MICROCHIP TC4431COA713

M
TC4431/TC4432
1.5A High-Speed 30V MOSFET Drivers
Features
General Description
• High Peak Output Current – 1.5A
• Wide Input Supply Voltage Operating Range:
- 4.5V to 30V
• High Capacitive Load Drive Capability:
- 1000 pF in 25 nsec
• Short Delay Times – <78 nsec Typ.
• Low Supply Current:
- With Logic ‘1’ Input – 2.5 mA
- With Logic ‘0’ Input – 300 µA
• Low Output Impedance – 7Ω
• Latch-Up Protected: Will Withstand >300 mA
Reverse Current
• ESD Protected – 4 kV
The TC4431/TC4432 are 30V CMOS buffer/drivers
suitable for use in high-side driver applications. They
will not latch-up under any conditions within their power
and voltage ratings. They can accept, without damage
or logic upset, up to 300 mA of reverse current (of
either polarity) being forced back into their outputs. All
terminals are fully protected against up to 4 kV of
electrostatic discharge.
Undervoltage lockout circuitry forces the output to a
‘low’ state when the input supply voltage drops below
7V. For operation at lower voltages, disable the lockout
and start-up circuit by grounding pin 3 (LOCK DIS); for
all other situations, pin 3 should be left floating. The
under-voltage lockout and start-up circuit gives brownout protection when driving MOSFETS.
Applications
• Small Motor Drive
• Power MOSFET Driver
• Driving Bipolar Transistors
Package Types
8-Pin PDIP/SOIC/CERDIP
VDD 1
8 VDD
IN 2
7 OUT
TC4431
LOCK DIS 3
6 OUT
GND 4
5 GND
7
2
Inverting
6
VDD 1
8 VDD
IN 2
7 OUT
TC4432
LOCK DIS 3
6 OUT
GND 4
5 GND
2
7
6
Non Inverting
 2003 Microchip Technology Inc.
DS21424C-page 1
TC4431/TC4432
Functional Block Diagram
8 V
DD
3
LOCK DIS
UV LOCK
2 mA
Inverting
TC4431
7 OUT
OUT
6
2
Input
4, 5
GND
250 mV
Non-Inverting
TC4432
TC4431/TC4432
Inverting/Non Inverting
Effective
Input
C = 10 pF
DS21424C-page 2
 2003 Microchip Technology Inc.
TC4431/TC4432
1.0
ELECTRICAL
CHARACTERISTICS
† Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
Absolute Maximum Ratings†
Supply Voltage ....................................................... 36V
Input Voltage (Note 1)................... VDD + 0.3V to GND
Package Power Dissipation (TA ≤ 70°C)
PDIP ............................................................ 730 mW
CERDIP ....................................................... 800 mW
SOIC............................................................ 470 mW
Maximum Junction Temperature, TJ ................ +150°C
Storage Temperature Range.............. -65°C to +150°C
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, TA = +25ºC with 4.5V ≤ VDD ≤ 30V.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Input
Logic ‘1’, High Input Voltage
VIH
2.4
—
—
V
Logic ‘0’, Low Input Voltage
VIL
—
—
0.8
V
Input Current (Note 1)
IIN
-1
—
1
µA
0V ≤ VIN ≤ 12V
IOUT = 100 mA
Output
High Output Voltage
VOH
VDD – 1.0
VDD – 0.8
—
V
Low Output Voltage
VOL
—
—
0.025
V
Output Resistance
RO
—
7
10
Ω
IOUT = 10 mA, VDD = 30V
Peak Output Current
IPK
—
—
3.0
1.5
—
—
A
Source: VDD = 30V
Sink: VDD = 30V
Latch-Up Protection
Withstand Reverse Current
IREV
—
0.3
—
A
Duty cycle ≤ 2%, t ≤ 300 µsec
tR
—
25
40
nsec Figure 4-1
Fall Time
tF
—
33
50
nsec Figure 4-1
Delay Time
tD1
—
62
80
nsec Figure 4-1
Delay Time
tD2
—
78
90
nsec Figure 4-1
Power Supply Current
IS
—
—
2.5
0.3
4
0.4
mA
Start-up Threshold
VS
—
8.4
10
V
Drop-out Threshold
VDO
7
7.7
—
V
Switching Time (Note 2)
Rise Time
Power Supply
Note 1:
2:
3:
VIN = 3V
VIN = 0V
Note 3
For inputs >12V, add a 1 kΩ resistor in series with the input. See “Typical Characteristics” graph for input
current.
Switching times are ensured by design.
