MICROCHIP 24AA025-I/P

24AA024/24LC024/24AA025/24LC025
2K I2C™ Serial EEPROM
Device Selection Table
Description:
Part
Number
VCC
Range
Max
Clock
24AA024
1.7V-5.5V
400 kHz(1)
I
24AA025
1.7V-5.5V
(1)
I
No
24LC024
2.5V-5.5V
400 kHz
I
Yes
2.5V-5.5V
400 kHz
I
No
24LC025
Note 1:
400 kHz
Temp. Write
Range Protect
Yes
100 kHz for VCC < 2.5V
Features:
• Single supply with operation from 1.7V to 5.5V for
24AA024/24AA025 devices, 2.5V for 24LC024/
24LC025 devices
• Low-power CMOS technology:
- Read current 1 mA, typical
- Standby current 1 μA, typical
• 2-wire serial interface, I2C™ compatible
• Cascadable up to eight devices
• Schmitt Trigger inputs for noise suppression
• Output slope control to eliminate ground bounce
• 100 kHz and 400 kHz clock compatibility
• Page write time 5 ms maximum
• Self-timed erase/write cycle
• 16-byte page write buffer
• Hardware write-protect on 24XX024 devices
• ESD protection >4,000V
• More than 1 million erase/write cycles
• Data retention >200 years
• Factory programming available
• Packages include 8-lead PDIP, SOIC, TSSOP,
DFN and MSOP
• Pb-free and RoHS compliant
• Temperature ranges:
- Industrial (I): -40°C to +85°C
The Microchip Technology Inc. 24AA024/24LC024/
24AA025/24LC025 is a 2 Kbit Serial Electrically
Erasable PROM with a voltage range of 1.7V to 5.5V.
The device is organized as a single block of 256 x 8-bit
memory with a 2-wire serial interface. Low current
design permits operation with typical standby and
active currents of only 1 μA and 1 mA, respectively.
The device has a page write capability for up to 16
bytes of data. Functional address lines allow the
connection of up to eight 24AA024/24LC024/
24AA025/24LC025 devices on the same bus for up to
16K bits of contiguous EEPROM memory. The device
is available in the standard 8-pin PDIP, 8-pin SOIC
(3.90 mm), TSSOP, 2x3 DFN and MSOP packages.
Package Types
SOIC, TSSOP
PDIP, MSOP
A0
1
8
VCC A0
1
8
VCC
A1
2
7
WP A1
2
7
WP
A2
3
6
SCL A2
3
6
SCL
VSS
4
5
SDA VSS
4
5
SDA
DFN
A0
A1
A2
VSS
Note:
1
2
3
4
8
7
6
5
VCC
WP
SCL
SDA
WP pin is not internally connected on the
24XX025.
Block Diagram
A0 A1 A2
I/O
Control
Logic
WP*
HV Generator
Memory
Control
Logic
XDEC
EEPROM
Array
SDA SCL
VCC
VSS
Write-Protect
Circuitry
YDEC
Sense Amp.
R/W Control
© 2007 Microchip Technology Inc.
DS21210K-page 1
24AA024/24LC024/24AA025/24LC025
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings (†)
VCC .............................................................................................................................................................................6.5V
All inputs and outputs w.r.t. VSS ......................................................................................................... -0.6V to VCC +1.0V
Storage temperature ...............................................................................................................................-65°C to +150°C
Ambient temperature with power applied ................................................................................................-40°C to +125°C
ESD protection on all pins ......................................................................................................................................................≥ 4 kV
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
TABLE 1-1:
DC CHARACTERISTICS
All parameters apply across the
specified operating ranges unless
otherwise noted.
Parameter
VCC = 1.7V to 5.5V
Industrial (I): TA = -40°C to +85°C
Symbol
Min.
Max.
Units
Conditions
SCL and SDA pins:
High-level input voltage
VIH
0.7 VCC
—
V
Low-level input voltage
VIL
—
0.3 VCC
V
—
Hysteresis of Schmitt Trigger inputs
VHYS
0.05 VCC
—
V
(Note)
Low-level output voltage
VOL
—
0.40
V
IOL = 3.0 mA, VCC = 4.5V
IOL = 2.1 mA, VCC = 2.5V
Input leakage current
ILI
—
±1
μA
VIN = VSS or VCC
Output leakage current
ILO
—
±1
μA
VOUT = VSS or VCC
Pin capacitance (all inputs/outputs)
CIN, COUT
—
10
pF
VCC = 5.0V (Note)
TA = 25°C, FCLK = 1 MHz
Operating current
ICC Read
—
1
mA
VCC = 5.5V, SCL = 400 kHz
ICC Write
—
3
mA
VCC = 5.5V
ICCS
—
1
μA
VCC = 5.5V, SDA = SCL = VCC
WP = VSS, A0, A1, A2 = VSS
Standby current
Note:
—
This parameter is periodically sampled and not 100% tested.
