MICROCHIP TC1305R-DVUN

TC1305
Dual 150mA CMOS LDO With Select Mode™ Operation,
Shutdown and Independent RESET Output
Features
General Description
• Extremely Low Supply Current for Longer Battery
Life
• Select Mode™ Operation: Selectable Output
Voltages for High Design Flexibility
• Very Low Dropout Voltage
• 29µVRMS Typical Output Noise
• 10µsec (Typ.) Wake-Up Time from SHDN
• 150mA Output Current per Output
• High Output Voltage Accuracy
• Power-Saving Shutdown Mode
• RESET Output Can Be Used as a Low Battery
Detector or Processor Reset Generator
• Over Current Protection and Over Temperature
Shutdown
• Space Saving 10-Pin MSOP Package
The TC1305 combines two CMOS Low Dropout Regulators and a Microprocessor Monitor in a space saving
10-Pin MSOP package. Designed specifically for
battery operated systems, total supply current is
typically 120µA at full load, 20 to 60 times lower than in
bipolar regulators.
Applications
•
•
•
•
•
•
•
Load Partitioning
Battery Operated Systems
Portable Computers
Medical Instruments
Instrumentation
Pagers and Cellular/PHS Phones
Linear Post-Regulator for SMPS
TC1305R-DVUN
An active low RESET is asserted when the detected
voltage (V DET) falls below the 2.63V reset voltage
threshold. The RESET output remains low for 300msec
(typical) after VDET rises above reset threshold. When
the shutdown controls (SHDN1 and SHDN2) are low,
the regulator output voltages fall to zero, RESET output
remains valid and supply current is reduced to 20µA
(typ.)
Other key features for the device include ultra low noise
operation, fast response to step changes in load and
very low dropout voltage (typically 150mV at full load).
The device also incorporates both over temperature
and over current protection. Each regulator is stable
with an output capacitor of only 1µF and has a
maximum output current of 150mA. The TC1305 is
featured in a 10-Pin MSOP package with selective
output voltages.
Device Selection Table
Part Number
The TC1305 features selectable output voltages for
higher design flexibility. The tri-state SELECT input pin
allows the user to select VOUT1 and VOUT2 from 3
different values (2.5V, 2.8V and 3.0V).
Junction
Temperature
Range
Package
10-Pin MSOP
-40°C to +85°C
Typical Application
VDET
VIN
10
2
9
RESET
VOUT2
3.3µF
NOTE: “R” denotes the suffix for the 2.63V VDET threshold.
“D” indicates VOUT1 = VOUT2 = 2.5, 2.8, 3.0 (selectable).
GND
Other output voltages are available. Please contact Microchip
Technology Inc. for details.
SELECT
Package Type
1
3
TC1305
8
VOUT1
3.3µF
SHDN1
4
7
5
6
470pF Bypass
(Optional)
SHDN2
10-Pin MSOP
VDET 1
10 RESET
VIN 2
GND 3
9 VOUT2
TC1305
SELECT 4
SHDN1 5
 2002 Microchip Technology Inc.
8 VOUT1
7 Bypass
6
SHDN2
DS21526A-page 1
TC1305
1.0
ELECTRICAL
CHARACTERISTICS
ABSOLUTE MAXIMUM RATINGS*
Input Voltage .........................................................6.5V
Output Voltage........................... (-0.3V) to (VIN + 0.3V)
Power Dissipation................Internally Limited (Note 7)
Maximum Voltage on Any Pin ......... VIN +0.3V to -0.3V
Operating Temperature Range.... -40°C < TJ < +125°C
Storage Temperature Range .............. -55°C to +150°C
*Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
TC1305 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: VIN = VR + 1V, IL = 100µA, C L = 3.3µF, SHDN1 > VIH , SHDN2 > VIH, TA = 25°C, unless otherwise
noted. Boldface type specifications apply for junction temperature of -40°C to +125°C. Applies to both VOUT1 and VOUT2.
Symbol
Parameter
Min
Typ
Max
Units
VIN
Input Operating Voltage
2.7
—
6.0
V
IOUTMAX
Maximum Output Current
150
—
—
mA
VOUT
Output Voltage (VOUT1 and VOUT2)
TCV OUT
VOUT Temperature Coefficient
VR – 2.5% VR ± 0.5% VR + 2.5%
—
—
20
40
—
—
∆VOUT/∆VIN
Line Regulation
V
Test Conditions
Note 1
Per Channel
Note 2
ppm/°C Note 3
—
0.05
0.35
%
(VR + 1V) < VIN < 6V
∆V OUT/VOUT Load Regulation
—
0.5
2
%
IL = 0.1mA to IOUTMAX
(Note 4)
VIN – VOUT
Dropout Voltage
—
2
50
100
150
—
120
240
360
mV
IL = 100µA
IL = 50mA
IL = 100mA
IL = 150mA
(Note 5)
IIN
Supply Current
—
120
160
µA
SHDN1, SHDN2 = VIH , IL = 0
IINSD
Shutdown Supply Current
—
0.05
0.5
µA
SHDN1, SHDN2 = 0V
PSRR
Power Supply Rejection Ratio
—
64
—
dB
FRE ≤ 120Hz
IOUTSC
Output Short Circuit Current
—
600
—
mA
VOUT = 0V
∆V OUT∆PD
Thermal Regulation
—
0.04
—
V/W
Notes 6, 7
tWK
Wake Up Time
—
10
—
µsec
VIN = 5V
CIN = 1µF, COUT = 4.7µF
IL = 30mA, (See Figure 4-1)
ts
Settling Time
—
40
—
µsec
VIN = 5V
CIN = 1µF, COUT = 4.7µF
IL = 30mA, (See Figure 4-1)
(from Shutdown Mode)
(from Shutdown Mode)
Note 1:
2:
3:
4:
5:
6:
7:
The minimum VIN has to meet two conditions: VIN ≥ 2.7 and VIN ≥ VR + VDROPOUT.
VR is the regulator output voltage setting. For example: VR = 2.5V, 2.8V, 3.0V.
TC VOUT = (VOUTMAX – VOUTMIN) x 106
VOUT x ∆T
Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from
0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation
specification.
Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a 1V
differential.
Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or
line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec.
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the
thermal resistance from junction-to-air (i.e., TA, TJ, θ JA). Exceeding the maximum allowable power dissipation causes the device to initiate
thermal shutdown. Please see Section 5.0 Thermal Considerations section of this data sheet for more details.
DS21526A-page 2
 2002 Microchip Technology Inc.
TC1305
TC1305 ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: VIN = VR + 1V, IL = 100µA, CL = 3.3µF, SHDN1 > VIH, SHDN2 > VIH , TA = 25°C, unless otherwise noted.
Boldface type specifications apply for junction temperature of -40°C to +125°C. Applies to both VOUT1 and VOUT2.
