Communications modu les & subs ystem S Multiprotocol XFP Optical Transceiver—1310 nm for up to 10 km Reach JXP Series Key Features •Compliant with SONET OC-192 SR-1, 10 G Ethernet and 10 G Fibre Channel 10GBASE-LR, and corresponding Forward Error Correction (FEC) rates from 9.95 Gbps to 11.35 Gbps •1310 nm optical signals for up to 10 km reach •RoHS 6/6 compliant •Industrial operating case temperature range from -40˚C to 85˚C •Low power consumption (< 2.5 W max) •Excellent EMI performance •Digital diagnostic monitoring support •XFI system loopback implemented Applications •Wide area network (WAN) •Local area network (LAN) •Storage area network (SAN) •SONET OC-192 applications •SDH STM-64 applications •Ethernet switches and applications •Fibre Channel switches and applications Compliance •Telcordia GR-253-CORE standard •ITU-T G.691 standard •IEEE 802.3-2005 Clause 52 standard •10GFC 1200-SM-LL-L standard •Class 1 Laser Safety •Tested in accordance with Telcordia GR-468 NORTH AMERICA: 800 498-JDSU (5378) The JDSU 10 Gbps 1310 nm multiprotocol XFP optical transceiver is a fully duplexed, integrated fiber optic transceiver that provides a high-speed serial link at signaling rates from 9.95 to 11.35 Gbps. The module complies with the 10 Gigabit Small Form Factor Pluggable (XFP) multisource agreement (MSA). The 1310 nm XFP also complies with Telcordia GR-253-CORE (SONET) OC-192 SR-1 and ITU-T G.691 (SDH) STM-64 I-64.1 for 2 km reach, and IEEE 802.3-2005 Clause 52 (Ethernet) 10GBASE-LR and 10GFC (Fibre Channel) 1200-SM-LL-L for 10 km reach. The 10 Gbps multiprotocol XFP optical transceiver integrates the receive and transmit path on one module. On the transmit side, the 10 Gbps serial data stream is recovered, retimed, and passed to a laser driver. The laser driver modulates a 1310 nm semicooled external modulated laser (EML), enabling data transmission over single-mode fiber through an industry standard LC connector. On the receive side, the 10 Gbps optical data stream is recovered from a PIN photodetector/ transimpedance amplifier, retimed, and passed to an output driver. This module features a hot-pluggable, XFI-compliant electrical interface. worldwide : +800 5378-JDSU WEBSITE: www.jdsu.com Multiprotoco l XFP O ptica l Transcei ver —1310 nm for up to 10 km Reach 2 Section 1 Functional Description The 10 Gbps 1310 nm multiprotocol XFP optical transceiver is a fully duplexed serial electric, serial optical device with both transmit and receive functions contained in a single module that provides a high-speed serial link at signaling rates from 9.95 to 11.35 Gbps. It is designed to be compliant with Telcordia GR-253CORE OC-192 SR-1 for 2 km reach (SONET), ITU-T G.691 STM-64 I-64.1 for 2 km reach (SDH), IEEE 802.3-2005 Clause 52 10GBASE-LR and 10G BASE-LW for 10 km reach (Ethernet) and 10GFC 1200-SM-LL-L for 10 km reach (Fibre Channel). The transceiver is also fully compliant with the 10 Gigabit Small Form Factor XFP Pluggable Module MSA INF8077i Rev. 4.5. A block diagram of the 10 Gbps 1310 nm multiprotocol XFP optical transceiver is shown in Figure 1. The 10 Gbps 1310 nm multiprotocol XFP optical transceiver locks to data without the requirement of reference clock. The reference clock inputs have an internal 100 Ω differential line-to-line termination. It has several low-speed interface connections, including a two-wire serial interface. These connections include module not ready (Mod_NR), module deselect (Mod_DeSel), Interrupt, transmitter disable (TX_DIS), module absent (Mod_ABS), receive loss (RX_LOS), and power down/reset (P_Down/RST). The XFP transceiver also supports XFI loopback. In this mode, data input on the electrical Tx pins of the XFP module is retimed and is redirected to the Rx pins of the module. This facilitates system-side test and debug operations. Transmitter The transmitter path converts serial NRZ electrical data from line rate of 9.95 