Q1 and the instruction is fetched from program memory and latched into the instruction register in Q4. It is decoded and executed during the following Q1 through Q4. The clocks and instruction execution flow is shown in Figure 3-2 and Example 3-1. A fetch cycle begins with the PC incrementing in Q1. In the execution cycle, the fetched instruction is latched into the Instruction Register (IR) in cycle Q1. This instruction is then decoded and executed during the Q2, Q3 and Q4 cycles. Data memory is read during Q2 (operand read) and written during Q4 (destination write). FIGURE 3-2: CLOCK/INSTRUCTION CYCLE Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 OSC1 Q1 Q2 Internal Phase Clock Q3 Q4 PC PC PC + 1 Fetch INST (PC) Execute INST (PC – 1) EXAMPLE 3-1: PC + 2 Fetch INST (PC + 1) Execute INST (PC) Fetch INST (PC + 2) Execute INST (PC + 1) INSTRUCTION PIPELINE FLOW 1. MOVLW 03H 2. MOVWF PORTB 3. CALL SUB_1 4. BSF PORTB, BIT1 Fetch 1 Execute 1 Fetch 2 Execute 2 Fetch 3 Execute 3 Fetch 4 Flush Fetch SUB_1 Execute SUB_1 All instructions are single cycle, except for any program branches. These take two cycles, since the fetch instruction is “flushed” from the pipeline, while the new instruction is being fetched and then executed. DS41326D-page 14 2010 Microchip Technology Inc. PIC16F526 4.1 Program Memory Organization for the PIC16F526 The PIC16F526 device has an 11-bit Program Counter (PC) capable of addressing a 2K x 12 program memory space. Program memory is partitioned into user memory, data memory and configuration memory spaces. The user memory space is the on-chip user program memory. As shown in Figure 4-1, it extends from 0x000 to 0x3FF and partitions into pages, including Reset vector at address 0x3FF. User Memory Space The PIC16F526 memories are organized into program memory and data memory (SRAM).The self-writable portion of the program memory called Flash data memory is located at addresses at 400h-43Fh. All Program mode commands that work on the normal Flash memory work on the Flash data memory. This includes bulk erase, row/column/cycling toggles, Load and Read data commands (Refer to Section 5.0 “Flash Data Memory Control” for more details). For devices with more than 512 bytes of program memory, a paging scheme is used. Program memory pages are accessed using one STATUS register bit. For the PIC16F526, with data memory register files of more than 32 registers, a banking scheme is used. Data memory banks are accessed using the File Select Register (FSR). FIGURE 4-1: Data Memory Space MEMORY ORGANIZATION MEMORY MAP On-chip User Program Memory (Page 0) On-chip User Program Memory (Page 1) Reset Vector 000h 1FFh 200h 3FEh 3FFh 400h Flash Data Memory User ID Locations Backup OSCCAL Locations Configuration Memory Space 4.0 43Fh 440h 443h 444h 447h 448h Reserved 49Fh 4A0h Unimplemented 7FEh Configuration Word 7FFh The data memory space is the Flash data memory block and is located at addresses PC = 400h-43Fh. All Program mode commands that work on the normal Flash memory work on the Flash data memory block. This includes bulk erase, Load and Read data commands. The configuration memory space extends from 0x440 to 0x7FF. Locations from 0x448 through 0x49F are reserved. The user ID locations extend from 0x440 through 0x443. The Backup OSCCAL locations extend from 0x444 through 0x447. The Configuration Word is physically located at 0x7FF. Refer to “PIC16F526 Memory Programming Specification” (DS41317) for more details. 2010 Microchip Technology Inc. DS41326D-page 15 PIC16F526 4.2 Data Memory (SRAM and FSRs) 4.2.1 Data memory is composed of registers or bytes of SRAM. Therefore, data memory for a device is specified by its register file. The register file is divided into two functional groups: Special Function Registers (SFR) and General Purpose Registers (GPR). The General Purpose Register file is accessed, either directly or indirectly, through the File Select Register (FSR). See Section 4.8 “Indirect Data Addressing: INDF and FSR Registers”. The Special Function Registers are registers used by the CPU and peripheral functions for controlling desired operations of the PIC16F526. See Figure 4-1 for details. 4.2.2 The Special Function Registers can be classified into two sets. The Special Function Registers associated with the “core” functions are described in this section. Those related to the operation of the peripheral features are described in the section for each peripheral feature. REGISTER FILE MAP FSR<6:5> 00 01 20h File Address 10 40h 11 60h 00h INDF(1) INDF(1) INDF(1) INDF(1) 01h TMR0 EECON TMR0 EECON 02h PCL PCL PCL PCL 03h STATUS STATUS STATUS STATUS 04h FSR FSR FSR FSR 05h OSCCAL EEDATA OSCCAL EEDATA 06h PORTB EEADR PORTB EEADR 07h PORTC PORTC PORTC PORTC 08h CM1CON0 CM1CON0 CM1CON0 CM1CON0 09h ADCON0 ADCON0 ADCON0 ADCON0 0Ah 0Bh ADRES CM2CON0 ADRES CM2CON0 ADRES CM2CON0 ADRES CM2CON0 0Ch VRCON VRCON VRCON VRCON 0Dh General Purpose Registers 0Fh 10h Addresses map back to addresses in Bank 0. 4Fh 6Fh 2Fh 30h General Purpose Registers 1Fh 50h General Purpose Registers 3Fh Bank 0 Note 1: SPECIAL FUNCTION REGISTERS The Special Function Registers (SFRs) are registers used by the CPU and peripheral functions to control the operation of the device (Table 4-1). The PIC16F526 register file is composed of 16 Special Function Registers and 67 General Purpose Registers. FIGURE 4-2: GENERAL PURPOSE REGISTER FILE 70h General Purpose Registers 5Fh Bank 1 General Purpose Registers 7Fh Bank 2 Bank 3 Not a physical register. See Section 4.8 “Indirect Data Addressing: INDF and FSR Registers”. DS41326D-page 16 2010 Microchip Technology Inc. PIC16F526 TABLE 4-1: Addr SPECIAL FUNCTION REGISTER (SFR) SUMMARY Name Bit 7 Bit 6 — — Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page # N/A TRIS --11 1111 27 N/A OPTION Contains control bits to configure Timer0 and Timer0/WDT prescaler 1111 1111 19 00h INDF Uses contents of FSR to Address Data Memory (not a physical register) xxxx xxxx 22 01h/41h TMR0 Timer0 Module Register xxxx xxxx 37 02h(1) PCL Low order 8 bits of PC 1111 1111 21 03h STATUS 0001 1xxx 18 04h FSR 05h/45h OSCCAL 06h/46h 07h 08h CM1CON0 09h ADCON0 0Ah ADRES 0Bh CM2CON0 C2OUT C2OUTEN C2POL RBWUF I/O Control Register (PORTB, PORTC) Value on Power-on Reset CWUF PA0 TO PD Z DC C Indirect Data Memory Address Pointer CAL4 CAL3 CAL2 CAL1 CAL0 100x xxxx 22 — 1111 111- 20 27 CAL6 CAL5 PORTB — — RB5 RB4 RB3 RB2 RB1 RB0 --xx xxxx PORTC — — RC5 RC4 RC3 RC2 RC1 RC0 --xx xxxx 28 C1OUT C1OUTEN C1POL C1T0CS C1ON C1NREF C1PREF C1WU q111 1111 63 ANS1 ANS0 ADCS1 ADCS0 CHS1 CHS0 GO/DONE ADON 1111 1100 61 ADC Conversion Result C2PREF2 C2ON xxxx xxxx 62 C2NREF C2PREF1 C2WU q111 1111 64 0Ch VRCON VREN VROE VRR — VR3 VR2 VR1 VR0 001- 1111 69 21h/61h EECON — — — FREE WRERR WREN WR RD ---0 x000 23 25h/65h EEDATA 26h/66h EEADR Legend: x = unknown, u = unchanged, – = unimplemented, read as '0' (if applicable), q = value depends on condition. Shaded cells = unimplemented or unused The upper byte of the Program Counter is not directly accessible. See Section 4.6 “Program Counter” for an explanation of how to access these bits. Note 1: SELF READ/WRITE DATA — 2010 Microchip Technology Inc. — SELF READ/WRITE ADDRESS xxxx xxxx 23 --xx xxxx 23 DS41326D-page 17 PIC16F526 4.3 STATUS Register For example, CLRF STATUS, will clear the upper three bits and set the Z bit. This leaves the STATUS register as 000u u1uu (where u = unchanged). This register contains the arithmetic status of the ALU, the Reset status and the page preselect bit. Therefore, it is recommended that only BCF, BSF and MOVWF instructions be used to alter the STATUS register. These instructions do not affect the Z, DC or C bits from the STATUS register. For other instructions which do affect Status bits, see Section 12.0 “Instruction Set Summary”. The STATUS register can be the destination for any instruction, as with any other register. If the STATUS register is the destination for an instruction that affects the Z, DC or C bits, then the write to these three bits is disabled. These bits are set or cleared according to the device logic. Furthermore, the TO and PD bits are not writable. Therefore, the result of an instruction with the STATUS register as destination may be different than intended. REGISTER 4-1: STATUS: STATUS REGISTER R/W-0 R/W-0 R/W-0 R-1 R-1 R/W-x R/W-x R/W-x RBWUF CWUF PA0 TO PD Z DC C bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 RBWUF: Wake-up from Sleep on Pin Change bit 1 = Reset due to wake-up from Sleep on pin change 0 = After power-up or other Reset bit 6 CWUF: Wake-up from Sleep on Comparator Change bit 1 = Reset due to wake-up from Sleep on comparator change 0 = After power-up or other Reset bit 5 PA0: Program Page Preselect bit 1 = Page 1 (000h-1FFh) 0 = Page 0 (200h-3FFh) bit 4 TO: Time-out bit 1 = After power-up, CLRWDT instruction, or SLEEP instruction 0 = A WDT time-out occurred bit 3 PD: Power-down bit 1 = After power-up or by the CLRWDT instruction 0 = By execution of the SLEEP instruction bit 2 Z: Zero bit 1 = The result of an arithmetic or logic operation is zero 0 = The result of an arithmetic or logic operation is not zero bit 1 DC: Digit carry/borrow bit (for ADDWF and SUBWF instructions) ADDWF: 1 = A carry from the 4th low-order bit of the result occurred 0 = A carry from the 4th low-order bit of the result did not occur SUBWF: 1 = A borrow from the 4th low-order bit of the result did not occur 0 = A borrow from the 4th low-order bit of the result occurred bit 0 C: Carry/borrow bit (for ADDWF, SUBWF and RRF, RLF instructions) ADDWF: SUBWF: RRF or RLF: 1 = A carry occurred 1 = A borrow did not occur Load bit with LSb or MSb, respectively 0 = A carry did not occur 0 = A borrow occurred DS41326D-page 18 2010 Microchip Technology Inc. PIC16F526 4.4 OPTION Register The OPTION register is a 8-bit wide, write-only register, which contains various control bits to configure the Timer0/WDT prescaler and Timer0. Note: By executing the OPTION instruction, the contents of the W register will be transferred to the OPTION register. A Reset sets the OPTION <7:0> bits. REGISTER 4-2: If TRIS bit is set to ‘0’, the wake-up on change and pull-up functions are disabled for that pin (i.e., note that TRIS overrides Option control of RBPU and RBWU). OPTION: OPTION REGISTER W-1 W-1 W-1 W-1 W-1 W-1 W-1 W-1 RBWU RBPU T0CS(1) T0SE PSA PS2 PS1 PS0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 RBWU: Enable Wake-up On Pin Change bit (RB0, RB1, RB3, RB4) 1 = Disabled 0 = Enabled bit 6 RBPU: Enable Weak Pull-ups bit (RB0, RB1, RB3, RB4) 1 = Disabled 0 = Enabled bit 5 T0CS: Timer0 Clock Source Select bit(1) 1 = Transition on T0CKI pin 0 = Internal instruction cycle clock (CLKOUT) bit 4 T0SE: Timer0 Source Edge Select bit 1 = Increment on high-to-low transition on T0CKI pin 0 = Increment on low-to-high transition on T0CKI pin bit 3 PSA: Prescaler Assignment bit 1 = Prescaler assigned to the WDT 0 = Prescaler assigned to Timer0 bit 2-0 PS<2:0>: Prescaler Rate Select bits Note 1: Bit Value Timer0 Rate WDT Rate 000 001 010 011 100 101 110 111 1:2 1:4 1:8 1 : 16 1 : 32 1 : 64 1 : 128 1 : 256 1:1 1:2 1:4 1:8 1 : 16 1 : 32 1 : 64 1 : 128 x = Bit is unknown If the T0CS bit is set to ‘1’, it will override the TRIS function on the T0CKI pin. 2010 Microchip Technology Inc. DS41326D-page 19 PIC16F526 4.5 OSCCAL Register The Oscillator Calibration (OSCCAL) register is used to calibrate the 8 MHz internal oscillator macro. It contains 7 bits of calibration that uses a two’s complement scheme for controlling the oscillator speed. See Register 4-3 for details. REGISTER 4-3: OSCCAL: OSCILLATOR CALIBRATION REGISTER R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 U-0 CAL6 CAL5 CAL4 CAL3 CAL2 CAL1 CAL0 — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-1 CAL<6:0>: Oscillator Calibration bits 0111111 = Maximum frequency • • • 0000001 0000000 = Center frequency 1111111 • • • 1000000 = Minimum frequency bit 0 Unimplemented: Read as ‘0’ DS41326D-page 20 x = Bit is unknown 2010 Microchip Technology Inc. PIC16F526 4.6 Program Counter 4.6.1 EFFECTS OF RESET As a program instruction is executed, the Program Counter (PC) will contain the address of the next program instruction to be executed. The PC value is increased by one every instruction cycle, unless an instruction changes the PC. The PC is set upon a Reset, which means that the PC addresses the last location in the last page (i.e., the oscillator calibration instruction). After executing MOVLW XX, the PC will roll over to location 00h and begin executing user code. For a GOTO instruction, bits 8:0 of the PC are provided by the GOTO instruction word. The Program Counter (PCL) is mapped to PC<7:0>. Bit 5 of the STATUS register provides page information to bit 9 of the PC (Figure 4-3). The STATUS register page preselect bits are cleared upon a Reset, which means that page 0 is pre-selected. For a CALL instruction, or any instruction where the PCL is the destination, bits 7:0 of the PC again are provided by the instruction word. However, PC<8> does not come from the instruction word, but is always cleared (Figure 4-3). Instructions where the PCL is the destination, or modify PCL instructions, include MOVWF PCL, ADDWF PCL and BSF PCL,5. Note: Because bit 8 of the PC is cleared in the CALL instruction or any modify PCL instruction, all subroutine calls or computed jumps are limited to the first 256 locations of any program memory page (512 words long). FIGURE 4-3: LOADING OF PC BRANCH INSTRUCTIONS GOTO Instruction 10 9 8 7 PC 0 PCL PA0 4.7 Stack The PIC16F526 device has a 2-deep, 12-bit wide hardware PUSH/POP stack. A CALL instruction will PUSH the current value of Stack 1 into Stack 2 and then PUSH the current PC value, incremented by one, into Stack Level 1. If more than two sequential CALLs are executed, only the most recent two return addresses are stored. A RETLW instruction will POP the contents of Stack Level 1 into the PC and then copy Stack Level 2 contents into Stack Level 1. If more than two sequential RETLWs are executed, the stack will be filled with the address previously stored in Stack Level 2. Note that the W register will be loaded with the literal value specified in the instruction. This is particularly useful for the implementation of data look-up tables within the program memory. Note 1: There are no Status bits to indicate Stack Overflows or Stack Underflow conditions. 2: There are no instruction mnemonics called PUSH or POP. These are actions that occur from the execution of the CALL and RETLW instructions. Instruction Word 7 Therefore, upon a Reset, a GOTO instruction will automatically cause the program to jump to page 0 until the value of the page bits is altered. 0 Status CALL or Modify PCL Instruction 10 9 8 7 PC 0 PCL 7 Instruction Word Reset to ‘0’ PA0 0 Status 2010 Microchip Technology Inc. DS41326D-page 21 PIC16F526 4.8 Indirect Data Addressing: INDF and FSR Registers A simple program to clear RAM locations 10h-1Fh using indirect addressing is shown in Example 4-1. The INDF Register is not a physical register. Addressing INDF actually addresses the register whose address is contained in the FSR Register (FSR is a pointer). This is indirect addressing. EXAMPLE 4-1: Reading INDF itself indirectly (FSR = 0) will produce 00h. Writing to the INDF Register indirectly results in a no-operation (although Status bits may be affected). MOVLW MOVWF CLRF NEXT INCF BTFSC GOTO CONTINUE : : The FSR is an 8-bit wide register. It is used in conjunction with the INDF Register to indirectly address the data memory area. The FSR<4:0> bits are used to select data memory addresses 00h to 1Fh. HOW TO CLEAR RAM USING INDIRECT ADDRESSING 0x10 FSR INDF ;initialize pointer ;to RAM ;clear INDF ;register ;inc pointer ;all done? ;NO, clear next FSR,F FSR,4 NEXT ;YES, continue FSR<6:5> are the bank select bits and are used to select the bank to be addressed (00 = Bank 0, 01 = Bank 1, 10 = Bank 2, 11 = Bank 3). FSR<7> is unimplemented and read as ‘1’. FIGURE 4-4: (FSR) 6 DIRECT/INDIRECT ADDRESSING Direct Addressing (opcode) 4 5 bank select 3 2 1 Indirect Addressing (FSR) 0 6 location select 00 01 10 11 5 4 bank select 3 2 1 0 location select 00h Data Memory(1) 0Ch 0Dh Addresses map back to addresses in Bank 0. 0Fh 10h 2Fh 4Fh 6Fh 1Fh 3Fh 5Fh 7Fh Bank 0 Bank 1 Bank 2 Bank 3 Note 1: For register map detail see Figure 4-1. DS41326D-page 22 2010 Microchip Technology Inc. PIC16F526 5.0 FLASH DATA MEMORY CONTROL The Flash data memory is readable and writable during normal operation (full VDD range). This memory is not directly mapped in the register file space. Instead, it is indirectly addressed through the Special Function Registers (SFRs). 5.1 Reading Flash Data Memory To read a Flash data memory location the user must: • Write the EEADR register • Set the RD bit of the EECON register The value written to the EEADR register determines which Flash data memory location is read. Setting the RD bit of the EECON register initiates the read. Data from the Flash data memory read is available in the EEDATA register immediately. The EEDATA register will hold this value until another read is initiated or it is modified by a write operation. Program execution is suspended while the read cycle is in progress. Execution will continue with the instruction following the one that sets the WR bit. See Example 1 for sample code. EXAMPLE 1: READING FROM FLASH DATA MEMORY BANKSEL EEADR ; MOVF DATA_EE_ADDR, W ; MOVWF EEADR ;Data Memory BANKSEL EECON1 ; ;Address to read BSF EECON, RD ;EE Read MOVF EEDATA, W ;W = EEDATA Note: Only a BSF command will work to enable the Flash data memory read documented in Example 1. No other sequence of commands will work, no exceptions. 5.2 Writing and Erasing Flash Data Memory Flash data memory is erased one row at a time and written one byte at a time. The 64-byte array is made up of eight rows. A row contains eight sequential bytes. Row boundaries exist every eight bytes. Generally, the procedure to write a byte of data to Flash data memory is: 1. 2. Identify the row containing the address where the byte will be written. If there is other information in that row that must be saved, copy those bytes from Flash data memory to RAM. 2010 Microchip Technology Inc. 3. 4. Perform a row erase of the row of interest. Write the new byte of data and any saved bytes back to the appropriate addresses in Flash data memory. To prevent accidental corruption of the Flash data memory, an unlock sequence is required to initiate a write or erase cycle. This sequence requires that the bit set instructions used to configure the EECON register happen exactly as shown in Example 2 and Example 3, depending on the operation requested. 5.2.1 ERASING FLASH DATA MEMORY A row must be manually erased before writing new data. The following sequence must be performed for a single row erase. 1. 2. 3. 4. Load EEADR with an address in the row to be erased. Set the FREE bit to enable the erase. Set the WREN bit to enable write access to the array. Set the WR bit to initiate the erase cycle. If the WREN bit is not set in the instruction cycle after the FREE bit is set, the FREE bit will be cleared in hardware. If the WR bit is not set in the instruction cycle after the WREN bit is set, the WREN bit will be cleared in hardware. Sample code that follows this procedure is included in Example 2. Program execution is suspended while the erase cycle is in progress. Execution will continue with the instruction following the one that sets the WR bit. EXAMPLE 2: ERASING A FLASH DATA MEMORY ROW BANKSEL EEADR MOVLW EE_ADR_ERASE ; LOAD ADDRESS OF ROW TO MOVWF EEADR ; BSF EECON,FREE ; SELECT ERASE BSF EECON,WREN ; ENABLE WRITES BSF EECON,WR ; INITITATE ERASE ; ERASE Note 1: The FREE bit may be set by any command normally used by the core. However, the WREN and WR bits can only be set using a series of BSF commands, as documented in Example 1. No other sequence of commands will work, no exceptions. 