MITSUBISHI CM75RX-24A

MITSUBISHI IGBT MODULES
CM75RX-24A
HIGH POWER SWITCHING USE
CM75RX-24A
¡IC ..................................................................... 75A
¡VCES ......................................................... 1200V
¡7pack (3-phase Inverter + Brake)
¡Flatbase Type / Insulated Package /
Copper (non-plating) base plate
¡RoHS Directive compliant
APPLICATION
General purpose Inverters, Servo Amplifiers
OUTLINE DRAWING & CIRCUIT DIAGRAM
1.15
0.65
TERMINAL t = 0.8
4-φ5.5 MOUNTING HOLES
(20.5)
0.8
(21.14)
6.5
1.2
*91.2
*95
(102.25)
(110)
*114.06
*75.96
*79.76
*60.72
*64.52
136.9
121.7
110 ±0.5
99
94.5
SECTION A
17
13
*45.48
*49.28
*30.24
*34.04
0
(7.75)
*15
*18.8
12.5
0.8
(50)
35
10
22
39
8
6
5
2
3
*15.48
*11.66
4
0
(21.14)
13.64 14
17
12
6
7
36
1
A
6
12
6.5
12.5
(SCREWING DEPTH)
17 +1
-0.5
*34.52
*30.72
11
39
50 ±0.5
57.5
62
77.1
17
12
6
12
9
(5.4)
7
*54.2
34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13
(3)
(7.4)
(3.81)
LABEL
3.5
φ2.5
φ2.1
Dimensions in mm
(20.5)
1.5
φ4.3
13.5
20.71
8.5
17
22.86
22.86
6-M5 NUTS
TH1(11)
NTC
P(35)
GuP(34)
GvP(26)
GwP(18)
EuP(33)
EvP(25)
U(1)
Division of Dimension
W(3)
±0.2
to
6
±0.3
to
30
±0.5
30
to
120
±0.8
over 120
to
400
±1.2
to
over
3
over
6
over
GB(6)
EB(5)
GuN(30)
GvN(22)
GwN(14)
N(36)
EuN(29)
EvN(21)
EwN(13)
Tolerance
3
0.5
EwP(17)
V(2)
φ0.5
Tolerance otherwise specified
TH2(10)
B(4)
*Pin positions
with tolerance
22.86
CIRCUIT DIAGRAM
Jan. 2009
MITSUBISHI IGBT MODULES
CM75RX-24A
HIGH POWER SWITCHING USE
ABSOLUTE MAXIMUM RATINGS
INVERTER PART
Symbol
VCES
VGES
IC
ICRM
PC
IE (Note.3)
IERM(Note.3)
(Tj = 25°C, unless otherwise specified)
Parameter
Collector-emitter voltage
Gate-emitter voltage
Conditions
G-E Short
C-E Short
DC, TC = 93°C
Collector current
Pulse
Maximum collector dissipation TC = 25°C
Emitter current
TC = 25°C
(Free wheeling diode forward current) Pulse
(Note. 1)
(Note. 4)
(Note. 1, 5)
(Note. 1)
(Note. 4)
Rating
1200
±20
75
150
500
75
150
Unit
Rating
1200
±20
50
100
355
1200
50
100
Unit
Rating
–40 ~ +150
–40 ~ +125
2500
±0 ~ +100
2.5 ~ 3.5
2.5 ~ 3.5
330
Unit
V
A
W
A
BRAKE PART
Symbol
VCES
VGES
IC
ICRM
PC
VRRM(Note.3)
IF (Note.3)
IFRM(Note.3)
Parameter
Collector-emitter voltage
Gate-emitter voltage
Conditions
G-E Short
C-E Short
DC, TC = 97°C
Collector current
Pulse
Maximum collector dissipation TC = 25°C
Repetitive peak reverse voltage
TC = 25°C
Forward current
Pulse
(Note. 1)
(Note. 4)
(Note. 1, 5)
(Note. 1)
(Note. 4)
V
A
W
V
A
MODULE
Symbol
Tj
Tstg
Viso
—
—
—
—
Parameter
Junction temperature
Storage temperature
Isolation voltage
Base plate flatness
Torque strength
Torque strength
Weight
Conditions
Terminals to base plate, f = 60Hz, AC 1 minute
(Note. 8)
On the centerline X, Y
M5 screw
Main terminals
M5 screw
Mounting
(Typical)
°C
Vrms
μm
N·m
g
+:convex
–:concave
–
Y
+
Heat sink side
Note. 8: The base plate flatness measurement points are in the following figure.
