Pressure Freescale Semiconductor MPXH6250A Rev 3, 10/2009 High Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure, On-Chip Signal Conditioned, Temperature Compensated and Calibrated The Freescale MPXH6250A series sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. The small form factor and high reliability of on-chip integration make the Freescale MAP sensor a logical and economical choice for automotive system designers. The MPXH6250A series piezoresistive transducer is a state-of-the-art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. MPXH6250A MPXHZ6250A Series 20 to 250 kPa (3 to 36 psi) 0.3 to 4.9 V Output Application Examples • Industrial Controls • Engine Control/Manifold Absolute Pressure (MAP)/Liquefied Petroleum Gas (LPG) Features • • • • • • Improved Accuracy at High Temperature Available in Super Small Outline Package 1.5% Maximum Error over 0° to 85°C Ideally suited for Microprocessor or Microcontroller-Based Systems Temperature Compensated from -40° to +125°C Durable Thermoplastic (PPS) Surface Mount Package ORDERING INFORMATION # of Ports Case Device Name No. None Single Dual Super Small Outline Package (MPXH6250A Series) MPXH6250A6U 1317 • MPXH6250A6T1 1317 • MPXH6250AC6U 1317A • MPXH6250AC6T1 1317A • Super Small Outline Package (Media Resistant Gel) (MPXHZ6250A Series) MPXHZ6250A6T1 1317 • MPXHZ6250A6U 1317 • MPXHZ6250AC6T1 1317A • Gauge Pressure Type Differential SUPER SMALL OUTLINE PACKAGE MPXH6250A6U/6T1 MPXHZ6250A6U/6T1 CASE 1317 © Freescale Semiconductor, Inc., 2007-2009. All rights reserved. MPXH6250AC6U/C6T1 MPXHZ6250AC6T1 CASE 1317A Absolute Device Marking • • • • MPXH6250A MPXH6250A MPXH6250A MPXH6250A • • • MPXHZ6250A MPXHZ6250A MPXHZ6250A Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 5.1 Vdc, TA = 25°C unless otherwise noted, P1 > P2.) Characteristic Symbol Min Typ Max Unit Pressure Range POP 20 — 250 kPa Supply Voltage(1) VS 4.74 5.1 5.46 Vdc Supply Current Io — 6.0 10 mAdc 0.133 0.204 0.274 4.826 4.896 4.966 4.552 4.692 4.833 — — — ±1.5 %VFSS V/P — 20 20.4 — mV/kPa Response Time(6) tR — 1.0 — ms Warm-Up Time(7) — — 20 — ms Offset Stability(8) — — ±0.25 — %VFSS Minimum Pressure Offset @ VS = 5.1 Volts(2) (0 to 85°C) Full Scale Output @ VS = 5.1 Volts(3) (0 to 85°C) Full Scale Span @ VS = 5.1 Volts(4) (0 to 85°C) Accuracy(5) (0 to 85°C) Sensitivity Voff Vdc VFSO Vdc VFSS Vdc 1. Device is ratiometric within this specified excitation range. 2. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 3. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 4. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 5. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at 25°C due to all sources of error including the following: Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. TcSpan: Output deviation over the temperature range of 0 to 85°C, relative to 25°C. TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C. Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 8. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPXH6250A 2 Sensors Freescale Semiconductor Pressure Maximum Ratings Table 2. Maximum Ratings(1) Rating Symbol Value Unit Maximum Pressure (P1 > P2) PMAX 1000 kPa Storage Temperature TSTG -40 to +125 °C Operating Temperature TA -40 to +125 °C Output Source Current @ Full Scale Output(2) Io + 0.5 mAdc Output Sink Current @ Minimum Pressure Offset2 Io – -0.5 mAdc 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. 2. Maximum Output Current is controlled by effective impedance from Vout to GND or Vout to VS in the application circuit. