LINER LTM4612V

LTM4612
Ultralow Noise
36VIN, 15VOUT, 5A,
DC/DC µModule
DESCRIPTION
FEATURES
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Complete Low EMI Switch Mode Power Supply
CISPR 22 Class B Compliant
Wide Input Voltage Range: 5V to 36V
5A DC, 7A Peak Output Current
3.3V to 15V Output Voltage Range
Low Input and Output Referred Noise
Output Voltage Tracking and Margining
PLL Frequency Synchronization
±1.5% Set Point Accuracy
Power Good Tracks with Margining
Current Foldback Protection (Disabled at Start-Up)
Parallel/Current Sharing
Ultrafast Transient Response
Current Mode Control
Programmable Soft-Start
Output Overvoltage Protection
–55°C to 125°C Operating Temperature Range
(LTM4612MPV)
Small Surface Mount Footprint, Low Profile
(15mm × 15mm × 2.8mm) LGA Package
APPLICATIONS
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Telecom and Networking Equipment
Industrial and Avionic Equipment
RF Systems
The LTM®4612 is a complete, ultralow noise, high voltage
input and output, 5A switching mode DC/DC power supply.
Included in the package are the switching controller, power
FETs, inductor and all support components. Operating
over an input voltage range of 5V to 36V, the LTM4612
supports an output voltage range of 3.3V to 15V, set by a
single resistor. Only bulk input and output capacitors are
needed to finish the design.
High switching frequency and an adaptive on-time current
mode architecture enables a very fast transient response
to line and load changes without sacrificing stability.
The onboard input filter and noise cancellation circuits
achieve low noise coupling, thus effectively reducing the
electromagnetic interference (EMI)—see Figures 4 and 8.
Furthermore, the DC/DC μModuleTM can be synchronized
with an external clock for reducing undesirable frequency
harmonics and allows PolyPhase® operation for high load
currents.
The LTM4612 is offered in a space saving and thermally
enhanced 15mm × 15mm × 2.8mm LGA package, which
enables utilization of unused space on the bottom of PC
boards for high density point-of-load regulation. The
LTM4612 is Pb-free and RoHS compliant.
, LT, LTC, LTM and PolyPhase are registered trademarks of Linear Technology
Corporation. μModule is a trademark of Linear Technology Corporation. All other
trademarks are the property of their respective owners.
TYPICAL APPLICATION
Efficiency vs Load Current at 12V Output
12V/5A Ultralow Noise μModule with 22V to 36V Input
100
95
CLOCK SYNC
VIN
22V
TO 36V
100k
VIN
PLLIN
VOUT
PGOOD
RUN LTM4612
COMP
INTVCC
DRVCC
fSET
TRACK/SS
VD
CIN
0.01μF
10μF
SGND
100pF
VFB
5.23k
FCB
MARG0
MARG1
MPGM
PGND
MARGIN
CONTROL
392k
5% MARGIN
4612 TA01
VOUT
12V
5A
COUT
EFFICIENCY (%)
90
2M
85
80
75
70
65
60
24VIN 12VOUT
28VIN 12VOUT
36VIN 12VOUT
55
50
0
1
2
3
4
OUTPUT CURRENT (A)
5
4612 TA01b
4612f
1
LTM4612
ABSOLUTE MAXIMUM RATINGS
PIN CONFIGURATION
(Note 1)
TOP VIEW
INTVCC
PLLIN
TRACK/SS
RUN
COMP
MPGM
INTVCC, DRVCC ............................................. –0.3V to 6V
VOUT ........................................................... –0.3V to 16V
PLLIN, FCB, TRACK/SS, MPGM, MARG0,
MARG1, PGOOD, fSET ...........–0.3V to INTVCC + 0.3V
RUN ............................................................. –0.3V to 5V
VFB, COMP ................................................ –0.3V to 2.7V
VIN , VD ....................................................... –0.3V to 36V
Internal Operating Temperature Range (Note 2)
E and I Grades ...................................–40°C to 125°C
MP Grade...........................................–55°C to 125°C
Junction Temperature ........................................... 125°C
Storage Temperature Range...................–55°C to 125°C
A
VIN B
BANK 1
C
D
E
PGND
BANK 2 F
G
H
J
VOUT K
BANK 3 L
M
VD
SGND
fSET
MARG0
MARG1
DRVCC
VFB
PGOOD
SGND
NC
NC
NC
FCB
1 2 3 4 5 6 7 8 9 10 11 12
LGA PACKAGE
133-LEAD (15mm × 15mm × 2.8mm)
TJMAX = 125°C, θJA = 15°C/W, θJC = 6°C/W
θJA DERIVED FROM 95mm × 76mm PCB WITH 4 LAYERS
WEIGHT = 1.7g
ORDER INFORMATION
LEAD FREE FINISH
TRAY
PART MARKING*
PACKAGE DESCRIPTION
TEMPERATURE RANGE
LTM4612EV#PBF
LTM4612EV#PBF
LTM4612V
133-Lead (15mm × 15mm × 2.8mm) LGA
–40°C to 125°C
LTM4612IV#PBF
LTM4612IV#PBF
LTM4612V
133-Lead (15mm × 15mm × 2.8mm) LGA
–40°C to 125°C
LTM4612MPV#PBF
LTM4612MPV#PBF
LTM4612MPV
133-Lead (15mm × 15mm × 2.8mm) LGA
–55°C to 125°C
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
This product is only offered in trays. For more information go to: http://www.linear.com/packaging/
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the full internal
operating temperature range, otherwise specifications are at TA = 25°C, VIN = 24V, unless otherwise noted. Per Typical Application
(front page) configuration.
SYMBOL
PARAMETER
VIN(DC)
Input DC Voltage
VOUT(DC)
Output Voltage
CONDITIONS
CIN = 10μF × 3, COUT = 300μF; FCB = 0
VIN = 24V, VOUT = 12V, IOUT = 0A
VIN = 36V, VOUT=12V, IOUT = 0A
MIN
l
5
l
l
11.89
11.89
TYP
MAX
UNITS
36
V
12.07
12.07
12.25
12.25
V
V
4.8
V
Input Specifications
VIN(UVLO)
Undervoltage Lockout Threshold
IOUT = 0A
3.2
IINRUSH(VIN)
Input Inrush Current at Start-Up
IOUT = 0A; CIN = 10μF × 2, COUT = 200μF;
VOUT = 12V
VIN = 24V
VIN = 36V
0.6
0.7
A
A
4612f
2
LTM4612
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the full internal
operating temperature range, otherwise specifications are at TA = 25°C, VIN = 24V, unless otherwise noted. Per Typical Application
(front page) configuration.