DS21210K-page 2
© 2007 Microchip Technology Inc.
24AA024/24LC024/24AA025/24LC025
TABLE 1-2:
AC CHARACTERISTICS
All parameters apply across the specified
operating ranges unless otherwise noted.
VCC = 1.7V to 5.5V
Industrial (I): TA = -40°C to +85°C
STD MODE
Parameter
Symbol
Min.
Max.
Vcc = 2.5V - 5.5V
FAST MODE
Min.
Max.
Units
Remarks
Clock frequency
FCLK
—
100
—
400
kHz
—
Clock high time
THIGH
4000
—
600
—
ns
—
Clock low time
TLOW
4700
—
1300
—
ns
—
SDA and SCL rise time
TR
—
1000
—
300
ns
(Note 1)
SDA and SCL fall time
TF
—
300
—
300
ns
(Note 1)
Start condition hold time
THD:STA
4000
—
600
—
ns
After this period the first
clock pulse is generated
Start condition setup time
TSU:STA
4700
—
600
—
ns
Only relevant for repeated
Start condition
Data input hold time
THD:DAT
0
—
0
—
ns
(Note 2)
Data input setup time
TSU:DAT
250
—
100
—
ns
—
4000
—
600
—
ns
—
—
3500
—
900
ns
(Note 2)
4700
—
1300
—
ns
Time the bus must be free
before a new transmission
can start
Stop condition setup time
TSU:STO
Output valid from clock
TAA
Bus free time
TBUF
Output fall time from VIH
minimum to VIL maximum
TOF
—
250
20 +0.1
CB
250
ns
(Note 1), CB ≤ 100 pF
Input filter spike suppression TSP
(SDA and SCL pins)
—
50
—
50
ns
(Note 3)
Write cycle time
—
5
—
5
ms
Byte or Page mode
1M
—
1M
—
Endurance
Note 1:
2:
3:
4:
TWC
cycles 25°C, (Note 4)
Not 100% tested. CB = total capacitance of one bus line in pF.
As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region
(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.
The combined TSP and VHYS specifications are due to Schmitt Trigger inputs which provide improved
noise spike suppression. This eliminates the need for a TI specification for standard operation.
This parameter is not tested but ensured by characterization. For endurance estimates in a specific
application, please consult the Total Endurance™ Model which can be downloaded at
www.microchip.com.
© 2007 Microchip Technology Inc.
DS21210K-page 3
24AA024/24LC024/24AA025/24LC025
FIGURE 1-1:
BUS TIMING DATA
THIGH
TF
SCL
TR
TSU:STA
TLOW
SDA
IN
TSP
THD:DAT
TSU:DAT
TSU:STO
THD:STA
TAA
TBUF
SDA
OUT
DS21210K-page 4
© 2007 Microchip Technology Inc.
24AA024/24LC024/24AA025/24LC025
2.0
PIN DESCRIPTIONS
Pin Function Table
Name
PDIP
SOIC
TSSOP
DFN
MSOP
Description
A0
1
1
1
1
1
Address Pin AO
A1
2
2
2
2
2
Address Pin A1
A2
3
3
3
3
3
Address Pin A2
VSS
4
4
4
4
4
Ground
SDA
5
5
5
5
5
Serial Address/Data I/O
SCL
6
6
6
6
6
Serial Clock
WP
7
7
7
7
7
Write-Protect Input
VCC
8
8
8
8
8
+1.7 to 5.5V Power Supply
2.1
SDA Serial Data
SDA is a bidirectional pin used to transfer addresses
and data into and out of the device. It is an open-drain
terminal, therefore, the SDA bus requires a pull-up
resistor to VCC (typical 10 kΩ for 100 kHz, 2 kΩ for
400 kHz).
For normal data transfer, SDA is allowed to change
only during SCL low. Changes during SCL high are
reserved for indicating the Start and Stop conditions.
2.2
SCL Serial Clock
The SCL input is used to synchronize the data transfer
from and to the device.
2.3
A0, A1, A2
The levels on the A0, A1 and A2 inputs are compared
with the corresponding bits in the slave address. The
chip is selected if the compare is true.
