REG1117 REG1117A SBVS001D − OCTOBER 1992 − REVISED JULY 2004 800mA and 1A Low Dropout Positive Regulator 1.8V, 2.5V, 2.85, 3.3V, 5V, and Adjustable FEATURES D FIXED AND ADJUSTABLE VERSIONS D 2.85V MODEL FOR SCSI-2 ACTIVE D D D D D D TERMINATION OUTPUT CURRENT: REG1117: 800mA max REG1117A: 1A max OUTPUT TOLERANCE: +1% max DROPOUT VOLTAGE: REG1117: 1.2V max at IO = 800mA REG1117A: 1.3V max at IO = 1A INTERNAL CURRENT LIMIT THERMAL OVERLOAD PROTECTION SOT-223 AND DDPAK SURFACE-MOUNT PACKAGES DESCRIPTION The REG1117 is a family of easy-to-use three-terminal voltage regulators. The family includes a variety of fixedand adjustable-voltage versions, two currents (800mA and 1A) and two package types (SOT-223 and DDPAK). See the chart below for available options. Output voltage of the adjustable versions is set with two external resistors. The REG1117 low dropout voltage allows its use with as little as 1V input-output voltage differential. Laser trimming assures excellent output voltage accuracy without adjustment. An NPN output stage allows output stage drive to contribute to the load current for maximum efficiency. 800mA VOLTAGE APPLICATIONS D D D D D D SOT-223 1A DDPAK 1.8V 2.5V SCSI-2 ACTIVE TERMINATION HAND-HELD DATA COLLECTION DEVICES HIGH EFFICIENCY LINEAR REGULATORS BATTERY-POWERED INSTRUMENTATION BATTERY MANAGEMENT CIRCUITS FOR NOTEBOOK AND PALMTOP PCs CORE VOLTAGE SUPPLY: FPGA, PLD, DSP, CPU 2.85V n 3.3V n 5V n Adjustable n SOT-223 DDPAK n n n n n n n n Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. Copyright 1992−2004, Texas Instruments Incorporated ! ! www.ti.com "#$$$% "#$$$% www.ti.com SBVS001D − OCTOBER 1992 − REVISED JULY 2004 ABSOLUTE MAXIMUM RATINGS(1) Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . Internally Limited Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +15V Operating Junction Temperature Range . . . . . . . . −40°C to +125°C Storage Temperature Range . . . . . . . . . . . . . . . . . −65°C to +150°C Lead Temperature (soldering, 10s)(2) . . . . . . . . . . . . . . . . . +300°C (1) Stresses above these ratings may cause permanent damage. (2) See Soldering Methods section. This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. CONNECTION DIAGRAM Front View Plastic SOT−223 Plastic DDPAK Tab is VOUT Tab is VOUT Ground VOUT (Adj.)(1) VIN Ground VOUT (Adj.)(1) NOTE: (1) Adjustable−Voltage Model. 2 VIN "#$$$% "#$$$% www.ti.com SBVS001D − OCTOBER 1992 − REVISED JULY 2004 PACKAGE/ORDERING INFORMATION(1) PRODUCT VO/IO PACKAGE-LEAD PACKAGE DESIGNATOR OPERATING TEMPERATURE RANGE PACKAGE MARKING REG1117-2.85 2.85/800mA SOT223-3 DCY −40°C to +125°C BB11172 REG1117-3.3 3.3/800mA SOT223-3 DCY −40°C to +125°C BB11174 KTT −40 C to −40°C +125°C REG1117F-3.3 3.3/800mA DDPAK-3 REG1117-5 5V/800mA SOT223-3 DCY REG1117 Adj./800mA SOT223-3 DCY −40°C to +125°C BB1117 REG1117A-1.8 1.8V/1A SOT223-3 DCY −40°C to +125°C R111718 KTT −40 C to −40°C +125°C REG1117FA1.8 −40°C to +125°C R111725 REG1117A-2.5 REG1117FA-2.5 REG1117FA-5 REG1117A REG1117FA 1.8/1A 2.5/1A 2.5/1A 5/1A Adj./1A Adj./1A DDPAK-3 SOT223-3 DDPAK-3 DDPAK-3 SOT223-3 DDPAK-3 DCY KTT KTT −40 C to −40°C +125°C −40 C to −40°C +125°C DCY −40°C to +125°C KTT −40 C to −40°C +125°C