TC1232 Microprocessor Monitor Features General Description • Precision Voltage Monitor - Adjustable +4.5V or +4.75V • Reset Pulse Width – 250 msec minimum • No External Components • Adjustable Watchdog Timer - 150 msec, 600 msec or 1.2 sec • Operating Voltage 4.0V to 5.5V • Debounced Manual Reset Input for External Override The TC1232 is a fully-integrated processor supervisor that provides three important functions to safeguard processor sanity: precision power on/off reset control, watchdog timer and external reset override. On power-up, the TC1232 holds the processor in the reset state for a minimum of 250 msec after VCC is within tolerance to ensure a stable system start-up. Microprocessor sanity is monitored by the onboard watchdog circuit. The microprocessor must provide a periodic low-going signal on the ST input. Should the processor fail to supply this signal within the selected time-out period (150 msec, 600 msec or 1200 msec), an out-of-control processor is indicated and the TC1232 issues a processor reset as a result. Block Diagram VCC RST Tolerance Select (5% or 10%) TOL + – + + VREF – PB RST Debounce TD Watchdog Timebase Select The outputs of the TC1232 are immediately driven active when the PB input is brought low by an external push button switch or other electronic signal. When connected to a push button switch, the TC1232 provides contact debounce. RST The TC1232 is packaged in a space-saving 8-Pin PDIP or SOIC package, a 16-Pin SOIC (wide) package and requires no external components. Reset Generator Watchdog Timer ST Package Types 8-Pin PDIP 8 VCC PB RST 1 TD 2 TOL 3 8-Pin SOIC TC1232 PB RST 1 8 VCC TD 2 7 ST TOL 3 6 RST GND 4 5 RST 7 ST 6 RST 5 GND 4 16-Pin SOIC (Wide) RST TC1232 TC1232 NC PB RST NC TD NC TOL NC GND 1 2 3 4 5 6 7 8 TC1232 16 15 14 13 12 11 10 9 NC VCC NC ST NC RST NC RST Device Features RST pin Device Type TC1232 Open-drain RST pin Pull-up Active Resistor Level External © 2005 Microchip Technology Inc. Low Type Push-pull Minimum WDI Input Trip Points Reset MR Typical Active (Max) Active Time Input Timeouts (ms) Level (ms) High Preliminary 4.75V or 4.5V 250 150, 600 or 1200 Yes DS21370C-page 1 TC1232 1.0 ELECTRICAL CHARACTERISTICS † Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings† Voltage on Any Pin (With Respect to GND) ...................................................... -0.3V to +5.8V Operating Temperature Range: C-Version ........................................ 0°C to +70°C E-Version......................................-40°C to +85°C Storage Temperature Range: ............-65°C to +150°C DC CHARACTERISTICS Electrical Specifications: Unless otherwise noted, TA = TMIN to TMAX; VCC = +4.0V to 5.5V. Parameters Sym Min Typ Max Units Supply Voltage VCC 4.0 5.0 5.5 V ST and PB RST Input High Level VIH 2.0 — VCC +0.3 V ST and PB RST Input Low Level VIL -0.3 — +0.8 V IL -1.0 — +1.0 µA Output Current RST IOH -1.0 -12 — mA VOH = 2.4V Current RST, RST IOL 2.0 10 — mA VOL = 0.4V Operating Current ICC — 50 200 µA Note 2 VCC 5% Trip Point VCCTP 4.50 4.62 4.74 V TOL = GND (Note 3) VCC 10% Trip Point VCCTP 4.25 4.37 4.49 V TOL = VCC (Note 3) Input Leakage ST, TOL Conditions Note 1 Capacitance Electrical Characteristics: Unless otherwise noted, TA = +25°C. (Note 4) Input Capacitance ST, TOL Output Capacitance RST, RST Note 1: 2: 3: 4: CIN — — 5 pF COUT — — 7 pF PB RST is internally pulled up to VCC with an internal impedance of typically 40 kΩ. Measured with outputs open. All voltages referenced to GND. Ensured by design. DS21370C-page 2 Preliminary © 2005 Microchip Technology Inc. TC1232 tF VCC tR +4.75V +4.75V +4.25V +4.25V VCC VCC = 5V 4.6V (5% Trip Point) +4.5V (5% Trip Point) 4.5V(10% Trip Point) +4.25V (10% Trip Point) VCC tRPU tRPD RST RST RST Determined by external Pull-up resistor FIGURE 1-1: VOH VOH VOL Determined by external Pull-up resistor VOL RST Rise Time, Fall