to 11.35 Gbps to a standard compliant optical signal. The transmitter accepts a 100 Ω differential 120 mV peak-to-peak to 820 mV peak-to-peak 10 Gbps CML electrical signal on TD- and TD+ pins. Inside the module, the differential signals pass through a signal conditioner with equalization that compensates for losses and deterministic jitter present on the input data stream. The transmit CDR function generates a clock that is at the same frequency as the incoming data bit rate of the electrical data input. The clock is phase aligned by a phase locked loop (PLL) that samples the data in the center of the data eye pattern. The CDR function does not require a reference clock to “lock” to incoming data. The CDR contains a lock detect circuit that indicates successful locking of the PLL onto the incoming data. The output of the Tx signal conditioner is input to the laser driver circuit, which transforms the small swing digital voltage to an output modulation that drives a semi-cooled, electroabsorption (EA) modulator. The optical signal is engineered to meet the SONET/SDH, 10 G Ethernet, 10 G Fibre Channel and corresponding forward error correction (FEC) rates specifications. Closed-loop control of the transmitted laser power and modulation swing over temperature and voltage variations is provided. The laser is coupled to single-mode optical fiber through an industrystandard LC optical connector. Multiprotoco l XFP O ptica l Transcei ver —1310 nm for up to 10 km Reach 3 Receiver The receiver converts incoming DC balanced serial NRZ optical data from line rate of 9.95 to 11.35 Gbps into serial XFI electrical data. Light is coupled to a PIN photodetector from single-mode optical fiber through an industry-standard LC optical connector. The electrical current from the PIN photodetector is converted to a voltage in a high-gain transimpedance amplifier. The amplified signal is passed to a signal conditioning IC that provides clock and data recovery. The receive CDR function generates a clock that is at the same frequency as the incoming data bit rate of the optical data input. The clock is phase aligned by a PLL that samples the data in the center of the data eye pattern. The CDR function does not require a reference clock to “lock” to incoming data. The CDR contains a lock detect circuit that indicates successful locking of the PLL onto the incoming data. Loss of signal, and signal lock detection is included in the receive circuitry that is reflected in the Mod_NR status pin. The recovered data is output on the RD+ and RD- pins as a 100 Ω 340 mV peak-to-peak CML signal. The output signal meets the XFP MSA requirements. Vcc3 Vcc5 Power Supply Sequence / In Rush Control Circuit Vcc2 Vee5 GND No Connect Transceiver Ground ROSA RD- CDR / Limiting Amplifier RD+ SCL MicroProcessor SDA TDTD+ TIA Laser Control Circuit CDR / Equalizer RX_LOS MOD_NR INTERRUPT TOSA Vcc3 Vcc3 GND REFCLK+ REFCLKTX_DIS MOD_DESEL PDOWN/RST Figure 1 Vcc3 MOD_ABS JDSU 10 Gbps 1310 nm multiprotocol XFP optical transceiver functional block diagram Multiprotoco l XFP O ptica l Transcei ver —1310 nm for up to 10 km Reach 4 Low-speed Signaling Low-speed signaling is based on low voltage TTL (LVTTL) operating at a nominal voltage of 3.3 V. SCL/SDA: Two-wire serial interface clock and data line. Hosts should use a pull-up resistor connected to Vcc 3.3 V on the two-wire interface SCL (clock), SDA (data), and all low speed outputs. Mod_NR: Output pin. When asserted high, indicates that the module has detected a condition that renders Tx and or Rx data invalid. Mod_DeSel: Input pin. When held low by the host the module responds to two-wire serial communication commands. When high, the module does not respond to, or acknowledge any, two-wire interface communication from the host. Interrupt: Output pin. When low, indicates possible module operational fault or a status critical to the host system. TX_DIS: Input pin. When asserted high, the transmitter output is turned off. Mod_ABS: Output pin. Asserted high when the XFP module is absent, and is pulled low when the XFP module is inserted. RX_LOS: Output pin. Asserted high when insufficient optical power for reliable signal reception is received. P_Down/RST: Multifunction input pin. The module can be powered down or reset by pulling the low-speed, P-Down pin high. In power-down mode, no data is transmitted on the optical Tx or the electrical Rx path. The reset pulse is generated on the falling edge of the P-Down signal. Following reset, the internal PLLs must reacquire lock and will temporarily indicate a Mod_NR failure until the PLLs reacquire lock. Section 2 Application Schematics Recommended MSA connections to the 10 Gbps 1310 nm multiprotocol XFP optical transceiver are shown in Figure 2. Power supply filtering is recommended for the JDSU 10 Gbps 1310 nm multiprotocol XFP optical transceiver. To limit wide band noise power, the host system and module shall each meet a maximum of two percent peak-to-peak noise when measured with a one MHz low-pass filter. In addition, the host system and the module shall each meet a maximum of three percent peak-to-peak noise when measured with a filter from 1 – 10 MHz. Multiprotoco l XFP O ptica l Transcei ver —1310 nm for up to 10 km Reach 5 2 TD +/- 2 RX_LOS Mod_NR Mod_Abs Interrupt OUTPUT TX_DIS P_Down/RST 2 Mod_DeSel SCL/SDA INPUT GND 5V +3.3 V POWER XFP Module RD +/- ROSA CDR System Loopback LC uController CDR Figure 2 TIA Laser Driver LC TOSA Application schematics for the 10 Gbps 1310 nm XFP optical transceiver Section 3 Specifications Technical specifications related to the 10 Gbps 1310 nm multiprotocol XFP optical transceiver includes: • Section 3.1 Pin Function Definitions • Section 3.2 XFP/XFI Reference Model Compliance Points • Section 3.3 Absolute Maximum Ratings • Section 3.4 Operating Conditions • Section 3.5 Electrical Characteristics • Section 3.6 Jitter Specifications • Section 3.7 Timing Requirement of Control and Status I/O • Section 3.8 XFP Two-wire Interface Protocol and Management Interface • Section 3.9 Optical Transmitter Characteristics • Section 3.10 Optical Receiver Characteristics • Section 3.11 Regulatory Compliance • Section 3.12 PCB Layout • Section 3.13 Module Outline • Section 3.14 Connectors Multiprotocol XFP Optical Transceiver —1310 nm for up to 10 km Reach 6 GND 15 RD- RX_LOS 14 18 RD+ Mod_NR 13 19 GND Mod_ASB 12 20 VCC2 SDA 11 21 P_Down/RST SCL 10 22 VCC2 VCC3 9 23 GND VCC3 8 24 RefCLK+ GND 7 25 RefCLK- VCC5 6 26 GND TX_DIS TX_DIS 5 27 GND Interrupt Interupt 4 28 TD- Mod_DeSel 3 29 TD+ VEE5 2 30 GND GND 1 16 GND 17 Figure 3 _______ Toward Bezel Pin Function Definitions Toward ASIC 3.1 XFP optical transceiver pin-out on host board Vcc 10 kΩ Receiver (Tx Fault) CMOS, TTL, or Open Collector Driver 1 VeeT 2 Tx Fault VeeT 20 TD- 19 Multiprotocol XFP Optical Transceiver —1310 nm for up to 10 km Reach 7 Table 1 XFP Optical Transceiver Pin Descriptions Pin Number Type Name 1 GND1 2 VEE5 3 LVTTL-I Mod_Desel 4 LVTTL-O Interrupt2 5 LVTTL-I TX_DIS 6 VCC5 7 GND1 8 VCC3 9 VCC3 10 LVTTL-I SCL2 11 LVTTL-I/O SDA2 12 LVTTL-O Mod_Abs2 13 LVTTL-O Mod_NR2 14 LVTTL-O RX_LOS2 15 GND1 16 GND1 17 CML-O RD- 18 CML-O RD+ 19 GND1 20 VCC2 21 LVTTL-I P_Down/RST 22 VCC2 23 GND1 24 PECL-I RefCLK+ 25 PECL-I RefCLK- 26 GND1 27 GND1 28 CML-I TD- 29 CML-I TD+ 30 GND1 Description Module Ground Not used; may be left unconnected (Optional -5.2 V Power Supply) Module Deselect; When held low allows the module to respond to two-wire serial interface commands Interrupt; Indicates presence of an important condition which can be read over the serial two-wire interface Transmitter Disable; Transmitter Laser Source Turned Off +5 V Power Supply Module Ground +3.3 V Power Supply +3.3 V Power Supply Two-wire Interface Clock Two-wire Interface Data Line Indicates Module is not present. Grounded in the Module Module Not Ready; Indicating Module Operational Fault Receiver Loss Of Signal Indicator Module Ground Module Ground Receiver Inverted Data Output Receiver Noninverted Data Output Module Ground +1.8 V Power Supply (not used) Power down; When high, the module limits power consumption to 1.5 W or below. Serial interface is functional in the low power mode. Reset; The falling edge initiates a complete reset of the module including the serial interface, equivalent to a power cycle. +1.8 V Power Supply (not used) Module Ground Reference Clock Noninverted Input (not used) Reference Clock Inverted Input (not used) Module Ground Module Ground Transmitter Inverted Data Input Transmitter Noninverted Data Input Module Ground 1. Module ground pins (GND) are isolated from the module case and chassis ground within the module 2. Shall be pulled up with 4.7 kΩ – 10 kΩ to a voltage between 3.15 V and 3.45 V on the host board Multiprotocol XFP Optical Transceiver —1310 nm for up to 10 km Reach 8 3.2 XFP/XFI Reference Model Compliance Points C' ASIC/ SERDES A Figure 4 3.3 C RX Connector D B' XFP Module TX B XFP optical transceiver model compliance points Absolute Maximum Ratings Parameter Symbol Ratings Unit Storage temperature Operating case temperature Relative humidity Static electrical discharge (Human Body Model) Power supply voltages Receive input optical power (damage threshold) Tst TOP RH ESD VCC3, max VCC5, max Pdth -40 to +85 -40 to +85 5 to 85 (noncondensing) 500 -0.3 to 3.63 -0.5 to 6.0 5 ˚C ˚C % V V V dBm Note: Absolute maximum ratings represent the damage threshold of the device. Damage may occur if the device is operated above the limits stated here except for brief excursions. Performance is not guaranteed and reliability is not implied for operation at any condition outside the recommended operating limits. 3.4 Operating Conditions Part Number SONET/SDH and FEC (9.95 to 11.35 Gbps) 10GbE/10GFC and FEC (9.95 to 11.27 Gbps) Industrial Temperature (-40˚C to 85˚C) JXP-01LMAB1 X JXP-01LMAC1 X JXP-01LEAB1 JXP-01LGAB1 X X X X X X Note: Performance is not guaranteed and reliability is not implied for operation at any condition outside the recommended operating limits. Commercial Temperature (-5˚C to 70˚C) X X X X Multiprotocol XFP Optical Transceiver —1310 nm for up to 10 km Reach 9 3.5 Electrical Characteristics Parameter Symbol Minimum Typical Maximum Unit Notes Supply currents and voltages Voltage3 VCC3 3.13 3.3 3.47 V With respect to GND Voltage5 VCC5 4.75 5 5.25 V With respect to GND Voltage2 VCC2 1.8 V Not used 750 mA Supply current3 ICC3 Supply current5 ICC5 500 mA Supply current2 ICC2 0 mA VPS; Not used Power dissipation Pwr 2.5 W Low-speed control and sense signals (detailed specification in XFP MSA INF8077i Rev. 4.5) 0 0.4 V Rpullup pulled to host _Vcc, Outputs (Interrupt, VOL Mod_NR, RX_LOS) measured at host side of connector. IOL(max)=3 mA host_Vcc-0.5 host_Vcc+ 0.3 V Rpullup pulled to host _Vcc, VOH measured at host side of connector Inputs (TX_DIS, VIL -0.3 0.8 V Pulled up in module to Vcc3 P_Down/RST, M_DSEL) VIH 2 Vcc3+ 0.3 V Pulled up in module to Vcc3 SCL and SDA Inputs VIL -0.3 Vcc3*0.3 V Rpullup pulled to host _Vcc, measured at XFP side of connector VIH Vcc3*0.7 Vcc3+0.5 V Rpullup pulled to host _Vcc, measured at XFP side of connector Transmitter input (detailed specification in XFP MSA INF8077i Rev. 4.5) Data input baud rate nominal 9.95 11.35 Gbps Data input bit rate tolerance -100 +100 ppm (10GbE/10GFC) Data input bit rate tolerance -20 +20 ppm (SONET/SDH) Data input compliance B Internally AC coupled signals 90 100 110 Ω Data input differential RI impedance Receiver output (detailed specification in XFP MSA INF8077i Rev. 4.5) Data output baud rate nominal 9.95 11.35 Gbps Data output compliance C internally AC coupled signals Data output bit rate stability -100 +100 ppm (10GbE/10GFC) Data output bit rate stability -20 +20 