Symbol
Parameter
Min
Typ
Max
Units
—
160
—
°C
Test Conditions
TSD
Thermal Shutdown Die
Temperature
∆TSD
Thermal Shutdown Hysteresis
—
15
—
°C
eN
Output Noise
—
200
—
nV√Hz
IL = 100µA, F = 1kHz,
COUT1 = C OUT2 = 4.7µF,
CBYPASS = 0.01µF
—
29
—
µVRMS
F = 10Hz to 100kHz
SHDN Input
VIH
SHDN Input High Threshold
65
—
—
%VIN
VIN = 2.7V to 6.0V
VIL
SHDN Input Low Threshold
—
—
15
%VIN
VIN = 2.7V to 6.0V
VIN – 0.2
—
—
V
VIN = 2.7V to 6.0V
—
0.2
V
VIN = 2.7V to 6.0V
1.0
1.2
—
—
6.0
6.0
V
TA = 0°C to +70°C
TA = -40°C to +125°C
2.59
2.55
2.63
—
2.66
2.70
V
TA = +25°C
TA = -40°C to +125°C
RESET = Open
SELECT Input
VSELH
SELECT Input HIgh Threshold
VSELL
SELECT Input Low Threshold
RESET Output
VDET
VDET Voltage Range
VTH
Reset Threshold
IVDET
Reset Circuit Supply Current
—
20
40
µA
Reset Threshold Tempco
—
30
—
ppm/°C
V DET to Reset Delay
—
100
—
µsec
Reset Active Time-out Period
VDET = VTH to (VTH – 100mV)
140
300
560
msec
VOL
RESET Output Voltage Low
—
—
—
—
—
—
0.3
0.4
0.3
V
VDET = VTH MIN, ISINK = 1.2mA
VDET = VTH MIN, ISINK = 3.2mA
VDET > 1.0V, ISINK = 50µA
VOH
RESET Output Voltage High
0.8 VDET
VDET – 1.5
—
—
—
V
VDET > VTHMAX, ISOURCE = 500µA
VDET > VTHMAX, ISOURCE = 800µA
Note 1:
2:
3:
4:
5:
6:
7:
The minimum VIN has to meet two conditions: VIN ≥ 2.7 and VIN ≥ VR + VDROPOUT.
VR is the regulator output voltage setting. For example: VR = 2.5V, 2.8V, 3.0V.
TC VOUT = (VOUTMAX – VOUTMIN) x 106
VOUT x ∆T
Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from
0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation
specification.
Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a 1V
differential.
Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or
line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec.
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the
thermal resistance from junction-to-air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate
thermal shutdown. Please see Section 5.0 Thermal Considerations section of this data sheet for more details.
 2002 Microchip Technology Inc.
DS21526A-page 3
TC1305
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
PIN FUNCTION TABLE
Pin No.
(10-Pin MSOP)
Symbol
Description
Detected input voltage. VDET and VIN can be connected together.
1
VDET
2
VIN
3
GND
4
SELECT
Tri-state input for setting V OUT1 and VOUT2. SELECT = GND for VOUT1 = VOUT2 = 2.5V,
SELECT = VIN for VOUT1 = VOUT2 = 3.0V and SELECT = No connect for VOUT1 = VOUT2 = 2.8V.
5
SHDN1
Shutdown control input for VOUT1. Regulator 1 is fully enabled when a logic high is applied to
this input. Regulator 1 enters shutdown when a logic low is applied to this input. During
shutdown, regulator output voltage falls to zero, RESET output remains valid.
6
SHDN2
Shutdown control input for VOUT2. Regulator 2 is fully enabled when a logic high is applied to
this input. Regulator 2 enters shutdown when a logic low is applied to this input. During
shutdown, regulator output voltage falls to zero, RESET output remains valid.
Power supply input.
Ground terminal.
7
Bypass
Reference bypass input. Connecting a 0.01µF to this input further reduces output noise.
8
VOUT1
Regulated voltage output 1.
9
VOUT2
Regulated voltage output 2.
10
RESET
RESET Output. RESET = Low when VDET is below the Reset Threshold Voltage.
RESET = High when VDET is above the Reset Threshold Voltage.
DS21526A-page 4
 2002 Microchip Technology Inc.
TC1305
3.0
DETAILED DESCRIPTION
4.0
TYPICAL APPLICATIONS
The TC1305 is a precision fixed output voltage
regulator that contains two fully independent 150mA
regulator outputs. The device features separate
shutdown modes for low-power operation, and a
common bypass pin that can be used to further reduce
output noise. The Select Mode™ operation allows the
user to select VOUT1 and V OUT2 from three different
values (2.5V, 2.8V, 3.0V), therefore providing high
design flexibility. The CMOS construction of the
TC1305 results to a very low supply current, which
does not increase with load changes. In addition, VOUT
remains stable and within regulation at no load
currents.
4.1
Input and Output Capacitor
The TC1305 also features an integrated microprocessor supervisor that monitors power-up, power-down,
and brown-out conditions. The active low RESET
signal is asserted when the detected voltage VDET falls
below the reset voltage threshold (2.63V). The RESET
output remains low for 300msec (typical) after V DET
rises above the reset threshold. The RESET output of
the TC1305 is ensured valid down to VDET = 1V and is
optimized to reject fast transient glitches on the
monitored power supply line.
