MOLEX 73656-1000

This document was generated on 05/14/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number:
Status:
Overview:
Description:
0736561000
Active
hdm
2.00mm (.079") Pitch HDM® Board-to-Board Backplane Power Module, Vertical, SMC,
Power Receptacle, 3 Circuits, Gold (Au) 0.76µm (30µ")
Documents:
3D Model
Drawing (PDF)
Product Specification PS-73670-9999 (PDF)
RoHS Certificate of Compliance (PDF)
Series
image - Reference only
General
Product Family
Series
Application
Comments
Component Type
Overview
Product Name
Style
Backplane Connectors
73656
Backplane
Midplane Power Module
Power Header
hdm
HDM®
N/A
Physical
Circuits (Loaded)
Circuits (maximum)
Color - Resin
Durability (mating cycles max)
First Mate / Last Break
Guide to Mating Part
Keying to Mating Part
Material - Metal
Material - Plating Mating
Material - Plating Termination
Material - Resin
Number of Columns
Number of Pairs
Number of Rows
Orientation
PC Tail Length (in)
PC Tail Length (mm)
PCB Locator
PCB Retention
PCB Thickness Recommended (in)
PCB Thickness Recommended (mm)
Packaging Type
Pitch - Mating Interface (in)
Pitch - Mating Interface (mm)
Plating min: Mating (µin)
Plating min: Mating (µm)
Plating min: Termination (µin)
Plating min: Termination (µm)
Polarized to PCB
Stackable
Surface Mount Compatible (SMC)
Temperature Range - Operating
Termination Interface: Style
Electrical
3
3
Black
250
No
No
None
Beryllium Copper
Gold
Gold
High Temperature Thermoplastic
1
Open Pin Field
3
Vertical
0.138 In
3.50 mm
No
Yes
0.098 In
2.50 mm
Tube
0.000 In
0.00 mm
30
0.75
2
0.05
Yes
No
No
-55°C to +105°C
Through Hole - Compliant Pin
EU RoHS
China RoHS
ELV and RoHS
Compliant
REACH SVHC
Contains SVHC: No
Halogen-Free
Status
Halogen-Free
Need more information on product
environmental compliance?
Email [email protected]
For a multiple part number RoHS Certificate of
Compliance, click here
Please visit the Contact Us section for any
non-product compliance questions.
Search Parts in this Series
73656Series
Mates With
73651 HDM® Board-to-Board
Daughterboard Power Module
Application Tooling | FAQ
Tooling specifications and manuals are
found by selecting the products below.
Crimp Height Specifications are then
contained in the Application Tooling
Specification document.
Global
Description
Product #
HDM® Backplane
0622005711
Power Module
Loading Heads
Current - Maximum per Contact
Data Rate
Shielded
Voltage - Maximum
15A
1.0 Gbps
No
500V AC
Material Info
Reference - Drawing Numbers
Application Specification
AS-73656-1998
Packaging Specification
PK-70873-0819
Product Specification
PS-73670-9999
Sales Drawing
SDA-73656-*00*
HDM and High Density Metric are trademarks of Amphenol Corporation
This document was generated on 05/14/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION