TI LM318

The LM118 and LM218 are
obsolete and are no longer supplied.
SLOS063B – JUNE 1976 – REVISED DECEMBER 2002
D Small Signal Bandwidth . . . 15 MHz Typ
D Slew Rate . . . 50 V/µs Min
D Bias Current . . . 250 nA Max (LM118,
D
D
D
D
LM118 . . . JG PACKAGE
LM218 . . . D OR P PACKAGE
LM318 . . . D, P, OR PS PACKAGE
(TOP VIEW)
LM218)
Supply Voltage Range . . . ±5 V to ±20 V
Internal Frequency Compensation
Input and Output Overload Protection
Same Pin Assignments as
General-Purpose Operational Amplifiers
BAL/COMP1
IN–
IN+
VCC–
1
8
2
7
3
6
4
5
COMP2
VCC+
OUT
BAL/COMP3
LM118 . . . FK PACKAGE
(TOP VIEW)
NC
BAL/COMP1
NC
COMP2
NC
description/ordering information
The LM118, LM218, and LM318 are precision,
fast operational amplifiers designed for
applications requiring wide bandwidth and high
slew rate. They feature a factor-of-ten increase in
speed over general-purpose devices without
sacrificing dc performance.
NC
IN–
NC
IN+
NC
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
NC
VCC+
NC
OUT
NC
NC
VCC–
NC
BAL/COMP3
NC
These operational amplifiers have internal
unity-gain frequency compensation. This
considerably simplifies their application because
no external components are necessary for
operation. However, unlike most internally
compensated amplifiers, external frequency
compensation may be added for optimum
performance.
For
inverting
applications,
feed-forward compensation boosts the slew rate
to over 150 V/µs and almost double the
bandwidth. Overcompensation can be used with
the amplifier for greater stability when maximum
bandwidth is not needed. Further, a single
capacitor can be added to reduce the settling time
for 0.1% error band to under 1 µs.
4
NC – No internal connection
The high speed and fast settling time of these operational amplifiers make them useful in A/D converters,
oscillators, active filters, sample-and-hold circuits, and general-purpose amplifiers.
ORDERING INFORMATION
TA
VIOmax
AT 25°C
PACKAGE†
PDIP (P)
0°C to 70°C
10 mV
SOIC (D)
ORDERABLE
PART NUMBER
Tube of 50
LM318P
Tube of 75
LM318D
Reel of 2500
LM318DR
TOP-SIDE
MARKING
LM318P
LM318
SOP (PS)
Reel of 2000
LM318PSR
LM18
† Package drawings, standard packing quantities, thermal data, symboliztion, and PCB design guidelines are
available at www.ti.com/sc/package.
Copyright  2002, Texas Instruments Incorporated
!"# $"%&! '#(
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'' +,( '"! $!# - '# #!# &, !&"'#
# - && $## (
$'"! !$& .. && $## # # #'
"&#
)#+ # #'( && )# $'"! $'"!
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POST OFFICE BOX 655303
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1
The LM118 and LM218 are
obsolete and are no longer supplied.
SLOS063B – JUNE 1976 – REVISED DECEMBER 2002
symbol
BAL/COMP1
COMP2
BAL/COMP3
IN+
IN–
1
8
5
3
+
2
6
OUT
–
Pin numbers shown are for the D, JG, P, and PS packages.
schematic
BAL/COMP3
COMP2
BAL/COMP1
VCC+
2 kΩ
150 kΩ
2 kΩ
5 kΩ
100 pF
20 kΩ
5 kΩ
13 Ω
20 kΩ
25 Ω
3.5 kΩ
6 pF
IN–
1 kΩ
OUT
33 Ω
1 kΩ
28 pF
5 kΩ
50 Ω
1.7 kΩ
4 kΩ
IN+
30 Ω
500 Ω
1.2 kΩ
5.6 kΩ
20 kΩ
110 Ω
1.2 kΩ
30 Ω
VCC–
Component values shown are nominal.