SYMBOL
PARAMETER
CONDITIONS
IQ(VIN)
Input Supply Bias Current
VIN = 36V, No Switching
VIN = 36V, VOUT = 12V, Switching Continuous
VIN = 24V, No Switching
VIN = 24V, VOUT = 12V, Switching Continuous
Shutdown, RUN = 0, VIN = 36V
MIN
TYP
4.5
57
3.5
48
50
mA
mA
mA
mA
μA
IS(VIN)
Input Supply Current
VIN = 36V, VOUT = 12V, IOUT = 5A
VIN = 24V, VOUT = 12V, IOUT = 5A
1.85
2.72
A
A
VINTVCC
Internal VCC Voltage
VIN = 36V, RUN > 2V, IOUT = 0A
4.7
0
5
MAX
UNITS
5.3
V
5
A
Output Specifications
IOUT(DC)
Output Continuous Current Range
VIN = 24V, VOUT = 12V (Note 4)
ΔVOUT(LINE)
VOUT
Line Regulation Accuracy
VOUT = 12V, FCB = 0V, VIN = 22V to 36V,
IOUT = 0A
l
0.05
0.3
%
ΔVOUT(LOAD)
VOUT
Load Regulation Accuracy
VOUT = 12V, FCB = 0V, IOUT = 0A to 5A (Note 4)
VIN = 36V
VIN = 24V
l
l
0.3
0.3
0.6
0.6
%
%
VIN(AC)
Input Ripple Voltage
VOUT(AC)
Output Ripple Voltage
IOUT = 0A,
CIN = 2 × 10μF X5R Ceramic and 1 × 100μF
Electrolytic, 1 × 10μF X5R Ceramic on VD Pins
VIN = 24V, VOUT = 5V
VIN = 24V, VOUT = 12V
7.2
3.4
mVP-P
mVP-P
IOUT = 0A,
COUT = 2 × 22μF, 2 × 47μF X5R Ceramic
VIN = 24V, VOUT = 5V
VIN = 24V, VOUT = 12V
17.5
12.5
mVP-P
mVP-P
fS
Output Ripple Voltage Frequency
IOUT = 1A, VIN = 24V, VOUT = 12V
940
kHz
ΔVOUT(START)
Turn-On Overshoot,
TRACK/SS = 10nF
COUT = 200μF, VOUT = 12V, IOUT = 0A
VIN = 36V
VIN = 24V
20
20
mV
mV
tSTART
Turn-On Time, TRACK/SS = Open
COUT = 300μF, VOUT = 12V, IOUT = 1A
Resistive Load
VIN = 36V
VIN = 24V
0.5
0.5
ms
ms
153
mV
37
μs
9
9
A
A
ΔVOUT(LS)
Peak Deviation for Dynamic Load
tSETTLE
Settling Time for Dynamic Load Step Load: 0% to 50% to 0% of Full Load, VIN = 24V
IOUT(PK)
Output Current Limit
Load: 0% to 50% to 0% of Full Load
COUT = 2 × 22μF Ceramic, 150μF Bulk
VIN = 24V, VOUT = 12V
COUT = 200μF
VIN = 36V, VOUT = 12V
VIN = 24V, VOUT = 12V
Control Section
VFB
Voltage at VFB Pin
VRUN
RUN Pin On/Off Threshold
ISS / TRACK
Soft-Start Charging Current
VFCB
Forced Continuous Threshold
IFCB
Forced Continuous Pin Current
tON(MIN)
tOFF(MIN)
IOUT = 0A, VOUT = 12V
l
0.594
0.6
0.606
V
1
1.5
1.9
V
–1
–1.5
–2
μA
0.57
0.6
0.63
V
VFCB = 0V
–1
–2
μA
Minimum On-Time
(Note 3)
50
100
ns
Minimum Off-Time
(Note 3)
250
400
ns
VSS/TRACK = 0V
4612f
3
LTM4612
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the –40°C to 85°C
operating temperature range, otherwise specifications are at TA = 25°C, VIN = 24V, unless otherwise noted. Per Typical Application
(front page) configuration.
SYMBOL
PARAMETER
RPLLIN
PLLIN Input Resistor
CONDITIONS
MIN
TYP
MAX
UNITS
IDRVCC
Current into DRVCC Pin
RFBHI
Resistor Between VOUT and VFB Pins
VMPGM
Margin Reference Voltage
1.18
V
VMARG0, VMARG1
MARG0, MARG1 Voltage Thresholds
1.4
V
50
VOUT = 12V, IOUT = 1A
99.5
kΩ
22
30
mA
100
100.5
kΩ
PGOOD
ΔVFBH
PGOOD Upper Threshold
VFB Rising
7
10
13
%
ΔVFBL
PGOOD Lower Threshold
VFB Falling
–7
–10
–13
%
ΔVFB(HYS)
PGOOD Hysteresis
VFB Returning
1.5
VPGL
PGOOD Low Voltage
IPGOOD = 5mA
0.15
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: The LTM4612E is guaranteed to meet performance specifications
over the 0°C to 125°C internal operating temperature range. Specifications
over the –40°C to 125°C internal operating temperature range are assured
by design, characterization and correlation with statistical process
controls. The LTM4612I is guaranteed to meet specifications over the
%
0.4
V
–40°C to 125°C internal operating temperature range. The LTM4612MP
is guaranteed and tested over the full –55°C to 125°C internal operating
temperature range. Note that the maximum ambient temperature is
determined by specific operating conditions in conjunction with board
layout, the rated package thermal resistance and other environmental
factors.
Note 3: 100% tested at die level only.
Note 4: See the Output Current Derating curves for different VIN, VOUT
and TA.
4612f
4
LTM4612
TYPICAL PERFORMANCE CHARACTERISTICS (Refer to Figure 18)
Efficiency vs Load Current with
3.3VOUT (FCB = 0)
Efficiency vs Load Current with
5VOUT (FCB = 0)
100
95
95
90
95
85
90
EFFICIENCY (%)
85
80
75
70
65
5VIN 3.3VOUT
12VIN 3.3VOUT
24VIN 3.3VOUT
36VIN 3.3VOUT
60
55
50
0
1
2
3
LOAD CURRENT (A)
80
75
70
65
80
75
70
50
0
1
2
3
LOAD CURRENT (A)
55
50
0
5
4
4612 G02
Transient Response from 12VIN
to 3.3VOUT
Efficiency vs Load Current with
15VOUT (FCB = 0, Refer to Figure 20)
20VIN 12VOUT
24VIN 12VOUT
28VIN 12VOUT
36VIN 12VOUT
60
12VIN 5VOUT
24VIN 5VOUT
36VIN 5VOUT
55
4612 G01
85
65
60
5
4
100
EFFICIENCY (%)
90
EFFICIENCY (%)
Efficiency vs Load Current with
12VOUT (FCB = 0)
1
2
3
LOAD CURRENT (A)
5
4
4612 G03
Transient Response from 12VIN
to 5VOUT
100
95
EFFICIENCY (%)
90
85
80
2A/DIV
2A/DIV
100mV/DIV
100mV/DIV
75
70
28VIN 15VOUT
32VIN 15VOUT
36VIN 15VOUT
65
60
0
1
2
3
LOAD CURRENT (A)
50μs/DIV
5
4
4612 G04
Transient Response from 24VIN
to 12VOUT
50μs/DIV
4612 G05
4612 G06
LOAD STEP: 0A to 3A
COUT = 2 s 22μF CERAMIC CAPACITORS AND
2 s 47μF CERAMIC CAPACITORS
LOAD STEP: 0A to 3A
COUT = 2 s 22μF CERAMIC CAPACITORS AND
2 s 47μF CERAMIC CAPACITORS
Start-Up with 24VIN to 12VOUT
at IOUT = 0A
Start-Up with 24VIN to 12VOUT at
IOUT = 5A
IIN
0.2A/DIV
2A/DIV
IIN
1A/DIV
200mV/
DIV
VOUT
5V/DIV
50μs/DIV
4612 G07
LOAD STEP: 0A to 3A
COUT = 2 s 22μF CERAMIC CAPACITORS AND
2 s 47μF CERAMIC CAPACITORS
VOUT
5V/DIV
500μs/DIV
4612 G08
SOFT-START CAPACITOR: 3.9nF
CIN = 3 s 10μF CERAMIC CAPACITORS AND
1 s 47μF OSCON CAPACITOR
500μs/DIV
4612 G09
SOFT-START CAPACITOR: 3.9nF
CIN = 3 s 10μF CERAMIC CAPACITORS AND
1 s 47μF OSCON CAPACITOR
4612f
5
LTM4612
TYPICAL PERFORMANCE CHARACTERISTICS
Start-Up with 24VIN to 12VOUT at
IOUT = 5A, TA = –55°C
Short-Circuit with 24VIN to 12VOUT
at IOUT = 0A
Short-Circuit with 24VIN to 12VOUT
at IOUT = 5A
IIN
2A/DIV
IIN
0.2A/DIV
VOUT
5V/DIV
VOUT
5V/DIV
VOUT
5V/DIV
IIN
1A/DIV
500μs/DIV
36
50μs/DIV
4612 G10
20μs/DIV
4612 G11
4612 G12
SOFT-START CAPACITOR: 3.9nF
CIN = 3 s 10μF CERAMIC CAPACITORS AND
1 s 47μF OSCON CAPACITOR
COUT = 2 s 22μF CERAMIC CAPACITORS AND
2 s 47μF CERAMIC CAPACITORS
COUT = 2 s 22μF CERAMIC CAPACITORS AND
2 s 47μF CERAMIC CAPACITORS
VIN to VOUT Step-Down Ratio
Input Ripple
Output Ripple
SEE FREQUENCY ADJUSTMENT SECTION
FOR OPERATIONS OUTSIDE THIS REGION
30
VIN (V)
24
OPERATING REGION
WITH DEFAULT FREQUENCY
18
50mV/DIV
10mV/DIV
12
6
0
3.3 4
6
10
8
VOUT (V)
12
14 15
4612 G13
1μs/DIV
4612 G14
VIN = 24V
VOUT = 12V AT 5A RESISTIVE LOAD
CIN = 3 s 10μF 50V CERAMIC 1 s 100μF BULK
1μs/DIV
4612 G15
VIN = 24V
VOUT = 12V AT 5A RESISTIVE LOAD
COUT = 2 s 22μF 16V CERAMIC AND
2 s 47μF 16V CERAMIC
4612f
6
LTM4612
PIN FUNCTIONS
(See Package Description for Pin Assignments)
VIN (Bank 1): Power Input Pins. Apply input voltage between these pins and PGND pins. Recommend placing
input decoupling capacitance directly between VIN pins
and PGND pins.
