1/4 TR0636E-20033 IT3D(M)-300S-BGA (57) Cross Sectioning TEST REPORT APPROVED TY. ARAI CHECKED TM.MATSUO PREPARED TY.TAKADA HIROSE ELECTRIC CO., LTD. 2/4 [1] Objective To evaluate SnCu intermetallic at BGA joints by cross sectioning initial state and post 3500 thermal cycle in accordance with IPC-9701. [2] Specimens No. Product Assembly State # of specimens 1 IT3D-300S-BGA (57) Raw connector Initial 1 2 IT3M-300S-BGA (57) Virgin Initial 1 3 IT3M-300S-BGA (57) Reworked Initial 1 4 IT3D-300S-BGA (57) Virgin Initial 1 5 IT3D-300S-BGA (57) Reworked Initial 1 6 IT3M-300S-BGA (57) Virgin Post 1 3500 cycles 7 IT3M-300S-BGA (57) Reworked Post 1 3500 cycles 8 IT3D-300S-BGA (57) Virgin Post 1 3500 cycles 9 IT3D-300S-BGA (57) Reworked Post 3500 cycles Remarks *Specimens are assembled as Fig.1. *The test board design is based on IPC-9701 specification. *Thickness of the PCB: 3.3mm [3] Test Period From: To 2007-09-12 : 2008-01-18 Fig.1 1 3/4 Cross Sectioning 1. Requirements SnCu intermetallic is observed at ‘the solder to connector pin interface’ and ‘the solder to pad interface’. 2. Conditions 2-1 Test condition 0 (+10 / 0 C ) ( 0 / -100C ) Test cycle : 3500 cycles 2-2 Cross Sectioning Locations st 1 Column of Solder Joints Pin 1 Side st 1 Row of Solder Joints 4/4 3. Results Typical SnCu intermetallic was observed in all specimens. Cross sections are shown in the attachment : TR060E_20033_CROSS_SECTIONING_Analysis TR0636E-20033 - IT3 CROSS SECTIONING Analysis TR0636E-20033 IT3 CROSS SECTIONING ANALYSIS Preliminary Analysis Time-Zero September 12, 2007 No.1 SnPb Raw Connector X-Ray Image Typical Solder Joint 100 micron Cross-section Target Pin 10 micron No.2 /IT3M-300S-BGA(57) / Virgin / Initial SnPb_MB_026 Conn-2 X-Ray Image Typical Solder Joint 100 micron Cross-section Target PCB 10 micron Pin 10 micron No.3 /IT3M-300S-BGA(57) / Reworked / Initial SnPb_MB_026 Conn-1 X-Ray Image Typical Solder Joint 100 micron Cross-section Target Pin PCB 10 micron 10 micron No.4 /IT3D-300S-BGA(57) / Virgin / Initial SnPb_DC_027 Conn-2 X-Ray Image Typical Solder Joint 100 micron Cross-section Target Pin PCB 10 micron 10 micron No.5 /IT3D-300S-BGA(57) / Reworked / Initial SnPb_DC_027 Conn-1 X-Ray Image Typical Solder Joint 100 micron Cross-section Target PCB 10 micron Pin 10 micron Post L2 ATC Analysis 3500 Cycles January 18, 2008 No.6 /IT3M-300S-BGA(57) / Virgin / Post 3500 cycles SnPb_MB_027 Conn-2 X-Ray Image Typical Solder Joint 100 micron Cross-section Target IMC - Pin IMC - PCB 10 micron 10 micron No.7 /IT3M-300S-BGA(57) / Reworked / Post 3500 cycles SnPb_MB_027 Conn-1 X-Ray Image Typical Solder Joint 100 micron Cross-section Target IMC - Pin IMC - PCB 1000X 10 micron 1000X 10 micron No.8 /IT3D-300S-BGA(57) / Virgin / Post 3500 cycles SnPb_DC_026 Conn-2 X-Ray Image Typical Solder Joint 100 micron Cross-section Target IMC - Pin IMC - PCB 10 micron 10 micron No.9 /IT3D-300S-BGA(57) / Reworked / Post 3500 cycles SnPb_DC_026 Conn-1 X-Ray Image Typical Solder Joint 100 micron Cross-section Target IMC - Pin IMC - PCB 10 micron 10 micron