MICROCHIP MCP1825T

MCP1825/MCP1825S
500 mA, Low Voltage, Low Quiescent Current LDO Regulator
Features
Description
• 500 mA Output Current Capability
• Input Operating Voltage Range: 2.1V to 6.0V
• Adjustable Output Voltage Range: 0.8V to 5.0V
(MCP1825 only)
• Standard Fixed Output Voltages:
- 0.8V, 1.2V, 1.8V, 2.5V, 3.0V, 3.3V, 5.0V
• Other Fixed Output Voltage Options Available
Upon Request
• Low Dropout Voltage: 210 mV Typical at 500 mA
• Typical Output Voltage Tolerance: 0.5%
• Stable with 1.0 µF Ceramic Output Capacitor
• Fast response to Load Transients
• Low Supply Current: 120 µA (typical)
• Low Shutdown Supply Current: 0.1 µA (typical)
(MCP1825 only)
• Fixed Delay on Power Good Output
(MCP1825 only)
• Short Circuit Current Limiting and
Overtemperature Protection
• TO-263-5 (DDPAK-5), TO-220-5, SOT-223-5
Package Options (MCP1825).
• TO-263-3 (DDPAK-3), TO-220-3, SOT-223-3
Package Options (MCP1825S).
The MCP1825/MCP1825S is a 500 mA Low Dropout
(LDO) linear regulator that provides high current and
low output voltages. The MCP1825 comes in a fixed or
adjustable output voltage version, with an output
voltage range of 0.8V to 5.0V. The 500 mA output
current capability, combined with the low output voltage
capability, make the MCP1825 a good choice for new
sub-1.8V output voltage LDO applications that have
high current demands. The MCP1825S is a 3-pin fixed
voltage version.
Applications
•
•
•
•
•
•
High-Speed Driver Chipset Power
Networking Backplane Cards
Notebook Computers
Network Interface Cards
Palmtop Computers
2.5V to 1.XV Regulators
© 2008 Microchip Technology Inc.
The MCP1825/MCP1825S is stable using ceramic
output capacitors that inherently provide lower output
noise and reduce the size and cost of the entire
regulator solution. Only 1 µF of output capacitance is
needed to stabilize the LDO.
Using CMOS construction, the quiescent current
consumed by the MCP1825/MCP1825S is typically
less than 120 µA over the entire input voltage range,
making it attractive for portable computing applications
that demand high output current. The MCP1825
versions have a Shutdown (SHDN) pin. When shut
down, the quiescent current is reduced to less than
0.1 µA.
On the MCP1825 fixed output versions, the scaleddown output voltage is internally monitored and a
power good (PWRGD) output is provided when the
output is within 92% of regulation (typical). The
PWRGD delay is internally fixed at 110 µs (typical).
The overtemperature and short circuit current-limiting
provide additional protection for the LDO during system
fault conditions.
DS22056B-page 1
MCP1825/MCP1825S
Package Types
MCP1825
DDPAK-5
MCP1825S
TO-220-5
Fixed/Adjustable
DDPAK-3
1
2
TO-220-3
3
1
1 2 3 4 5
2
3
1 2 3 4 5
SOT-223-5
SOT-223-3
6
4
1
2
3
4
1
5
2
3
Pin
Fixed
Adjustable
Pin
1
SHDN
SHDN
1
VIN
2
VIN
VIN
2
GND (TAB)
3
VOUT
4
GND (TAB)
3
GND (TAB)
GND (TAB)
4
VOUT
VOUT
5
PWRGD
ADJ
6
GND (TAB)
GND (TAB)
DS22056B-page 2
© 2008 Microchip Technology Inc.
MCP1825/MCP1825S
Typical Applications
MCP1825 Fixed Output Voltage
PWRGD
R1
100 kΩ
On
SHDN
Off
VIN = 2.3V to 2.8V
1
VIN
VOUT = 1.8V @ 500 mA
VOUT
GND
C1
4.7 µF
C2
1 µF
MCP1825 Adjustable Output Voltage
VADJ
R1
40 kΩ
On
R2
20 kΩ
SHDN
Off
VIN = 2.1V to 2.8V
VIN
1
VOUT
C1
4.7 µF
VOUT = 1.2V @ 500 mA
C2
1 µF
GND
© 2008 Microchip Technology Inc.
DS22056B-page 3
MCP1825/MCP1825S
Functional Block Diagram - Adjustable Output
PMOS
VIN
VOUT
Undervoltage
Lock Out
(UVLO)
ISNS
Cf
Rf
SHDN
ADJ/SENSE
Overtemperature
Sensing
+
Driver w/limit
and SHDN
EA
–
SHDN
VREF
V IN
SHDN
Reference
Soft-Start
Comp
TDELAY
GND
92% of VREF
DS22056B-page 4
© 2008 Microchip Technology Inc.
MCP1825/MCP1825S
Functional Block Diagram - Fixed Output (3-Pin)
PMOS
VIN
VOUT
Undervoltage
Lock Out
(UVLO)
Sense
ISNS
Cf
Rf
SHDN
Overtemperature
Sensing
+
Driver w/limit
and SHDN
EA
–
SHDN
VREF
V IN
SHDN
Reference
Soft-Start
Comp
TDELAY
GND
92% of VREF
© 2008 Microchip Technology Inc.
DS22056B-page 5
MCP1825/MCP1825S
Functional Block Diagram - Fixed Output (5-Pin)
PMOS
VIN
VOUT
Undervoltage
Lock Out
(UVLO)
Sense
ISNS
Cf
Rf
SHDN
Overtemperature
Sensing
+
Driver w/limit
and SHDN
EA
–
SHDN
VREF
V IN
SHDN
Reference
Soft-Start
PWRGD
Comp
GND
TDELAY
92% of VREF
DS22056B-page 6
© 2008 Microchip Technology Inc.
MCP1825/MCP1825S
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
VIN ....................................................................................6.5V
† Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.
Maximum Voltage on Any Pin .. (GND – 0.3V) to (VDD + 0.3)V
Maximum Power Dissipation......... Internally-Limited (Note 6)
Output Short Circuit Duration ................................ Continuous
Storage temperature .....................................-65°C to +150°C
Maximum Junction Temperature, TJ ........................... +150°C
ESD protection on all pins (HBM/MM) ........... ≥ 4 kV; ≥ 300V
AC/DC CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, VIN = VOUT(MAX) + VDROPOUT(MAX), Note 1, VR = 1.8V for Adjustable Output,
IOUT = 1 mA, CIN = COUT = 4.7 µF (X7R Ceramic), TA = +25°C.
Boldface type applies for junction temperatures, TJ (Note 7) of -40°C to +125°C
Parameters
Sym
Min
Input Operating Voltage
VIN
2.1
Input Quiescent Current
Iq
—
Input Quiescent Current for
SHDN Mode
ISHDN
Maximum Output Current
Max
Units
6.0
V
Note 1
120
220
µA
IL = 0 mA, VOUT = 0.8V to
5.0V
—
0.1
3
µA
SHDN = GND
IOUT
500
—
—
mA
VIN = 2.1V to 6.0V
VR = 0.8V to 5.0V, Note 1
Line Regulation
ΔVOUT/
(VOUT x ΔVIN)
—
±0.05
±0.16
%/V
(Note 1) ≤ VIN ≤ 6V
Load Regulation
ΔVOUT/VOUT
-1.0
±0.5
1.0
%
IOUT = 1 mA to 500 mA,
(Note 4)
IOUT_SC
—
1.2
—
A
RLOAD < 0.1Ω, Peak Current
VADJ
0.402
0.410
0.418
V
VIN = 2.1V to VIN = 6.0V,
IOUT = 1 mA
IADJ
-10
±0.01
+10
nA
VIN = 6.0V, VADJ = 0V to 6V
TCVOUT
—
40
—
ppm/°C
Note 3
V
Note 2
Output Short Circuit Current
Typ
Conditions
Adjust Pin Characteristics (Adjustable Output Only)
Adjust Pin Reference Voltage
Adjust Pin Leakage Current
Adjust Temperature Coefficient
Fixed-Output Characteristics (Fixed Output Only)
Voltage Regulation
Note 1:
2:
3:
4:
5:
6:
7:
VOUT
VR - 2.5%
VR ±0.5% VR + 2.5%
The minimum VIN must meet two conditions: VIN ≥ 2.1V and VIN ≥ VOUT(MAX) + VDROPOUT(MAX).