BB11175 Rails, 80 REG1117-2.85 Tape and Reel, 2500 REG1117-3.3 Rails, 80 REG1117-3.3 Tape and Reel, 2500 REG1117F-3.3KTTT Tape and Reel, 50 REG1117F-3.3/500 Tape and Reel, 500 REG1117-5 Rails, 80 REG1117-5 Tape and Reel, 2500 REG1117 Rails, 80 REG1117 Tape and Reel, 2500 REG1117A-1.8 Rails, 80 REG1117A-1.8 Tape and Reel, 2500 REG1117FA-1.8KTTT Tape and Reel, 50 REG1117FA-1.8/500 Tape and Reel, 500 REG1117A-2.5 Rails, 80 REG1117A-2.5 Tape and Reel, 2500 REG1117FA-2.5KTTT Tape and Reel, 50 REG1117FA-2.5/500 Tape and Reel, 500 REG1117FA-5/KTTT Tape and Reel, 50 REG1117FA-5/500 Tape and Reel, 500 REG1117A Rails, 80 REG1117A Tape and Reel, 2500 REG1117FA/KTTT Tape and Reel, 50 REG1117FA/500 Tape and Reel, 500 REG1117FA2.5 BB1117FA5.0 BB1117A TRANSPORT MEDIA, QUANTITY REG1117-2.85 BB1117F4 −40°C to +125°C REG1117FA-1.8 ORDERING NUMBER REG1117FA (1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet. 3 "#$$$% "#$$$% www.ti.com SBVS001D − OCTOBER 1992 − REVISED JULY 2004 ELECTRICAL CHARACTERISTICS At TJ = +25°C, unless otherwise noted. REG1117, REG1117A PARAMETER CONDITION MIN TYP MAX UNIT REG1117-2.85 IO = 10mA, VIN = 4.85V 2.820 2.85 2.880 V See Note 1 IO = 0 to 800mA, VIN = 4.05V to 10V 2.790 2.85 2.910 V REG1117-3.3 IO = 10mA, VIN = 5.3V 3.270 3.30 3.330 V See Note 1 IO = 0 to 800mA, VIN = 4.8V to 10V 3.240 3.30 3.360 V IO = 10mA, VIN = 7V 4.950 5.00 5.050 V See Note 1 IO = 0 to 800mA, VIN = 6.5V to 10V 4.900 5.00 5.100 V REG1117A-1.8 IO = 10mA, VIN = 3.8V 1.782 1.8 1.818 V OUTPUT VOLTAGE REG1117-5 See Note 1 IO = 0 to 1A, VIN = 3.8V to 10V 1.764 1.8 1.836 V REG1117A-2.5 IO = 10mA, VIN = 4.5V 2.475 2.5 2.525 V See Note 1 IO = 0 to 1A, VIN = 4.5V to 10V 2.450 2.5 2.550 V IO = 10mA, VIN = 7V 4.950 5.0 5.050 V IO = 0 to 1A, VIN = 7V to 10V 4.900 5.0 5.100 V IO = 10mA, VIN − VO = 2V 1.238 1.250 1.262 V IO = 10 to 800mA, VIN − VO = 1.4 to 10V 1.225 1.250 1.280 V IO = 10mA, VIN − VO = 2V 1.238 1.250 1.262 V IO = 10mA to 1A, VIN − VO = 1.4 to 10V 1.225 1.250 1.280 V IO = 0, VIN = 4.25 to 10V 1 7 mV IO = 0, VIN = 4.8 to 10V 2 7 mV IO = 0, VIN = 6.5 to 15V 3 10 mV IO = 10mA, VIN − VO = 1.5 to 13.75V 0.1 0.4 % REG1117A-5 See Note 1 REFERENCE VOLTAGE REG1117 (Adjustable) See Note 1 REG1117A (Adjustable) See Note 1 LINE REGULATION REG1117-2.85(1) REG1117-3.3(1) REG1117-5(1) REG1117 (Adjustable)(1) REG1117A (Adjustable)(1) IO = 10mA, VIN − VO = 1.5 to 13.75V 0.1 0.4 % REG1117A-1.8(1) REG1117A-2.5(1) IO = 0, VIN = 3.8V to 10V 1 7 mV IO = 0, VIN = 4.5V to 10V 1 7 mV REG1117A-5.0(1) IO = 0, VIN = 7V to 15V 3 10 mV IO = 0 to 800mA, VIN = 4.25V 2 10 mV IO = 0 to 800mA, VIN = 4.8V 3 12 mV LOAD REGULATION REG1117-2.85(1) REG1117-3.3(1) REG1117-5(1) IO = 0 to 800mA, VIN = 6.5V 3 15 mV IO = 10 to 800mA, VIN − VO = 3V 0.1 0.4 % IO = 10mA to 1A, VIN − VO = 3V 0.1 0.4 % REG1117A-1.8(1) IO = 0 to 1A, VIN = 3.8V 2 10 mV REG1117A-2.5 IO = 0 to 1A, VIN = 4.5V 2 10 mV REG1117A-5 IO = 0 to 1A, VIN = 7.0V 3 15 mV IO = 100mA 1.00 1.10 V IO = 500mA 1.05 1.15 V IO = 800mA 1.10 1.20 V IO = 1A 1.2 1.30 V IO = 1A 1.2 1.55 V REG1117 (Adjustable)(1)(2) REG1117A (Adjustable)(1)(2) DROPOUT VOLTAGE(3) All Models(1) See Note 1 REG1117 Models(1) REG1117A See Note 1 (1) Specification applies over the full specified junction temperature range, 0°C to +125°C. (2) REG1117 and REG1117A adjustable versions require a minimum load current for ±3% regulation. (3) Dropout voltage is the input voltage minus output voltage that produces a 1% decrease in output voltage. (4) Percentage change in unloaded output voltage before versus after a 30ms power pulse of IO = 800mA (REG1117 models), IO = 1A (REG1117A), VIN − VO = 1.4V (reading taken 10ms after pulse). 