PGND (Bank 2): Power Ground Pins for Both Input and
Output Returns.
VOUT (Bank 3): Power Output Pins. Apply output load
between these pins and PGND pins. Recommend placing
output decoupling capacitance directly between these
pins and GND pins (see the LTM4612 Pin Configuration
below).
VD (Pins B7, C7): Top FET Drain Pins. Add more capacitors between VD and ground to handle the input RMS
current and reduce the input ripple further.
DRVCC (Pins C10, E11, E12): These pins normally connect to INTVCC for powering the internal MOSFET drivers.
They can be biased up to 6V from an external supply with
about 50mA capability. This improves efficiency at the
higher input voltages by reducing power dissipation in
the module.
INTVCC (Pin A7): This pin is for additional decoupling of
the 5V internal regulator.
PLLIN (Pin A8): External Clock Synchronization Input to the
Phase Detector. This pin is internally terminated to SGND
with a 50k resistor. Apply a clock above 2V and below
INTVCC. See the Applications Information section.
FCB (Pin M12): Forced Continuous Input. Connect this pin
to SGND to force continuous synchronization operation at
INTVCC
PLLIN
TRACK/SS
RUN
COMP
MPGM
TOP VIEW
A
VIN B
BANK 1
C
D
E
PGND
BANK 2 F
G
H
J
VOUT K
BANK 3 L
M
VD
SGND
1 2 3 4 5 6 7 8 9 10 11 12
LGA PACKAGE
133-LEAD (15mm × 15mm × 2.8mm)
fSET
MARG0
MARG1
DRVCC
VFB
PGOOD
SGND
NC
NC
NC
FCB
low load, to INTVCC to enable discontinuous mode operation at low load or to a resistive divider from a secondary
output when using a secondary winding.
TRACK/SS (Pin A9): Output Voltage Tracking and Soft-Start
Pin. When the module is configured as a master output,
then a soft-start capacitor is placed on this pin to ground
to control the master ramp rate. A soft-start capacitor can
be used for soft-start turn-on as a standalone regulator.
Slave operation is performed by putting a resistor divider
from the master output to the ground, and connecting the
center point of the divider to this pin. See the Applications
Information section.
MPGM (Pins A12, B11): Programmable Margining Input.
A resistor from these pins to ground sets a current that is
equal to 1.18V/R. This current multiplied by 10k will equal
a value in millivolts that is a percentage of the 0.6V reference voltage. See the Applications Information section.
To parallel LTM4612s, each requires an individual MPGM
resistor. Do not tie MPGM pins together.
fSET (Pin B12): Frequency Set Internally to 850kHz at 12V
Output. An external resistor can be placed from this pin to
ground to increase frequency. This pin can be decoupled
with a 1000pF capacitor. See the Applications Information
section for frequency adjustment.
VFB (Pin F12): The Negative Input of the Error Amplifier.
Internally, this pin is connected to VOUT with a 100k precision resistor. Different output voltages can be programmed
with an additional resistor between the VFB and SGND pins.
See the Applications Information section.
MARG0 (Pin C12): LSB Logic Input for the Margining
Function. Together with the MARG1 pin, the MARG0 pin
will determine if a margin high, margin low, or no margin
state is applied. The pin has an internal pull-down resistor
of 50k. See the Applications Information section.
MARG1 (Pins C11, D12): MSB Logic Input for the Margining Function. Together with the MARG0 pin, the MARG1 pin
will determine if a margin high, margin low, or no margin
state is applied. The pins have an internal pull-down resistor
of 50k. See the Applications Information section.
SGND (Pins D9, H12): Signal Ground Pins. These pins
connect to PGND at output capacitor point.
LTM4612 Pin Configuration
4612f
7
LTM4612
PIN FUNCTIONS
COMP (Pins A11, D11): Current Control Threshold and
Error Amplifier Compensation Point. The current comparator threshold increases with this control voltage. The
voltage ranges from 0V to 2.4V with 0.7V corresponding
to zero sense voltage (zero current).
RUN (Pins A10, B9): Run Control Pins. A voltage above
1.9V will turn on the module, and below 1V will turn off
the module. A programmable UVLO function can be accomplished with a resistor from VIN to this pin that is has
a 5.1V zener to ground. Maximum pin voltage is 5V.
PGOOD (Pin G12): Output Voltage Power Good Indicator.
Open-drain logic output that is pulled to ground when the
output voltage is not within ±10% of the regulation point,
after a 25μs power bad mask timer expires.
NC (Pins J12, K12, L12): No Connect Pins.
BLOCK DIAGRAM
> 1.9V = ON
< 1V = OFF
MAX = 5V
VOUT
RUN
PGOOD
5.1V
ZENER
COMP
1μF
INPUT
FILTER
+
VIN
20V TO 36V
CIN
100k
VD
INTERNAL
COMP
CD
POWER CONTROL
SGND
M1
VOUT
12V
AT 4A
MARG1
MARG0
VFB
RFB
5.23k
50k
50k
fSET
M2
NOISE
CANCELLATION
10μF
+
COUT
93.1k
PGND
FCB
10k
MPGM
TRACK/SS
CSS
PLLIN
4.7μF
50k
INTVCC
4612 F01
DRVCC
Figure 1. Simplified Block Diagram
DECOUPLING REQUIREMENTS
Specifications are at TA = 25°C. Use Figure 1 configuration.
SYMBOL
PARAMETER
CONDITIONS
MIN
CIN
External Input Capacitor Requirement
(VIN = 20V to 36V, VOUT = 12V)
IOUT = 4A
10
COUT
External Output Capacitor Requirement
(VIN = 20V to 36V, VOUT = 12V)
IOUT = 4A
100
TYP
MAX
UNITS
μF
150
μF
4612f
8
LTM4612
OPERATION
Power Module Description
The LTM4612 is a standalone nonisolated switching mode
DC/DC power supply. It can deliver 5A of DC output
current with some external input and output capacitors.