VR is the nominal regulator output voltage for the fixed cases. VR = 1.2V, 1.8V, etc. VR is the desired set point output
voltage for the adjustable cases. VR = VADJ * ((R1/R2)+1). Figure 4-1.
TCVOUT = (VOUT-HIGH – VOUT-LOW) *106 / (VR * ΔTemperature). VOUT-HIGH is the highest voltage measured over the
temperature range. VOUT-LOW is the lowest voltage measured over the temperature range.
Load regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is
tested over a load range from 1 mA to the maximum specified output current.
Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its
nominal value that was measured with an input voltage of VIN = VOUT(MAX) + VDROPOUT(MAX).
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air. (i.e., TA, TJ, θJA). Exceeding the maximum allowable power
dissipation will cause the device operating junction temperature to exceed the maximum +150°C rating. Sustained
junction temperatures above 150°C can impact device reliability.
The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the
desired junction temperature. The test time is small enough such that the rise in the junction temperature over the
ambient temperature is not significant.
© 2008 Microchip Technology Inc.
DS22056B-page 7
MCP1825/MCP1825S
AC/DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise noted, VIN = VOUT(MAX) + VDROPOUT(MAX), Note 1, VR = 1.8V for Adjustable Output,
IOUT = 1 mA, CIN = COUT = 4.7 µF (X7R Ceramic), TA = +25°C.
Boldface type applies for junction temperatures, TJ (Note 7) of -40°C to +125°C
Parameters
Sym
Min
Typ
Max
Units
VDROPOUT
—
210
350
mV
VPWRGD_VIN
1.0
—
6.0
V
1.2
—
6.0
Conditions
Dropout Characteristics
Dropout Voltage
Note 5, IOUT = 500 mA,
VIN(MIN) = 2.1V
Power Good Characteristics
PWRGD Input Voltage Operating Range
TA = +25°C
TA = -40°C to +125°C
For VIN < 2.1V, ISINK = 100 µA
PWRGD Threshold Voltage
(Referenced to VOUT)
%VOUT
VPWRGD_TH
Falling Edge
89
92
95
VOUT < 2.5V Fixed,
VOUT = Adj.
90
92
94
VOUT >= 2.5V Fixed
VPWRGD_HYS
1.0
2.0
3.0
%VOUT
PWRGD Output Voltage Low
VPWRGD_L
—
0.2
0.4
V
IPWRGD SINK = 1.2 mA,
ADJ = 0V
PWRGD Leakage
PWRGD_LK
—
1
—
nA
VPWRGD = VIN = 6.0V
TPG
—
110
—
µs
Rising Edge
RPULLUP = 10 kΩ
TVDET-PWRGD
—
200
—
µs
VOUT = VPWRGD_TH + 20 mV
to VPWRGD_TH - 20 mV
Logic High Input
VSHDN-HIGH
45
—
—
%VIN
Logic Low Input
VSHDN-LOW
—
—
15
%VIN
SHDNILK
-0.1
±0.001
+0.1
µA
VIN = 6V, SHDN =VIN,
SHDN = GND
TOR
—
100
—
µs
SHDN = GND to VIN,
VOUT = GND to 95% VR
eN
—
2.0
—
µV/√Hz
PWRGD Threshold Hysteresis
PWRGD Time Delay
Detect Threshold to PWRGD
Active Time Delay
Shutdown Input
SHDN Input Leakage Current
VIN = 2.1V to 6.0V
VIN = 2.1V to 6.0V
AC Performance
Output Delay From SHDN
Output Noise
Note 1:
2:
3:
4:
5:
6:
7:
IOUT = 200 mA, f = 1 kHz,
COUT = 10 µF (X7R Ceramic),
VOUT = 2.5V
The minimum VIN must meet two conditions: VIN ≥ 2.1V and VIN ≥ VOUT(MAX) + VDROPOUT(MAX).
VR is the nominal regulator output voltage for the fixed cases. VR = 1.2V, 1.8V, etc. VR is the desired set point output
voltage for the adjustable cases. VR = VADJ * ((R1/R2)+1). Figure 4-1.
TCVOUT = (VOUT-HIGH – VOUT-LOW) *106 / (VR * ΔTemperature). VOUT-HIGH is the highest voltage measured over the
temperature range. VOUT-LOW is the lowest voltage measured over the temperature range.
Load regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is
tested over a load range from 1 mA to the maximum specified output current.
Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its
nominal value that was measured with an input voltage of VIN = VOUT(MAX) + VDROPOUT(MAX).
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air. (i.e., TA, TJ, θJA). Exceeding the maximum allowable power
dissipation will cause the device operating junction temperature to exceed the maximum +150°C rating. Sustained
junction temperatures above 150°C can impact device reliability.
The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the
desired junction temperature. The test time is small enough such that the rise in the junction temperature over the
ambient temperature is not significant.
DS22056B-page 8
© 2008 Microchip Technology Inc.
MCP1825/MCP1825S
AC/DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise noted, VIN = VOUT(MAX) + VDROPOUT(MAX), Note 1, VR = 1.8V for Adjustable Output,
IOUT = 1 mA, CIN = COUT = 4.7 µF (X7R Ceramic), TA = +25°C.
Boldface type applies for junction temperatures, TJ (Note 7) of -40°C to +125°C
Parameters
Sym
Min
Typ
Max
Units
Power Supply Ripple Rejection
Ratio
PSRR
—
60
—
dB
f = 100 Hz, COUT = 4.7 µF,
IOUT = 100 µA,
VINAC = 100 mV pk-pk,
CIN = 0 µF
Thermal Shutdown Temperature
TSD
—
150
—
°C
IOUT = 100 µA, VOUT = 1.8V,
VIN = 2.8V
Thermal Shutdown Hysteresis
ΔTSD
—
10
—
°C
IOUT = 100 µA, VOUT = 1.8V,
VIN = 2.8V
Note 1:
2:
3:
4:
5:
6:
7:
Conditions
The minimum VIN must meet two conditions: VIN ≥ 2.1V and VIN ≥ VOUT(MAX) + VDROPOUT(MAX).
VR is the nominal regulator output voltage for the fixed cases. VR = 1.2V, 1.8V, etc. VR is the desired set point output
voltage for the adjustable cases. VR = VADJ * ((R1/R2)+1). Figure 4-1.
TCVOUT = (VOUT-HIGH – VOUT-LOW) *106 / (VR * ΔTemperature). VOUT-HIGH is the highest voltage measured over the
temperature range. VOUT-LOW is the lowest voltage measured over the temperature range.
Load regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is
tested over a load range from 1 mA to the maximum specified output current.
Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its
nominal value that was measured with an input voltage of VIN = VOUT(MAX) + VDROPOUT(MAX).