4 "#$$$% "#$$$% www.ti.com SBVS001D − OCTOBER 1992 − REVISED JULY 2004 ELECTRICAL CHARACTERISTICS (continued) At TJ = +25°C, unless otherwise noted. REG1117, REG1117A PARAMETER CONDITION MIN TYP MAX UNIT REG1117 Models VIN − VO = 5V 800 950 1200 mA REG1117A VIN − VO = 5V 1000 1250 1600 mA 1.7 5 mA CURRENT LIMIT MINIMUM LOAD CURRENT Adjustable Models(1)(2) QUIESCENT CURRENT Fixed-Voltage Models(1) VIN − VO = 13.75V VIN − VO = 5V 4 10 mA IO = 10mA, VIN − VO = 1.4 to 10V 50 120 µA IO = 10mA to 800mA, VIN − VO = 1.4 to 10V 0.5 5 µA IO = 10mA to 1A, VIN − VO = 1.4 to 10V 0.5 5 µA 30ms Pulse 0.01 0.1 %/W f = 120Hz, VIN − VOUT = 3V + 1VPP Ripple 62 dB Fixed-Voltage Models TJ = 0°C to +125°C 0.5 % Adjustable Models TJ = 0°C to +125°C 2 % TA = 125°C, 1000Hr 0.3 % f = 10Hz to 10kHz 0.003 % 15 °C/W f > 50Hz 2 °C/W dc 3 °C/W 65 °C/W ADJUSTABLE PIN CURRENT(1)(2) vs Load Current, REG1117(1) vs Load Current, REG1117A(1) THERMAL REGULATION All Models(4) RIPPLE REJECTION All Models TEMPERATURE DRIFT LONG-TERM STABILITY All Models OUTPUT NOISE rms Noise, All Models THERMAL RESISTANCE Thermal Resistance, qJC (Junction-to-Case at Tab) 3-Lead SOT-223 Surface-Mount 3-Lead DDPAK Surface-Mount Thermal Resistance, qJA 3-Lead DDPAK Surface-Mount (Junction-to-Case at Tab) No Heatsink (1) Specification applies over the full specified junction temperature range, 0°C to +125°C. (2) REG1117 and REG1117A adjustable versions require a minimum load current for ±3% regulation. (3) Dropout voltage is the input voltage minus output voltage that produces a 1% decrease in output voltage. (4) Percentage change in unloaded output voltage before versus after a 30ms power pulse of IO = 800mA (REG1117 models), IO = 1A (REG1117A), VIN − VO = 1.4V (reading taken 10ms after pulse). 5 "#$$$% "#$$$% www.ti.com SBVS001D − OCTOBER 1992 − REVISED JULY 2004 SIMPLIFIED SCHEMATIC VIN + Current Limit Thermal Limit VOUT 10X (Substrate) Ground (Fixed−voltage Models) Adj. (Adjustable−voltage Model) 6 "#$$$% "#$$$% www.ti.com SBVS001D − OCTOBER 1992 − REVISED JULY 2004 TYPICAL CHARACTERISTICS At TA = +25°C, all models, unless otherwise noted. LOAD REGULATION ( ∆I LOAD = 800mA) SHORT−CIRCUIT CURRENT vs TEMPERATURE 1 1300 REG1117A 1200 1100 REG1117 Models 1000 900 800 −50 −25 0 0 Output Voltage Deviation (mV) Short−Circuit Current (mA) 1400 25 50 75 REG1117−2.85 1 REG1117A−1.8 −2 −3 −4 −5 REG1117−5 −6 −7 −50 100 −25 0 LINE REGULATION vs TEMPERATURE VIN = 6.5V to 15V REG1117−5 4 100 IOUT = 100mA VRIPPLE = 1.0VPP 80 Ripple Rejection (dB) Output Voltage Change (mV) 75 RIPPLE REJECTION vs FREQUENCY 90 5 3 2 1 REG1117A−1.8 VIN = 3.8V to 10V 0 70 60 50 40 30 20 −1 10 0 −25 0 25 50 75 100 10 100 1k Temperature (_C) 10k 100k Frequency (Hz) QUIESCENT CURRENT vs TEMPERATURE OUTPUT