This module provides precisely regulated output voltage
programmable via one external resistor from 3.3VDC to
15VDC over a 5V to 36V wide input voltage. The typical
application schematic is shown in Figure 18.
The LTM4612 has an integrated constant on-time current
mode regulator, ultralow RDS(ON) FETs with fast switching speed and integrated Schottky diodes. The typical
switching frequency is 850kHz at full load. With current
mode control and internal feedback loop compensation,
the LTM4612 module has sufficient stability margins and
good transient performance under a wide range of operating conditions and with a wide range of output capacitors,
even all ceramic output capacitors.
Current mode control provides cycle-by-cycle fast current
limiting. Moreover, foldback current limiting is provided
in an overcurrent condition while VFB drops. Internal
overvoltage and undervoltage comparators pull the opendrain PGOOD output low if the output feedback voltage exits
a ±10% window around the regulation point. Furthermore,
in an overvoltage condition, internal top FET M1 is turned
off and bottom FET M2 is turned on and held on until the
overvoltage condition clears.
Input filter and noise cancellation circuitry reduce the
noise coupling to I/O sides, and ensure the electromagnetic interference (EMI) meets the limits of CISPR 22 and
CISPR 25.
Pulling the RUN pin below 1V forces the controller into its
shutdown state, turning off both M1 and M2. At low load
currents, discontinuous mode (DCM) operation can be
enabled to achieve higher efficiency compared to continuous mode (CCM) by setting FCB pin higher than 0.6V.
When the DRVCC pin is connected to INTVCC, an integrated
5V linear regulator powers the internal gate drivers. If a
5V external bias supply is applied on DRVCC pin, then an
efficiency improvement will occur due to the reduced power
loss in the internal linear regulator. This is especially true
at the higher input voltage range.
The MPGM, MARG0, and MARG1 pins are used to support voltage margining, where the percentage of margin
is programmed by the MPGM pin, and the MARG0 and
MARG1 selected margining. The PLLIN pin provides frequency synchronization of the device to an external clock.
The TRACK/SS pin is used for power supply tracking and
soft-start programming.
4612f
9
LTM4612
APPLICATIONS INFORMATION
There are restrictions in the maximum VIN and VOUT step
down ratio that can be achieved for a given input voltage.
These constraints are shown in the Typical Performance
Characteristic curve labeled “VIN to VOUT Step-Down
Ratio.” Note that additional thermal derating may be applied. See the Thermal Considerations and Output Current
Derating section in this data sheet.
Output Voltage Programming and Margining
The PWM controller has an internal 0.6V reference voltage.
As shown in the Block Diagram, a 100k internal feedback
resistor connects the VOUT and VFB pins together. Adding a
resistor, RFB, from the VFB pin to the SGND pin programs
the output voltage.
100k + RFB
VOUT = 0.6 V •
RFB
Table 1. RFB Standard 1% Resistor Values vs VOUT
VOUT (V)
3.3
5
6
8
10
12
14
15
RFB (kΩ)
22.1
13.7
11
8.06
6.34
5.23
4.42
4.12
The MPGM pin programs a current that when multiplied
by an internal 10k resistor sets up the 0.6V reference ±
offset for margining. A 1.18V reference divided by the
RPGM resistor on the MPGM pin programs the current.
Calculate VOUT(MARGIN):
VOUT(MARGIN) =
%VOUT
• VOUT
100
Where %VOUT is the percentage of VOUT to be margined,
and VOUT(MARGIN) is the margin quantity in volts:
V
1.18 V
RPGM = OUT •
• 10k
0.6 V VOUT(MARGIN)
Where RPGM is the resistor value to place on the MPGM
pin to ground.
MARG1
MARG0
MODE
LOW
LOW
NO MARGIN
LOW
HIGH
MARGIN UP
HIGH
LOW
MARGIN DOWN
HIGH
HIGH
NO MARGIN
Operating Frequency
The operating frequency of the LTM4612 is optimized to
achieve the compact package size and the minimum
output ripple voltage while still keeping high efficiency.
As shown in Figure 2, the frequency is linearly increased
with larger output voltages to keep the low output current ripple. Figure 3 shows the inductor current ripple ΔI
with different output voltages. In most applications, no
additional frequency adjusting is required.
1200
1000
FREQUENCY (kHz)
VIN to VOUT Stepdown Ratios
The output margining will be ± margining of the value.
This is controlled by the MARG0 and MARG1 pins. See
the truth table below:
800
600
400
200
2
4
6
10
8
VOUT (V)
12
14
16
4612 F02
Figure 2. Operating Frequency vs Output Voltage
3.5
INDUCTOR CURRENT RIPPLE ΔI (A)
The typical LTM4612 application circuit is shown in
Figure 18. External component selection is primarily
determined by the maximum load current and output
voltage. Refer to Table 2 for specific external capacitor
requirements for a particular application.
3.0
VIN = 36V
2.5
2.0
VIN = 28V
VIN = 20V
1.5
1.0
0.5
2
4
6
8
10
VOUT (V)
12
14
16
4612 F03
Figure 3. Inductor Current Ripple vs Output Voltage
4612f
10
LTM4612
APPLICATIONS INFORMATION
f=
VOUT
(R fSET || 93 . 1k )
1 . 5 • 10 − 10
For output voltages more than 12V, the frequency can be
higher than 1MHz, thus reducing the efficiency significantly.
Additionally, the minimum off time 400ns normally limits
the operation when the input voltage is close to the output
voltage. Therefore, it is recommended to lower the frequency in these conditions by connecting a resistor (RfSET)
from the fSET pin to VIN, as shown in Figure 20.
f=
VOUT
⎛ 3 • R fSET • 93 . 1k ⎞
5 • 10 − 11 ⎜
⎝ R fSET − 3 • 93 . 1k ⎟⎠
The load current can affect the frequency due to its constant
on-time control. If constant frequency is a necessity, the
PLLIN pin can be used to synchronize the frequency of
the LTM4612 to an external clock, as shown in Figures
21 to 23.
Input Capacitors
LTM4612 is designed to achieve the low input conducted
EMI noise due to the fast switching of turn-on and turn-off.
In the LTM4612, a high-frequency inductor is integrated
into the input line for noise attenuation. VD and VIN pins
are available for external input capacitors to form a high
frequency π filter. As shown in Figure 18, the ceramic
capacitor C1 on the VD pins is used to handle most of
the RMS current into the converter, so careful attention
is needed for capacitor C1 selection.
For a buck converter, the switching duty cycle can be
estimated as:
V
D = OUT
VIN
Without considering the inductor current ripple, the RMS
current of the input capacitor can be estimated as:
IOUT(MAX )
ICIN(RMS) =
• D • ( 1 – D)
η
In this equation, η is the estimated efficiency of the
power module. Note the capacitor ripple current ratings
are often based on temperature and hours of life. This
makes it advisable to properly derate the input capacitor,
or choose a capacitor rated at a higher temperature than
required. Always contact the capacitor manufacturer for
derating requirements.
In a typical 5A output application, one very low ESR, X5R
or X7R, 10μF ceramic capacitor is recommended for C1.
This decoupling capacitor should be placed directly adjacent to the module VD pins in the PCB layout to minimize
the trace inductance and high frequency AC noise. Each
10μF ceramic is typically good for 2A to 3A of RMS ripple
current. Refer to your ceramics capacitor catalog for the
RMS current ratings.
To attenuate the high frequency noise, extra input capacitors
should be connected to the VIN pads and placed before the
high frequency inductor to form the π filter. One of these
low ESR ceramic input capacitors is recommended to be
close to the connection into the system board. A large
bulk 100μF capacitor is only needed if the input source
impedance is compromised by long inductive leads or
traces. Figure 4 shows the conducted EMI testing results
to meet the Level 5 of the CISPR 25 limit. For different
applications, input capacitance may be varied to meet
different conducted EMI limits.