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air. (i.e., TA, TJ, θJA). Exceeding the maximum allowable power
dissipation will cause the device operating junction temperature to exceed the maximum +150°C rating. Sustained
junction temperatures above 150°C can impact device reliability.
The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the
desired junction temperature. The test time is small enough such that the rise in the junction temperature over the
ambient temperature is not significant.
© 2008 Microchip Technology Inc.
DS22056B-page 9
MCP1825/MCP1825S
TEMPERATURE SPECIFICATIONS
Parameters
Sym
Min
Typ
Max
Units
Conditions
TJ
-40
—
+125
°C
Steady State
Transient
Temperature Ranges
Operating Junction Temperature Range
Maximum Junction Temperature
TJ
—
—
+150
°C
Storage Temperature Range
TA
-65
—
+150
°C
θJA
—
31.4
—
°C/W
θJC
—
3.0
—
4-Layer JC51 Standard
Board
θJA
—
29.4
—
°C/W
θJC
—
2.0
—
4-Layer JC51 Standard
Board
θJA
—
62
—
°C/W
θJC
—
15.0
—
EIA/JEDEC JESD51-751-7
4 Layer Board
θJA
—
31.2
—
°C/W
θJC
—
3.0
—
4-Layer JC51 Standard
Board
θJA
—
29.3
—
°C/W
θJC
—
2.0
—
4-Layer JC51 Standard
Board
θJA
—
62
—
°C/W
θJC
—
15.0
—
EIA/JEDEC JESD51-751-7
4 Layer Board
Thermal Package Resistances
Thermal Resistance, 3LD DDPAK
Thermal Resistance, 3LD TO-220
Thermal Resistance, 3LD SOT-223
Thermal Resistance, 5LD DDPAK
Thermal Resistance, 5LD TO-220
Thermal Resistance, 5LD SOT-223
DS22056B-page 10
© 2008 Microchip Technology Inc.
MCP1825/MCP1825S
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, COUT = 4.7 µF Ceramic (X7R), CIN = 4.7 µF Ceramic (X7R), IOUT = 1 mA,
Temperature = +25°C, VIN = VOUT + 0.5V, Fixed output.
VOUT = 1.2V Adj
IOUT = 0 mA
130
Line Regulation (%/V)
Quiescent Current (μA)
140
130°C
120
90°C
110
25°C
0°C
-45°C
100
90
2
3
4
5
6
0.10
0.09
0.08
0.07
0.06
0.05
0.04
0.03
0.02
0.01
0.00
IOUT = 50 mA
IOUT=100 mA
-45
-20
5
0.20
Load Regulation (%)
Ground Current (μA)
55
80
105
130
FIGURE 2-4:
Line Regulation vs.
Temperature (Adjustable Version).
VOUT = 1.2V Adj
VIN=5.0V
VIN=3.3V
VIN=2.5V
IOUT = 1.0 mA to 500 mA
0.15
VOUT = 3.3V
0.10
0.05
VOUT = 1.8V
0.00
VOUT = 0.8V
-0.05
VOUT = 5.0V
-0.10
-0.15
0
100
200
300
400
500
600
-45
-20
5
Load Current (mA)
170
VIN=6.0V
VIN=5.0V
120
110
VIN=4.0V
100
VIN=2.1V
90
-45
-20
5
VIN=3.0V
30
55
105
130
VOUT = 1.8V
IOUT = 1.0 mA
0.4105
0.4100
VIN = 6.0V
0.4095
0.4090
0.4085
VIN = 4.0V
0.4080
0.4075
VIN = 2.3V
0.4070
80
105
Temperature (°C)
FIGURE 2-3:
Quiescent Current vs.
Junction Temperature (Adjustable Version).
© 2008 Microchip Technology Inc.
80
FIGURE 2-5:
Load Regulation vs.
Temperature (Adjustable Version).
Adjust Pin Voltage (V)
150
140
55
0.4110
VOUT = 1.2V Adj
IOUT = 0 mA
160
30
Temperature (°C)
FIGURE 2-2:
Ground Current vs. Load
Current (Adjustable Version).
Quiescent Current (μA)
30
Temperature (°C)
FIGURE 2-1:
Quiescent Current vs. Input
Voltage (Adjustable Version).
130
IOUT=500 mA
IOUT=250 mA
Input Voltage (V)
200
190
180
170
160
150
140
130
120
110
100
VOUT = 1.2V adj
VIN = 2.1V to 6.0V
IOUT = 1 mA
130
-45
-20
5
30
55
80
105
130
Temperature (°C)
FIGURE 2-6:
Adjust Pin Voltage vs.
Temperature (Adjustable Version).
DS22056B-page 11
MCP1825/MCP1825S
0.30
160
0.25
150
Quiescent Current (μA)
Dropout Voltage (V)
Note: Unless otherwise indicated, COUT = 4.7 µF Ceramic (X7R), CIN = 4.7 µF Ceramic (X7R), IOUT = 1 mA,
Temperature = +25°C, VIN = VOUT + 0.5V, Fixed output.
VOUT = 5.0V Adj
0.20
0.15
VOUT = 2.5V Adj
0.10
0.05
0.00
VOUT = 0.8V
IOUT = 0 mA
140
+130°C
130
+90°C
+25°C
120
0°C
110
-45°C
100
90
0
50 100 150 200 250 300 350 400 450 500
2
3
4
Load Current (mA)
FIGURE 2-7:
Dropout Voltage vs. Load
Current (Adjustable Version).
FIGURE 2-10:
Voltage.
0.28
VOUT = 5.0V Adj
0.26
VOUT = 3.3V Adj
0.24
VOUT = 2.5V Adj
0.22
0.20
VOUT = 2.5V
IOUT = 0 mA
140
130
+130°C
120
+90°C
110
+25°C
+0°C
-45°C
100
90
-45
-20
5
30
55
80
105
130
3
3.5
Temperature (°C)
170
FIGURE 2-11:
Voltage.
VIN = 6.0V
140
VIN = 5.0V
130
120
110
Ground Current (μA)
150
VIN = 3.0V
4.5
5
5.5
6
Quiescent Current vs. Input
250
VOUT = 2.5V Fixed
160
4
Input Voltage (V)
FIGURE 2-8:
Dropout Voltage vs.
Temperature (Adjustable Version).
Power Good Time Delay (µS)
6
Quiescent Current vs. Input
150
IOUT = 500 mA
Quiescent Current (μA)
Dropout Voltage (V)
0.30
5
Input Voltage (V)
VIN = 4.0V
100
VIN = 2.3V for VR=0.8V
VIN = 3.0V for VR=2.5V
200
VOUT=2.5V
150
100
VOUT=0.8V
50
0
-45
-20
5
30
55
80
105
130
0
100
Temperature (°C)
FIGURE 2-9:
Power Good (PWRGD)
Time Delay vs. Temperature.
DS22056B-page 12
200
300
400
500
600
Load Current (mA)
FIGURE 2-12:
Current.
Ground Current vs. Load
© 2008 Microchip Technology Inc.
MCP1825/MCP1825S
Note: Unless otherwise indicated, COUT = 4.7 µF Ceramic (X7R), CIN = 4.7 µF Ceramic (X7R), IOUT = 1 mA,
Temperature = +25°C, VIN = VOUT + 0.5V, Fixed output.
0.045
IOUT = 0 mA
135
Line Regulation (%/V)
Quiescent Current (μA)
140
130
125
VOUT = 5V
120
115
110
VOUT = 2.5V
105
VOUT = 0.8V
100
95
VR = 2.5V
VIN = 3.1V to 6.0V
IOUT = 1 mA
0.040
0.035
IOUT = 50 mA
0.030
IOUT = 100 mA
0.025
0.020
IOUT = 250 mA
IOUT = 500 mA
0.015
-45
-20
5
30
55
80
105
130
-45
-20
5
Temperature (°C)
FIGURE 2-13:
Temperature.
