TC1174 300mA CMOS LDO with Shutdown and VREF Bypass Features General Description • • • • • • • • The TC1174 is an adjustable output CMOS low dropout regulator. Total supply current is typically 50µA at full load (20 to 60 times lower than in bipolar regulators). Extremely Low Supply Current (50µA, Typ.) Very Low Dropout Voltage 300mA Output Current Adjustable Output Voltages Power Saving Shutdown Mode Bypass Input for Ultra Quiet Operation Over Current and Over Temperature Protection Space-Saving MSOP Package Option The TC1174 incorporates both over temperature and over current protection. The TC1174 is stable with an output capacitor of only 1µF and has a maximum output current of 300mA. Applications • • • • • • • TC1174 key features include ultra low noise operation (plus optional Bypass input); very low dropout voltage (typically 270mV at full load) and internal feed-forward compensation for fast response to step changes in load. Supply current is reduced to 0.05µA (typical) and VOUT falls to zero when the shutdown input is low. Battery Operated Systems Portable Computers Medical Instruments Instrumentation Cellular/GSM/PHS Phones Linear Post-Regulators for SMPS Pagers Typical Application VOUT 1 V OUT + VIN 8 VIN C1 1µF R1 Device Selection Table 2 3 NC Output Voltage (V) Package Junction Temp. Range TC1174VOA Adjustable 8-Pin SOIC -40°C to +125°C TC1174VUA Adjustable 8-Pin MSOP -40°C to +125°C R2 7 NC TC1174 470K Part Number NC GND 4 ADJ SHDN Bypass 6 5 Shutdown Control (from Power Control Logic) CBYPASS 470pF (Optional) 470K [ R1 ] R2 VOUT = VREF x — + 1 Package Type 8-Pin MSOP VOUT 1 8 VIN GND NC 2 7 6 NC SHDN ADJ 4 5 Bypass 3 TC1174VUA 8-Pin SOIC VOUT 1 8 VIN GND 2 TC1174VOA 7 NC NC 3 6 SHDN ADJ 4 5 Bypass 2002 Microchip Technology Inc. DS21363B-page 1 TC1174 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings* Input Voltage .........................................................6.5V Output Voltage.................. (VSS – 0.3V) to (VIN + 0.3V) Power Dissipation................Internally Limited (Note 5) Maximum Voltage on Any Pin ........ VIN +0.3V to -0.3V Operating Temperature Range...... -40°C < TJ < 125°C Storage Temperature.......................... -65°C to +150°C *Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. TC1174 ELECTRICAL SPECIFICATIONS Electrical Characteristics: VIN = VOUT + 1V, IL = 0.1µA, CL = 3.3µF, SHDN > VIH , TA = 25°C, unless otherwise noted. Boldface type specifications apply for junction temperatures of -40°C to +125°C. Symbol Parameter Min Typ Max Units VIN Input Operating Voltage 2.7 — 6.0 V IOUTMAX Maximum Output Current 300 — — mA VREF Reference Voltage 1.165 1.20 1.235 V Test Conditions Note 6 ∆VOUT/∆T VOUT Temperature Coefficient — 40 — ppm/°C ∆VOUT/∆VIN Line Regulation — 0.05 0.35 % (VR + 1V) ≤ VIN ≤ 6V ∆VOUT/VOUT Load Regulation — 1.1 2.0 % IL = 0.1mA to IOUTMAX (Note 2) VIN-VOUT Dropout Voltage — — — 20 80 270 30 160 480 mV IL = 0.1mA IL = 100mA IL = 300mA (Note 3) ISS1 Supply Current — 50 90 µA SHDN = VIH ISS2 Shutdown Supply Current — 0.05 0.5 µA SHDN = 0V PSRR Power Supply Rejection Ratio — 60 — dB FRE – 1kHz IOUTSC Output Short Circuit Current — 550 650 mA VOUT = 0V ∆VOUT/∆PD Thermal Regulation — 0.04 — V/W eN Output Noise — 260 — nV/√Hz VIH SHDN Input High Threshold 45 — — %VIN VIL SHDN Input Low Threshold — — 15 %VIN Adjustable Input Leakage Current — 50 — pA Note 1 Note 4 F = 10kHz, IL = IOUTMAX 470pF from Bypass to GND SHDN Input ADJ Input IADJ 1: 2: 3: 4: 5: 6: TC VOUT = (VOUT MAX – VOUT MIN) x 10 6 VOUT x ∆T Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a 1V differential. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, θ JA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 4.0 Thermal Considerations for more details. The minimum VIN has to justify the conditions: VIN ≥ VR + VDROPOUT and VIN ≥ 2.7V for IL = 0.1mA to I OUT MAX. DS21363B-page 2 2002 Microchip Technology Inc. TC1174 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1. TABLE 2-1: PIN FUNCTION TABLE Pin No. (8-Pin SOIC) (8-Pin MSOP) Symbol 1 VOUT Regulated voltage output. 