2: Bits <5:3> of the EEADR register indicate which row is to be erased. DS41326D-page 23 PIC16F526 5.2.2 WRITING TO FLASH DATA MEMORY Note 1: Only a series of BSF commands will work to enable the memory write sequence documented in Example 2. No other sequence of commands will work, no exceptions. Once a cell is erased, new data can be written. Program execution is suspended during the write cycle. The following sequence must be performed for a single byte write. 1. 2. 3. 4. 2: For reads, erases and writes to the Flash data memory, there is no need to insert a NOP into the user code as is done on midrange devices. The instruction immediately following the “BSF EECON,WR/RD” will be fetched and executed properly. Load EEADR with the address. Load EEDATA with the data to write. Set the WREN bit to enable write access to the array. Set the WR bit to initiate the erase cycle. If the WR bit is not set in the instruction cycle after the WREN bit is set, the WREN bit will be cleared in hardware. Sample code that follows this procedure is included in Example 3. EXAMPLE 3: BANKSEL MOVLW MOVWF MOVLW MOVWF BSF BSF WRITING A FLASH DATA MEMORY ROW EEADR EE_ADR_WRITE EEADR EE_DATA_TO_WRITE EEDATA EECON,WREN EECON,WR ; ; ; ; ; ; 5.3 Write Verify Depending on the application, good programming practice may dictate that data written to the Flash data memory be verified. Example 4 is an example of a write verify. EXAMPLE 4: LOAD ADDRESS WRITE VERIFY OF FLASH DATA MEMORY MOVF EEDATA, W ;EEDATA has not changed BSF EECON, RD ;Read the value written ;from previous write LOAD DATA INTO EEDATA REGISTER ENABLE WRITES INITITATE ERASE XORWF EEDATA, W ; BTFSS STATUS, Z ;Is data the same GOTO WRITE_ERR ;No, handle error ;Yes, continue REGISTER 5-1: EEDATA: FLASH DATA REGISTER R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x EEDATA7 EEDATA6 EEDATA5 EEDATA4 EEDATA3 EEDATA2 EEDATA1 EEDATA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 x = Bit is unknown EEDATA<7:0>: 8-bits of data to be read from/written to data Flash REGISTER 5-2: EEADR: FLASH ADDRESS REGISTER U-0 U-0 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x — — EEADR5 EEADR4 EEADR3 EEADR2 EEADR1 EEADR0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’. bit 5-0 EEADR<5:0>: 6-bits of data to be read from/written to data Flash DS41326D-page 24 x = Bit is unknown 2010 Microchip Technology Inc. PIC16F526 REGISTER 5-3: EECON: FLASH CONTROL REGISTER U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — — FREE WRERR WREN WR RD bit 7 bit 0 Legend: S = Bit can only be set R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-5 Unimplemented: Read as ‘0’. bit 4 FREE: Flash Data Memory Row Erase Enable Bit 1 = Program memory row being pointed to by EEADR will be erased on the next write cycle. No write will be performed. This bit is cleared at the completion of the erase operation. 0 = Perform write only bit 3 WRERR: Write Error Flag bit 1 = A write operation terminated prematurely (by device Reset) 0 = Write operation completed successfully bit 2 WREN: Write Enable bit 1 = Allows write cycle to Flash data memory 0 = Inhibits write cycle to Flash data memory bit 1 WR: Write Control bit 1 = Initiate a erase or write cycle 0 = Write/Erase cycle is complete bit 0 RD: Read Control bit 1 = Initiate a read of Flash data memory 0 = Do not read Flash data memory 5.4 Code Protection Code protection does not prevent the CPU from performing read or write operations on the Flash data memory. Refer to the code protection chapter for more information. 2010 Microchip Technology Inc. DS41326D-page 25 PIC16F526 NOTES: DS41326D-page 26 2010 Microchip Technology Inc. PIC16F526 6.0 I/O PORT 6.2 PORTC is a 6-bit I/O register. Only the low-order 6 bits are used (RC<5:0>). Bits 7 and 6 are unimplemented and read as ‘0’s. As with any other register, the I/O register(s) can be written and read under program control. However, read instructions (e.g., MOVF PORTB,W) always read the I/O pins independent of the pin’s Input/Output modes. On Reset, all I/O ports are defined as input (inputs are at highimpedance) since the I/O control registers are all set. 6.1 6.3 TRIS Register The Output Driver Control register is loaded with the contents of the W register by executing the TRIS f instruction. A ‘1’ from a TRIS register bit puts the corresponding output driver in a High-Impedance mode. A ‘0’ puts the contents of the output data latch on the selected pins, enabling the output buffer. The exceptions are RB3, which is input-only and the T0CKI pin, which may be controlled by the OPTION register. See Register 4-2. PORTB PORTB is a 6-bit I/O register. Only the low-order 6 bits are used (RB<5:0>). Bits 7 and 6 are unimplemented and read as ‘0’s. Please note that RB3 is an input-only pin. The Configuration Word can set several I/O’s to alternate functions. When acting as alternate functions, the pins will read as ‘0’ during a port read. Pins RB0, RB1, RB3 and RB4 can be configured with weak pullups and also for wake-up on change. The wake-up on change and weak pull-up functions are not pin selectable. If RB3/MCLR is configured as MCLR, weak pull-up is always on and wake-up on change for this pin is not enabled. TABLE 6-1: PORTC TRIS registers are “write-only”. Active bits in these registers are set (output drivers disabled) upon Reset. WEAK PULL-UP ENABLED PINS Device RB0 Weak Pull-up PIC16F526 Yes RB1 Weak Pull-up RB3 Weak Pull-up(1) Yes RB4 Weak Pull-up Yes Yes Note 1: When MCLREN = 1, the weak pull-up on RB3/MCLR is always enabled. REGISTER 6-1: PORTB: PORTB REGISTER U-0 U-0 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x — — RB5 RB4 RB3 RB2 RB1 RB0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 RB<5:0>: PORTB I/O Pin bits 1 = Port pin is >VIH min. 0 = Port pin is <VIL max. 2010 Microchip Technology Inc. x = Bit is unknown DS41326D-page 27 PIC16F526 REGISTER 6-2: PORTC: PORTC REGISTER U-0 U-0 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x — — RC5 RC4 RC3 RC2 RC1 RC0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 RC<5:0>: PORTC I/O Pin bits 1 = Port pin is >VIH min. 0 = Port pin is <VIL max. DS41326D-page 28 x = Bit is unknown 2010 Microchip Technology Inc. PIC16F526 6.4 I/O Interfacing The equivalent circuit for an I/O port pin is shown in Figure 6-1. All port pins, except RB3 which is inputonly, may be used for both input and output operations. For input operations, these ports are non-latching. Any input must be present until read by an input instruction (e.g., MOVF PORTB, W). The outputs are latched and remain unchanged until the output latch is rewritten. To use a port pin as output, the corresponding direction control bit in TRIS must be cleared (= 0). For use as an input, the corresponding TRIS bit must be set. Any I/O pin (except RB3) can be programmed individually as input or output. FIGURE 6-1: BLOCK DIAGRAM OF RB0 AND RB1 (with Weak Pullup and Wake-up on Change) GPPU RBPU Data Bus D Q Data Latch WR Port CK W Reg D I/O Pin(1) Q Q TRIS Latch TRIS ‘f’ CK Q Reset ADC pin Ebl COMP pin Ebl RD Port Q D CK Pin Change ADC COMP Note 1: 2010 Microchip Technology Inc. I/O pins have protection diodes to VDD and VSS. DS41326D-page 29 PIC16F526 FIGURE 6-2: BLOCK DIAGRAM OF RB2 C1OUT Data Bus WR Port D Q 0 FIGURE 6-3: BLOCK DIAGRAM OF RB3 (with Weak Pull-up and Wake-up on Change) I/O Pin(1) 1 Data Latch GPPU RBPU MCLRE Q CK C1OUTEN W Reg TRIS ‘f’ D Reset Q TRIS Latch Input Pin Q CK Reset ADC Pin Enable Data Bus RD Port Q D CK RD Port Pin Change ADC Note 1: I/O pins have protection diodes to VDD and VSS. DS41326D-page 30 Note 1: RB3/MCLR pin has a protection diode to VSS only. 2010 Microchip Technology Inc. PIC16F526 FIGURE 6-4: BLOCK DIAGRAM OF RB4 (with Weak Pull-up and Wake-up on Change) D Q 0 Q CK I/O pin(1) 1 D Q Data Latch I/O pin(1) Q CK D Q TRIS Latch TRIS ‘f’ Q CK FOSC/4 W Reg BLOCK DIAGRAM OF RB5 D W Reg Data Latch WR Port Data Bus WR Port RBPU Data Bus FIGURE 6-5: Reset (Note 2) Q TRIS Latch TRIS ‘f’ Q CK RD Port Reset OSC2 INTOSC/RC/EC CLKOUT Enable (Note 2) Note 1: Oscillator Circuit I/O pins have protection diodes to VDD and VSS. 2: Input mode is disabled when pin is used for oscillator. RD Port OSC1 Q Oscillator Circuit D CK Pin Change Note 1: 2: I/O pins have protection diodes to VDD and VSS. Input mode is disabled when pin is used for oscillator. 2010 Microchip Technology Inc. DS41326D-page 31 PIC16F526 FIGURE 6-6: Data Bus WR Port W Reg TRIS ‘f’ BLOCK DIAGRAM OF RC0/RC1 D FIGURE 6-7: BLOCK DIAGRAM OF RC2 VROE Q CVREF Data Latch I/O pin(1) Q CK Data Bus WR Port D Q D Q 1 I/O PIN(1) 0 Data Latch Q CK TRIS Latch W Reg Q CK Reset TRIS ‘f’ D Q TRIS Latch Q CK Comp Pin Enable Reset RD Port COMP2 Note 1: I/O pins have protection diodes to VDD and VSS. DS41326D-page 32 RD Port Note 1: I/O pins have protection diodes to VDD and VSS. 2010 Microchip Technology Inc. PIC16F526 FIGURE 6-8: Data Bus WR Port W Reg TRIS ‘f’ BLOCK DIAGRAM OF RC3 FIGURE 6-9: BLOCK DIAGRAM OF RC4 C2OUT I/O Pin(1) D Q Data Latch Q CK Data Bus WR Port D Q 0 I/O Pin(1) 1 Data Latch Q CK C2OUTEN D Q TRIS Latch W Reg Q CK TRIS ‘f’ D Q TRIS Latch Q CK Reset Reset RD Port RD Port Note 1: I/O pins have protection diodes to VDD and VSS. 2010 Microchip Technology Inc. Note 1: I/O pins have protection diodes to VDD and VSS. DS41326D-page 33 PIC16F526 FIGURE 6-10: Data Bus WR Port W Reg TRIS ‘f’ BLOCK DIAGRAM OF RC5 I/O Pin(1) D Q Data Latch Q CK D Q TRIS Latch Q CK T0CS Reset RD Port T0CKI Note 1: I/O pins have protection diodes to VDD and VSS. DS41326D-page 34 2010 Microchip Technology Inc. PIC16F526 TABLE 6-2: Addr SUMMARY OF PORT REGISTERS Name Bit 7 Bit 6 — — RBWU RBPU N/A TRIS N/A OPTION 03h STATUS 06h PORTB — 07h PORTC — Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 I/O Control Register (PORTB, PORTC) Value on Power-On Reset Value on All Other Resets --11 1111 --11 1111 1111 1111 1111 1111 TOCS TOSE PSA PS2 PS1 PS0 PA0 TO PD Z DC C — RB5 RB4 RB3 RB2 RB1 RB0 --xx xxxx --uu uuuu — RC5 RC4 RC3 RC2 RC1 RC0 --xx xxxx --uu uuuu RBWUF CWUF 0001 1xxx qq0q quuu(1) Legend: Shaded cells are not used by PORT registers, read as ‘0’. – = unimplemented, read as ‘0’, x = unknown, u = unchanged, q = depends on condition. Note 1: If Reset was due to wake-up on pin change, then bit 7 = 1. All other Resets will cause bit 7 = 0. TABLE 6-3: I/O PINS ORDER OF PRECEDENCE Priority RB0 RB1 RB2 RB3 RC0 RC1 RC2 RC4 RC5 1 2 3 AN0 C1IN+ TRISB AN1 C1INTRISB AN2 C1OUT TRISB RB3/MCLR — — C2IN+ TRISC — C2INTRISC — CVREF TRISC — C2OUT TRISC — T0CKI TRISC — 2010 Microchip Technology Inc. DS41326D-page 35 PIC16F526 6.5 I/O Programming Considerations 6.5.1 EXAMPLE 6-1: BIDIRECTIONAL I/O PORTS Some instructions operate internally as read followed by write operations. The BCF and BSF instructions, for example, read the entire port into the CPU, execute the bit operation and rewrite the result. Caution must be used when these instructions are applied to a port where one or more pins are used as input/outputs. For example, a BSF operation on bit 5 of PORTB will cause all eight bits of PORTB to be read into the CPU, bit 5 to be set and the PORTB value to be written to the output latches. If another bit of PORTB is used as a bidirectional I/O pin (say bit 0) and it is defined as an input at this time, the input signal present on the pin itself would be read into the CPU and rewritten to the data latch of this particular pin, overwriting the previous content. As long as the pin stays in the Input mode, no problem occurs. However, if bit 0 is switched into Output mode later on, the content of the data latch may now be unknown. ;Initial PORTB Settings ;PORTB<5:3> Inputs ;PORTB<2:0> Outputs ; ; PORTB latch PORTB pins ; ------------------BCF PORTB, 5 ;--01 -ppp --11 pppp BCF PORTB, 4 ;--10 -ppp --11 pppp MOVLW 007h; TRIS PORTB ;--10 -ppp --11 pppp ; Note 1: The user may have expected the pin values to be ‘--00 pppp’. The 2nd BCF caused RB5 to be latched as the pin value (High). 6.5.2 A pin actively outputting a high or a low should not be driven from external devices at the same time in order to change the level on this pin (“wired OR”, “wired AND”). The resulting high output currents may damage the chip. SUCCESSIVE I/O OPERATION Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Instruction Fetched SUCCESSIVE OPERATIONS ON I/O PORTS The actual write to an I/O port happens at the end of an instruction cycle, whereas for reading, the data must be valid at the beginning of the instruction cycle (Figure 6-11). Therefore, care must be exercised if a write followed by a read operation is carried out on the same I/O port. The sequence of instructions should allow the pin voltage to stabilize (load dependent) before the next instruction causes that file to be read into the CPU. Otherwise, the previous state of that pin may be read into the CPU rather than the new state. When in doubt, it is better to separate these instructions with a NOP or another instruction not accessing this I/O port. Example 6-1 shows the effect of two sequential Read-Modify-Write instructions (e.g., BCF, BSF, etc.) on an I/O port. FIGURE 6-11: READ-MODIFY-WRITE INSTRUCTIONS ON AN I/O PORT(e.g. DSTEMP) PC MOVWF PORTB PC + 1 MOVF PORTB, W Q1 Q2 Q3 Q4 PC + 2 PC + 3 This example shows a write to PORTB followed by a read from PORTB. NOP NOP Data setup time = (0.25 TCY – TPD) where: TCY = instruction cycle. RB<5:0> TPD = propagation delay Port pin written here Instruction Executed DS41326D-page 36 MOVWF PORTB (Write to PORTB) Port pin sampled here MOVF PORTB,W (Read PORTB) Therefore, at higher clock frequencies, a write followed by a read may be problematic. NOP 2010 Microchip Technology Inc. PIC16F526 7.0 TIMER0 MODULE AND TMR0 REGISTER The Timer0 module has the following features: • • • • 8-bit timer/counter register, TMR0 Readable and writable 8-bit software programmable prescaler Internal or external clock select: - Edge select for external clock Figure 7-1 is a simplified block diagram of the Timer0 module. Timer mode is selected by clearing the T0CS bit of the OPTION register. In Timer mode, the Timer0 module will increment every instruction cycle (without prescaler). If TMR0 register is written, the increment is inhibited for the following two cycles (Figure 7-2 and Figure 7-3). The user can work around this by writing an adjusted value to the TMR0 register. There are two types of Counter mode. The first Counter mode uses the T0CKI pin to increment Timer0. It is selected by setting the T0CS bit of the OPTION register, setting the C1T0CS bit of the CM1CON0 register and setting the C1OUTEN bit of the CM1CON0 register. In this mode, Timer0 will increment either on every rising or falling edge of pin T0CKI. The T0SE bit of the OPTION register determines the source edge. Clearing the T0SE bit selects the rising edge. Restrictions on the external clock input are discussed in detail in Section 7.1 “Using Timer0 with an External Clock”. The second Counter mode uses the output of the comparator to increment Timer0. It can be entered in two different ways. The first way is selected by setting the T0CS bit of the OPTION register, and clearing the C1T0CS bit of the CM1CON0 register (C1OUTEN [CM1CON0<6>] does not affect this mode of operation). This enables an internal connection between the comparator and the Timer0. The prescaler may be used by either the Timer0 module or the Watchdog Timer, but not both. The prescaler assignment is controlled in software by the control bit, PSA of the OPTION register. Clearing the PSA bit will assign the prescaler to Timer0. The prescaler is not readable or writable. When the prescaler is assigned to the Timer0 module, prescale values of 1:2, 1:4,..., 1:256 are selectable. Section 7.2 “Prescaler” details the operation of the prescaler. A summary of registers associated with the Timer0 module is found in Table 7-1. FIGURE 7-1: TIMER0 BLOCK DIAGRAM Data Bus Comparator Output FOSC/4 0 PSOUT 0 1 1 1 T0CKI pin Programmable Prescaler(2) T0SE(1) T0CS(1) 0 8 Sync with Internal Clocks TMR0 Reg PSOUT (2 cycle delay) Sync PSA(1) 3 PS2(1), PS1(1), PS0(1) C1T0CS(3) Note 1: Bits T0CS, T0SE, PSA, PS2, PS1 and PS0 are located in the OPTION register. 2: The prescaler is shared with the Watchdog Timer. 3: The C1T0CS bit is in the CM1CON0 register. 2010 Microchip Technology Inc. DS41326D-page 37 PIC16F526 FIGURE 7-2: PC (Program Counter) TIMER0 TIMING: INTERNAL CLOCK/NO PRESCALE Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 PC – 1 Instruction Fetch PC PC + 1 MOVWF TMR0 T0 Timer0 T0 + 1 T0 + 2 Instruction Executed PC + 4 PC + 5 PC + 6 NT0 + 1 Read TMR0 reads NT0 Read TMR0 reads NT0 NT0 + 2 Read TMR0 Read TMR0 reads NT0 + 1 reads NT0 + 2 Read TMR0 reads NT0 TIMER0 TIMING: INTERNAL CLOCK/PRESCALE 1:2 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 PC – 1 Instruction Fetch PC PC + 1 MOVWF TMR0 T0 Timer0 PC + 2 T0 + 1 Name PC + 4 PC + 5 NT0 Read TMR0 reads NT0 Write TMR0 executed TABLE 7-1: PC + 3 PC + 6 MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W Instruction Executed Addr PC + 3 NT0 Write TMR0 executed FIGURE 7-3: PC (Program Counter) PC + 2 MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W Read TMR0 reads NT0 NT0 + 1 Read TMR0 Read TMR0 reads NT0 + 1 reads NT0 + 2 Read TMR0 reads NT0 REGISTERS ASSOCIATED WITH TIMER0 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on All Other Resets xxxx xxxx uuuu uuuu 1111 1111 uuuu uuuu 01h TMR0 08h CM1CON0 C1OUT C1OUTEN C1POL C1T0CS C1ON C1NREF C1PREF C1WU 0Bh CM2CON0 C2OUT C2OUTEN C2POL C2PREF2 C2ON C2NREF C2PREF1 C2WU 1111 1111 uuuu uuuu N/A OPTION RBWU RBPU T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111 N/A TRIS(1) — — --11 1111 --11 1111 Legend: Note 1: Timer0 – 8-bit Real-Time Clock/Counter Value on Power-On Reset I/O Control Register (PORTB, PORTC) Shaded cells are not used by Timer0. – = unimplemented, x = unknown, u = unchanged. The TRIS of the T0CKI pin is overridden when T0CS = 1. DS41326D-page 38 2010 Microchip Technology Inc. PIC16F526 7.1 Using Timer0 with an External Clock When an external clock input is used for Timer0, it must meet certain requirements. The external clock requirement is due to internal phase clock (TOSC) synchronization. Also, there is a delay in the actual incrementing of Timer0 after synchronization. 7.1.1 EXTERNAL CLOCK SYNCHRONIZATION When no prescaler is used, the external clock input is the same as the prescaler output. The synchronization of T0CKI with the internal phase clocks is accomplished by sampling the prescaler output on the Q2 and Q4 cycles of the internal phase clocks (Figure 7-4). Therefore, it is necessary for T0CKI to be high for at least 2 TOSC (and a small RC delay of 2 Tt0H) and low for at least 2 TOSC (and a small RC delay of 2 Tt0H). Refer to the electrical specification of the desired device. FIGURE 7-4: When a prescaler is used, the external clock input is divided by the asynchronous ripple counter-type prescaler, so that the prescaler output is symmetrical. For the external clock to meet the sampling requirement, the ripple counter must be taken into account. Therefore, it is necessary for T0CKI to have a period of at least 4 TOSC (and a small RC delay of 4 Tt0H) divided by the prescaler value. The only requirement on T0CKI high and low time is that they do not violate the minimum pulse width requirement of Tt0H. Refer to parameters 40, 41 and 42 in the electrical specification of the desired device. 