FIGURE 2-16:
Temperature.
Quiescent Current vs.
Load Regulation (%)
Ishdn (μA)
VIN = 6.0V
VIN = 5.0V
VIN = 4.0V
VIN = 2.3V
0.10
0.05
0.00
0.15
VIN = 5.0V
VIN = 4.0V
-20
5
30
55
80
105
VOUT = 0.8V
IOUT = 1 mA to 500 mA
VIN = 2.1V
-0.05
VIN = 6.0V
-0.15
-45
130
-20
5
30
55
80
105
130
Temperature (°C)
FIGURE 2-17:
Load Regulation vs.
Temperature (VOUT < 2.5V Fixed).
ISHDN vs. Temperature.
FIGURE 2-14:
0.09
0.00
VOUT = 0.8V
VIN = 2.1V to 6.0V
IOUT = 1 mA
0.08
0.07
IOUT = 50 mA
IOUT = 100 mA
0.05
IOUT = 250 mA
0.03
IOUT = 500 mA
0.02
-45
-20
5
30
55
80
Line Regulation vs.
© 2008 Microchip Technology Inc.
VOUT = 2.5V
-0.10
-0.15
-0.20
VOUT = 5.0V
-0.25
-0.30
-0.35
105
Temperature (°C)
FIGURE 2-15:
Temperature.
IOUT = 1 mA to 500 mA
-0.05
Load Regulation (%)
Line Regulation (%/V)
130
0.05
Temperature (°C)
0.04
105
-0.25
-45
0.06
80
Line Regulation vs.
0.25
VR = 0.8V
0.25
0.15
55
Temperature (°C)
0.30
0.20
30
130
-45
-20
5
30
55
80
105
130
Temperature (°C)
FIGURE 2-18:
Load Regulation vs.
Temperature (VOUT ≥ 2.5V Fixed).
DS22056B-page 13
MCP1825/MCP1825S
Note: Unless otherwise indicated, COUT = 4.7 µF Ceramic (X7R), CIN = 4.7 µF Ceramic (X7R), IOUT = 1 mA,
Temperature = +25°C, VIN = VOUT + 0.5V, Fixed output.
10
0.25
Noise (mV/ √Hz)
Dropout Voltage (V)
0.30
VOUT = 5.0V
0.20
0.15
VOUT = 2.5V
0.10
VR=2.5V, VIN=3.3V
1
IOUT=200 mA
VR=0.8V, VIN=2.3V
0.1
0.05
0.01
0.01
0.00
0
100
200
300
400
500
0.1
Load Current (mA)
FIGURE 2-19:
Current.
Dropout Voltage vs. Load
1
10
Frequency (kHz)
100
1000
FIGURE 2-22:
Output Noise Voltage
Density vs. Frequency.
0.0
IOUT = 500 mA
-10.0
0.28
-20.0
0.26
PSRR (dB)
Dropout Voltage (V)
0.30
VOUT = 5.0V
0.24
0.22
-30.0
-40.0
VR=1.2V Adj
COUT=10 μF ceramic X7R
VIN=2.5V
CIN=0 μF
IOUT=10 mA
-50.0
-60.0
0.20
-70.0
VOUT = 2.5V
0.18
-45
-20
5
30
55
80
105
-80.0
0.01
130
0.1
Temperature (°C)
FIGURE 2-20:
Temperature.
Dropout Voltage vs.
0.80
VOUT = 2.5V
0.70
0.60
0.50
0.40
0.30
0.20
0.10
0.00
0.00
1.00
2.00
3.00
4.00
5.00
6.00
Input Voltage (V)
FIGURE 2-21:
Input Voltage.
DS22056B-page 14
Short Circuit Current vs.
1
10
Frequency (kHz)
100
1000
FIGURE 2-23:
Power Supply Ripple
Rejection (PSRR) vs. Frequency (Adj.).
PSRR (dB)
Short Circuit Current (A)
COUT=1 μF cer
CIN=10 μF cer
0.0
-10.0
-20.0
-30.0
-40.0
-50.0
-60.0
-70.0
-80.0
-90.0
0.01
VR=2.5V (Fixed)
COUT=22 μF ceramic X7R
VIN=3.3V
CIN=0 μF
IOUT=10 mA
0.1
1
10
Frequency (kHz)
100
1000
FIGURE 2-24:
Power Supply Ripple
Rejection (PSRR) vs. Frequency.
© 2008 Microchip Technology Inc.
MCP1825/MCP1825S
Note: Unless otherwise indicated, COUT = 4.7 µF Ceramic (X7R), CIN = 4.7 µF Ceramic (X7R), IOUT = 1 mA,
Temperature = +25°C, VIN = VOUT + 0.5V, Fixed output.
FIGURE 2-25:
2.5V (Adj.) Startup from VIN.
FIGURE 2-28:
FIGURE 2-26:
Shutdown.
2.5V (Adj.) Startup from
FIGURE 2-29:
Dynamic Load Response
(1 mA to 500 mA).
FIGURE 2-27:
Timing.
Power Good (PWRGD)
FIGURE 2-30:
Dynamic Load Response
(10 mA to 500 mA).
© 2008 Microchip Technology Inc.
Dynamic Line Response.
DS22056B-page 15
MCP1825/MCP1825S
3.0
PIN DESCRIPTION
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
3-Pin Fixed
Output
5-Pin Fixed
Output
Adjustable
Output
Name
Description
—
1
1
SHDN
Shutdown Control Input (active-low)
1
2
2
VIN
2
3
3
GND
Ground
3
4
4
VOUT
Regulated Output Voltage
—
5
—
PWRGD
—
—
5
ADJ
Voltage Adjust/Sense Input
EP
Exposed Pad of the Package (ground potential)
Exposed Pad Exposed Pad Exposed Pad
3.1
Shutdown Control Input (SHDN)
Input Voltage Supply
Power Good Output
3.5
Power Good Output (PWRGD)
The SHDN input is used to turn the LDO output voltage
on and off. When the SHDN input is at a logic-high
level, the LDO output voltage is enabled. When the
SHDN input is pulled to a logic-low level, the LDO
output voltage is disabled. When the SHDN input is
pulled low, the PWRGD output also goes low and the
LDO enters a low quiescent current shutdown state
where the typical quiescent current is 0.1 µA.
The PWRGD output is an open-drain output used to
indicate when the LDO output voltage is within 92%
(typically) of its nominal regulation value. The PWRGD
threshold has a typical hysteresis value of 2%. The
PWRGD output is delayed by 110 µs (typical) from the
time the LDO output is within 92% + 3% (maximum
hysteresis) of the regulated output value on power-up.
This delay time is internally fixed.
3.2
3.6
Input Voltage Supply (VIN)
Output Voltage Adjust Input (ADJ)
Connect the unregulated or regulated input voltage
source to VIN. If the input voltage source is located
several inches away from the LDO, or the input source
is a battery, it is recommended that an input capacitor
be used. A typical input capacitance value of 1 µF to
10 µF should be sufficient for most applications.
For adjustable applications, the output voltage is
connected to the ADJ input through a resistor divider
that sets the output voltage regulation value. This
provides the user the capability to set the output
voltage to any value they desire within the 0.8V to 5.0V
range of the device.
3.3
3.7
Ground (GND)
Connect the GND pin of the LDO to a quiet circuit
ground. This will help the LDO power supply rejection
ratio and noise performance. The ground pin of the
LDO only conducts the quiescent current of the LDO
(typically 120 µA), so a heavy trace is not required.