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
The LM118 and LM218 are
obsolete and are no longer supplied.
SLOS063B – JUNE 1976 – REVISED DECEMBER 2002
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage: VCC+ (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 V
VCC– (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –20 V
Input voltage, VI (either input, see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±15 V
Differential input current, VID (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±10 V
Duration of output short circuit (see Note 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Unlimited
Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Package thermal impedance, θJA (see Notes 5 and 6): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97°C/W
P package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85°C/W
PS package . . . . . . . . . . . . . . . . . . . . . . . . . . . 95°C/W
Package thermal impedance, θJC (see Notes 7 and 8): FK package . . . . . . . . . . . . . . . . . . . . . . . . . 5.61°C/W
JG package . . . . . . . . . . . . . . . . . . . . . . . . . 14.5°C/W
Case temperature for 60 seconds: FK package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds: JG package . . . . . . . . . . . . . . . . . . . . 300°C
Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds: D, P, PS, or PW package . . . . . . . . 260°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, unless otherwise noted, are with respect to the midpoint between VCC+ and VCC–.
2. The magnitude of the input voltage must never exceed the magnitude of the supply voltage or 15 V, whichever is less.
3. The inputs are shunted with two opposite-facing base-emitter diodes for overvoltage protection. Therefore, excessive current flows
if a different input voltage in excess of approximately 1 V is applied between the inputs unless some limiting resistance is used.
4. The output can be shorted to ground or either power supply. For the LM118 and LM218 only, the unlimited duration of the short circuit
applies at (or below) 85°C case temperature or 75°C free-air temperature.
5. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperautre is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
6. The package thermal impedance is calculated in accordance with JESD 51-7.
7. Maximum power dissipation is a function of TJ(max), θJC, and TC. The maximum allowable power dissipation at any allowable
ambient temperautre is PD = (TJ(max) – TC)/θJC. Operating at the absolute maximum TJ of 150°C can affect reliability.
8. The package thermal impedance is calculated in accordance with MIL-STD-883.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
The LM118 and LM218 are
obsolete and are no longer supplied.
SLOS063B – JUNE 1976 – REVISED DECEMBER 2002
electrical characteristics at specified free-air temperature (see Note 5)
TEST
CONDITIONS†
PARAMETER
LM118, LM218
TA‡
MIN
LM318
TYP
MAX
2
4
25°C
MIN
TYP
MAX
4
10
VIO
Inp t offset voltage
Input
oltage
VO = 0
Full range
IIO
Inp t offset ccurrent
Input
rrent
VO = 0
Full range
IIB
Input bias current
VO = 0
VICR
Common-mode input voltage range
±11.5
VOM
VCC± = ±15 V
VCC± = ±15 V,
RL = 2 kΩ
Full range
Maximum peak output voltage
swing
Full range
±12
±13
±12
±13
Large signal differential
Large-signal
voltage amplification
VCC± = ±15 V,
VO = ±10 V
V,
RL ≥ 2 kΩ
25°C
50
200
25
200
AVD
Full range
25
B1
ri
Unity-gain bandwidth
VCC± = ±15 V
25°C
25°C
1*
3
CMRR
Common-mode rejection ratio
VIC = VICRmin
Full range
80
100
kSVR
Supply-voltage rejection ratio
(∆VCC/∆VIO)
Full range
70
80
6
25°C
6
15
50
30
120
300
250
Full range
mV
200
100
25°C
UNIT
150
nA
500
500
750
±11.5
nA
V
V
V/mV
Input resistance
20
15
15
MHz
0.5
3
MΩ
70
100
dB
65
80
dB
ICC
Supply current
VO = 0, No load
25°C
5
8
5
* On products compliant to MIL-STD-883, Class B, this parameter is not production tested.
† All characteristics are measured under open-loop conditions with common-mode input voltage, unless otherwise specified.
