M TC1240/TC1240A Positive Doubling Charge Pumps with Shutdown in a SOT-23 Package Features General Description • • • • The TC1240/TC1240A is a doubling CMOS charge pump voltage converter in a small 6-Pin SOT-23A package. The TC1240 doubles an input voltage that can range from +2.5V to +4.0V, while the TC1240A doubles an input voltage that can range from +2.5V to +5.5V. Conversion efficiency is typically >99%. Internal oscillator frequency is 160 kHz for both devices. The TC1240 and TC1240A have an active-high shutdown that limits the current consumption of the devices to less than 1 µA. • • • • • Charge Pumps in 6-Pin SOT-23A Package >99% Typical Voltage Conversion Efficiency Voltage Doubling Input Voltage Range, TC1240: +2.5V to +4.0V, TC1240A: +2.5V to +5.5V Low Output Resistance, TC1240: 17Ω (Typical) TC1240A: 12Ω (Typical) Only Two External Capacitors Required Low Supply Current, TC1240: 180 µA (Typical) TC1240A: 550 µA (Typical) Power-Saving Shutdown Mode (1 µA Maximum) Shutdown Input Fully Compatible with 1.8V Logic Systems Applications • • • • • Cellular Phones Pagers PDAs, Portable Data Loggers Battery Powered Devices Handheld Instruments External component requirement is only two capacitors for standard voltage doubler applications. All other circuitry (including control, oscillator and power MOSFETs) are integrated on-chip. Typical supply current is 180 µA for the TC1240 and 550 µA for the TC1240A. Both devices are available in a 6-Pin SOT23A surface mount package. Typical Application Circuit Positive Voltage Doubler + Package Type C+ C1 6-Pin SOT-23A C+ 6 C- VIN INPUT TC1240 TC1240A OFF SHDN ON VOUT SHDN 5 4 VOUT GND TC1240ECH TC1240AECH 1 2 3 VIN GND C- + 2 x INPUT C2 NOTE: 6-Pin SOT-23A is equivalent to the EIAJ (SC-74A) 2003 Microchip Technology Inc. DS21516C-page 1 TC1240/TC1240A 1.0 ELECTRICAL CHARACTERISTICS † Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings † Input Voltage (VIN to GND) TC1240 ............................................. +4.5V, -0.3V TC1240A ........................................... +5.8V, -0.3V Output Voltage (VOUT to GND) TC1240 ....................................... +9.0V, VIN -0.3V TC1240A ................................... +11.6V, VIN -0.3V Current at VOUT Pin............................................50 mA Short-Circuit Duration: VOUT to GND .............Indefinite Thermal Resistance .......................................210°C/W Power Dissipation (TA = +25°C)........................600 mW Operating Temperature Range............. -40°C to +85°C Storage Temperature (Unbiased) ....... -65°C to +150°C TC1240 ELECTRICAL SPECIFICATIONS Electrical Specifications: Unless otherwise noted, typical values apply at TA = +25°C. Minimum and maximum values apply for TA = -40° to +85°C, and VIN = +2.8V, C1 = C2 = 3.3 µF, SHDN = GND. Parameters Supply Current Sym Min Typ Max Units Conditions IDD — 180 300 µA RLOAD = ∞ SHDN = VIN Shutdown Supply Current ISHDN — 0.1 1.0 µA Minimum Supply Voltage VMIN 2.5 — — V RLOAD = 1.0 kΩ Maximum Supply Voltage VMAX — — 4.0 V RLOAD = 1.0 kΩ Oscillator Frequency FOSC — 160 — kHz TA = -40°C to +85°C Switching Frequency (Note 1) FSW 40 80 125 kHz TA = -40°C to +85°C Shutdown Input Logic High VIH 1.4 — — V VIN = VMIN to VMAX Shutdown Input Logic Low VIL — — 0.4 V VIN = VMIN to VMAX Power Efficiency PEFF 86 93 — % RLOAD = 1.0 kΩ Voltage Conversion Efficiency VEFF 97.5 99.96 — % RLOAD = ∞ Output Resistance (Note 2) ROUT — — 17 — — 30 Ω RLOAD = 1.0 kΩ TA = -40°C to +85°C Note 1: 2: Switching frequency is one-half internal oscillator frequency. Capacitor contribution is approximately 26% of the output impedance [ESR = 1 / switching frequency x capacitance]. DS21516C-page 2 2003 Microchip Technology Inc. TC1240/TC1240A TC1240A ELECTRICAL SPECIFICATIONS Electrical Specifications: Unless otherwise noted, typical values apply at TA = +25°C. Minimum and maximum values apply for TA = -40° to +85°C, and VIN = +5.0V, C1 = C 2 = 3.3 µF, SHDN = GND. Parameters Supply Current Sym Min Typ Max Units IDD — 550 900 µA RLOAD = ∞ SHDN = VIN Shutdown Supply Current ISHDN — 0.01 1.0 µA Minimum Supply Voltage VMIN 2.5 — — V Conditions Maximum Supply Voltage VMAX — — 5.5 V Output Current ILOAD 20 — — mA Sum of the R DS(ON) of the internal MOSFET Switches RSW — 4 8 Ω Oscillator Frequency FOSC — 160 — kHz TA = -40°C to +85°C Switching Frequency (Note 1) FSW 40 80 125 kHz TA = -40°C to +85°C Shutdown Input Logic High VIH 1.4 — — V VIN = VMIN to VMAX Shutdown Input Logic Low ILOAD = 20 mA VIL — — 0.4 V VIN = VMIN to VMAX Power Efficiency PEFF 86 94 — % ILOAD = 5 mA Voltage Conversion Efficiency VEFF 99 99.96 — % RLOAD = ∞ Output Resistance (Note 2) ROUT — — 12 — — 25 Ω ILOAD = 20 µA TA = -40°C to +85°C Note 1: 2: Switching frequency is one-half internal oscillator frequency. Capacitor contribution is approximately 26% of the output impedance [ESR = 1 / switching frequency x capacitance]. 2003 Microchip Technology Inc. DS21516C-page 3 TC1240/TC1240A 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, typical values apply at TA = +25°C. 450 400 600 SUPPLY CURRENT (µA) SUPPLY CURRENT (µA) 700 500 400 300 200 100 VIN = 4.0V 350 300 250 200 VIN = 2.8V 150 100 50 0 2.00 3.00 4.00 5.00 0 -50 6.00 -25 0 SUPPLY VOLTAGE (V) 20 15 10 5 0 2.00 3.00 4.00 5.00 6.00 20 VIN = 2.8V 15 VIN = 4.0V 10 5 0 -50 -25 0 100% 90% POWER EFFICIENCY (%) 1 VOLT DROP (V) 0.7 0.6 VIN = 2.8V 0.5 VIN = 4.0V 0.4 0.3 0.2 0.1 0 25 50 75 TEMPERATURE (°C) 100 125 FIGURE 2-5: Output Source Resistance vs. Temperature (with RLOAD = 1 kΩ). 0.9 0.8 125 25 SUPPLY VOLTAGE (V) FIGURE 2-2: Output Source Resistance vs. Supply Voltage (with RLOAD = 1 kΩ) 100 FIGURE 2-4: Supply Current vs. Temperature (No Load). OUTPUT SOURCE RESISTANCE (Ω) OUTPUT SOURCE RESISTANCE (Ω) FIGURE 2-1: Supply Current vs. Supply Voltage (No Load). 25 50 75 TEMPERATURE (°C) VIN = 2.5V 80% VIN = 3.5V 70% 60% VIN = 4.5V 50% 40% 30% 20% 10% 0% 0 5 10 FIGURE 2-3: Load Current. DS21516C-page 4 15 20 25 30 35 LOAD CURRENT (mA) 40 45 Output Voltage Drop vs. 50 0 5 FIGURE 2-6: Current. 10 15 20 25 30 35 LOAD CURRENT (mA) 40 45 50 Power Efficiency vs. Load 2003 Microchip Technology Inc. TC1240/TC1240A Note: Unless otherwise indicated, typical values apply at TA = +25°C. SWITCHING FREQUENCY (kHz) 100 VIN = 4.0V 80 VIN = 2.8V 60 40 20 0 -50 -25 FIGURE 2-7: Temperature. 