M TC72 Digital Temperature Sensor with SPI™ Interface Features General Description • • • • • • • The TC72 is a digital temperature sensor capable of reading temperatures from -55°C to +125°C. This sensor features a serial interface that allows communication with a host controller or other peripherals. The TC72 interface is compatible with the SPI protocol. The TC72 does not require any additional external components. However, it is recommended that a decoupling capacitor of 0.01 µF to 0.1 µF be provided between the VDD and GND pins. Temperature-to-Digital Converter SPI™ Compatible Interface 10-Bit Resolution (0.25°C/Bit) ±2°C (max.) Accuracy from -40°C to +85°C ±3°C (max.) Accuracy from -55°C to +125°C 2.65V to 5.5V Operating Range Low Power Consumption: - 250 µA (typ.) Continuous Temperature Conversion Mode - 1 µA (max.) Shutdown Mode • Power Saving One-Shot Temperature Measurement • Industry Standard 8-Pin MSOP Package • Space Saving 8-Pin DFN (3x3 mm) Package Typical Applications • • • • • • • Personal Computers and Servers Hard Disk Drives and Other PC Peripherals Entertainment Systems Office Equipment Datacom Equipment Mobile Phones General Purpose Temperature Monitoring The TC72 can be used either in a Continuous Temperature Conversion mode or a One-Shot Conversion mode. The Continuous Conversion mode measures the temperature approximately every 150 ms and stores the data in the temperature registers. In contrast, the One-Shot mode performs a single temperature measurement and returns to the power saving shutdown mode. The TC72 features high temperature accuracy, easeof-use and is the ideal solution for implementing thermal management in a variety of systems. The device is available in both 8-pin MSOP and 8-pin DFN spacesaving packages. The TC72 also features a shutdown mode for low power operation. Block Diagram VDD Package Types Internal Diode Temperature Sensor MSOP 8 VDD CE 2 7 NC SCK 3 TC72 NC 1 GND 4 6 SDI 5 SDO 10-Bit Sigma Delta A/D Converter DFN 8 VDD SCK 2 7 NC TC72 NC 1 CE 3 GND 4 6 SDO Temperature Register 5 SDI GND 2002 Microchip Technology Inc. TC72 Manufacturer ID Register Serial Port Interface CE SCK SDO SDI Control Register DS21743A-page 1 TC72 Typical Application VDD 0.1µF VDD TC72 PICmicro® MCU CE AN0 SCK SCK SDO SDI SDI SDO GND DS21743A-page 2 2002 Microchip Technology Inc. TC72 1.0 1.1 ELECTRICAL CHARACTERISTICS PIN FUNCTION TABLE Name Maximum Ratings† VDD........................................................................ 6.0V All inputs and outputs w.r.t. GND ...-0.3V to VDD +0.3V Storage temperature .......................... -65°C to +150°C Ambient temp. with power applied ..... -55°C to +125°C Junction Temperature ........................................ 150°C ESD protection on all pins: Human Body Model (HBM)............................. > 4 kV Man Machine Model (MM)............................. > 400V Function NC No Internal Connection CE Chip Enable Input, the device is selected when this input is high SCK Serial Clock Input GND Ground SDO Serial Data Output SDI Serial Data Input NC No Internal Connection VDD Power Supply Latch-Up Current at each pin ........................ ±200 mA Maximum Power Dissipation........................... 250 mW † Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. DC CHARACTERISTICS Electrical Specifications: Unless otherwise noted, all parameters apply at V DD = 2.65V to 5.5V, TA = -55°C to +125 °C. Parameters Sym Min Typ Max Units Conditions Power Supply Operating Voltage Range Operating Current: Normal Mode, ADC Active Shut-Down Supply Current V DD 2.65 — 5.5 V Note 1 IDD-CON — 250 400 µA Continuous temp. conversion mode (Shutdown Bit = ‘0’) ISHD — 0.1 1.0 µA Shutdown Mode (Shutdown Bit = ‘1’) — +2.0 °C -40°C < TA < +85°C -3.0 — +3.0 — 10 — Bits tCONV — 150 200 ms Temperature Sensor and Analog-to-Digital Converter Temperature Accuracy (Note 1) TACY Resolution ADC Conversion Time -2.0 -55°C < TA < +125°C Note 4 Digital Input / Output High Level Input Voltage VIH 