0.75mm (.030”) Pitch AMC.0 B+ 170-Circuit Connectors FEATURES AND SPECIFICATIONS AMC.0 B+ connectors from Molex support the next generation of mezzanine card standards and 12.5 Gbps speeds The 170-circuit AMC.0 B+, or AdvancedMCTM connectors from Molex support the next generation of mezzanine card standards that allow for hot-plugging of high-speed serial interconnects. These connectors support AdvancedTCA (Advanced Telecommunications Computing Architecture), a standard developed by PICMG (PCI Industrial Computer Manufacturers Group). Molex AMC.0 B+ connectors feature controlled impedance and reduced crosstalk, plus a footprint launch optimized for high-speed data rates. This design enables the connector to achieve 12.5 Gbps NRZ (Non Return to Zero) signal transmission. This enhanced footprint further reduces crosstalk by managing inter-pair affinity and incorporating additional ground vias for isolation. As a result, the AMC.0 B+ connectors achieve crosstalk of less than 3 percent at 12.5 Gbps. 75800 Standard 75908 Pegless 75791 Extended Height Three versions of the Molex AMC.0 B+ connector exist: the standard connector with locating pegs (series 75800), connector without pegs (series 75908) and the 1.15mm (.045”) extended-height connector (series 75791). This taller height is optimized for blade-server applications where cooling is critical. Series 75800 Standard AMC.0 B+ Connector Features and Benefits n Insert-molded wafer design provides excellent electrical performance n Press-fit contacts and high-speed footprint for simpler application to PCB and superior signal integrity than competition n T in or Tin-Lead tail plating supports RoHS requirements and customer preferences for press-fit n M eets PICMG Advanced MCTM specification and industry standard requirements SPECIFICATIONS Reference Information Packaging: Tray UL File No.: E29179 CSA File No.: LR19980 Mates With: AMC module Designed In: Millimeters Electrical Voltage: 250V AC Current: 1.5A Power Terminal 1.0A Other Terminals Contact Resistance: 60 milliohms max. Dielectric Withstanding Voltage: 80V RMS Insulation Resistance: 500V DC Mechanical Insertion Force to PCB: 6050N (1360 lbf) max. Mating Force: 100N (22 lbf) max. Unmating Force: 65N (14 lbf) max. Durability: 200 cycles Physical Housing: Black Thermoplastic Contact: Copper (Cu) Alloy Plating: Contact Area — 0.76μm Gold (Au) Solder Tail Area — Tin or Tin-Lead (Sn or Sn/Pb) Underplating — Nickel (Ni) PCB Thickness: 2.36mm (.092”) Operating Temperature: -40 to +105ºC 0.75mm (.030”) Pitch AMC.0 B+ 170-Circuit Connectors applications 75800 Standard 75908 Pegless 75791 Extended Height n Telecommunications equipment n For use in the IEEE 1386 market as it transitions to serial buses n General “blade” computing applications n Extended-height version used in non-ATCA applications n Any hot-pluggable high-speed serial bus application ATCA Carrier ATCA Rack ORDERING INFORMATION Order No. Comment Tail Plating Height PCB Peg 75800-0001 With alignment pegs Tin plated 21.85mm (.860”) Yes 75800-0002 With alignment pegs Tin/Lead plated 21.85mm (.860”) Yes 75908-0001 Without alignment pegs Tin plated 21.85mm (.860”) No 75908-0002 Without alignment pegs Tin/Lead plated 21.85mm (.860”) No 75791-0001 Extended height Tin plated 23.0mm (.905”) Yes 75791-0002 Extended height Tin/Lead plated 23.0mm (.905”) Yes Americas Headquarters Lisle, Illinois 60532 U.S.A. 1-800-78MOLEX [email protected] Order No. 987650-0651 Asia Pacific North Headquarters Yamato, Kanagawa, Japan 81-462-65-2324 [email protected] Asia Pacific South Headquarters Jurong, Singapore 65-6268-6868 [email protected] Visit our website at www.molex.com Printed in USA/JI/2007.01 European Headquarters Munich, Germany 49-89-413092-0 [email protected] Corporate Headquarters 2222 Wellington Ct. Lisle, IL 60532 U.S.A. 630-969-4550 Fax:630-969-1352 ©2007, Molex