ppm (SONET/SDH) Multiprotocol XFP Optical Transceiver —1310 nm for up to 10 km Reach 10 3.6 Jitter Specifications Parameter Symbol Min Max Unit Notes Transmitter electrical input jitter from host at B (detailed specification in XFP MSA INF8077i Rev. 4.5)1 Total non-EQJ jitter 0.41 UI(p-p) Total jitter less ISI Total jitter TJ 0.61 UI(p-p) Eye mask X1 0.305 UI Mask coordinate X1=0.205 if total non-DDJ is measured Eye mask Y1 60 mV Eye mask Y2 410 mV 50 mV is allocated for multiple reflections Receiver electrical output jitter to host at C (detailed specification in XFP MSA INF8077i Rev. 4.5)1 Deterministic jitter DJ 0.18 UI(p-p) Includes jitter transferred from the optical receiver during any valid operational input condition. Total jitter TJ 0.34 UI(p-p) Includes jitter transferred from the optical receiver during any valid operational input condition. Eye mask X1 0.17 UI Eye mask X2 0.42 UI Eye mask Y1 170 mV Eye mask Y2 425 mV Telecom module optical transmitter and receiver jitter (detailed specification in XFP MSA INF8077i Rev. 4.5 and GR-253-CORE Issue 4-2005)2 Jitter transfer bandwidth BW 8 MHz PRBS 231-1, OC-192 / SDH-64 Sinusoidal Jitter Tolerance Mask Jitter peaking 1 dB Frequency >120 KHz Transmitter jitter generation 0.3 UIpp 20 KHz to 80 MHz 4 MHz to 80 MHz 0.1 UIpp Datacom module optical transmitter and receiver jitter (detailed specification in XFP MSA INF8077i Rev. 4.5)1 Jitter transfer bandwidth BW 8 MHz PRBS 231-1, Data or scrambled 64 B/66 B as detailed in IEEE 802.3-2005 Clause 52 Jitter peaking 1 dB Frequency >50 KHz 1. Specifications are applicable to all Part Numbers listed in Section 3.4. 2. Specifications are applicable to SONET / SDH compliant Part Numbers listed in Section 3.4 only. 3.7 Timing Requirement of Control and Status I/O Parameter Symbol Min Max Unit TX_DIS assert time t_off 10 µsec TX_DIS negate time t_on 2 msec Time to initialize t_init 300 msec Interrupt assert delay Interrupt_on 200 msec Interrupt negate delay Interrupt_off 500 µsec P_Down/RST assert delay P_Down/RST_on 100 µsec Mod_NR assert delay Mod_NR_on 1 msec Mod_NR negate delay Mod_NR_off 1 msec P-Down reset time 10 µsec RX_LOS assert delay t_loss_on 100 µsec RX_LOS negate delay t_loss_off 100 µsec Note: Two-wire serial bus timing is described in Chapter 4 of XFP MSA INF8077i Rev. 4.5. Notes Rising edge of TX_DIS to fall of output signal below 10% of nominal Falling edge of TX_DIS to rise of output signal above 90% of nominal From power on or from falling edge of P_Down/RST From occurrence of the condition triggering Interrupt. From clear on read Interrupt flags From power down initiation From occurrence of fault to assertion of Mod_NR From clearance of signal to negation of Mod_NR Min. length of P-Down assert to initiate reset From Occurrence of loss of signal to assertion of RX_LOS From Occurrence of return of signal to negation of RX_LOS Multiprotocol XFP Optical Transceiver —1310 nm for up to 10 km Reach 11 3.8 XFP Two-wire Interface Protocol and Management Interface The 10 Gbps 1310 nm multiprotocol XFP optical transceiver incorporates a XFP compliant two-wire management interface which is used for serial ID, digital diagnostics, and certain control functions. It is modeled on the SFF-8472 Rev 9.3 specification modified to accommodate a single two-wire interface address. In addition to the basic I2C read/write functionality, the modules support packet error checking that, when enabled, allows the host system to confirm the validity of any read data. Details of the protocol and interface are explicitly described in the MSA. Please refer to the MSA for design reference. 