0.7 VDD — — V Low Level Input Voltage V IL — — 0.2 VDD V High Level Output Voltage VOH 0.7 VDD — — V IOH = 1 mA Low Level Output Voltage VOL — — 0.2 VDD V IOL = 4 mA Input Resistance RIN 1.0 — — MΩ Pin Capacitance CIN — 15 — pF COUT — 50 — Note 1: The TC72-2.8MXX, TC72-3.3MXX and TC72-5.0MXX will operate from a supply voltage of 2.65V to 5.5V. However, the TC72-2.8MXX, TC72-3.3MXX and TC72-5.0MXX are tested and specified at the nominal operating voltages of 2.8V, 3.3V and 5.0V respectively. As VDD varies from the nominal operating value, the accuracy may be degraded. Refer to Figure 2-5 and Figure 2-6. 2: Measured with a load of CL = 50 pF on the SDO output pin of the TC72. 3: All time measurements are measured with respect to the 50% point of the signal, except for the SCK rise and fall times. The rise and fall times are defined as the 10% to 90% transition time. 4: Resolution = Temperature Range/No. of Bits = (+127°C – -128°C) / (210) = 256/1024 = 0.25°C/Bit 2002 Microchip Technology Inc. DS21743A-page 3 TC72 DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise noted, all parameters apply at V DD = 2.65V to 5.5V, TA = -55°C to +125 °C. Parameters Sym Min Typ Max Units Conditions Serial Port AC Timing (Note 2, 3) Clock Frequency fCLK DC — 7.5 MHz SCK Low Time tCL 65 — — ns SCK High Time tCH 65 — — ns CE to SCK Setup tCC 400 — — ns SCK to Data Out Valid tCDD — — 55 ns CE to Output Tri-state tCDZ — — 40 ns SCK to Data Hold Time tCDH 35 — — ns tDC 35 — — ns tCCH 100 — — ns tR — — 200 ns Data to SCK Set-up Time SCK to CE Hold Time SCK Rise Time tF — — 200 ns tCWH 400 — — ns Thermal Resistance, MSOP-8 θJA — 206 — °C/W Thermal Resistance, DFN-8 θJA — 60.5 — °C/W SCK Fall Time CE Inactive Time Thermal Package Resistance Note 1: The TC72-2.8MXX, TC72-3.3MXX and TC72-5.0MXX will operate from a supply voltage of 2.65V to 5.5V. However, the TC72-2.8MXX, TC72-3.3MXX and TC72-5.0MXX are tested and specified at the nominal operating voltages of 2.8V, 3.3V and 5.0V respectively. As VDD varies from the nominal operating value, the accuracy may be degraded. Refer to Figure 2-5 and Figure 2-6. 2: Measured with a load of CL = 50 pF on the SDO output pin of the TC72. 3: All time measurements are measured with respect to the 50% point of the signal, except for the SCK rise and fall times. The rise and fall times are defined as the 10% to 90% transition time. 4: Resolution = Temperature Range/No. of Bits = (+127°C – -128°C) / (210) = 256/1024 = 0.25°C/Bit DS21743A-page 4 2002 Microchip Technology Inc. TC72 SPI READ DATA TRANSFER (CP = 0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7 = 0) tCWH CE tCCH 1/fCLK tCC SCK SDI tDC tCDH A7 MSb tF tR tCH A0 tCL LSb tCDD SDO HIGH Z tCDZ D7 MSb D0 LSb HIGH Z SPI WRITE DATA TRANSFER (CP = 0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7 = 1) tCWH CE 1/fCLK tCC tCCH SCK tF SDI A7 = 1 MSb Note: FIGURE 1-1: tR tCH A0 LSb tDC tCDH D7 MSb tCL D0 LSb The timing diagram is drawn with CP = 0. The TC72 also functions with CP = 1; however, the edges of SCK are reversed as defined in Table 3-3 and Figure 3-2. Serial Port Timing Diagrams. 2002 Microchip Technology Inc. DS21743A-page 5 TC72 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 3.5 3 2.5 2 1.5 1 0.5 0 -0.5 -1 -1.5 -2 -2.5 -3 -3.5 0.20 Upper Specification Limit Mean Mean + 3V Mean - 3V Lower Specification Limit Shutdown Current (µA) Temperature Error (°C) Note: Unless otherwise indicated, all parameters apply at VDD = 2.65V to 5.5V, TA = -55°C to +125°C. 0.15 TC72-3.3MXX TC72-5.0MXX VDD = 3.3V VDD = 5.0V TC72-5.0MXX VDD = 2.8V 0.10 0.05 0.00 -55 -25 5 35 65 95 -55 125 -25 5 Reference Temperature (°C) FIGURE 2-1: (TC72-X.XMXX). FIGURE 2-4: Temperature. Temperature Change (°C) Supply Current (µA) Accuracy vs. Temperature TC72-X.XMXX 250 TA = +25°C 240 230 220 TA = -55°C 210 TA = +125°C 200 2.5 3.0 3.5 4.5 5.0 0.3 TC72-2.8MXX 0.2 TA = +85°C 0.1 0.0 -0.1 -0.2 2.6 2.7 TC72-2.8MXX VDD = 2.8V 50 0 -55 -25 5 35 65 95 Temperature (°C) FIGURE 2-3: Temperature. DS21743A-page 6 2.9 3.0 Supply Current vs. FIGURE 2-5: Temperature Accuracy vs. Supply Voltage (TC72-2.8MXX). Temperature Change (°C) Supply Current (uA) TC72-3.3MXX VDD = 3.3V 200 100 2.8 Supply Voltage (V) 250 150 TA = -25°C TA = +25°C -0.3 5.5 Supply Current vs. Supply TC72-5.0MXX VDD = 5.0V 300 125 -0.4 4.0 400 350 95 Shutdown Current vs. Supply Voltage (V) FIGURE 2-2: Voltage. 