PIC12F508/509/16F505 Data Sheet 8/14-Pin, 8-Bit Flash Microcontrollers *8-bit, 8-pin Devices Protected by Microchip’s Low Pin Count Patent: U.S. Patent No. 5,847,450. Additional U. S. and foreign patents and applications may be issued or pending. 2004 Microchip Technology Inc. Preliminary DS41236A Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2004, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company’s quality system processes and procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. DS41236A-page ii Preliminary 2004 Microchip Technology Inc. PIC12F508/509/16F505 8/14-Pin, 8-Bit Flash Microcontroller Devices Included In This Data Sheet: • PIC12F508 • PIC12F509 • PIC16F505 High-Performance RISC CPU: • Only 33 single-word instructions to learn • All single-cycle instructions except for program branches, which are two-cycle • 12-bit wide instructions • 2-level deep hardware stack • Direct, Indirect and Relative Addressing modes for data and instructions • 8-bit wide data path • 8 Special Function Hardware registers • Operating speed: - DC – 20 MHz clock input (PIC16F505 only) - DC – 200 ns instruction cycle (PIC16F505 only) - DC – 4 MHz clock input - DC – 1000 ns instruction cycle Special Microcontroller Features: • 4 MHz precision internal oscillator: - Factory calibrated to ±1% • In-Circuit Serial Programming™ (ICSP™) • In-Circuit Debugging (ICD) support • Power-on Reset (POR) • Device Reset Timer (DRT) • Watchdog Timer (WDT) with dedicated on-chip RC oscillator for reliable operation • Programmable code protection • Multiplexed MCLR input pin • Internal weak pull-ups on I/O pins • Power-saving Sleep mode • Wake-up from Sleep on pin change • Selectable oscillator options: - INTRC: 4 MHz precision Internal oscillator - EXTRC: External low-cost RC oscillator - XT: Standard crystal/resonator - HS: High-speed crystal/resonator (PIC16F505 only) 2004 Microchip Technology Inc. - LP: - EC: Power-saving, low-frequency crystal High-speed external clock input (PIC16F505 only) Low-Power Features/CMOS Technology: • Operating Current: - < 350 µA @ 2V, 4 MHz • Standby Current: - 100 nA @ 2V, typical • Low-power, high-speed Flash technology: - 100,000 Flash endurance - > 40 year retention • Fully static design • Wide operating voltage range: 2.0V to 5.5V • Wide temperature range: - Industrial: -40°C to +85°C - Extended: -40°C to +125°C Peripheral Features (PIC12F508/509): • 6 I/O pins: - 5 I/O pins with individual direction control - 1 input only pin - High current sink/source for direct LED drive - Wake-on-change - Weak pull-ups • 8-bit real-time clock/counter (TMR0) with 8-bit programmable prescaler Peripheral Features (PIC16F505): • 12 I/O pins: - 11 I/O pins with individual direction control - 1 input only pin - High current sink/source for direct LED drive - Wake-on-change - Weak pull-ups • 8-bit real-time clock/counter (TMR0) with 8-bit programmable prescaler Preliminary DS41236A-page 1 PIC12F508/509/16F505 Pin Diagrams PDIP, SOIC, TSSOP PDIP, SOIC, MSOP VSS RB5/OSC1/CLKIN 2 13 RB0/ICSPDAT RB4/OSC2/CLKOUT 3 12 RB1/ISCPCLK RB3/MCLR/VPP 11 RB2 RC5/T0CKI 4 5 10 RC0 RC4 6 9 RC1 RC3 7 8 RC2 VDD 2 GP4/OSC2 3 GP3/MCLR/VPP 4 Data Memory Flash (words) SRAM (bytes) PIC12F508 512 25 PIC12F509 1024 PIC16F505 1024 Preliminary 8 VSS 7 GP0/ICSPDAT 6 GP1/ICSPCLK 5 GP2/T0CKI I/O Timers 8-bit 6 1 41 6 1 72 12 1 Device DS41236A-page 2 1 GP5/OSC1/CLKIN Program Memory PIC12F508/509 14 PIC16F505 1 VDD 2004 Microchip Technology Inc. PIC12F508/509/16F505 Table of Contents 1.0 General Description...................................................................................................................................................................... 5 2.0 PIC12F508/509/16F505 Device Varieties ................................................................................................................................... 7 3.0 Architectural Overview ................................................................................................................................................................. 9 4.0 Memory Organization ................................................................................................................................................................. 15 5.0 I/O Port ....................................................................................................................................................................................... 29 6.0 Timer0 Module and TMR0 Register ........................................................................................................................................... 33 7.0 Special Features Of The CPU.................................................................................................................................................... 39 8.0 Instruction Set Summary ............................................................................................................................................................ 55 9.0 Development Support................................................................................................................................................................. 63 10.0 Electrical Characteristics ............................................................................................................................................................ 69 11.0 DC and AC Characteristics Graphs and Charts ......................................................................................................................... 81 12.0 Packaging Information................................................................................................................................................................ 83 Index .................................................................................................................................................................................................... 91 On-Line Support................................................................................................................................................................................... 93 Systems Information and Upgrade Hot Line ........................................................................................................................................ 93 Reader Response ................................................................................................................................................................................ 94 Product Identification System .............................................................................................................................................................. 95 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at [email protected] or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: • Microchip’s Worldwide Web site; http://www.microchip.com • Your local Microchip sales office (see last page) • The Microchip Corporate Literature Center; U.S. FAX: (480) 792-7277 When contacting a sales office or the literature center, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com/cn to receive the most current information on all of our products. 2004 Microchip Technology Inc. Preliminary DS41236A-page 3 PIC12F508/509/16F505 NOTES: DS41236A-page 4 Preliminary 2004 Microchip Technology Inc. PIC12F508/509/16F505 1.0 GENERAL DESCRIPTION 1.1 The PIC12F508/509/16F505 devices from Microchip Technology are low-cost, high-performance, 8-bit, fullystatic, Flash-based CMOS microcontrollers. They employ a RISC architecture with only 33 single word/ single cycle instructions. All instructions are single cycle (200 µs) except for program branches, which take two cycles. The PIC12F508/509/16F505 devices deliver performance an order of magnitude higher than their competitors in the same price category. The 12-bit wide instructions are highly symmetrical, resulting in a typical 2:1 code compression over other 8-bit microcontrollers in its class. The easy to use and easy to remember instruction set reduces development time significantly. Applications The PIC12F508/509/16F505 devices fit in applications ranging from personal care appliances and security systems to low-power remote transmitters/receivers. The Flash technology makes customizing application programs (transmitter codes, appliance settings, receiver frequencies, etc.) extremely fast and convenient. The small footprint packages, for through hole or surface mounting, make these microcontrollers perfect for applications with space limitations. Low cost, low power, high performance, ease of use and I/O flexibility make the PIC12F508/509/16F505 devices very versatile even in areas where no microcontroller use has been considered before (e.g., timer functions, logic and PLDs in larger systems and coprocessor applications). The PIC12F508/509/16F505 products are equipped with special features that reduce system cost and power requirements. The Power-on Reset (POR) and Device Reset Timer (DRT) eliminate the need for external Reset circuitry. There are four oscillator configurations to choose from (six on the PIC16F505), including INTRC Internal Oscillator mode and the powersaving LP (Low-power) Oscillator mode. Power-saving Sleep mode, Watchdog Timer and code protection features improve system cost, power and reliability. The PIC12F508/509/16F505 devices are available in the cost-effective Flash programmable version, which is suitable for production in any volume. The customer can take full advantage of Microchip’s price leadership in Flash programmable microcontrollers, while benefiting from the Flash programmable flexibility. The PIC12F508/509/16F505 products are supported by a full-featured macro assembler, a software simulator, an in-circuit emulator, a ‘C’ compiler, a low-cost development programmer and a full featured programmer. All the tools are supported on IBM® PC and compatible machines. TABLE 1-1: PIC12F508/509/16F505 DEVICES PIC12F508 PIC12F509 PIC16F505 Clock Maximum Frequency of Operation (MHz) 4 4 20 Memory Flash Program Memory 512 1024 1024 Data Memory (bytes) 25 41 72 TMR0 TMR0 TMR0 Yes Yes Yes I/O Pins 5 5 11 Input Pins 1 1 1 Internal Pull-ups Yes Yes Yes In-Circuit Serial Programming Yes Yes Yes Number of Instructions 33 33 33 8-pin PDIP, SOIC, MSOP 8-pin PDIP, SOIC, MSOP 14-pin PDIP, SOIC, TSSOP Peripherals Timer Module(s) Wake-up from Sleep on Pin Change Features Packages The PIC12F508/509/16F505 devices have Power-on Reset, selectable Watchdog Timer, selectable code-protect, high I/O current capability and precision internal oscillator. The PIC12F508/509/16F505 device uses serial programming with data pin RB0/GP0 and clock pin RB1/GP1. 