For operation below 7V, pin 3 (LOCK DIS) should be tied to ground to disable the lockout and start-up
circuit, otherwise, pin 3 must be left floating.
 2003 Microchip Technology Inc.
DS21424C-page 3
TC4431/TC4432
DC CHARACTERISTICS (Continued)
Electrical Specifications: Unless otherwise noted, Over operating temperature range with 4.5V ≤ VDD ≤ 30V.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Logic ‘1’, High Input Voltage
VIH
2.4
—
—
V
Logic ‘0’, Low Input Voltage
VIL
—
—
0.8
V
IIN
-10
—
10
µA
0V ≤ VIN ≤ 12V
IOUT = 100 mA
Input
Input Current (Note 1)
Output
High Output Voltage
VOH
VDD – 1.2
—
—
V
Low Output Voltage
VOL
—
—
0.025
V
Output Resistance
RO
—
—
12
Ω
Rise Time
tR
—
—
60
nsec Figure 4-1
Fall Time
tF
—
—
70
nsec Figure 4-1
Delay Time
tD1
—
—
100
nsec Figure 4-1
Delay Time
tD2
—
—
110
nsec Figure 4-1
Power Supply Current
IS
—
—
—
—
6
0.7
mA
Start-up Threshold
VS
—
8.4
10
V
Drop-out Threshold
VDO
7
7.7
—
V
IOUT = 10 mA, VDD = 30V
Switching Time (Note 2)
Power Supply
Note 1:
2:
3:
VIN = 3V
VIN = 0V
Note 3
For inputs >12V, add a 1 kΩ resistor in series with the input. See “Typical Characteristics” graph for input
current.
Switching times are ensured by design.
For operation below 7V, pin 3 (LOCK DIS) should be tied to ground to disable the lockout and start-up circuit, otherwise, pin 3 must be left floating.
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V ≤ VDD ≤ 30V.
Parameters
Sym
Min
Typ
Max
Units
Specified Temperature Range (C)
TA
0
—
+70
ºC
Conditions
Temperature Ranges
Specified Temperature Range (E)
TA
-40
—
+85
ºC
Maximum Junction Temperature
TJ
—
—
+150
ºC
Storage Temperature Range
TA
-65
—
+150
ºC
Thermal Resistance, 8L-SOIC
θJA
—
155
—
ºC/W
Thermal Resistance, 8L-PDIP
θJA
—
125
—
ºC/W
Thermal Resistance, 8L-CERDIP
θJA
—
150
—
ºC/W
Package Thermal Resistances
DS21424C-page 4
 2003 Microchip Technology Inc.
TC4431/TC4432
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, TA = +25ºC with 4.5V ≤ V DD ≤ 30V.
60
150
50
125
40
100
Time (nsec)
ISUPPLY (mA)
CLOAD = 1000 pF
TA = +25°C
2 MHz
VDD = 12V
30
900 kHz
20
600 kHz
10
tFALL
75
50
tRISE
25
200 kHz
20 kHz
0
100
0
1000
CLOAD (pF)
FIGURE 2-1:
Capacitive Load.
3
10,000
Supply Current vs.
6
9
15 18
VDD (V)
24
27
30
300
CLOAD = 1000 pF
TA = +25°C
45
250 tD1
40
35
TIME (nsec)
INPUT CURRENT (mA)
21
Rise/Fall Time vs. VDD.
FIGURE 2-3:
50
12
30
25
20
WITHOUT 1 K RES.
200
150
tD2
100
15
10
50
WITH 1 K RES.
5
0
0
3
FIGURE 2-2:
Voltage.
6
9
12 15 18 21 24
INPUT VOLTAGE (VIN)
27
30
Input Current vs. Input
 2003 Microchip Technology Inc.
3
FIGURE 2-4:
6
9
12
15 18
VDD (V)
21
24
27
30
tD1 and tD2 Delay vs. VDD.
DS21424C-page 5
TC4431/TC4432
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin No.
Symbol
1
VDD
2
IN
TTL/CMOS Compatible Input
3
LOCK DIS
Input Pin, Enable/Disable for
UV Lockout
4
GND
Ground
5
GND
Ground
6
OUT
Drive Output, Pull Down
7
OUT
Drive Output, Pull Up
8
VDD
Supply Input, 4.5V to 30V
3.1
Description
Supply Input, 4.5V to 30V
Supply Input (VDD)
The V DD input is the bias supply input for the MOSFET
driver and is rated for 4.5V to 30V with respect to the
ground pins. The VDD input should be bypassed to
ground with a local ceramic capacitor. The value of this
capacitor should be chosen based on the capacitive
load that is being driven.