VOLTAGE vs TEMPERATURE 8 2.0 IO = 10mA 7 Fixed−Voltage Models Quiescent Current (mA) Output Voltage Change (%) 50 100 6 −2 −50 25 Temperature (_C) Temperature (_ C) 1.0 0 −1.0 6 5 4 3 2 1 −2.0 −50 −25 0 25 50 Temperature (_ C) 75 100 0 −50 −25 0 25 50 75 100 Temperature (_C) 7 "#$$$% "#$$$% www.ti.com SBVS001D − OCTOBER 1992 − REVISED JULY 2004 TYPICAL CHARACTERISTICS (continued) At TA = +25°C, all models, unless otherwise noted. LOAD TRANSIENT RESPONSE LINE TRANSIENT RESPONSE Output Voltage Deviation (mV) Output Voltage Deviations (V) 60 0.1 0 −0.1 CIN = 1µF COUT = 10µF Tantalum IOUT = 0.1A 40 20 0 0 −0.5 0 20 40 60 80 100 Input Voltage (V) Load Current (A) −20 CIN = 10µF COUT = 10µF Tantalum VIN = 4.25V Preload = 0.1A 0.5 −40 5.25 4.25 3.25 0 20 40 60 Time (µs) Time (µs) Figure 2 shows a hookup diagram for the adjustable voltage model. Resistor values are shown for some commonly-used output voltages. Values for other voltages can be calculated from the equation shown in Figure 2. For best load regulation, connect R1 close to the output pin and R2 close to the ground side of the load as shown. APPLICATIONS INFORMATION Figure 1 shows the basic hookup diagram for fixed-voltage models. All models require an output capacitor for proper operation, and for improving high-frequency load regulation; a 10µF tantalum capacitor is recommended. Aluminum electrolytic types of 50µF or greater can also be used. A high-quality capacitor should be used to assure that the ESR (Effective Series Resistance) is less than 0.5Ω. VIN THERMAL CONSIDERATIONS The REG1117 has current limit and thermal shutdown circuits that protect it from overload. The thermal shutdown activates at approximately TJ = 165°C. For continuous operation, however, the junction temperature should not be allowed to exceed 125°C. Any tendency to activate the thermal shutdown in normal use is an indication of an inadequate heat sink or excessive power dissipation. The power dissipation is equal to: VO REG1117 + 10µF Tantalum 80 100 120 140 160 180 200 + 10µF Tantalum PD = (VIN – VOUT) IOUT The junction temperature can be calculated by: TJ = TA + PD (qJA) where TA is the ambient temperature, and qJA is the junction-to-ambient thermal resistance. Figure 1. Fixed-Voltage Model—Basic Connections VIN C1 + 10µF 3 REG1117 (Adj) 1 C3(1) + 10µF VO 2 R1 + C2 10µF Load R2 VO = R1 + R2 R1 x (1.25V) + (50µA) (R2) This term is negligible with proper choice of values−see table at right. VOUT (V ) R1 (Ω)(2) R2 (Ω)(2) 1.25 1.5 2.1 2.85 3 3.3 5 10 Open 750 158 169 137 115 113 113 Short 147 107 215 191 187 340 787 NOTES: (1) C3 optional. Improves high−frequency line rejection. (2) Resistors are standard 1% values. Figure 2. Adjustable-Voltage Model—Basic Connections 8 "#$$$% "#$$$% www.ti.com SBVS001D − OCTOBER 1992 − REVISED JULY 2004 A simple experiment will determine whether the maximum recommended junction temperature is exceeded in an actual circuit board and mounting configuration: Increase the ambient temperature above that expected in normal operation until the device’s thermal shutdown is activated. If this occurs at more than 40°C above the maximum expected ambient temperature, then TJ will be less than 125°C during