Up to eight 24AA024/24LC024/24AA025/24LC025
devices may be connected to the same bus by using
different Chip Select bit combinations. These inputs
must be connected to either VCC or VSS.
2.4
2.5
Noise Protection
The 24AA024/24LC024/24AA025/24LC025 employs a
VCC threshold detector circuit which disables the
internal erase/write logic if the VCC is below 1.5 volts at
nominal conditions.
The SCL and SDA inputs have Schmitt Trigger and
filter circuits which suppress noise spikes to assure
proper device operation, even on a noisy bus.
3.0
FUNCTIONAL DESCRIPTION
The 24AA024/24LC024/24AA025/24LC025 supports
a bidirectional, 2-wire bus and data transmission
protocol. A device that sends data onto the bus is
defined as transmitter, while a device receiving data
is defined as receiver. The bus has to be controlled
by a master device which generates the Serial Clock
(SCL), controls the bus access and generates the
Start and Stop conditions, while the 24AA024/
24LC024/24AA025/24LC025 works as slave. Both
master and slave can operate as transmitter or
receiver, but the master device determines which
mode is activated.
WP (24XX024 Only)
WP is the hardware write-protect pin. It must be tied to
VCC or VSS. If tied to Vcc, hardware write protection is
enabled. If WP is tied to Vss, the hardware write
protection is disabled. Note that the WP pin is available
only on the 24XX024. This pin is not internally
connected on the 24LC025.
© 2007 Microchip Technology Inc.
DS21210K-page 5
24AA024/24LC024/24AA025/24LC025
4.0
BUS CHARACTERISTICS
The data on the line must be changed during the low
period of the clock signal. There is one bit of data per
clock pulse.
The following bus protocol has been defined:
• Data transfer may be initiated only when the bus
is not busy.
• During data transfer, the data line must remain
stable whenever the clock line is high. Changes in
the data line while the clock line is high will be
interpreted as a Start or Stop condition.
Accordingly, the following bus conditions have been
defined (Figure 4-1).
Each data transfer is initiated with a Start condition and
terminated with a Stop condition. The number of the
data bytes transferred between the Start and Stop
conditions is determined by the master device and is,
theoretically, unlimited, (though only the last sixteen will
be stored when performing a write operation). When an
overwrite does occur, it will replace data in a first-in
first-out fashion.
4.1
4.5
Bus Not Busy (A)
Each receiving device, when addressed, is required to
generate an acknowledge after the reception of each
byte. The master device must generate an extra clock
pulse which is associated with this Acknowledge bit.
Both data and clock lines remain high.
4.2
Start Data Transfer (B)
A high-to-low transition of the SDA line while the clock
(SCL) is high determines a Start condition. All
commands must be preceded by a Start condition.
4.3
Note:
Stop Data Transfer (C)
Data Valid (D)
The state of the data line represents valid data when,
after a Start condition, the data line is stable for the
duration of the high period of the clock signal.
FIGURE 4-1:
SCL
(A)
The 24AA024/24LC024/24AA025/24LC025
does not generate any Acknowledge bits if
an internal programming cycle is in
progress.
The device that acknowledges has to pull down the SDA
line during the acknowledge clock pulse in such a way
that the SDA line is stable low during the high period of
the acknowledge-related clock pulse. Of course, setup
and hold times must be taken into account. A master
must signal an end of data to the slave by not generating
an Acknowledge bit on the last byte that has been
clocked out of the slave. In this case, the slave must
leave the data line high to enable the master to generate
the Stop condition (Figure 4-2).
A low-to-high transition of the SDA line while the clock
(SCL) is high determines a Stop condition. All
operations must be ended with a Stop condition.
4.4
Acknowledge
DATA TRANSFER SEQUENCE ON THE SERIAL BUS CHARACTERISTICS
(B)
(C)
(D)
(C)
(A)
SDA
Start
Condition
FIGURE 4-2:
Address or
Acknowledge
Valid
Stop
Condition
Data
Allowed
to Change
ACKNOWLEDGE TIMING
Acknowledge
Bit
1
SCL
SDA
2
3
4
5
6
7
Data from transmitter
Transmitter must release the SDA line at this point allowing
the Receiver to pull the SDA line low to acknowledge the
previous eight bits of data.
DS21210K-page 6
8
9
1
2
3
Data from transmitter
Receiver must release the SDA line at this
point so the Transmitter can continue
sending data.
© 2007 Microchip Technology Inc.
