SN74LVC244A OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCAS414X – NOVEMBER 1992 – REVISED MARCH 2005 • • • 1 20 2 19 3 18 4 5 17 16 6 15 7 14 8 13 9 12 11 10 VCC 2OE 1Y1 2A4 1Y2 2A3 1Y3 2A2 1Y4 2A1 RGY PACKAGE (TOP VIEW) 1A1 2Y4 1A2 2Y3 1A3 2Y2 1A4 2Y1 DESCRIPTION/ORDERING INFORMATION This octal buffer/line driver is operational at 1.5-V to 3.6-V VCC, but is designed specifically for 1.65-V to 3.6-V VCC operation. VCC • 1OE 1A1 2Y4 1A2 2Y3 1A3 2Y2 1A4 2Y1 GND 1 20 3 4 19 2OE 18 1Y1 17 2A4 5 6 16 1Y2 15 2A3 7 8 14 1Y3 13 2A2 9 12 1Y4 2 10 11 2A1 • DB, DGV, DW, N, NS, OR PW PACKAGE (TOP VIEW) 1OE • • Operates From 1.65 V to 3.6 V Inputs Accept Voltages to 5.5 V Specified From –40°C to 85°C and –40°C to 125°C Max tpd of 5.9 ns at 3.3 V Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 3.3 V, TA = 25°C Typical VOHV (Output VOH Undershoot) > 2 V at VCC = 3.3 V, TA = 25°C Supports Mixed-Mode Signal Operation on All Ports (5-V Input/Output Voltage With 3.3-V VCC) Ioff Supports Partial-Power-Down Mode Operation Latch-Up Performance Exceeds 250 mA Per JESD 17 ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101) GND FEATURES • • • ORDERING INFORMATION PACKAGE (1) TA QFN – RGY –40°C to 85°C VFBGA – GQN VFBGA – ZQN (Pb-Free) PDIP – N SN74LVC244AGQNR SN74LVC244AZQNR TOP-SIDE MARKING LC244A LC244A SN74LVC244AN Tube of 25 SN74LVC244ADW Reel of 2000 SN74LVC244ADWR SOP – NS Reel of 2000 SN74LVC244ANSR LVC244A SSOP – DB Reel of 2000 SN74LVC244ADBR LC244A Tube of 70 SN74LVC244APW Reel of 2000 SN74LVC244APWR Reel of 250 SN74LVC244APWT Reel of 2000 SN74LVC244ADGVR TSSOP – PW TVSOP – DGV (1) Reel of 1000 ORDERABLE PART NUMBER SN74LVC244ARGYR Tube of 20 SOIC – DW –40°C to 125°C Reel of 1000 SN74LVC244AN LVC244A LC244A LC244A Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1992–2005, Texas Instruments Incorporated SN74LVC244A OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCAS414X – NOVEMBER 1992 – REVISED MARCH 2005 DESCRIPTION/ORDERING INFORMATION (CONTINUED) The SN74LVC244A is organized as two 4-bit line drivers with separate output-enable (OE) inputs. When OE is low, the device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in the high-impedance state. Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of this device as a translator in a mixed 3.3-V/5-V system environment. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. GQN OR ZQN PACKAGE (TOP VIEW) 1 2 3 4 A B C D E TERMINAL ASSIGNMENTS 1 2 3 4 A 1A1 1OE VCC 2OE B 1A2 2A4 2Y4 1Y1 C 1A3 2Y3 2A3 1Y2 D 1A4 2A2 2Y2 1Y3 E GND 2Y1 2A1 1Y4 FUNCTION TABLE (EACH BUFFER) INPUTS 2 OE A OUTPUT Y L H H L L L H X Z SN74LVC244A OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCAS414X – NOVEMBER 1992 – REVISED MARCH 2005 LOGIC DIAGRAM (POSITIVE LOGIC) 1OE 1A1 1A2 1A3 1A4 1 2OE 2 18 4 16 6 14 8 12 1Y1 2A1 1Y2 2A2 1Y3 2A3 1Y4 2A4 19 11 9 13 7 15 5 17 3 2Y1 2Y2 2Y3 2Y4 Pin numbers shown are for the DB, DGV, DW, N, NS, PW, and RGY packages. Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range –0.5 6.5 V VI Input voltage range (2) –0.5 6.5 V –0.5 6.5 V –0.5 VCC + 0.5 state (2) UNIT VO Voltage range applied to any output in the high-impedance or power-off VO Voltage range applied to any output in the high or low state (2) (3) IIK Input clamp current VI < 0 –50 mA IOK Output clamp current VO < 0 –50 mA IO Continuous output current ±50 mA ±100 mA Continuous current through VCC or GND θJA Package thermal impedance DB package (4) 70 DGV package (4) 92 DW package (4) 58 GQN/ZQN package (4) 78 package (4) 69 NS package (4) 60 PW package (4) 83 N RGY Tstg Storage temperature