2004 Microchip Technology Inc. Preliminary DS41236A-page 5 PIC12F508/509/16F505 NOTES: DS41236A-page 6 Preliminary 2004 Microchip Technology Inc. PIC12F508/509/16F505 2.0 PIC12F508/509/16F505 DEVICE VARIETIES A variety of packaging options are available. Depending on application and production requirements, the proper device option can be selected using the information in this section. When placing orders, please use the PIC12F508/509/16F505 Product Identification System at the back of this data sheet to specify the correct part number. 2.1 2.2 Serialized Quick Turn ProgrammingSM (SQTPSM) Devices Microchip offers a unique programming service, where a few user-defined locations in each device are programmed with different serial numbers. The serial numbers may be random, pseudo-random or sequential. Serial programming allows each device to have a unique number, which can serve as an entry code, password or ID number. Quick Turn Programming (QTP) Devices Microchip offers a QTP programming service for factory production orders. This service is made available for users who choose not to program medium-to-high quantity units and whose code patterns have stabilized. The devices are identical to the Flash devices but with all Flash locations and fuse options already programmed by the factory. Certain code and prototype verification procedures do apply before production shipments are available. Please contact your local Microchip Technology sales office for more details. 2004 Microchip Technology Inc. Preliminary DS41236A-page 7 PIC12F508/509/16F505 NOTES: DS41236A-page 8 Preliminary 2004 Microchip Technology Inc. PIC12F508/509/16F505 3.0 ARCHITECTURAL OVERVIEW The high performance of the PIC12F508/509/16F505 devices can be attributed to a number of architectural features commonly found in RISC microprocessors. To begin with, the PIC12F508/509/16F505 devices use a Harvard architecture in which program and data are accessed on separate buses. This improves bandwidth over traditional von Neumann architectures where program and data are fetched on the same bus. Separating program and data memory further allows instructions to be sized differently than the 8-bit wide data word. Instruction opcodes are 12 bits wide, making it possible to have all single-word instructions. A 12-bit wide program memory access bus fetches a 12-bit instruction in a single cycle. A two-stage pipeline overlaps fetch and execution of instructions. Consequently, all instructions (33) execute in a single cycle (200 ns @ 20 MHz, 1 µs @ 4 MHz) except for program branches. The Table below lists program memory (Flash) and data memory (RAM) for the PIC12F508/509/16F505 devices. TABLE 3-1: The PIC12F508/509/16F505 devices contain an 8-bit ALU and working register. The ALU is a general purpose arithmetic unit. It performs arithmetic and Boolean functions between data in the working register and any register file. The ALU is 8 bits wide and capable of addition, subtraction, shift and logical operations. Unless otherwise mentioned, arithmetic operations are two’s complement in nature. In two-operand instructions, one operand is typically the W (working) register. The other operand is either a file register or an immediate constant. In single operand instructions, the operand is either the W register or a file register. The W register is an 8-bit working register used for ALU operations. It is not an addressable register. Depending on the instruction executed, the ALU may affect the values of the Carry (C), Digit Carry (DC) and Zero (Z) bits in the Status register. The C and DC bits operate as a borrow and digit borrow out bit, respectively, in subtraction. See the SUBWF and ADDWF instructions for examples. A simplified block diagram is shown in Figure 3-2, with the corresponding device pins described in Table 3-3. PIC12F508/509/16F505 MEMORY Memory Device Program Data PIC12F508 512 x 12 25 x 8 PIC12F509 1024 x 12 41 x 8 PIC16F505 1024 x 12 72 x 8 The PIC12F508/509/16F505 devices can directly or indirectly address its register files and data memory. All Special Function Registers (SFR), including the PC, are mapped in the data memory. The PIC12F508/509/ 16F505 devices have a highly orthogonal (symmetrical) instruction set that makes it possible to carry out any operation, on any register, using any addressing mode. This symmetrical nature and lack of “special optimal situations” make programming with the PIC12F508/509/16F505 devices simple, yet efficient. In addition, the learning curve is reduced significantly. 2004 Microchip Technology Inc. Preliminary DS41236A-page 9 PIC12F508/509/16F505 FIGURE 3-1: PIC12F508/509 BLOCK DIAGRAM 12 Flash 512 x 12 or 1024 x 12 Program Memory 8 Data Bus Program Counter GP0/ISCPDAT GP1/ISCPCLK GP2/T0CKI GP3/MCLR/VPP GP4/OSC2 GP5/OSC1/CLKIN RAM 25 x 8 or 41 x 8 File Registers Stack 1 Stack 2 Program 12 Bus RAM Addr GPIO 9 Addr MUX Instruction reg Direct Addr 5 5-7 Indirect Addr FSR reg Status reg 8 3 MUX Device Reset Timer Instruction Decode & Control OSC1/CLKIN OSC2 Timing Generation Internal RC OSC ALU Power-on Reset 8 Watchdog Timer W reg Timer0 MCLR VDD, VSS DS41236A-page 10 Preliminary 2004 Microchip Technology Inc. PIC12F508/509/16F505 TABLE 3-2: PIC12F508/509 PINOUT DESCRIPTION Name GP0/ICSPDAT GP1\ICSPCLK GP2/T0CKI GP3/MCLR/VPP GP4/OSC2 GP5/OSC1/CLKIN Function Input Type Output Type GP0 TTL CMOS Bidirectional I/O pin. Can be software programmed for internal weak pull-up and wake-up from Sleep on pin change. ICSPDAT ST CMOS In-Circuit Serial Programming™ data pin. GP1 TTL CMOS Bidirectional I/O pin. Can be software programmed for internal weak pull-up and wake-up from Sleep on pin change. ICSPCLK ST CMOS In-Circuit Serial Programming clock pin. CMOS Bidirectional I/O pin. Description GP2 TTL T0CKI ST — Clock input to TMR0. GP3 TTL — Input pin. Can be software programmed for internal weak pull-up and wake-up from Sleep on pin change. MCLR ST — Master Clear (Reset). When configured as MCLR, this pin is an active-low Reset to the device. Voltage on MCLR/VPP must not exceed VDD during normal device operation or the device will enter Programming mode. Weak pull-up always on if configured as MCLR. VPP HV — Programming voltage input. GP4 TTL OSC2 — GP5 TTL CMOS Bidirectional I/O pin. XTAL Oscillator crystal output. Connections to crystal or resonator in Crystal Oscillator mode (XT and LP modes only, GPIO in other modes). CMOS Bidirectional I/O pin. OSC1 XTAL — Oscillator crystal input. CLKIN ST — External clock source input . VDD VDD — P Positive supply for logic and I/O pins. VSS VSS — P Ground reference for logic and I/O pins. Legend: I = Input, O = Output, I/O = Input/Output, P = Power, — = Not used, TTL = TTL input, ST = Schmitt Trigger input 2004 Microchip Technology Inc. Preliminary DS41236A-page 11 PIC12F508/509/16F505 FIGURE 3-2: PIC16F505 BLOCK DIAGRAM 12 Flash 1K x 12 Program Memory 8 Data Bus Program Counter RB0/ICSPCLK RB1/ICSPDAT RB2 RB3/MCLR/VPP RB4/OSC2/CLKOUT RB5/OSC1/CLKIN RAM 72 bytes File Registers Stack 1 Stack 2 Program 12 Bus RAM Addr 9 PORTC Addr MUX Instruction reg Direct Addr 5 5-7 Indirect Addr FSR reg Status reg 8 3 Device Reset Timer Instruction Decode & Control OSC1/CLKIN OSC2/CLKOUT Timing Generation PORTB Power-on Reset RC0 RC1 RC2 RC3 RC4 RC5/T0CKI MUX ALU 8 Watchdog Timer W reg Internal RC OSC Timer0 MCLR VDD, VSS DS41236A-page 12 Preliminary 2004 Microchip Technology Inc. PIC12F508/509/16F505 TABLE 3-3: PIC16F505 PINOUT DESCRIPTION Name RB0/ICSPDAT RB1/ICSPCLK Function Input Type Output Type RB0 TTL CMOS Bidirectional I/O pin. Can be software programmed for internal weak pull-up and wake-up from Sleep on pin change. ICSPDAT ST CMOS In-Circuit Serial Programming™ data pin. RB1 TTL CMOS Bidirectional I/O pin. Can be software programmed for internal weak pull-up and wake-up from Sleep on pin change. ICSPCLK ST CMOS In-Circuit Serial Programming clock pin. CMOS Bidirectional I/O pin. Description RB2 RB2 TTL RB3/MCLR/VPP RB3 TTL — Input port. Can be software programmed for internal weak pull-up and wake-up from Sleep on pin change. MCLR ST — Master Clear (Reset). When configured as MCLR, this