Time and Reset Detected to Reset Active Timing Waveforms. AC CHARACTERISTICS Electrical Specifications: Unless otherwise noted, TA = TMIN to TMAX; VCC = +4.0V to 5.5V. Parameters VCC Fall Time VCC Rise Time Sym Min Typ Max Units Conditions tF 10 — — µs Note 1 tR 0 — — µs Note 1 VCC Trip Point Detected to RST High and RST Low tRPD — — 100 ns VCC falling VCC Trip Point Detected to RST High and RST Open tRPU 250 610 1000 ms VCC rising (Note 2) Note 1: 2: Ensured by design. tR = 5 µs. © 2005 Microchip Technology Inc. Preliminary DS21370C-page 3 TC1232 tPB ST tTD tST tPBD PB RST VIH VIL RST (when tTD ≤ tTD (min)) tRST “H” RST (when tTD(min) ≤ tTD ≤ tTD(max)) RST RST RST (when tTD ≥ tTD(max)) The debounced PB RST input ignores input pulses less than 1 ms and is designed to recognize pulses of 20 ms or greater. RST (when tTD ≤ tTD(min)) “L” RST (when tTD(min) ≤ tTD ≤ tTD(max)) RST (when tTD ≥ tTD(max)) FIGURE 1-2: Push Button Reset and Watchdog Timer Reset Timing Waveforms. AC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise noted, TA = TMIN to TMAX; VCC = +4.0V to 5.5V. Parameters Sym Min Typ Max Units PB RST Pulse Width tPB 20 — — ms PB RST Falling Edge Low to Reset Active tPBD 1 4 20 ms PB RST Rising Edge High to Reset Inactive tRST 250 610 1000 ms ST Pulse Width tST 20 — — ns ST Time-out Period tTD 62.5 150 250 ms TD Pin = 0V 250 600 1000 ms TD Pin = Open 500 1200 2000 ms TD Pin = VCC Note 1: Conditions Note 1 PB RST must be held low for a minimum of 20 ms to ensure a reset. DS21370C-page 4 Preliminary © 2005 Microchip Technology Inc. TC1232 2.0 TYPICAL PERFORMANCE CURVES Performance Graphs are not available. © 2005 Microchip Technology Inc. Preliminary DS21370C-page 5 TC1232 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLES Pin No. Buffer/ Pin 8-pin Symbol Driver 16-pin Type PDIP, Type SOIC SOIC Function 1 2 PB RST I ST Push-button Reset Input. Input for a Manual Reset Switch. This input debounces (ignores) pulses less than 1 ms in duration and is ensured to recognize inputs of 20 ms or greater. L = Manual Reset Switch is Active, Force RST/RST pins Active H = Manual Reset Switch is Inactive. State of RST/RST pins determined by other system conditions. 2 4 TD I ST Time Delay Input. The voltage level on this input determines the watchdog timer time-out period. TD = 0V → tTD = 150 ms TD = Open → tTD = 600 ms TD = VCC → tTD = 1.2 sec 3 6 TOL I ST Tolerance Input. TOL = GND, Max Voltage Trip Point (VCCTP) = 4.75V (5% tolerance) TOL = VCC, Max Voltage Trip Point (VCCTP) = 4.5V (10% tolerance) 4 8 GND — P 5 9 RST O Push Pull Reset Output (Active-High) Goes active (High) if one of these conditions occurs: 1. If VCC falls below the selected reset voltage threshold. 2. If PB RST pin is forced low. 3. If ST pin is not strobed within the minimum selected time-out period. (see TD pin) 4. During power-up 6 11 RST O Open Drain Reset Output (Active-Low) Goes active (Low) if one of these conditions occurs: 1. If VCC falls below the selected reset voltage threshold. 2. If PB RST pin is forced low. 3. If ST pin is not strobed within the minimum selected time-out period. (see TD pin) 4. During power-up 7 13 ST I ST 8 15 VCC — P The positive supply (+5V) for the device. — 1,3,5, 7,10,1 2,16 NC — — No internal connection. DS21370C-page 6 The ground reference for the device. Strobe Input Input for Watchdog Timer. WDT period determined by state of TD pin Falling Edge → Resets Watchdog Timer counter (no time-out) Preliminary © 2005 Microchip Technology Inc. TC1232 4.0 OPERATIONAL DESCRIPTION 4.1 Power Monitor VCC = 5V +4.5V (5% Trip Point) The TC1232 provides the function of warning the processor of a power failure. When VCC is detected as being below the voltage levels defined by the TOL pin, the TC1232’s comparator outputs the RST and RST signals to a logic level that warns the system of an outof-tolerance power supply. The