0 25 50 75 TEMPERATURE (°C) 100 125 Switching Frequency vs. 2003 Microchip Technology Inc. DS21516C-page 5 TC1240/TC1240A 3.0 PIN DESCRIPTION The description of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE Pin No. Symbol 1 VIN 2 GND 3 C- 4 SHDN Shutdown input (active high) 5 VOUT Doubled output voltage 6 C+ DS21516C-page 6 Description Power supply input Ground Commutation capacitor negative terminal Commutation capacitor positive terminal 2003 Microchip Technology Inc. TC1240/TC1240A 4.0 DETAILED DESCRIPTION 5.0 TYPICAL APPLICATIONS The TC1240/TC1240A charge pump converter doubles the voltage applied to the VIN pin. Conversion consists of a two-phase operation (Figure 4-1). During the first phase, switches S2 and S4 are open and S1 and S3 are closed. During this time, C 1 charges to the voltage on V IN and load current is supplied from C2. During the second phase, S2 and S 4 are closed, while S1 and S3 are open. 5.1 Output Voltage Considerations During this second phase, C1 is level-shifted upward by VIN volts. This connects C 1 to the reservoir capacitor C2, allowing energy to be delivered to the output as needed. The actual voltage is slightly lower than 2 x V IN since the four switches (S 1-S4) have an on-resistance and the load drains charge from reservoir capacitor C2. VIN S1 S2 TC1240/TC1240A The TC1240/TC1240A performs voltage doubling but does not provide regulation. The output voltage will droop in a linear manner with respect to load current. The value of this equivalent output resistance is approximately 12Ω nominal at +25°C and VIN = +5.0V for the TC1240A and 17Ω nominal at +25°C and VIN = +2.8V for the TC1240. VOUT is approximately +10.0V at light loads for the TC1240A and +5.6V for the TC1240, and droops according to the equation below: EQUATION V DROOP = I OUT × R OUT V OUT = 2 × V IN – V DROOP 5.2 The overall power efficiency of the charge pump is affected by four factors: C1 VOUT = 2 x VIN 1. C2 S3 Charge Pump Efficiency S4 2. VIN OSC 3. 4. FIGURE 4-1: Ideal Switched Capacitor Charge Pump Doubler. Losses from power consumed by the internal oscillator, switch drive, etc. (which vary with input voltage, temperature and oscillator frequency). I2R losses due to the on-resistance of the MOSFET switches on-board the charge pump. Charge pump capacitor losses due to effective series resistance (ESR). Losses that occur during charge transfer (from commutation capacitor to the output capacitor) when a voltage difference between the two capacitors exist. Most of the conversion losses are due to factors (2) and (3) above. These losses are given by Equation 5-1. EQUATION 5-1: 2 a) P LOSS(2,3) = I OU T × R O UT 1 b) R O UT = ---------------------- + 8R SWITCH + 4ESR C1 + ESR C2 F SW ( C 1 ) 2003 Microchip Technology Inc. DS21516C-page 7 TC1240/TC1240A The switching frequency in Equation 5-1b is defined as one-half the oscillator frequency (i.e., FSW = FOSC/2). The 1/(FSW)(C1) term in Equation 5-1b is the effective output resistance of an ideal switched capacitor circuit (Figure 5-1 and Figure 5-2). The output voltage ripple is given by Equation 5-2. EQUATION 5-2: I OUT V RIPPLE = -------------------------------- + 2 ( I OUT ) ( ESR C2 ) 2 ( F SW ) ( C 2 ) f V+ VOUT C1 FIGURE 5-1: Model. C2 RL Ideal Switched Capacitor REQUIV V+ VOUT REQUIV = 1 FSW x C 1 C2 