The TC1305 is stable with a wide range of capacitor
values and types. A capacitor with a minimum value of
1µF from VOUT to Ground is required. The output
capacitor should have an effective series resistance
(ESR) of 0.1Ω to 10Ω for a 1µF capacitor and 0.01Ω to
10Ω for a 10µF capacitor. A 1µF capacitor should be
connected from the VIN to GND if there is more than 10
inches of wire between the regulator and the AC filter
capacitor, or if a battery is used as the power source.
Aluminum electrolytic or tantalum capacitor types can
be used. (Since many aluminum electrolytic capacitors
freeze at approximately -30°C, solid tantalums are
recommended for applications operating below -20°C).
When operating from sources other than batteries,
supply-noise rejection and transient response can be
improved by increasing the value of the input and
output capacitors and employing passive filtering
techniques.
4.2
Bypass Capacitor
A 0.01µF capacitor connected from the bypass input to
ground reduces noise present on the internal
reference, which in turn significantly reduces output
noise. If output noise is not a concern, this input may be
left unconnected.
Larger capacitor values may be used, but result in a
longer time period to rated output voltage when power
is initially applied.
4.3
Shutdown Mode
Applying a logic high to each of the shutdown pins turns
on the corresponding output. Each regulator enters
shutdown mode when a logic low is applied in the
corresponding input. During shutdown mode, the output voltage falls to zero, and regulator supply current is
reduced to 0.5µA (max). If shutdown mode is not
necessary, the pins should be connected to VIN.
 2002 Microchip Technology Inc.
DS21526A-page 5
TC1305
4.4
Select Mode™ Operation
The Select Mode™ operation is a tri-state input that
allows the user to select VOUT1 and VOUT2 from three
different values. By connecting the SELECT pin to
GND, both output voltages (VOUT1, VOUT2) supply
2.5V. Connecting the SELECT pin to VIN results in both
output channels supplying a fixed 3.0V output. Last but
not least, leaving the SELECT pin floating sets both
voltages to 2.8V. This output voltage functionality
provides high design flexibility and minimizes costs
associated with inventory, time-to-market and new
device qualifications.
4.5
RESET Output
The microprocessor supervisor of theTC1305 provides
accurate supply voltage monitoring and reset timing
during power-up, power-down and brown-out conditions. The RESET output is valid to VDET = 1.0V (below
this point it becomes an open circuit and does not sink
current) and is able to reject negative going transients
(glitches) on the power supply line. Transient immunity
can further be improved by adding a capacitor close to
the VDET pin of the TC1305.
4.6
Turn On Response
The turn on response is defined as two separate
response categories, Wake Up Time (tWK) and Settling
Time (tS).
The TC1305 has a fast Wake Up Time (10µsec typical)
when released from shutdown. See Figure 4-1 for the
Wake Up Time designated as tWK. The Wake Up Time
is defined as the time it takes for the output to rise to 2%
of the V OUT value after being released from shutdown.
The total turn on response is defined as the Settling
Time (tS), see Figure 4-1. Settling Time (inclusive with
tWK) is defined as the condition when the output is
within 2% of its fully enabled value (40µsec typical)
when released from shutdown. The settling time of the
output voltage is dependent on load conditions and
output capacitance on VOUT (RC response).
FIGURE 4-1:
WAKE-UP RESPONSE
TIME
VIH
SHDN
VIL
tS
98%
VOUT
2%
tWK
DS21526A-page 6
 2002 Microchip Technology Inc.
TC1305
5.0
THERMAL CONSIDERATIONS
5.1
Thermal Shutdown
Integrated thermal protection circuitry shuts the
regulator off when die exceeds approximately 160°C.
The regulator remains off until the die temperature
drops to approximately 145°C.
Thermal shutdown is intended to protect the device
under transient accidental (fault) overload conditions.