For applications that have switching or noisy inputs, tie
the GND pin to the return of the output capacitor.
Ground planes help lower inductance and voltage
spikes caused by fast transient load currents and are
recommended for applications that are subjected to
fast load transients.
3.4
Exposed Pad (EP)
The DDPAK and TO-220 package have an exposed
tab on the package. A heat sink may may be mount to
the tab to aid in the removal of heat from the package
during operation. The exposed tab is at the ground
potential of the LDO.
Regulated Output Voltage (VOUT)
The VOUT pin is the regulated output voltage of the
LDO. A minimum output capacitance of 1.0 µF is
required for LDO stability. The MCP1825/MCP1825S
is stable with ceramic, tantalum and aluminum-electrolytic capacitors. See Section 4.3 “Output Capacitor”
for output capacitor selection guidance.
DS22056B-page 16
© 2008 Microchip Technology Inc.
MCP1825/MCP1825S
4.0
DEVICE OVERVIEW
EQUATION 4-2:
The MCP1825/MCP1825S is a high output current,
Low Dropout (LDO) voltage regulator. The low dropout
voltage of 210 mV typical at 500 mA of current makes
it ideal for battery-powered applications. Unlike other
high output current LDOs, the MCP1825/MCP1825S
only draws a maximum of 220 µA of quiescent current.
The MCP1825 has a shutdown control input and a
power good output.
4.1
The 5-pin MCP1825 LDO is available with either a fixed
output voltage or an adjustable output voltage. The
output voltage range is 0.8V to 5.0V for both versions.
The 3-pin MCP1825S LDO is available as a fixed
voltage device.
4.1.1
ADJUST INPUT
The adjustable version of the MCP1825 uses the ADJ
pin (pin 5) to get the output voltage feedback for output
voltage regulation. This allows the user to set the
output voltage of the device with two external resistors.
The nominal voltage for ADJ is 0.41V.
Figure 4-1 shows the adjustable version of the
MCP1825. Resistors R1 and R2 form the resistor
divider network necessary to set the output voltage.
With this configuration, the equation for setting VOUT is:
EQUATION 4-1:
VOUT
=
LDO Output Voltage
VADJ
=
ADJ Pin Voltage
(typically 0.41V)
VOUT
R1
1 2 3 4 5
SHDN
ADJ
C2
1 µF
VIN
C1
4.7 µF
GND
R2
FIGURE 4-1:
Typical adjustable output
voltage application circuit.
The allowable resistance value range for resistor R2 is
from 10 kΩ to 200 kΩ. Solving the equation for R1
yields the following equation:
© 2008 Microchip Technology Inc.
LDO Output Voltage
VADJ
=
ADJ Pin Voltage
(typically 0.41V)
Output Current and Current
Limiting
The MCP1825/MCP1825S also incorporates an output
current limit. If the output voltage falls below 0.7V due
to an overload condition (usually represents a shorted
load condition), the output current is limited to 1.2A
(typical). If the overload condition is a soft overload, the
MCP1825/MCP1825S will supply higher load currents
of up to 1.5A. The MCP1825/MCP1825S should not be
operated in this condition continuously as it may result
in failure of the device. However, this does allow for
device usage in applications that have higher pulsed
load currents having an average output current value of
500 mA or less.
Output Capacitor
The MCP1825/MCP1825S requires a minimum output
capacitance of 1 µF for output voltage stability.
Ceramic capacitors are recommended because of their
size, cost and environmental robustness qualities.
MCP1825-ADJ
On
=
The MCP1825/MCP1825S LDO is tested and ensured
to supply a minimum of 500 mA of output current. The
MCP1825/MCP1825S has no minimum output load, so
the output load current can go to 0 mA and the LDO will
continue to regulate the output voltage to within
tolerance.
4.3
Off
VOUT
Output overload conditions may also result in an overtemperature shutdown of the device. If the junction
temperature rises above 150°C, the LDO will shut
down the output voltage. See Section 4.8 “Overtemperature Protection” for more information on
overtemperature shutdown.
R1 + R2
V OUT = V ADJ ⎛ ------------------⎞
⎝ R2 ⎠
Where:
Where:
4.2
LDO Output Voltage
V OUT – V ADJ
R 1 = R 2 ⎛ --------------------------------⎞
⎝
⎠
V ADJ
Aluminum-electrolytic and tantalum capacitors can be
used on the LDO output as well. The Equivalent Series
Resistance (ESR) of the electrolytic output capacitor
must be no greater than 1 ohm. The output capacitor
should be located as close to the LDO output as is
practical. Ceramic materials X7R and X5R have low
temperature coefficients and are well within the
acceptable ESR range required. A typical 1 µF X7R
0805 capacitor has an ESR of 50 milli-ohms.
Larger LDO output capacitors can be used with the
MCP1825/MCP1825S
to
improve
dynamic
performance and power supply ripple rejection
performance. A maximum of 22 µF is recommended.
Aluminum-electrolytic capacitors are not recommended for low temperature applications of < -25°C.
DS22056B-page 17
MCP1825/MCP1825S
4.4
Input Capacitor
Low input source impedance is necessary for the LDO
output to operate properly. When operating from
batteries, or in applications with long lead length
(> 10 inches) between the input source and the LDO,
some input capacitance is recommended. A minimum
of 1.0 µF to 4.7 µF is recommended for most
applications.
For applications that have output step load
requirements, the input capacitance of the LDO is very
important. The input capacitance provides the LDO
with a good local low-impedance source to pull the
transient currents from in order to respond quickly to
the output load step. For good step response
performance, the input capacitor should be of
equivalent (or higher) value than the output capacitor.
The capacitor should be placed as close to the input of
the LDO as is practical. Larger input capacitors will also
help reduce any high-frequency noise on the input and
output of the LDO and reduce the effects of any
inductance that exists between the input source
voltage and the input capacitance of the LDO.
4.5
Power Good Output (PWRGD)
The PWRGD output is used to indicate when the output
voltage of the LDO is within 92% (typical value, see
Section 1.0 “Electrical Characteristics” for Minimum
and Maximum specifications) of its nominal regulation
value.
As the output voltage of the LDO rises, the PWRGD
output will be held low until the output voltage has
exceeded the power good threshold plus the hysteresis
value. Once this threshold has been exceeded, the
power good time delay is started (shown as TPG in the
Electrical Characteristics table). The power good time
delay is fixed at 110 µs (typical). After the time delay
period, the PWRGD output will go high, indicating that
the output voltage is stable and within regulation limits.
If the output voltage of the LDO falls below the power
good threshold, the power good output will transition
low. The power good circuitry has a 170 µs delay when
detecting a falling output voltage, which helps to
increase noise immunity of the power good output and
avoid false triggering of the power good output during
fast output transients. See Figure 4-2 for power good
timing characteristics.
When the LDO is put into Shutdown mode using the
SHDN input, the power good output is pulled low
immediately, indicating that the output voltage will be
out of regulation. The timing diagram for the power
good output when using the shutdown input is shown in
Figure 4-3.
DS22056B-page 18
The power good output is an open-drain output that can
be pulled up to any voltage that is equal to or less than
the LDO input voltage. This output is capable of sinking
1.2 mA (VPWRGD < 0.4V maximum).
VPWRGD_TH
VOUT
TPG
VOH
TVDET_PWRG
PWRGD
VOL
FIGURE 4-2:
VIN
Power Good Timing.
TOR
30 µs
70 µs
TPG
SHDN
VOUT
PWRGD
FIGURE 4-3:
Shutdown.