7.1.2 TIMER0 INCREMENT DELAY Since the prescaler output is synchronized with the internal clocks, there is a small delay from the time the external clock edge occurs to the time the Timer0 module is actually incremented. Figure 7-4 shows the delay from the external clock edge to the timer incrementing. TIMER0 TIMING WITH EXTERNAL CLOCK Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 External Clock Input or Prescaler Output (2) External Clock/Prescaler Output After Sampling (3) Q1 Q2 Q3 Q4 Small pulse misses sampling (1) Increment Timer0 (Q4) Timer0 Note 1: T0 T0 + 1 T0 + 2 Delay from clock input change to Timer0 increment is 3 TOSC to 7 TOSC. (Duration of Q = TOSC). Therefore, the error in measuring the interval between two edges on Timer0 input = ±4 TOSC max. 2: External clock if no prescaler selected; prescaler output otherwise. 3: The arrows indicate the points in time where sampling occurs. 2010 Microchip Technology Inc. DS41326D-page 39 PIC16F526 7.2 Prescaler An 8-bit counter is available as a prescaler for the Timer0 module or as a postscaler for the Watchdog Timer (WDT), respectively (see Section 8.6 “Watchdog Timer (WDT)”). For simplicity, this counter is being referred to as “prescaler” throughout this data sheet. Note: The prescaler may be used by either the Timer0 module or the WDT, but not both. Thus, a prescaler assignment for the Timer0 module means that there is no prescaler for the WDT and vice versa. The PSA and PS<2:0> bits of the OPTION register determine prescaler assignment and prescale ratio. When assigned to the Timer0 module, all instructions writing to the TMR0 register (e.g., CLRF TMR0, MOVWF TMR0, etc.) will clear the prescaler. When assigned to WDT, a CLRWDT instruction will clear the prescaler along with the WDT. The prescaler is neither readable nor writable. On a Reset, the prescaler contains all ‘0’s. 7.2.1 SWITCHING PRESCALER ASSIGNMENT EXAMPLE 7-1: CHANGING PRESCALER (TIMER0 WDT) CLRWDT ;Clear WDT CLRF TMR0 ;Clear TMR0 & Prescaler MOVLW b'00xx1111' CLRWDT ;PS<2:0> are 000 or 001 MOVLW b'00xx1xxx' ;Set Postscaler to OPTION ;desired WDT rate To change the prescaler from the WDT to the Timer0 module, use the sequence shown in Example 7-2. This sequence must be used even if the WDT is disabled. A CLRWDT instruction should be executed before switching the prescaler. EXAMPLE 7-2: CLRWDT MOVLW CHANGING PRESCALER (WDT TIMER0) ;Clear WDT and ;prescaler b'xxxx0xxx' ;Select TMR0, new ;prescale value and ;clock source OPTION The prescaler assignment is fully under software control (i.e., it can be changed “on-the-fly” during program execution). To avoid an unintended device Reset, the following instruction sequence (Example 71) must be executed when changing the prescaler assignment from Timer0 to the WDT. DS41326D-page 40 2010 Microchip Technology Inc. PIC16F526 FIGURE 7-5: BLOCK DIAGRAM OF THE TIMER0/WDT PRESCALER TCY (= FOSC/4) Data Bus 0 Comparator Output 0 1 8 M U X 1 0 1 T0CKI Pin M U X T0SE(1) T0CS(1) Sync 2 Cycles TMR0 Reg PSA(1) C1TOCS 0 Watchdog Timer 1 8-bit Prescaler M U X 8 PS<2:0>(1) 8-to-1 MUX (1) PSA WDT Enable bit 1 0 MUX PSA(1) WDT Time-out Note 1: T0CS, T0SE, PSA, PS<2:0> are bits in the OPTION register. 2010 Microchip Technology Inc. DS41326D-page 41 PIC16F526 NOTES: DS41326D-page 42 2010 Microchip Technology Inc. PIC16F526 8.0 SPECIAL FEATURES OF THE CPU What sets a microcontroller apart from other processors are special circuits that deal with the needs of real-time applications. The PIC16F526 microcontrollers have a host of such features intended to maximize system reliability, minimize cost through elimination of external components, provide powersaving operating modes and offer code protection. These features are: • Oscillator Selection • Reset: - Power-on Reset (POR) - Device Reset Timer (DRT) - Wake-up from Sleep on Pin Change • Watchdog Timer (WDT) • Sleep • Code Protection • ID Locations • In-Circuit Serial Programming™ • Clock Out 2010 Microchip Technology Inc. The PIC16F526 device has a Watchdog Timer, which can be shut off only through Configuration bit WDTE. It runs off of its own RC oscillator for added reliability. If using HS, XT or LP selectable oscillator options, there is always an 18 ms (nominal) delay provided by the Device Reset Timer (DRT), intended to keep the chip in Reset until the crystal oscillator is stable. If using INTRC or EXTRC, there is a 1 ms delay only on VDD power-up. With this timer on-chip, most applications need no external Reset circuitry. The Sleep mode is designed to offer a very low current Power-Down mode. The user can wake-up from Sleep through a change on input pins or through a Watchdog Timer time-out. Several oscillator options are also made available to allow the part to fit the application, including an internal 4/8 MHz oscillator. The EXTRC oscillator option saves system cost while the LP crystal option saves power. A set of Configuration bits are used to select various options. 8.1 Configuration Bits The PIC16F526 Configuration Words consist of 12 bits. Configuration bits can be programmed to select various device configurations. Three bits are for the selection of the oscillator type; one bit is the Watchdog Timer enable bit, one bit is the MCLR enable bit and one bit is for code protection (Register 8-1). DS41326D-page 43 PIC16F526 REGISTER 8-1: CPDF CONFIG: CONFIGURATION WORD REGISTER IOSCFS MCLRE CP WDTE FOSC2 FOSC1 bit 7 FOSC0 bit 0 bit 7 CPDF: Code Protection bit – Flash Data Memory 1 = Code protection off 0 = Code protection on bit 6 IOSCFS: Internal Oscillator Frequency Select bit 1 = 8 MHz INTOSC frequency 0 = 4 MHz INTOSC frequency bit 5 MCLRE: Master Clear Enable bit 1 = RB3/MCLR pin functions as MCLR 0 = RB3/MCLR pin functions as RB3, MCLR internally tied to VDD bit 4 CP: Code Protection bit – User Program Memory 1 = Code protection off 0 = Code protection on bit 3 WDTE: Watchdog Timer Enable bit 1 = WDT enabled 0 = WDT disabled bit 2-0 FOSC<2:0>: Oscillator Selection bits 000 = LP oscillator and 18 ms DRT 001 = XT oscillator and 18 ms DRT 010 = HS oscillator and 18 ms DRT 011 = EC oscillator with RB4 function on RB4/OSC2/CLKOUT and 1 ms DRT(1) 100 = INTRC with RB4 function on RB4/OSC2/CLKOUT and 1 ms DRT(1) 101 = INTRC with CLKOUT function on RB4/OSC2/CLKOUT and 1 ms DRT(1) 110 = EXTRC with RB4 function on RB4/OSC2/CLKOUT and 1 ms DRT(1) 111 = EXTRC with CLKOUT function on RB4/OSC2/CLKOUT and 1 ms DRT(1) Note 1: Refer to the “PIC16F526 Memory Programming Specification”, DS41317 to determine how to access the Configuration Word. 2: DRT length (18 ms or 1 ms) is a function of Clock mode selection. It is the responsibility of the application designer to ensure the use of either 18 ms (nominal) DRT or the 1 ms (nominal) DRT will result in acceptable operation. Refer to Section 14.1 “DC Characteristics: PIC16F526 (Industrial)” and Section 14.2 “DC Characteristics: PIC16F526 (Extended)” for VDD rise time and stability requirements for this mode of operation. DS41326D-page 44 2010 Microchip Technology Inc. PIC16F526 8.2 Oscillator Configurations 8.2.1 FIGURE 8-1: OSCILLATOR TYPES The PIC16F526 device can be operated in up to six different oscillator modes. The user can program up to three Configuration bits (FOSC<2:0>). To select one of these modes: • • • • • • LP: XT: HS: INTRC: EXTRC: EC: 8.2.2 CRYSTAL OPERATION (OR CERAMIC RESONATOR) (HS, XT OR LP OSC CONFIGURATION) Low-Power Crystal Crystal/Resonator High-Speed Crystal/Resonator Internal 4/8 MHz Oscillator External Resistor/Capacitor External High-Speed Clock Input C1(1) Note 1: This device has been designed to perform to the parameters of its data sheet. It has been tested to an electrical specification designed to determine its conformance with these parameters. Due to process differences in the manufacture of this device, this device may have different performance characteristics than its earlier version. These differences may cause this device to perform differently in your application than the earlier version of this device. 2: The user should verify that the device oscillator starts and performs as expected. Adjusting the loading capacitor values and/or the Oscillator mode may be required. 2010 Microchip Technology Inc. RS(2) C2(1) Note 1: 2: 3: PIC16F526 Sleep XTAL CRYSTAL OSCILLATOR/CERAMIC RESONATORS In HS, XT or LP modes, a crystal or ceramic resonator is connected to the RB5/OSC1/CLKIN and RB4/OSC2/ CLKOUT pins to establish oscillation (Figure 8-1). The PIC16F526 oscillator designs require the use of a parallel cut crystal. Use of a series cut crystal may give a frequency out of the crystal manufacturers specifications. When in HS, XT or LP modes, the device can have an external clock source drive the RB5/OSC1/CLKIN pin (Figure 8-2). In this mode, the output drive levels on the OSC2 pin are very weak. If the part is used in this fashion, then this pin should be left open and unloaded. Also when using this mode, the external clock should observe the frequency limits for the Clock mode chosen (HS, XT or LP). OSC1 RF(3) To internal logic OSC2 See Capacitor Selection tables for recommended values of C1 and C2. A series resistor (RS) may be required for AT strip cut crystals. RF approx. value = 10 M. FIGURE 8-2: EXTERNAL CLOCK INPUT OPERATION (HS, XT, LP OR EC OSC CONFIGURATION) EC, HS, XT, LP Clock From ext. system RB5/OSC1/CLKIN PIC16F526 OSC2/CLKOUT/RB4 Note 1: OSC2/CLKOUT/RB4(1) RB4 is available in EC mode only. TABLE 8-1: CAPACITOR SELECTION FOR CERAMIC RESONATORS Osc Type Resonator Freq. XT 4.0 MHz 30 pF 30 pF HS 16 MHz 10-47 pF 10-47 pF Note 1: Cap. Range C1 Cap. Range C2 These values are for design guidance only. Since each resonator has its own characteristics, the user should consult the resonator manufacturer for appropriate values of external components. DS41326D-page 45 PIC16F526 TABLE 8-2: CAPACITOR SELECTION FOR CRYSTAL OSCILLATOR(2) Osc Type Resonator Freq. Cap. Range C1 Cap. Range C2 LP 32 kHz(1) 15 pF 15 pF XT 200 kHz 1 MHz 4 MHz 47-68 pF 15 pF 15 pF 47-68 pF 15 pF 15 pF 20 MHz 15-47 pF 15-47 pF HS Note 1: 2: 8.2.3 For VDD > 4.5V, C1 = C2 30 pF is recommended. These values are for design guidance only. Rs may be required to avoid overdriving crystals with low drive level specification. Since each crystal has its own characteristics, the user should consult the crystal manufacturer for appropriate values of external components. EXTERNAL CRYSTAL OSCILLATOR CIRCUIT Either a prepackaged oscillator or a simple oscillator circuit with TTL gates can be used as an external crystal oscillator circuit. Prepackaged oscillators provide a wide operating range and better stability. A well-designed crystal oscillator will provide good performance with TTL gates. Two types of crystal oscillator circuits can be used: one with parallel resonance, or one with series resonance. Figure 8-3 shows implementation of a parallel resonant oscillator circuit. The circuit is designed to use the fundamental frequency of the crystal. The 74AS04 inverter performs the 180-degree phase shift that a parallel oscillator requires. The 4.7 k resistor provides the negative feedback for stability. The 10 k potentiometers bias the 74AS04 in the linear region. This circuit could be used for external oscillator designs. FIGURE 8-3: EXTERNAL PARALLEL RESONANT CRYSTAL OSCILLATOR CIRCUIT +5V To Other Devices 10k 74AS04 4.7k CLKIN 74AS04 PIC16F526 10k XTAL Figure 8-4 shows a series resonant oscillator circuit. This circuit is also designed to use the fundamental frequency of the crystal. The inverter performs a 180degree phase shift in a series resonant oscillator circuit. The 330 resistors provide the negative feedback to bias the inverters in their linear region. FIGURE 8-4: 330 EXTERNAL SERIES RESONANT CRYSTAL OSCILLATOR CIRCUIT To Other Devices 330 74AS04 74AS04 74AS04 CLKIN 0.1 mF PIC16F526 XTAL 8.2.4 EXTERNAL RC OSCILLATOR For timing insensitive applications, the RC device option offers additional cost savings. The RC oscillator frequency is a function of the supply voltage, the resistor (REXT) and capacitor (CEXT) values, and the operating temperature. In addition to this, the oscillator frequency will vary from unit-to-unit due to normal process parameter variation. Furthermore, the difference in lead frame capacitance between package types will also affect the oscillation frequency, especially for low CEXT values. The user also needs to take into account variation due to tolerance of external R and C components used. Figure 8-5 shows how the R/C combination is connected to the PIC16F526 device. For REXT values below 3.0 k, the oscillator operation may become unstable, or stop completely. For very high REXT values (e.g., 1 M), the oscillator becomes sensitive to noise, humidity and leakage. Thus, we recommend keeping REXT between 5.0 k and 100 k. Although the oscillator will operate with no external capacitor (CEXT = 0 pF), we recommend using values above 20 pF for noise and stability reasons. With no or small external capacitance, the oscillation frequency can vary dramatically due to changes in external capacitances, such as PCB trace capacitance or package lead frame capacitance. Section 14.0 “Electrical Characteristics” shows RC frequency variation from part-to-part due to normal process variation. The variation is larger for larger values of R (since leakage current variation will affect RC frequency more for large R) and for smaller values of C (since variation of input capacitance will affect RC frequency more). 10k 20 pF DS41326D-page 46 20 pF 2010 Microchip Technology Inc. PIC16F526 Also, see the Electrical Specifications section for variation of oscillator frequency due to VDD for given REXT/CEXT values, as well as frequency variation due to operating temperature for given R, C and VDD values. FIGURE 8-5: EXTERNAL RC OSCILLATOR MODE VDD REXT OSC1 Internal clock N CEXT PIC16F526 VSS FOSC/4 OSC2/CLKOUT 8.2.5 INTERNAL 4/8 MHz RC OSCILLATOR The internal RC oscillator provides a fixed 4/8 MHz (nominal) system clock at VDD = 5V and 25°C, (see Section 14.0 “Electrical Characteristics” for information on variation over voltage and temperature). In addition, a calibration instruction is programmed into the last address of memory, which contains the calibration value for the internal RC oscillator. This location is always non-code protected, regardless of the codeprotect settings. This value is programmed as a MOVLW XX instruction where XX is the calibration value, and is placed at the Reset vector. This will load the W register with the calibration value upon Reset and the PC will then roll over to the users program at address 0x000. The user then has the option of writing the value to the OSCCAL Register (05h) or ignoring it. OSCCAL, when written to with the calibration value, will “trim” the internal oscillator to remove process variation from the oscillator frequency. Note: Erasing the device will also erase the preprogrammed internal calibration value for the internal oscillator. The calibration value must be read prior to erasing the part so it can be reprogrammed correctly later. For the PIC16F526 device, only bits 7:1 of OSCCAL are used for calibration. See Register 4-3 for more information. Note: 2010 Microchip Technology Inc. The bit 0 of the OSCCAL register is unimplemented and should be written as ‘0’ when modifying OSCCAL for compatibility with future devices. DS41326D-page 47 PIC16F526 8.3 Reset The device differentiates between various kinds of Reset: • • • • • • Power-on Reset (POR) MCLR Reset during normal operation MCLR Reset during Sleep WDT Time-out Reset during normal operation WDT Time-out Reset during Sleep Wake-up from Sleep on pin change TABLE 8-3: Register W Some registers are not reset in any way, they are unknown on POR and unchanged in any other Reset. Most other registers are reset to “Reset state” on Power-on Reset (POR), MCLR, WDT or Wake-up on pin change Reset during normal operation. They are not affected by a WDT Reset during Sleep or MCLR Reset during Sleep, since these Resets are viewed as resumption of normal operation. The exceptions to this are TO, PD and RBWUF bits. They are set or cleared differently in different Reset situations. These bits are used in software to determine the nature of Reset. See Table 8-3 for a full description of Reset states of all registers. RESET CONDITIONS FOR REGISTERS Address — Power-on Reset MCLR Reset, WDT Time-out, Wake-up On Pin Change qqqq qqq0(1) qqqq qqq0(1) INDF 00h xxxx xxxx uuuu uuuu TMR0 01h xxxx xxxx uuuu uuuu PCL 02h 1111 1111 1111 1111 STATUS 03h 0001 1xxx FSR 04h 100x xxxx 1uuu uuuu OSCCAL 05h 1111 111- uuuu uuu- PORTB 06h --xx xxxx --uu uuuu PORTC 07h --xx xxxx --uu uuuu CMICON0 08h q111 1111 quuu uuuu ADCON0 09h 1111 1100 1111 1100 ADRES 0Ah xxxx xxxx uuuu uuuu CM2CON0 0Bh q111 1111 quuu uuuu VRCON 0Ch 001-1111 uuu-uuuu OPTION — 1111 1111 1111 1111 TRISB — --11 1111 --11 1111 qq0q quuu(2) TRISC — --11 1111 --11 1111 EECON 21h/61h ---0 x000 ---0 q000 EEDATA 25h/65h xxxx xxxx uuuu uuuu EEADR 26h/66h --xx xxxx --uu uuuu Legend: u = unchanged, x = unknown, – = unimplemented bit, read as ‘0’, q = value depends on condition. Note 1: Bits <7:1> of W register contain oscillator calibration values due to MOVLW XX instruction at top of memory. 2: See Table 8-4 for Reset value for specific conditions. DS41326D-page 48 2010 Microchip Technology Inc. PIC16F526 TABLE 8-4: RESET CONDITION FOR SPECIAL REGISTERS STATUS Addr: 03h Power-on Reset 0001 1xxx MCLR Reset during normal operation 000u uuuu MCLR Reset during Sleep 0001 0uuu WDT Reset during Sleep 0000 0uuu WDT Reset normal operation 0000 uuuu Wake-up from Sleep on pin change 1001 0uuu Wake-up from Sleep on comparator change 0101 0uuu Legend: u = unchanged, x = unknown, – = unimplemented bit, read as ‘0’. 