pin is an active-low Reset to the device. Voltage on MCLR/VPP must not exceed VDD during normal device operation or the device will enter Programming mode. Weak pull-up always on if configured as MCLR. — Programming voltage input. RB4/OSC2/CLKOUT RB5/OSC1/CLKIN VPP — RB4 TTL OSC2 — XTAL CLKOUT — CMOS In EXTRC and INTRC modes, the pin output can be configured for CLKOUT, which has 1/4 the frequency of OSC1 and denotes the instruction cycle rate. RB5 TTL OSC1 XTAL CMOS Bidirectional I/O pin. Can be software programmed for internal weak pull-up and wake-up from Sleep on pin change. Oscillator crystal output. Connections to crystal or resonator in Crystal Oscillator mode (XT, HS and LP modes only). CMOS Bidirectional I/O pin. — Crystal input. — External clock source input. CLKIN ST RC0 RC0 TTL CMOS Bidirectional I/O pin. RC1 RC1 TTL CMOS Bidirectional I/O pin. RC2 RC2 TTL CMOS Bidirectional I/O pin. RC3 RC3 TTL CMOS Bidirectional I/O pin. RC4 RC4 TTL CMOS Bidirectional I/O pin. CMOS Bidirectional I/O pin. RC5/T0CKI RC5 TTL T0CKI ST — Clock input to TMR0. VDD VDD — P Positive supply for logic and I/O pins. VSS VSS — P Ground reference for logic and I/O pins. Legend: I = Input, O = Output, I/O = Input/Output, P = Power, — = Not used, TTL = TTL input, ST = Schmitt Trigger input 2004 Microchip Technology Inc. Preliminary DS41236A-page 13 PIC12F508/509/16F505 3.1 Clocking Scheme/Instruction Cycle 3.2 Instruction Flow/Pipelining An instruction cycle consists of four Q cycles (Q1, Q2, Q3 and Q4). The instruction fetch and execute are pipelined such that fetch takes one instruction cycle, while decode and execute take another instruction cycle. However, due to the pipelining, each instruction effectively executes in one cycle. If an instruction causes the PC to change (e.g., GOTO), then two cycles are required to complete the instruction (Example 3-1). The clock input (OSC1/CLKIN pin) is internally divided by four to generate four non-overlapping quadrature clocks, namely Q1, Q2, Q3 and Q4. Internally, the PC is incremented every Q1 and the instruction is fetched from program memory and latched into the instruction register in Q4. It is decoded and executed during the following Q1 through Q4. The clocks and instruction execution flow is shown in Figure 3-3 and Example 3-1. A fetch cycle begins with the PC incrementing in Q1. In the execution cycle, the fetched instruction is latched into the Instruction Register (IR) in cycle Q1. This instruction is then decoded and executed during the Q2, Q3 and Q4 cycles. Data memory is read during Q2 (operand read) and written during Q4 (destination write). FIGURE 3-3: CLOCK/INSTRUCTION CYCLE Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 OSC1 Q1 Q2 Internal phase clock Q3 Q4 PC PC PC+1 Fetch INST (PC) Execute INST (PC – 1) EXAMPLE 3-1: PC+2 Fetch INST (PC + 1) Execute INST (PC) Fetch INST (PC + 2) Execute INST (PC + 1) INSTRUCTION PIPELINE FLOW 1. MOVLW 03H 2. MOVWF PORTB 3. CALL SUB_1 4. BSF PORTB, BIT1 Fetch 1 Execute 1 Fetch 2 Execute 2 Fetch 3 Execute 3 Fetch 4 Flush Fetch SUB_1 Execute SUB_1 All instructions are single cycle, except for any program branches. These take two cycles, since the fetch instruction is “flushed” from the pipeline, while the new instruction is being fetched and then executed. DS41236A-page 14 Preliminary 2004 Microchip Technology Inc. PIC12F508/509/16F505 4.0 MEMORY ORGANIZATION FIGURE 4-1: The PIC12F508/509/16F505 memories are organized into program memory and data memory. For devices with more than 512 bytes of program memory, a paging scheme is used. Program memory pages are accessed using one Status register bit. For the PIC12F509 and PIC16F505, with data memory register files of more than 32 registers, a banking scheme is used. Data memory banks are accessed using the File Select Register (FSR). PROGRAM MEMORY MAP AND STACK FOR THE PIC12F508/509 PC<11:0> 12 CALL, RETLW Stack Level 1 Stack Level 2 Reset Vector(1) Program Memory Organization for the PIC12F508/509 The PIC12F508 device has a 10-bit Program Counter (PC) and PIC12F509 has a 11-bit Program Counter (PC) capable of addressing a 2K x 12 program memory space. Only the first 512 x 12 (0000h-01FFh) for the PIC12F508, and 1K x 12 (0000h-03FFh) for the PIC12F509 are physically implemented (see Figure 4-1). Accessing a location above these boundaries will cause a wraparound within the first 512 x 12 space (PIC12F508) or 1K x 12 space (PIC12F509). The effective Reset vector is a 0000h (see Figure 4-1). Location 01FFh (PIC12F508) and location 03FFh (PIC12F509) contain the internal clock oscillator calibration value. This value should never be overwritten. On-chip Program Memory User Memory Space 4.1 Preliminary 512 Word 01FFh 0200h On-chip Program Memory 1024 Word 03FFh 0400h 7FFh Note 1: 2004 Microchip Technology Inc. 0000h Address 0000h becomes the effective Reset vector. Location 01FFh, 03FFh (PIC12F508, PIC12F509) contains the MOVLW XX internal oscillator calibration value. DS41236A-page 15 PIC12F508/509/16F505 4.2 Program Memory Organization For The PIC16F505 4.3 The PIC16F505 device has a 11-bit Program Counter (PC) capable of addressing a 2K x 12 program memory space. The 1K x 12 (0000h-03FFh) for the PIC16F505 are physically implemented. Refer to Figure 4-2. Accessing a location above this boundary will cause a wraparound within the first 1K x 12 space. The effective Reset vector is at 0000h (see Figure 4-2). Location 03FFh contains the internal oscillator calibration value. This value should never be overwritten. FIGURE 4-2: PROGRAM MEMORY MAP AND STACK FOR THE PIC16F505 PC<11:0> 12 CALL, RETLW Data memory is composed of registers or bytes of RAM. Therefore, data memory for a device is specified by its register file. The register file is divided into two functional groups: Special Function Registers (SFR) and General Purpose Registers (GPR). The Special Function Registers include the TMR0 register, the Program Counter (PCL), the Status register, the I/O registers (ports) and the File Select Register (FSR). In addition, Special Function Registers are used to control the I/O port configuration and prescaler options. The General Purpose Registers are used for data and control information under command of the instructions. For the PIC12F508/509, the register file is composed of 7 Special Function Registers, 9 General Purpose Registers and 16 or 32 General Purpose Registers accessed by banking (see Figure 4-3 and Figure 4-4). For the PIC16F505, the register file is composed of 8 Special Function Registers, 8 General Purpose Registers and 64 General Purpose Registers accessed by banking (Figure 4-5). Stack Level 1 Stack Level 2 Reset Vector(1) Data Memory Organization 0000h 4.3.1 GENERAL PURPOSE REGISTER FILE User Memory Space The General Purpose Register file is accessed, either directly or indirectly, through the File Select Register (FSR). See Section 4.9 “Indirect Data Addressing: INDF and FSR Registers”. 01FFh 0200h On-chip Program Memory 1024 Words 03FFh 0400h 7FFh Note 1: Address 0000h becomes the effective Reset vector. Location 03FFh contains the MOVLW XX internal oscillator calibration value. DS41236A-page 16 Preliminary 2004 Microchip Technology Inc. PIC12F508/509/16F505 FIGURE 4-3: PIC12F508 REGISTER FILE MAP FIGURE 4-4: PIC12F509 REGISTER FILE MAP FSR<6:5> File Address 00 01 File Address 00h INDF(1) 01h TMR0 02h PCL 03h STATUS 04h FSR 05h OSCCAL 06h GPIO 07h 00h INDF(1) 01h TMR0 02h PCL 03h STATUS 04h FSR 05h OSCCAL 06h GPIO 20h Addresses map back to addresses in Bank 0. 07h General Purpose Registers General Purpose Registers 2Fh 0Fh 10h 30h General Purpose Registers 1Fh 1Fh 3Fh Bank 0 Note 1: Note 1: Not a physical register. See Section 4.9 “Indirect Data Addressing: INDF and FSR Registers”. FIGURE 4-5: General Purpose Registers Bank 1 Not a physical register. See Section 4.9 “Indirect Data Addressing: INDF and FSR Registers”. PIC16F505 REGISTER FILE MAP FSR<6:5> 00 File Address 00h INDF(1) 01h TMR0 02h PCL 03h STATUS 04h FSR 05h OSCCAL 06h PORTB 07h PORTC 08h General Purpose Registers 0Fh 10h 01 20h 60h 2Fh 4Fh 6Fh 30h 50h 70h General Purpose Registers 3Fh Bank 0 Note 1: 40h 11 Addresses map back to addresses in Bank 0. General Purpose Registers 1Fh 10 General Purpose Registers 5Fh Bank 1 General Purpose Registers 7Fh Bank 2 Bank 3 Not a physical register. See Section 4.9 “Indirect Data Addressing: INDF and FSR Registers”. 2004 Microchip Technology Inc. Preliminary DS41236A-page 17 PIC12F508/509/16F505 4.3.2 SPECIAL FUNCTION REGISTERS The Special Function Registers (SFRs) are registers used by the CPU and peripheral functions to control the operation of the device (Table 4-1). The Special Function Registers can be classified into two sets. The Special Function Registers associated with the “core” functions are described in this section. Those related to the operation of the peripheral features are described in the section for each peripheral feature. TABLE 4-1: Address SPECIAL FUNCTION REGISTER (SFR) SUMMARY (PIC12F508/509) Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on Power-On Reset(2) Page # 00h INDF Uses Contents of FSR to Address Data Memory (not a physical register) xxxx xxxx 26 01h TMR0 8-bit Real-Time Clock/Counter xxxx xxxx 33 02h(1) PCL Low-order 8 bits of PC 1111 1111 25 — PA0(5) TO PD Z DC C 0-01 1xxx(3) 20 03h STATUS GPWUF 04h FSR Indirect Data Memory Address Pointer 111x xxxx 26 04h(4) FSR Indirect Data Memory Address Pointer 110x xxxx 26 05h OSCCAL CAL6 CAL5 CAL4 CAL3 CAL2 CAL1 CAL0 — 1111 111- 24 06h GPIO — — GP5 GP4 GP3 GP2 GP1 GP0 --xx xxxx 29 N/A TRISGPIO — — --11 1111 29 N/A OPTION GPWU GPPU 1111 1111 22 I/O Control Register TOCS TOSE PSA PS2 PS1 PS0 Legend: — = unimplemented, read as ‘0’, x = unknown, u = unchanged, q = value depends on condition. Note 1: The upper byte of the Program Counter is not directly accessible. See Section 4.7 “Program Counter” for an explanation of how to access these bits. 2: Other (non Power-up) Resets include external Reset through MCLR, Watchdog Timer and wake-up on pin change Reset. 