24AA024/24LC024/24AA025/24LC025
5.0
DEVICE ADDRESSING
A control byte is the first byte received following the
Start condition from the master device (Figure 5-1).
The control byte consists of a four-bit control code. For
the 24AA024/24LC024/24AA025/24LC025, this is set
as ‘1010’ binary for read and write operations. The next
three bits of the control byte are the Chip Select bits
(A2, A1, A0). The Chip Select bits allow the use of up
to
eight
24AA024/24LC024/24AA025/24LC025
devices on the same bus and are used to select which
device is accessed. The Chip Select bits in the control
byte must correspond to the logic levels on the corresponding A2, A1 and A0 pins for the device to respond.
These bits are in effect the three Most Significant bits of
the word address.
The last bit of the control byte defines the operation to
be performed. When set to a one, a read operation is
selected. When set to a zero, a write operation is
selected. Following the Start condition, the 24AA024/
24LC024/24AA025/24LC025 monitors the SDA bus
checking the control byte being transmitted. Upon
receiving a ‘1010’ code and appropriate Chip Select
bits, the slave device outputs an Acknowledge signal
on the SDA line. Depending on the state of the R/W bit,
the 24AA024/24LC024/24AA025/24LC025 will select a
read or write operation.
© 2007 Microchip Technology Inc.
FIGURE 5-1:
CONTROL BYTE FORMAT
Read/Write Bit
Chip Select
Bits
Control Code
S
1
0
1
0
A2
A1
A0 R/W ACK
Slave Address
Start Bit
5.1
Acknowledge Bit
Contiguous Addressing Across
Multiple Devices
The Chip Select bits A2, A1 and A0 can be used to
expand the contiguous address space for up to 16K bits
by adding up to eight 24AA024/24LC024/24AA025/
24LC025 devices on the same bus. In this case, software can use A0 of the control byte as address bit A8,
A1 as address bit A9 and A2 as address bit A10. It is
not possible to sequentially read across device
boundaries.
DS21210K-page 7
24AA024/24LC024/24AA025/24LC025
6.0
WRITE OPERATIONS
6.1
Byte Write
The higher-order four bits of the word address remain
constant. If the master should transmit more than 16
bytes prior to generating the Stop condition, the
address counter will roll over and the previously
received data will be overwritten. As with the byte-write
operation, once the Stop condition is received, an
internal write cycle will begin (Figure 6-2). If an attempt
is made to write to the protected portion of the array
when the hardware write protection has been enabled,
the device will acknowledge the command, but no data
will be written. The write cycle time must be observed
even if write protection is enabled.
Following the Start signal from the master, the device
code(4 bits), the Chip Select bits (3 bits) and the R/W
bit (which is a logic-low) is placed onto the bus by the
master transmitter. The device will acknowledge this
control byte during the ninth clock pulse. The next byte
transmitted by the master is the word address and will
be written into the Address Pointer of the 24AA024/
24LC024/24AA025/24LC025. After receiving another
Acknowledge signal from the 24AA024/24LC024/
24AA025/24LC025, the master device will transmit the
data word to be written into the addressed memory
location. The 24AA024/24LC024/24AA025/24LC025
acknowledges again and the master generates a Stop
condition. This initiates the internal write cycle and, during this time, the 24AA024/24LC024/24AA025/
24LC025 will not generate Acknowledge signals
(Figure 6-1). If an attempt is made to write to the
protected portion of the array when the hardware write
protection (24XX024 only) has been enabled, the
device will acknowledge the command, but no data will
be written. The write cycle time must be observed even
if write protection is enabled.
6.2
Note:
Page Write
The write control byte, word address and the first data
byte are transmitted to the 24AA024/24LC024/
24AA025/24LC025 in the same way as in a byte write.
However, instead of generating a Stop condition, the
master transmits up to 15 additional data bytes to the
24AA024/24LC024/24AA025/24LC025, which are
temporarily stored in the on-chip page buffer and will be
written into the memory once the master has transmitted a Stop condition. Upon receipt of each word, the
four lower-order Address Pointer bits are internally
incremented by one.
FIGURE 6-1:
S
T
A
R
T
SDA LINE
S
The WP pin (available on 24XX024 only) must be tied
to VCC or VSS. If tied to VCC, the entire array will be
write-protected. If the WP pin is tied to VSS, write
operations to all address locations are allowed.