65 Temperature (°C) 0.4 260 35 125 1.0 0.8 0.6 0.4 0.2 0.0 -0.2 -0.4 -0.6 -0.8 -1.0 TC72-5.0MXX TA = +85°C T A = -25°C TA = +25°C 4.5 4.6 4.7 4.8 4.9 5.0 5.1 5.2 5.3 5.4 5.5 Supply Voltage (V) FIGURE 2-6: Temperature Accuracy vs. Supply Voltage (TC72-5.0MXX). 2002 Microchip Technology Inc. TC72 TC72-X.XMXX Sample Size = 166 TA = +65°C 50 40 30 20 10 Temperature Error (°C) Percentage of Occurances (%) 40 30 20 10 0 1.5 2 -2 -1.5 1.50 1.25 1.00 0.75 0.25 0.00 -0.25 0.50 1 1.5 2 Temperature Error (°C) FIGURE 2-9: Histogram of Temperature Accuracy at +25 Degrees C. 25 20 15 10 5 3 0 2.5 1.50 1.25 1.00 0.75 0.50 0.25 0.00 -0.25 -0.50 -0.75 -1.00 0 30 -2 10 -1.25 0.5 TC72-X.XMXX Sample Size = 166 TA = +125°C 35 -3 20 40 -2.5 30 2002 Microchip Technology Inc. 0 FIGURE 2-11: Histogram of Temperature Accuracy at +85 Degrees C. Percentage of Occurances (%) 40 TC72-X.XMXX Sample Size = 166 TA = +25°C -1.50 Percentage of Occurances (%) 50 -0.5 Temperature Error (°C) FIGURE 2-8: Histogram of Temperature Accuracy at -40 Degrees C. 60 -1 2 1 1.5 0.5 1 0 0.5 -0.5 Temperature Error (°C) 0 -1 -0.5 -1.5 TC72-X.XMXX Sample Size = 166 TA = +85°C -1 -2 50 45 40 35 30 25 20 15 10 5 0 -1.5 Percentage of Occurances (%) FIGURE 2-10: Histogram of Temperature Accuracy at +65 Degrees C. TC72-X.XMXX Sample Size = 166 TA = -40°C 50 -0.50 Temperature Error (°C) FIGURE 2-7: Histogram of Temperature Accuracy at -55 Degrees C. 60 -0.75 -1.00 -1.25 0 -1.50 Percentage of Occurances (%) 60 3 2 2.5 1 0 0.5 -0.5 -1 -2 -1.5 -3 1.5 TC72-X.XMXX Sample Size = 166 TA = -55°C 50 45 40 35 30 25 20 15 10 5 0 -2.5 Percentage of Occurances (%) Note: Unless otherwise indicated, all parameters apply at VDD = 2.65V to 5.5V, TA = -55°C to +125°C. Temperature Error (°C) FIGURE 2-12: Histogram of Temperature Accuracy at +125 Degrees C. DS21743A-page 7 TC72 3.0 FUNCTIONAL DESCRIPTION The Continuous Conversion mode measures the temperature approximately every 150 ms and stores the data in the temperature registers. The TC72 has an internal clock generator that controls the automatic temperature conversion sequence. The automatic temperature sampling operation is repeated indefinitely until the TC72 is placed in a shutdown mode by a write operation to the Control register. The TC72 will remain in the shutdown mode until the shutdown bit in the Control register is reset. The TC72 consists of a band-gap type temperature sensor, a 10-bit Sigma Delta Analog-to-Digital Converter (ADC), an internal conversion oscillator and a double buffer digital output port. The 10-bit ADC is scaled from -128°C to +127°C; therefore, the resolution is 0.25°C per bit. The ambient temperature operating range of the TC72 is specified from -55°C to +125°C. This device features a four-wire serial interface that is fully compatible with the SPI specification and, therefore, allows simple communications with common microcontrollers and processors. The TC72 can be used either in a Continuous Temperature Conversion mode or a One-Shot Conversion mode. The TC72 temperature measurements are performed in the background and, therefore, reading the temperature via the serial I/O lines does not affect the measurement in progress. MSB LSB 0111 1101 / 0000 0000 In contrast, the One-Shot mode performs a single temperature measurement and returns to the power-saving shut down mode. This mode is especially useful for low power applications. Output Code +25°C +0.25°C MSB LSB 0001 1001 / 0000 0000 MSB LSB 0000 0000 / 0100 0000 MSB LSB 0°C 0000 0000 / 0000 0000 Temp -55°C MSB LSB 1111 1111 / 1100 0000 Temp +125°C MSB LSB 1110 0111 / 0000 0000 -0.125°C -25°C MSB LSB 1100 1001 / 0000 0000 Note: FIGURE 3-1: DS21743A-page 8 The ADC converter is scaled from -128°C to -127°C, but the operating range of the TC72 is specified from -55°C to +125°C. Temperature-To-Digital Transfer Function (Non-linear Scale). 