3: If Reset was due to wake-up on pin change, then bit 7 = 1. All other Resets will cause bit 7 = 0. 4: PIC12F509 only. 5: This bit is used on the PIC12F509. For code compatibility do not use this bit on the PIC12F508. DS41236A-page 18 Preliminary 2004 Microchip Technology Inc. PIC12F508/509/16F505 TABLE 4-2: Address 00h 01h SPECIAL FUNCTION REGISTER (SFR) SUMMARY (PIC16F505) Name INDF Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Uses Contents of FSR to Address Data Memory (not a physical register) Value on Power-On Reset(2) Page # xxxx xxxx 26 TMR0 8-bit Real-Time Clock/Counter xxxx xxxx 33 02h PCL Low-order 8 bits of PC 1111 1111 25 03h STATUS RBWUF 0-01 1xxx 20 04h FSR Indirect Data Memory Address Pointer 05h OSCCAL (1) — CAL6 CAL5 PA0 CAL4 TO CAL3 PD Z DC C CAL2 CAL1 CAL0 — 110x xxxx 26 1111 111- 24 06h PORTB — — RB5 RB4 RB3 RB2 RB1 RB0 --xx xxxx 29 07h PORTC — — RC5 RC4 RC3 RC2 RC1 RC0 --xx xxxx 29 N/A TRISB — — I/O Control Register --11 1111 29 N/A TRISC — — I/O Control Register --11 1111 29 N/A OPTION RBWU RBPU 1111 1111 23 TOCS TOSE PSA PS2 PS1 PS0 Legend: — = unimplemented, read as ‘0’, x = unknown, u = unchanged, q = value depends on condition. Note 1: If Reset was due to wake-up on pin change, then bit 7 = 1. All other Resets will cause bit 7 = 0. 2: Other (non Power-up) Resets include external reset through MCLR, Watchdog Timer and wake-up on pin change Reset. 2004 Microchip Technology Inc. Preliminary DS41236A-page 19 PIC12F508/509/16F505 4.4 Status Register This register contains the arithmetic status of the ALU, the Reset status and the page preselect bit. The Status register can be the destination for any instruction, as with any other register. If the Status register is the destination for an instruction that affects the Z, DC or C bits, then the write to these three bits is disabled. These bits are set or cleared according to the device logic. Furthermore, the TO and PD bits are not writable. Therefore, the result of an instruction with the Status register as destination may be different than intended. REGISTER 4-1: For example, CLRF STATUS, will clear the upper three bits and set the Z bit. This leaves the Status register as 000u u1uu (where u = unchanged). Therefore, it is recommended that only BCF, BSF and MOVWF instructions be used to alter the Status register. These instructions do not affect the Z, DC or C bits from the Status register. For other instructions which do affect Status bits, see Section 8.0 “Instruction Set Summary”. STATUS REGISTER (ADDRESS: 03h) (PIC12F508/509) R/W-0 R/W-0 R/W-0 R-1 R-1 R/W-x R/W-x R/W-x GPWUF — PA0 TO PD Z DC C bit 7 bit 0 bit 7 GPWUF: GPIO Reset bit 1 = Reset due to wake-up from Sleep on pin change 0 = After power-up or other Reset bit 6 Reserved: Do not use bit 5 PA0: Program Page Preselect bits(1) 1 = Page 1 (200h-3FFh) 0 = Page 0 (000h-1FFh) Each page is 512 bytes. Using the PA0 bit as a general purpose read/write bit in devices which do not use it for program page preselect is not recommended, since this may affect upward compatibility with future products. bit 4 TO: Time-out bit 1 = After power-up, CLRWDT instruction, or SLEEP instruction 0 = A WDT time-out occurred bit 3 PD: Power-down bit 1 = After power-up or by the CLRWDT instruction 0 = By execution of the SLEEP instruction bit 2 Z: Zero bit 1 = The result of an arithmetic or logic operation is zero 0 = The result of an arithmetic or logic operation is not zero bit 1 DC: Digit carry/borrow bit (for ADDWF and SUBWF instructions) ADDWF: 1 = A carry from the 4th low-order bit of the result occurred 0 = A carry from the 4th low-order bit of the result did not occur SUBWF: 1 = A borrow from the 4th low-order bit of the result did not occur 0 = A borrow from the 4th low-order bit of the result occurred bit 0 C: Carry/borrow bit (for ADDWF, SUBWF and RRF, RLF instructions) SUBWF: RRF or RLF: ADDWF: 1 = A carry occurred 1 = A borrow did not occur Load bit with LSb or MSb, respectively 0 = A carry did not occur 0 = A borrow occurred Note 1: This bit is used on the PIC12F509. For code compatibility do not use this bit on the PIC12F508. Legend: DS41236A-page 20 R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared Preliminary x = Bit is unknown 2004 Microchip Technology Inc. PIC12F508/509/16F505 REGISTER 4-2: STATUS REGISTER (ADDRESS: 03h) (PIC16F505) R/W-0 R/W-0 R/W-0 R-1 R-1 R/W-x R/W-x R/W-x RBWUF — PA0 TO PD Z DC C bit 7 bit 0 bit 7 RBWUF: PORTB Reset bit 1 = Reset due to wake-up from Sleep on pin change 0 = After power-up or other Reset bit 6 Reserved: Do not use bit 5 PA0: Program Page Preselect bits 1 = Page 1 (200h-3FFh) 0 = Page 0 (000h-1FFh) Each page is 512 bytes. Using the PA0 bit as a general purpose read/write bit in devices which do not use it for program page preselect is not recommended, since this may affect upward compatibility with future products. bit 4 TO: Time-out bit 1 = After power-up, CLRWDT instruction, or SLEEP instruction 0 = A WDT time-out occurred bit 3 PD: Power-down bit 1 = After power-up or by the CLRWDT instruction 0 = By execution of the SLEEP instruction bit 2 Z: Zero bit 1 = The result of an arithmetic or logic operation is zero 0 = The result of an arithmetic or logic operation is not zero bit 1 DC: Digit carry/borrow bit (for ADDWF and SUBWF instructions) ADDWF: 1 = A carry from the 4th low-order bit of the result occurred 0 = A carry from the 4th low-order bit of the result did not occur SUBWF: 1 = A borrow from the 4th low-order bit of the result did not occur 0 = A borrow from the 4th low-order bit of the result occurred bit 0 C: Carry/borrow bit (for ADDWF, SUBWF and RRF, RLF instructions) ADDWF: SUBWF: RRF or RLF: 1 = A carry occurred 1 = A borrow did not occur Load bit with LSb or MSb, respectively 0 = A carry did not occur 0 = A borrow occurred Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared 2004 Microchip Technology Inc. Preliminary x = Bit is unknown DS41236A-page 21 PIC12F508/509/16F505 4.5 Option Register The Option register is a 8-bit wide, write-only register, which contains various control bits to configure the Timer0/WDT prescaler and Timer0. Note: If TRIS bit is set to ‘0’, the wake-up on change and pull-up functions are disabled for that pin (i.e., note that TRIS overrides Option control of GPPU/RBPU and GPWU/RBWU). Note: If the T0CS bit is set to ‘1’, it will override the TRIS function on the T0CKI pin. By executing the OPTION instruction, the contents of the W register will be transferred to the Option register. A Reset sets the Option<7:0> bits. REGISTER 4-3: OPTION REGISTER (PIC12F508/509) W-1 W-1 W-1 W-1 W-1 W-1 W-1 W-1 GPWU GPPU T0CS T0SE PSA PS2 PS1 PS0 bit 7 bit 0 bit 7 GPWU: Enable Wake-up on Pin Change bit (GP0, GP1, GP3) 1 = Disabled 0 = Enabled bit 6 GPPU: Enable Weak Pull-ups bit (GP0, GP1, GP3) 1 = Disabled 0 = Enabled bit 5 T0CS: Timer0 Clock Source Select bit 1 = Transition on T0CKI pin (overrides TRIS on the T0CKI pin) 0 = Transition on internal instruction cycle clock, FOSC/4 bit 4 T0SE: Timer0 Source Edge Select bit 1 = Increment on high-to-low transition on the T0CKI pin 0 = Increment on low-to-high transition on the T0CKI pin bit 3 PSA: Prescaler Assignment bit 1 = Prescaler assigned to the WDT 0 = Prescaler assigned to Timer0 bit 2-0 PS<2:0>: Prescaler Rate Select bits Bit Value 000 001 010 011 100 101 110 111 Timer0 Rate WDT Rate 1:2 1:4 1:8 1 : 16 1 : 32 1 : 64 1 : 128 1 : 256 1:1 1:2 1:4 1:8 1 : 16 1 : 32 1 : 64 1 : 128 Legend: DS41236A-page 22 R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared Preliminary x = Bit is unknown 2004 Microchip Technology Inc. PIC12F508/509/16F505 REGISTER 4-4: OPTION REGISTER (PIC16F505) W-1 W-1 W-1 W-1 W-1 W-1 W-1 W-1 RBWU RBPU T0CS T0SE PSA PS2 PS1 PS0 bit 7 bit 0 bit 7 RBWU: Enable Wake-up on Pin Change bit (RB0, RB1, RB3, RB4) 1 = Disabled 0 = Enabled bit 6 RBPU: Enable Weak Pull-ups bit (RB0, RB1, RB3, RB4) 1 = Disabled 0 = Enabled bit 5 T0CS: Timer0 clock Source Select bit 1 = Transition on T0CKI pin (overrides TRIS on the T0CKI pin) 0 = Transition on internal instruction cycle clock, FOSC/4 bit 4 T0SE: Timer0 Source Edge Select bit 1 = Increment on high-to-low transition on the T0CKI pin 0 = Increment on low-to-high transition on the T0CKI pin bit 3 PSA: Prescaler Assignment bit 1 = Prescaler assigned to the WDT 0 = Prescaler assigned to Timer0 bit 2-0 PS<2:0>: Prescaler Rate Select bits Bit Value 000 001 010 011 100 101 110 111 Timer0 Rate WDT Rate 1:2 1:4 1:8 1 : 16 1 : 32 1 : 64 1 : 128 1 : 256 1:1 1:2 1:4 1:8 1 : 16 1 : 32 1 : 64 1 : 128 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared 2004 Microchip Technology Inc. Preliminary x = Bit is unknown DS41236A-page 23 PIC12F508/509/16F505 4.6 OSCCAL Register The Oscillator Calibration (OSCCAL) register is used to calibrate the internal precision 4 