X
–
+
Heat sink side
Jan. 2009
2
MITSUBISHI IGBT MODULES
CM75RX-24A
HIGH POWER SWITCHING USE
ELECTRICAL CHARACTERISTICS
INVERTER PART
Symbol
(Tj = 25°C, unless otherwise specified)
Parameter
Conditions
ICES
VGE(th)
IGES
VCE = VCES, VGE = 0V
Collector cutoff current
Gate-emitter threshold voltage IC = 7.5mA, VCE = 10V
Gate leakage current
±VGE = VGES, VCE = 0V
VCE(sat)
Collector-emitter saturation
voltage
Cies
Coes
Cres
QG
td(on)
tr
td(off)
tf
trr (Note.3)
Qrr (Note.3)
Input capacitance
Output capacitance
Reverse transfer capacitance
Total gate charge
Turn-on delay time
Turn-on rise time
Turn-off delay time
Turn-off fall time
Reverse recovery time
Reverse recovery charge
VEC(Note.3) Emitter-collector voltage
Rth(j-c)Q
Rth(j-c)R
RGint
RG
(Note. 6)
IC = 75A, VGE = 15V
IC = 75A, VGE = 15V
VCE = 10V
VGE = 0V
Tj = 25°C
Tj = 125°C
Chip
(Note. 6)
VCC = 600V, IC = 75A, VGE = 15V
VCC = 600V, IC = 75A
VGE = ±15V, RG = 4.3Ω
Inductive load
(IE = 75A)
(Note. 6)
IE = 75A, VGE = 0V
IE = 75A, VGE = 0V
Thermal resistance
per IGBT
(Note. 1)
(Junction to case)
per free wheeling diode
Internal gate resistance
TC = 25°C, per switch
External gate resistance
Tj = 25°C
Tj = 125°C
Chip
Min.
—
6
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
4.1
Limits
Typ.
—
7
—
2.0
2.2
1.9
—
—
—
380
—
—
—
—
—
3
2.6
2.16
2.5
—
—
0
—
Max.
1
8
0.5
2.6
—
—
11.5
1.0
0.23
—
100
50
300
600
150
—
3.4
—
—
0.25
0.40
—
41
Min.
—
6
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
6.0
Limits
Typ.
—
7
—
2.0
2.2
1.9
—
—
—
250
—
2.6
2.16
2.5
—
—
0
—
Max.
1
8
0.5
2.6
—
—
8.5
0.75
0.17
—
1
3.4
—
—
0.35
0.63
—
62
Unit
mA
V
μA
V
nF
nC
ns
μC
V
K/W
Ω
BRAKE PART
Symbol
Parameter
Conditions
ICES
VGE(th)
IGES
VCE = VCES, VGE = 0V
Collector cutoff current
Gate-emitter threshold voltage IC = 5mA, VCE = 10V
Gate leakage current
±VGE = VGES, VCE = 0V
VCE(sat)
Collector-emitter saturation
voltage
Cies
Coes
Cres
QG
IRRM(Note.3)
Input capacitance
Output capacitance
Reverse transfer capacitance
Total gate charge
Repetitive peak reverse current
VFM(Note.3) Forward voltage drop
Rth(j-c)Q
Rth(j-c)R
RGint
RG
(Note. 6)
IC = 50A, VGE = 15V
IC = 50A, VGE = 15V
VCE = 10V
VGE = 0V
Tj = 25°C
Tj = 125°C
Chip
(Note. 6)
VCC = 600V, IC = 50A, VGE = 15V
VR = VRRM
(Note. 6)
IF = 50A
IF = 50A
per IGBT
Thermal resistance
(Note. 1)
per Clamp diode
(Junction to case)
TC = 25°C
Internal gate resistance
External gate resistance
Tj = 25°C
Tj = 125°C
Chip
Unit
mA
V
μA
V
nF
nC
mA
V
K/W
Ω
Jan. 2009
3
MITSUBISHI IGBT MODULES
CM75RX-24A
HIGH POWER SWITCHING USE
NTC THERMISTOR PART
Symbol
R
ΔR
B(25/50)
P25
Parameter
Conditions
Zero power resistance
Deviation of resistance
B constant
Power dissipation
TC = 25°C
TC = 100°C, R100 = 493Ω
Approximate by equation
TC = 25°C
(Note. 7)
Min.