2010 Microchip Technology Inc. DS41326D-page 49 PIC16F526 8.3.1 MCLR ENABLE This Configuration bit, when unprogrammed (left in the ‘1’ state), enables the external MCLR function. When programmed, the MCLR function is tied to the internal VDD and the pin is assigned to be a I/O. See Figure 8-6. FIGURE 8-6: MCLR SELECT A power-up example where MCLR is held low is shown in Figure 8-8. VDD is allowed to rise and stabilize before bringing MCLR high. The chip will actually come out of Reset TDRT msec after MCLR goes high. RBWU RB3/MCLR/VPP MCLRE 8.4 The Power-on Reset circuit and the Device Reset Timer (see Section 8.5 “Device Reset Timer (DRT)”) circuit are closely related. On power-up, the Reset latch is set and the DRT is reset. The DRT timer begins counting once it detects MCLR to be high. After the time-out period, which is typically 18 ms or 1 ms, it will reset the Reset latch and thus end the on-chip Reset signal. Internal MCLR Power-on Reset (POR) The PIC16F526 device incorporates an on-chip Poweron Reset (POR) circuitry, which provides an internal chip Reset for most power-up situations. The on-chip POR circuit holds the chip in Reset until VDD has reached a high enough level for proper operation. To take advantage of the internal POR, program the RB3/MCLR/VPP pin as MCLR and tie through a resistor to VDD, or program the pin as RB3. An internal weak pull-up resistor is implemented using a transistor (refer to Table 14-5 for the pull-up resistor ranges). This will eliminate external RC components usually needed to create a Power-on Reset. A maximum rise time for VDD is specified. See Section 14.0 “Electrical Characteristics” for details. When the device starts normal operation (exit the Reset condition), device operating parameters (voltage, frequency, temperature,...) must be met to ensure operation. If these conditions are not met, the device must be held in Reset until the operating parameters are met. In Figure 8-9, the on-chip Power-on Reset feature is being used (MCLR and VDD are tied together or the pin is programmed to be RB3. The VDD is stable before the start-up timer times out and there is no problem in getting a proper Reset. However, Figure 8-10 depicts a problem situation where VDD rises too slowly. The time between when the DRT senses that MCLR is high and when MCLR and VDD actually reach their full value, is too long. In this situation, when the start-up timer times out, VDD has not reached the VDD (min) value and the chip may not function correctly. For such situations, we recommend that external RC circuits be used to achieve longer POR delay times (Figure 8-9). Note: When the device starts normal operation (exit the Reset condition), device operating parameters (voltage, frequency, temperature, etc.) must be met to ensure operation. If these conditions are not met, the device must be held in Reset until the operating conditions are met. For additional information, refer to Application Notes AN522 “Power-Up Considerations” (DS00522) and AN607 “Power-up Trouble Shooting” (DS00607). A simplified block diagram of the on-chip Power-on Reset circuit is shown in Figure 8-7. DS41326D-page 50 2010 Microchip Technology Inc. PIC16F526 FIGURE 8-7: SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT VDD Power-up Detect POR (Power-on Reset) RB3/MCLR/VPP MCLR Reset S Q R Q MCLRE WDT Time-out Pin Change Sleep WDT Reset Start-up Timer (10 ms, 1.125 ms or 18 ms) CHIP Reset Wake-up on pin Change Reset Comparator Change Wake-up on Comparator Change TIME-OUT SEQUENCE ON POWER-UP (MCLR PULLED LOW) FIGURE 8-8: VDD MCLR Internal POR TDRT DRT Time-out Internal Reset FIGURE 8-9: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD): FAST VDD RISE TIME VDD MCLR Internal POR TDRT DRT Time-out Internal Reset 2010 Microchip Technology Inc. DS41326D-page 51 PIC16F526 FIGURE 8-10: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD): SLOW VDD RISE TIME V1 VDD MCLR Internal POR TDRT DRT Time-out Internal Reset Note: When VDD rises slowly, the TDRT time-out expires long before VDD has reached its final value. In this example, the chip will reset properly if, and only if, V1 VDD min. DS41326D-page 52 2010 Microchip Technology Inc. PIC16F526 8.5 Device Reset Timer (DRT) On the PIC16F526 device, the DRT runs any time the device is powered up. DRT runs from Reset and varies based on oscillator selection and Reset type (see Table 8-5). The DRT operates on an internal RC oscillator. The processor is kept in Reset as long as the DRT is active. The DRT delay allows VDD to rise above VDD min. and for the oscillator to stabilize. Oscillator circuits based on crystals or ceramic resonators require a certain time after power-up to establish a stable oscillation. The on-chip DRT keeps the device in a Reset condition after MCLR has reached a logic high (VIH MCLR) level. Programming RB3/MCLR/VPP as MCLR and using an external RC network connected to the MCLR input is not required in most cases. This allows savings in cost-sensitive and/or space restricted applications, as well as allowing the use of the RB3/ MCLR/VPP pin as a general purpose input. The Device Reset Time delays will vary from chip-tochip due to VDD, temperature and process variation. See AC parameters for details. The DRT will also be triggered upon a Watchdog Timer time-out from Sleep. This is particularly important for applications using the WDT to wake from Sleep mode automatically. Reset sources are POR, MCLR, WDT time-out and wake-up on pin or comparator change. See Section 8.9.2 “Wake-up from Sleep”, Notes 1, 2 and 3. 8.6 TABLE 8-5: Oscillator Configuration TYPICAL DRT PERIODS POR Reset Subsequent Resets 18 ms 18 ms EC 1.125 ms 10 s INTOSC, EXTRC 1.125 ms 10 s HS, XT, LP 8.6.1 WDT PERIOD The WDT has a nominal time-out period of 18 ms, (with no prescaler). If a longer time-out period is desired, a prescaler with a division ratio of up to 1:128 can be assigned to the WDT (under software control) by writing to the OPTION register. Thus, a time-out period of a nominal 2.3 seconds can be realized. These periods vary with temperature, VDD and part-to-part process variations (see DC specs). Under worst-case conditions (VDD = Min., Temperature = Max., max. WDT prescaler), it may take several seconds before a WDT time-out occurs. 8.6.2 WDT PROGRAMMING CONSIDERATIONS The CLRWDT instruction clears the WDT and the postscaler, if assigned to the WDT, and prevents it from timing out and generating a device Reset. The SLEEP instruction resets the WDT and the postscaler, if assigned to the WDT. This gives the maximum Sleep time before a WDT wake-up Reset. Watchdog Timer (WDT) The Watchdog Timer (WDT) is a free running on-chip RC oscillator, which does not require any external components. This RC oscillator is separate from the external RC oscillator of the RB5/OSC1/CLKIN pin and the internal 4/8 MHz oscillator. This means that the WDT will run even if the main processor clock has been stopped, for example, by execution of a SLEEP instruction. During normal operation or Sleep, a WDT Reset or wake-up Reset, generates a device Reset. The TO bit of the STATUS register will be cleared upon a Watchdog Timer Reset. The WDT can be permanently disabled by programming the configuration WDTE as a ‘0’ (see Section 8.1 “Configuration Bits”). Refer to the PIC16F526 Programming Specifications to determine how to access the Configuration Word. 2010 Microchip Technology Inc. DS41326D-page 53 PIC16F526 FIGURE 8-11: WATCHDOG TIMER BLOCK DIAGRAM From Timer0 Clock Source (Figure 7-1) 0 1 Watchdog Time M U X Postscaler 8-to-1 MUX PS<2:0>(1) PSA WDT Enable Configuration Bit To Timer0 (Figure 7-4) 0 1 MUX PSA(1) WDT Time-out Note 1: TABLE 8-6: Address N/A PSA, PS<2:0> are bits in the OPTION register. SUMMARY OF REGISTERS ASSOCIATED WITH THE WATCHDOG TIMER Name OPTION Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on Power-On Reset Value on All Other Resets RBWU RBPU T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111 Legend: Shaded boxes = Not used by Watchdog Timer. DS41326D-page 54 2010 Microchip Technology Inc. PIC16F526 8.7 Time-out Sequence, Power-down and Wake-up from Sleep Status Bits (TO, PD, RBWUF, CWUF) The TO, PD and RBWUF bits in the STATUS register can be tested to determine if a Reset condition has been caused by a power-up condition, a MCLR or Watchdog Timer (WDT) Reset. TABLE 8-7: FIGURE 8-12: VDD VDD 33k PIC12F510 PIC16F506 Q1 10k TO/PD/RBWUF/CWUF STATUS AFTER RESET CWUF RBWUF TO PD MCLR(2) 40k(1) Reset Caused By 0 0 0 0 WDT wake-up from Sleep 0 0 0 u WDT time-out (not from Sleep) 0 0 1 0 MCLR wake-up from Sleep 0 0 1 1 Power-up 0 0 u u MCLR not during Sleep 0 1 1 0 Wake-up from Sleep on pin change 1 0 1 0 Wake up from Sleep on comparator change Note 1: This circuit will activate Reset when VDD goes below Vz + 0.7V (where Vz = Zener voltage). Pin must be configured as MCLR. 2: FIGURE 8-13: Note 1: The TO, PD and RBWUF bits maintain their status (u) until a Reset occurs. A low-pulse on the MCLR input does not change the TO, PD and RBWUF Status bits. VDD R1 Q1 R2 Note 1: To reset PIC16F526 devices when a brown-out occurs, external brown-out protection circuits may be built, as shown in Figure 8-12 and Figure 8-13. PIC12F510 PIC16F506 MCLR(2) 40k(1) This brown-out circuit is less expensive, although less accurate. Transistor Q1 turns off when VDD is below a certain level such that: Reset on Brown-out A brown-out is a condition where device power (VDD) dips below its minimum value, but not to zero, and then recovers. The device should be reset in the event of a brown-out. BROWN-OUT PROTECTION CIRCUIT 2 VDD Legend: u = unchanged 8.8 BROWN-OUT PROTECTION CIRCUIT 1 VDD • 2: R1 R1 + R2 = 0.7V Pin must be configured as MCLR. FIGURE 8-14: BROWN-OUT PROTECTION CIRCUIT 3 VDD MCP809 VSS Bypass Capacitor VDD VDD RST MCLR PIC12F510 PIC16F506 Note: 2010 Microchip Technology Inc. This brown-out protection circuit employs Microchip Technology’s MCP809 microcontroller supervisor. There are 7 different trip point selections to accommodate 5V to 3V systems. DS41326D-page 55 PIC16F526 8.9 Power-down Mode (Sleep) A device may be powered down (Sleep) and later powered up (wake-up from Sleep). 8.9.1 SLEEP 8.9.2 The device can wake-up from Sleep through one of the following events: 1. The Power-Down mode is entered by executing a SLEEP instruction. 2. If enabled, the Watchdog Timer will be cleared but keeps running, the TO bit of the STATUS register is set, the PD bit of the STATUS register is cleared and the oscillator driver is turned off. The I/O ports maintain the status they had before the SLEEP instruction was executed (driving high, driving low or high-impedance). 3. Note: A Reset generated by a WDT time-out does not drive the MCLR pin low. For lowest current consumption while powered down, the T0CKI input should be at VDD or VSS and the RB3/ MCLR/VPP pin must be at a logic high level if MCLR is enabled. WAKE-UP FROM SLEEP 4. An external Reset input on RB3/MCLR/VPP pin, when configured as MCLR. A Watchdog Timer Time-out Reset (if WDT was enabled). A change on input pin RB0, RB1, RB3 or RB4 when wake-up on change is enabled. A change in one of the comparator output bits, C1OUT or C2OUT (if comparator wake-up is enabled). These events cause a device Reset. The TO, PD and CWUF/RBWUF bits can be used to determine the cause of device Reset. The TO bit is cleared if a WDT time-out occurred (and caused wake-up). The PD bit, which is set on power-up, is cleared when SLEEP is invoked. The CWUF bit indicates a change in a comparator output state while the device was in Sleep. The RBWUF bit indicates a change in state while in Sleep at pins RB0, RB1, RB3 or RB4 (since the last file or bit operation on RB port). Note: Caution: Right before entering Sleep, read the input pins. When in Sleep, wake-up occurs when the values at the pins change from the state they were in at the last reading. If a wake-up on change occurs and the pins are not read before re-entering Sleep, a wake-up will occur immediately even if no pins change while in Sleep mode. The WDT is cleared when the device wakes from Sleep, regardless of the wake-up source. Note: DS41326D-page 56 Caution: Right before entering Sleep, read the comparator Configuration register(s) CM1CON0 and CM2CON0. When in Sleep, wake-up occurs when the comparator output bit C1OUT and C2OUT change from the state they were in at the last reading. If a wake-up on comparator change occurs and the pins are not read before re-entering Sleep, a wake-up will occur immediately, even if no pins change while in Sleep mode. 2010 Microchip Technology Inc. PIC16F526 8.10 Program Verification/Code Protection FIGURE 8-15: If the code protection bit has not been programmed, the on-chip program memory can be read out for verification purposes. The first 64 locations and the last location (OSCCAL) can be read, regardless of the code protection bit setting. The last memory location can be read regardless of the code protection bit setting on the PIC16F526 device. 8.11 ID Locations Four memory locations are designated as ID locations where the user can store checksum or other code identification numbers. These locations are not accessible during normal execution, but are readable and writable during Program/Verify. Use only the lower 4 bits of the ID locations and always program the upper 8 bits as ‘0’s. 8.12 External Connector Signals TYPICAL IN-CIRCUIT SERIAL PROGRAMMING CONNECTION To Normal Connections PIC16F526 +5V VDD 0V VSS VPP MCLR/VPP CLK RB1 Data RB0 VDD To Normal Connections In-Circuit Serial Programming™ The PIC16F526 microcontroller can be serially programmed while in the end application circuit. This is simply done with two lines for clock and data, and three other lines for power, ground and the programming voltage. This allows customers to manufacture boards with unprogrammed devices and then program the microcontroller just before shipping the product. This also allows the most recent firmware, or a custom firmware, to be programmed. The devices are placed into a Program/Verify mode by holding the RB1 and RB0 pins low while raising the MCLR (VPP) pin from VIL to VIHH (see programming specification). RB1 becomes the programming clock and B0 becomes the programming data. Both RB1 and RB0 are Schmitt Trigger inputs in this mode. After Reset, a 6-bit command is then supplied to the device. Depending on the command, 14 bits of program data are then supplied to or from the device, depending if the command was a Load or a Read. For complete details of serial programming, please refer to the PIC16F526 Programming Specifications. A typical In-Circuit Serial Programming connection is shown in Figure 8-15. 2010 Microchip Technology Inc. DS41326D-page 57 PIC16F526 NOTES: DS41326D-page 58 2010 Microchip Technology Inc. PIC16F526 9.0 ANALOG-TO-DIGITAL (A/D) CONVERTER Note: The A/D Converter allows conversion of an analog signal into an 8-bit digital signal. 9.1 Clock Divisors The ADC has 4 clock source settings ADCS<1:0>. There are 3 divisor values 16, 8 and 4. The fourth setting is INTOSC with a divisor of 4. These settings will allow a proper conversion when using an external oscillator at speeds from 20 MHz to 350 kHz. Using an external oscillator at a frequency below 350 kHz requires the ADC oscillator setting to be INTOSC/4 (ADCS<1:0> = 11) for valid ADC results. The ADC requires 13 TAD periods to complete a conversion. The divisor values do not affect the number of TAD periods required to perform a conversion. The divisor values determine the length of the TAD period. When the ADCS<1:0> bits are changed while an ADC conversion is in process, the new ADC clock source will not be selected until the next conversion is started. This clock source selection will be lost when the device enters Sleep. Note: 9.1.1 The ADC clock is derived from the instruction clock. The ADCS divisors are then applied to create the ADC clock VOLTAGE REFERENCE There is no external voltage reference for the ADC. The ADC reference voltage will always be VDD. 9.1.2 ANALOG MODE SELECTION The ANS<1:0> bits are used to configure pins for analog input. Upon any Reset, ANS<1:0> defaults to 11. This configures pins AN0, AN1 and AN2 as analog inputs. The comparator output, C1OUT, will override AN2 as an input if the comparator output is enabled. Pins configured as analog inputs are not available for digital output. Users should not change the ANS bits while a conversion is in process. ANS bits are active regardless of the condition of ADON. 9.1.3 It is the users responsibility to ensure that use of the ADC and comparator simultaneously on the same pin, does not adversely affect the signal being monitored or adversely effect device operation. When the CHS<1:0> bits are changed during an ADC conversion, the new channel will not be selected until the current conversion is completed. This allows the current conversion to complete with valid results. All channel selection information will be lost when the device enters Sleep. TABLE 9-1: CHANNEL SELECT (ADCS) BITS AFTER AN EVENT Event MCLR ADCS<1:0> 11 Conversion completed CS<1:0> Conversion terminated CS<1:0> Power-on 11 Wake from Sleep 11 9.1.4 THE GO/DONE BIT The GO/DONE bit is used to determine the status of a conversion, to start a conversion and to manually halt a conversion in process. Setting the GO/DONE bit starts a conversion. When the conversion is complete, the ADC module clears the GO/DONE bit. A conversion can be terminated by manually clearing the GO/DONE bit while a conversion is in process. Manual termination of a conversion may result in a partially converted result in ADRES. The GO/DONE bit is cleared when the device enters Sleep, stopping the current conversion. The ADC does not have a dedicated oscillator, it runs off of the instruction clock. Therefore, no conversion can occur in sleep. The GO/DONE bit cannot be set when ADON is clear. ADC CHANNEL SELECTION The CHS bits are used to select the analog channel to be sampled by the ADC. The CHS<1:0> bits can be changed at any time without adversely effecting a conversion. To acquire an analog signal the CHS<1:0> selection must match one of the pin(s) selected by the ANS<1:0> bits. When the ADC is on (ADON = 1) and a channel is selected that is also being used by the comparator, then both the comparator and the ADC will see the analog voltage on the pin. 2010 Microchip Technology Inc. DS41326D-page 59 PIC16F526 9.1.5 SLEEP This ADC does not have a dedicated ADC clock, and therefore, no conversion in Sleep is possible. If a conversion is underway and a Sleep command is executed, the GO/DONE and ADON bit will be cleared. This will stop any conversion in process and powerdown the ADC module to conserve power. Due to the nature of the conversion process, the ADRES may contain a partial conversion. At least 1 bit must have been converted prior to Sleep to have partial conversion data in ADRES. The ADCS and CHS bits are reset to their default condition; ANS<1:0> = 11 and CHS<1:0> = 11. • For accurate conversions, TAD must meet the following: • 500 ns < TAD < 50 s • TAD = 1/(FOSC/divisor) Shaded areas indicate TAD out of range for accurate conversions. If analog input is desired at these frequencies, use INTOSC/8 for the ADC clock source. TABLE 9-2: Source TAD FOR ADCS SETTINGS WITH VARIOUS OSCILLATORS ADCS <1:0> Divisor 20 MHz 16 MHz 11 4 — — .5 s 1 s INTOSC 8 MHz 4 MHz 1 MHz — 500 kHz 350 kHz 200 kHz 100 kHz 32 kHz — — — — — FOSC 10 4 .2 s .25 s .5 s 1 s 4 s 8 s 11 s 20 s 40 s 125 s FOSC 01 8 .4 s .5 s 1 s 2 s 8 s 16 s 23 s 40 s 80 s 250 s FOSC 00 16 .8 s 1 s 2 s 4 s 16 s 32 s 46 s 80 s 160 s 500 s TABLE 9-3: EFFECTS OF SLEEP ON ADCON0 ANS1 Entering Sleep ANS0 Unchanged Unchanged Wake or Reset DS41326D-page 60 1 1 ADCS1 ADCS0 CHS1 CHS0 GO/DONE ADON 1 1 1 1 0 0 1 1 1 1 0 0 2010 Microchip Technology Inc. PIC16F526 9.1.6 ANALOG CONVERSION RESULT REGISTER right shifts of the ‘leading one’ have taken place, the conversion is complete; the ‘leading one’ has been shifted out and the GO/DONE bit is cleared. The ADRES register contains the results of the last conversion. These results are present during the sampling period of the next analog conversion process. After the sampling period is over, ADRES is cleared (= 0). A ‘leading one’ is then right shifted into the ADRES to serve as an internal conversion complete bit. As each bit weight, starting with the MSB, is converted, the leading one is shifted right and the converted bit is stuffed into ADRES. After a total of 9 REGISTER 9-1: If the GO/DONE bit is cleared in software during a conversion, the conversion stops. The data in ADRES is the partial conversion result. This data is valid for the bit weights that have been converted. The position of the ‘leading one’ determines the number of bits that have been converted. The bits that were not converted before the GO/DONE was cleared are unrecoverable. ADCON0: A/D CONTROL REGISTER R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-0 R/W-0 ANS1 ANS0 ADCS1 ADCS0 CHS1 CHS0 GO/DONE ADON bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-6 ANS<1:0>: ADC Analog Input Pin Select bits(1), (2), (5) 00 = No pins configured for analog input 01 = AN2 configured as an analog input 10 = AN2 and AN0 configured as analog inputs 11 = AN2, AN1 and AN0 configured as analog inputs bit 5-4 ADCS<1:0>: ADC Conversion Clock Select bits 00 = FOSC/16 01 = FOSC/8 10 = FOSC/4 11 = INTOSC/4 bit 3-2 CHS<1:0>: ADC Channel Select bits(3, 5) 00 = Channel AN0 01 = Channel AN1 10 = Channel AN2 11 = 0.6V absolute voltage reference bit 1 GO/DONE: ADC Conversion Status bit(4) 1 = ADC conversion in progress. Setting this bit starts an ADC conversion cycle. This bit is automatically cleared by hardware when the ADC is done converting. 0 = ADC conversion completed/not in progress. Manually clearing this bit while a conversion is in process terminates the current conversion. bit 0 ADON: ADC Enable bit 1 = ADC module is operating 0 = ADC module is shut-off and consumes no power Note 1: When the ANS bits are set, the channels selected will automatically be forced into Analog mode, regardless of the pin function previously defined. The only exception to this is the comparator, where the analog input to the comparator and the ADC will be active at the same time. It is the users responsibility to ensure that the ADC loading on the comparator input does not affect their application. 