Control
Byte
Word
Address
S
T
O
P
Data
P
A
C
K
BUS ACTIVITY
FIGURE 6-2:
A
C
K
A
C
K
PAGE WRITE
BUS ACTIVITY
MASTER
S
T
A
R
T
SDA LINE
S
DS21210K-page 8
Write Protection
BYTE WRITE
BUS ACTIVITY
MASTER
BUS ACTIVITY
6.3
Page write operations are limited to writing
bytes within a single physical page,
regardless of the number of bytes
actually being written. Physical page
boundaries start at addresses that are
integer multiples of the page buffer size (or
‘page size’) and end at addresses that are
integer multiples of [page size – 1]. If a
Page Write command attempts to write
across a physical page boundary, the
result is that the data wraps around to the
beginning of the current page (overwriting
data previously stored there), instead of
being written to the next page, as might be
expected. It is therefore necessary for the
application software to prevent page write
operations that would attempt to cross a
page boundary.
Control
Byte
Word
Address (n)
Data (n +1)
Data (n)
Data (n + 15)
S
T
O
P
P
A
C
K
A
C
K
A
C
K
A
C
K
A
C
K
© 2007 Microchip Technology Inc.
24AA024/24LC024/24AA025/24LC025
7.0
ACKNOWLEDGE POLLING
Since the device will not acknowledge during a write
cycle, this can be used to determine when the cycle is
complete (this feature can be used to maximize bus
throughput). Once the Stop condition for a Write
command has been issued from the master, the device
initiates the internally-timed write cycle, with ACK
polling being initiated immediately. This involves the
master sending a Start condition followed by the control
byte for a Write command (R/W = 0). If the device is still
busy with the write cycle, no ACK will be returned. If no
ACK is returned, the Start bit and control byte must be
re-sent. If the cycle is complete, the device will return
the ACK and the master can then proceed with the next
Read or Write command. See Figure 7-1 for a flow
diagram of this operation.
FIGURE 7-1:
ACKNOWLEDGE POLLING
FLOW
Send
Write Command
Send Stop
Condition to
Initiate Write Cycle
Send Start
Send Control Byte
with R/W = 0
Did Device
Acknowledge
(ACK = 0)?
No
Yes
Next
Operation
© 2007 Microchip Technology Inc.
DS21210K-page 9
24AA024/24LC024/24AA025/24LC025
8.0
READ OPERATIONS
Read operations are initiated in the same way as write
operations, with the exception that the R/W bit of the
slave address is set to ‘1’. There are three basic types
of read operations: current address read, random read
and sequential read.
8.1
Current Address Read
The 24AA024/24LC024/24AA025/24LC025 contains
an address counter that maintains the address of the
last word accessed, internally incremented by one.
Therefore, if the previous read access was to address
n, the next current address read operation would
access data from address n + 1. Upon receipt of the
slave address with the R/W bit set to ‘1’, the 24AA024/
24LC024/24AA025/24LC025 issues an acknowledge
and transmits the 8-bit data word. The master will not
acknowledge the transfer, but does generate a Stop
condition and the 24AA024/24LC024/24AA025/
24LC025 discontinues transmission (Figure 8-1).
8.2
Random Read
Random read operations allow the master to access
any memory location in a random manner. To perform
this type of read operation, the word address must first
be set. This is accomplished by sending the word
address to the 24AA024/24LC024/24AA025/24LC025
as part of a write operation. Once the word address is
sent, the master generates a Start condition following
the acknowledge. This terminates the write operation,
but not before the internal Address Pointer is set. The
master then issues the control byte again, but with the
R/W bit set to a ‘1’. The 24AA024/24LC024/24AA025/
24LC025 will then issue an acknowledge and transmits
the eight bit data word. The master will not acknowledge the transfer but does generate a Stop condition
and
the
24AA024/24LC024/24AA025/24LC025
discontinues transmission (Figure 8-2). After this
command, the internal address counter will point to the
address location following the one that was just read.
DS21210K-page 10
8.3
Sequential Read
Sequential reads are initiated in the same way as a
random read except that after the 24AA024/24LC024/
24AA025/24LC025 transmits the first data byte, the
master issues an acknowledge (as opposed to a Stop
condition in a random read). This directs the 24AA024/
24LC024/24AA025/24LC025 to transmit the next
sequentially-addressed 8-bit word (Figure 8-3).
To provide sequential reads, the 24AA024/24LC024/
24AA025/24LC025 contains an internal Address
Pointer that is incremented by one upon completion of
each operation. This Address Pointer allows the entire
memory contents to be serially read during one
operation. The internal Address Pointer will
automatically roll over from address 0FFh to address
000h.