4.85
–7.3
—
—
Limits
Typ.
5.00
—
3375
—
Max.
5.15
+7.8
—
10
Min.
Limits
Typ.
Max.
—
0.015
—
Unit
kΩ
%
K
mW
MODULE
Symbol
Rth(c-f)
Parameter
Conditions
Contact thermal resistance
Thermal grease applied
(Note. 1) per 1 module
(Case to fin)
(Note. 2)
Unit
K/W
Note.1: Case temperature (TC), heat sink temperature (Tf) measured point is just under the chips. (Refer to the figure of the chip location.)
2: Typical value is measured by using thermally conductive grease of λ = 0.9W/(m·K).
3: IE, IERM, VEC, trr and Qrr represent ratings and characteristics of the anti-parallel, emitter-collector free wheeling diode (FWDi).
IF, IFRM, VF, VRRM and IRRM represent ratings and characteristics of the Clamp diode of Brake part.
4: Pulse width and repetition rate should be such that the device junction temperature (Tj) dose not exceed Tjmax rating.
5: Junction temperature (Tj) should not increase beyond 150°C.
6: Pulse width and repetition rate should be such as to cause negligible temperature rise.
(Refer to the figure of the test circuit for VCE(sat) and VEC)
1
7: B(25/50) = In( R25 )/( 1
)
T50
R50 T25
R25: resistance at absolute temperature T25 [K]; T25 = 25 [°C]+273.15 = 298.15 [K]
R50: resistance at absolute temperature T50 [K]; T50 = 50 [°C]+273.15 = 323.15 [K]
Dimensions in mm (tolerance: ±1mm)
89.3
96.6
97.3
100.1
79.6
55.8
45.3
34.1
0
22.6
Chip Location (Top view)
LABEL SIDE
0
0
(50)
(62)
(77.1)
34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13
19.6
25.6
28.7
34.7
35
Tr
UP
Di
UP
Tr
UN
Di
UN
Di
Tr
WP T r B r
D i WN Th
WP D i
WN T r
Br
Tr
VP T r
D i VN
VP D i
VN
36
1
2
3
12
17.3
11
10
9
26.8
8
7
6
40.8
5
4
(110)
(121.7)
(136.9)
Each mark points the center position of each chip. Tr**: IGBT, Di**: FWDi (DiBr: Clamp diode), Th: NTC thermistor
Jan. 2009
4
MITSUBISHI IGBT MODULES
CM75RX-24A
HIGH POWER SWITCHING USE
P
V
VGE = 15V
P
U
B
VGE = 0V
IC
GuP
P
GuP
EuP
EuP
U
VGE = 0V
VGE = 15V
GuN
IC
GuN
EuN
VGE = 15V
V
N
EuN
V
IC
GB
N
EB
N
P side Inverter part Tr
(example of U arm)
VGE = 0V(GvP-EvP, GwP-EwP, GvN-EvN,
GwN-EwN, GB-EB)
N side Inverter part Tr
(example of U arm)
VGE = 0V(GvP-EvP, GwP-EwP, GvN-EvN,
GwN-EwN, GB-EB)
Br Tr
VGE = 0V(GuP-EuP, GvP-EvP, GwP-EwP,