2002 Microchip Technology Inc. TC72 3.1 Temperature Data Format 3.3 Serial Bus Interface Temperature data is represented by a 10-bit two’s complement word with a resolution of 0.25°C per bit. The temperature data is stored in the Temperature registers in a two’s complement format. The ADC converter is scaled from -128°C to +127°C, but the operating range of the TC72 is specified from -55°C to +125°C. The serial interface consists of the Chip Enable (CE), Serial Clock (SCK), Serial Data Input (SDI) and Serial Data Output (SDO) signals. The TC72 operates as a slave and is compatible with the SPI bus specifications. The serial interface is designed to be compatible with the Microchip PICmicro® family of microcontrollers. Example: The CE input is used to select the TC72 when multiple devices are connected to the serial clock and data lines. The CE is active-high, and data is written to or read from the device, when CE is equal to a logic high voltage. The SCK input is disabled when CE is low. The rising edge of the CE line initiates a read or write operation, while the falling edge of CE completes a read or write operation. Temperature = 41.5°C MSB Temperature Register= = = 00101001b 25 + 23 + 20 32 + 8 + 1 = 41 LSB Temperature Register = 10000000b = 2-1 = 0.5 TABLE 3-1: TC72 TEMPERATURE OUTPUT DATA Temperature Binary MSB / LSB Hex +125°C 0111 1101/0000 0000 7D00 +25°C 0001 1001/0000 0000 1900 +0.5°C 0000 0000/1000 0000 0080 +0.25°C 0000 0000/0100 0000 0040 0°C 0000 0000/0000 0000 0000 -0.25°C 1111 1111/1100 0000 FFC0 -25°C 1110 0111/0000 0000 E700 -55°C 1100 1001/0000 0000 C900 TABLE 3-2: TEMPERATURE REGISTER D7 D6 D5 D4 D3 D2 D1 D0 Address/ Register Sign 26 25 24 23 23 21 20 02H Temp. MSB 2-1 2-2 0 0 0 0 0 0 01H Temp. LSB 3.2 Power-Up And Power-Down The TC72 is in the low power consumption shutdown mode at power-up. The Continuous Temperature Conversion mode is selected by performing a Write operation to the Control register, as described in Section 4.0, “Internal Register Structure”. The SCK input is provided by the external microcontroller and is used to synchronize the data on the SDI and SDO lines. The SDI input writes data into the TC72’s Control register, while the SDO outputs the temperature data from the Temperature register and the status of Shutdown bit of the Control register. The TC72 has the capability to function with either an active-high or low SCK input. The SCK inactive state is detected when the CE signal goes high, while the polarity of the clock input (CP) determines whether the data is clocked and shifted on either the rising or falling edge of the system clock, as shown in Figure 3-2. Table 3-3 gives the appropriate clock edge used to transfer data into and out of the registers. Each data bit is transferred at each clock pulse, and the data bits are clocked in groups of eight bits, as shown in Figure 3-3. The address byte is transferred first, followed by the data. A7, the MSb of the address, determines whether a read or write operation will occur. If A7 = ‘0’, one or more read cycles will occur; otherwise, if A7 = ‘1’, one or more write cycles will occur. Data can be transferred either in a single byte or a multi-byte packet, as shown in Figure 3-3. In the 3-byte packet, the data sequence consists of the MSb temperature data, LSb temperature data, followed by the Control register data. The multi-byte read feature is initiated by writing the highest address of the desired packet to registers. The TC72 will automatically send the register addressed and all of the lower address registers, as long as the Chip Enable pin is held active. A supply voltage lower than 1.6V (typical) is considered a power-down state for the TC72. If the supply voltage drops below the 1.6V threshold, the internal registers are reset to the power-up default state. 