range Ptot Power dissipation (1) (2) (3) (4) (5) (6) (7) package (5) °C/W 37 –65 TA = –40°C to 125°C (6) (7) V 150 °C 500 mW Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed. The value of VCC is provided in the recommended operating conditions table. The package thermal impedance is calculated in accordance with JESD 51-7. The package thermal impedance is calculated in accordance with JESD 51-5. For the DW package: above 70°C the value of Ptot derates linearly with 8 mW/K. For the DB, DGV, N, NS, and PW packages: above 60°C the value of Ptot derates linearly with 5.5 mW/K. 3 SN74LVC244A OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCAS414X – NOVEMBER 1992 – REVISED MARCH 2005 Recommended Operating Conditions (1) TA = 25°C VCC Supply voltage VIH VIL High-level input voltage Low-level input voltage VI Input voltage VO Output voltage IOH High-level output current Operating Data retention only VCC = 1.65 V to 1.95 V (1) 4 Low-level output current –40 TO 125°C MIN MAX MIN MAX MIN MAX 1.65 3.6 1.65 3.6 1.65 3.6 1.5 1.5 1.5 0.65 × VCC 0.65 × VCC 0.65 × VCC VCC = 2.3 V to 2.7 V 1.7 1.7 1.7 VCC = 2.7 V to 3.6 V 2 2 2 VCC = 1.65 V to 1.95 V UNIT V V 0.35 × VCC 0.35 × VCC 0.35 × VCC VCC = 2.3 V to 2.7 V 0.7 0.7 0.7 VCC = 2.7 V to 3.6 V 0.8 0.8 0.8 V 0 5.5 0 5.5 0 5.5 V 0 VCC 0 VCC 0 VCC V VCC = 1.65 V –4 –4 –4 VCC = 2.3 V –8 –8 –8 VCC = 2.7 V –12 –12 –12 VCC = 3 V –24 –24 –24 4 4 4 VCC = 1.65 V IOL –40 TO 85°C VCC = 2.3 V 8 8 8 VCC = 2.7 V 12 12 12 VCC = 3 V 24 24 24 All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. mA mA SN74LVC244A OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCAS414X – NOVEMBER 1992 – REVISED MARCH 2005 Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS IOH = –100 µA VOH MIN –40 TO 125°C MAX MIN VCC – 0.2 VCC – 0.2 VCC – 0.3 1.65 V 1.29 1.2 1.05 IOH = –8 mA 2.3 V 1.9 1.7 1.55 2.7 V 2.2 2.2 2.05 2.25 V 3V 2.4 2.4 IOH = –24 mA 3V 2.3 2.2 IOL = 100 µA 1.65 V to 3.6 V 0.1 0.2 IOL = 4 mA 1.65 V 0.24 0.45 0.6 IOL = 8 mA 2.3 V 0.3 0.7 0.75 IOL = 12 mA 2.7 V 0.4 0.4 0.6 3V VI = 5.5 V or GND UNIT MAX 2 0.3 V 0.55 0.55 0.8 3.6 V ±1 ±5 ±20 µA Ioff VI or VO = 5.5 V 0 ±1 ±10 ±20 µA IOZ VO = 0 to 5.5 V 3.6 V ±1 ±10 ±20 µA 1 10 40 1 10 40 500 500 5000 ICC ∆ICC (1) –40 TO 85°C TYP MAX IOH = –4 mA IOL = 24 mA II MIN 1.65 V to 3.6 V IOH = –12 mA VOL TA = 25°C VCC VI = VCC or GND 3.6 V ≤ VI ≤ 5.5 V (1) IO = 0 One input at VCC – 0.6 V, Other inputs at VCC or GND 3.6 V 2.7 V to 3.6 V µA µA Ci VI = VCC or GND 3.3 V 4 pF Co VO = VCC or GND 3.3 V 5.5 pF This applies in the disabled state only. Switching Characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) PARAMETER tpd FROM (INPUT) A TO (OUTPUT) Y VCC OE Y OE Y TYP MAX MIN MAX MIN MAX 1 7 14.4 1 14.9 1 16.4 1 5.9 10.4 1 10.9 1 12.4 2.5 V ± 0.2 V 1 4.2 7.4 1 7.9 1 10 2.7 V 1 4.2 6.7 1 6.9 1 8.2 1.5 3.9 5.7 1.5 5.9 1.5 7.2 1.5 V 1 8.3 17.8 1 18.3 1 19.8 1.8 V ± 0.15 V 1 6.4 12.1 1 12.6 1 14.1 2.5 V ± 0.2 V 1 4.6 9.1 1 9.6 1 11.7 2.7 V 1 5 8.4 1 8.6 1 10.3 1.5 4.5 7.4 1.5 7.6 1.5 9.4 1.5 V 1 7.2 15.6 1 16.1 1 17.6 1.8 V ± 0.15 V 1 5.8 11.6 1 12.1 1 13.6 2.5 V ± 0.2 V 1 3.7 7.3 1 7.8 1 9.9 2.7 V 1 3.8 6.6 1 6.8 1 8.6 1.5 3.8 6.3 1.5 6.5 1.5 8 3.3 V ± 0.3 V tsk(o) –40 TO 125°C 1.5 V 3.3 V ± 0.3 V tdis MIN –40 TO 85°C 1.8 V ± 0.15 V 3.3 V ± 0.3 V ten TA = 25°C 3.3 V ± 0.3 V 1 1.5 UNIT ns ns ns ns 5 SN74LVC244A OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCAS414X – NOVEMBER 1992 – REVISED MARCH 2005 Operating Characteristics TA = 25°C PARAMETER TEST CONDITIONS Outputs enabled Cpd Power dissipation capacitance per buffer/driver Outputs disabled 