FIGURE 8-1:
S
T
BUS ACTIVITY A
MASTER
R
T
SDA LINE
S
BUS ACTIVITY
CURRENT ADDRESS
READ
Control
Byte
S
T
O
P
Data
P
A
C
K
N
O
A
C
K
© 2007 Microchip Technology Inc.
24AA024/24LC024/24AA025/24LC025
FIGURE 8-2:
RANDOM READ
BUS ACTIVITY
MASTER
S
T
A
R
T
Control
Byte
S
SDA LINE
BUS ACTIVITY
MASTER
Control
Byte
S
T
O
P
Data (n)
P
S
A
C
K
A
C
K
BUS ACTIVITY
FIGURE 8-3:
S
T
A
R
T
Word
Address (n)
N
O
A
C
K
A
C
K
SEQUENTIAL READ
Control
Byte
Data (n)
Data (n + 1)
Data (n + 2)
S
T
O
P
Data (n + x)
P
SDA LINE
BUS ACTIVITY
© 2007 Microchip Technology Inc.
A
C
K
A
C
K
A
C
K
A
C
K
N
O
A
C
K
DS21210K-page 11
24AA024/24LC024/24AA025/24LC025
9.0
PACKAGING INFORMATION
9.1
Package Marking Information
8-Lead PDIP (300 mil)
XXXXXXXX
T/XXXNNN
YYWW
8-Lead SOIC (3.90 mm)
XXXXXXXT
XXXXYYWW
NNN
8-Lead TSSOP
24LC024
I/P e3 13F
0519
Example:
24LC024I
SN e3 0519
13F
Example:
XXXX
4L24
TYWW
I519
NNN
13F
8-Lead MSOP
XXXXT
YWWNNN
8-Lead 2x3 DFN
XXX
YWW
NN
DS21210K-page 12
Example:
Example:
4L24I
51913F
Example:
2P4
519
13
© 2007 Microchip Technology Inc.
24AA024/24LC024/24AA025/24LC025
1st Line Marking Codes
Part Number
TSSOP
MSOP
24AA024
4A24
4A24T
2P1
24LC024
4L24
4L24T
2P4
24AA025
4A25
4A25T
2R1
24LC025
4L25
4L25T
2R4
Note:
DFN
T = Temperature grade (I, E)
Legend: XX...X
T
Y
YY
WW
NNN
e3
Note:
Part number or part number code
Temperature (I, E)
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code (2 characters for small packages)
Pb-free JEDEC designator for Matte Tin (Sn)
Note:
For very small packages with no room for the Pb-free JEDEC designator
e3 , the marking will only appear on the outer carton or reel label.
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
Please visit www.microchip.com/Pbfree for the latest information on Pb-free conversion.
*Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.
© 2007 Microchip Technology Inc.
DS21210K-page 13
24AA024/24LC024/24AA025/24LC025
8-Lead Plastic Dual In-Line (P or PA) – 300 mil Body [PDIP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
N
NOTE 1
E1
1
3
2
D
E
A2
A
L
A1
c
e
eB
b1
b
Units
Dimension Limits
Number of Pins
INCHES
MIN
N
NOM
MAX
8
Pitch
e
Top to Seating Plane
A
–
–
.210
Molded Package Thickness
A2
.115
.130
.195
Base to Seating Plane
A1
.015
–
–
Shoulder to Shoulder Width
E
.290
.310
.325
Molded Package Width
E1
.240
.250
.280
Overall Length
D
.348
.365
.400
Tip to Seating Plane
L
.115
.130
.150
Lead Thickness
c
.008
.010
.015
b1
.040
.060
.070
b
.014
.018
.022
eB
–
–
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
.100 BSC
.430
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-018B
DS21210K-page 14
© 2007 Microchip Technology Inc.
24AA024/24LC024/24AA025/24LC025
8-Lead Plastic Small Outline (SN or OA) – Narrow, 3.90 mm Body [SOIC]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
e
N
E
E1
NOTE 1
1
2
3
α
h
b
h
A2
A
c
φ
L
A1
L1
Units
Dimension Limits
Number of Pins
β
MILLIMETERS
MIN
N
NOM
MAX
8
Pitch
e
Overall Height
A
–
1.27 BSC
–
Molded Package Thickness
A2
1.25
–
–
Standoff §
A1
0.10
–
0.25
Overall Width
E
Molded Package Width
E1
3.90 BSC
Overall Length
D
4.90 BSC
1.75
6.00 BSC
Chamfer (optional)
h
0.25
–
0.50
Foot Length
L
0.40
–
1.27
Footprint
L1
1.04 REF
Foot Angle
φ
0°
–
8°
Lead Thickness
c
0.17
–
0.25
Lead Width
b
0.31
–
0.51
Mold Draft Angle Top
α
5°
–
15°
Mold Draft Angle Bottom
β
5°
–
15°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-057B
© 2007 Microchip Technology Inc.