RL 5.3 Capacitor Selection In order to maintain the lowest output resistance and output ripple voltage, it is recommended that low ESR capacitors be used. Additionally, larger values of C 1 will lower the output resistance and larger values of C2 will reduce output ripple (see Equation 5-1b). Table 5-1 shows various values of C1 and the corresponding output resistance values @ +25°C. It assumes a 0.1Ω ESRC1 and 0.9Ω RSW. Table 5-2 shows the output voltage ripple for various values of C 2. The VRIPPLE values assume 5mA output load current and 0.1Ω ESRC2. TABLE 5-1: C1 (µF) TC1240 R OUT(Ω) TC1240A ROUT(Ω) 0.47 47 35 20.5 1 28.5 2.2 19.5 14 3.3 17 12 4.7 15.5 10.5 10 13.6 9.3 47 12.5 8.3 100 12.2 8.1 TABLE 5-2: FIGURE 5-2: Resistance. DS21516C-page 8 OUTPUT RESISTANCE VS. C1 (ESR = 0.1Ω) Equivalent Output OUTPUT VOLTAGE RIPPLE VS. C2 (ESR = 0.1Ω) IOUT 5 mA C1 (µF) TC1240/TC1240A VRIPPLE (mV) 0.47 142 1 67 2.2 30 3.3 20 4.7 14 10 6.7 47 2.5 100 1.6 2003 Microchip Technology Inc. TC1240/TC1240A 5.4 Input Supply Bypassing 5.6 The VIN input should be capacitively bypassed to reduce AC impedance and minimize noise effects due to the switching internal to the device. The recommended capacitor should be a large value (at least equal to C 1) connected from the input to GND. 5.5 Shutdown Input Voltage Doubler The most common application for charge pump devices is the doubler (Figure 5-3). This application uses two external capacitors – C1 and C 2 (plus a power supply bypass capacitor, if necessary). The output is equal to 2 x VIN minus any voltage drops due to loading. Refer to Table 5-1 and Table 5-2 for capacitor selection. The TC1240 and TC1240A are disabled when SHDN is high, and enabled when SHDN is low. This input cannot be allowed to float. C3 VIN + VOUT 5 OUT C+ 6 TC1240 TC1240A 1 V + + C1 C2 RL IN 2 3 CGND 4 SHDN Device TC1240 TC1240A FIGURE 5-3: C1 C2 C3 3.3 µF 3.3 µF 3.3 µF Test Circuit. 2003 Microchip Technology Inc. DS21516C-page 9 TC1240/TC1240A 5.7 Cascading Devices 5.8 Two or more TC1240/TC1240As can be cascaded to increase output voltage (Figure 5-4). If the output is lightly loaded, it will be close to ((n + 1) x VIN), but will droop at least by ROUT of the first device multiplied by the IQ of the second. It can be seen that the output resistance rises rapidly for multiple cascaded devices. For the case of the two-stage ‘tripler’, output resistance can be approximated as ROUT = 2 x ROUT1 + ROUT2, where ROUT1 is the output resistance of the first stage and ROUT2 is the output resistance of the second stage. Paralleling Devices To reduce the value of ROUT, multiple TC1240/ TC1240As can be connected in parallel (Figure 5-5). The output resistance will be reduced by a factor of N, where N is the number of TC1240/TC1240As. Each device will require its own pump capacitor (C1x), but all devices may share one reservoir capacitor (C2). However, to preserve ripple performance, the value of C2 should be scaled according to the number of paralled TC1240/TC1240As, respectively. 