4.6
Power Good Timing from
Shutdown Input (SHDN)
The SHDN input is an active-low input signal that turns
the LDO on and off. The SHDN threshold is a
percentage of the input voltage. The typical value of
this shutdown threshold is 30% of VIN, with minimum
and maximum limits over the entire operating
temperature range of 45% and 15%, respectively.
The SHDN input will ignore low-going pulses (pulses
meant to shut down the LDO) that are up to 400 ns in
pulse width. If the shutdown input is pulled low for more
than 400 ns, the LDO will enter Shutdown mode. This
small bit of filtering helps to reject any system noise
spikes on the shutdown input signal.
© 2008 Microchip Technology Inc.
MCP1825/MCP1825S
On the rising edge of the SHDN input, the shutdown
circuitry has a 30 µs delay before allowing the LDO
output to turn on. This delay helps to reject any false
turn-on signals or noise on the SHDN input signal. After
the 30 µs delay, the LDO output enters its soft-start
period as it rises from 0V to its final regulation value. If
the SHDN input signal is pulled low during the 30 µs
delay period, the timer will be reset and the delay time
will start over again on the next rising edge of the
SHDN input. The total time from the SHDN input going
high (turn-on) to the LDO output being in regulation is
typically 100 µs. See Figure 4-4 for a timing diagram of
the SHDN input.
TOR
400 ns (typ)
30 µs
70 µs
SHDN
Dropout Voltage and
Undervoltage Lockout
Dropout voltage is defined as the input-to-output
voltage differential at which the output voltage drops
2% below the nominal value that was measured with a
VR + 0.5V differential applied. The MCP1825/
MCP1825S LDO has a very low dropout voltage
specification of 210 mV (typical) at 500 mA of output
current. See Section 1.0 “Electrical Characteristics”
for maximum dropout voltage specifications.
The MCP1825/MCP1825S LDO operates across an
input voltage range of 2.1V to 6.0V and incorporates
input Undervoltage Lockout (UVLO) circuitry that
keeps the LDO output voltage off until the input voltage
reaches a minimum of 2.00V (typical) on the rising
edge of the input voltage. As the input voltage falls, the
LDO output will remain on until the input voltage level
reaches 1.82V (typical).
Since the MCP1825/MCP1825S LDO undervoltage
lockout activates at 1.82V as the input voltage is falling,
the dropout voltage specification does not apply for
output voltages that are less than 1.8V.
VOUT
FIGURE 4-4:
Diagram.
4.7
Shutdown Input Timing
For high-current applications, voltage drops across the
PCB traces must be taken into account. The trace
resistances can cause significant voltage drops
between the input voltage source and the LDO. For
applications with input voltages near 2.1V, these PCB
trace voltage drops can sometimes lower the input
voltage enough to trigger a shutdown due to
undervoltage lockout.
4.8
Overtemperature Protection
The MCP1825/MCP1825S LDO has temperaturesensing circuitry to prevent the junction temperature
from exceeding approximately 150°C. If the LDO
junction temperature does reach 150°C, the LDO
output will be turned off until the junction temperature
cools to approximately 140°C, at which point the LDO
output will automatically resume normal operation. If
the internal power dissipation continues to be
excessive, the device will again shut off. The junction
temperature of the die is a function of power
dissipation, ambient temperature and package thermal
resistance. See Section 5.0 “Application Circuits/
Issues” for more information on LDO power
dissipation and junction temperature.
© 2008 Microchip Technology Inc.
DS22056B-page 19
MCP1825/MCP1825S
5.0
APPLICATION CIRCUITS/
ISSUES
5.1
Typical Application
In addition to the LDO pass element power dissipation,
there is power dissipation within the MCP1825/
MCP1825S as a result of quiescent or ground current.
The power dissipation as a result of the ground current
can be calculated using the following equation:
The MCP1825/MCP1825S is used for applications that
require high LDO output current and a power good
output.
EQUATION 5-2:
P I ( GND ) = V IN ( MAX ) × I VIN
Where:
VOUT = 2.5V @ 500 mA
MCP1825-2.5
On
Off
1 2 3 4 5
SHDN
R1
10 kΩ
C2
10 µF
VIN
3.3V
PI(GND
=
Power dissipation due to the
quiescent current of the LDO
VIN(MAX)
=
Maximum input voltage
IVIN
=
Current flowing in the VIN pin
with no LDO output current
(LDO quiescent current)
C1
4.7 µF
PWRGD
GND
FIGURE 5-1:
5.1.1
Typical Application Circuit.
APPLICATION CONDITIONS
Package Type
=
TO-220-5
Input Voltage Range
=
3.3V ± 5%
VIN maximum
=
3.465V
VIN minimum
=
3.135V
VDROPOUT (max)
=
0.350V
VOUT (typical)
=
2.5V
IOUT
=
500 mA maximum
PDISS (typical)
=
0.483W
Temperature Rise
=
14.2°C
5.2
Power Calculations
5.2.1
POWER DISSIPATION
The internal power dissipation within the MCP1825/
MCP1825S is a function of input voltage, output
voltage, output current and quiescent current.
Equation 5-1 can be used to calculate the internal
power dissipation for the LDO.
EQUATION 5-1:
P LDO = ( V IN ( MAX ) ) – V OUT ( MIN ) ) × I OUT ( MAX ) )
The total power dissipated within the MCP1825/
MCP1825S is the sum of the power dissipated in the
LDO pass device and the P(IGND) term. Because of the
CMOS construction, the typical IGND for the MCP1825/
MCP1825S is 120 µA. Operating at a maximum VIN of
3.465V results in a power dissipation of 0.12 milli-Watts
for a 2.5V output. For most applications, this is small
compared to the LDO pass device power dissipation
and can be neglected.
The maximum continuous operating junction
temperature specified for the MCP1825/MCP1825S is
+125°C. To estimate the internal junction temperature
of the MCP1825/MCP1825S, the total internal power
dissipation is multiplied by the thermal resistance from
junction to ambient (RθJA) of the device. The thermal
resistance from junction to ambient for the TO-220-5
package is estimated at 29.3°C/W.
EQUATION 5-3:
T J ( MAX ) = P TOTAL × Rθ JA + T AMAX
TJ(MAX) = Maximum continuous junction
temperature
PTOTAL = Total device power dissipation
RθJA = Thermal resistance from junction to
ambient
TAMAX = Maximum ambient temperature
Where:
PLDO
=
LDO Pass device internal
power dissipation
VIN(MAX)
=
Maximum input voltage
VOUT(MIN)
=
LDO minimum output voltage
DS22056B-page 20
© 2008 Microchip Technology Inc.
MCP1825/MCP1825S
The maximum power dissipation capability for a
package can be calculated given the junction-toambient thermal resistance and the maximum ambient
temperature for the application. Equation 5-4 can be
used to determine the package maximum internal
power dissipation.
EQUATION 5-4:
P D ( MAX )
( T J ( MAX ) – T A ( MAX ) )
= --------------------------------------------------Rθ JA
5.3
Typical Application
Internal power dissipation, junction temperature rise,
junction temperature and maximum power dissipation
is calculated in the following example. The power
dissipation as a result of ground current is small
enough to be neglected.