GuN-EuN, GvN-EvN, GwN-EwN)
VCE(sat) test circuit
P
V
P
VGE = 0V
VGE = 0V
IE
GuP
P
V
GuP
EuP
IF
EuP
B
U
U
VGE = 0V
VGE = 0V
GuN
GuN
EuN
EuN
IE
VGE = 0V
V
GB
EB
N
N
N
N side Inverter part Di
(example of U arm)
VGE = 0V(GvP-EvP, GwP-EwP, GvN-EvN,
GwN-EwN, GB-EB)
P side Inverter part Di
(example of U arm)
VGE = 0V(GvP-EvP, GwP-EwP, GvN-EvN,
GwN-EwN, GB-EB)
Br Di
VGE = 0V(GuP-EuP, GvP-EvP, GwP-EwP,
GuN-EuN, GvN-EvN, GwN-EwN)
VEC/VFM test circuit
Arm
VGE
IE
IE
90%
0V
0%
trr
Load
–VGE
+
VCC
IC
0A
90%
+VGE
0V
RG
VGE
–VGE
t
VCE
Irr
IC
10%
0A
td(on)
tr
td(off)
Switching time test circuit and waveforms
1/2 ✕ Irr
Qrr = 1/2 ✕ Irr ✕ trr
tf
trr, Qrr test waveform
Jan. 2009
5
MITSUBISHI IGBT MODULES
CM75RX-24A
HIGH POWER SWITCHING USE
PERFORMANCE CURVES
COLLECTOR-EMITTER SATURATION
VOLTAGE CHARACTERISTICS
(TYPICAL) Inverter part
Tj = 25°C
15
13
125
100
12
75
11
50
10
25
9
0
COLLECTOR-EMITTER
SATURATION VOLTAGE VCE(sat) (V)
VGE =
20V
0
1
2
3
4
5
6
7
8
9 10
VGE = 15V
3.5
3
2.5
2
1.5
1
Tj = 25°C
Tj = 125°C
0.5
0
0
25
50
75
100
125
150
COLLECTOR CURRENT IC (A)
COLLECTOR-EMITTER SATURATION
VOLTAGE CHARACTERISTICS
(TYPICAL) Inverter part
FREE WHEELING DIODE
FORWARD CHARACTERISTICS
(TYPICAL) Inverter part
10
103
Tj = 25°C
8
6
4
IC = 150A
IC = 75A
2
IC = 30A
0
6
8
10
12
14
16
18
7
5
3
2
102
7
5
3
2
101
7
5
3
2
100
20
1
1.5
2
2.5
3
3.5
4
HALF-BRIDGE
SWITCHING CHARACTERISTICS
(TYPICAL) Inverter part
101
7
5
3
2
SWITCHING TIME (ns)
Cies
Coes
100
10–1
0.5
CAPACITANCE CHARACTERISTICS
(TYPICAL) Inverter part
103
7
5
3
2
0
EMITTER-COLLECTOR VOLTAGE VEC (V)
102
7
5
3
2
Tj = 25°C
Tj = 125°C
GATE-EMITTER VOLTAGE VGE (V)
7
5
3
2
CAPACITANCE (nF)
4
COLLECTOR-EMITTER VOLTAGE VCE (V)
EMITTER CURRENT IE (A)
COLLECTOR CURRENT IC (A)
150
COLLECTOR-EMITTER
SATURATION VOLTAGE VCE(sat) (V)
OUTPUT CHARACTERISTICS
(TYPICAL) Inverter part
Cres
7
5
3
2
VGE = 0V
10–2 –1
10 2 3 5 7 100 2 3 5 7 101 2 3 5 7 102
tf
td(off)
102
7
5
3
2
td(on)
Conditions:
101 VCC = 600V
7
5 VGE = ±15V
3 RG = 4.3Ω
2 Tj = 125°C
Inductive load
100 0
10
2 3
5 7 101
tr
2
3
5 7 102
COLLECTOR CURRENT IC (A)
COLLECTOR-EMITTER VOLTAGE VCE (V)
Jan. 2009
6
MITSUBISHI IGBT MODULES
CM75RX-24A
HIGH POWER SWITCHING USE
HALF-BRIDGE