Thermal Shutdown may not protect the LDO while
operating above junction temperatures of 125°C
continuously. Sufficient thermal evaluation of the
design needs to be conducted to ensure that the
junction temperature does not exceed 125°C.
5.2
Power Dissipation
The amount of power the regulator dissipates is
primarily a function of input and output voltage, and
output current. The following equation is used to
calculate worst case actual power dissipation.
EQUATION 5-1:
PD ≈ (VINMAX – VOUT1MIN)ILOAD1 MAX +
(VINMAX – VOUT2MIN)ILOAD2MAX
Where:
PD = Worst case actual power dissipation
VINMAX = Maximum voltage on VIN
VOUT1MIN = Minimum regulator output voltage1
ILOAD1MAX = Maximum output (load) current1
VOUT2MIN = Minimum regulator output voltage2
ILOAD2MAX = Maximum output (load) current2
The
maximum
allowable
power
dissipation
(Equation 5-2) is a function of the maximum ambient
temperature (TAMAX), the maximum allowable die
temperature (125°C), and the thermal resistance from
junction-to-air (θJA). The MSOP-10 package has a θJA
of approximately 113°C/W when mounted on a four
layer FR4 dielectric copper clad PC board.
EQUATION 5-2:
PDMAX = (T JMAX – TAMAX)
θJA
Where all terms are previously defined.
 2002 Microchip Technology Inc.
Equation 5-1 can be used in conjunction with
Equation 5-2 to ensure regulator thermal operation is
within limits. For example:
Given:
VINMAX
= 3.8V ± 5%
VOUT1MIN = 3.0V ± 2.5%
VOUT2MIN = 3.0V ± 2.5%
ILOAD1MAX = 120mA
ILOAD2MAX = 120mA
TJMAX
= 125°C
TAMAX
= 55°C
θJA
= 113°C/W
Find: 1. Actual power dissipation
2. Maximum allowable dissipation
Actual power dissipation:
PD ≈ [(VINMAX – VOUT1MIN)] x ILOAD1MAX
+ [(VINMAX – VOUT2MIN)] x ILOAD2MAX
[(3.8 x 1.05) – (3.0 x .975)] x 120 x 10-3
+ [(3.8 x 1.05) – (3.0 x .975)] x 120 x 10-3
= 256mW
Maximum allowable power dissipation:
PD = (TJMAX – TAMAX)
θJA
= (125 – 55)
113
= 620mW
In this example, the TC1305 dissipates a maximum of
256mW; below the allowable limit of 620mW. In a
similar manner, Equation 5-1 and Equation 5-2 can be
used to calculate maximum current and/or input
voltage limits. For example, the maximum allowable
VIN is found by substituting the maximum allowable
power dissipation of 620mW into Equation 5-1, from
which VINMAX = 5.6V.
5.3
Layout Considerations
The primary path of heat conduction out of the package
is via the package leads. Therefore, layouts having a
ground plane, wide traces at the pads, and wide power
supply bus lines combine to lower θJA and therefore
increase the maximum allowable power dissipation
limit.
DS21526A-page 7
TC1305
6.0
TYPICAL CHARACTERISTICS
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein are
not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Dropout Voltage1 vs. Load Current
(SELECT = VDD)
0.18
0.18
0.16
0.16
130°C
DROPOUT VOLTAGE (V)
0.14
0.12
25°C
0.10
0.08
0.06
0.04
-45°C
0.02
0.25
130°C
0.14
0.12
25°C
0.10
0.08
0.06
0.04
-45°C
0.02
0
25
50
75
100 125 150
LOAD CURRENT (mA)
130°C
0.15
25°C
0.10
-45°C
0.05
0.00
0
25
Dropout Voltage2 vs. Load Current
(SELECT = VDD)
0
50
75
100 125 150
LOAD CURRENT (mA)
130°C
-45°C
0.10
0.05
0.00
0
25
50
75
100
140
0.500
120
0.400
IL = 0.1 to 150mA
0.300
0.200
130
350
RESET TIMING (µsec)
400
120
VDD = 6.0V
110
VDD = 3.0V
90
-20
5
30
55
80
30
55
80
TEMPERATURE (°C)
DS21526A-page 8
60
0
3
105 130
3.5
105 125
4
4.5
VDD (V)
5
5.5
6
VCC Trip Point vs.