MHz oscillator. It contains seven bits for calibration. Note: Erasing the device will also erase the preprogrammed internal calibration value for the internal oscillator. The calibration value must be read prior to erasing the part so it can be reprogrammed correctly later. After you move in the calibration constant, do not change the value. See Section 7.2.5 “Internal 4 MHz RC Oscillator”. REGISTER 4-5: OSCCAL REGISTER (ADDRESS: 05h) R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-0 CAL6 CAL5 CAL4 CAL3 CAL2 CAL1 CAL0 — bit 7 bit 0 bit 7-1 CAL<6:0>: Oscillator Calibration bits 0111111 = Maximum frequency • • • 0000001 0000000 = Center frequency 1111111 • • • 1000000 = Minimum frequency bit 0 Unimplemented: Read as ‘0’ Legend: DS41236A-page 24 R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared Preliminary x = Bit is unknown 2004 Microchip Technology Inc. PIC12F508/509/16F505 4.7 4.7.1 Program Counter EFFECTS OF RESET As a program instruction is executed, the Program Counter (PC) will contain the address of the next program instruction to be executed. The PC value is increased by one every instruction cycle, unless an instruction changes the PC. The PC is set upon a Reset, which means that the PC addresses the last location in the last page (i.e., the oscillator calibration instruction). After executing MOVLW XX, the PC will roll over to location 00h and begin executing user code. For a GOTO instruction, bits 8:0 of the PC are provided by the GOTO instruction word. The Program Counter (PCL) is mapped to PC<7:0>. Bit 5 of the Status register provides page information to bit 9 of the PC (Figure 4-6). The Status register page preselect bits are cleared upon a Reset, which means that page 0 is pre-selected. For a CALL instruction, or any instruction where the PCL is the destination, bits 7:0 of the PC again are provided by the instruction word. However, PC<8> does not come from the instruction word, but is always cleared (Figure 4-6). Instructions where the PCL is the destination, or modify PCL instructions, include MOVWF PC, ADDWF PC and BSF PC,5. Note: Because PC<8> is cleared in the CALL instruction or any modify PCL instruction, all subroutine calls or computed jumps are limited to the first 256 locations of any program memory page (512 words long). FIGURE 4-6: LOADING OF PC BRANCH INSTRUCTIONS GOTO Instruction 11 10 9 8 7 PC 0 PCL Therefore, upon a Reset, a GOTO instruction will automatically cause the program to jump to page 0 until the value of the page bits is altered. 4.8 The PIC12F508/509/16F505 devices have a 2-deep, 12-bit wide hardware PUSH/POP stack. A CALL instruction will PUSH the current value of Stack 1 into Stack 2 and then PUSH the current PC value, incremented by one, into Stack Level 1. If more than two sequential CALLs are executed, only the most recent two return addresses are stored. A RETLW instruction will POP the contents of Stack Level 1 into the PC and then copy Stack Level 2 contents into Stack Level 1. If more than two sequential RETLWs are executed, the stack will be filled with the address previously stored in Stack Level 2. Note that the W register will be loaded with the literal value specified in the instruction. This is particularly useful for the implementation of data look-up tables within the program memory. Note 1: There are no Status bits to indicate stack overflows or stack underflow conditions. 2: There are no instruction mnemonics called PUSH or POP. These are actions that occur from the execution of the CALL and RETLW instructions. Instruction Word 7 PA0 Stack 0 Status CALL or Modify PCL Instruction 11 10 9 8 7 PC 0 PCL 7 Instruction Word Reset to ‘0’ PA0 0 Status 2004 Microchip Technology Inc. Preliminary DS41236A-page 25 PIC12F508/509/16F505 4.9 EXAMPLE 4-1: Indirect Data Addressing: INDF and FSR Registers The INDF register is not a physical register. Addressing INDF actually addresses the register whose address is contained in the FSR register (FSR is a pointer). This is indirect addressing. 4.9.1 NEXT MOVLW MOVWF CLRF INCF BTFSC GOTO CONTINUE : : INDIRECT ADDRESSING • • • • Register file 07 contains the value 10h Register file 08 contains the value 0Ah Load the value 07 into the FSR register A read of the INDF register will return the value of 10h • Increment the value of the FSR register by one (FSR = 08) • A read of the INDR register now will return the value of 0Ah. HOW TO CLEAR RAM USING INDIRECT ADDRESSING 0x10 FSR INDF ;initialize pointer ;to RAM ;clear INDF ;register ;inc pointer ;all done? ;NO, clear next FSR,F FSR,4 NEXT ;YES, continue The FSR is a 5-bit wide register. It is used in conjunction with the INDF register to indirectly address the data memory area. Reading INDF itself indirectly (FSR = 0) will produce 00h. Writing to the INDF register indirectly results in a no operation (although Status bits may be affected). A simple program to clear RAM locations 10h-1Fh using indirect addressing is shown in Example 4-1. The FSR<4:0> bits are used to select data memory addresses 00h to 1Fh. PIC12F508 – Does not use banking. FSR <7:5> are unimplemented and read as ‘1’s. PIC12F509 – Uses FSR<5>. Selects between bank 0 and bank 1. FSR<7:6> is unimplemented, read as ‘1’. PIC16F505 – Uses FSR<6:5>. Selects from bank 0 to bank 3. FSR<7> is unimplemented, read as ‘1’. FIGURE 4-7: DIRECT/INDIRECT ADDRESSING (PIC12F508/509) Direct Addressing (FSR) 6 5 Bank Select 4 Indirect Addressing (opcode) 0 6 Location Select 5 4 Bank 00 (FSR) 0 Location Select 01 00h Addresses map back to addresses in Bank 0. Data Memory(1) 0Fh 10h 1Fh Bank 0 Note 1: 2: 3Fh Bank 1(2) For register map detail, see Section 4.3 “Data Memory Organization”. PIC12F509. DS41236A-page 26 Preliminary 2004 Microchip Technology Inc. PIC12F508/509/16F505 FIGURE 4-8: DIRECT/INDIRECT ADDRESSING (PIC16F505) Direct Addressing (FSR) 6 5 Bank Select 4 Indirect Addressing (opcode) 0 6 Location Select 01 10 00h (FSR) 0 Location Select 11 Addresses map back to addresses in Bank 0. 0Fh 10h 1Fh Bank 0 Note 1: 4 Bank 00 Data Memory(1) 5 3Fh Bank 1 5Fh Bank 2 7Fh Bank 3 For register map detail, see Section 4.3 “Data Memory Organization”. 2004 Microchip Technology Inc. Preliminary DS41236A-page 27 PIC12F508/509/16F505 NOTES: DS41236A-page 28 Preliminary 2004 Microchip Technology Inc. PIC12F508/509/16F505 5.0 I/O PORT 5.4 As with any other register, the I/O register(s) can be written and read under program control. However, read instructions (e.g., MOVF PORTB,W) always read the I/O pins independent of the pin’s input/output modes. On Reset, all I/O ports are defined as input (inputs are at high-impedance) since the I/O control registers are all set. Note: 5.1 On the PIC12F508/509, I/O PORTB is referenced as GPIO. On the PIC16F505, I/O PORTB is referenced as PORTB. The equivalent circuit for an I/O port pin is shown in Figure 5-2. All port pins, except RB3/GP3 which is input only, may be used for both input and output operations. For input operations, these ports are non-latching. Any input must be present until read by an input instruction (e.g., MOVF PORTB, W). The outputs are latched and remain unchanged until the output latch is rewritten. To use a port pin as output, the corresponding direction control bit in TRIS must be cleared (= 0). For use as an input, the corresponding TRIS bit must be set. Any I/O pin (except RB3/GP3) can be programmed individually as input or output. FIGURE 5-1: PORTB/GPIO PORTB/GPIO is an 8-bit I/O register. Only the loworder 6 bits are used (RB/GP<5:0>). Bits 7 and 6 are unimplemented and read as ‘0’s. Please note that RB3/ GP3 is an input only pin. The Configuration Word can set several I/O’s to alternate functions. When acting as alternate functions, the pins will read as ‘0’ during a port read. Pins RB0/GP0, RB1/GP1, RB3/GP3 and RB4 can be configured with weak pull-ups and also for wake-up on change. The wake-up on change and weak pull-up functions are not pin selectable. If RB3/GP3/ MCLR is configured as MCLR, weak pull-up is always on and wake-up on change for this pin is not enabled. 5.2 I/O Interfacing PORTC (PIC16F505 Only) Data Bus D WR Port W Reg CK VDD VDD Q P N D TRIS ‘f’ I/O pin Q TRIS Latch CK VSS VSS Q Reset (1) TRIS Registers The Output Driver Control register is loaded with the contents of the W register by executing the TRIS f instruction. A ‘1’ from a TRIS register bit puts the corresponding output driver in a High-Impedance mode. A ‘0’ puts the contents of the output data latch on the selected pins, enabling the output buffer. The exceptions are RB3/GP3, which is input only and the T0CKI pin, which may be controlled by the Option register. See Register 4-3 and Register 4-4. Note: Q Data Latch PORTC is an 8-bit I/O register. Only the low-order 6 bits are used (RC<5:0>). Bits 7 and 6 are unimplemented and read as ‘0’s. 5.3 PIC12F508/509/16F505 EQUIVALENT CIRCUIT FOR A SINGLE I/O PIN RD Port Note 1: See Table 3-3 for buffer type. A read of the ports reads the pins, not the output data latches. That is, if an output driver on a pin is enabled and driven high, but the external system is holding it low, a read of the port will indicate that the pin is low. The TRIS registers are “write-only” and are set (output drivers disabled) upon Reset. 