FREESCALE MPXC2011DT1

Pressure
Freescale Semiconductor
MPXC2011DT1
Rev 6, 10/2008
High Volume Sensor for Low
Pressure Applications
Freescale Semiconductor has developed a low cost, high volume, miniature
pressure sensor package which is ideal as a sub-module component or a
disposable unit. The unique concept of the Chip Pak allows great flexibility in
system design while allowing an economic solution for the designer. This new
chip carrier package uses Freescale Semiconductor's unique sensor die with its
piezoresistive technology, along with the added feature of on-chip, thin-film
temperature compensation and calibration.
NOTE:Freescale Semiconductor is also offering the Chip Pak package in
application-specific configurations, which will have an “SPX” prefix,
followed by a four-digit number, unique to the specific customer
Features
•
•
•
•
Low Cost
Integrated Temperature Compensation and Calibration
Ratiometric to Supply Voltage
Polysulfone Case Material (Medical, Class V Approved)
• Provided in Easy-to-Use Tape and Reel
MPXC2011DT1
MPXC2012DT1
Pressure Sensors
0 to 75 mmHG
(0 to 10 kPa)
Application Examples
•
•
•
•
Respiratory Diagnostics
Air Movement Control
Controllers
Pressure Switching
ORDERING INFORMATION
Device Name
MPXC2011DTI
MPXC2012DTI
Package Options
Tape and Reel
Tape and Reel
Case
No.
423A
423A
Gauge
Pressure Type
Differential
•
•
Absolute
Device Marking
Date Code, Lot ID
Date Code, Lot ID
CHIP PAK PACKAGE
MPXC2011DT1/MPXC2012DT1
CASE 423A-03
NOTE: The die and wire bonds are exposed on the front side of the Chip Pak (pressure is applied to the backside of the device).
Front side die and wire protection must be provided in the customer's housing. Use caution when handling the devices
during all processes.
© Freescale Semiconductor, Inc., 2006, 2008. All rights reserved.
Pressure
Freescale Semiconductor's MPXC2011DT1/
MPXC2012DT1 Pressure Sensor has been designed for
medical usage by combining the performance of Freescale
Semiconductor's shear stress pressure sensor design and
the use of biomedically approved materials. Materials with a
proven history in medical situations have been chosen to
provide a sensor that can be used with confidence in
applications, such as invasive blood pressure monitoring. It
can be sterilized using ethylene oxide. The portions of the
pressure sensor that are required to be biomedically
approved are the rigid housing and the gel coating.
The rigid housing is molded from a white, medical grade
polysulfone that has passed extensive biological testing
including: tissue culture test, rabbit implant, hemolysis,
intracutaneous test in rabbits, and system toxicity, USP.
The MPXC2011DT1 contains a silicone dielectric gel
which covers the silicon piezoresistive sensing element. The
gel is a nontoxic, nonallergenic elastomer system which
meets all USP XX Biological Testing Class V requirements.
The properties of the gel allow it to transmit pressure
uniformly to the diaphragm surface, while isolating the
internal electrical connections from the corrosive effects of
fluids, such as saline solution. The gel provides electrical
isolation sufficient to withstand defibrillation testing, as
specified in the proposed Association for the Advancement of
Medical Instrumentation (AAMI) Standard for blood pressure
transducers. A biomedically approved opaque filler in the gel
prevents bright operating room lights from affecting the
performance of the sensor.
The MPXC2012DT1 is a no-gel option.
MPXC2011DT1
2
Sensors
Freescale Semiconductor
Pressure
MAXIMUM RATINGS
Table 1. Maximum Ratings(1)
Rating
Symbol
Value
Unit
Maximum Pressure (Backside)
Pmax
75
kPa
Storage Temperature
Tstg
-25 to +85
°C
Operating Temperature
TA
+15 to +40
°C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
OPERATING CHARACTERISTICS
Table 2. Operating Characteristics (VS = 10 Vdc, TA = 25°C unless otherwise noted, P1 > P2)
Characteristic
Symbol
Min
Typ
Max
Unit
Pressure Range(1)
POP
0
—
10
kPa
Supply Voltage(2)
VS
—
3
10
Vdc
Supply Current
Io
—
6.0
—
mAdc
VFSS
24
25
26
mV
Voff
-1.0
—
1.0
mV
Sensitivity
ΔV/ΔP
—
2.5
—
mV/kPa
Linearity(5)
—
-1.0
—
1.0
%VFSS
Pressure Hysteresis(5) (0 to 10 kPa)
—
—
±0.1
—
%VFSS
Temperature Hysteresis(5) (+15°C to +40°C)
—
—
±0.1
—
%VFSS
TCVFSS
-1.0
—
1.0
%VFSS
TCVoff
-1.0
—
1.0
mV
Input Impedance
Zin
1300
—
2550
Ω
Output Impedance
Zout
1400
—
3000
Ω
Response Time(6) (10% to 90%)
tR
—
1.0
—
ms
Warm-Up
—
—
20
v
ms
Offset Stability(7)
—
—
±0.5
—
%VFSS
Full Scale Span(3)
Offset(4)
Temperature Effect on Full Scale Span(5)
Temperature Effect on Offset(5)
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self-heating.
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
4. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
5. Accuracy (error budget) consists of the following:
Linearity:
Output deviation from a straight line relationship with pressure, using end point method, over the specified
pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25°C.
TcSpan:
Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.
TcOffset:
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C.
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
7. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
MPXC2011DT1
Sensors
Freescale Semiconductor
3
Pressure
PACKAGE DIMENSIONS
STYLE 2:
PIN 1. GND
2. S+
3. Vs
4. S-
CASE 423A-03
ISSUE C
CHIP PAK PACKAGE
MPXC2011DT1
4
Sensors
Freescale Semiconductor
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MPXC2011DT1
Rev. 6
10/2008
D2
INCHES
MILLIMETERS
DIM MIN
MAX MIN
MAX
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D2
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0.088
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circuits or integrated circuits based on the information in this document.
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particular
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