5.9 Layout Considerations As with any switching power supply circuit good layout practice is recommended. Mount components as close together as possible to minimize stray inductance and capacitance. Also use a large ground plane to minimize noise leakage into other circuitry. VIN 6 C+ C1A VIN 1 + C1B TC1240 TC1240A 2 GND + VIN 1 6 C+ 2 3 "1" OUT 5 C4 SHDN + TC1240 TC1240A GND 5 3 C"n" OUT 4 SHDN + C2A VOUT C2B VOUT = (n + 1)VIN FIGURE 5-4: Cascading Multiple Devices To Increase Output Voltage. ROUT = ROUT OF SINGLE DEVICE NUMBER OF DEVICES ... VIN 1 1 3 3 C1A 2 + 6 4 Shutdown Control FIGURE 5-5: DS21516C-page 10 VIN TC1240 TC1240A "1" SHDN C1B 5 2 TC1240 TC1240A + 6 "n" 4 SHDN ... 5 VOUT + C2 VOUT = 2 x VIN Paralleling Multiple Devices To Reduce Output Resistance. 2003 Microchip Technology Inc. TC1240/TC1240A 6.0 PACKAGING INFORMATION 6.1 Package Marking Information 6-Pin SOT-23A 1 1 1 & 2 4 5 6 2 3 2 4 3 = part number code + temperature range (two-digit code) Device Code TC1240 DN TC1240A EN ex: 1240AECH = E N 3 represents year and 2-month code 4 represents production lot ID code 2003 Microchip Technology Inc. DS21516C-page 11 TC1240/TC1240A 6-Lead Plastic Small Outline Transistor (CH) (SOT-23) E E1 B p1 n D 1 α c A A2 φ L β Units Dimension Limits n p MIN A1 INCHES* NOM MAX MILLIMETERS NOM 6 0.95 1.90 0.90 1.18 0.90 1.10 0.00 0.08 2.60 2.80 1.50 1.63 2.80 2.95 0.35 0.45 0 5 0.09 0.15 0.35 0.43 0 5 0 5 MIN Number of Pins 6 Pitch .038 p1 Outside lead pitch (basic) .075 Overall Height A .035 .046 .057 Molded Package Thickness .035 .043 .051 A2 Standoff .000 .003 .006 A1 Overall Width E .102 .110 .118 Molded Package Width .059 .064 .069 E1 Overall Length D .110 .116 .122 Foot Length L .014 .018 .022 φ Foot Angle 0 5 10 c Lead Thickness .004 .006 .008 Lead Width B .014 .017 .020 α Mold Draft Angle Top 0 5 10 β Mold Draft Angle Bottom 0 5 10 *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side. MAX 1.45 1.30 0.15 3.00 1.75 3.10 0.55 10 0.20 0.50 10 10 JEITA (formerly EIAJ) equivalent: SC-74A Drawing No. C04-120 DS21516C-page 12 2003 Microchip Technology Inc. TC1240/TC1240A PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X /XX Device Temperature Range Package Examples: a) b) Device TC1240: TC1240A Temperature Range I Package CHTR: = TC1240ECHTR: Tape and Reel, 6L SOT-23 (EIAJ) TC1240AECHTR: Tape and Reel, 6L SOT-23 (EIAJ) Positive Doubling Charge Pump with Shutdown Positive Doubling Charge Pump with Shutdown = -40°C to +85°C (Industrial) 6L SOT-23, Tape and Reel Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. 2003 Microchip Technology Inc. DS21516C-page 13 TC1240/TC1240A NOTES: DS21516C-page 14 2003 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, KEELOQ, MPLAB, PIC, PICmicro, PICSTART, PRO MATE and PowerSmart are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Accuron, Application Maestro, dsPIC, dsPICDEM, dsPICDEM.net, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICC, PICkit, PICDEM, PICDEM.net, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPIC, Select Mode, SmartSensor, SmartShunt, SmartTel and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2003, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company’s quality system processes and procedures are QS-9000 compliant for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001 certified. 2003 Microchip Technology Inc. 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