Temperature (°C)
2.70
2.68
2.66
300
250
200
150
100
0
-40 -20
2.64
2.62
2.60
2.58
2.56
2.54
50
5
-45°C 25°C
Reset Active Time vs.
Temperature (°C)
140
-20
80
TEMPERATURE (°C)
IDD vs. Temperature
(SELECT = NC)
80
-40
100
20
LOAD CURRENT (mA)
100
130°C
40
0.100
0.000
-45
125 150
150
IDD (µA)
25°C
LOAD REGULATION (%)
0.15
50
75
100 125 150
LOAD CURRENT (mA)
IDD vs. VDD
(SELECT = GND)
0.600
0.20
25
Load Regulation
vs. Temperature
0.25
DROPOUT VOLTAGE (V)
0.20
0.00
0.00
IDD (µA)
Dropout Voltage2 vs. Load Current
(SELECT = VDD)
VCC TRIP POINT (V)
DROPOUT VOLTAGE (V)
Dropout Voltage1 vs. Load Current
(SELECT = NC)
DROPOUT VOLTAGE (V)
Note:
2.52
5
30
55
80
TEMPERATURE (°C)
105 125
2.50
-40
-20
5
30
55
80
105 125
TEMPERATURE (°C)
 2002 Microchip Technology Inc.
TC1305
TYPICAL CHARACTERISTICS (CONTINUED)
VOUT1 vs. Temperature
(SELECT = VDD)
VOUT2 vs. Temperature
(SELECT = VDD)
3.01
VDD = 6.0V & IL = 100µA
VDD = 4.0V & IL = 100µA
2.99
VDD = 3.8V & IL = 100mA
2.97
2.96
2.95
2.81
2.99
2.80
2.98 VDD = 3.8V & IL = 150mA
2.79
2.97
2.78
2.96
VDD = 6.0V & IL = 100µA
VDD = 4.0V & IL = 100µA
2.95
2.93
2.74
2.92
-45
2.73
-45
30
55
80 105 130
5
30
55
80 105
130
-20
5
30
55
80 105 130
TEMPERATURE (°C)
TEMPERATURE (°C)
VOUT2 vs. Temperature
(SELECT = NC)
VOUT1 vs. Temperature
(SELECT = GND)
VOUT2 vs. Temperature
(SELECT = GND)
2.51
VDD = 6.0V & IL = 100µA
2.49
VOUT1 (V)
VDD = 3.8V & IL = 150mA
2.77
2.76
2.51
VDD = 6.0V & IL = 100µA
VDD = 3.5V & IL = 100µA
2.50
VDD = 6.0V & IL = 100µA
2.79
2.78
-20
TEMPERATURE (°C)
2.81
2.80
VDD = 3.8V & IL = 150mA
2.76
2.92
-45
5
VDD = 3.8V & IL = 100mA
2.77
2.93
-20
VDD = 6.0V & IL = 100µA
2.75
2.94
2.94
VOUT2 (V)
3.00
2.50
VDD = 3.5V & IL = 150mA
VDD = 3.5V & IL = 150mA
2.48
2.47
2.46
2.48
2.46
2.45
2.45
2.74
2.44
2.44
2.43
-45 -20
5
30
55
80 105
TEMPERATURE (°C)