normal operation. The internal protection circuitry of the REG1117 was designed to protect against overload conditions. It was not intended to replace proper heat sinking. Continuously running the REG1117 into thermal shutdown will degrade reliability. LAYOUT CONSIDERATIONS The DDPAK (REG1117F-3.3 and REG1117FA) is a surface-mount power package that has excellent thermal characteristics. For best thermal performance, the mounting tab should be soldered directly to a circuit board copper area, as shown in Figure 3. Increasing the copper area improves heat dissipation. Figure 4 shows typical thermal resistance from junction-to-ambient as a function of the copper area. 3−Lead DDPAK(1) 0.2 0.085 0.45 0.51 All measurements in inches. 0.155 0.05 0.10 NOTE: (1) For improved thermal performance increase footprint area. See Figure 4 (Thermal Resistance vs Circuit Board Copper Area). Figure 3. DDPAK Footprint THERMAL RESISTANCE vs CIRCUIT BOARD COPPER AREA Circuit Board Copper Area Thermal Resistance, qJA (°C/W) 60 REG1117F DDPAK Surface Mount Package 1oz copper 50 40 30 20 REG1117F DDPAK Surface−Mount Package 10 0 1 2 3 4 5 Copper Area (inches2) Figure 4. DDPAK Thermal Resistance versus Circuit Board Copper Area 9 "#$$$% "#$$$% www.ti.com SBVS001D − OCTOBER 1992 − REVISED JULY 2004 The SOT-223 package derives heat sinking from conduction through its copper leads, especially the large mounting tab. These must be soldered to a circuit board with a substantial amount of copper remaining, as shown in Figure 5. Circuit board traces connecting the tab and the leads should be made as large as practical. The mounting tab of both packages is electrically connected to VOUT. Total Area: 50 x 50mm 35 x 17 mm 16 x 10 mm 16 x 10 mm Without backside copper: q With solid backside copper: q ≈ 59_ C/W JA ≈ 49_C/W Table 1. SOT-223 qJA for Various Board Configurations TOTAL PC BOARD AREA TOPSIDE(1) COPPER AREA BACKSIDE COPPER AREA SOT-223 THERMAL RESISTANCE JUNCTIONTO-AMBIENT 2500mm2 2500mm2 2500mm2 46°C/W 2500mm2 1250mm2 2500mm2 47°C/W 2500mm2 950mm2 2500mm2 49°C/W 2500mm2 2500mm2 0 51°C/W 2500mm2 1800mm2 0 53°C/W 1600mm2 600mm2 1600mm2 55°C/W 2500mm2 1250mm2 0 58°C/W 2500mm2 915mm2 0 59°C/W 1600mm2 600mm2 0 67°C/W 900mm2 340mm2 900mm2 72°C/W 900mm2 340mm2 0 85°C/W JA (1) Tab is attached to the topside copper. Figure 5. SOT-223 Circuit Board Layout Example SOLDERING METHODS Other nearby circuit traces, including those on the back side of the circuit board, help conduct heat away from the device, even though they may not be electrically connected. Make all nearby copper traces as wide as possible and leave only narrow gaps between traces. Both REG1117 packages are suitable for infrared reflow and vapor-phase reflow soldering techniques. The high rate of temperature change that occurs with wave soldering or hand soldering can damage the REG1117. Table 1 shows approximate values of qJA for various circuit board and copper areas for the SOT-223 package. Nearby heat dissipating components, circuit board mounting conditions, and ventilation can dramatically affect the actual qJA. Proper heat sinking significantly increases the maximum power dissipation at a given ambient temperature, as