80
70
SIGNAL AMPLITUDE (dBμV)
If lower output ripple is required, the operating frequency
f can be increased by adding a resistor RfSET between fSET
pin and SGND, as shown in Figure 19.
60
CIS25QP
50
40
30
20
10
0
0.15
1
FREQUENCY (MHz)
10
30
4612 F04
Figure 4. Conducted Emission Scan with 24VIN to
12VOUT at 5A (3 × 10μF Ceramic Capacitors on VIN
Pads and 1 × 10μF Ceramic Capacitor on VD Pads).
4612f
11
LTM4612
APPLICATIONS INFORMATION
Output Capacitors
The LTM4612 is designed for low output voltage ripple.
The bulk output capacitors defined as COUT are chosen
with low enough effective series resistance (ESR) to meet
the output voltage ripple and transient requirements. COUT
can be low ESR tantalum capacitor, low ESR polymer
capacitor or ceramic capacitor. The typical capacitance is
150μF if all ceramic output capacitors are used. Additional
output filtering may be required by the system designer,
if further reduction of output ripple or dynamic transient
spike is required. Table 2 shows a matrix of different output
voltages and output capacitors to minimize the voltage
droop and overshoot during a 2A/μs transient. The table
optimizes total equivalent ESR and total bulk capacitance
to maximize transient performance.
Multiphase operation with multiple LTM4612 devices in
parallel will also lower the effective output ripple current
due to the phase interleaving operation. Refer to Figure 5
for the normalized output ripple current versus the duty
cycle. Figure 5 provides a ratio of peak-to-peak output
ripple current to the inductor ripple current as functions
of duty cycle and the number of paralleled phases. Pick
the corresponding duty cycle and the number of phases
to get the correct output ripple current value. For example,
each phase’s inductor ripple current DIr at zero duty cycle
is ~4.3A for a 36V to 12V design. The duty cycle is about
0.33. The 2-phase curve has a ratio of ~0.33 for a duty
cycle of 0.33. This 0.33 ratio of output ripple current to
the inductor ripple current DIr at 4.3A equals 1.4A of the
output ripple current (ΔIL).
The output voltage ripple has two components that are
related to the amount of bulk capacitance and effective
series resistance (ESR) of the output bulk capacitance.
The equation is:
⎞
⎛
Δ IL
+ ESR • Δ IL
Δ VOUT (P −P) ≈ ⎜
⎝ 8 • f • N • COUT ⎟⎠
Where f is the frequency and N is the number of paralleled phases.
1.00
0.95
1-PHASE
2-PHASE
3-PHASE
4-PHASE
6-PHASE
0.90
0.85
RATIO =
PEAK-TO-PEAK OUTPUT RIPPLE CURRENT
DIr
0.80
0.75
0.70
0.65
0.60
0.55
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 0.7 0.75 0.8 0.85 0.9
DUTY CYCLE (VO/VIN)
4612 F05
Figure 5. Normalized Output Ripple Current vs Duty Cycle, Dlr = VOT/LI
4612f
12
LTM4612
APPLICATIONS INFORMATION
Fault Conditions: Current Limit and
Overcurrent Foldback
Output Voltage Tracking
LTM4612 has a current mode controller, which inherently
limits the cycle-by-cycle inductor current not only in steady
state operation, but also in transient.
To further limit current in the event of an overload condition, the LTM4612 provides foldback current limiting. If the
output voltage falls by more than 50%, then the maximum
output current is progressively lowered to about one sixth
of its full current limit value.
Soft-Start and Tracking
The TRACK/SS pin provides a means to either soft-start
the regulator or track it to a different power supply. A
capacitor on this pin will program the ramp rate of the
output voltage. A 1.5μA current source will charge up the
external soft-start capacitor to 80% of the 0.6V internal
voltage reference minus any margin delta. This will control
the ramp of the internal reference and the output voltage.
The total soft-start time can be calculated as:
C
t SOFTSTART ≅ 0.8 • 0.6 V – VOUT(MARGIN) • SS
1.5µA
(
)
If the RUN pin falls below 2.5V, then the soft-start pin
is reset to allow for the proper soft-start again. Current
foldback and force continuous mode are disabled during
the soft-start process. The soft-start function can also
be used to control the output ramp rising time, so that
another regulator can be easily tracked.
VIN
VD
PGOOD
VIN
PLLIN
VOUT
RUN
MASTER
OUTPUT
TRACK
CONTROL
R2
100k
R1
5.23k
RUN Enable
The RUN pin is used to enable the power module. The
pin has an internal 5.1V zener to ground. The pin can be
driven with 5V logic levels.
The RUN pin can also be used as an undervoltage lockout
(UVLO) function by connecting a resistor divider from
the input supply to the RUN pin. The equation for UVLO
threshold:
VUVLO =
R1+ R2
• 1.5V
R2
where R1 is the top resistor, and R2 is the bottom resistor.
Power Good
The PGOOD pin is an open-drain pin that can be used to
monitor valid output voltage regulation. This pin monitors
a ±10% window around the regulation point, and tracks
with margining.
10μF
100k
CIN
Output voltage tracking can be programmed externally
using the TRACK/SS pin. The output can be tracked up
and down with another regulator. The master regulator’s
output is divided down with an external resistor divider
that is the same as the slave regulator’s feedback divider.
Figure 6 shows an example of coincident tracking. Ratiometric modes of tracking can be achieved by selecting
different resistor values to change the output tracking ratio.
The master output must be greater than the slave output
for the tracking to work. Figure 7 shows the coincident
output tracking.
COMP
SLAVE
OUTPUT
VFB
LTM4612
MARG0
DRVCC
MARG1
TRACK/SS
SGND
COUT
FCB
INTVCC
fSET
MASTER OUTPUT
SLAVE OUTPUT
OUTPUT
VOLTAGE
MPGM
5.23k
PGND
4612 F06
TIME
Figure 6. Coincident Tracking
4612 F07
Figure 7. Coincident Output Tracking
4612f
13
LTM4612
APPLICATIONS INFORMATION
COMP Pin
Parallel Operation
The pin is the external compensation pin. The module
has already been internally compensated for most output
voltages. An Excel design tool from Linear Technology will
be provided for more control loop optimization.
The LTM4612 device is an inherently current mode controlled device. This allows the paralleled modules to have
very good current sharing and balanced thermal on the
design. Figure 21 shows a schematic of the parallel design.
The voltage feedback equation changes with the variable
N as modules are paralleled. The equation:
The FCB pin determines whether the bottom MOSFET
remains on when current reverses in the inductor. Tying
this pin above its 0.6V threshold enables discontinuous
operation where the bottom MOSFET turns off when inductor current reverses. FCB pin below the 0.6V threshold
forces continuous synchronous operation, allowing current
to reverse at light loads and maintaining high frequency
operation.
PLLIN Pin
The power module has a phase-locked loop comprised
of an internal voltage controlled oscillator and a phase
detector. This allows the internal top MOSFET turn-on
to be locked to the rising edge of the external clock.
The frequency range is ±30% around the set operating
frequency. A pulse detection circuit is used to detect a
clock on the PLLIN pin to turn on the phase-locked loop.
The pulse width of the clock has to be at least 400ns, and
2V in amplitude. During the start-up of the regulator, the
phase-locked loop function is disabled.
INTVCC and DRVCC Connection
An internal low dropout regulator produces an internal
5V supply that powers the control circuitry and DRVCC
for driving the internal power MOSFETs. Therefore, if
the system does not have a 5V power rail, the LTM4612
can be directly powered by VIN . The gate driver current
through the LDO is about 20mA. The internal LDO power
dissipation can be calculated as:
PLDO_LOSS = 20mA • (VIN – 5V)
The LTM4612 also provides the external gate driver voltage
pin DRVCC. If there is a 5V rail in the system, it is recommended to connect the DRVCC pin to the external 5V rail.