RST and RST signals switch at a threshold value of 4.5V if TOL is tied to VCC, and at a value of 4.75 volts if TOL is grounded. The RST and RST signals are held active for a minimum of 250 ms to ensure that the power supply voltage has been stabilized. +4.25V (10% Trip Point) tRPD RST VOH RST Figure 4-1 shows the VCC fall time. Figure 4-2 shows the VCC rise time. VOL VCC SLEW RATE = 1.66 mV/µs (0.5V/300 µs) Figure 4-3 shows the time from when the voltage trip point is detected to the reset output pin going active. Figure 4-4 shows the time from when the voltage trip point is exited to the reset output pin going inactive. FIGURE 4-3: VCC Detect Reset Output Delay (Power-Down). 4.6V (5% Trip Point) tF VCC 4.5V(10% Trip Point) +4.75V VCC +4.25V tRPU RST VOH FIGURE 4-1: Power-Down Slew Rate. RST VOL FIGURE 4-4: VCC Detect Reset Output Delay (Power-Up). tR +4.75V +4.25V VCC FIGURE 4-2: Power-up Slew Rate. © 2005 Microchip Technology Inc. Preliminary DS21370C-page 7 TC1232 4.2 Push Button Reset Input +5V The debounced manual reset input (PB RST) manually forces the reset outputs into their active states. Figure 4-5 shows a block diagram for using the TC1232 with a push button switch. VCC Once PB RST has been low for a time tPBD (the pushbutton delay time), the reset outputs go active. The reset outputs remain in their active states for a minimum of 250 ms after PB RST rises above VIH. Figure 4-6 shows a waveform for the push button switch input and the reset pins output. A mechanical push button or active logic signal can drive the PB RST input. The debounced input ignores input pulses less than 1 ms and recognizes pulses of 20 ms or greater. No external pull-up resistor is required because the PB RST input has an internal pull-up to VCC of approximately 100 µA. TD ST PB RST TC1232 I/O Microprocessor RST Reset GND TOL FIGURE 4-5: Watchdog Timer. Push Button Reset and tPB PB RST tPBD VIH VIL tRST RST RST The debounced PB RST input ignores input pulses less than 1 ms and is designed to recognize pulses of 20 ms or greater. FIGURE 4-6: PB RST Input. DS21370C-page 8 Preliminary Push Button Reset – © 2005 Microchip Technology Inc. TC1232 4.3 Watchdog Timer When the ST input is not stimulated for a preset time period, the watchdog timer function forces RST and RST signals to the active state. The preset time period is determined by the TD inputs to be 150 ms with TD connected to ground, 600 ms with TD floating or 1200 ms with TD connected to VCC (typ.). The watchdog timer starts timing-out from the set time period as soon as RST and RST are inactive. If a highto-low transition occurs on the ST input pin prior to time-out, the watchdog timer is reset and begins to time-out again. If the watchdog timer is allowed to timeout, the RST and RST signals are driven to the active state for 250 ms, minimum (Figure 4-7). Figure 4-8 shows the expected reset output pin waveforms depending on the period of the ST pin falling edge and the state of the TD input pin. ST RST (when tTD ≤ tTD (min)) TABLE 4-1: WATCHDOG TIMER PERIODS tTD Min Condition Typ Max TD pin = 0V 62.5 ms 150 ms 250 ms TD pin = Open 250 ms 600 ms 1000 ms TD pin = VCC 500 ms 1200 ms 2000 ms “H” RST (when tTD(min) ≤ tTD ≤ tTD(max)) The software routine that strobes ST is critical. The code must be in a section of software that is executed frequently enough so the time between toggles is less than the watchdog time-out period. One common technique controls the microprocessor I/O line from two sections of the program. The software might set the I/O line high while operating in the Foreground mode and set it low while in the Background or Interrupt modes. If both modes do not execute correctly, the watchdog timer issues reset pulses. tTD is the maximum elapsed time between ST high-tolow transitions (ST is activated by falling edges only), which will keep the watchdog