shown in Figure 6. INSPEC Abstract Number: B91007604, C91012627. Kelly, E.G. “Thermal Characteristics of Surface 5WK9Ω Packages.” The Proceedings of SMTCON. Surface Mount Technology Conference and Exposition: Competitive Surface Mount Technology, April 3−6, 1990, Atlantic City, NJ, USA. Abstract Publisher: IC Manage, 1990, Chicago, IL, USA. MAXIMUM POWER DISSIPATION vs AMBIENT TEMPERATURE Power Dissipation (Watts) 6 q JA = 27_ C/W (4in2 one oz copper mounting pad) 5 PD = (TJ (max) − TA) / q JA TJ (max) = 150_ C qJA = 46_ C/W (2500mm2 topside and backside copper) 4 DDPAK SOT−223 3 qJA = 65_ C/W (no heat sink) 2 qJA = 85_ C/W (340mm2 topside copper, no backside copper) 1 0 0 25 50 75 100 125 Ambient Temperature (_ C) Figure 6. Maximum Power Dissipation versus Ambient Temperature 10 "#$$$% "#$$$% www.ti.com SBVS001D − OCTOBER 1992 − REVISED JULY 2004 TERMPWR 5V TERMPWR 110Ω 2.85V 1N5817 110Ω 2.85V REG1117−2.85 10µF 5V 1N5817 REG1117−2.85 10µF 10µF (Up to 27 Lines) 110Ω 10µF 110Ω Figure 7. SCSI Active Termination Configuration REG1117−5 In VIN > 12V 10µF REG1117−5 Out + 5V to 10V + GND In VIN > 9.0V 100µF 10µF + Out 7.5V + GND 100µF 2.5VOUT 10µF + 1kΩ REF1004−2.5 Figure 8. Adjusting Output of Fixed Voltage Models Figure 9. Regulator with Reference REG1117−5 VIN In 10µF 5.2V Line 5.0V Battery Out GND + 50Ω 1kΩ REG1117−5 In 6.5V 10µF Out GND + + 100µF Figure 10. Battery Backed-Up Regulated Supply REG1117−5 In VIN 10µF + Out GND + 100µF Floating Input VOUT = −5V Figure 11. Low Dropout Negative Supply 11 MECHANICAL DATA MPDS094A – APRIL 2001 – REVISED JUNE 2002 DCY (R-PDSO-G4) PLASTIC SMALL-OUTLINE 6,70 (0.264) 6,30 (0.248) 3,10 (0.122) 2,90 (0.114) 4 0,10 (0.004) M 3,70 (0.146) 3,30 (0.130) 7,30 (0.287) 6,70 (0.264) Gauge Plane 1 2 0,84 (0.033) 0,66 (0.026) 2,30 (0.091) 4,60 (0.181) 1,80 (0.071) MAX 3 0°–10° 0,10 (0.004) M 0,25 (0.010) 0,75 (0.030) MIN 1,70 (0.067) 1,50 (0.059) 0,35 (0.014) 0,23 (0.009) Seating Plane 0,08 (0.003) 0,10 (0.0040) 0,02 (0.0008) 4202506/B 06/2002 NOTES: A. B. C. D. All linear dimensions are in millimeters (inches). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion. Falls within JEDEC TO-261 Variation AA. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 5-Oct-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty REG1117 ACTIVE SOT-223 DCY 4 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM REG1117-2.85 ACTIVE SOT-223 DCY 4 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM REG1117-2.85/2K5 ACTIVE SOT-223 DCY 4 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM REG1117-2.85/2K5G4 ACTIVE SOT-223 DCY 4 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM REG1117-2.85G4 ACTIVE SOT-223 DCY 4 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM REG1117-3.3 ACTIVE SOT-223 DCY 4 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM REG1117-3.3/2K5 ACTIVE SOT-223 DCY 4 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM REG1117-3.3/2K5G4 ACTIVE SOT-223 DCY 4 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM REG1117-3.3G4 ACTIVE SOT-223 DCY 4 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM REG1117-5 ACTIVE SOT-223 DCY 4 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM REG1117-5/2K5 ACTIVE