2004 Microchip Technology Inc. Preliminary DS41236A-page 29 PIC12F508/509/16F505 TABLE 5-1: Address SUMMARY OF PORT REGISTERS Name Bit 7 Bit 6 TRISGPIO(1) Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on Power-On Reset Value on All Other Resets — — I/O Control Register --11 1111 --11 1111 N/A (2) TRISB — — I/O Control Register --11 1111 --11 1111 N/A TRISC(2) — — I/O Control Register --11 1111 --11 1111 N/A OPTION (1) GPWU GPPU TOCS TOSE PSA PS2 PS1 PS0 1111 1111 1111 1111 N/A OPTION(2) RBWU RBPU TOCS TOSE PSA PS2 PS1 PS0 1111 1111 1111 1111 03h STATUS(1) GPWUF — PAO TO PD Z DC C 0-01 1xxx q00q quuu(3) 03h STATUS (2) RBWUF — PAO TO PD Z DC C 0-01 1xxx q00q quuu(3) 06h GPIO(1) — — GP5 GP4 GP3 GP2 GP1 GP0 --xx xxxx --uu uuuu 06h PORTB(2) — — RB5 RB4 RB3 RB2 RB1 RB0 --xx xxxx --uu uuuu 07h (2) — — RC5 RC4 RC3 RC2 RC1 RC0 --xx xxxx --uu uuuu N/A Legend: Note 1: 2: 3: PORTC Shaded cells are not used by Port registers, read as ‘0’. — = unimplemented, read as ‘0’, x = unknown, u = unchanged, q = depends on condition. PIC12F508/509 only. PIC16F505 only. If Reset was due to wake-up on pin change, then bit 7 = 1. All other Resets will cause bit 7 = 0. DS41236A-page 30 Preliminary 2004 Microchip Technology Inc. PIC12F508/509/16F505 5.5 I/O Programming Considerations 5.5.1 BIDIRECTIONAL I/O PORTS Some instructions operate internally as read followed by write operations. The BCF and BSF instructions, for example, read the entire port into the CPU, execute the bit operation and re-write the result. Caution must be used when these instructions are applied to a port where one or more pins are used as input/outputs. For example, a BSF operation on bit 5 of PORTB/GPIO will cause all eight bits of PORTB/GPIO to be read into the CPU, bit 5 to be set and the PORTB/GPIO value to be written to the output latches. If another bit of PORTB/ GPIO is used as a bidirectional I/O pin (say bit 0) and it is defined as an input at this time, the input signal present on the pin itself would be read into the CPU and rewritten to the data latch of this particular pin, overwriting the previous content. As long as the pin stays in the Input mode, no problem occurs. However, if bit 0 is switched into Output mode later on, the content of the data latch may now be unknown. Example 5-1 shows the effect of two sequential Read-Modify-Write instructions (e.g., BCF, BSF, etc.) on an I/O port. A pin actively outputting a high or a low should not be driven from external devices at the same time in order to change the level on this pin (“wired OR”, “wired AND”). The resulting high output currents may damage the chip. FIGURE 5-2: READ-MODIFY-WRITE INSTRUCTIONS ON AN I/O PORT(e.g. PIC16F505) ;Initial PORTB Settings ;PORTB<5:3> Inputs ;PORTB<2:0> Outputs ; ; PORTB latch PORTB pins ; ------------------BCF PORTB, 5 ;--01 -ppp --11 pppp BCF PORTB, 4 ;--10 -ppp --11 pppp MOVLW 007h; TRIS PORTB ;--10 -ppp --11 pppp ; Note 1: The user may have expected the pin values to be ‘--00 pppp’. The 2nd BCF caused RB5 to be latched as the pin value (High). 5.5.2 SUCCESSIVE OPERATIONS ON I/O PORTS The actual write to an I/O port happens at the end of an instruction cycle, whereas for reading, the data must be valid at the beginning of the instruction cycle (Figure 5-2). Therefore, care must be exercised if a write followed by a read operation is carried out on the same I/O port. The sequence of instructions should allow the pin voltage to stabilize (load dependent) before the next instruction causes that file to be read into the CPU. Otherwise, the previous state of that pin may be read into the CPU rather than the new state. When in doubt, it is better to separate these instructions with a NOP or another instruction not accessing this I/O port. SUCCESSIVE I/O OPERATION (PIC16F505 Shown) Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 PC Instruction Fetched EXAMPLE 5-1: MOVWF PORTB PC + 1 MOVF PORTB, W Q1 Q2 Q3 Q4 PC + 2 PC + 3 This example shows a write to PORTB followed by a read from PORTB. NOP NOP Data setup time = (0.25 TCY – TPD) where: TCY = instruction cycle. RB<5:0> TPD = propagation delay Port pin written here Instruction Executed MOVWF PORTB (Write to PORTB) 2004 Microchip Technology Inc. Port pin sampled here MOVF PORTB,W (Read PORTB) Therefore, at higher clock frequencies, a write followed by a read may be problematic. NOP Preliminary DS41236A-page 31 PIC12F508/509/16F505 NOTES: DS41236A-page 32 Preliminary 2004 Microchip Technology Inc. PIC12F508/509/16F505 6.0 TIMER0 MODULE AND TMR0 REGISTER Counter mode is selected by setting the T0CS bit (Option<5>). In this mode, Timer0 will increment either on every rising or falling edge of pin T0CKI. The T0SE bit (Option<4>) determines the source edge. Clearing the T0SE bit selects the rising edge. Restrictions on the external clock input are discussed in detail in Section 6.1 “Using Timer0 with an External Clock”. The Timer0 module has the following features: • • • • 8-bit timer/counter register, TMR0 Readable and writable 8-bit software programmable prescaler Internal or external clock select: - Edge select for external clock Figure 6-1 is a simplified block diagram of the Timer0 module. Timer mode is selected by clearing the T0CS bit (Option<5>). In Timer mode, the Timer0 module will increment every instruction cycle (without prescaler). If TMR0 register is written, the increment is inhibited for the following two cycles (Figure 6-2 and Figure 6-3). The user can work around this by writing an adjusted value to the TMR0 register. FIGURE 6-1: The prescaler may be used by either the Timer0 module or the Watchdog Timer, but not both. The prescaler assignment is controlled in software by the control bit, PSA (Option<3>). Clearing the PSA bit will assign the prescaler to Timer0. The prescaler is not readable or writable. When the prescaler is assigned to the Timer0 module, prescale values of 1:2, 1:4,..., 1:256 are selectable. Section 6.2 “Prescaler” details the operation of the prescaler. A summary of registers associated with the Timer0 module is found in Table 6-1. TIMER0 BLOCK DIAGRAM Data Bus (GP2/RC5)/T0CKI FOSC/4 Pin 0 PSOUT 1 1 Programmable Prescaler(2) 0 T0SE 8 Sync with Internal Clocks TMR0 reg PSOUT (2 TCY delay) Sync 3 T0CS(1) Note 1: 2: The prescaler is shared with the Watchdog Timer (Figure 6-5). TIMER0 TIMING: INTERNAL CLOCK/NO PRESCALE Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 PC – 1 Instruction Fetch Timer0 PSA(1) Bits T0CS, T0SE, PSA, PS2, PS1 and PS0 are located in the Option register. FIGURE 6-2: PC (Program Counter) PS2, PS1, PS0(1) PC MOVWF TMR0 T0 T0 + 1 Instruction Executed 2004 Microchip Technology Inc. PC + 1 PC + 2 PC + 3 PC + 4 PC + 5 PC + 6 MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W T0 + 2 Write TMR0 executed NT0 + 1 NT0 Read TMR0 reads NT0 Read TMR0 reads NT0 Preliminary Read TMR0 reads NT0 NT0 + 2 Read TMR0 Read TMR0 reads NT0 + 1 reads NT0 + 2 DS41236A-page 33 PIC12F508/509/16F505 FIGURE 6-3: PC (Program Counter) TIMER0 TIMING: INTERNAL CLOCK/PRESCALE 1:2 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 PC – 1 Instruction Fetch PC MOVWF TMR0 T0 Timer0 N/A PC + 3 PC + 4 PC + 5 NT0 Read TMR0 reads NT0 Write TMR0 executed TABLE 6-1: 01h PC + 2 T0 + 1 Instruction Executed Address PC + 1 PC + 6 MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W NT0 + 1 Read TMR0 reads NT0 Read TMR0 Read TMR0 reads NT0 + 1 reads NT0 + 2 Read TMR0 reads NT0 REGISTERS ASSOCIATED WITH TIMER0 Name TMR0 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Timer0 – 8-bit real-time clock/counter (1) GPWU GPPU (2) RBWU RBPU — — — — OPTION N/A OPTION N/A TRISGPIO(1), (3) (2), (3) Value on All Other Resets xxxx xxxx uuuu uuuu T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111 T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111 --11 1111 --11 1111 --11 1111 --11 1111 I/O Control Register N/A TRISC Legend: Note 1: 2: 3: Shaded cells are not used by Timer0. — = unimplemented, x = unknown, u = unchanged. PIC12F508/509 only. PIC16F505 only. The TRIS of the T0CKI pin is overridden when T0CS = 1. DS41236A-page 34 Value on Power-On Reset RC5 RC4 RC3 Preliminary RC2 RC1 RC0 2004 Microchip Technology Inc. PIC12F508/509/16F505 6.1 Using Timer0 with an External Clock When an external clock input is used for Timer0, it must meet certain requirements. The external clock requirement is due to internal phase clock (TOSC) synchronization. Also, there is a delay in the actual incrementing of Timer0 after synchronization. 6.1.1 EXTERNAL CLOCK SYNCHRONIZATION When no prescaler is used, the external clock input is the same as the prescaler output. The synchronization of T0CKI with the internal phase clocks is accomplished by sampling the prescaler output on the Q2 and Q4 cycles of the internal phase clocks (Figure 6-4). Therefore, it is necessary for T0CKI to be high for at least 2 TOSC (and a small RC delay of 2 Tt0H) and low for at least 2 TOSC (and a small RC delay of 2 Tt0H). Refer to the electrical specification of the desired device. FIGURE 6-4: When a prescaler is used, the external clock input is divided by the asynchronous ripple counter-type prescaler, so that the prescaler output is symmetrical. For the external clock to meet the sampling requirement, the ripple counter must be taken into account. Therefore, it is necessary for T0CKI to have a period of at least 4 TOSC (and a small RC delay of 4 Tt0H) divided by the prescaler value. The only requirement on T0CKI high and low time is that they do not violate the minimum pulse width requirement of Tt0H. Refer to parameters 40, 41 and 42 in the electrical specification of the desired device. 