3.2
Control Input (IN)
3.3
Lockout Disable (LOCK DIS)
The lockout pin enables/disables the undervoltage
lock-out feature of the device. If undervoltage lockout is
desired (output is not enabled until the bias voltage
reaches 8.4V (typical) on the rising edge and is disabled when the bias voltage reaches 7.7V (typical) on
the falling edge), the lockout pin should be left floating.
If operation below 7V is desired, the lockout pin should
be tied to ground.
3.4
Ground (GND)
The ground pins are the return path for the bias current
and for the high peak currents which discharge the load
capacitor. Both ground pins should be used to ensure
proper operation. The ground pins should be tied into a
ground plane or have short traces to the bias supply
source return.
3.5
Drive Output (OUT)
The TC4431/TC4432 devices have individual source
and sink output pins. This feature can be used to adjust
the rise and fall time independently by adding separate
charge and discharge resistors external to the device.
Pin 7 (source output) can source 3A peak currents into
capacitive loads and pin 6 (sink output) can sink 1.5A
peak currents from a capacitive load.
The MOSFET driver input is a TTL/CMOS compatible
input with 250 mV of hysteresis between the high and
low threshold voltages. If an input signal level of greater
than 12V is applied to the device, a series current
limiting resistor is recommended.
DS21424C-page 6
 2003 Microchip Technology Inc.
TC4431/TC4432
4.0
APPLICATIONS INFORMATION
+5V
90%
Input
VDD = 30V
0V
4.7 µF
1, 8
Input
2
0.1 µF
10%
tD1
VDD
tD2
tF
90%
90%
Output
7
Output
6
10%
10%
0V
Inverting Driver
C L= 1000 pF
+5V
LOCK DIS
tR
3
90%
Input
4, 5
Input: 100 kHz,
square wave,
tRISE = tFALL ≤ 10 nsec
0V
VDD
10%
tD1 90%
Output
0V
10%
tR
90%
tD2
tF
10%
Non-Inverting Driver
FIGURE 4-1:
Switching Time Test Circuit.
 2003 Microchip Technology Inc.
DS21424C-page 7
TC4431/TC4432
5.0
PACKAGING INFORMATION
5.1
Package Marking Information
8-Lead PDIP (300 mil)
XXXXXXXX
XXXXXNNN
YYWW
8-Lead SOIC (150 mil)
XXXXXXXX
XXXXYYWW
NNN
8-Lead CERDIP (300 mil)
XXXXXXXX
XXXXXNNN
YYWW
Legend:
Note:
*
XX...X
YY
WW
NNN
Example:
TC4431
CPA256
0302
Example:
TC4431
COA0302
256
Example:
TC4431
EJA256
0302
Customer specific information*
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.
DS21424C-page 8
 2003 Microchip Technology Inc.
TC4431/TC4432
8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
E1
D
2
n
1
α
E
A2
A
L
c
A1
β
B1
p
eB
B
Units
Dimension Limits
n
p
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
A
A2
A1
E
E1
D
L
c
§
B1
B
eB
α
β
MIN
.140
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
5
5
INCHES*
NOM
MAX
8
.100
.155
.130
.170
.145
.313
.250
.373
.130
.012
.058
.018
.370
10
10
.325
.260
.385
.135
.015
.070
.022
.430
15
15
MILLIMETERS
NOM
8
2.54
3.56
3.94
2.92
3.30
0.38
7.62
7.94
6.10
6.35
9.14
9.46
3.18
3.30
0.20
0.29
1.14
1.46
0.36
0.46
7.87
9.40
5
10
5
10
MIN
MAX
4.32
3.68
8.26
6.60
9.78
3.43
0.38
1.78
0.56
10.92
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
 2003 Microchip Technology Inc.
DS21424C-page 9
TC4431/TC4432
8-Lead Ceramic Dual In-line (JA) – 300 mil (CERDIP)
