KOA SPEER ELECTRONICS, INC. SS-228 R1 AHA 8/05/05 Three Termination Capacitor/Resistor EMI Filter for Signal Lines Type KCR CERTIFIED CERTIFIED 1. Features ■ ■ The KCR Series provides improved reduction of radiated noise and drives it into the ground. Capacitor/Resistor filter 2. Applications ■ Noise reduction in a variety of circuits 3. Ordering & Specifying Information Type designation shall be as the following form. KCR 1206 T TE 220/500 Type Size Termination Material Packaging Capacitance/ Resistance 1206 T: Sn TE: 7" Embossed Taping 2,000 pcs/reel 2 Significant digits + No. of zeros 4. Dimension and Structure L W Size Terminals (Ag + Ni, Sn Plating) t e Glass Coating 4.1 Circuit g GND Terminals (Ag + Ni, Sn Plating) In e 1206 L W t g * KCR1206T221/500: t = .043 ± .008 (1.1 ± 0.2) KCR1206T221/101: t = .043 ± .008 (1.1 ± 0.2) Out GND Bolivar Drive ■ P.O. Box 547 e .126±.008 .063±.008 .031±.008 .039±.012 .016±.012 (0.4±0.3) (3.2±0.2) (1.6±0.2) (0.8±0.2)* (1.0±0.3) ■ Bradford, PA 16701 PAGE 1 OF 6 ■ USA ■ 814-362-5536 ■ Fax 814-362-8883 ■ www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. KOA SPEER ELECTRONICS, INC. SS-228 R1 5. Ratings Ordering Code Capacitance Capacitance Resistance Resistance (pF) Tolerance (Ω) Tolerance (%) KCR1206T220/500 22 50 KCR1206T220/101 22 100 KCR1206T470/500 47 50 KCR1206T470/101 47 KCR1206T101/500 100 50 KCR1206T101/101 100 100 KCR1206T221/500 220 50 KCR1206T221/101 220 100 100 +50 ~ -20 ±30 Power Rating (W) Temp. Range (°C) 1/16 -40 ~ +85 Customized parts are available upon request. 5.1 Rating Item Operating temperature range Storage temperature range Measuring condition (Standard) Temperature Relative humidity Measuring condition (Precision) Temperature Relative humidity Specification -40°C ~ +85°C -40°C ~ +85°C (After soldering) 15 ~ 35°C 20 ~ 90% 20°C ±1°C 60 ~ 67% PAGE 2 OF 6 Bolivar Drive ■ P.O. Box 547 ■ Bradford, PA 16701 ■ USA ■ 814-362-5536 ■ Fax 814-362-8883 ■ www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. KOA SPEER ELECTRONICS, INC. SS-228 R1 6. Characteristics Item Requirement Conditions Insulation Resistance Min 1000M ohms Applied rated voltage for 60 seconds. Capacitance Within the tolerance Frequency: 1kHz Voltage: 1Vrms DC Resistance Within the tolerance DC: 0.3V Max. Terminal Adhesion Strength No physical damage Solder a chip to a test substrate and then laterally apply a load (5N, 500gF) in the arrow direction. Chip Substrate Soldering Heat Resistance Appearance: No physical damage Capacitance: Within tolerance Dielectric Loss: Within tolerance Insulation Resistance: Within tolerance Flux: 25% rosin Pre-heating: 60 sec Pre-heating Temp: 150°C Solder: H60A Solder Temp: 260°C ±5°C Dip Time: 5 ±0.5 sec Solderablility More than 95% of the terminal electrode shall be covered with new solder. Flux: 25% rosin Pre-heating: 60 sec Pre-heating Temp: 150°C Solder: H60A Solder Temp: 230°C ±5°C Dip Time: 4 ±1 sec Temperature Cycle Appearance: No physical damage Capacitance: Within tolerance Dielectric Loss: Within tolerance Insulation Resistance: Within tolerance Repeat the following heat cycle 10 times: Step Temperature Time 1 -40°C ±3°C 30 min ±3 min 2 Room Temp. 15 min max. 3 85°C ±2°C 30 min ±3 min 4 Room Temp. 15 min max. High Temperature Resistance Appearance: No physical damage Capacitance: Within tolerance Dielectric Loss: Within tolerance Insulation Resistance: Within tolerance Temp: 70°C ±2°C Bias: 150% of rated voltage Test Time: 1000+48/-0 hour Humidity Resistance (unload) Appearance: No physical damage Capacitance: Within tolerance Dielectric Loss: Within tolerance Insulation Resistance: Within tolerance Temp: 85°C ±2°C Humidity: 85% ±5% Test Time: 500+24/-0 hour PAGE 3 OF 6 Bolivar Drive ■ P.O. Box 547 ■ Bradford, PA 16701 ■ USA ■ 814-362-5536 ■ Fax 814-362-8883 ■ www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. KOA SPEER ELECTRONICS, INC. SS-228 R1 6. Characteristics Cont. Item Requirement Conditions Vending Substrate Appearance: No physical damage Capacitance: Within tolerance After soldering a chip to a test substrate, bend the substrate by 1 mm and then measure. The substrate is 20 GE4 or based Substrate Weight on GE4. Displacement 45 ± 2 45 ± 2 Humidity Resistance (load) Appearance: No physical damage Capacitance: Within tolerance Dielectric Loss: Within