2002 Microchip Technology Inc. DS21743A-page 9 TC72 TABLE 3-3: OPERATIONAL MODES Mode CE SCK (Note 1) SDI SDO Disable L Input Disabled Input Disabled High Z Data Bit Latch High Z X Next data bit shift, Note 2 Write (A7 = 1) H CP=1, Data Shifted on Falling Edge, Data Clocked on Rising Edge CP=0, Data Shifted on Rising Edge, Data Clocked on Falling Edge Read (A7 = 0) H CP=1, Data Shifted on Falling Edge, Data Clocked on Rising Edge CP=0, Data Shifted on Rising Edge, Data Clocked on Falling Edge Note 1: CP is the Clock Polarity of the microcontroller system clock. If the inactive state of SCK is logic level high, CP is equal to ‘1’; otherwise, if the inactive state of SCK is low, CP is equal to ‘0’. 2: During a Read operation, SDO remains at a high impedance (High Z) level until the eight bits of data begin to be shifted out of the Temperature register. 3.4 Read Operation The temperature and control register data is outputted from the TC72 using the CE, SCK and SDO lines. Figure 3-3 shows a timing diagram of the read operation. Communication is initiated by the chip enable (CE) going high. The SDO line remains at the voltage level of the LSb bit that is outputted and goes to the tri-state level when the CE line goes to a logic low level. 3.5 CP = 0 CE SCK Write Operation Data is clocked into the Control register in order to enable the TC72’s power saving shutdown mode. The write operation is shown in Figure 3-3 and is accomplished using the CE, SCK and SDI line. SHIFT EDGE CLOCK EDGE CP = 1 CE SCK SHIFT EDGE FIGURE 3-2: Operation. DS21743A-page 10 CLOCK EDGE Serial Clock Polarity (CP) 2002 Microchip Technology Inc. TC72 Single Byte Write Operation (CP=0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7=1) CE SCK 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 A7=1 A 7 SDI A 6 A 5 A 4 A 3 A 2 A 1 A 0 D 7 D 6 D 5 D 4 D 3 D 2 D 1 MSb SDO D 0 LSb High Z Single Byte Read Operation (CP=0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7=0) CE SCK 2 1 3 4 5 6 7 8 9 10 11 12 13 14 15 16 A7=0 A 7 SDI A 6 A 5 A 4 A 3 SDO A 2 A 1 A 0 High Z D 7 D 0 MSb LSb High Z SPI Multiple Byte Transfer CE SCK Write Operation (CP=0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7=1) SDI Address Byte = 80hex A7 A0 Control Byte D7 D0 High Z SDO Read Operation (CP=0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7=0) SDI Address Byte = 02hex A0 A7 SDO MSB Temp. Byte High Z FIGURE 3-3: D7 Control Byte LSB Temp. Byte D0 D7 D0 D7 D0 High Z Serial Interface Timing Diagrams (CP=0). 2002 Microchip Technology Inc. DS21743A-page 11 TC72 4.0 INTERNAL REGISTER STRUCTURE The TC72 registers are listed below. TABLE 4-1: REGISTERS FOR TC72 Read Address Write Address Bit 7 Bit 6 Bit 5 Bit 4 Control 00hex 80hex 0 0 0 One-Shot (OS) LSB Temperature 01hex N/A T1 T0 0 MSB Temperature 02hex N/A T9 T8 T7 Manufacturer ID 03hex N/A 0 1 0 1 Register 4.1 Control Register The Control register is both a read and a write register that is used to select either the Shutdown, Continuous or One-Shot Conversion operating mode. The Temperature Conversion mode selection logic is shown in Table 4-2. The Shutdown (SHDN) bit is stored in bit 0 of the Control register. If SHDN is equal to ‘1’, the TC72 will go into the power-saving shutdown mode. If SHDN is equal to ‘0’, the TC72 will perform a temperature conversion approximately every 150 ms. At power-up, the SHDN bit is set to ‘1’. Thus, the TC72 is in the shutdown operating mode at startup. The Continuous Temperature Conversion mode is selected by writing a ‘0’ to the SHDN bit of the Control register. The Shutdown mode can be used to minimize the power consumption of the TC72 when active temperature monitoring is not required. The shutdown mode disables the temperature conversion circuitry; however, the serial I/O communication port remains active. A temperature conversion will be initialized by a Write operation to the Control register to select either the