E1
2
1
n
D
E
A2
A
c
L
B1
eB
B
A1
Units
Dimension Limits
n
p
Number of Pins
Pitch
Top to Seating Plane
Standoff §
Shoulder to Shoulder Width
Ceramic Pkg. Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
*Controlling Parameter
JEDEC Equivalent: MS-030
A
A1
E
E1
D
L
c
B1
B
eB
p
MIN
.160
.020
.290
.230
.370
.125
.008
.045
.016
.320
INCHES*
NOM
8
.100
.180
.030
.305
.265
.385
.163
.012
.055
.018
.360
MAX
.200
.040
.320
.300
.400
.200
.015
.065
.020
.400
MILLIMETERS
NOM
8
2.54
4.06
4.57
0.51
0.77
7.37
7.75
5.84
6.73
9.40
9.78
3.18
4.13
0.20
0.29
1.14
1.40
0.41
0.46
8.13
9.15
MIN
MAX
5.08
1.02
8.13
7.62
10.16
5.08
0.38
1.65
0.51
10.16
Drawing No. C04-010
DS21424C-page 10
 2003 Microchip Technology Inc.
TC4431/TC4432
8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC)
E
E1
p
D
2
B
n
1
h
α
45°
c
A2
A
φ
β
L
Units
Dimension Limits
n
p
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
A
A2
A1
E
E1
D
h
L
φ
c
B
α
β
MIN
.053
.052
.004
.228
.146
.189
.010
.019
0
.008
.013
0
0
A1
INCHES*
NOM
8
.050
.061
.056
.007
.237
.154
.193
.015
.025
4
.009
.017
12
12
MAX
.069
.061
.010
.244
.157
.197
.020
.030
8
.010
.020
15
15
MILLIMETERS
NOM
8
1.27
1.35
1.55
1.32
1.42
0.10
0.18
5.79
6.02
3.71
3.91
4.80
4.90
0.25
0.38
0.48
0.62
0
4
0.20
0.23
0.33
0.42
0
12
0
12
MIN
MAX
1.75
1.55
0.25
6.20
3.99
5.00
0.51
0.76
8
0.25
0.51
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
 2003 Microchip Technology Inc.
DS21424C-page 11
TC4431/TC4432
NOTES:
DS21424C-page 12
 2003 Microchip Technology Inc.
TC4431/TC4432
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
Device:
X
/XX
Temperature
Range
TC4431:
TC4432:
Package
1.5A High-Speed 30V MOSFET Driver,
Inverting
1.5A High-Speed 30V MOSFET Driver,
Non Inverting
Examples:
a)
b)
a)
b)
Temperature Range:
C
E
=
=
0°C to +70°C
-40°C to +85°C
Package:
JA
= Ceramic Dual In-line (300 mil Body), 8-lead *
OA
= Plastic SOIC, (150 mil Body), 8-lead
OA713 = Plastic SOIC, (150 mil Body), 8-lead
(Tape and Reel)
PA
= Plastic DIP (300 mil Body), 8-lead
TC4431COA: 1.5A MOSFET driver, SOIC
package, 0°C to +70°C.
TC4431EJA: 1.5A MOSFET driver,
CERDIP package, -40ºC to +85ºC.
TC4432CPA: 1.5A MOSFET driver, PDIP
package, 0°C to +70°C.
TC4432EPA: 1.5A MOSFET driver, PDIP
package, -40°C to +85°C.
* Offered in E-temp range only.
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and
recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1.
2.
3.
Your local Microchip sales office
The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
 2003 Microchip Technology Inc.
DS21424C-page 13
TC4431/TC4432
NOTES:
DS21424C-page 14
 2003 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
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© 2003, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
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The Company’s quality system processes and
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 2003 Microchip Technology Inc.
DS21424C-page 15
DSTEMP
DS21424C-page 16
 2003 Microchip Technology Inc.
M
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Epping 2121, NSW
Australia
Tel: 61-2-9868-6733 Fax: 61-2-9868-6755
Atlanta
3780 Mansell Road, Suite 130
Alpharetta, GA 30022
Tel: 770-640-0034 Fax: 770-640-0307
China - Beijing
2 Lan Drive, Suite 120
Westford, MA 01886
Tel: 978-692-3848 Fax: 978-692-3821
Microchip Technology Consulting (Shanghai)
Co., Ltd., Beijing Liaison Office
Unit 915
Bei Hai Wan Tai Bldg.
No. 6 Chaoyangmen Beidajie
Beijing, 100027, No. China
Tel: 86-10-85282100 Fax: 86-10-85282104
Chicago
China - Chengdu
333 Pierce Road, Suite 180
Itasca, IL 60143
Tel: 630-285-0071 Fax: 630-285-0075
Microchip Technology Consulting (Shanghai)
Co., Ltd., Chengdu Liaison Office
Rm. 2401-2402, 24th Floor,
Ming Xing Financial Tower
No. 88 TIDU Street
Chengdu 610016, China
Tel: 86-28-86766200 Fax: 86-28-86766599
Boston
Dallas
4570 Westgrove Drive, Suite 160
Addison, TX 75001
Tel: 972-818-7423 Fax: 972-818-2924
Detroit
Tri-Atria Office Building
32255 Northwestern Highway, Suite 190
Farmington Hills, MI 48334
Tel: 248-538-2250 Fax: 248-538-2260
Kokomo
2767 S. Albright Road
Kokomo, IN 46902
Tel: 765-864-8360 Fax: 765-864-8387
Los Angeles
18201 Von Karman, Suite 1090
Irvine, CA 92612
Tel: 949-263-1888 Fax: 949-263-1338
Phoenix
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7966 Fax: 480-792-4338
San Jose
Microchip Technology Inc.