0- Two-wire Serial Address 1010000x (A0H) Digital Diagnostic Functions 118 119-122 126 127 128- 128Reserved For Future Diagnostic Functions 255 Table 00H 4 Byte Password Change 4 Byte Password Entry Page Select Byte Entry XFP MSA Serial ID Data 223 224255 128- 128- Vendor Specific ID Data Table 01H Figure 5 User EEPROM Data 255 Table 02H 128Vendor Specific Functions 255 Table 03H-7FH XFP two-wire serial digital diagnostic memory map Reserved 255 Table 80H-FFH Multiprotocol XFP Optical Transceiver —1310 nm for up to 10 km Reach 12 3.9 Optical Transmitter Characteristics Parameter Symbol Minimum Typical Maximum Center wavelength λ 1290 1330 -20 dB spectral width ∆λ 1 Sidemode suppression ratio SSR 30 Relative intensity noise RIN12OMA -128 -6.0 -1.0 Average optical power (SONET/SDH) (EOL) Pavg Extinction ratio1 (SONET/SDH) ER 6 7 Chromatic dispersion penalty PCD 6.6 Optical path penalty DP 1.0 Return loss tolerance 14 Datacom module optical transmitter characteristics2 OMA (optical modulation amplitude) OMA -5.2 Transmitter and dispersion penalty TDP 3.9 Average optical power (10GbE/10GFC) (EOL) Pavg -8.2 0.5 Extinction ratio1 (10GbE/10GFC) ER 3.5 Unit nm nm dB dB/Hz dBm dB ps/nm dB dB dBm dB dBm dB 1. Tested with PRBS 231-1 pattern 2. Applicable to non SONET/SDH compliant Part Numbers listed in Section 3.4 only. 3.10 Optical Receiver Characteristics Parameter Symbol Minimum Typical Maximum Center wavelength λ 1260 1600 Receiver sensitivity1 Rsen -14.4 Stressed receive sensitivity2 SRS -10.3 Pmax 1 Receive overload3 Receiver reflectance Rrx -14 LOS assert Plos_on -30 -20 LOS deassert Plos_off -18.5 LOS hysteresis 0.5 6 Note: Specifications are applicable to the operating temperature range listed in Section 3.4 1. Guaranteed at 10.709 Gbps. Measured with worst ER; BER<10-12; 231-1 PRBS. Equivalent to -12.6 dBm OMA at ER = 6 dB. 2. Guaranteed at 11.35 Gbps. 3. Guaranteed up to 10.709 Gbps. Unit nm dBm dBm dBm dB dBm dBm dB Multiprotocol XFP Optical Transceiver —1310 nm for up to 10 km Reach 13 3.11 Regulatory Compliance The 10 Gbps 1310 nm multiprotocol XFP optical transceiver is lead-free and RoHS 6/6 compliant per Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. The JDSU 10 Gbps 1310 nm multiprotocol XFP optical transceiver complies with international electromagnetic compatibility (EMC) and international safety requirements and standards. EMC performance is dependent on the overall system design. Information included herein is intended as a figure of merit for designers to use as a basis for design decisions. Table 2 Regulatory Compliance Feature Test Method Performance Component safety UL 60950 UL Certificate UL94-V0 UL Certificate EN 60950 TUV Report/Certificate (CB Scheme) RoHS-compliance Directive 2002/95/EC Compliant per the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. Laser eye safety EN 60825 TUV Certificate U.S. 21CFR (J) 1040.10 CDRH compliant and Class 1 laser safe. Electromagnetic Compatibility Electromagnetic emissions EMC Directive 89/336/EEC Noise frequency range: 30 MHz to 40 GHz. FCC CFR47 Part 15 Good system EMI design practice required IEC/CISPR 22 to achieve Class B margins. AS/NZS CISPR22 EN 55022 ICES-003, Issue 4 VCCI-03 Electromagnetic immunity EMC Directive 89/336/EEC IEC /CISPR/24 EN 55024 ESD immunity EN 61000-4-2 Exceeds requirements. Withstands discharges of; 8 kV contact, 15 kV air Radiated immunity EN 61000-4-3 Exceeds requirements. Field strength of 10 V/m RMS, from 10 MHz to 1 GHz. No effect on transmitter/receiver performance is detectable between these limits. 3.12 PCB Layout Recommended PCB layout is given in XFP MSA INF8077i Rev. 4.5. Multiprotocol XFP Optical Transceiver —1310 nm for up to 10 km Reach 14 3.13 Module Outline Figure 6 Belly-to-Belly Mounting Recommendation 3.14 Connectors Fiber The XFP module has a duplex LC receptacle connector. Electrical The electrical connector is the 30-way, two-row PCB edge connector. Customer connector is Tyco/AMP Part No. 788862C or equivalent. Multiprotocol XFP Optical Transceiver —1310 nm for up to 10 km Reach 15 Section 4 Related Information Other information related to the 10 Gbps 1310 nm multiprotocol XFP optical transceiver includes: • Section 4.1 