Continuous Temperature Conversion or the One-Shot operating mode. The temperature data will be available in the MSB and LSB Temperature registers approximately 150 ms after the Control register Write operation. Bit Bit Bit 3 2 1 Bit 0 Value on POR/BOR Shutdown (SHDN) 05hex 0 1 0 0 0 0 0 0 00hex T6 T5 T4 T3 T2 00hex 0 0 54hex 1 0 The One-Shot mode is selected by writing a ‘1’ into bit 4 of the Control register. The One-Shot mode performs a single temperature measurement and returns to the power-saving shutdown mode. After completion of the temperature conversion, the One-Shot bit (OS) is reset to ‘0’ (i.e. “OFF”). The user must set the One-Shot bit to ‘1’ to initiate another temperature conversion. Bits 1, 3, 5, 6 and 7 of the Control register are not used by the TC72. Bit 2 is set to a logic ‘1’. Any write operation to these bit locations will have no affect on the operation of the TC72. 4.2 Temperature Register The Temperature register is a read-only register and contains a 10-bit two’s complement representation of the temperature measurement. Bit 0 through Bit 5 of the LSB Temperature register are always set to a logic ‘0’. At Power-On Reset (POR) or a Brown-Out Reset (BOR) low voltage occurrence, the temperature register is reset to all zeroes, which corresponds to a temperature value of 0°C. A V DD power supply less than 1.6V is considered a reset event and will reset the Temperature register to the power-up state. 4.3 Manufacturer ID Register The Manufacturer Identification (ID) register is a readonly register used to identify the temperature sensor as a Microchip component. TABLE 4-2: CONTROL REGISTER TEMPERATURE CONVERSION MODE SELECTION Operational Mode One-Shot (OS) Bit 4 Shutdown (SHDN) Bit 0 Continuous Temperature Conversion 0 0 Shutdown 0 1 Continuous Temperature Conversion (One-Shot Command is ignored if SHDN = ‘0’) 1 0 One-Shot 1 1 DS21743A-page 12 2002 Microchip Technology Inc. TC72 5.0 APPLICATIONS INFORMATION The TC72 does not require any additional components in order to measure temperature; however, it is recommended that a decoupling capacitor of 0.1mF to 1mF be provided between the VDD and GND pins. Although the current consumption of the TC72 is modest (250 mA, typical), the TC72 contains an on chip data acquisition with internal digital switching circuitry. Thus, it is considered good design practice to use an external decoupling capacitor with the sensor. A high frequency ceramic capacitor should be used and be located as close as possible to the IC power pins in order to provide effective noise protection to the TC72. The TC72 measures temperature by monitoring the voltage of a diode located on the IC die. The IC pins of the TC72 provide a low impedance thermal path between the die and the PCB, allowing the TC72 to effectively monitor the temperature of the PCB board. The thermal path between the ambient air is not as efficient because the plastic IC housing package functions as a thermal insulator. Thus the ambient air temperature (assuming that a large temperature gradient exists between the air and PCB) has only a small effect on the temperature measured by the TC72. Note that the exposed metal center pad on the bottom of the DFN package is connected to the silicon substrate. The center pad should be connected to either the PCB ground plane or treated as a “No Connect” pin. The mechanical dimensions of the center pad are given in Section 6.0, “Packaging Information”, of this datasheet. A potential for self-heating errors can exist if the TC72 SPI communication lines are heavily loaded. Typically, the self-heating error is negligible because of the relatively small current consumption of the TC72. A temperature accuracy error of approximately 0.5°C will result from self-heating if the SPI communication pins sink/source the maximum current specified for the TC72. Thus to maximize the temperature accuracy, the output loading of the SPI signals should be minimized. 