This is especially true for higher input voltages. Do not
apply more than 6V to the DRVCC pin.
100k
+ RFB
N
VOUT = 0.6 V
RFB
N is the number of paralleled modules.
Radiated EMI Noise
High radiated EMI noise is a disadvantage for switching
regulators by nature. Fast switching turn-on and turn-off
make the large di/dt change in the converters, which act
as the radiation sources in most systems. LTM4612 integrates the feature to minimize the radiated EMI noise to
meet the most applications with low noise requirements.
An optimized gate driver for the MOSFET and a noise
cancellation network are installed inside the LTM4612
to achieve the low radiated EMI noise. Figure 8 shows a
typical example for the LTM4612 to meet the Class B of
CISPR 22 radiated emission limit.
90
EMISSIONS LEVEL (dBμV/m)
FCB Pin
70
50
CISPR22, CLASS B
30
10
0
0
100
200
300
400 500 600 700
FREQUENCY (MHz)
800
900 1000
4612 F08
Figure 8. Radiated Emission Scan with 24VIN to
12VOUT at 5A Measured in 10 Meter Chamber
Thermal Considerations and Output Current Derating
In different applications, LTM4612 operates in a variety
of thermal environments. The maximum output current is
limited by the environment thermal condition. Sufficient
cooling should be provided to help ensure reliable opera4612f
14
LTM4612
APPLICATIONS INFORMATION
tion. When the cooling is limited, proper output current
derating is necessary, considering ambient temperature,
airflow, input/output condition, and the need for increased
reliability.
125°C maximum. This will maintain the maximum operating temperature below 125°C. Each of the derating curves
and the power loss curve that corresponds to the correct
output voltage can be used to solve for the approximate
θJA of the condition. Each figure has three curves that are
taken at three different air flow conditions. Each of the
derating curves in Figures 11 to 16 can be used with the
appropriate power loss curve in either Figure 9 or Figure
10 to derive an approximate θJA. Table 3 provides the approximate θJA for Figures 11 to 16. A complete explanation
of the thermal characteristics is provided in the thermal
application note, AN110.
The power loss curves in Figures 9 and 10 can be used
in coordination with the load current derating curves in
Figures 11 to 16 for calculating an approximate θJA for
the module. Graph designation delineates between no
heat sink, and a BGA heat sink. Each of the load current
derating curves will lower the maximum load current as a
function of the increased ambient temperature to keep the
maximum junction temperature of the power module at
6
6
5
5
5.0
200
LFM
4.5
4.0
4
3
24VIN TO 12VOUT
2
LOAD CURRENT (A)
POWER LOSS (W)
POWER LOSS (W)
36VIN TO 15VOUT
4
36VIN TO 5VOUT
3
2
400LFM
3.0
2.5
2.0
1.5
1.0
1
1
0LFM
3.5
0.5
0
0
1
0
2
3
4
0
5
LOAD CURRENT (A)
2
1
3
4
LOAD CURRENT (A)
4612 F09
0
5
25
35
4612 F10
45 55 65 75 85 95
AMBIENT TEMPERATURE (°C)
105
4612 F11
Figure 9. Power Loss at
12VOUT and 15VOUT
Figure 10. Power Loss at 5VOUT
5.0
5.0
200
LFM
4.0
0LFM
5.0
200
LFM
4.5
4.0
400LFM
LOAD CURRENT (A)
3.5
3.0
2.5
2.0
1.5
0LFM
4.0
400LFM
3.5
3.0
2.5
2.0
1.5
2.5
2.0
1.5
1.0
0.5
0.5
0.5
0
0
45 55 65 75 85 95
AMBIENT TEMPERATURE (°C)
105
0
25
35
45 55 65 75 85 95
AMBIENT TEMPERATURE (°C)
4612 F12
Figure 12. BGA Heat Sink
with 36VIN to 5VOUT
400LFM
3.0
1.0
35
0LFM
3.5
1.0
25
200
LFM
4.5
LOAD CURRENT (A)
4.5
LOAD CURRENT (A)
Figure 11. No Heat Sink
with 36VIN to 5VOUT
105
25
35
45 55 65 75 85 95
AMBIENT TEMPERATURE (°C)
4612 F13
Figure 13. No Heat Sink
with 24VIN to 12VOUT
105
4612 F14
Figure 14. BGA Heat Sink
with 24VIN to 12VOUT
4612f
15
LTM4612
APPLICATIONS INFORMATION
5.0
5.0
4.5
4.5
200LFM
0LFM
4.0
400LFM
3.5
LOAD CURRENT (A)
LOAD CURRENT (A)
4.0
3.0
2.5
2.0
1.5
200LFM
400LFM
3.0
2.5
2.0
1.5
1.0
1.0
0.5
0.5
0
0LFM
3.5
0
25
35
45
55
65
75
85
AMBIENT TEMPERATURE (°C)
25
95
35
45
55
65
75
85
AMBIENT TEMPERATURE (°C)
4612 F15
95
4612 F16
Figure 15. No Heat Sink
with 36VIN to 15VOUT
Figure 16. BGA Heat Sink
with 36VIN to 15VOUT
Table 2. Output Voltage Response Versus Component Matrix (Refer to Figure 20)
TYPICAL MEASURED VALUES
VENDORS
Murata
Murata
VOUT
(V)
5
5
CIN
(CERAMIC)
PART NUMBER
GRM32ER61C476KEI5L (47μF, 16V)
GRM32ER61C226KE20L (22μF, 16V)
COUT1
(CERAMIC)
COUT2
(BULK)
150μF 25V
VENDORS
Murata
TDK
2 × 10μF 50V
CIN
(BULK)
100μF 50V
VIN
(V)
12
2 × 22μF 16V
2 × 10μF 50V
100μF 50V
4 × 47μF 16V
None
12
5
2 × 10μF 50V
100μF 50V
2 × 22μF 16V
150μF 25V
24
5
2 × 10μF 50V
100μF 50V
4 × 47μF 16V
None
24
5
2 × 10μF 50V
100μF 50V
2 × 22μF 16V
150μF 25V
36
DROOP
(mV)
86
PART NUMBER
GRM32ER71H106K (10μF, 50V)
C3225X5RIC226M (22μF, 16V)
PEAK-TOPEAK (mV)
156
RECOVERY
TIME (μs)
26
LOAD STEP
(A/μs)
3
RFB
(kΩ)
13.7
86
178
14.8
3
13.7
83
166
27
3
13.7
86
169
14.8
3
13.7
86
178
25
3
13.7
5
2 × 10μF 50V
100μF 50V
4 × 47μF 16V
None
36
86
172
15.2
3
13.7
10
2 × 10μF 50V
100μF 50V
2 × 22μF 16V
150μF 25V
24
111
209
30
3
6.34
10
2 × 10μF 50V
100μF 50V
4 × 47μF 16V
None
24
171
325
35
3
6.34
10
2 × 10μF 50V
100μF 50V
2 × 22μF 16V
150μF 25V
36
108
197
35
3
6.34
10
2 × 10μF 50V
100μF 50V
4 × 47μF 16V
None
36
153
288
39
3
6.34
5.23
12
2 × 10μF 50V
100μF 50V
2 × 22μF 16V
150μF 25V
24
153
281
37
3
12
2 × 10μF 50V
100μF 50V
4 × 47μF 16V
None
36
184
375
34.4
3
5.23
15
2 × 10μF 50V
100μF 50V
2 × 22μF 16V
150μF 25V
28
178
338
70
3
4.12
15
2 × 10μF 50V
100μF 50V
4 × 47μF 16V
None
36
134
250
70
3
4.12
Table 3. 12V and 15V Outputs
DERATING CURVE
VIN (V)
POWER LOSS CURVE
Figures 11, 13, 15
24, 36
Figures 11, 13, 15
24, 36
Figures 11, 13, 15
θJA (°C/W)
AIR FLOW (LFM)
HEAT SINK
Figure 9
0
None
13
Figure 9
200
None
9.3
24, 36
Figure 9
400
None
8.3
Figures 12, 14, 16
24, 36
Figure 9
0
BGA Heat Sink
12.2
Figures 12, 14, 16
24, 36
Figure 9
200
BGA Heat Sink
8.6
Figures 12, 14, 16
24, 36
Figure 9
400
BGA Heat Sink
7.7
4612f
16
LTM4612
APPLICATIONS INFORMATION
Table 4. 5V Output
VIN (V)
POWER LOSS CURVE
AIR FLOW (LFM)
HEAT SINK
θJA (°C/W)
Figures 18, 21
36
Figure 10
0
None
14.9
Figures 18, 21
36
Figure 10
200
None
11.1
Figures 18, 21
36
Figure 10
400
None
10
Figures 10, 13, 16
36
Figure 10
0
BGA Heat Sink
14
Figures 10, 13, 16
36
Figure 10
200
BGA Heat Sink
10.4
Figures 10, 13, 16
36
Figure 10
400
BGA Heat Sink
9.3
DERATING CURVE
Heat Sink Manufacturer
Wakefield Engineering
Part No: LTN20069
Phone: 603-635-2800
Safety Considerations
• Do not put vias directly on pads.