DS21210K-page 15
24AA024/24LC024/24AA025/24LC025
8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
N
E
E1
NOTE 1
1
2
b
e
c
A
φ
A2
A1
L
L1
Units
Dimension Limits
Number of Pins
MILLIMETERS
MIN
N
NOM
MAX
8
Pitch
e
Overall Height
A
–
0.65 BSC
–
Molded Package Thickness
A2
0.80
1.00
1.05
Standoff
A1
0.05
–
0.15
1.20
Overall Width
E
Molded Package Width
E1
4.30
6.40 BSC
4.40
Molded Package Length
D
2.90
3.00
3.10
Foot Length
L
0.45
0.60
0.75
Footprint
L1
4.50
1.00 REF
Foot Angle
φ
0°
–
8°
Lead Thickness
c
0.09
–
0.20
Lead Width
b
0.19
–
0.30
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-086B
DS21210K-page 16
© 2007 Microchip Technology Inc.
24AA024/24LC024/24AA025/24LC025
8-Lead Plastic Micro Small Outline Package (MS or UA) [MSOP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
N
E
E1
NOTE 1
1
2
e
b
A2
A
c
φ
L
L1
A1
Units
Dimension Limits
Number of Pins
MILLIMETERS
MIN
N
NOM
MAX
8
Pitch
e
Overall Height
A
–
0.65 BSC
–
Molded Package Thickness
A2
0.75
0.85
0.95
Standoff
A1
0.00
–
0.15
Overall Width
E
Molded Package Width
E1
3.00 BSC
Overall Length
D
3.00 BSC
Foot Length
L
Footprint
L1
1.10
4.90 BSC
0.40
0.60
0.80
0.95 REF
Foot Angle
φ
0°
–
8°
Lead Thickness
c
0.08
–
0.23
Lead Width
b
0.22
–
0.40
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-111B
© 2007 Microchip Technology Inc.
DS21210K-page 17
24AA024/24LC024/24AA025/24LC025
8-Lead Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
e
b
N
N
L
K
E2
E
EXPOSED PAD
NOTE 1
2
1
NOTE 1
1
2
D2
BOTTOM VIEW
TOP VIEW
A
A3
A1
NOTE 2
Units
Dimension Limits
Number of Pins
MILLIMETERS
MIN
N
NOM
MAX
8
Pitch
e
Overall Height
A
0.80
0.90
1.00
Standoff
A1
0.00
0.02
0.05
Contact Thickness
A3
0.20 REF
Overall Length
D
2.00 BSC
Overall Width
E
Exposed Pad Length
D2
1.30
–
Exposed Pad Width
E2
1.50
–
1.90
b
0.18
0.25
0.30
Contact Length
L
0.30
0.40
0.50
Contact-to-Exposed Pad
K
0.20
–
–
Contact Width
0.50 BSC
3.00 BSC
1.75
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Package is saw singulated.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-123B
DS21210K-page 18
© 2007 Microchip Technology Inc.
24AA024/24LC024/24AA025/24LC025
APPENDIX A:
REVISION HISTORY
Revision F
Corrections to Section 1.0, Electrical Characteristics.
Revision G
Added part number 24AA025 to document.
Correction to Section 1.0, Ambient Temperature.
Revision H
Added DFN package.
Revision J (02/2007)
Revised Features section; Revised Pin Function Table;
Changed 1.8V to 1.7V, Table 1-1 and Table 1-2;
Replaced Package Drawings; Replaced On-line
Support page; Revised Product ID section.
Revision K (03/2007)
Replaced Package Drawings (Rev. AM).
© 2007 Microchip Technology Inc.
DS21210K-page 19
24AA024/24LC024/24AA025/24LC025
NOTES:
DS21210K-page 20
© 2007 Microchip Technology Inc.
24AA024/24LC024/24AA025/24LC025
THE MICROCHIP WEB SITE
CUSTOMER SUPPORT
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
Users of Microchip products can receive assistance
through several channels:
• Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
• General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
• Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
•
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Development Systems Information Line
Customers
should
contact
their
distributor,
representative or field application engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is available through the web site
at: http://support.microchip.com
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com, click on Customer Change
Notification and follow the registration instructions.