2002 Microchip Technology Inc. DS21743A-page 13 TC72 6.0 PACKAGING INFORMATION 6.1 Taping Form Component Taping Orientation for 8-Pin MSOP Devices User Direction of Feed User Direction of Feed PIN 1 W PIN 1 Standard Reel Component Orientation for TR Suffix Device P Reverse Reel Component Orientation for RT Suffix Device Carrier Tape, Number of Components Per Reel and Reel Size Package 8-Pin MSOP Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 12 mm 8 mm 2500 13 in Tape and Reel information for the 8-Lead DFN package will be available TBD. DS21743A-page 14 2002 Microchip Technology Inc. TC72 6.2 Package Marking Information Example: 8-Lead MSOP TC722M 221067 XXXXXX YWWNNN Example: 8-Lead DFN XXXXXXXX MYWW NNN Legend: Note: * XX...X YY WW NNN 7228 8221 067 Customer specific information* Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. Standard OTP marking consists of Microchip part number, year code, week code, and traceability code. 2002 Microchip Technology Inc. DS21743A-page 15 TC72 8-Lead Plastic Micro Small Outline Package (MS) (MSOP) E p E1 D 2 B n 1 α A2 A c φ A1 (F) L β Units Number of Pins Pitch Dimension Limits n p Overall Height NOM MAX 8 0.65 .026 A .044 .030 Standoff A1 .002 E .184 Molded Package Width MIN 8 A2 Overall Width MAX NOM Molded Package Thickness § MILLIMETERS* INCHES MIN 1.18 .038 0.76 .006 0.05 .193 .200 .034 0.86 0.97 4.67 4.90 .5.08 0.15 E1 .114 .118 .122 2.90 3.00 3.10 Overall Length D .114 .118 .122 2.90 3.00 3.10 Foot Length L .016 .022 .028 0.40 0.55 0.70 Footprint (Reference) .035 .037 .039 0.90 0.95 1.00 Foot Angle F φ 6 0 Lead Thickness c .004 .006 .008 0.10 0.15 0.20 Lead Width B α .010 .012 .016 0.25 0.30 0.40 Mold Draft Angle Top Mold Draft Angle Bottom β 0 6 7 7 7 7 *Controlling Parameter § Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. Drawing No. C04-111 DS21743A-page 16 2002 Microchip Technology Inc. TC72 8-Lead Plastic Dual Flat Pack, No Lead (MF) 3x3x1 mm Body (DFN) E p b n L D D2 EXPOSED METAL PAD 2 1 E2 TOP VIEW PIN 1 ID INDEX AREA (NOTE 2) BOTTOM VIEW A1 A3 A EXPOSED TIE BAR (NOTE 1) Number of Pins Pitch Overall Height Standoff Lead Thickness Overall Length Exposed Pad Length Overall Width Exposed Pad Width Lead Width Lead Length Units Dimension Limits n p (Note 4) (Note 4) A A1 A3 E E2 D D2 b L MIN .031 .000 INCHES NOM 8 .026 BSC .035 .001 .008 REF. .118 BSC MAX .039 .002 .096 .055 .118 BSC .047 .007 .012 .010 .019 .069 .015 .022 MILLIMETERS* NOM 8 0.65 BSC 0.80 0.90 0.02 0.00 0.20 REF. 3.00 BSC 1.39 3.00 BSC 1.20 0.23 0.26 0.30 0.48 MIN MAX 1.00 0.05 2.45 1.75 0.37 0.55 *Controlling Parameter Notes: 1. Package may have one or more exposed tie bars at ends. 2. Pin 1 visual index feature may vary, but must be located within the hatched area. 3. Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. 4. Exposed pad dimensions vary with paddle size. 5. JEDEC equivalent: Pending Drawing No. C04-062 2002 Microchip Technology Inc. DS21743A-page 17 TC72 8-Lead Plastic Dual Flat Pack, No Lead (MF) 3x3x1 mm Body (DFN) p X P1 Y Z G G2 CP THERMAL VIAS ON 4 LAYER PC BOARD 0V H OPTIONAL FOUR LAYER PCB LAND PATTERN DFN LAND PATTERN H2 OPTIONAL TWO LAYER PCB LAND PATTERN M (TYP) Terminal Pitch MILLIMETERS* INCHES Units Dimension Limits p TYPCAL SOLDER MASKS MIN NOM MAX MIN NOM MAX 0.65 BSC .026 BSC Terminal Land Pattern O.D. Z .134 .157 3.40 4.00 Terminal Land Pattern I.D. A1 .057 .060 1.45 1.53 Exposed Pad Clearance CP .006 Interior Lead Clearance Z .071 Terminal Land Width X .014 .017 0.35 0.42 Terminal Land Length Y .033 .035 0.85 0.88 Exposed Pad Length H .130 H2 .130 G2 .057 Optional Exposed Pad Length Exposed Pad Width (Note 1) Termal Via Pitch V Minimum Solder Mask Clearance M 1.80 3.30 3.30 .059 1.45 0.30 .012 .002 1.50 1.20 .047 P1 Thermal Via Diameter 0.15 0.05 *Controlling Parameter Notes: 1. Exposed pad dimensions vary with paddle size. Drawing No. C04-2062 DS21743A-page 18 2002 Microchip Technology Inc. TC72 ON-LINE SUPPORT Microchip provides on-line support on the Microchip World Wide Web site. The web site is used by Microchip