The LTM4612 modules do not provide isolation from VIN
to VOUT. There is no internal fuse. If required, a slow blow
fuse with a rating twice the maximum input current needs
to be provided to protect each unit from catastrophic
failure.
• If vias are placed onto the pads, the the vias must be
capped.
Layout Checklist/Example
The high integration of LTM4612 makes the PCB board
layout very simple and easy. However, to optimize its
electrical and thermal performance, some layout considerations are still necessary.
• Use large PCB copper areas for high current path, including VIN, PGND and VOUT. It helps to minimize the
PCB conduction loss and thermal stress.
• Place high frequency ceramic input and output capacitors next to the VD, PGND and VOUT pins to minimize
high frequency noise.
• Interstitial via placement can also be used if necessary.
• Use a separated SGND ground copper area for components connected to signal pins. Connect the SGND
to PGND underneath the unit.
• Place one or more high frequency ceramic capacitors
close to the connection into the system board.
Figure 17 gives a good example of the recommended
layout.
VIN
CIN
CIN
GND
• Place a dedicated power ground layer underneath the
unit.
SIGNAL
GND
• Use round corners for the PCB copper layer to minimize
the radiated noise.
• To minimize the EMI noise and reduce module thermal
stress, use multiple vias for interconnection between
top layer and other power layers.
COUT
COUT
VOUT
4612 F17
Figure 17. Recommended PCB Layout
4612f
17
LTM4612
APPLICATIONS INFORMATION
VOUT
CLOCK SYNC
VIN
22V TO 36V
R3
100k
R4
100k
R5
2M
C1
10μF
50V
VD
VIN
PLLIN
VOUT
PGOOD
RUN LTM4612
ON/OFF
VFB
COMP
INTVCC
FCB
DRVCC
MARG0
fSET
MARG1
TRACK/SS
MPGM
C4
SGND PGND
0.01μF
CIN
10μF
50V CERAMIC
C3
22pF
RFB
5.23k
MARGIN
CONTROL
COUT1
22μF
16V
VOUT
12V
COUT2 5A
220μF
16V
+
REFER TO TABLE 2
R1
392k
5% MARGIN
4612 F18
Figure 18. Typical 22V to 36VIN, 12V at 5A Design
VOUT
CLOCK SYNC
VIN
5V TO 36V
R4
100k
CIN
10μF
50V CERAMIC
EXTERNAL 5V SUPPLY
IMPROVES EFFICIENCY—
ESPECIALLY FOR HIGH
INPUT VOLTAGES
R3
100k
C1
10μF
50V
VD
VIN
PLLIN
VOUT
PGOOD
RUN
ON/OFF
VFB
COMP
LTM4612
INTVCC
FCB
C3
22pF
RFB
22.1k
DRVCC
fSET
TRACK/SS
RfSET
191k
1%
C4
0.01μF
SGND
MARG0
MARG1
MPGM
PGND
MARGIN
CONTROL
COUT1
22μF
6.3V
+
COUT2
220μF
6.3V
VOUT
3.3V
5A
REFER TO TABLE 2
R1
392k
5% MARGIN
4612 F19
Figure 19. Typical 5V to 36VIN, 3.3V at 5A Design with 400kHz Frequency
4612f
18
LTM4612
APPLICATIONS INFORMATION
VOUT
CLOCK SYNC
VIN
26V TO 36V
R4
100k
RfSET
806k, 1%
CIN
10μF
50V
CERAMIC
C1
10μF
50V
R3
100k
VD
VIN
PLLIN
VOUT
PGOOD
RUN LTM4612
ON/OFF
VFB
COMP
INTVCC
FCB
DRVCC
MARG0
fSET
MARG1
TRACK/SS
MPGM
SGND PGND
C4
0.01μF
C3
22pF
COUT1
22μF
16V
RFB
4.12k
+
COUT2
220μF
16V
VOUT
15V
4A
MARGIN
CONTROL
R1
392k
5% MARGIN
4612 F20
Figure 20. 26V to 36VIN, 15V at 4A Design with Reduced Frequency
VOUT
VIN
20V TO 36V
R4
100k
C2
10μF
50V
+
2-PHASE
OSCILLATOR
R5
124k
C11
0.1μF
C5
100μF
50V
R2
100k
C1
10μF
50V
CLOCK SYNC
0° PHASE
VD
VIN
PLLIN
PGOOD
VOUT
RUN LTM4612
VFB
COMP
FCB
INTVCC
DRVCC
MARG0
fSET
MARG1
TRACK/SS
MPGM
C7
SGND PGND
0.33μF
VOUT
12V, 10A
C6
47pF
C3
22μF
16V
R1
392k
C11
10μF
50V
C8
10μF
50V
C10
220μF
16V
100k/N + RFB
RFB
CLOCK SYNC
180° PHASE
VD
VIN
PLLIN
VOUT
PGOOD
RUN LTM4612
VFB
COMP
FCB
INTVCC
DRVCC
fSET
TRACK/SS
SGND
+
RFB
2.61k
VOUT = 0.6V •
LTC6908-1
C4
220μF
16V
MARGIN
CONTROL
5% MARGIN
V+ OUT1
GND OUT2
SET MOD
+
C9
22μF
16V
MARG0
MARG1
MPGM
PGND
R6
392k
4612 F21
Figure 21. 2-Phase, Parallel 12V at 10A Design
4612f
19
LTM4612
APPLICATIONS INFORMATION
12V
VIN
22V TO 36V
R4
100k
+
C5
100μF
50V
R2
100k
C2
10μF
50V
C7
0.15μF
C1
10μF
50V
VD
CLOCK SYNC
0° PHASE
VIN
2-PHASE
OSCILLATOR
C11
0.1μF
12V AT 5A
C6
22pF
C3
22μF
16V
+
C4
220μF
16V
MARGIN
CONTROL
RFB1
5.23k
R1
392k
5% MARGIN
V+
R5
118k
PLLIN
PGOOD
VOUT
RUN LTM4612
VFB
COMP
FCB
INTVCC
DRVCC
MARG0
fSET
MARG1
TRACK/SS
MPGM
SGND PGND
10V
OUT1
GND OUT2
SET MOD
LTC6908-1
R3
100k
R7
100k
12V TRACK
C8
10μF
50V
R8
100k
R9
6.24k
C11
10μF
50V
CLOCK SYNC
180° PHASE
VD
VIN
PLLIN
VOUT
PGOOD
RUN LTM4612
COMP
INTVCC
DRVCC
fSET
TRACK/SS
SGND
10V AT 5A
C1
22pF
VFB
FCB
MARG0
MARG1
MPGM
PGND
C9
22μF
16V
+
C10
220μF
16V
MARGIN
CONTROL
R6
392k
RFB2
6.24k
4612 F22
Figure 22. 2-Phase, 12V and 10V at 5A Design
4612f
20
LTM4612
APPLICATIONS INFORMATION
5V
VIN
7V TO 36V
C1
10μF
50V
R2
100k