timer from forcing the reset outputs active for a time of tRST. tTD is a function of the voltage at the TD pin, as tabulated below: tTD tST RST (when tTD ≥ tTD(max)) RST (when tTD ≤ tTD(min)) “L” RST (when tTD(min) ≤ tTD ≤ tTD(max)) RST (when tTD ≥ tTD(max)) FIGURE 4-8: 4.4 Strobe Input. Supply Monitor Noise Sensitivity The TC1232 is optimized for fast response to negativegoing changes in VDD. Systems with an inordinate amount of electrical noise on VDD (such as systems using relays) may require a 0.01 µF or 0.1 µF bypass capacitor to reduce detection sensitivity. This capacitor should be installed as close to the TC1232 as possible to keep the capacitor lead length short. Figure 4-7 shows a block diagram for using the TC1232 with a PICmicro® MCU and the Watchdog input. +5V 10 kΩ 3-Terminal Regulator (example: MCP1700) +5V 0.1 µF VCC RST TC1232 ST RESET PICmicro® MCU I/O TD TOL GND FIGURE 4-7: Watchdog Timer. © 2005 Microchip Technology Inc. Preliminary DS21370C-page 9 TC1232 5.0 PACKAGING INFORMATION 5.1 Package Marking Information 8-Lead PDIP (300 mil) XXXXXXXX XXXXXNNN YYWW TC1232 I/P256 0518 8-Lead SOIC (150 mil) XXXXXXXX XXXXYYWW NNN XXXXXXXXXXXXX XXXXXXXXXXXXX YYWWNNN Legend: XX...X Y YY WW NNN e3 * DS21370C-page 10 TC1232 e3 CPA^^256 0518 OR Examples: TC1232 COA0518 256 16-Lead SOIC (150 mil) Note: Examples: TC1232E e3 OA^^0518 256 OR Examples: TC1232COE XXXXXXXXXX 0518256 OR e3 TC1232COE^^ XXXXXXXXXX 0518256 Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. Preliminary © 2005 Microchip Technology Inc. TC1232 8-Lead Plastic Dual In-line (PA) – 300 mil (PDIP) E1 D 2 n 1 α E A2 A L c A1 β B1 p eB B Units Dimension Limits n p Number of Pins Pitch Top to Seating Plane Molded Package Thickness Base to Seating Plane Shoulder to Shoulder Width Molded Package Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Row Spacing Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic A A2 A1 E E1 D L c § B1 B eB α β MIN .140 .115 .015 .300 .240 .360 .125 .008 .045 .014 .310 5 5 INCHES* NOM MAX 8 .100 .155 .130 .170 .145 .313 .250 .373 .130 .012 .058 .018 .370 10 10 .325 .260 .385 .135 .015 .070 .022 .430 15 15 MILLIMETERS NOM 8 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 9.14 9.46 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40 5 10 5 10 MIN MAX 4.32 3.68 8.26 6.60 9.78 3.43 0.38 1.78 0.56 10.92 15 15 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-018 © 2005 Microchip Technology Inc. Preliminary DS21370C-page 11 TC1232 8-Lead Plastic Small Outline (OA) – Narrow, 150 mil (SOIC) E E1 p D 2 B n 1 h α 45° c A2 A φ β L Units Dimension Limits n p Number of Pins Pitch Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic A A2 A1 E E1 D h L φ c B α β MIN .053 .052 .004 .228 .146 .189 .010 .019 0 .008 .013 0 0 A1 INCHES* NOM 8 .050 .061 .056 .007 .237 .154 .193 .015 .025 4 .009 .017 12 12 MAX .069 .061 .010 .244 .157 .197 .020 .030 8 .010 .020 15 15 MILLIMETERS NOM 8 1.27 1.35 1.55 1.32 1.42 0.10 0.18 5.79 6.02 3.71 3.91 4.80 4.90 0.25 0.38 0.48 0.62 0 4 0.20 0.23 0.33 0.42 0 12 0 12 MIN MAX 1.75 1.55 0.25 6.20 3.99 5.00 0.51 0.76 8 0.25 0.51 15 15 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-057 DS21370C-page 12 Preliminary © 2005 Microchip Technology Inc. TC1232 16-Lead Plastic Small Outline (OE) – Wide, 300 mil (SOIC) E p E1 D 2 1 n B h α 45° c A2 A φ β L Units Dimension Limits n p Number of Pins Pitch Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic A A2 A1 E E1 D h L φ c B α β MIN .093 .088 .004 .394 .291 .398 .010 .016 0 .009 .014 0 0 A1 INCHES* NOM 16 .050 .099 .091 .008 .407 .295 .406 .020 .033 4 .011 .017 12 12 MAX .104 .094 .012 .420 .299 .413 .029 .050 8 .013 .020 15 15 MILLIMETERS NOM 16 1.27 2.36 2.50 2.24 2.31 0.10 0.20 10.01 10.34 7.39 7.49 10.10 10.30 0.25 0.50 0.41 0.84 0 4 0.23 0.28 0.36 0.42 0 12 0 12 MIN MAX 2.64 2.39 0.30 10.67 7.59 10.49 0.74 1.27 8 0.33 0.51 15 15 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-013 Drawing No. C04-102 © 2005 Microchip Technology Inc. Preliminary DS21370C-page 13 TC1232 NOTES: DS21370C-page 14 Preliminary © 2005 Microchip Technology Inc. TC1232 APPENDIX A: REVISION HISTORY Revision C (June 2005) The following is the list of modifications: 1. 