SOT-223 DCY 4 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM REG1117-5/2K5G4 ACTIVE SOT-223 DCY 4 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM REG1117-5G4 ACTIVE SOT-223 DCY 4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM REG1117/2K5 ACTIVE SOT-223 DCY 4 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM REG1117/2K5G4 ACTIVE SOT-223 DCY 4 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM REG1117A ACTIVE SOT-223 DCY 4 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM REG1117A-1.8 ACTIVE SOT-223 DCY 4 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM REG1117A-1.8/2K5 ACTIVE SOT-223 DCY 4 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM REG1117A-1.8/2K5G4 ACTIVE SOT-223 DCY 4 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM REG1117A-1.8G4 ACTIVE SOT-223 DCY 4 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM REG1117A-2.5 ACTIVE SOT-223 DCY 4 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM REG1117A-2.5/2K5 ACTIVE SOT-223 DCY 4 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM REG1117A-2.5/2K5G4 ACTIVE SOT-223 DCY 4 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM REG1117A-2.5G4 ACTIVE SOT-223 DCY 4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM REG1117A/2K5 ACTIVE SOT-223 DCY 4 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 80 80 Addendum-Page 1 Lead/Ball Finish MSL Peak Temp (3) PACKAGE OPTION ADDENDUM www.ti.com 5-Oct-2007 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty REG1117A/2K5G4 ACTIVE SOT-223 DCY 4 REG1117AG4 ACTIVE SOT-223 DCY 4 REG1117F-3.3 OBSOLETE DDPAK/ TO-263 KTT 3 REG1117F-3.3/500 ACTIVE DDPAK/ TO-263 KTT 3 REG1117F-3.3/500G3 ACTIVE DDPAK/ TO-263 KTT REG1117F-3.3KTTT ACTIVE DDPAK/ TO-263 REG1117F33KTTTG3 ACTIVE REG1117FA 2500 Green (RoHS & no Sb/Br) Lead/Ball Finish MSL Peak Temp (3) CU NIPDAU Level-1-260C-UNLIM Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TBD Call TI Call TI 500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR 3 500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR KTT 3 50 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR DDPAK/ TO-263 KTT 3 50 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR OBSOLETE DDPAK/ TO-263 KTT 3 TBD Call TI Call TI REG1117FA-1.8 OBSOLETE DDPAK/ TO-263 KTT 3 TBD Call TI Call TI REG1117FA-1.8/500 ACTIVE DDPAK/ TO-263 KTT 3 500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR REG1117FA-1.8KTTT ACTIVE DDPAK/ TO-263 KTT 3 50 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR REG1117FA-18/500G3 ACTIVE DDPAK/ TO-263 KTT 3 500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR REG1117FA-2.5 OBSOLETE DDPAK/ TO-263 KTT 3 TBD Call TI Call TI REG1117FA-2.5/500 ACTIVE DDPAK/ TO-263 KTT 3 500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR REG1117FA-2.5KTTT ACTIVE DDPAK/ TO-263 KTT 3 50 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR REG1117FA-25/500G3 ACTIVE DDPAK/ TO-263 KTT 3 500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR REG1117FA-5.0 OBSOLETE DDPAK/ TO-263 KTT 3 TBD Call TI Call TI REG1117FA-5.0/500 ACTIVE DDPAK/ TO-263 KTT 3 500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR REG1117FA-5.0KTTT ACTIVE DDPAK/ TO-263 KTT 3 50 