2 GND Ground terminal. Description 3 NC No connect. 4 ADJ Output voltage adjust terminal. Output voltage setting is programmed with a resistor divider from VOUT to this input. A capacitor may also be added to this input to reduce output noise. 5 Bypass Reference bypass input. Connecting a 470pF to this input further reduces output noise. 6 SHDN Shutdown control input. The regulator is fully enabled when a logic high is applied to this input. The regulator enters shutdown when a logic low is applied to this input. During shutdown, output voltage falls to zero and supply current is reduced to 0.05µA (typical). 7 NC No connect. 8 VIN Unregulated supply input. 2002 Microchip Technology Inc. DS21363B-page 3 TC1174 3.0 DETAILED DESCRIPTION 3.1 Bypass Input The TC1174 is an adjustable low drop-out regulator. Unlike bipolar regulators, the TC1174’s supply current does not increase with load current. In addition, VOUT remains stable and within regulation over the entire 0mA to IOUTMAX operating load current range, (an important consideration in RTC and CMOS RAM battery back-up applications). A 470pF capacitor connected from the Bypass input to ground reduces noise present on the internal reference, which in turn significantly reduces output noise. If output noise is not a concern, this input may be left unconnected. Larger capacitor values may be used, but results in a longer time period to rated output voltage when power is initially applied. Figure 3-1 shows a typical application circuit. The regulator is enabled any time the shutdown input (SHDN) is at or above VIH, and shutdown (disabled) when SHDN is at or below VIL. SHDN may be controlled by a CMOS logic gate, or I/O port of a microcontroller. If the SHDN input is not required, it should be connected directly to the input supply. While in shutdown, supply current decreases to 0.05µA (typical), VOUT falls to zero. 3.2 FIGURE 3-1: TYPICAL APPLICATION CIRCUIT 1 VOUT + C1 1µF R1 470K R2 470K 2 VOUT VIN NC GND 8 + + Battery TC1174 3 4 NC ADJ SHDN C2 1µF 7 6 Bypass 5 Shutdown Control (from Power Control Logic) CBYPASS 470pF (Optional) – Output Capacitor A 1µF (min) capacitor from VOUT to ground is required. The output capacitor should have an effective series resistance greater than 0.1Ω and less than 5.0Ω. A 1µF capacitor should be connected from VIN to GND if there is more than 10 inches of wire between the regulator and the AC filter capacitor, or if a battery is used as the power source. Aluminum electrolytic or tantalum capacitor types can be used. (Since many aluminum electrolytic capacitors freeze at approximately -30°C, solid tantalums are recommended for applications operating below -25°C.) When operating from sources other than batteries, supply-noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques. 3.3 Adjust Input The output voltage setting is determined by the values of R1 and R2 (Figure 3-1). The ohmic values of these resistors should be between 470K and 3M to minimize bleeder current. The output voltage setting is calculated using the following equation. EQUATION 3-1: VOUT = VREF x [ R1 + 1] R2 The voltage adjustment range of the TC1174 is from VREF to (VIN – 0.05V). DS21363B-page 4 2002 Microchip Technology Inc. TC1174 4.0 THERMAL CONSIDERATIONS 4.1 Thermal Shutdown Integrated thermal protection circuitry shuts the regulator off when die temperature exceeds 150°C. The regulator remains off until the die temperature drops to approximately 140°C. 4.2 Power Dissipation EQUATION 4-2: PDMAX = (TJMAX – TAMAX) θJA Where all terms are previously defined. Equation 4-1 can be used in conjunction with Equation 4-2 to ensure regulator thermal operation is within limits. For example: Given: The amount of power the regulator dissipates is primarily a function of input and output voltage, and output current. The following equation is used to calculate worst case actual power dissipation: VINMAX = 3.0V + 10% VOUTMIN = 2.7V – 0.5% ILOADMAX = 250mA = 125°C TJMAX = 55°C TAMAX 8-Pin MSOP Package EQUATION 4-1: PD ≈ (VINMAX – VOUTMIN)ILOADMAX Where: PD VINMAX VOUTMIN ILOADMAX = Worst case actual power dissipation = Maximum voltage on V IN = Minimum regulator output voltage = Maximum output (load) current The maximum allowable power dissipation (Equation 4-2) is a function of the maximum ambient temperature (TAMAX), the maximum allowable die temperature (TJMAX) and the thermal resistance from junction-to-air (θJA). The 8-Pin SOIC package has a θJA of approximately 160°C/Watt, while the 8-Pin MSOP package has a θJA of approximately 200°C/Watt. Find: 1. Actual power dissipation 2. Maximum allowable dissipation Actual power dissipation: PD ≈ (VINMAX – VOUTMIN)ILOADMAX = [(3.0 x 1.1) – (2.7 x .995)]250 x 10–3 = 155mW Maximum allowable power dissipation: PDMAX = (TJMAX – TAMAX) θJA = (125 – 55) 200 = 350mW In this example, the TC1174 dissipates a maximum of 155mW; below the allowable limit of 350mW. In a similar manner, Equation 4-1 and Equation 4-2 can be used to calculate maximum current and/or input voltage limits. For example, the maximum allowable VIN is found by substituting the maximum allowable power dissipation of 350mW into Equation 4-1, from which VINMAX = 4.1V. 4.3 Layout Considerations The primary path of heat conduction out of the package is via the package leads. Therefore, layouts having a ground plane, wide traces at the pads, and wide power supply bus lines combine to lower θJA and therefore increase the maximum allowable power dissipation limit. 2002 Microchip Technology Inc. DS21363B-page 5 TC1174 5.0 TYPICAL CHARACTERISTICS Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 2.00 10.0 RLOAD = 50Ω COUT = 1µF 1.80 LOAD REGULATION (%) 0.010 0.008 NOISE (µV/√HZ) LINE REGULATION (%) Load Regulation Output Noise Line Regulation 0.012 0.006 0.004 0.002 1.0 0.1 0.000 -0.002 1.40 1 to 300mA 1.20 1.00 0.80 0.60 1 to 100mA 0.40 1 to 50mA 0.20 0.0 0.01 -0.004 -40° -20° 0° 20° 40° 60° 80° 100° 120° 0.01 TEMPERATURE (°C) Supply Current 60.0 50.0 TEMPERATURE (°C) VOUT vs. Temperature 3.075 85°C C 0.30 70°C 0.25 VIN = 4V ILOAD = 100µA CLOAD = 3.3µF 3.025 VOUT (V) DROPOUT VOLTAGE (V) 70.0 0.00 -40° -20° 0° 20° 40° 60° 80° 100° 120° 1000 125°C 0.35 80.0 100 Dropout Voltage vs. Load Current 0.40 90.0 10 1 FREQUENCY (kHz) 100.0 SUPPLY CURRENT (µA) 1.60 25°C 0.20 0°C C 0.15 2.975 0.10 -40°C 0.05 40.0 -40° -20° 0° 20° 40° 60° 80° 100° 120° TEMPERATURE (°C) DS21363B-page 6 0.00 0 50 100 150 200 LOAD CURRENT (mA) 250 300 2.925 -40° -20° 0° 20° 40° 60° 80° 100° 120° TEMPERATURE (°C) 2002 Microchip Technology Inc. TC1174 6.0 PACKAGING INFORMATION 6.1 Package Marking Information Package marking data not available at this time. 6.2 Taping Form Component Taping Orientation for 8-Pin MSOP Devices User Direction of Feed PIN 1 W P Standard Reel Component Orientation for TR Suffix Device Carrier Tape, Number of Components Per Reel and Reel Size Package 8-Pin MSOP Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 12 mm 8 mm 2500 13 in Component Taping Orientation for 8-Pin SOIC (Narrow) Devices User Direction of Feed PIN 1 W P Standard Reel Component Orientation for TR Suffix Device Carrier Tape, Number of Components Per Reel and Reel Size Package 8-Pin SOIC (N) 2002 Microchip Technology Inc. Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 12 mm 8 mm 2500 13 in DS21363B-page 7 TC1174 6.3 Package Dimensions 8-Pin MSOP PIN 1 .122 (3.10) .114 (2.90) .197 (5.00) .189 (4.80) .026 (0.65) TYP. .122 (3.10) .114 (2.90) .043 (1.10) MAX. .016 (0.40) .010 (0.25) .008 (0.20) .005 (0.13) 6° MAX. .006 (0.15) .002 (0.05) .028 (0.70) .016 (0.40) Dimensions: inches (mm) 8-Pin SOIC PIN 1 .157 (3.99) .150 (3.81) .244 (6.20) .228 (5.79) .050 (1.27) TYP. .197 (5.00) .189 (4.80) .069 (1.75) .053 (1.35) .020 (0.51) .010 (0.25) .013 (0.33) .004 (0.10) .010 (0.25) .007 (0.18) 8° MAX.. .050 (1.27) .016 (0.40) Dimensions: inches (mm) DS21363B-page 8 2002 Microchip Technology Inc. TC1174 SALES AND SUPPORT Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. 2002 Microchip Technology Inc. DS21363B-page 9 TC1174 NOTES: DS21363B-page 10 2002 Microchip Technology Inc. TC1174 Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. 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