tolerance Insulation Resistance: Within tolerance Temp: 40°C ±2°C Humidity: 90 - 95% Bias: 100% of rated voltage Test Time: 500+24/-0 hour Low Temperature Resistance (unload) Appearance: No physical damage Capacitance: Within tolerance Dielectric Loss: Within tolerance Insulation Resistance: Within tolerance Temp: -40°C ±2°C Test Time: 1000+48/-0 hour Vibration Appearance: No physical damage Capacitance: Within tolerance Dielectric Loss: Within tolerance Insulation Resistance: Within tolerance The frequency of applied vibratoin should be swept from 10 Hz to 55 Hz and return to 10 Hz. This cycle time should be about 1 min and thiscycle should be repeated. Amplitude (total Excursion): 1.5 mm This motion shall be applied for period of 2 hours in each 3 mutually perpendicular axes. (total of 6 hours) After Temperature cycle test, High temperature resistance test, Humidity resistance test or Low temperature resistance test, the tested sample should be measured after having left in temperature from 15° to 35°C and relative humidity from 45% to 75% for 24 hours. 7. Packaging Specifications 7.1 Taping Packaging of components on continuous tape is complete with carrier tape for putting components and cover tape for sealing. (1) Dimensions of Carrier Tape 15.75 (400) 6.30 (160) 6.30 (160) Top tape Empty Empty Tape running direction Bolivar Drive ■ P.O. Box 547 ■ Bradford, PA 16701 ■ USA ■ 814-362-5536 ■ Fax 814-362-8883 PAGE 4 OF 6 ■ www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. KOA SPEER ELECTRONICS, INC. SS-228 R1 (1) Dimensions of Carrier Tape Cont. Feeding Hole Chip Pocket D0 t1 E F B W A Chip Component t2 P1 P2 P3 Dimensions in inches (mm) Series A B W F E P1 KCR1206 0.078 ± 0.003 0.137 ± 0.003 0.314 ± 0.011 0.137 ± 0.02 0.068 ± 0.003 0.157 ± 0.003 (2.0 ± 0.1) (3.5 ± 0.1) (8.0 ± 0.3) (3.5 ± 0.05) (1.75 ± 0.1) (4.0 ± 0.1) Dimensions in inches (mm) Series P2 P3 KCR1206 0.078 ± 0.02 0.157 ± 0.003 (2.0 ± 0.05) (4.0 ± 0.1) D0 0.059...+ 0.003 -0.... + 0.1 (1.5 -0 ) t1 0.011 ± 0.001 (0.3 ± 0.05) t2 0.098 (2.5 max) (2) Reel dimensions .079 (2.0±0.5) øD A øB Embossed cavity øC Embossed carrier W Dimensions in inches (mm) Series A B C D E W (min) W (max) 7.00 ± 0.78 (178 ± 2) 2.36 (60 min) 0.511 ± 0.02 (13 ± 0.5) 0.83 ± 0.03 (21 ± 0.8) 0.079 ± 0.02 (2 ± 0.5) 0.311 ± 0.059 (7.9 ± 1.5) 0.429 ± 0.059 (10.9 ± 1.5) PAGE 5 OF 6 Bolivar Drive ■ P.O. Box 547 ■ Bradford, PA 16701 ■ USA ■ 814-362-5536 ■ Fax 814-362-8883 ■ www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. KOA SPEER ELECTRONICS, INC. SS-228 R1 8. General Information 9. Recommended Soldering Conditions (1) Storage The products must be stored from 10° to 35°C and from 30% to 70% RH before soldering. (2) Soldering In general, ceramics are very sensitive to thermal shocks. Therefore the parts shall not be exposed to a sudden temperature increase, decrease or partial heating. Products shall be pre-heated prior to soldering. The temperature difference between the solder temperature and product temperature does not exceed 130°C. It is desirable that the soldering temperature be kept 240° - 250°C and that soldering time be less than 4 seconds. Flux shall be rosin type. Do not use strong acid type flux. The tip of the soldering iron shall be 20 W or less, 3ƒ or less, and 220° - 250° C. Recommended soldering thermal and time conditions are shown in the Recommend Soldering Conditions. (3) Mounting After mounting components on the printed circuit board, do not apply stress through board bending or mishandling. Recommended Condition for Reflow Soldering Preheat 180 Seconds Max. 250°C 230°C - 250°C 150°C Recommended Condition for Flow Soldering Preheat 120 Seconds Max. Soldering 3-4 Seconds Max. 150°C 230°C - 250°C Recommended Condition for Iron Soldering Preheat 120 Seconds Max. Connect to ground pattern of mounting side Soldering 4 Seconds Max. 250°C 120 Seconds Min. 220°C - 250°C Resist (unit: mm) ■ P.O. Box 547 ■ Natural Cooling 150°C Ground Pattern Bolivar Drive Natural Cooling 120 Seconds Min. 250°C Back Side Through Hole Natural Cooling 120 Seconds Min. (4) Pattern design The land pattern is recommended as follows. Chip Mounting Side Soldering 10 Seconds Max. Bradford, PA 16701 ■ USA PAGE 6 OF 6 ■ 814-362-5536 ■ Fax 814-362-8883 ■ www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.