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR REG1117FA-5.0KTTTG ACTIVE DDPAK/ TO-263 KTT 3 50 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR REG1117FA/500 ACTIVE DDPAK/ TO-263 KTT 3 500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR REG1117FA/500G3 ACTIVE DDPAK/ TO-263 KTT 3 500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR REG1117FA1.8KTTTG3 ACTIVE DDPAK/ TO-263 KTT 3 50 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR REG1117FA2.5KTTTG3 ACTIVE DDPAK/ TO-263 KTT 3 50 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR REG1117FA5.0/500G3 ACTIVE DDPAK/ TO-263 KTT 3 500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR REG1117FAKTTT ACTIVE DDPAK/ TO-263 KTT 3 50 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR 80 Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 5-Oct-2007 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty REG1117FAKTTTG3 ACTIVE DDPAK/ TO-263 KTT 3 50 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR REG1117G4 ACTIVE SOT-223 DCY 4 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 25-Oct-2007 TAPE AND REEL BOX INFORMATION Device Package Pins Site Reel Diameter (mm) Reel Width (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant REG1117F-3.3/500 KTT 3 SITE 41 330 24 10.6 15.6 4.9 16 24 Q2 REG1117F-3.3KTTT KTT 3 SITE 41 330 24 10.6 15.6 4.9 16 24 Q2 REG1117FA-1.8/500 KTT 3 SITE 41 330 24 10.6 15.6 4.9 16 24 Q2 REG1117FA-1.8KTTT KTT 3 SITE 41 330 24 10.6 15.6 4.9 16 24 Q2 REG1117FA-2.5/500 KTT 3 SITE 41 330 24 10.6 15.6 4.9 16 24 Q2 REG1117FA-2.5KTTT KTT 3 SITE 41 330 24 10.6 15.6 4.9 16 24 Q2 REG1117FA-5.0/500 KTT 3 SITE 41 330 24 10.6 15.6 4.9 16 24 Q2 REG1117FA-5.0KTTT KTT 3 SITE 41 330 24 10.6 15.6 4.9 16 24 Q2 REG1117FA/500 KTT 3 SITE 41 330 24 10.6 15.6 4.9 16 24 Q2 REG1117FAKTTT KTT 3 SITE 41 330 24 10.6 15.6 4.9 16 24 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 25-Oct-2007 Device Package Pins Site Length (mm) Width (mm) Height (mm) REG1117F-3.3/500 KTT 3 SITE 41 346.0 346.0 41.0 REG1117F-3.3KTTT KTT 3 SITE 41 346.0 346.0 41.0 REG1117FA-1.8/500 KTT 3 SITE 41 346.0 346.0 41.0 REG1117FA-1.8KTTT KTT 3 SITE 41 346.0 346.0 41.0 REG1117FA-2.5/500 KTT 3 SITE 41 346.0 346.0 41.0 REG1117FA-2.5KTTT KTT 3 SITE 41 346.0 346.0 41.0 REG1117FA-5.0/500 KTT 3 SITE 41 346.0 346.0 41.0 REG1117FA-5.0KTTT KTT 3 SITE 41 346.0 346.0 41.0 REG1117FA/500 KTT 3 SITE 41 346.0 346.0 41.0 REG1117FAKTTT KTT 3 SITE 41 346.0 346.0 41.0 Pack Materials-Page 2 MECHANICAL DATA MPDS094A – APRIL 2001 – REVISED JUNE 2002 DCY (R-PDSO-G4) PLASTIC SMALL-OUTLINE 6,70 (0.264) 6,30 (0.248) 3,10 (0.122) 2,90 (0.114) 4 0,10 (0.004) M 3,70 (0.146) 3,30 (0.130) 7,30 (0.287) 6,70 (0.264) Gauge Plane 1 2 0,84 (0.033) 0,66 (0.026) 2,30 (0.091) 4,60 (0.181) 1,80 (0.071) MAX 3 0°–10° 0,10 (0.004) M 0,25 (0.010) 0,75 (0.030) MIN 1,70 (0.067) 1,50 (0.059) 0,35 (0.014) 0,23 (0.009) Seating Plane 0,08 (0.003) 0,10 (0.0040) 0,02 (0.0008) 4202506/B 06/2002 NOTES: A. B. C. D. All linear dimensions are in millimeters (inches). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion. Falls within JEDEC TO-261 Variation AA. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. 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