 2002 Microchip Technology Inc.
130
VDD = 6.0V & IL = 100µA
2.47
2.75
2.73
VDD = 3.5V & IL = 100µA
2.49
VOUT2 (V)
VOUT1 (V)
2.98
VOUT2 (V)
3.00
VOUT1 vs. Temperature
(SELECT = NC)
VOUT1 (V)
6.0
2.43
-45 -20
5
30
55
80 105
TEMPERATURE (°C)
130
-45 -20
5
30
55
80 105
130
TEMPERATURE (°C)
DS21526A-page 9
TC1305
6.0
TYPICAL CHARACTERISTICS (CONTINUED)
Power Supply Rejection Ratio vs. Frequency
Power Supply Rejection Ratio vs. Frequency
0
0
-20
PSRR (dB)
-20
IOUT = 150mA
COUT = 10µF Tantalum
VINDC = 4V
VINAC = 100mVP-P
VOUTDC = 3V
PSRR (dB)
-40
-60
-40
-60
-80
-80
-100
-100
10
100
1k
10k
100k
10
1M
Input Voltage
2V / div
0.1
0.001
0.01
COUT1 = COUT2 = 4.7µF,
CBYPASS = 0.01µF, ILOAD = 100µA,
VIN = 4.0V, VOUT1 = VOUT2 = 3.0V
0.1
1
10k
100k
1M
Output Voltage
(50mV / div)
VOUT2
VOUT1
0.01
1k
Line Transient Response
Output Noise
10
1
100
f (Hz)
f (Hz)
Noise (mV/ √HZ)
IOUT = 150mA
COUT = 10µF Tantalum
CBYPASS = 0.01µF Ceramic
VINDC = 4V
VINAC = 100mVP-P
VOUTDC = 3V
10
100
1000
6V
4V
COUT = 10µF Ceramic
CIN = 0
CBYP = 0.01µF
ILOAD = 100µA
VOUT = 3V
Frequency (kHz)
Time (2µs / div)
Output Current
Output Voltage
(50mV / div)
Load Transient Response
150mA
100µA
VIN = 4V
VOUT = 3V
COUT = 10µF Ceramic
CBYP = 0.01µF
Time (100ms / div)
DS21526A-page 10
 2002 Microchip Technology Inc.
TC1305
TYPICAL CHARACTERISTICS (CONTINUED)
Output Voltage Output Voltage
(20mV / div)
(20mV / div)
Line Transient Response
VOUT2
4.6V
3.6V
COUT1 = COUT2 = 10µF Ceramic
RLOAD = 30kΩ
Output Voltage Output Voltage
(20mV / div)
(20mV / div)
Load Transient Response
VOUT2
VOUT1
COUT1 = COUT2 = 1µF Tantalum
VIN = 5.5V
RLOAD = 30kΩ
RL = 30kΩ
100mA
100µA
Output Voltage 1 Output Voltage 2
(20mV / div)
(50mV / div)
Load Transient Response
VOUT2
VOUT1
COUT1 = COUT2 = 10µF Ceramic
VIN = 5.5V
RLOAD = 30kΩ
RL = 30kΩ
 2002 Microchip Technology Inc.
Output Current
VIN
Input Voltage
2V / div
VOUT1
100mA
100µA
Output Current
Output Current
Output Voltage Output Voltage
(20mV / div)
(20mV / div)
Output Current
Output Voltage Output Voltage
(20mV / div)
(20mV / div)
Input Voltage
2V / div
Output Voltage Output Voltage
(20mV / div)
(20mV / div)
6.0
Line Transient Response
VOUT2
VOUT1
VIN
4.6V
3.6V
COUT1 = COUT2 = 1µF Tantalum
RLOAD = 30kΩ
Load Transient Response
VOUT2
VOUT1
COUT1 = COUT2 = 10µF Ceramic
100mA
VIN = 5.5V
RLOAD = 30kΩ
RL = 30kΩ
100µA
Load Transient Response
VOUT2
VOUT1
COUT1 = COUT2 = 1µF Tantalum
VIN = 5.5V
RLOAD = 30kΩ
RL = 30kΩ
100mA
100µA
DS21526A-page 11
TC1305
6.0
TYPICAL CHARACTERISTICS (CONTINUED)
Thermal Shutdown Response
Thermal Shutdown Response
VOUT
1V / div
1V / div
VOUT
VIN = 6.0V
VOUT = 2.8V
CIN = 1µF
COUT = 1µF
CBYPASS = 470pF
VIN = 6.0V
VOUT = 2.5V
CIN = 1µF
COUT = 1µF
CBYPASS = 470pF
Time (500ms / div)
Time (500ms / div)
Shutdown Response
Thermal Shutdown Response
3.0V
VOUT
3.0V
VOUT1
1V / div
1V / div
1V / div
VOUT2
VIN = 6.0V
VOUT = 3.0V
CIN = 1µF
COUT = 1µF
CBYPASS = 470pF
/Shdn1 = /Shdn2
COUT1 = COUT2 = 1µF Tantalum
VIN = 5.5V
RLOAD = 30kΩ
Time (500ms / div)
Time (10ms / div)