as a means to make files and information easily available to customers. To view the site, the user must have access to the Internet and a web browser, such as Netscape® or Microsoft® Internet Explorer. Files are also available for FTP download from our FTP site. Connecting to the Microchip Internet Web Site The Microchip web site is available at the following URL: www.microchip.com SYSTEMS INFORMATION AND UPGRADE HOT LINE The Systems Information and Upgrade Line provides system users a listing of the latest versions of all of Microchip's development systems software products. Plus, this line provides information on how customers can receive the most current upgrade kits.The Hot Line Numbers are: 1-800-755-2345 for U.S. and most of Canada, and 1-480-792-7302 for the rest of the world. 092002 The file transfer site is available by using an FTP service to connect to: ftp://ftp.microchip.com The web site and file transfer site provide a variety of services. Users may download files for the latest Development Tools, Data Sheets, Application Notes, User's Guides, Articles and Sample Programs. A variety of Microchip specific business information is also available, including listings of Microchip sales offices, distributors and factory representatives. Other data available for consideration is: • Latest Microchip Press Releases • Technical Support Section with Frequently Asked Questions • Design Tips • Device Errata • Job Postings • Microchip Consultant Program Member Listing • Links to other useful web sites related to Microchip Products • Conferences for products, Development Systems, technical information and more • Listing of seminars and events 2002 Microchip Technology Inc. DS21734A-page19 TC72 READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. To: Technical Publications Manager RE: Reader Response Total Pages Sent ________ From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ FAX: (______) _________ - _________ Application (optional): Would you like a reply? Device: TC72 Y N Literature Number: DS21734A Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? DS21734A-page20 2002 Microchip Technology Inc. TC72 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. -X.X X XX Device Voltage Range Temperature Range Package Examples: a) TC72-2.8MUA: Digital Temperature Sensor, b) TC72-2.8MUATR: Digital Temperature Sen- 2.8V, 8LD MSOP package. sor, 2.8V, 8LD MSOP (tape and reel) package. Device: TC72: Digital Temperature Sensor w/SPI Interface Voltage Range: 2.8 3.3 5.0 = Accuracy Optimized for 2.8V = Accuracy Optimized for 3.3V = Accuracy Optimized for 5.0V c) TC72-2.8MMF: Digital Temperature Sensor, 2.8V, 8LD DFN package. d) TC72-3.3MUA: Digital Temperature Sensor, e) TC72-3.3MMF: Digital Temperature Sensor, 3.3V, 8LD MSOP package. 3.3V, 8LD DFN package. Temperature Range: M = -55°C to +125°C Package: MF = Dual, Flat, No Lead (DFN) (3x3mm), 8-lead MFTR = Dual, Flat, No Lead (DFN) (3x3mm), 8-lead (Tape and Reel) UA = Plastic Micro Small Outline (MSOP), 8-lead UATR = Plastic Micro Small Outline (MSOP), 8-lead (Tape and Reel) f) TC72-5.0MUA: Digital Temperature Sensor, 5.0V, 8LD MSOP package. g) TC72-5.0MMF: Digital Temperature Sensor, h) TC72-5.0MMFTR: Digital Temperature Sen- 5.0V, 8LD DFN package. sor, 5.0V, 8LD DFN (tape and reel) package. Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. 2002 Microchip Technology Inc. DS21743A-page21 TC72 NOTES: DS21743A-page 22 2002 Microchip Technology Inc. Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, K EELOQ, MPLAB, PIC, PICmicro, PICSTART and PRO MATE are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. dsPIC, dsPICDEM.net, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2002, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company’s quality system processes and procedures are QS-9000 compliant for its PICmicro ® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001 certified. 2002 Microchip Technology Inc. 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