FEATURES AND SPECIFICATIONS Camera Sockets Molex's Mobile Phone Camera Sockets Offer Versatility for Mounting Camera Modules 47249 47337 47356 47357 47578 The mobile phone has become more than just an audio communication device over the past few years. With advances in cellular networks and camera modules, improved bandwidths have provided mobile phone manufacturers more options to include cameras and video-conference capabilities. 8 x 8, Top Mount 8.5 x 8.5, Top Mount 6 x 6, Mid Mount with Cap 8 x 8, Mid Mount 6 x 6, Top Mount Visual transmission is via the camera module connected to the camera socket. The entire assembly is either soldered onto flex or PCB of the mobile phone. These sockets allow mobile phone makers to reduce their bills-ofmaterial (BOM) due to the socket's compact design and simple assembly process. Another major benefit arising from the size of the sockets is the reduction in space. Molex offers a wide range of socket configurations that includes application extraction tooling to disengage the camera module from the socket. Features Benefits • Low profile • Excellent for Slim type cell phone • High reliability • Stable high quality image • Side contact and bottom contact solution • Options for module mating design • Top mount and mid mount solution • Provides various height options • Top cover available for • EMI and module holding • Module extraction tool available • Allows re-work SPECIIFICATIONS Reference Information Mechanical Packaging: Embossed Tape on Reel Unmating Force: 1.00N UL File No.: Pending Durability: 30 cycles CSA File No.: Pending Mates With: Respective camera module Physical Designed In: mm Housing: PA Polyamide (nylon), UL 94V-0 Contact: Copper Alloy Electrical Plating: Voltage: 50V Contact Area — 12 μ”Gold Current: 0.5A Solder Tail Area — Gold Contact Resistance: 60 milliohms max. Underplating — Nickel Dielectric Withstanding Voltage: 150V AC PCB Thickness: Insulation Resistance: 400 Megohms min. Operating Temperature: -55°C to +85°C MARKETS AND APPLICATIONS Camera Sockets • 47249 47337 47356 47357 47578 Mobile phones 8 x 8, Top Mount 8.5 x 8.5, Top Mount 6 x 6, Mid Mount with Cap 8 x 8, Mid Mount 6 x 6, Top Mount ORDERING INFORMATION Description Camera Socket Order No. Imager Dim. (mm) PCB Mounting Type Pitch (mm) Circuits Physical Size (L x W x H) in mm Contact Type Capacity (Mega Pixels) 47578-0001 6x6 Top 0.65 20 8.20 x 8.20 x 4.00 Bottom 0.30 MP (VGA) 47356-0020 6x6 Mid 0.65 20 7.90 x 7.90 x 2.90 Bottom 0.30 MP (VGA) 47249-0001 8x8 Top 0.90 24 10.10 x 10.10 x 4.20 Side 1 - 2 MP (CMOS) 47357-0001 8x8 Mid 0.90 24 10.18 x 10.18 x 3.35 Side 1 – 2 MP (CMOS) 47337-0001 8.5 x 8.5 Top 0.90 24 10.60 x 10.60 x 4.20 Side 2.0 MP (CMOS) Americas Headquarters 2222 Wellington Ct. Lisle, Illinois 60532 USA 1-800-78MOLEX [email protected] Asia Pacific North Headquarters Yamato, Kanagawa, Japan 81-462-65-2324 [email protected] Asia Pacific South Headquarters Jurong, Singapore 65-6-268-6868 [email protected] European Headquarters Munich, Germany 49-89-413092-0 [email protected] Corporate Headquarters 2222 Wellington Ct. Lisle, Illinois 60532 USA 630-969-4550 Visit our Web site at http://www.molex.com Order No. SNG-079 ©2007, Molex