Wire Bondable Resistor Network Arrays Chip Network Array Series • Absolute tolerances to ±0.1% • Tight TCR tracking to ±5ppm/°C • Ratio match tolerances to ±0.05% • Ultra-stable tantalum nitride resistors IRC’s TaNSil® network array resistors are ideally suited for applications that demand a small footprint. The small wire bondable chip package provides higher component density, lower resistor cost and high reliability. The tantalum nitride film system on silicon provides precision tolerance, exceptional TCR tracking and low cost. Excellent performance in harsh, humid environments is a trademark of IRC’s self-passivating TaNSil® resistor film. For applications requiring high performance resistor networks in a low cost, wire bondable package, specify IRC network array die. Electrical Data Resistance Range TCR/Inspection Code Table Isolated Bussed 10Ω to 2.5MΩ 10Ω to 1.25MΩ Absolute Tolerance Ratio Tolerance to R1 to ±0.1% to ±0.05% to ±0.1% Absolute TCR to ±25ppm/°C Tracking TCR to ±5ppm/°C Element Power Rating Package Power Rating 100mW @ 70°C 8-Pad 400mW @ 70°C 16-Pad 800mW @ 70°C 24-Pad 1.0W @ 70°C Rated Operating Voltage (not to exceed √ P x R) Operating Temperature MIL Inspection Code* ±300ppm/°C 00 04 ±100ppm/°C 01 05 ±50ppm/°C 02 06 ±25ppm/°C 03 07 *Notes: Product supplied to Class H of MIL-PRF 38534 include 100% visual inspection Power Derating Data -55°C to +150°C <-30dB Substrate Material Substrate Thickness Oxidized Silicon (10KÅ SiO2 minimum) 0.016˝ ±0.001 (0.406mm ±0.01) Aluminum 10KÅ minimum Gold 15KÅ minimum Silicon (gold available) Backside Passivation Commercial Code 100V Noise Bond Pad Metallization 50mW @ 70°C Absolute TCR Silicon Dioxide or Silicon Nitride General Note IRC reserves the right to make changes in product specification without notice or liability. All information is subject to IRC’s own data and is considered accurate at time of going to print. © IRC Advanced Film Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com A subsidiary of TT electronics plc WBC Series Issue January 2009 Sheet 1 of 4 Wire Bondable Resistor Network Arrays Manufacturing Capabilities Data Isolated schematic A Absolute TCR (±ppm/°C) Bussed schematic B Ohmic range (Ω) Available tolerances Available ratio tolerances Best TCR tracking (±ppm/°C) Ohmic range (Ω) Available tolerances Available ratio tolerances Best TCR tracking (±ppm/°C) 10 - 25 FGJ FG 50 10 - 25 FGJ FG 200 26 - 50 DFGJ CDF 10 26 - 50 FGJ DFG 100 51 - 200 CDFGJ CDFG 5 51 - 100 DFGJ CDFG 50 201 - 2.5M BCDFGJ ABCDFG 5 101 - 200 DFGJ BCDFG 25 201 - 500 BCDFGJ BCDFG 20 300 501 - 1.25M B C D F G J A B C D F G 100 5 26 - 50 DFGJ CDFG 10 26 - 50 FGJ DFG 100 51 - 200 CDFGJ CDFG 5 51 - 100 DFGJ CDFG 50 201 - 2.5M BCDFGJ ABFG 5 101 - 200 DFGJ BCDFG 25 201 - 500 BCDFGJ BCDFG 20 501 - 350K BCDFGJ ABCDFG 5 26 - 50 DFGJ CDFG 10 51 - 100 DFGJ CDFG 50 51 - 200 CDFGJ CDFG 5 101 - 200 DFGJ BCDFG 25 201 - 2.5M BCDFGJ ABFG 5 201 - 500 BCDFGJ BCDFG 20 50 501 - 1.25M B C D F G J A B C D F G 51 - 200 CDFGJ CDFG 5 201 - 2.5M BCDFGJ ABFG 5 201 - 500 BCDFGJ BCDFG 5 20 25 © IRC Advanced Film Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com 501 - 1.25M B C D F G J A B C D F G 5 WBC Series Issue January 2009 Sheet 2 of 4 Wire Bondable Resistor Network Arrays Physical Data DSS4A DSS4X 8 7 6 5 1 2 3 4 0.070˝ ±0.001 (1.778mm ±0.025) 0.070˝ ±0.001 (1.778mm ±0.025) R1 DSS4B 8 Pad 1 7 6 5 2 3 4 R1 0.004˝ min Bond Pads 1 DSS8X DSS8A 0.080˝ ±0.001 (2.032mm ±0.025) 0.140˝ ±0.001 (3.556mm ±0.025) 16 15 14 13 12 11 10 9 1 2 3 4 5 6 7 8 R1 DSS8B Pad 1 16 15 14 13 12 11 10 9 1 2 3 4 5 6 7 8 0.004˝ min Bond Pads R1 © IRC Advanced Film Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com WBC Series Issue January 2009 Sheet 3 of 4 Wire Bondable Resistor Network Arrays Physical Data DQSCX DQSCA 0.115˝ ±0.001 (2.921mm ±0.025) 24 23 22 21 20 19 18 17 16 15 14 13 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14 13 1 2 3 4 5 6 7 8 9 10 11 12 0.086˝ ±0.001 (2.184mm ±0.025) R1 DQSCB Pad 1 R1 0.004˝ min Bond Pads Environmental Data Ordering Data Prefix Method Max ∆R Typical ∆R MIL-STD-202 Method 107 Test condition F ±0.1% ±0.02% High Temperature Exposure MIL-STD-883 Method 1008 150°C, 1000 hours ±0.1% Low Temperature Storage -55°C, 1000 hours ±0.03% Life MIL-STD-202 Method 108 70°C, 1000 hours ±0.5% MIL-STD-202 Method 108 125°C, 1000 hours ±0.5% Test Thermal Shock Life at Elevated Temperature DSS8 - B - 01 - 1002 - F - B DSS4 = 8-pad Network DSS8 = 6-pad Network DQSC = 24-pad Network Schematic and Termination A = Isolated; B = Bussed TCR/Inspection Code Reference TCR/Inspection Code Table ±0.05% Resistance Code 4-Digit Resistance Code Ex: 1002 = 10KΩ, 50R1 = 50.1Ω ±0.01% Absolute Tolerance Code J = ±5%; G = ±2%; F = ±1%; D = ±0.5%; C = ±0.25%; B = ±0.1% Ratio Tolerance Code (optional) ±0.01% G = ±2%; F = ±1%; D = ±0.5%; C = ±0.25%; B = ±0.1%; A = 0.05% Packaging ±0.05% © IRC Advanced Film Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com WBD Style Standard packaging is 2˝ x 2˝ chip tray. For additional information or to discuss your specific requirements, please contact our Applications Team using the contact details below. WBC Series Issue January 2009 Sheet 4 of 4