2. 3. 4. Since no data is given in Section 2.0 “Typical Performance Curves”, “Preliminary” was added to the bottom of this document. Corrected Operating Voltage in the Electrical Specifications General Data Sheet Enhancements Added Revision History Appendix Section Revision B (March 2003) • Not logged Revision A (March 2002) • Original Release of this Document. © 2005 Microchip Technology Inc. Preliminary DS21370C-page 15 TC1232 NOTES: DS21370C-page 16 Preliminary © 2005 Microchip Technology Inc. TC1232 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X Examples: /XX Temperature Range Package Device: TC1232: Microprocessor Monitor Temperature Range: C E Package: PA = Plastic DIP (300 mil Body), 8-lead OA = Plastic SOIC, (150 mil Body), 8-lead OA713 = Plastic SOIC, (150 mil Body), 8-lead Tape and Reel OE = Plastic SOIC (300 mil Body), 16-lead OE713 = Plastic SOIC (300 mil Body), 16-lead Tape and Reel = 0°C to +70°C = -40°C to +85°C © 2005 Microchip Technology Inc. Preliminary a) TC1232COA: 0°C to +70°C, 8L-SOIC b) TC1232COA713: 0°C to +70°C, 8L-SOIC, Tape and Reel c) TC1232COE: 0°C to +70°C, 16L-SOIC d) TC1232COE713: 0°C to +70°C, 16L-SOIC Tape and Reel e) TC1232CPA: 0°C to +70°C, 8L-PDIP f) TC1232EOA: -40°C to +85°C, 8L-SOIC g) TC1232EOA713: -40°C to +85°C, 8L-SOIC, Tape and Reel h) TC1232EOE: -40°C to +85°C, 16L-SOIC i) TC1232EOE713: -40°C to +85°C, 16L-SOIC, Tape and Reel j) TC1232EPA: -40°C to +85°C, 8L-PDIP DS21370C-page 17 TC1232 NOTES: DS21370C-page 18 Preliminary © 2005 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active Thermistor, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance and WiperLock are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2005, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company’s quality system processes and procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. © 2005 Microchip Technology Inc. Preliminary DS21370C-page 19 WORLDWIDE SALES AND SERVICE AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 India - Bangalore Tel: 91-80-2229-0061 Fax: 91-80-2229-0062 China - Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 India - New Delhi Tel: 91-11-5160-8631 Fax: 91-11-5160-8632 Austria - Weis Tel: 43-7242-2244-399 Fax: 43-7242-2244-393 Denmark - Ballerup Tel: 45-4450-2828 Fax: 45-4485-2829 China - Chengdu Tel: 86-28-8676-6200 Fax: 86-28-8676-6599 Japan - Kanagawa Tel: 81-45-471- 6166 Fax: 81-45-471-6122 France - Massy Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 China - Fuzhou Tel: 86-591-8750-3506 Fax: 86-591-8750-3521 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Germany - Ismaning Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Atlanta Alpharetta, GA Tel: 770-640-0034 Fax: 770-640-0307 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 Philippines - Manila Tel: 011-632-634-9065 Fax: 011-632-634-9069 China - Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 China - Shunde Tel: 86-757-2839-5507 Fax: 86-757-2839-5571 China - Qingdao Tel: 86-532-502-7355 Fax: 86-532-502-7205 Malaysia - Penang Tel:011-604-646-8870 Fax:011-604-646-5086 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 England - Berkshire Tel: 44-118-921-5869 Fax: 44-118-921-5820 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Taiwan - Hsinchu Tel: 886-3-572-9526 Fax: 886-3-572-6459 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 San Jose Mountain View, CA Tel: 650-215-1444 Fax: 650-961-0286 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509 04/20/05 DS21370C-page 20 Preliminary © 2005 Microchip Technology Inc.