2: The ANS<1:0> bits are active regardless of the condition of ADON. 3: CHS<1:0> bits default to 11 after any Reset. 4: If the ADON bit is clear, the GO/DONE bit cannot be set. 5: C1OUT, when enabled, overrides AN2. 2010 Microchip Technology Inc. DS41326D-page 61 PIC16F526 REGISTER 9-2: ADRES: A/D CONVERSION RESULTS REGISTER R/W-X R/W-X R/W-X R/W-X R/W-X R/W-X R/W-X R/W-X ADRES7 ADRES6 ADRES5 ADRES4 ADRES3 ADRES2 ADRES1 ADRES0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared EXAMPLE 9-1: PERFORMING AN ANALOG-TO-DIGITAL CONVERSION EXAMPLE 9-2: ;Sample code operates out of BANK0 loop0 MOVLW 0xF1 ;configure A/D MOVWF ADCON0 BSF ADCON0, 1 ;start conversion BTFSC ADCON0, 1;wait for ‘DONE’ GOTO loop0 MOVF ADRES, W ;read result MOVWF result0 ;save result loop1 ;setup for read of ;channel 1 BSF ADCON0, 1 ;start conversion BTFSC ADCON0, 1;wait for ‘DONE’ GOTO loop1 MOVF ADRES, W ;read result MOVWF result1 ;save result loop2 BSF ADCON0, 3 ;setup for read of BCF ADCON0, 2 ;channel 2 BSF ADCON0, 1 ;start conversion BTFSC ADCON0, 1;wait for ‘DONE’ GOTO loop2 MOVF ADRES, W ;read result MOVWF result2 ;save result CHANNEL SELECTION CHANGE DURING CONVERSION MOVLW 0xF1 MOVWF ADCON0 BSF ADCON0, 1 BSF ADCON0, 2 ;configure A/D loop0 ;start conversion ;setup for read of ;channel 1 BTFSC ADCON0, 1;wait for ‘DONE’ GOTO loop0 MOVF ADRES, W ;read result MOVWF result0 ;save result loop1 BSF ADCON0, 1 ;start conversion BSF ADCON0, 3 ;setup for read of BCF ADCON0, 2 ;channel 2 BTFSC ADCON0, 1;wait for ‘DONE’ GOTO loop1 MOVF ADRES, W ;read result MOVWF result1 ;save result BSF ADCON0, 2 DS41326D-page 62 x = Bit is unknown loop2 BSF ADCON0, 1 ;start conversion BTFSC ADCON0, 1;wait for ‘DONE’ GOTO loop2 MOVF ADRES, W ;read result MOVWF result2 ;save result CLRF ADCON0 ;optional: returns ;pins to Digital mode and turns off ;the ADC module 2010 Microchip Technology Inc. PIC16F526 10.0 COMPARATOR(S) This device contains two comparators comparator voltage reference. REGISTER 10-1: and a CM1CON0: COMPARATOR C1 CONTROL REGISTER R-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 C1OUT C1OUTEN C1POL C1T0CS C1ON C1NREF C1PREF C1WU bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 C1OUT: Comparator Output bit 1 = VIN+ > VIN0 = VIN+ < VIN- bit 6 C1OUTEN: Comparator Output Enable bit(1), (2) 1 = Output of comparator is NOT placed on the C1OUT pin 0 = Output of comparator is placed in the C1OUT pin bit 5 C1POL: Comparator Output Polarity bit(2) 1 = Output of comparator is not inverted 0 = Output of comparator is inverted bit 4 C1T0CS: Comparator TMR0 Clock Source bit(2) 1 = TMR0 clock source selected by T0CS control bit 0 = Comparator output used as TMR0 clock source bit 3 C1ON: Comparator Enable bit 1 = Comparator is on 0 = Comparator is off bit 2 C1NREF: Comparator Negative Reference Select bit(2) 1 = C1IN- pin 0 = 0.6V VREF bit 1 C1PREF: Comparator Positive Reference Select bit(2) 1 = C1IN+ pin 0 = C1IN- pin bit 0 C1WU: Comparator Wake-up On Change Enable bit(2) 1 = Wake-up On Comparator Change is disabled 0 = Wake-up On Comparator Change is enabled Note 1: x = Bit is unknown Overrides T0CS bit for TRIS control of RB2. 2: When comparator is turned on, these control bits assert themselves. Otherwise, the other registers have precedence. 2010 Microchip Technology Inc. DS41326D-page 63 PIC16F526 REGISTER 10-2: CM2CON0: COMPARATOR C2 CONTROL REGISTER R-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 C2OUT C2OUTEN C2POL C2PREF2 C2ON C2NREF C2PREF1 C2WU bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 C2OUT: Comparator Output bit 1 = VIN+ > VIN0 = VIN+ < VIN- bit 6 C2OUTEN: Comparator Output Enable bit(1), (2) 1 = Output of comparator is NOT placed on the C2OUT pin 0 = Output of comparator is placed in the C2OUT pin bit 5 C2POL: Comparator Output Polarity bit(2) 1 = Output of comparator not inverted 0 = Output of comparator inverted bit 4 C2PREF2: Comparator Positive Reference Select bit(2) 1 = C1IN+ pin 0 = C2IN- pin bit 3 C2ON: Comparator Enable bit 1 = Comparator is on 0 = Comparator is off bit 2 C2NREF: Comparator Negative Reference Select bit(2) 1 = C2IN- pin 0 = CVREF bit 1 C2PREF1: Comparator Positive Reference Select bit(2) 1 = C2IN+ pin 0 = C2PREF2 controls analog input selection bit 0 C2WU: Comparator Wake-up on Change Enable bit(2) 1 = Wake-up on Comparator change is disabled 0 = Wake-up on Comparator change is enabled. x = Bit is unknown Note 1: Overrides TOCS bit for TRIS control of RC4. 2: When comparator is turned on, these control bits assert themselves. Otherwise, the other registers have precedence. DS41326D-page 64 2010 Microchip Technology Inc. PIC16F526 FIGURE 10-1: COMPARATORS BLOCK DIAGRAM RB2/C1OUT C1PREF C1IN+ 1 C1IN- 0 C1OUT (Register) 1 VREF (0.6V) C1OUTEN + - 0 C1NREF C1ON C1POL 0 T0CKI 1 T0CKI Pin C1T0CS Q D S RC4/C2OUT C2PREF1 C2IN+ 1 0 1 READ CM1CON0 C2OUTEN + C2OUT (Register) 0 - C2PREF2 C2INC2ON C2POL 1 0 CVREF C2NREF Q D C1WU S CWUF READ CM2CON0 C2WU 2010 Microchip Technology Inc. DS41326D-page 65 PIC16F526 10.1 Comparator Operation A single comparator is shown in Figure 10-2 along with the relationship between the analog input levels and the digital output. When the analog input at VIN+ is less than the analog input VIN-, the output of the comparator is a digital low level. The shaded area of the output of the comparator in Figure 10-2 represent the uncertainty due to input offsets and response time. See Table 14-2 for Common Mode Voltage. FIGURE 10-2: SINGLE COMPARATOR VIN+ + VIN- – Result Note: 10.5 Analog levels on any pin that is defined as a digital input may cause the input buffer to consume more current than is specified. Comparator Wake-up Flag The Comparator Wake-up Flag is set whenever all of the following conditions are met: • C1WU = 0 (CM1CON0<0>) or C2WU = 0 (CM2CON0<0>) • CM1CON0 or CM2CON0 has been read to latch the last known state of the C1OUT and C2OUT bit (MOVF CM1CON0, W) • Device is in Sleep • The output of a comparator has changed state The wake-up flag may be cleared in software or by another device Reset. 10.6 VIN- Comparator Operation During Sleep VIN+ When the comparator is enabled it is active. To minimize power consumption while in Sleep mode, turn off the comparator before entering Sleep. Result 10.7 10.2 Comparator Reference An internal reference signal may be used depending on the comparator operating mode. The analog signal that is present at VIN- is compared to the signal at VIN+, and the digital output of the comparator is adjusted accordingly (Figure 10-2). Please see Section 11.0 “Comparator Voltage Reference Module” for internal reference specifications. 10.3 Comparator Response Time Response time is the minimum time after selecting a new reference voltage or input source before the comparator output is to have a valid level. If the comparator inputs are changed, a delay must be used to allow the comparator to settle to its new state. Please see Table 14-3 for comparator response time specifications. 10.4 Effects of Reset A Power-on Reset (POR) forces the CM2CON0 register to its Reset state. This forces the Comparator input pins to analog Reset mode. Device current is minimized when analog inputs are present at Reset time. 10.8 Analog Input Connection Considerations A simplified circuit for an analog input is shown in Figure 10-3. Since the analog pins are connected to a digital output, they have reverse biased diodes to VDD and VSS. The analog input, therefore, must be between VSS and VDD. If the input voltage deviates from this range by more than 0.6V in either direction, one of the diodes is forward biased and a latch-up may occur. A maximum source impedance of 10 k is recommended for the analog sources. Any external component connected to an analog input pin, such as a capacitor or a Zener diode, should have very little leakage current. Comparator Output The comparator output is read through the CM1CON0 or CM2CON0 register. This bit is read-only. The comparator output may also be used externally, see Figure 10-1. DS41326D-page 66 2010 Microchip Technology Inc. PIC16F526 FIGURE 10-3: ANALOG INPUT MODE VDD VT = 0.6V RS < 10 K AIN CPIN 5 pF VA VT = 0.6V RIC ILEAKAGE ±500 nA VSS Legend: TABLE 10-1: CPIN VT ILEAKAGE RIC RS VA = = = = = = Input Capacitance Threshold Voltage Leakage Current at the Pin Interconnect Resistance Source Impedance Analog Voltage REGISTERS ASSOCIATED WITH COMPARATOR MODULE Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR Value on All Other Resets STATUS RBWUF CWUF PA0 TO PD Z DC C 0001 1xxx qq0q quuu CM1CON0 C1OUT C1OUTEN C1POL C1T0CS C1ON C1NREF C1PREF C1WU q111 1111 quuu uuuu CM2CON0 C2OUT C2OUTEN C2POL C2PREF2 C2ON C2NREF C2PREF1 C2WU q111 1111 quuu uuuu — — --11 1111 --11 1111 Name TRIS Legend: I/O Control Register (PORTB, PORTC) x = Unknown, u = Unchanged, – = Unimplemented, read as ‘0’, q = Depends on condition. 2010 Microchip Technology Inc. DS41326D-page 67 PIC16F526 NOTES: DS41326D-page 68 2010 Microchip Technology Inc. PIC16F526 11.0 COMPARATOR VOLTAGE REFERENCE MODULE 11.2 The Comparator Voltage Reference module also allows the selection of an internally generated voltage reference for one of the C2 comparator inputs. The VRCON register (Register 11-1) controls the Voltage Reference module shown in Figure 11-1. 11.1 Configuring The Voltage Reference The voltage reference can output 32 voltage levels; 16 in a high range and 16 in a low range. Equation 11-1 determines the output voltages: EQUATION 11-1: Voltage Reference Accuracy/Error The full range of VSS to VDD cannot be realized due to construction of the module. The transistors on the top and bottom of the resistor ladder network (Figure 11-1) keep CVREF from approaching VSS or VDD. The exception is when the module is disabled by clearing the VREN bit of the VRCON register. When disabled, the reference voltage is VSS when VR<3:0> is ‘0000’ and the VRR bit of the VRCON register is set. This allows the comparator to detect a zero-crossing and not consume the CVREF module current. The voltage reference is VDD derived and, therefore, the CVREF output changes with fluctuations in VDD. The tested absolute accuracy of the comparator voltage reference can be found in Section 14.0 “Electrical Characteristics”. VRR = 1 (low range): CVREF = (VR<3:0>/24) x VDD VRR = 0 (high range): CVREF = (VDD/4) + (VR<3:0> x VDD/32) REGISTER 11-1: VRCON: VOLTAGE REFERENCE CONTROL REGISTER R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 VREN VROE VRR — VR3 VR2 VR1 VR0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 VREN: CVREF Enable bit 1 = CVREF is powered on 0 = CVREF is powered down, no current is drawn bit 6 VROE: CVREF Output Enable bit(1) 1 = CVREF output is enabled 0 = CVREF output is disabled bit 5 VRR: CVREF Range Selection bit 1 = Low range 0 = High range bit 4 Unimplemented: Read as ‘0’ bit 3-0 VR<3:0> CVREF Value Selection bit When VRR = 1: CVREF= (VR<3:0>/24)*VDD When VRR = 0: CVREF= VDD/4+(VR<3:0>/32)*VDD x = Bit is unknown Note 1: When this bit is set, the TRIS for the CVREF pin is overridden and the analog voltage is placed on the CVREF pin. 2010 Microchip Technology Inc. DS41326D-page 69 PIC16F526 FIGURE 11-1: COMPARATOR VOLTAGE REFERENCE BLOCK DIAGRAM 16 Stages 8R R R R R VDD 8R VRR 16-1 Analog MUX VREN CVREF to Comparator 2 Input VR<3:0> RC2/CVREF VREN VR<3:0> = 0000 VRR VROE TABLE 11-1: Name VRCON REGISTERS ASSOCIATED WITH COMPARATOR VOLTAGE REFERENCE Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR Value on all other Resets uuu- uuuu VREN VROE VRR — VR3 VR2 VR1 VR0 001- 1111 CM1CON0 C1OUT C1OUTEN C1POL C1T0CS C1ON C1NREF C1PREF C1WU q111 1111 quuu uuuu CM2CON0 C2OUT C2OUTEN C2POL C2PREF2 C2ON C2NREF C2PREF1 C2WU q111 1111 quuu uuuu Legend: x = unknown, u = unchanged, – = unimplemented, read as ‘0’, q = value depends on condition. DS41326D-page 70 2010 Microchip Technology Inc. PIC16F526 12.0 INSTRUCTION SET SUMMARY The PIC16 instruction set is highly orthogonal and is comprised of three basic categories. • Byte-oriented operations • Bit-oriented operations • Literal and control operations Each PIC16 instruction is a 12-bit word divided into an opcode, which specifies the instruction type, and one or more operands which further specify the operation of the instruction. The formats for each of the categories is presented in Figure 12-1, while the various opcode fields are summarized in Table 12-1. For byte-oriented instructions, ‘f’ represents a file register designator and ‘d’ represents a destination designator. The file register designator specifies which file register is to be used by the instruction. The destination designator specifies where the result of the operation is to be placed. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed in the file register specified in the instruction. For bit-oriented instructions, ‘b’ represents a bit field designator which selects the number of the bit affected by the operation, while ‘f’ represents the number of the file in which the bit is located. For literal and control operations, ‘k’ represents an 8 or 9-bit constant or literal value. TABLE 12-1: Description Register file address (0x00 to 0x7F) W Working register (accumulator) b Bit address within an 8-bit file register k Literal field, constant data or label x Don’t care location (= 0 or 1) The assembler will generate code with x = 0. It is the recommended form of use for compatibility with all Microchip software tools. d Destination select; d = 0 (store result in W) d = 1 (store result in file register ‘f’) Default is d = 1 label Label name TOS Top-of-Stack PC WDT TO Power-down bit [ ] Options ( ) Contents italics FIGURE 12-1: GENERAL FORMAT FOR INSTRUCTIONS Byte-oriented file register operations 11 6 OPCODE 5 d 4 0 f (FILE #) d = 0 for destination W d = 1 for destination f f = 5-bit file register address Bit-oriented file register operations 11 OPCODE 8 7 5 4 b (BIT #) 0 f (FILE #) b = 3-bit bit address f = 5-bit file register address Literal and control operations (except GOTO) 11 8 7 OPCODE 0 k (literal) k = 8-bit immediate value Literal and control operations – GOTO instruction 11 9 8 OPCODE 0 k (literal) k = 9-bit immediate value Watchdog Timer counter Destination, either the W register or the specified register file location Œ where ‘h’ signifies a hexadecimal digit. Time-out bit PD < > 0xhhh Program Counter dest Æ Figure 12-1 shows the three general formats that the instructions can have. All examples in the figure use the following format to represent a hexadecimal number: OPCODE FIELD DESCRIPTIONS Field f All instructions are executed within a single instruction cycle, unless a conditional test is true or the program counter is changed as a result of an instruction. In this case, the execution takes two instruction cycles. One instruction cycle consists of four oscillator periods. Thus, for an oscillator frequency of 4 MHz, the normal instruction execution time is 1 s. If a conditional test is true or the program counter is changed as a result of an instruction, the instruction execution time is 2 s. Assigned to Register bit field In the set of User defined term (font is courier) 2010 Microchip Technology Inc. DS41326D-page 71 PIC16F526 TABLE 12-2: Mnemonic, Operands ADDWF ANDWF CLRF CLRW COMF DECF DECFSZ INCF INCFSZ IORWF MOVF MOVWF NOP RLF RRF SUBWF SWAPF XORWF INSTRUCTION SET SUMMARY Description Cycles 12-Bit Opcode MSb LSb Status Notes Affected f, d f, d f — f, d f, d f, d f, d f, d f, d f, d f — f, d f, d f, d f, d f, d 0001 11df ffff C, DC, Z 1, 2, 4 Add W and f 1 0001 01df ffff AND W with f 1 Z 2, 4 0000 011f ffff Clear f 1 Z 4 0000 0100 0000 Clear W 1 Z 0010 01df ffff Complement f 1 Z 0000 11df ffff Decrement f 1 Z 2, 4 0010 11df ffff Decrement f, Skip if 0 1(2) None 2, 4 1 0010 10df ffff Increment f Z 2, 4 1(2) 0011 11df ffff Increment f, Skip if 0 None 2, 4 1 0001 00df ffff Inclusive OR W with f Z 2, 4 1 0010 00df ffff Move f Z 2, 4 1 0000 001f ffff Move W to f None 1, 4 1 0000 0000 0000 No Operation None 1 0011 01df ffff Rotate left f through Carry C 2, 4 1 0011 00df ffff Rotate right f through Carry C 2, 4 1 0000 10df ffff C, DC, Z 1, 2, 4 Subtract W from f 1 0011 10df ffff Swap f None 2, 4 1 0001 10df ffff Exclusive OR W with f Z 2, 4 BIT-ORIENTED FILE REGISTER OPERATIONS 0100 bbbf ffff None 2, 4 1 Bit Clear f BCF f, b 0101 bbbf ffff None 2, 4 1 Bit Set f BSF f, b 0110 bbbf ffff None Bit Test f, Skip if Clear 1(2) BTFSC f, b 1(2) 0111 bbbf ffff None f, b Bit Test f, Skip if Set BTFSS LITERAL AND CONTROL OPERATIONS ANDLW k AND literal with W 1 1110 kkkk kkkk Z CALL 1 k Call Subroutine 2 1001 kkkk kkkk None CLRWDT — Clear Watchdog Timer 1 0000 0000 0100 TO, PD None GOTO k Unconditional branch 2 101k kkkk kkkk Z IORLW k Inclusive OR literal with W 1 1101 kkkk kkkk None MOVLW k Move literal to W 1 1100 kkkk kkkk None OPTION — Load OPTION register 1 0000 0000 0010 None RETLW k Return, place literal in W 2 1000 kkkk kkkk SLEEP — Go into Standby mode 1 0000 0000 0011 TO, PD None 3 TRIS f Load TRIS register 1 0000 0000 0fff Z XORLW k Exclusive OR literal to W 1 1111 kkkk kkkk Note 1: The 9th bit of the program counter will be forced to a ‘0’ by any instruction that writes to the PC except for GOTO. See Section 4.6 “Program Counter”. 2: When an I/O register is modified as a function of itself (e.g. MOVF PORTB, 1), the value used will be that value present on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input and is driven low by an external device, the data will be written back with a ‘0’. 3: The instruction TRIS f, where f = 6, causes the contents of the W register to be written to the tri-state latches of PORTB. A ‘1’ forces the pin to a high-impedance state and disables the output buffers. 4: If this instruction is executed on the TMR0 register (and, where applicable, d = 1), the prescaler will be cleared (if assigned to TMR0). DS41326D-page 72 2010 Microchip Technology Inc. PIC16F526 ADDWF Add W and f BCF f,d Bit Clear f Syntax: [ label ] ADDWF Syntax: [ label ] BCF Operands: 0 f 31 d 01 Operands: 0 f 31 0b7 Operation: (W) + (f) (dest) Operation: 0 (f<b>) Status Affected: C, DC, Z Status Affected: None Description: Description: Bit ‘b’ in register ‘f’ is cleared. BSF Bit Set f Syntax: [ label ] BSF Operands: 0 f 31 0b7 Status Affected: Z Operation: 1 (f<b>) Description: The contents of the W register are AND’ed with the eight-bit literal ‘k’. The result is placed in the W register. Status Affected: None Description: Bit ‘b’ in register ‘f’ is set. ANDWF AND W with f BTFSC Bit Test f, Skip if Clear Syntax: [ label ] ANDWF Add the contents of the W register and register ‘f’. If ‘d’ is’0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. ANDLW AND literal with W Syntax: [ label ] ANDLW k Operands: 0 k 255 Operation: (W).AND. (k) (W) f,d f,b f,b Syntax: [ label ] BTFSC f,b 0 f 31 0b7 Operands: 0 f 31 d [0,1] Operands: Operation: (W) .AND. (f) (dest) Operation: skip if (f<b>) = 0 Status Affected: Z Status Affected: None Description: Description: If bit ‘b’ in register ‘f’ is ‘0’, then the next instruction is skipped. If bit ‘b’ is ‘0’, then the next instruction fetched during the current instruction execution is discarded, and a NOP is executed instead, making this a two-cycle instruction. The contents of the W register are AND’ed with register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. 