SWITCHING CHARACTERISTICS
(TYPICAL) Inverter part
HALF-BRIDGE
SWITCHING CHARACTERISTICS
(TYPICAL) Inverter part
101
7
5
3
2
7
SWITCHING LOSS (mJ/pulse)
SWITCHING TIME (ns)
103
tf
td(off)
102
7
5
3
2
td(on)
tr
Conditions:
VCC = 600V
VGE = ±15V
IC = 75A
Tj = 125°C
Inductive load
101
7
5
3
2
100 0
10
2
3
5 7 101
2
100
Conditions:
VCC = 600V
VGE = ±15V
RG = 4.3Ω
Tj = 125°C
Inductive load
5
3
2
2
3
5 7 101
5 7 102
7
5
3
2
lrr (A), trr (ns)
Eon
Eoff
7
5
trr
102
7
5
3
2
Irr
Conditions:
VCC = 600V
VGE = ±15V
RG = 4.3Ω
Tj = 25°C
Inductive load
101
7
5
3
2
Err
3
2
2
3
5 7 101
2
100 0
10
5 7 102
3
GATE RESISTANCE RG (Ω)
3
5 7 101
2
3
5 7 102
TRANSIENT THERMAL
IMPEDANCE CHARACTERISTICS
100
NORMALIZED TRANSIENT
THERMAL IMPEDANCE Zth(j–c)
IC = 75A
VCC = 400V
15
VCC = 600V
10
5
100
2
EMITTER CURRENT IE (A)
GATE CHARGE CHARACTERISTICS
(TYPICAL) Inverter part
0
3
REVERSE RECOVERY CHARACTERISTICS
OF FREE WHEELING DIODE
(TYPICAL) Inverter part
103
101
20
2
HALF-BRIDGE
SWITCHING CHARACTERISTICS
(TYPICAL) Inverter part
Conditions:
VCC = 600V
5 VGE = ±15V
3 IC, IE = 75A
Tj = 125°C
2
Inductive load
100 0
10
GATE-EMITTER VOLTAGE VGE (V)
Eon
7
COLLECTOR CURRENT IC (A)
EMITTER CURRENT IE (A)
7
0
Eoff
Err
2
GATE RESISTANCE RG (Ω)
102
SWITCHING LOSS (mJ/pulse)
3
10–1 0
10
5 7 102
3
5
200
300
400
7 Single pulse,
5 TC = 25°C
3
2
10–1
7
5
3
2
10–2
7
5 Inverter IGBT part : Per unit base = Rth(j–c) = 0.25K/W
3 Inverter FWDi part : Per unit base = Rth(j–c) = 0.40K/W
: Per unit base = Rth(j–c) = 0.35K/W
2 Brake IGBT part
Brake Clamp-Di part : Per unit base = Rth(j–c) = 0.63K/W
10–3
10–52 3 5710–42 3 5710–32 3 5710–22 3 5710–12 3 57 100 2 3 57 101
500
GATE CHARGE QG (nC)
TIME (s)
Jan. 2009
7
MITSUBISHI IGBT MODULES
CM75RX-24A
HIGH POWER SWITCHING USE
CLAMP DIODE
FORWARD CHARACTERISTICS
(TYPICAL) Brake part
102
4
VGE = 15V
3.5
FORWARD CURRENT IF (A)
COLLECTOR-EMITTER
SATURATION VOLTAGE VCE(sat) (V)
COLLECTOR-EMITTER SATURATION
VOLTAGE CHARACTERISTICS
(TYPICAL) Brake part
3
2.5
2
1.5
1
0.5
0
Tj = 25°C
Tj = 125°C
7
5
3
2
101
7
5
3
2
100
0 10 20 30 40 50 60 70 80 90 100
Tj = 25°C
Tj = 125°C
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
FORWARD VOLTAGE VF (V)
COLLECTOR CURRENT IC (A)
Jan. 2009
8