6 f = 10 MHz f = 10 MHz VCC TYP 1.8 V 43 2.5 V 43 3.3 V 44 1.8 V 1 2.5 V 1 3.3 V 2 UNIT pF SN74LVC244A OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCAS414X – NOVEMBER 1992 – REVISED MARCH 2005 PARAMETER MEASUREMENT INFORMATION VLOAD S1 RL From Output Under Test CL (see Note A) Open GND RL TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open VLOAD GND LOAD CIRCUIT INPUTS VCC 1.5 V 1.8 V ± 0.15 V 2.5 V ± 0.2 V 2.7 V 3.3 V ± 0.3 V VI tr/tf VCC VCC VCC 2.7 V 2.7 V ≤2 ns ≤2 ns ≤2 ns ≤2.5 ns ≤2.5 ns VM VLOAD CL RL V∆ VCC/2 VCC/2 VCC/2 1.5 V 1.5 V 2 × VCC 2 × VCC 2 × VCC 6V 6V 15 pF 30 pF 30 pF 50 pF 50 pF 2 kΩ 1 kΩ 500 Ω 500 Ω 500 Ω 0.1 V 0.15 V 0.15 V 0.3 V 0.3 V VI Timing Input VM 0V tw tsu VI Input VM VM th VI Data Input VM VM 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VI VM Input VM 0V tPLH VM VM VOL tPHL VM VM 0V Output Waveform 1 S1 at VLOAD (see Note B) tPLH tPLZ VLOAD/2 VM tPZH VOH Output VM tPZL tPHL VOH Output VI Output Control VM VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS Output Waveform 2 S1 at GND (see Note B) VOL + V∆ VOL tPHZ VM VOH − V∆ VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms 7 PACKAGE OPTION ADDENDUM www.ti.com 6-Dec-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing SN74LVC244ADBLE OBSOLETE SSOP DB 20 SN74LVC244ADBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC244ADBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC244ADBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC244ADGVR ACTIVE TVSOP DGV 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC244ADGVRE4 ACTIVE TVSOP DGV 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC244ADW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC244ADWE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC244ADWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC244ADWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC244AGQNR ACTIVE GQN 20 1000 TBD SNPB Level-1-240C-UNLIM SN74LVC244AN ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LVC244ANE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LVC244ANSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC244ANSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC244APW ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC244APWE4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC244APWG4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC244APWLE OBSOLETE TSSOP PW 20 SN74LVC244APWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC244APWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC244APWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC244APWT ACTIVE TSSOP PW 20 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC244APWTE4 ACTIVE TSSOP PW 20 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC244ARGYR ACTIVE QFN RGY 20 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1YEAR BGA MI CROSTA R JUNI OR Pins Package Eco Plan (2) Qty TBD TBD Addendum-Page 1 Lead/Ball Finish Call TI Call TI MSL Peak Temp (3) Call TI Call TI PACKAGE OPTION ADDENDUM www.ti.com 6-Dec-2006 Orderable Device Status (1) Package Type Package Drawing SN74LVC244ARGYRG4 ACTIVE QFN RGY 20 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1YEAR SN74LVC244AZQNR ACTIVE ZQN 20 1000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM BGA MI CROSTA R JUNI OR Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0°–8° 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. Falls within JEDEC: 24/48 Pins – MO-153 14/16/20/56 Pins – MO-194 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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