2010 Microchip Technology Inc. DS41326D-page 73 PIC16F526 BTFSS Bit Test f, Skip if Set CLRW Syntax: [ label ] BTFSS f,b Syntax: [ label ] CLRW 0 f 31 0b<7 Operands: None Operation: 00h (W); 1Z Operands: Clear W Operation: skip if (f<b>) = 1 Status Affected: None Status Affected: Z Description: If bit ‘b’ in register ‘f’ is ‘1’, then the next instruction is skipped. If bit ‘b’ is ‘1’, then the next instruction fetched during the current instruction execution, is discarded and a NOP is executed instead, making this a two-cycle instruction. Description: The W register is cleared. Zero bit (Z) is set. CALL Subroutine Call CLRWDT Clear Watchdog Timer Syntax: [ label ] CALL k Syntax: [ label ] CLRWDT Operands: 0 k 255 Operands: None Operation: (PC) + 1 Top-of-Stack; k PC<7:0>; (STATUS<6:5>) PC<10:9>; 0 PC<8> Operation: 00h WDT; 0 WDT prescaler (if assigned); 1 TO; 1 PD Status Affected: None Status Affected: TO, PD Description: Subroutine call. First, return address (PC + 1) is PUSHed onto the stack. The eight-bit immediate address is loaded into PC bits <7:0>. The upper bits PC<10:9> are loaded from STATUS<6:5>, PC<8> is cleared. CALL is a two-cycle instruction. Description: The CLRWDT instruction resets the WDT. It also resets the prescaler, if the prescaler is assigned to the WDT and not Timer0. Status bits TO and PD are set. CLRF Clear f COMF Complement f Syntax: [ label ] CLRF Syntax: [ label ] COMF Operands: 0 f 31 Operands: Operation: 00h (f); 1Z 0 f 31 d [0,1] Operation: (f) (dest) Status Affected: Z Status Affected: Z Description: The contents of register ‘f’ are cleared and the Z bit is set. Description: The contents of register ‘f’ are complemented. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. DS41326D-page 74 f f,d 2010 Microchip Technology Inc. PIC16F526 DECF Decrement f INCF Syntax: [ label ] DECF f,d Syntax: [ label ] Operands: 0 f 31 d [0,1] Operands: 0 f 31 d [0,1] Operation: (f) – 1 (dest) Operation: (f) + 1 (dest) Status Affected: Z Status Affected: Z Description: Decrement register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. Description: The contents of register ‘f’ are incremented. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. DECFSZ Decrement f, Skip if 0 INCFSZ Increment f, Skip if 0 Syntax: [ label ] DECFSZ f,d Syntax: [ label ] Operands: 0 f 31 d [0,1] Operands: 0 f 31 d [0,1] Operation: (f) – 1 d; Operation: (f) + 1 (dest), skip if result = 0 Status Affected: None Status Affected: None Description: The contents of register ‘f’ are decremented. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. If the result is ‘0’, the next instruction, which is already fetched, is discarded and a NOP is executed instead making it a two-cycle instruction. Description: The contents of register ‘f’ are incremented. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. If the result is ‘0’, then the next instruction, which is already fetched, is discarded and a NOP is executed instead making it a two-cycle instruction. GOTO Unconditional Branch IORLW Inclusive OR literal with W Syntax: [ label ] Syntax: [ label ] Operands: 0 k 511 Operands: 0 k 255 Operation: k PC<8:0>; STATUS<6:5> PC<10:9> Operation: (W) .OR. (k) (W) Status Affected: Z Status Affected: None Description: Description: GOTO is an unconditional branch. The 9-bit immediate value is loaded into PC bits <8:0>. The upper bits of PC are loaded from STATUS<6:5>. GOTO is a twocycle instruction. The contents of the W register are OR’ed with the eight-bit literal ‘k’. The result is placed in the W register. skip if result = 0 GOTO k 2010 Microchip Technology Inc. Increment f INCF f,d INCFSZ f,d IORLW k DS41326D-page 75 PIC16F526 IORWF Inclusive OR W with f MOVWF Syntax: [ label ] Syntax: [ label ] Operands: 0 f 31 d [0,1] Operands: 0 f 31 (W).OR. (f) (dest) Operation: (W) (f) Operation: Status Affected: None Status Affected: Z Description: Description: Inclusive OR the W register with register ‘f’. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. Move data from the W register to register ‘f’. MOVF Move f NOP No Operation Syntax: [ label ] Syntax: [ label ] Operands: 0 f 31 d [0,1] Operands: None Operation: No operation Status Affected: None Description: No operation. IORWF f,d MOVF f,d Move W to f MOVWF f NOP Operation: (f) (dest) Status Affected: Z Description: The contents of register ‘f’ are moved to destination ‘d’. If ‘d’ is ‘0’, destination is the W register. If ‘d’ is ‘1’, the destination is file register ‘f’. ‘d’ = 1 is useful as a test of a file register, since status flag Z is affected. MOVLW Move Literal to W OPTION Load OPTION Register Syntax: [ label ] Syntax: [ label ] Operands: 0 k 255 Operands: None Operation: k (W) Operation: (W) OPTION Status Affected: None Status Affected: None Description: The eight-bit literal ‘k’ is loaded into the W register. The “don’t cares” will assembled as ‘0’s. Description: The content of the W register is loaded into the OPTION register. DS41326D-page 76 MOVLW k OPTION 2010 Microchip Technology Inc. PIC16F526 RETLW Return with Literal in W SLEEP Enter SLEEP Mode Syntax: [ label ] Syntax: [label ] Operands: 0 k 255 Operands: None Operation: k (W); TOS PC Operation: 00h WDT; 0 WDT prescaler; 1 TO; 0 PD RETLW k SLEEP Status Affected: None Description: The W register is loaded with the eight-bit literal ‘k’. The program counter is loaded from the top of the stack (the return address). This is a two-cycle instruction. Status Affected: TO, PD, RBWUF Description: Time-out Status bit (TO) is set. The Power-down Status bit (PD) is cleared. RBWUF is unaffected. The WDT and its prescaler are cleared. The processor is put into Sleep mode with the oscillator stopped. See Section 8.9 “Power-down Mode (Sleep)” on Sleep for more details. RLF Rotate Left f through Carry SUBWF Subtract W from f Syntax: [ label ] Syntax: [label ] Operands: 0 f 31 d [0,1] Operands: 0 f 31 d [0,1] Operation: See description below Operation: (f) – (W) dest) Status Affected: C Status Affected: C, DC, Z Description: The contents of register ‘f’ are rotated one bit to the left through the Carry flag. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. Description: Subtract (2’s complement method) the W register from register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. RLF f,d SUBWF f,d register ‘f’ C RRF Rotate Right f through Carry SWAPF Swap Nibbles in f Syntax: [ label ] Syntax: [ label ] SWAPF f,d Operands: 0 f 31 d [0,1] Operands: 0 f 31 d [0,1] Operation: See description below Operation: Status Affected: C (f<3:0>) (dest<7:4>); (f<7:4>) (dest<3:0>) Description: The contents of register ‘f’ are rotated one bit to the right through the Carry flag. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. Status Affected: None Description: The upper and lower nibbles of register ‘f’ are exchanged. If ‘d’ is ‘0’, the result is placed in W register. If ‘d’ is ‘1’, the result is placed in register ‘f’. RRF f,d C 2010 Microchip Technology Inc. register ‘f’ DS41326D-page 77 PIC16F526 TRIS Load TRIS Register XORWF Syntax: [ label ] TRIS Syntax: [ label ] XORWF Operands: f=6 Operands: Operation: (W) TRIS register f 0 f 31 d [0,1] f Exclusive OR W with f f,d Status Affected: None Operation: (W) .XOR. (f) dest) Description: TRIS register ‘f’ (f = 6 or 7) is loaded with the contents of the W register Status Affected: Z Description: Exclusive OR the contents of the W register with register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. XORLW Exclusive OR literal with W Syntax: [label ] Operands: 0 k 255 Operation: (W) .XOR. k W) Status Affected: Z Description: The contents of the W register are XOR’ed with the eight-bit literal ‘k’. The result is placed in the W register. DS41326D-page 78 XORLW k 2010 Microchip Technology Inc. PIC16F526 13.0 DEVELOPMENT SUPPORT The PIC® microcontrollers and dsPIC® digital signal controllers are supported with a full range of software and hardware development tools: • Integrated Development Environment - MPLAB® IDE Software • Compilers/Assemblers/Linkers - MPLAB C Compiler for Various Device Families - HI-TECH C for Various Device Families - MPASMTM Assembler - MPLINKTM Object Linker/ MPLIBTM Object Librarian - MPLAB Assembler/Linker/Librarian for Various Device Families • Simulators - MPLAB SIM Software Simulator • Emulators - MPLAB REAL ICE™ In-Circuit Emulator • In-Circuit Debuggers - MPLAB ICD 3 - PICkit™ 3 Debug Express • Device Programmers - PICkit™ 2 Programmer - MPLAB PM3 Device Programmer • Low-Cost Demonstration/Development Boards, Evaluation Kits, and Starter Kits 13.1 MPLAB Integrated Development Environment Software The MPLAB IDE software brings an ease of software development previously unseen in the 8/16/32-bit microcontroller market. The MPLAB IDE is a Windows® operating system-based application that contains: • A single graphical interface to all debugging tools - Simulator - Programmer (sold separately) - In-Circuit Emulator (sold separately) - In-Circuit Debugger (sold separately) • A full-featured editor with color-coded context • A multiple project manager • Customizable data windows with direct edit of contents • High-level source code debugging • Mouse over variable inspection • Drag and drop variables from source to watch windows • Extensive on-line help • Integration of select third party tools, such as IAR C Compilers The MPLAB IDE allows you to: • Edit your source files (either C or assembly) • One-touch compile or assemble, and download to emulator and simulator tools (automatically updates all project information) • Debug using: - Source files (C or assembly) - Mixed C and assembly - Machine code MPLAB IDE supports multiple debugging tools in a single development paradigm, from the cost-effective simulators, through low-cost in-circuit debuggers, to full-featured emulators. This eliminates the learning curve when upgrading to tools with increased flexibility and power. 2010 Microchip Technology Inc. DS41326D-page 79 PIC16F526 13.2 MPLAB C Compilers for Various Device Families The MPLAB C Compiler code development systems are complete ANSI C compilers for Microchip’s PIC18, PIC24 and PIC32 families of microcontrollers and the dsPIC30 and dsPIC33 families of digital signal controllers. These compilers provide powerful integration capabilities, superior code optimization and ease of use. For easy source level debugging, the compilers provide symbol information that is optimized to the MPLAB IDE debugger. 13.3 HI-TECH C for Various Device Families The HI-TECH C Compiler code development systems are complete ANSI C compilers for Microchip’s PIC family of microcontrollers and the dsPIC family of digital signal controllers. These compilers provide powerful integration capabilities, omniscient code generation and ease of use. For easy source level debugging, the compilers provide symbol information that is optimized to the MPLAB IDE debugger. The compilers include a macro assembler, linker, preprocessor, and one-step driver, and can run on multiple platforms. 13.4 MPASM Assembler The MPASM Assembler is a full-featured, universal macro assembler for PIC10/12/16/18 MCUs. The MPASM Assembler generates relocatable object files for the MPLINK Object Linker, Intel® standard HEX files, MAP files to detail memory usage and symbol reference, absolute LST files that contain source lines and generated machine code and COFF files for debugging. The MPASM Assembler features include: 13.5 MPLINK Object Linker/ MPLIB Object Librarian The MPLINK Object Linker combines relocatable objects created by the MPASM Assembler and the MPLAB C18 C Compiler. It can link relocatable objects from precompiled libraries, using directives from a linker script. The MPLIB Object Librarian manages the creation and modification of library files of precompiled code. When a routine from a library is called from a source file, only the modules that contain that routine will be linked in with the application. This allows large libraries to be used efficiently in many different applications. The object linker/library features include: • Efficient linking of single libraries instead of many smaller files • Enhanced code maintainability by grouping related modules together • Flexible creation of libraries with easy module listing, replacement, deletion and extraction 13.6 MPLAB Assembler, Linker and Librarian for Various Device Families MPLAB Assembler produces relocatable machine code from symbolic assembly language for PIC24, PIC32 and dsPIC devices. MPLAB C Compiler uses the assembler to produce its object file. The assembler generates relocatable object files that can then be archived or linked with other relocatable object files and archives to create an executable file. Notable features of the assembler include: • • • • • • Support for the entire device instruction set Support for fixed-point and floating-point data Command line interface Rich directive set Flexible macro language MPLAB IDE compatibility • Integration into MPLAB IDE projects • User-defined macros to streamline assembly code • Conditional assembly for multi-purpose source files • Directives that allow complete control over the assembly process DS41326D-page 80 2010 Microchip Technology Inc. PIC16F526 13.7 MPLAB SIM Software Simulator The MPLAB SIM Software Simulator allows code development in a PC-hosted environment by simulating the PIC MCUs and dsPIC® DSCs on an instruction level. On any given instruction, the data areas can be examined or modified and stimuli can be applied from a comprehensive stimulus controller. Registers can be logged to files for further run-time analysis. The trace buffer and logic analyzer display extend the power of the simulator to record and track program execution, actions on I/O, most peripherals and internal registers. The MPLAB SIM Software Simulator fully supports symbolic debugging using the MPLAB C Compilers, and the MPASM and MPLAB Assemblers. The software simulator offers the flexibility to develop and debug code outside of the hardware laboratory environment, making it an excellent, economical software development tool. 13.8 MPLAB REAL ICE In-Circuit Emulator System MPLAB REAL ICE In-Circuit Emulator System is Microchip’s next generation high-speed emulator for Microchip Flash DSC and MCU devices. It debugs and programs PIC® Flash MCUs and dsPIC® Flash DSCs with the easy-to-use, powerful graphical user interface of the MPLAB Integrated Development Environment (IDE), included with each kit. The emulator is connected to the design engineer’s PC using a high-speed USB 2.0 interface and is connected to the target with either a connector compatible with incircuit debugger systems (RJ11) or with the new highspeed, noise tolerant, Low-Voltage Differential Signal (LVDS) interconnection (CAT5). The emulator is field upgradable through future firmware downloads in MPLAB IDE. In upcoming releases of MPLAB IDE, new devices will be supported, and new features will be added. MPLAB REAL ICE offers significant advantages over competitive emulators including low-cost, full-speed emulation, run-time variable watches, trace analysis, complex breakpoints, a ruggedized probe interface and long (up to three meters) interconnection cables. 2010 Microchip Technology Inc. 13.9 MPLAB ICD 3 In-Circuit Debugger System MPLAB ICD 3 In-Circuit Debugger System is Microchip's most cost effective high-speed hardware debugger/programmer for Microchip Flash Digital Signal Controller (DSC) and microcontroller (MCU) devices. It debugs and programs PIC® Flash microcontrollers and dsPIC® DSCs with the powerful, yet easyto-use graphical user interface of MPLAB Integrated Development Environment (IDE). The MPLAB ICD 3 In-Circuit Debugger probe is connected to the design engineer's PC using a high-speed USB 2.0 interface and is connected to the target with a connector compatible with the MPLAB ICD 2 or MPLAB REAL ICE systems (RJ-11). MPLAB ICD 3 supports all MPLAB ICD 2 headers. 13.10 PICkit 3 In-Circuit Debugger/ Programmer and PICkit 3 Debug Express The MPLAB PICkit 3 allows debugging and programming of PIC® and dsPIC® Flash microcontrollers at a most affordable price point using the powerful graphical user interface of the MPLAB Integrated Development Environment (IDE). The MPLAB PICkit 3 is connected to the design engineer's PC using a full speed USB interface and can be connected to the target via an Microchip debug (RJ-11) connector (compatible with MPLAB ICD 3 and MPLAB REAL ICE). The connector uses two device I/O pins and the reset line to implement in-circuit debugging and In-Circuit Serial Programming™. The PICkit 3 Debug Express include the PICkit 3, demo board and microcontroller, hookup cables and CDROM with user’s guide, lessons, tutorial, compiler and MPLAB IDE software. DS41326D-page 81 PIC16F526 13.11 PICkit 2 Development Programmer/Debugger and PICkit 2 Debug Express 13.13 Demonstration/Development Boards, Evaluation Kits, and Starter Kits The PICkit™ 2 Development Programmer/Debugger is a low-cost development tool with an easy to use interface for programming and debugging Microchip’s Flash families of microcontrollers. The full featured Windows® programming interface supports baseline (PIC10F, PIC12F5xx, PIC16F5xx), midrange (PIC12F6xx, PIC16F), PIC18F, PIC24, dsPIC30, dsPIC33, and PIC32 families of 8-bit, 16-bit, and 32-bit microcontrollers, and many Microchip Serial EEPROM products. With Microchip’s powerful MPLAB Integrated Development Environment (IDE) the PICkit™ 2 enables in-circuit debugging on most PIC® microcontrollers. In-Circuit-Debugging runs, halts and single steps the program while the PIC microcontroller is embedded in the application. When halted at a breakpoint, the file registers can be examined and modified. A wide variety of demonstration, development and evaluation boards for various PIC MCUs and dsPIC DSCs allows quick application development on fully functional systems. Most boards include prototyping areas for adding custom circuitry and provide application firmware and source code for examination and modification. The PICkit 2 Debug Express include the PICkit 2, demo board and microcontroller, hookup cables and CDROM with user’s guide, lessons, tutorial, compiler and MPLAB IDE software. 13.12 MPLAB PM3 Device Programmer The MPLAB PM3 Device Programmer is a universal, CE compliant device programmer with programmable voltage verification at VDDMIN and VDDMAX for maximum reliability. It features a large LCD display (128 x 64) for menus and error messages and a modular, detachable socket assembly to support various package types. The ICSP™ cable assembly is included as a standard item. In Stand-Alone mode, the MPLAB PM3 Device Programmer can read, verify and program PIC devices without a PC connection. It can also set code protection in this mode. The MPLAB PM3 connects to the host PC via an RS-232 or USB cable. The MPLAB PM3 has high-speed communications and optimized algorithms for quick programming of large memory devices and incorporates an MMC card for file storage and data applications. DS41326D-page 82 The boards support a variety of features, including LEDs, temperature sensors, switches, speakers, RS-232 interfaces, LCD displays, potentiometers and additional EEPROM memory. The demonstration and development boards can be used in teaching environments, for prototyping custom circuits and for learning about various microcontroller applications. In addition to the PICDEM™ and dsPICDEM™ demonstration/development board series of circuits, Microchip has a line of evaluation kits and demonstration software for analog filter design, KEELOQ® security ICs, CAN, IrDA®, PowerSmart battery management, SEEVAL® evaluation system, Sigma-Delta ADC, flow rate sensing, plus many more. Also available are starter kits that contain everything needed to experience the specified device. This usually includes a single application and debug capability, all on one board. Check the Microchip web page (www.microchip.com) for the complete list of demonstration, development and evaluation kits. 2010 Microchip Technology Inc. PIC16F526 14.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings(†) Ambient temperature under bias.......................................................................................................... -40°C to +125°C Storage temperature ............................................................................................................................ -65°C to +150°C Voltage on VDD with respect to VSS ............................................................................................................... 