6.1.2 TIMER0 INCREMENT DELAY Since the prescaler output is synchronized with the internal clocks, there is a small delay from the time the external clock edge occurs to the time the Timer0 module is actually incremented. Figure 6-4 shows the delay from the external clock edge to the timer incrementing. TIMER0 TIMING WITH EXTERNAL CLOCK Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 External Clock Input or Prescaler Output (2) Q1 Q2 Q3 Q4 Small pulse misses sampling (1) External Clock/Prescaler Output After Sampling (3) Increment Timer0 (Q4) Timer0 Note 1: T0 T0 + 1 T0 + 2 Delay from clock input change to Timer0 increment is 3 TOSC to 7 TOSC. (Duration of Q = TOSC). Therefore, the error in measuring the interval between two edges on Timer0 input = ±4 TOSC max. 2: External clock if no prescaler selected; prescaler output otherwise. 3: The arrows indicate the points in time where sampling occurs. 2004 Microchip Technology Inc. Preliminary DS41236A-page 35 PIC12F508/509/16F505 6.2 EXAMPLE 6-1: Prescaler An 8-bit counter is available as a prescaler for the Timer0 module or as a postscaler for the Watchdog Timer (WDT), respectively (see Section 7.6 “Watchdog Timer (WDT)”). For simplicity, this counter is being referred to as “prescaler” throughout this data sheet. Note: The prescaler may be used by either the Timer0 module or the WDT, but not both. Thus, a prescaler assignment for the Timer0 module means that there is no prescaler for the WDT and vice versa. The PSA and PS<2:0> bits (Option<3:0>) determine prescaler assignment and prescale ratio. When assigned to the Timer0 module, all instructions writing to the TMR0 register (e.g., CLRF 1, MOVWF 1, BSF 1, x, etc.) will clear the prescaler. When assigned to WDT, a CLRWDT instruction will clear the prescaler along with the WDT. The prescaler is neither readable nor writable. On a Reset, the prescaler contains all ‘0’s. 6.2.1 SWITCHING PRESCALER ASSIGNMENT CHANGING PRESCALER (TIMER0 → WDT) CLRWDT ;Clear WDT CLRF TMR0 ;Clear TMR0 & Prescaler MOVLW ‘00xx1111’b ;These 3 lines (5, 6, 7) OPTION ;are required only if ;desired CLRWDT ;PS<2:0> are 000 or 001 MOVLW ‘00xx1xxx’b ;Set Postscaler to OPTION ;desired WDT rate To change the prescaler from the WDT to the Timer0 module, use the sequence shown in Example 6-2. This sequence must be used even if the WDT is disabled. A CLRWDT instruction should be executed before switching the prescaler. EXAMPLE 6-2: CLRWDT MOVLW ‘xxxx0xxx’ CHANGING PRESCALER (WDT → TIMER0) ;Clear WDT and ;prescaler ;Select TMR0, new ;prescale value and ;clock source OPTION The prescaler assignment is fully under software control (i.e., it can be changed “on-the-fly” during program execution). To avoid an unintended device Reset, the following instruction sequence (Example 6-1) must be executed when changing the prescaler assignment from Timer0 to the WDT. DS41236A-page 36 Preliminary 2004 Microchip Technology Inc. PIC12F508/509/16F505 BLOCK DIAGRAM OF THE TIMER0/WDT PRESCALER(1), (2) FIGURE 6-5: TCY (= FOSC/4) Data Bus 0 (GP2/RC5)/T0CKI pin 1 8 M U X 1 M U X 0 T0SE T0CS 0 Watchdog Timer 1 M U X Sync 2 Cycles TMR0 reg PSA 8-bit Prescaler 8 8-to-1 MUX PS<2:0> PSA WDT Enable bit 1 0 MUX PSA WDT Time-out Note 1: 2: T0CS, T0SE, PSA, PS<2:0> are bits in the Option register. T0CKI is shared with pin RC5 on the PIC16F505 and pin GP2 on the PIC12F508/509. 2004 Microchip Technology Inc. Preliminary DS41236A-page 37 PIC12F508/509/16F505 NOTES: DS41236A-page 38 Preliminary 2004 Microchip Technology Inc. PIC12F508/509/16F505 7.0 SPECIAL FEATURES OF THE CPU The PIC12F508/509/16F505 devices have a Watchdog Timer, which can be shut off only through configuration bit WDTE. It runs off of its own RC oscillator for added reliability. If using HS (PIC16F505), XT or LP selectable oscillator options, there is always an 18 ms (nominal) delay provided by the Device Reset Timer (DRT), intended to keep the chip in Reset until the crystal oscillator is stable. If using INTRC or EXTRC, there is an 18 ms delay only on VDD power-up. With this timer on-chip, most applications need no external Reset circuitry. What sets a microcontroller apart from other processors are special circuits that deal with the needs of realtime applications. The PIC12F508/509/16F505 microcontrollers have a host of such features intended to maximize system reliability, minimize cost through elimination of external components, provide powersaving operating modes and offer code protection. These features are: The Sleep mode is designed to offer a very low current Power-down mode. The user can wake-up from Sleep through a change on input pins or through a Watchdog Timer time-out. Several oscillator options are also made available to allow the part to fit the application, including an internal 4 MHz oscillator. The EXTRC oscillator option saves system cost while the LP crystal option saves power. A set of configuration bits are used to select various options. • Oscillator Selection • Reset: - Power-on Reset (POR) - Device Reset Timer (DRT) - Wake-up from Sleep on Pin Change • Watchdog Timer (WDT) • Sleep • Code Protection • ID Locations • In-Circuit Serial Programming™ • Clock Out REGISTER 7-1: — — 7.1 Configuration Bits The PIC12F508/509/16F505 Configuration Words consist of 12 bits. Configuration bits can be programmed to select various device configurations. Three bits are for the selection of the oscillator type; (two bits on the PIC12F508/509), one bit is the Watchdog Timer enable bit, one bit is the MCLR enable bit and one bit is for code protection (Register 7-1, Register 7-2). CONFIGURATION WORD FOR PIC12F508/509(1) — — — — — MCLRE CP WDTE FOSC1 bit 11 FOSC0 bit 0 bit 11-5 Unimplemented: Read as ‘0’ bit 4 MCLRE: GP3/MCLR Pin Function Select bit 1 = GP3/MCLR pin function is MCLR 0 = GP3/MCLR pin function is digital I/O, MCLR internally tied to VDD bit 3 CP: Code Protection bit 1 = Code protection off 0 = Code protection on bit 2 WDTE: Watchdog Timer Enable bit 1 = WDT enabled 0 = WDT disabled bit 1-0 FOSC<1:0>: Oscillator Selection bits 11 = EXTRC = external selection bits 10 = INTRC = internal RC oscillator 01 = XT oscillator 00 = LP oscillator Note 1: Refer to the “PIC12F508/509 Memory Programming Specifications” (DS41227) to determine how to access the Configuration Word. The Configuration Word is not user addressable during device operation. Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = bit is set ‘0’ = bit is cleared 2004 Microchip Technology Inc. Preliminary x = bit is unknown DS41236A-page 39 PIC12F508/509/16F505 REGISTER 7-2: — — CONFIGURATION WORD FOR PIC16F505(1) — — — — MCLRE CP WDTE FOSC2 FOSC1 bit 11 FOSC0 bit 0 bit 11-6 Unimplemented: Read as ‘0’ bit 5 MCLRE: RB3/MCLR Pin Function Select bit 1 = RB3/MCLR pin function is MCLR 0 = RB3/MCLR pin function is digital I/O, MCLR internally tied to VDD bit 4 CP: Code Protection bit 1 = Code protection off 0 = Code protection on bit 3 WDTE: Watchdog Timer Enable bit 1 = WDT enabled 0 = WDT disabled bit 2-0 FOSC<1:0>: Oscillator Selection bits 111 = External RC oscillator/CLKOUT function on RB4/OSC2/CLKOUT pin 110 = External RC oscillator/RB4 function on RB4/OSC2/CLKOUT pin 101 = Internal RC oscillator/CLKOUT function on RB4/OSC2/CLKOUT pin 100 = Internal RC oscillator/RB4 function on RB4/OSC2/CLKOUT pin 011 = EC oscillator/RB4 function on RB4/OSC2/CLKOUT pin 010 = HS oscillator 001 = XT oscillator 000 = LP oscillator Note 1: Refer to the “PIC16F505 Memory Programming Specifications” (DS41226) to determine how to access the Configuration Word. The Configuration Word is not user addressable during device operation. Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = bit is set ‘0’ = bit is cleared DS41236A-page 40 Preliminary x = bit is unknown 2004 Microchip Technology Inc. PIC12F508/509/16F505 7.2 7.2.1 FIGURE 7-1: Oscillator Configurations OSCILLATOR TYPES The PIC12F508/509/16F505 devices can be operated in up to six different oscillator modes. The user can program up to three configuration bits (FOSC<1:0> [PIC12F508/509], FOSC<2:0> [PIC16F505]). To select one of these modes: C1(1) Sleep Low-Power Crystal Crystal/Resonator High-Speed Crystal/Resonator (PIC16F505 only) • INTRC: Internal 4 MHz Oscillator • EXTRC: External Resistor/Capacitor • EC: External High-Speed Clock Input (PIC16F505 only) XTAL RS(2) RF(3) To internal logic OSC2 C2(1) Note 1: See Capacitor Selection tables for recommended values of C1 and C2. A series resistor (RS) may be required for AT strip cut crystals. RF approx. value = 10 MΩ. 2: 3: CRYSTAL OSCILLATOR/CERAMIC RESONATORS In HS (PIC16F505), XT or LP modes, a crystal or ceramic resonator is connected to the (GP5/RB5)/ OSC1/(CLKIN) and (GP4/RB4)/OSC2/(CLKOUT) pins to establish oscillation (Figure 7-1). The PIC12F508/ 509/16F505 oscillator designs require the use of a parallel cut crystal. Use of a series cut crystal may give a frequency out of the crystal manufacturers specifications. When in HS (PIC16F505), XT or LP modes, the device can have an external clock source drive the (GP5/RB5)/OSC1/CLKIN pin (Figure 7-2). Note 1: This device has been designed to perform to the parameters of its data sheet. It has been tested to an electrical specification designed to determine its conformance with these parameters. Due to process differences in the manufacture of this device, this device may have different performance characteristics than its earlier version. These differences may cause this device to perform differently in your application than the earlier version of this device. FIGURE 7-2: EXTERNAL CLOCK INPUT OPERATION (HS, XT OR LP OSC CONFIGURATION) OSC1 Clock from ext. system PIC12F508/509 PIC16F505 Open TABLE 7-1: OSC2 CAPACITOR SELECTION FOR CERAMIC RESONATORS – PIC12F508/509/16F505(1) Osc Type Resonator Freq Cap. Range C1 Cap. Range C2 XT 4.0 MHz 30 pF 30 pF 16 MHz 10-47 pF 10-47 pF (2) HS Note 1: 2: The user should verify that the device oscillator starts and performs as expected. Adjusting the loading capacitor values and/or the Oscillator mode may be required. 