5.3.1
POWER DISSIPATION EXAMPLE
Package
Package Type = TO-220-5
PD(MAX) = Maximum device power dissipation
TJ(MAX) = maximum continuous junction
temperature
TA(MAX) = maximum ambient temperature
Input Voltage
VIN = 3.3V ± 5%
LDO Output Voltage and Current
VOUT = 2.5V
RθJA = Thermal resistance from junction-toambient
IOUT = 500 mA
Maximum Ambient Temperature
EQUATION 5-5:
T J ( RISE ) = P D ( MAX ) × Rθ JA
TA(MAX) = 60°C
Internal Power Dissipation
PLDO(MAX) = (VIN(MAX) – VOUT(MIN)) x IOUT(MAX)
TJ(RISE) = Rise in device junction temperature
over the ambient temperature
PLDO = ((3.3V x 1.05) – (2.5V x 0.975))
x 500 mA
PD(MAX) = Maximum device power dissipation
PLDO = 0.514 Watts
RθJA = Thermal resistance from junction-toambient
EQUATION 5-6:
T J = T J ( RISE ) + T A
TJ = Junction temperature
TJ(RISE) = Rise in device junction temperature
over the ambient temperature
TA = Ambient temperature
5.3.1.1
Device Junction Temperature Rise
The internal junction temperature rise is a function of
internal power dissipation and the thermal resistance
from junction-to-ambient for the application. The
thermal resistance from junction-to-ambient (RθJA) is
derived from EIA/JEDEC standards for measuring
thermal resistance. The EIA/JEDEC specification is
JESD51. The standard describes the test method and
board specifications for measuring the thermal
resistance from junction to ambient. The actual thermal
resistance for a particular application can vary
depending on many factors such as copper area and
thickness. Refer to AN792, “A Method to Determine
How Much Power a SOT23 Can Dissipate in an
Application” (DS00792), for more information regarding
this subject.
TJ(RISE) = PTOTAL x RθJA
TJRISE = 0.514 W x 29.3° C/W
TJRISE = 15.06°C
© 2008 Microchip Technology Inc.
DS22056B-page 21
MCP1825/MCP1825S
5.3.1.2
Junction Temperature Estimate
To estimate the internal junction temperature, the
calculated temperature rise is added to the ambient or
offset temperature. For this example, the worst-case
junction temperature is estimated below:
TJ = TJRISE + TA(MAX)
TJ = 15.06°C + 60.0°C
TJ = 75.06°C
5.3.1.3
Maximum Package Power
Dissipation at 60°C Ambient
Temperature
TO-220-5 (29.3°C/W RθJA):
PD(MAX) = (125°C – 60°C) / 29.3°C/W
PD(MAX) = 2.218W
DDPAK-5 (31.2°C/Watt RθJA):
PD(MAX) = (125°C – 60°C)/ 31.2°C/W
PD(MAX) = 2.083W
From this table, you can see the difference in maximum
allowable power dissipation between the TO-220-5
package and the DDPAK-5 package.
DS22056B-page 22
© 2008 Microchip Technology Inc.
MCP1825/MCP1825S
6.0
PACKAGING INFORMATION
6.1
Package Marking Information
3-Lead DDPAK (MCP1825S)
MCP1825S
08EEB e3
0710256
XXXXXXXXX
XXXXXXXXX
YYWWNNN
1
2
Example:
3
1
3-Lead SOT-223 (MCP1825S)
3
Example:
XXXXXXX
XXXYYWW
NNN
1825S08
EDB0710
256
3-Lead TO-220 (MCP1825S)
Example:
XXXXXXXXX
XXXXXXXXX
YYWWNNN
MCP1825S
12EAB e3
0710256
1
1
2
3
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
2
2
3
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
© 2008 Microchip Technology Inc.
DS22056B-page 23
MCP1825/MCP1825S
Package Marking Information (Continued)
5-Lead DDPAK (MCP1825)
XXXXXXXXX
XXXXXXXXX
YYWWNNN
MCP1825
12EET e3
0710256
1 2 3 4 5
1 2 3 4 5
5-Lead SOT-223 (MCP1825)
XXXXXXX
XXXYYWW
NNN
5-Lead TO-220 (MCP1825)
1825-08
EDC0710
256
Example:
MCP1825
e3
08EAT^^
0710256
1 2 3 4 5
1 2 3 4 5
e3
*
DS22056B-page 24
Example:
XXXXXXXXX
XXXXXXXXX
YYWWNNN
Legend: XX...X
Y
YY
WW
NNN
Note:
Example:
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
© 2008 Microchip Technology Inc.
MCP1825/MCP1825S
3-Lead Plastic (EB) [DDPAK]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E
E1
L1
D1
D
H
1
N
b
e
BOTTOM VIEW
TOP VIEW
b1
CHAMFER
OPTIONAL
A
C2
φ
c
A1
L
Units
Dimension Limits
Number of Pins
INCHES
MIN
N
NOM
MAX
3
Pitch
e
Overall Height
A
.160
.100 BSC
–
.190
Standoff §
A1
.000
–
.010
Overall Width
E
.380
–
.420
Exposed Pad Width
E1
.245
–
–
Molded Package Length
D
.330
–
.380
Overall Length
H
.549
–
.625
Exposed Pad Length
D1
.270
–
–
Lead Thickness
c
.014
–
.029
Pad Thickness
C2
.045
–
.065
Lower Lead Width
b
.020
–
.039
Upper Lead Width
b1
.045
–
.070
Foot Length
L
.068
–
.110
Pad Length
L1
–
–
.067
Foot Angle
φ
0°
–
8°
Notes:
1. § Significant Characteristic.
2. Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-011B
© 2008 Microchip Technology Inc.
DS22056B-page 25
MCP1825/MCP1825S
3-Lead Plastic Small Outline Transistor (DB) [SOT-223]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
b2
E1
E
3
2
1
e
e1
A2
A
b
c
φ
L
A1
Units
Dimension Limits
Number of Leads
MILLIMETERS
MIN
NOM
MAX
N
3
Lead Pitch
e
2.30 BSC
Outside Lead Pitch
e1
Overall Height
A
–
–
1.80
Standoff
A1
0.02
–
0.10
Molded Package Height
A2
1.50
1.60
1.70
Overall Width
E
6.70
7.00
7.30
Molded Package Width
E1
3.30
3.50
3.70
Overall Length
D
6.30
6.50
6.70
Lead Thickness
c
0.23
0.30
0.35
Lead Width
b
0.60
0.76
0.84
Tab Lead Width
b2
2.90
3.00
3.10
Foot Length
L
0.75
–
–
Lead Angle
φ
0°
–
10°
4.60 BSC
Notes:
1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side.
2. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-032B
DS22056B-page 26
© 2008 Microchip Technology Inc.
MCP1825/MCP1825S
/HDG3ODVWLF6PDOO2XWOLQH7UDQVLVWRU'%>[email protected]
1RWH
)RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW
KWWSZZZPLFURFKLSFRPSDFNDJLQJ
© 2008 Microchip Technology Inc.
DS22056B-page 27
MCP1825/MCP1825S
3-Lead Plastic Transistor Outline (AB) [TO-220]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
CHAMFER
OPTIONAL
φP
E
A
A1
Q
H1
D
D1
L1
L
b2
1
2
N
b
c
e
A2
e1
Units
Dimension Limits
Number of Pins
INCHES
MIN
N
NOM
MAX
3
Pitch
e
.100 BSC
Overall Pin Pitch
e1
.200 BSC
Overall Height
A
.140
–
.190
Tab Thickness
A1
.020
–
.055
Base to Lead
A2
.080
–
.115
Overall Width
E
.357
–
.420
Mounting Hole Center
Q
.100
–
.120
Overall Length
D
.560
–
.650
Molded Package Length
D1
.330
–
.355
Tab Length
H1
.230
–
.270
Mounting Hole Diameter
.156
φP
.139
–
Lead Length
L
.500
–
.580
Lead Shoulder
L1
–
–
.250
Lead Thickness
c
.012
–
.024
Lead Width
b
.015
.027
.040
Shoulder Width
b2
.045
.057
.070
Notes:
1. Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" per side.
2. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-034B
DS22056B-page 28
© 2008 Microchip Technology Inc.
MCP1825/MCP1825S
5-Lead Plastic (ET) [DDPAK]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E
E1
L1
D1
D
H
1
N
b
BOTTOM VIEW
e
TOP VIEW
CHAMFER
OPTIONAL
C2
A
φ
c
A1
L
Units
Dimension Limits
Number of Pins
INCHES
MIN
N
NOM
MAX
5
Pitch
e
Overall Height
A
.160
–
.190
Standoff §
A1
.000
–
.010
Overall Width
E
.380
–
.420
Exposed Pad Width
E1
.245
–
–
Molded Package Length
D
.330
–
.380
Overall Length
H
.549
–
.625
Exposed Pad Length
D1
.270
–
–
Lead Thickness
c
.014
–
.029
Pad Thickness
C2
.045
–
.065
b
.020
–
.039
Foot Length
L
.068
–
.110
Pad Length
L1
–
–
.067
Lead Width
.067 BSC
Foot Angle
φ
0°
–
8°
Notes:
1. § Significant Characteristic.
2. Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-012B
© 2008 Microchip Technology Inc.
DS22056B-page 29
MCP1825/MCP1825S
/HDG3ODVWLF6PDOO2XWOLQH7UDQVLVWRU'&>[email protected]
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KWWSZZZPLFURFKLSFRPSDFNDJLQJ
D
b2
E
E1
2
1
3
4
N
e
e1
A2
A
b
c
φ
L
A1
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0LFURFKLS 7HFKQRORJ\ 'UDZLQJ &%
DS22056B-page 30
© 2008 Microchip Technology Inc.
MCP1825/MCP1825S
/HDG3ODVWLF6PDOO2XWOLQH7UDQVLVWRU'&>[email protected]
1RWH
)RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW
KWWSZZZPLFURFKLSFRPSDFNDJLQJ
© 2008 Microchip Technology Inc.
DS22056B-page 31
MCP1825/MCP1825S
5-Lead Plastic Transistor Outline (AT) [TO-220]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A
E
φP
CHAMFER
OPTIONAL
A1
Q
H1
D
D1
L
1
N
2 3
e
b
e1
c
A2
Units
Dimension Limits
Number of Pins
INCHES
MIN
N
NOM
MAX
5
Pitch
e
.067 BSC
Overall Pin Pitch
e1
.268 BSC
Overall Height
A
.140
–
Overall Width
E
.380
–
.420
Overall Length
D
.560
–
.650
.190
Molded Package Length
D1
.330
–
.355
Tab Length
H1
.204
–
.293
Tab Thickness
A1
.020
–
.055
Mounting Hole Center
Q
.100
–
.120
Mounting Hole Diameter
φP
.139
–
.156
L
.482
–
.590
A2
.080
–
.115
c
.012
–
.025
Lead Length
Base to Bottom of Lead
Lead Thickness
Lead Width
b
.015
.027
.040
Notes:
1. Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" per side.
2. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-036B
DS22056B-page 32
© 2008 Microchip Technology Inc.
MCP1825/MCP1825S
APPENDIX A:
REVISION HISTORY
Revision B (February 2008)
The following is the list of modifications
1.
2.
3.
Updated Figure 2-4, Figure 2-5, Figure 2-16,
Figure 2-29, and Figure 2-30.
Updated package outline drawings and landing
pattern drawings to Section 6.0 “Packaging
Information”.
Updated Appendix A: “Revision History”.
Revision A (August 2007)
• Original Release of this Document.
© 2008 Microchip Technology Inc.
DS22056B-page 33
MCP1825/MCP1825S
NOTES:
DS22056B-page 34
© 2008 Microchip Technology Inc.
MCP1825/MCP1825S
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
XX
X
X
X/
XX
Output Feature Tolerance Temp. Package
Voltage Code
Device:
MCP1825: 500 mA Low Dropout Regulator
MCP1825T: 500 mA Low Dropout Regulator
Tape and Reel
MCP1825S: 500 mA Low Dropout Regulator
MCP1825ST: 500 mA Low Dropout Regulator
Tape and Reel
Output Voltage *:
08
12
18
25
30
33
50
ADJ
=
=
=
=
=
=
=
=
0.8V “Standard”
1.2V “Standard”
1.8V “Standard”
2.5V “Standard”
3.0V “Standard”
3.3V “Standard”
5.0V “Standard”
Adjustable Output Voltage ** (MCP1825 Only)
*Contact factory for other output voltage options
** When ADJ is used, the “extra feature code” and
“tolerance” columns do not apply. Refer to examples.
Extra Feature Code:
0
= Fixed
Tolerance:
2
= 2.5% (Standard)
Temperature:
E
= -40°C to +125°C
Package Type:
AB
AT
EB
ET
DB
DC
=
=
=
=
=
=
Examples:
a)
b)
c)
d)
e)
f)
g)
h)
MCP1825-0802E/XX:
MCP1825-1202E/XX:
MCP1825-1802E/XX:
MCP1825-2502E/XX:
MCP1825-3002E/XX:
MCP1825-3302E/XX:
MCP1825-5002E/XX:
MCP1825-ADJE/XX:
0.8V LDO Regulator
1.2V LDO Regulator
1.8V LDO Regulator
2.5V LDO Regulator
3.0V LDO Regulator
3.3V LDO Regulator
5.0V LDO Regulator
ADJ LDO Regulator
a)
b)
c)
d)
e)
f)
g)
MCP1825S-0802E/YY:0.8V LDO Regulator
MCP1825S-1202E/YY:1.2V LDO Regulator
MCP1825S-1802E/YY:1.8V LDO Regulator
MCP1825S-2502E/YY:2.5V LDO Regulator
MCP1825S-2502E/YY:3.0V LDO Regulator
MCP1825S-3302E/YY:3.3V LDO Regulator
MCP1825S-5002E/YY:5.0V LDO Regulator
XX =
=
=
AT for 5LD TO-220 package
DC for 5LD SOT-223 package
ET for 5LD DDPAK package
YY =
=
=
AB for 3LD TO-220 package
DB for 3LD SOT-223 package
EB for 3LD DDPAK package
Plastic Transistor Outline, TO-220, 3-lead
Plastic Transistor Outline, TO-220, 5-lead
Plastic, DDPAK, 3-lead
Plastic, DDPAK, 5-lead
Plastic Small Transistor Outline, SOT-223, 3-lead
Plastic Small Transistor Outline, SOT-223, 5-lead
Note: ADJ (Adjustable) only available in 5-lead version.
© 2008 Microchip Technology Inc.
DS22056B-page 35
MCP1825/MCP1825S
NOTES:
DS22056B-page 36
© 2008 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PRO MATE, rfPIC and SmartShunt are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
FilterLab, Linear Active Thermistor, MXDEV, MXLAB,
SEEVAL, SmartSensor and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, In-Circuit Serial
Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, PICkit, PICDEM,
PICDEM.net, PICtail, PIC32 logo, PowerCal, PowerInfo,
PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Total
Endurance, UNI/O, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2008, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
© 2008 Microchip Technology Inc.
DS22056B-page 37
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-4182-8400
Fax: 91-80-4182-8422
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
Kokomo
Kokomo, IN
Tel: 765-864-8360
Fax: 765-864-8387
Los Angeles
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Tel: 949-462-9523
Fax: 949-462-9608
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Hsin Chu
Tel: 886-3-572-9526
Fax: 886-3-572-6459
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
01/02/08
DS22056B-page 38
© 2008 Microchip Technology Inc.