R4
100k
C2
10μF
50V
+
C5
100μF
50V
RfSET1
150k
C7
0.15μF
VD
VIN
PLLIN
VOUT
PGOOD
RUN LTM4612
VFB
COMP
INTVCC
FCB
DRVCC
MARG0
fSET
MARG1
TRACK/SS
MPGM
SGND PGND
2-PHASE
OSCILLATOR
R5
200k
C11
0.1μF
CLOCK SYNC
0° PHASE
5V AT 5A
C6
22pF
C3
22μF
6.3V
+
C4
220μF
6.3V
MARGIN
CONTROL
R1
392k
RFB1
13.7k
5% MARGIN
V+ OUT1
GND OUT2
SET MOD
3.3V
LTC6908-1
R3
100k
R7
100k
5V TRACK
C8
10μF
50V
R8
100k
R9
22.1k
RfSET2
100k
C11
CLOCK SYNC
10μF
180° PHASE
50V
VIN
VD
PLLIN
VOUT
PGOOD
RUN
VFB
COMP
LTM4612
FCB
INTVCC
DRVCC
fSET
TRACK/SS
SGND
MARG0
MARG1
MPGM
PGND
3.3V AT 5A
C1
22pF
C9
22μF
6.3V
+
C10
220μF
6.3V
MARGIN
CONTROL
R6
392k
RFB2
22.1k
4612 F23
Figure 23. 2-Phase, 5V and 3.3V at 5A Design with 500kHz Frequency
4612f
21
LTM4612
PACKAGE DESCRIPTION
Pin Assignment Tables
(Arranged by Pin Function)
PIN NAME
PIN NAME
A1
A2
A3
A4
A5
A6
VIN
VIN
VIN
VIN
VIN
VIN
D1
D2
D3
D4
D5
D6
PGND
PGND
PGND
PGND
PGND
PGND
B1
B2
B3
B4
B5
B6
VIN
VIN
VIN
VIN
VIN
VIN
C1
C2
C3
C4
C5
C6
VIN
VIN
VIN
VIN
VIN
VIN
E1
E2
E3
E4
E5
E6
E7
E8
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
F1
F2
F3
F4
F5
F6
F7
F8
F9
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
G1
G2
G3
G4
G5
G6
G7
G8
G9
G10
G11
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
H1
H2
H3
H4
H5
H6
H7
H8
H9
H10
H11
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PIN NAME
J1
J2
J3
J4
J5
J6
J7
J8
J9
J10
J11
VOUT
VOUT
VOUT
VOUT
VOUT
VOUT
VOUT
VOUT
VOUT
VOUT
VOUT
K1
K2
K3
K4
K5
K6
K7
K8
K9
K10
K11
VOUT
VOUT
VOUT
VOUT
VOUT
VOUT
VOUT
VOUT
VOUT
VOUT
VOUT
L1
L2
L3
L4
L5
L6
L7
L8
L9
L10
L11
VOUT
VOUT
VOUT
VOUT
VOUT
VOUT
VOUT
VOUT
VOUT
VOUT
VOUT
M1
M2
M3
M4
M5
M6
M7
M8
M9
M10
M11
VOUT
VOUT
VOUT
VOUT
VOUT
VOUT
VOUT
VOUT
VOUT
VOUT
VOUT
PIN NAME
A7
A8
A9
A10
A11
A12
INTVCC
PLLIN
TRACK/SS
RUN
COMP
MPGM
B7
B8
B9
B10
B11
B12
VD
RUN
MPGM
fSET
C7
C8
C9
C10
C11
C12
VD
DRVCC
MARG1
MARG0
D7
D8
D9
D10
D11
D12
SGND
COMP
MARG1
E9
E10
E11
E12
DRVCC
DRVCC
F10
F11
F12
VFB
G12
PGOOD
H12
SGND
J12
NC
K12
NC
L12
NC
M12
FCB
4612f
22
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
6.9850
5.7150
4.4450
3.1750
1.9050
0.6350
0.0000
0.6350
1.9050
3.1750
4.4450
5.7150
6.9850
PACKAGE TOP VIEW
3.1750
SUGGESTED PCB LAYOUT
TOP VIEW
1.9050
4
0.6350
0.0000
0.6350
PAD 1
CORNER
15
BSC
1.9050
aaa Z
6.9850
5.7150
4.4450
3.1750
4.4450
5.7150
6.9850
X
15
BSC
Y
bbb Z
DETAIL B
2.72 – 2.92
DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
LAND DESIGNATION PER JESD MO-222, SPP-010
SYMBOL TOLERANCE
aaa
0.10
0.10
bbb
0.05
eee
6. THE TOTAL NUMBER OF PADS: 133
5. PRIMARY DATUM -Z- IS SEATING PLANE
4
3
2. ALL DIMENSIONS ARE IN MILLIMETERS
3
M
L
TRAY PIN 1
BEVEL
COMPONENT
PIN “A1”
PADS
SEE NOTES
1.27
BSC
13.97
BSC
0.12 – 0.28
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
DETAIL A
0.27 – 0.37
SUBSTRATE
eee S X Y
DETAIL B
0.630 ±0.025 SQ. 133x
aaa Z
2.45 – 2.55
MOLD
CAP
Z
(Reference LTM DWG # 05-08-1766 Rev Ø)
LGA Package
133-Lead (15mm × 15mm × 2.82mm)
K
G
F
E
LTMXXXXXX
μModule
PACKAGE BOTTOM VIEW
H
D
C
B
LGA 133 1107 REV Ø
A
DETAIL A
PACKAGE IN TRAY LOADING ORIENTATION
J
13.97
BSC
1
2
3
4
5
6
7
8
9
10
11
12
C(0.30)
PAD 1
LTM4612
PACKAGE DESCRIPTION
4612f
23
LTM4612
PACKAGE PHOTOGRAPH
15mm
2.8mm
15mm
4612 F24
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DESCRIPTION
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Basic 10A DC/DC μModule, LGA Package
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6A DC/DC μModule with PLL and Output Tracking/
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Ultralow Noise 6A, DC/DC μModule
Ultralow Noise, with PLL, Output Tracking and Margining, LTM4612
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Low VIN 8A DC/DC μModule
2.4V ≤ VIN ≤ 5.5V; 0.6V ≤ VOUT ≤ 5V; 9mm × 15mm × 2.8mm LGA Package
LTM8020
High VIN 0.2A DC/DC Step-Down μModule
4V ≤ VIN ≤ 36V, 1.25V ≤ VOUT ≤ 5V 6.25mm × 6.25mm × 2.3mm LGA Package
LTM8021
High VIN 0.5A DC/DC Step-Down μModule
3V ≤ VIN ≤ 36V, 0.8V ≤ VOUT ≤ 5V 6.25mm × 11.25mm × 2.8mm LGA Package
LTM8022/LTM8023 36VIN, 1A and 2A DC/DC μModule
Pin Compatible; 4.5V ≤ VIN ≤ 36V; 9mm × 11.25mm × 2.8mm LGA Package
4612f
24 Linear Technology Corporation
LT 0808 • PRINTED IN USA
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 ● FAX: (408) 434-0507
●
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© LINEAR TECHNOLOGY CORPORATION 2008