‡ Full range for LM118 is –55°C to 125°C, full range for LM218 is –25°C to 85°C, and full range for LM318 is 0°C to 70°C.
NOTE 9: Unless otherwise noted, VCC = ±5 V to ±20 V. All typical values are at VCC± = ±15 V and TA = 25°C.
10
mA
operating characteristics, VCC± = ±15 V, TA = 25°C
PARAMETER
SR
TEST CONDITIONS
∆VI = 10 V,
Slew rate at unity gain
CL = 100 pF,
See Figure 1
MIN
TYP
50*
70
MAX
V/µs
* On products compliant to MIL-STD-883, Class B, this parameter is not production tested.
PARAMETER MEASUREMENT INFORMATION
10 V
2 kΩ
Input
0V
2 kΩ
Input
–
Output
+
1 kΩ
100 pF
10 V
90%
Output
∆VO
10%
0V
tt
SR +
TEST CIRCUIT
VOLTAGE WAVEFORMS
Figure 1. Slew Rate
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
UNIT
DV
O
tt
PACKAGE OPTION ADDENDUM
www.ti.com
9-Feb-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
JM38510/10107BPA
LM118FKB
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
Package
Type
Package
Drawing
OBSOLETE
CDIP
JG
8
TBD
Call TI
Call TI
OBSOLETE
LCCC
FK
20
TBD
Call TI
Call TI
LM118JG
OBSOLETE
CDIP
JG
8
TBD
Call TI
Call TI
LM118JGB
OBSOLETE
CDIP
JG
8
TBD
Call TI
Call TI
LM318D
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LM318DE4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LM318DR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LM318DRE4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LM318P
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
LM318PE4
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
LM318PSR
ACTIVE
SO
PS
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LM318PSRE4
ACTIVE
SO
PS
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MCER001A – JANUARY 1995 – REVISED JANUARY 1997
JG (R-GDIP-T8)
CERAMIC DUAL-IN-LINE
0.400 (10,16)
0.355 (9,00)
8
5
0.280 (7,11)
0.245 (6,22)
1
0.063 (1,60)
0.015 (0,38)
4
0.065 (1,65)
0.045 (1,14)
0.310 (7,87)
0.290 (7,37)
0.020 (0,51) MIN
0.200 (5,08) MAX
Seating Plane
0.130 (3,30) MIN
0.023 (0,58)
0.015 (0,38)
0°–15°
0.100 (2,54)
0.014 (0,36)
0.008 (0,20)
4040107/C 08/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a ceramic lid using glass frit.
Index point is provided on cap for terminal identification.
Falls within MIL STD 1835 GDIP1-T8
POST OFFICE BOX 655303
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MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
18
17
16
15
14
13
NO. OF
TERMINALS
**
12
19
11
20
10
A
B
MIN
MAX
MIN
MAX
20
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
28
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
9
22
8
44
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
23
7
52
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
24
6
68
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
84
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
B SQ
A SQ
25
5
26
27
28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140 / D 10/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a metal lid.
The terminals are gold plated.
Falls within JEDEC MS-004
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MECHANICAL DATA
MPDI001A – JANUARY 1995 – REVISED JUNE 1999
P (R-PDIP-T8)
PLASTIC DUAL-IN-LINE
0.400 (10,60)
0.355 (9,02)
8
5
0.260 (6,60)
0.240 (6,10)
1
4
0.070 (1,78) MAX
0.325 (8,26)
0.300 (7,62)
0.020 (0,51) MIN
0.015 (0,38)
Gage Plane
0.200 (5,08) MAX
Seating Plane
0.010 (0,25) NOM
0.125 (3,18) MIN
0.100 (2,54)
0.021 (0,53)
0.015 (0,38)
0.430 (10,92)
MAX
0.010 (0,25) M
4040082/D 05/98
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-001
For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm
POST OFFICE BOX 655303
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