0 to +6.5V Voltage on MCLR with respect to VSS..........................................................................................................0 to +13.5V Voltage on all other pins with respect to VSS ............................................................................... -0.3V to (VDD + 0.3V) Total power dissipation(1) .................................................................................................................................. 700 mW Max. current out of VSS pin ................................................................................................................................ 200 mA Max. current into VDD pin ................................................................................................................................... 150 mA Input clamp current, IIK (VI < 0 or VI > VDD)20 mA Output clamp current, IOK (VO < 0 or VO > VDD) 20 mA Max. output current sunk by any I/O pin .............................................................................................................. 25 mA Max. output current sourced by any I/O pin ......................................................................................................... 25 mA Max. output current sourced by I/O port .............................................................................................................. 75 mA Max. output current sunk by I/O port ................................................................................................................... 75 mA Note 1: Power dissipation is calculated as follows: PDIS = VDD x {IDD – IOH} + {(VDD – VOH) x IOH} + (VOL x IOL) †NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. 2010 Microchip Technology Inc. DS41326D-page 83 PIC16F526 PIC16F526 VOLTAGE-FREQUENCY GRAPH, -40C TA +125C FIGURE 14-1: 6.0 5.5 5.0 VDD (Volts) 4.5 4.0 3.5 3.0 INTOSC OR EC MODE ONLY 2.5 2.0 0 4 20 10 25 Frequency (MHz) FIGURE 14-2: MAXIMUM OSCILLATOR FREQUENCY TABLE Oscillator Mode LP XT XTRC INTOSC EC HS 0 200 kHz 4 MHz 8 MHz 20 MHz Frequency DS41326D-page 84 2010 Microchip Technology Inc. PIC16F526 14.1 DC Characteristics: PIC16F526 (Industrial) Standard Operating Conditions (unless otherwise specified) Operating Temperature -40C TA +85C (industrial) DC Characteristics Param No. Sym. Characteristic Min. Typ.(1) Max. Units Conditions D001 VDD Supply Voltage 2.0 5.5 V See Figure 14-1 D002 VDR RAM Data Retention Voltage(2) — 1.5* — V Device in Sleep mode D003 VPOR VDD Start Voltage to ensure Power-on Reset — Vss — V See Section 8.4 “Power-on Reset (POR)” for details D004 SVDD VDD Rise Rate to ensure Power-on Reset 0.05* — — V/ms See Section 8.4 “Power-on Reset (POR)” for details D005 IDDP Supply Current During Prog/ Erase — 250* — A D010 IDD Supply Current(3, 4, 6) — — 175 400 250 700 A A FOSC = 4 MHz, VDD = 2.0V FOSC = 4 MHz, VDD = 5.0V — — 250 0.75 400 1.2 A mA FOSC = 8 MHz, VDD = 2.0V FOSC = 8 MHz, VDD = 5.0V — 1.4 2.2 mA FOSC = 20 MHz, VDD = 5.0V — — 11 38 22 55 A A FOSC = 32 kHz, VDD = 2.0V FOSC = 32 kHz, VDD = 5.0V D020 IPD Power-down Current(5) — — 0.1 0.35 1.2 2.2 A A VDD = 2.0V VDD = 5.0V D022 IWDT WDT Current(5) — — 1.0 7.0 3.0 16.0 A A VDD = 2.0V VDD = 5.0V D023 ICMP Comparator Current(5) — — 15 60 26 76 A A VDD = 2.0V (per comparator) VDD = 5.0V (per comparator) D022 ICVREF CVREF Current(5) — — 30 75 75 135 A A VDD = 2.0V (high range) VDD = 5.0V (high range) D023 IFVR — 100 120 A — 175 205 A VDD = 2.0V (reference and 1 comparator enabled) VDD = 5.0V (reference and 1 comparator enabled) D024 IAD* Internal 0.6V Fixed Voltage Reference Current(5) A/D Conversion Current — 120 150 A 2.0V — 200 250 A 5.0V * These parameters are characterized but not tested. Note 1: Data in the Typical (“Typ”) column is based on characterization results at 25C. This data is for design guidance only and is not tested. 2: This is the limit to which VDD can be lowered in Sleep mode without losing RAM data. 3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, oscillator type, bus rate, internal code execution pattern and temperature also have an impact on the current consumption. 4: The test conditions for all IDD measurements in Active Operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VSS, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled as specified. 5: For standby current measurements, the conditions are the same as IDD, except that the device is in Sleep mode. If a module current is listed, the current is for that specific module enabled and the device in Sleep. 6: For EXTRC mode, does not include current through REXT. The current through the resistor can be estimated by the formula: I = VDD/2REXT (mA) with REXT in k. 2010 Microchip Technology Inc. DS41326D-page 85 PIC16F526 14.2 DC Characteristics: PIC16F526 (Extended) Standard Operating Conditions (unless otherwise specified) Operating Temperature -40C TA +125C (extended) DC Characteristics Param No. Sym. Characteristic Min. Typ.(1) Max. Units Conditions D001 VDD Supply Voltage 2.0 5.5 V See Figure 14-1 D002 VDR RAM Data Retention Voltage(2) — 1.5* — V Device in Sleep mode D003 VPOR VDD Start Voltage to ensure Power-on Reset — Vss — V See Section 8.4 “Power-on Reset (POR)” for details D004 SVDD VDD Rise Rate to ensure Power-on Reset 0.05* — — V/ms See Section 8.4 “Power-on Reset (POR)” for details D005 IDDP Supply Current During Prog/ Erase — 250* — A D010 IDD Supply Current(3,4,6) — — 175 400 250 700 A A FOSC = 4 MHz, VDD = 2.0V FOSC = 4 MHz, VDD = 5.0V — — 250 0.75 400 1.2 A mA FOSC = 8 MHz, VDD = 2.0V FOSC = 8 MHz, VDD = 5.0V — 1.4 2.2 mA FOSC = 20 MHz, VDD = 5.0V — — 11 38 26 110 A A FOSC = 32 kHz, VDD = 2.0V FOSC = 32 kHz, VDD = 5.0V D020 IPD Power-down Current(5) — — 0.1 0.35 9.0 15.0 A A VDD = 2.0V VDD = 5.0V D022 IWDT WDT Current(5) — — 1.0 7.0 18 22 A A VDD = 2.0V VDD = 5.0V D023 ICMP Comparator Current(5) — — 15 60 26 76 A A VDD = 2.0V (per comparator) VDD = 5.0V (per comparator) D022 IcVREF CvREF Current(5) — — 30 75 75 135 A A VDD = 2.0V (high range) VDD = 5.0V (high range) D023 IFVR — 100 130 A — 175 220 A VDD = 2.0V (reference and 1 comparator enabled) VDD = 5.0V (reference and 1 comparator enabled) D024 IAD* Internal 0.6V Fixed Voltage Reference Current(5) A/D Conversion Current — 120 150 A 2.0V — 200 250 A 5.0V * These parameters are characterized but not tested. Note 1: Data in the Typical (“Typ”) column is based on characterization results at 25C. This data is for design guidance only and is not tested. 2: This is the limit to which VDD can be lowered in Sleep mode without losing RAM data. 3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, oscillator type, bus rate, internal code execution pattern and temperature also have an impact on the current consumption. 4: The test conditions for all IDD measurements in Active Operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VSS, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled as specified. 5: For standby current measurements, the conditions are the same as IDD, except that the device is in Sleep mode. If a module current is listed, the current is for that specific module enabled and the device in Sleep. 6: For EXTRC mode, does not include current through REXT. The current through the resistor can be estimated by the formula: I = VDD/2REXT (mA) with REXT in k. DS41326D-page 86 2010 Microchip Technology Inc. PIC16F526 TABLE 14-1: DC CHARACTERISTICS: PIC16F526 (Industrial, Extended) Standard Operating Conditions (unless otherwise specified) Operating temperature -40°C TA +85°C (industrial) -40°C TA +125°C (extended) Operating voltage VDD range as described in DC spec. DC CHARACTERISTICS Param Sym. No. VIL Characteristic Min. Typ.† Max. Units Conditions Input Low Voltage I/O ports D030 with TTL buffer D030A Vss — 0.8 V For all 4.5 VDD 5.5V Vss — 0.15 VDD V Otherwise D031 with Schmitt Trigger buffer Vss — 0.15 VDD V D032 MCLR, T0CKI Vss — 0.15 VDD V D033 OSC1 (EXTRC mode), EC(1) Vss — 0.15 VDD V D033 OSC1 (HS mode) Vss — 0.3 VDD V D033 OSC1 (XT and LP modes) Vss — 0.3 V VIH Input High Voltage I/O ports D040 with TTL buffer D040A — 2.0 — VDD V 4.5 VDD 5.5V 0.25VDD + 0.8V — VDD V Otherwise For entire VDD range D041 with Schmitt Trigger buffer 0.85VDD — VDD V D042 MCLR, T0CKI 0.85VDD — VDD V D042A OSC1 (EXTRC mode), EC(1) 0.85VDD — VDD V D042A OSC1 (HS mode) 0.7VDD — VDD V D043 OSC1 (XT and LP modes) 1.6 — VDD V PORTB weak pull-up current(4) 50 250 400 A D070 IPUR IIL VDD = 5V, VPIN = VSS Input Leakage Current(2,5) D060 I/O ports — — ±1 A Vss VPIN VDD, Pin at high-impedance D061 RB3/MCLR(3) — ±0.7 ±5 A Vss VPIN VDD D063 OSC1 — — ±5 A Vss VPIN VDD, XT, HS and LP osc configuration — — 0.6 V IOL = 8.5 mA, VDD = 4.5V, –40C to +85C — — 0.6 V IOL = 7.0 mA, VDD = 4.5V, –40C to +125C VDD – 0.7 — — V IOH = -3.0 mA, VDD = 4.5V, –40C to +85C VDD – 0.7 — — V IOH = -2.5 mA, VDD = 4.5V, –40C to +125C In XT, HS and LP modes when external clock is used to drive OSC1. VOL D080 Output Low Voltage I/O ports/CLKOUT D080A VOH D090 Output High Voltage I/O ports/CLKOUT D090A Capacitive Loading Specs on Output Pins D100 COSC2 OSC2 pin — — 15 pF D101 CIO — — 50 pF All I/O pins and OSC2 Flash Data Memory D120 ED Byte endurance 100K 1M — E/W –40C TA +85C D120A ED Byte endurance 10K 100K — E/W +85C TA +125C D121 VDRW VDD for read/write VMIN — 5.5 V † Data in “Typ” column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: In EXTRC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the PIC16F526 be driven with external clock in RC mode. 2: Negative current is defined as coming out of the pin. 3: This spec. applies to RB3/MCLR configured as RB3 with pull-up disabled. 4: This spec. applies to all weak pull-up devices, including the weak pull-up found on RB3/MCLR. The current value listed will be the same whether or not the pin is configured as RB3 with pull-up enabled or as MCLR. 5: The leakage current on the nMCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage may be measured at different input voltages. 2010 Microchip Technology Inc. DS41326D-page 87 PIC16F526 TABLE 14-2: COMPARATOR SPECIFICATIONS. Comparator Specifications Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C to 125°C Characteristics Sym. Min. Typ. Max. Units 0.70 V Internal Voltage Reference VIVRF 0.50 0.60 Input offset voltage VOS — 5.0 10 mV Input common mode voltage* VCM 0 — VDD – 1.5 V CMRR* Response Time (1)* Comparator Mode Change to Output Valid* CMRR 55 — — db TRT — 150 400 ns TMC2COV — — 10 s Comments * These parameters are characterized but not tested. Note 1: Response time measured with one comparator input at (VDD – 1.5)/2 while the other input transitions from VSS to VDD – 1.5V. TABLE 14-3: Sym. CVRES * Note 1: 2: COMPARATOR VOLTAGE REFERENCE (VREF) SPECIFICATIONS Min. Typ. Max. Units Resolution Characteristics — — VDD/24* VDD/32 — — LSb LSb Low Range (VRR = 1) High Range (VRR = 0) Comments Absolute Accuracy(2) — — — — ±1/2* ±1/2* LSb LSb Low Range (VRR = 1) High Range (VRR = 0) Unit Resistor Value (R) — — 2K* — Settling Time(1) — — 10* s These parameters are characterized but not tested. Settling time measured while VRR = 1 and VR<3:0> transitions from 0000 to 1111. Do not use reference externally when VDD < 2.7V. Under this condition, reference should only be used with comparator Voltage Common mode observed. DS41326D-page 88 2010 Microchip Technology Inc. PIC16F526 TABLE 14-4: A/D CONVERTER CHARACTERISTICS: A/D Converter Specifications Param No. A01 Sym. Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +125°C Characteristic Min. Typ.† Max. Units 8 bit Conditions NR Resolution — — Integral Error — — 1.5 — — -1< EDNL 1.7 — — 1.5 LSb VDD = 5.0V -0.7 — +2.2 LSb VDD = 5.0V A03 EINL A04 EDNL Differential Error A06 EOFF Offset Error A07 EGN Gain Error A10 — Monotonicity — A25 VAIN Analog Input Voltage VSS A30 ZAIN Recommended Impedance of Analog Voltage Source — (1) LSb VDD = 5.0V LSb No missing codes to 8 bits VDD = 5.0V — — — VDD V — 10 K guaranteed VSS VAIN VDD * † These parameters are characterized but not tested. Data in “Typ” column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The A/D conversion result never decreases with an increase in the input voltage and has no missing codes. TABLE 14-5: VDD (Volts) RB0/RB1/RB4 2.0 5.5 RB3 2.0 5.5 PULL-UP RESISTOR RANGES Temperature (C) Min. Typ. Max. Units -40 25 85 125 -40 25 85 125 73K 73K 82K 86K 15K 15K 19K 23K 105K 113K 123K 132k 21K 22K 26k 29K 186K 187K 190K 190K 33K 34K 35K 35K -40 25 85 125 -40 25 85 125 63K 77K 82K 86K 16K 16K 24K 26K 81K 93K 96k 100K 20k 21K 25k 27K 96K 116K 116K 119K 22K 23K 28K 29K 2010 Microchip Technology Inc. DS41326D-page 89 PIC16F526 14.3 Timing Parameter Symbology and Load Conditions The timing parameter symbols have been created following one of the following formats: 1. TppS2ppS 2. TppS T F Frequency T Time Lowercase subscripts (pp) and their meanings: pp 2 to mc MCLR ck CLKOUT osc Oscillator cy Cycle time os OSC1 drt Device Reset Timer t0 T0CKI io I/O port wdt Watchdog Timer Uppercase letters and their meanings: S F Fall P Period H High R Rise I Invalid (high-impedance) V Valid L Low Z High-impedance FIGURE 14-3: LOAD CONDITIONS Legend: pin CL VSS DS41326D-page 90 CL = 50 pF for all pins except OSC2 15 pF for OSC2 in XT, HS or LP modes when external clock is used to drive OSC1 2010 Microchip Technology Inc. PIC16F526 FIGURE 14-4: EXTERNAL CLOCK TIMING Q4 Q1 Q3 Q2 Q4 Q1 OSC1 1 3 3 4 4 2 TABLE 14-6: EXTERNAL CLOCK TIMING REQUIREMENTS AC CHARACTERISTICS Standard Operating Conditions (unless otherwise specified) Operating Temperature -40C TA +85C (industrial), -40C TA +125C (extended) Operating Voltage VDD range is described in Section 14.1 “DC Characteristics: PIC16F526 (Industrial)” Param No. Sym. Characteristic Min. Typ.(1) Max. 1A FOSC External CLKIN Frequency(2) DC — 4 MHz XT Oscillator mode DC — 20 MHz HS/EC Oscillator mode DC — 200 kHz Oscillator Frequency 1 TOSC External CLKIN (2) Period(2) Oscillator Period(2) Units Conditions LP Oscillator mode — — 4 MHz EXTRC Oscillator mode 0.1 — 4 MHz XT Oscillator mode 4 — 20 MHz HS/EC Oscillator mode — — 200 kHz 250 — — ns XT Oscillator mode 50 — — ns HS/EC Oscillator mode LP Oscillator mode 5 — — s LP Oscillator mode 250 — — ns EXTRC Oscillator mode 250 — 10,000 ns XT Oscillator mode 50 — 250 ns HS/EC Oscillator mode LP Oscillator mode 5 — — s 2 TCY Instruction Cycle Time 200 4/FOSC — ns 3 TosL, TosH Clock in (OSC1) Low or High Time 50* — — ns XT Oscillator 2* — — s LP Oscillator 10* — — ns HS/EC Oscillator TosR, TosF Clock in (OSC1) Rise or Fall Time — — 25* ns XT Oscillator — — 50* ns LP Oscillator — — 15* ns HS/EC Oscillator 4 * Note 1: 2: These parameters are characterized but not tested. Data in the Typical (“Typ”) column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. When an external clock input is used, the “max” cycle time limit is “DC” (no clock) for all devices. 2010 Microchip Technology Inc. DS41326D-page 91 PIC16F526 TABLE 14-7: CALIBRATED INTERNAL RC FREQUENCIES AC CHARACTERISTICS Standard Operating Conditions (unless otherwise specified) Operating Temperature -40C TA +85C (industrial), -40C TA +125C (extended) Operating Voltage VDD range is described in Section 14.1 “DC Characteristics: PIC16F526 (Industrial)” Param No. Freq. Min. Tolerance F10 Sym. FOSC Characteristic Internal Calibrated INTOSC Frequency(1) Typ.† Max. Units Conditions 1% 7.92 8.00 8.08 MHz 3.5V, +25C 2% 7.84 8.00 8.16 MHz 2.5V VDD 5.5V 0C TA +85C 5% 7.60 8.00 8.40 MHz 2.0V VDD 5.5V -40C TA +85C (Ind.) -40C TA +125C (Ext.) * These parameters are characterized but not tested. † Data in the Typical (“Typ”) column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: To ensure these oscillator frequency tolerances, VDD and VSS must be capacitively decoupled as close to the device as possible. 0.1 uF and 0.01 uF values in parallel are recommended. DS41326D-page 92 2010 Microchip Technology Inc. PIC16F526 FIGURE 14-5: I/O TIMING Q1 Q4 Q2 Q3 OSC1 I/O Pin (input) 17 I/O Pin (output) 19 18 New Value Old Value 20, 21 Note: All tests must be done with specified capacitive loads (see data sheet) 50 pF on I/O pins and CLKOUT. TABLE 14-8: TIMING REQUIREMENTS Standard Operating Conditions (unless otherwise specified) Operating Temperature -40C TA +85C (industrial) AC -40C TA +125C (extended) CHARACTERISTICS Operating Voltage VDD range is described in Section 14.1 “DC Characteristics: PIC16F526 (Industrial)” Param No. 17 Sym. TOSH2IOV Characteristic OSC1 (Q1 cycle) to Port Out Valid(2), (3) 18 TOSH2IOI OSC1 (Q2 cycle) to Port Input Invalid (I/O in hold 19 TIOV2OSH Port Input Valid to OSC1 (I/O in setup time) 20 21 TIOR TIOF Port Output Rise Port Output Fall Time(3) Time(3) time)(2) Min. Typ.(1) Max. Units — — 100* ns 50 — — ns 20 — — ns — 10 50** ns — 10 58** ns * These parameters are characterized but not tested. ** These parameters are design targets and are not tested. Note 1: Data in the Typical (“Typ”) column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. 2: Measurements are taken in EXTRC mode. 3: See Figure 14-3 for loading conditions. 2010 Microchip Technology Inc. DS41326D-page 93 PIC16F526 FIGURE 14-6: RESET, WATCHDOG TIMER AND DEVICE RESET TIMER TIMING VDD MCLR 30 Internal POR 32 32 32 DRT Time-out(2) Internal Reset Watchdog Timer Reset 31 34 34 I/O pin(1) Note 1: 2: I/O pins must be taken out of High-Impedance mode by enabling the output drivers in software. Runs in MCLR or WDT Reset only in XT, LP and HS modes. TABLE 14-9: RESET, WATCHDOG TIMER AND DEVICE RESET TIMER Standard Operating Conditions (unless otherwise specified) Operating Temperature -40C TA +85C (industrial) -40C TA +125C (extended) Operating Voltage VDD range is described in Section 14.1 “DC Characteristics: PIC16F526 (Industrial)” AC CHARACTERISTICS Param No. Sym. Characteristic Min. Typ.(1) Max. Units 30 TMCL MCLR Pulse Width (low) 2000* — — ns VDD = 5.0V 31 TWDT Watchdog Timer Time-out Period (no prescaler) 9* 9* 18* 18* 30* 40* ms ms VDD = 5.0V (Industrial) VDD = 5.0V (Extended) 32 TDRT Device Reset Timer Period 9* 9* 18* 18* 30* 40* ms ms VDD = 5.0V (Industrial) VDD = 5.0V (Extended) 0.5* 0.5* 1.125* 1.125* 2* 2.5* ms ms VDD = 5.0V (Industrial) VDD = 5.0V (Extended) — — 2000* ns Standard Short 34 * Note 1: TIOZ I/O High-impedance from MCLR low Conditions These parameters are characterized but not tested. Data in the Typical (“Typ”) column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. DS41326D-page 94 2010 Microchip Technology Inc. PIC16F526 FIGURE 14-7: TIMER0 CLOCK TIMINGS T0CKI 40 41 42 TABLE 14-10: TIMER0 CLOCK REQUIREMENT Standard Operating Conditions (unless otherwise specified) Operating Temperature -40C TA +85C (industrial) -40C TA +125C (extended) Operating Voltage VDD range is described in Section 14.1 “DC Characteristics: PIC16F526 (Industrial)” AC CHARACTERISTICS Param Sym. No. 40 41 42 * Note 1: Tt0H Tt0L Tt0P Characteristic T0CKI High Pulse Width No Prescaler T0CKI Low Pulse Width No Prescaler T0CKI Period With Prescaler With Prescaler Min. Typ.(1) Max. Units 0.5 TCY + 20* — — ns 10* — — ns 0.5 TCY + 20* — — ns 10* — — ns 20 or TCY + 40* N — — ns Conditions Whichever is greater. N = Prescale Value (1, 2, 4,..., 256) These parameters are characterized but not tested. Data in the Typical (“Typ”) column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. 2010 Microchip Technology Inc. DS41326D-page 95 PIC16F526 TABLE 14-11: FLASH DATA MEMORY WRITE/ERASE TIME Standard Operating Conditions (unless otherwise specified) Operating Temperature -40C TA +85C (industrial) -40C TA +125C (extended) Operating Voltage VDD range is described in Section 14.1 “DC Characteristics: PIC16F526 (Industrial)” AC CHARACTERISTICS Param No. Sym. 43 TDW 44 TDE * Note 1: Min. Typ.(1) Max. Units Flash Data Memory Write Cycle Time 2 3.5 5 ms Flash Data Memory Erase Cycle Time 2 3.5 5 ms Characteristic Conditions These parameters are characterized but not tested. Data in the Typical (“Typ”) column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. DS41326D-page 96 2010 Microchip Technology Inc. PIC16F526 15.0 DC AND AC CHARACTERISTICS GRAPHS AND CHARTS The graphs and tables provided in this section are for design guidance and are not tested. In some graphs or tables, the data presented are outside specified operating range (i.e., outside specified VDD range). This is for information only and devices are ensured to operate properly only within the specified range Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore, outside the warranted range. “Typical” represents the mean of the distribution at 25C. “Maximum” or “minimum” represents (mean + 3) or (mean 3) respectively, where s is a standard deviation, over each temperature range. FIGURE 15-1: IDD VS. FOSC Over VDD (HS Mode) 3.00 2.50 Typical: Statistical Mean @25°C Maximum: Mean (Worst-Case Temp) + 3 (-40°C to 125°C) Max. 5V IDD (mA) 2.00 1.50 Typical 5V 1.00 0.50 Max. 2V Typical 2V 0.00 5 10 15 20 25 Fosc (MHz) 2010 Microchip Technology Inc. DS41326D-page 97 PIC16F526 FIGURE 15-2: TYPICAL IDD vs. FOSC OVER VDD (XT, EXTRC mode) 800 Typical: Statistical Mean @25°C Maximum: Mean (Worst-Case Temp) + 3 (-40°C to 125°C) 700 600 IDD (A) 500 5V 400 300 200 2V 100 0 0 1 3 2 5 4 FOSC (MHz) FIGURE 15-3: MAXIMUM IDD vs. FOSC OVER VDD (XT, EXTRC mode) 800 5V Typical: Statistical Mean @25°C Maximum: Mean (Worst-Case Temp) + 3 (-40°C to 125°C) 700 600 IDD (A) 500 400 300 2V 200 100 0 0 1 3 2 4 5 FOSC (MHz) DS41326D-page 98 2010 Microchip Technology Inc. PIC16F526 FIGURE 15-4: IDD vs. VDD OVER FOSC (LP MODE) 120 Typical: Statistical Mean @25°C Industrial: Mean (Worst-Case Temp) + 3σ (-40°C to 85°C) Extended: Mean (Worst-Case Temp) + 3σ (-40°C to 125°C) 100 32 kHz Maximum Extended IDD (A) 80 60 32 kHz Maximum Industrial 32 kHz Typical 40 20 0 1 2 3 4 5 6 VDD (V) 2010 Microchip Technology Inc. DS41326D-page 99 PIC16F526 FIGURE 15-5: TYPICAL IPD vs. VDD (SLEEP MODE, ALL PERIPHERALS DISABLED) 0.45 0.40 Typical: Statistical Mean @25°C Maximum: Mean (Worst-Case Temp) + 3 (-40°C to 125°C) 0.35 IPD (A) 0.30 0.25 0.20 0.15 0.10 0.05 0.0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) MAXIMUM IPD vs. VDD (SLEEP MODE, ALL PERIPHERALS DISABLED) FIGURE 15-6: 18.0 16.0 Typical: Statistical Mean @25°C Maximum: Mean (Worst-Case Temp) + 3 (-40°C to 125°C) 14.0 Max. 125°C IPD (A) 12.0 10.0 8.0 6.0 4.0 Max. 85°C 2.0 0.0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) DS41326D-page 100 2010 Microchip Technology Inc. PIC16F526 FIGURE 15-7: TYPICAL WDT IPD vs. VDD 9 8 Typical: Statistical Mean @25°C Maximum: Mean (Worst-Case Temp) + 3 (-40°C to 125°C) 7 IPD (A) 6 5 4 3 2 1 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) FIGURE 15-8: MAXIMUM WDT IPD vs. VDD OVER TEMPERATURE 25.0 20.0 Typical: Statistical Mean @25°C Maximum: Mean (Worst-Case Temp) + 3 (-40°C to 125°C) IPD (A) Max. 125°C 15.0 10.0 Max. 85°C 5.0 0.0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) 2010 Microchip Technology Inc. DS41326D-page 101 PIC16F526 FIGURE 15-9: 80 COMPARATOR IPD vs. VDD (COMPARATOR ENABLED) Typical: Statistical Mean @25°C Maximum: Mean (Worst-Case Temp) + 3 (-40°C to 125°C) Maximum Typical IPD (A) 60 40 20 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) FIGURE 15-10: WDT TIME-OUT vs. VDD OVER TEMPERATURE (NO PRESCALER) 50 Typical: Statistical Mean @25°C Maximum: Mean (Worst-Case Temp) + 3 (-40°C to 125°C) Max. 125°C 45 40 Max. 85°C 35 Time (ms) 30 Typical. 25°C 25 20 Min. -40°C 15 10 5 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) DS41326D-page 102 2010 Microchip Technology Inc. PIC16F526 FIGURE 15-11: VOL vs. IOL OVER TEMPERATURE (VDD = 3.0V) (VDD = 3V, -40×C TO 125×C) 0.8 0.7 Typical: Statistical Mean @25°C Maximum: Mean (Worst-Case Temp) + 3 (-40°C to 125°C) Max. 125°C 0.6 Max. 85°C VOL (V) 0.5 0.4 Typical 25°C 0.3 0.2 Min. -40°C 0.1 0.0 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 9.5 10.0 IOL (mA) FIGURE 15-12: VOL vs. IOL OVER TEMPERATURE (VDD = 5.0V) 0.45 Typical: Statistical Mean @25°C Typical: Statistical Mean @25×C Maximum: Mean (Worst-Case Temp) + 3 Maximum: Meas(-40×C + 3 to 125×C) (-40°C to 125°C) 0.40 Max. 125°C 0.35 Max. 85°C VOL (V) 0.30 0.25 Typ. 25°C 0.20 0.15 Min. -40°C 0.10 0.05 0.00 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 9.5 10.0 IOL (mA) 2010 Microchip Technology Inc. DS41326D-page 103 PIC16F526 FIGURE 15-13: VOH vs. IOH OVER TEMPERATURE (VDD = 3.0V) 3.5 3.0 Max. -40°C Typ. 25°C 2.5 Min. 125°C VOH (V) 2.0 1.5 1.0 Typical: Statistical Mean @25°C Maximum: Mean (Worst-Case Temp) + 3 (-40°C to 125°C) 0.5 0.0 0.0 -0.5 -1.0 -1.5 -2.0 -2.5 -3.0 -3.5 -4.0 IOH (mA) FIGURE 15-14: (VDD = 5.0V) VOH vs. IOH OVER TEMPERATURE ( , ) 5.5 5.0 Max. -40°C Typ. 25°C VOH (V) 4.5 Min. 125°C 4.0 3.5 Typical: Statistical Mean @25°C Maximum: Mean (Worst-Case Temp) + 3 (-40°C to 125°C) 3.0 0.0 -0.5 -1.0 -1.5 -2.0 -2.5 -3.0 -3.5 -4.0 -4.5 -5.0 IOH (mA) DS41326D-page 104 2010 Microchip Technology Inc. PIC16F526 FIGURE 15-15: TTL INPUT THRESHOLD VIN vs. VDD (TTL Input, -40×C TO 125×C) 1.7 1.5 Typical: Statistical Mean @25°C Maximum: Mean (Worst-Case Temp) + 3 (-40°C to 125°C) Max. -40°C VIN (V) 1.3 Typ. 25°C 1.1 Min. 125°C 0.9 0.7 0.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) FIGURE 15-16: SCHMITT TRIGGER INPUT THRESHOLD VIN vs. VDD (ST Input, -40×C TO 125×C) 4.0 VIH Max. 125°C 3.5 Typical: Statistical Mean @25°C Maximum: Mean (Worst-Case Temp) + 3 (-40°C to 125°C) VIH Min. -40°C VIN (V) 3.0 2.5 2.0 VIL Max. -40°C 1.5 VIL Min. 125°C 1.0 0.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) 2010 Microchip Technology Inc. DS41326D-page 105 PIC16F526 FIGURE 15-17: DEVICE RESET TIMER (HS, XT AND LP) vs. VDD Maximum (Sleep Mode all Peripherals Disabled) 45 40 35 Max. 125°C DRT (ms) 30 25 Max. 85°C 20 Typical. 25°C 15 Min. -40°C 10 5 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) Note: See Table 14-9 if another clock mode is selected. DS41326D-page 106 2010 Microchip Technology Inc. PIC16F526 16.0 PACKAGING INFORMATION 16.1 Package Marking Information 14-Lead PDIP (300 mil) Example XXXXXXXXXXXXXX XXXXXXXXXXXXXX YYWWNNN PIC16F526 -I/PG e3 0215 0410017 Example 14-Lead SOIC (3.90 mm) PIC16F526-E /SLG0125 0431017 XXXXXXXXXXX XXXXXXXXXXX YYWWNNN Example 14-Lead TSSOP (4.4 mm) 16F526-I 0431 017 XXXXXXXX YYWW NNN Example 16-Lead QFN MG1 0431 017 XXX YYWW NNN TABLE 16-1: 16-LEAD 3X3 QFN (MG) TOP MARKING Part Number Marking PIC16F526 - I/MG MG1 PIC16F526 - E/MG MG2 Legend: XX...X Y YY WW NNN e3 * Note: * Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. Standard PIC® device marking consists of Microchip part number, year code, week code, and traceability code. For PIC device marking beyond this, certain price adders apply. Please check with your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price. 2010 Microchip Technology Inc. DS41326D-page 107 PIC16F526 /HDG3ODVWLF'XDO,Q/LQH3±PLO%RG\>3',3@ 1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ N NOTE 1 E1 1 3 2 D E A2 A L A1 c b1 b e eB 8QLWV 'LPHQVLRQ/LPLWV 1XPEHURI3LQV ,1&+(6 0,1 1 120 0$; 3LWFK H 7RSWR6HDWLQJ3ODQH $ ± ± 0ROGHG3DFNDJH7KLFNQHVV $ %DVHWR6HDWLQJ3ODQH $ ± ± 6KRXOGHUWR6KRXOGHU:LGWK ( 0ROGHG3DFNDJH:LGWK ( 2YHUDOO/HQJWK ' 7LSWR6HDWLQJ3ODQH / /HDG7KLFNQHVV F E E H% ± ± 8SSHU/HDG:LGWK /RZHU/HDG:LGWK 2YHUDOO5RZ6SDFLQJ %6& 1RWHV 3LQYLVXDOLQGH[IHDWXUHPD\YDU\EXWPXVWEHORFDWHGZLWKWKHKDWFKHGDUHD 6LJQLILFDQW&KDUDFWHULVWLF 'LPHQVLRQV'DQG(GRQRWLQFOXGHPROGIODVKRUSURWUXVLRQV0ROGIODVKRUSURWUXVLRQVVKDOOQRWH[FHHGSHUVLGH 'LPHQVLRQLQJDQGWROHUDQFLQJSHU$60(<0 %6&%DVLF'LPHQVLRQ7KHRUHWLFDOO\H[DFWYDOXHVKRZQZLWKRXWWROHUDQFHV 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ &% DS41326D-page 108 2010 Microchip Technology Inc. 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DS41326D-page 109 PIC16F526 1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ DS41326D-page 110 2010 Microchip Technology Inc. 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DS41326D-page 111 PIC16F526 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS41326D-page 112 2010 Microchip Technology Inc. PIC16F526 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2010 Microchip Technology Inc. DS41326D-page 113 PIC16F526 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS41326D-page 114 2010 Microchip Technology Inc. PIC16F526 APPENDIX A: REVISION HISTORY Revision A (August 2007) Original release of this document. Revision B (December 2008) Added DC and AC Characteristics graphs; Updated Electrical Characteristics section; added I/O diagrams; updated the Flash Data Memory Control Section; made various changes to the Special Features of the CPU Section and made general edits. Miscellaneous updates. Revision C (July 2009) Removed “Preliminary” status; Revised Table 6-3: I/O Pins; Revised Table 8-3: Reset Conditions; Revised Table 14-4: A/D Converter Char. Revision D (March 2010) Added Package Drawings and Package Marking Information for the 16-Lead Package Quad Flat, No Lead Package (MG) - 3x3x0.9 mm Body (QFN); Updated the Product Identification System section. 2010 Microchip Technology Inc. DS41326D-page 115 PIC16F526 NOTES: DS41326D-page 116 2010 Microchip Technology Inc. PIC16F526 THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: Users of Microchip products can receive assistance through several channels: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives • • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Development Systems Information Line Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://support.microchip.com CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com, click on Customer Change Notification and follow the registration instructions. 2010 Microchip Technology Inc. DS41326D-page 117 PIC16F526 READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. To: Technical Publications Manager RE: Reader Response Total Pages Sent ________ From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ FAX: (______) _________ - _________ Application (optional): Would you like a reply? Device: PIC16F526 Y N Literature Number: DS41326D Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? DS41326D-page 118 2010 Microchip Technology Inc. PIC16F526 INDEX A A/D Specifications.............................................................. 89 ALU ..................................................................................... 11 Assembler MPASM Assembler..................................................... 80 B Block Diagram Comparator for the PIC16F526................................... 65 On-Chip Reset Circuit ................................................. 51 Timer0......................................................................... 37 TMR0/WDT Prescaler................................................. 41 Watchdog Timer.......................................................... 54 Brown-Out Protection Circuit .............................................. 55 C C Compilers MPLAB C18 ................................................................ 80 Carry ................................................................................... 11 Clock Divisors ..................................................................... 59 Clocking Scheme ................................................................ 14 Code Protection ............................................................ 43, 57 CONFIG1 Register.............................................................. 44 Configuration Bits................................................................ 43 Customer Change Notification Service ............................. 115 Customer Notification Service........................................... 115 Customer Support ............................................................. 115 D Data Memory (SRAM and FSRs) Register File Map.................................................. 16, 17 DC and AC Characteristics ................................................. 97 Graphs and Tables ..................................................... 97 Development Support ......................................................... 79 Digit Carry ........................................................................... 11 E Errata .................................................................................... 5 F Flash Data Memory Control ................................................ 23 FSR ..................................................................................... 22 Fuses. See Configuration Bits I I/O Interfacing ..................................................................... 29 I/O Ports .............................................................................. 27 I/O Programming Considerations........................................ 36 ID Locations .................................................................. 43, 57 INDF.................................................................................... 22 Indirect Data Addressing..................................................... 22 Instruction Cycle ................................................................. 14 Instruction Flow/Pipelining .................................................. 14 Instruction Set Summary..................................................... 72 Internet Address................................................................ 115 L Loading of PC ..................................................................... 21 M Memory Organization.......................................................... 15 Memory Map ............................................................... 15 PIC16F526.................................................................. 15 2010 Microchip Technology Inc. Program Memory (PIC16F526) .................................. 15 Microchip Internet Web Site.............................................. 115 MPLAB ASM30 Assembler, Linker, Librarian ..................... 80 MPLAB Integrated Development Environment Software.... 79 MPLAB PM3 Device Programmer ...................................... 82 MPLAB REAL ICE In-Circuit Emulator System .................. 81 MPLINK Object Linker/MPLIB Object Librarian .................. 80 O Option Register................................................................... 19 OSC selection..................................................................... 43 OSCCAL Register............................................................... 20 Oscillator Configurations..................................................... 45 Oscillator Types HS............................................................................... 45 LP ............................................................................... 45 RC .............................................................................. 45 XT ............................................................................... 45 P PIC16F526 Device Varieties................................................. 9 POR Device Reset Timer (DRT) ................................... 43, 53 PD............................................................................... 55 Power-on Reset (POR)............................................... 43 TO............................................................................... 55 PORTB ............................................................................... 27 PORTC ............................................................................... 27 Power-down Mode.............................................................. 56 Prescaler ............................................................................ 40 Program Counter ................................................................ 21 Q Q cycles .............................................................................. 14 R RC Oscillator....................................................................... 46 Reader Response............................................................. 116 Read-Modify-Write.............................................................. 36 Registers CONFIG1 (Configuration Word Register 1)................ 44 Special Function ......................................................... 16 Reset .................................................................................. 43 S Sleep ............................................................................ 43, 56 Software Simulator (MPLAB SIM) ...................................... 81 Special ................................................................................ 17 Special Features of the CPU .............................................. 43 Special Function Registers ........................................... 16, 17 Stack................................................................................... 21 STATUS register................................................................. 55 Status Register ............................................................. 11, 18 T Timer0 Timer0 ........................................................................ 37 Timer0 (TMR0) Module .............................................. 37 TMR0 with External Clock .......................................... 39 Timing Diagrams and Specifications .................................. 91 Timing Parameter Symbology and Load Conditions .......... 90 TRIS Register ..................................................................... 27 DS41326D-page 119 PIC16F526 W Wake-up from Sleep ........................................................... 56 Watchdog Timer (WDT) ................................................ 43, 53 Period.......................................................................... 53 Programming Considerations ..................................... 53 WWW Address.................................................................. 115 WWW, On-Line Support........................................................ 5 Z Zero bit ................................................................................ 11 DS41326D-page 120 2010 Microchip Technology Inc. PIC16F526 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X /XX XXX Device Temperature Range Package Pattern Examples: a) b) Device: PIC16F526 PIC16F526T(1) Temperature Range: I E = = Package: P SL ST MG Pattern: Special Requirements c) d) PIC16F526-E/P 301 = Extended Temp., PDIP package, QTP pattern #301 PIC16F526-I/SL = Industrial Temp., SOIC package PIC16F526T-E/P = Extended Temp., PDIP package, Tape and Reel PIC16F526T-I/MG = Industrial Temp., QFN Package, Tape and Reel -40C to +85C (Industrial) -40C to +125C (Extended) = = = = Plastic (PDIP)(2) 14L Small Outline, 3.90 mm (SOIC)(2) Thin Shrink Small Outline (TSSOP)(2) 16-Lead 3x3 (QFN)(2) Note 1: 2010 Microchip Technology Inc. 2: T = in tape and reel SOIC, TSSOP and QFN packages only Pb-free. DS41326D-page 121 WORLDWIDE SALES AND SERVICE AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 India - Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4123 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 India - Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Japan - Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Cleveland Independence, OH Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, CA Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 China - Chongqing Tel: 86-23-8980-9588 Fax: 86-23-8980-9500 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 Malaysia - Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 Taiwan - Hsin Chu Tel: 886-3-6578-300 Fax: 886-3-6578-370 China - Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820 China - Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 China - Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049 01/05/10 DS41326D-page 122 2010 Microchip Technology Inc.