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. VS 2 Thin Film Temperature Compensation and Gain Stage #1 Sensing Element Gain Stage #2 and Ground Reference Shift Circuitry 1 Vout 3 GND Pins 1, 5, 6, 7, and 8 are NO CONNECTS for super small outline package devices. Figure 1. Integrated Pressure Sensor Schematic MPXH6250A Sensors Freescale Semiconductor 3 Pressure On-chip Temperature Compensation and Calibration Figure 2 illustrates the absolute sensing chip in the basic Super Small Outline chip carrier (Case 1317). Figure 3 illustrates a typical application circuit (output source current operation). Figure 4 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves are shown for operation over 0 to 85°C temperature range. The output will saturate outside of the rated pressure range. A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPXH6250A series pressure sensor operating characteristics, internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Fluorosilicone Gel Die Coat Stainless Steel Cap Die P1 Wire Bond Thermoplastic Case Lead Frame Absolute Element Die Bond Sealed Vacuum Reference Figure 2. Cross Sectional Diagram SSOP (not to scale) +5.1 V VS Pin 2 MPXH6250A VOUT Pin 4 100 nF To ADC 47 pF GND Pin 3 51 K Figure 3. Typical Application Circuit (Output Source Current Operation) 5.0 4.5 4.0 Output (Volts) 3.5 Transfer Function: Vout = Vs*(0.0040*P-0.040) ± Error VS = 5.1 Vdc Temperature = 0 to 85°C 3.0 2.5 MAX TYP 2.0 1.5 0.5 0 MIN 20.0 31.5 43.0 54.5 66.0 77.5 89.0 100.5 112.0 123.5 135.0 146.5 158.0 169.5 181.0 192.5 204.0 215.5 227.0 238.5 250.0 1.0 Pressure (Reference to Sealed Vacuum) in kPa Figure 4. Output vs. Absolute Pressure MPXH6250A 4 Sensors Freescale Semiconductor Pressure Transfer Function Nominal Transfer Value: Vout = VS x (0.004 x P - 0.040) ± (Pressure Error x Temp Factor x 0.004 x VS) VS = 5.1 ± 0.36 Vdc Temperature Error Band 4.0 Break Points 3.0 Temperature Error Factor 2.0 Temp Multiplier -40 0 to 85 125 3 1 1.75 1.0 0.0 -40 -20 0 20 40 80 60 100 120 140 Temperature in °C NOTE: The Temperature Multiplier is a linear response from 0°C to -40°C and from 85°C to 125°C. Pressure Error Band 4.0 Error Limits for Pressure Pressure Error (kPa) 3.0 2.0 1.0 0.0 -1.0 20 60 100 140 180 220 260 Pressure (in kPa) 300 -2.0 -3.0 Pressure -4.0 20 to 250 (kPa) Error (Max) ±3.45 (kPa) SURFACE MOUNTING INFORMATION Minimum Recommended Footprint for Super Small Outline Packages Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a solder reflow process. It is always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts. 0.050 1.27 TYP 0.387 9.83 0.150 3.81 0.027 TYP 8X 0.69 0.053 TYP 8X 1.35 inch mm Figure 5. SSOP Footprint (Case 1317 and 1317A) MPXH6250A Sensors Freescale Semiconductor 5 Pressure PACKAGE DIMENSIONS PAGE 1 OF 3 CASE 1317-04 ISSUE F SUPER SMALL OUTLINE PACKAGE MPXH6250A 6 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS PAGE 2 OF 3 CASE 1317-04 ISSUE F SUPER SMALL OUTLINE PACKAGE MPXH6250A Sensors Freescale Semiconductor 7 Pressure PACKAGE DIMENSIONS PAGE 3 OF 3 CASE 1317-04 ISSUE F SUPER SMALL OUTLINE PACKAGE MPXH6250A 8 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1317A-04 ISSUE D SUPER SMALL OUTLINE PACKAGE MPXH6250A Sensors Freescale Semiconductor 9 Pressure PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1317A-04 ISSUE D SUPER SMALL OUTLINE PACKAGE MPXH6250A 10 Sensors Freescale Semiconductor How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. 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Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. All rights reserved. MPXH6250A Rev. 3 10/2009