© 2007 Microchip Technology Inc.
DS21210K-page 21
24AA024/24LC024/24AA025/24LC025
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
To:
Technical Publications Manager
RE:
Reader Response
Total Pages Sent ________
From: Name
Company
Address
City / State / ZIP / Country
Telephone: (_______) _________ - _________
FAX: (______) _________ - _________
Application (optional):
Would you like a reply?
Y
N
Device: 24AA024/24LC024/24AA025/24LC025
Literature Number: DS21210K
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
DS21210K-page 22
© 2007 Microchip Technology Inc.
24AA024/24LC024/24AA025/24LC025
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
X
/XX
Temperature
Range
Device:
Package
24AA024: 1.7V, 2 Kbit Addressable Serial EEPROM with
WP pin.
24AA024T:1.7V, 2 Kbit Addressable Serial EEPROM
(Tape and Reel) with WP pin.
24LC024: 2.5V, 2 Kbit Addressable Serial EEPROM with
WP pin.
24LC024T:2.5V, 2 Kbit Addressable Serial EEPROM
(Tape and Reel) with WP pin.
24AA025: 1.7V, 2 Kbit Addressable Serial EEPROM with
no WP pin.
24AA025T:1.7V, 2 Kbit Addressable Serial EEPROM
(Tape and Reel) with no WP pin.
24LC025: 2.5V, 2 Kbit Addressable Serial EEPROM
(Tape and Reel) with no WP pin.
24LC025T:2.5V, 2 Kbit Addressable Serial EEPROM
(Tape and Reel) with no WP pin.
Temperature Range:
I
Package:
P
SN
ST
MS
MC
=
Examples:
a)
b)
c)
d)
e)
f)
24AA024-I/P: Industrial Temperature,
1.7V, PDIP Package
24AA024-I/SN: Industrial Temperature,
1.7V, SOIC Package
24AA025T-I/ST: Industrial Temperature,
1.7V, TSSOP Package, Tape and Reel,
no WP
24LC024-I/P: Industrial Temperature,
2.5V, PDIP Package
24LC024-I/MS: Industrial Temperature,
2.5V, MSOP Package, Tape and Reel
24LC025-T-I/SN: Industrial Temperature,
2.5V, SOIC Package, Tape and Reel, No
WP
-40°C to +85°C
=
=
=
=
=
Plastic DIP, (300 mil Body), 8-lead
Plastic SOIC, (3.90 mm Body)
TSSOP, 8-lead
MSOP, 8-lead
2x3 DFN, 8-lead
© 2007 Microchip Technology Inc.
DS21210K-page 23
24AA024/24LC024/24AA025/24LC025
NOTES:
DS21210K-page 24
© 2007 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC,
PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and
SmartShunt are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
AmpLab, FilterLab, Linear Active Thermistor, Migratable
Memory, MXDEV, MXLAB, PS logo, SEEVAL, SmartSensor
and The Embedded Control Solutions Company are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, ECAN,
ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi,
MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit,
PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,
PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB,
rfPICDEM, Select Mode, Smart Serial, SmartTel, Total
Endurance, UNI/O, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2007, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona, Gresham, Oregon and Mountain View, California. The
Company’s quality system processes and procedures are for its PIC®
MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial
EEPROMs, microperipherals, nonvolatile memory and analog
products. In addition, Microchip’s quality system for the design and
manufacture of development systems is ISO 9001:2000 certified.
© 2007 Microchip Technology Inc.
DS21210K-page 25
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Habour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-4182-8400
Fax: 91-80-4182-8422
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Atlanta
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Tel: 678-957-9614
Fax: 678-957-1455
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Tel: 774-760-0087
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Canada
Tel: 905-673-0699
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Tel: 61-2-9868-6733
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Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Korea - Gumi
Tel: 82-54-473-4301
Fax: 82-54-473-4302
China - Fuzhou
Tel: 86-591-8750-3506
Fax: 86-591-8750-3521
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Malaysia - Penang
Tel: 60-4-646-8870
Fax: 60-4-646-5086
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Tel: 86-532-8502-7355
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Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-572-9526
Fax: 886-3-572-6459
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803
China - Shunde
Tel: 86-757-2839-5507
Fax: 86-757-2839-5571
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Xian
Tel: 86-29-8833-7250
Fax: 86-29-8833-7256
12/08/06
DS21210K-page 26
© 2007 Microchip Technology Inc.