DS21526A-page 12
 2002 Microchip Technology Inc.
TC1305
7.0
PACKAGING INFORMATION
7.1
Package Marking Information
Package marking data not available at this time.
7.2
Taping Form
Component Taping Orientation for 10-Pin MSOP Devices
User Direction of Feed
PIN 1
W
P
Standard Reel Component Orientation
for TR Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
12 mm
8 mm
2500
13 in
10-Pin MSOP
7.3
Package Dimensions
10-Pin MSOP
PIN 1
.122 (3.10)
.114 (2.90)
.201 (5.10)
.183 (4.65)
.012 (0.30)
.006 (0.15)
.122 (3.10)
.114 (2.90)
.043 (1.10)
MAX.
.020 (0.50)
.006 (0.15)
.002 (0.05)
.009 (0.23)
.005 (0.13)
6° MAX.
.028 (0.70)
.016 (0.40)
Dimensions: inches (mm)
 2002 Microchip Technology Inc.
DS21526A-page 13
TC1305
NOTES:
DS21526A-page 14
 2002 Microchip Technology Inc.
TC1305
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1.
2.
3.
Your local Microchip sales office
The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
 2002 Microchip Technology Inc.
DS21526A-page15
TC1305
NOTES:
DS21526A-page16
 2002 Microchip Technology Inc.
TC1305
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with
express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property
rights.
Trademarks
The Microchip name and logo, the Microchip logo, FilterLab,
KEELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER,
PICSTART, PRO MATE, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, microPort,
Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM,
MXDEV, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode
and Total Endurance are trademarks of Microchip Technology
Incorporated in the U.S.A.
Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2002, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received QS-9000 quality system
certification for its worldwide headquarters,
design and wafer fabrication facilities in
Chandler and Tempe, Arizona in July 1999
and Mountain View, California in March 2002.
The Company’s quality system processes and
procedures are QS-9000 compliant for its
PICmicro ® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals,
non-volatile memory and analog products. In
addition, Microchip’s quality system for the
design and manufacture of development
systems is ISO 9001 certified.
 2002 Microchip Technology Inc.
DS21526A-page 17
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
Japan
Corporate Office
Australia
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200 Fax: 480-792-7277
Technical Support: 480-792-7627
Web Address: http://www.microchip.com
Microchip Technology Australia Pty Ltd
Suite 22, 41 Rawson Street
Epping 2121, NSW
Australia
Tel: 61-2-9868-6733 Fax: 61-2-9868-6755
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Tel: 81-45-471- 6166 Fax: 81-45-471-6122
Rocky Mountain
China - Beijing
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Chandler, AZ 85224-6199
Tel: 480-792-7966 Fax: 480-792-7456
Microchip Technology Consulting (Shanghai)
Co., Ltd., Beijing Liaison Office
Unit 915
Bei Hai Wan Tai Bldg.
No. 6 Chaoyangmen Beidajie
Beijing, 100027, No. China
Tel: 86-10-85282100 Fax: 86-10-85282104
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Tel: 770-640-0034 Fax: 770-640-0307
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EUROPE
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Italy
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Tel: 44 118 921 5869 Fax: 44-118 921-5820
03/01/02
*DS21526A*
DS21526A-page 18
 2002 Microchip Technology Inc.