2107 North First Street, Suite 590
San Jose, CA 95131
Tel: 408-436-7950 Fax: 408-436-7955
Toronto
6285 Northam Drive, Suite 108
Mississauga, Ontario L4V 1X5, Canada
Tel: 905-673-0699 Fax: 905-673-6509
China - Fuzhou
Microchip Technology Consulting (Shanghai)
Co., Ltd., Fuzhou Liaison Office
Unit 28F, World Trade Plaza
No. 71 Wusi Road
Fuzhou 350001, China
Tel: 86-591-7503506 Fax: 86-591-7503521
China - Hong Kong SAR
Microchip Technology Hongkong Ltd.
Unit 901-6, Tower 2, Metroplaza
223 Hing Fong Road
Kwai Fong, N.T., Hong Kong
Tel: 852-2401-1200 Fax: 852-2401-3431
China - Shanghai
Microchip Technology Consulting (Shanghai)
Co., Ltd.
Room 701, Bldg. B
Far East International Plaza
No. 317 Xian Xia Road
Shanghai, 200051
Tel: 86-21-6275-5700 Fax: 86-21-6275-5060
China - Shenzhen
Microchip Technology Consulting (Shanghai)
Co., Ltd., Shenzhen Liaison Office
Rm. 1812, 18/F, Building A, United Plaza
No. 5022 Binhe Road, Futian District
Shenzhen 518033, China
Tel: 86-755-82901380 Fax: 86-755-8295-1393
China - Qingdao
Rm. B505A, Fullhope Plaza,
No. 12 Hong Kong Central Rd.
Qingdao 266071, China
Tel: 86-532-5027355 Fax: 86-532-5027205
India
Microchip Technology Inc.
India Liaison Office
Marketing Support Division
Divyasree Chambers
1 Floor, Wing A (A3/A4)
No. 11, O’Shaugnessey Road
Bangalore, 560 025, India
Tel: 91-80-2290061 Fax: 91-80-2290062
Japan
Microchip Technology Japan K.K.
Benex S-1 6F
3-18-20, Shinyokohama
Kohoku-Ku, Yokohama-shi
Kanagawa, 222-0033, Japan
Tel: 81-45-471- 6166 Fax: 81-45-471-6122
Korea
Microchip Technology Korea
168-1, Youngbo Bldg. 3 Floor
Samsung-Dong, Kangnam-Ku
Seoul, Korea 135-882
Tel: 82-2-554-7200 Fax: 82-2-558-5934
Singapore
Microchip Technology Singapore Pte Ltd.
200 Middle Road
#07-02 Prime Centre
Singapore, 188980
Tel: 65-6334-8870 Fax: 65-6334-8850
Taiwan
Microchip Technology (Barbados) Inc.,
Taiwan Branch
11F-3, No. 207
Tung Hua North Road
Taipei, 105, Taiwan
Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
EUROPE
Austria
Microchip Technology Austria GmbH
Durisolstrasse 2
A-4600 Wels
Austria
Tel: 43-7242-2244-399
Fax: 43-7242-2244-393
Denmark
Microchip Technology Nordic ApS
Regus Business Centre
Lautrup hoj 1-3
Ballerup DK-2750 Denmark
Tel: 45-4420-9895 Fax: 45-4420-9910
France
Microchip Technology SARL
Parc d’Activite du Moulin de Massy
43 Rue du Saule Trapu
Batiment A - ler Etage
91300 Massy, France
Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Germany
Microchip Technology GmbH
Steinheilstrasse 10
D-85737 Ismaning, Germany
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Italy
Microchip Technology SRL
Via Quasimodo, 12
20025 Legnano (MI)
Milan, Italy
Tel: 39-0331-742611 Fax: 39-0331-466781
United Kingdom
Microchip Ltd.
505 Eskdale Road
Winnersh Triangle
Wokingham
Berkshire, England RG41 5TU
Tel: 44-118-921-5869 Fax: 44-118-921-5820
05/30/03
DS21424C-page 17
 2003 Microchip Technology Inc.