Packing and Handling Instructions • Section 4.2 ESD Discharge (ESD) • Section 4.3 Eye Safety 4.1 Package and Handling Instructions Connector covers The 10 Gbps 1310 nm multiprotocol XFP optical transceiver is supplied with an LC duplex receptacle. The connector plug supplied protects the connector during standard manufacturing processes and handling by preventing contamination from dust, aqueous solutions, body oils, or airborne particles. Note: It is recommended that the connector plug remain on whenever the transceiver optical fiber connector is not inserted. Recommended cleaning and degreasing chemicals JDSU recommends the use of methyl, isopropyl and isobutyl alcohols for cleaning. Do not use halogenated hydrocarbons (trichloroethane, ketones such as acetone, chloroform, ethyl acetate, MEK, methylene chloride, methylene dichloride, phenol, N-methylpyrolldone). This product is not designed for aqueous wash. Housing The 10 Gbps 1310 nm multiprotocol XFP optical transceiver housing is made from zinc. 4.2 ESD Discharge (ESD) Handling Normal ESD precautions are required during the handling of this module. This transceiver is shipped in ESD protective packaging. It should be removed from the packaging and otherwise handled in an ESD protected environment utilizing standard grounded benches, floor mats, and wrist straps. Test and operation In most applications, the optical connector will protrude through the system chassis and be subjected to the same ESD environment as the system. Once properly installed in the system, this transceiver should meet and exceed common ESD testing practices and fulfill system ESD requirements. Typical of optical transceivers, this module’s receiver contains a highly sensitive optical detector and amplifier which may become temporarily saturated during an ESD strike. This could result in a short burst of bit errors. Such an event might require that the application reacquire synchronization at the higher layers (serializer/deserializer chip). Multiprotocol XFP Optical Transceiver —1310 nm for up to 10 km Reach 4.3 Eye Safety The JDSU 10 Gbps 1310 nm multiprotocol XFP optical transceiver is an international Class 1 laser product per IEC 60825-1 second edition 2007. The product also complies with U.S.A. regulations for Class 1 products contained in 21 CFR 1040.10 and 1040.11. Laser emissions from Class 1 laser products are not considered hazardous when operated within the limits of this specification. Operating this product in a manner inconsistent with intended usage and specification may result in hazardous radiation exposure. CLASS 1 LASER PRODUCT Caution Tampering with this laser based product or operating this product outside the limits of this specification may be considered an act of “manufacturing,” and will require, under law, recertification of the modified product with the U.S. Food and Drug Administration (21 CFR 1040). Ordering Information For more information on this or other products and their availability, please contact your local JDSU account manager or JDSU directly at 1-800-498-JDSU (5378) in North America and +800-5378-JDSU worldwide, or via e-mail at [email protected]. Sample: JXP-01LMAB1 Product Code JXP-01LMAB1 JXP-01LMAC1 JXP-01LEAB1 JXP-01LGAB1 Description Multiprotocol, OC-192 SR-1, 10 GbE/FC LR/LW, 1310 nm, industrial temperature range 10 Gbps XFP optical transceiver Multiprotocol, OC-192 SR-1, 10 GbE/FC LR/LW, 1310 nm, commercial temperature range 10 Gbps XFP optical transceiver 10 GbE/FC LR/LW, 1310 nm, industrial temperature range 10 Gbps XFP optical transceiver 10 GbE/FC LR/LW, 1310 nm, commercial temperature range 10 Gbps XFP optical transceiver NORTH AMERICA: 800 498-JDSU (5378) worldwide: +800 5378-JDSU WEBSITE: www.jdsu.com Product specifications and descriptions in this document subject to change without notice. © 2009 JDS Uniphase Corporation 30149346 003 0409 JXP-01LXAX1.DS.CMS.AE April 2009