2004 Microchip Technology Inc. PIC12F508/509 PIC16F505 OSC1 • LP: • XT: • HS: 7.2.2 CRYSTAL OPERATION (OR CERAMIC RESONATOR) (HS, XT OR LP OSC CONFIGURATION) Preliminary 2: These values are for design guidance only. Since each resonator has its own characteristics, the user should consult the resonator manufacturer for appropriate values of external components. PIC16F505 only. DS41236A-page 41 PIC12F508/509/16F505 TABLE 7-2: CAPACITOR SELECTION FOR CRYSTAL OSCILLATOR – PIC12F508/509/16F505(2) Osc Type Resonator Freq Cap.Range C1 Cap. Range C2 LP 32 kHz(1) 15 pF 15 pF XT 200 kHz 1 MHz 4 MHz 47-68 pF 15 pF 15 pF 47-68 pF 15 pF 15 pF 20 MHz 15-47 pF 15-47 pF HS(3) Note 1: 2: 3: 7.2.3 FIGURE 7-3: EXTERNAL PARALLEL RESONANT CRYSTAL OSCILLATOR CIRCUIT +5V To Other Devices 10k 74AS04 4.7k For VDD > 4.5V, C1 = C2 ≈ 30 pF is recommended. These values are for design guidance only. Rs may be required to avoid overdriving crystals with low drive level specification. Since each crystal has its own characteristics, the user should consult the crystal manufacturer for appropriate values of external components. PIC16F505 only. EXTERNAL CRYSTAL OSCILLATOR CIRCUIT PIC16F505 PIC12F508 PIC12F509 10k XTAL 10k 20 pF 20 pF Figure 7-4 shows a series resonant oscillator circuit. This circuit is also designed to use the fundamental frequency of the crystal. The inverter performs a 180degree phase shift in a series resonant oscillator circuit. The 330 Ω resistors provide the negative feedback to bias the inverters in their linear region. FIGURE 7-4: Either a prepackaged oscillator or a simple oscillator circuit with TTL gates can be used as an external crystal oscillator circuit. Prepackaged oscillators provide a wide operating range and better stability. A well-designed crystal oscillator will provide good performance with TTL gates. Two types of crystal oscillator circuits can be used: one with parallel resonance, or one with series resonance. Figure 7-3 shows implementation of a parallel resonant oscillator circuit. The circuit is designed to use the fundamental frequency of the crystal. The 74AS04 inverter performs the 180-degree phase shift that a parallel oscillator requires. The 4.7 kΩ resistor provides the negative feedback for stability. The 10 kΩ potentiometers bias the 74AS04 in the linear region. This circuit could be used for external oscillator designs. CLKIN 74AS04 330 EXTERNAL SERIES RESONANT CRYSTAL OSCILLATOR CIRCUIT To Other Devices 330 74AS04 74AS04 74AS04 CLKIN 0.1 mF XTAL 7.2.4 PIC16F505 PIC12F508 PIC12F509 EXTERNAL RC OSCILLATOR For timing insensitive applications, the RC device option offers additional cost savings. The RC oscillator frequency is a function of the supply voltage, the resistor (REXT) and capacitor (CEXT) values, and the operating temperature. In addition to this, the oscillator frequency will vary from unit to unit due to normal process parameter variation. Furthermore, the difference in lead frame capacitance between package types will also affect the oscillation frequency, especially for low CEXT values. The user also needs to take into account variation due to tolerance of external R and C components used. Figure 7-5 shows how the R/C combination is connected to the PIC12F508/509/16F505 devices. For REXT values below 3.0 kΩ, the oscillator operation may become unstable, or stop completely. For very high REXT values (e.g., 1 MΩ), the oscillator becomes sensitive to noise, humidity and leakage. Thus, we recommend keeping REXT between 5.0 kΩ and 100 kΩ. DS41236A-page 42 Preliminary 2004 Microchip Technology Inc. PIC12F508/509/16F505 Although the oscillator will operate with no external capacitor (CEXT = 0 pF), we recommend using values above 20 pF for noise and stability reasons. With no or small external capacitance, the oscillation frequency can vary dramatically due to changes in external capacitances, such as PCB trace capacitance or package lead frame capacitance. Section 10.0 “Electrical Characteristics”, shows RC frequency variation from part-to-part due to normal process variation. The variation is larger for larger values of R (since leakage current variation will affect RC frequency more for large R) and for smaller values of C (since variation of input capacitance will affect RC frequency more). Also, see the Electrical Specifications section for variation of oscillator frequency due to VDD for given REXT/CEXT values, as well as frequency variation due to operating temperature for given R, C and VDD values. FIGURE 7-5: EXTERNAL RC OSCILLATOR MODE VDD REXT OSC1 OSCCAL, when written to with the calibration value, will “trim” the internal oscillator to remove process variation from the oscillator frequency. Note: Note: PIC16F505 PIC12F508 PIC12F509 VSS FOSC/4 Erasing the device will also erase the preprogrammed internal calibration value for the internal oscillator. The calibration value must be read prior to erasing the part so it can be reprogrammed correctly later. For the PIC12F508/509/16F505 devices, only bits <7:1> of OSCCAL are implemented. Bits CAL6-CAL0 are used for calibration. Adjusting CAL6-CAL0 from ‘0000000’ to ‘1111111’ changes the clock speed. See Register 4-5 for more information. N CEXT 7.2.5 Internal clock In addition, a calibration instruction is programmed into the last address of memory, which contains the calibration value for the internal RC oscillator. This location is always uncode protected, regardless of the code-protect settings. This value is programmed as a MOVLW XX instruction where XX is the calibration value, and is placed at the Reset vector. This will load the W register with the calibration value upon Reset and the PC will then roll over to the users program at address 0x000. The user then has the option of writing the value to the OSCCAL Register (05h) or ignoring it. The 0 bit of OSCCAL is unimplemented and should be written as 0 when modifying OSCCAL for compatibility with future devices. OSC2/CLKOUT INTERNAL 4 MHz RC OSCILLATOR The internal RC oscillator provides a fixed 4 MHz (nominal) system clock at VDD = 5V and 25°C, (see Section 10.0 “Electrical Characteristics” for information on variation over voltage and temperature). 2004 Microchip Technology Inc. Preliminary DS41236A-page 43 PIC12F508/509/16F505 7.3 7.3.1 Reset The device differentiates between various kinds of Reset: • • • • • • Power-on Reset (POR) MCLR Reset during normal operation MCLR Reset during Sleep WDT time-out Reset during normal operation WDT time-out Reset during Sleep Wake-up from Sleep on pin change EXTERNAL CLOCK IN For applications where a clock is already available elsewhere, users may directly drive the PIC12F508/ 509/16F505 devices provided that this external clock source meets the AC/DC timing requirements listed in Section 7.6 “Watchdog Timer (WDT)”. Figure 7-6 below shows how an external clock circuit should be configured. FIGURE 7-6: Some registers are not reset in any way, they are unknown on POR and unchanged in any other Reset. Most other registers are reset to “Reset state” on Power-on Reset (POR), MCLR, WDT or Wake-up on pin change Reset during normal operation. They are not affected by a WDT Reset during Sleep or MCLR Reset during Sleep, since these Resets are viewed as resumption of normal operation. The exceptions to this are TO, PD and RBWUF/GPWUF bits. They are set or cleared differently in different Reset situations. These bits are used in software to determine the nature of Reset. See Table 7-4 for a full description of Reset states of all registers. EXTERNAL CLOCK INPUT OPERATION PIC16F505: EC, HS, XT, LP Clock From ext. system RB5/OSC1/CLKIN PIC16F505 PIC12F508/509: XT, LP Clock From ext. system GP5/OSC1/CLKIN PIC12F508 PIC12F509 GP4/OSC2 OSC2 Note 1: TABLE 7-3: Register W OSC2/CLKOUT/RB4(1) OSC2/CLKOUT/RB4 RB4 is available in EC mode only. RESET CONDITIONS FOR REGISTERS – PIC12F508/509 Address — Power-on Reset MCLR Reset, WDT Time-out, Wake-up On Pin Change qqqq qqqu(1) qqqq qqqu(1) INDF 00h xxxx xxxx uuuu uuuu TMR0 01h xxxx xxxx uuuu uuuu PC 02h 1111 1111 1111 1111 STATUS 03h 0001 1xxx q00q quuu(2), (3) FSR(4) 04h 110x xxxx 11uu uuuu FSR(5) 04h 111x xxxx 111u uuuu OSCCAL 05h 1111 111- uuuu uuu- GPIO 06h --xx xxxx --uu uuuu — 1111 1111 1111 1111 — --11 1111 --11 1111 OPTION TRIS Legend: Note 1: 2: 3: 4: 5: u = unchanged, x = unknown, — = unimplemented bit, read as ‘0’, q = value depends on condition. Bits <7:2> of W register contain oscillator calibration values due to MOVLW XX instruction at top of memory. See Table 7-8 for Reset value for specific conditions. If Reset was due to wake-up on pin change, then bit 7 = 1. All other Resets will cause bit 7 = 0. PIC12F509 only. PIC12F508 only. DS41236A-page 44 Preliminary 2004 Microchip Technology Inc. PIC12F508/509/16F505 TABLE 7-4: RESET CONDITIONS FOR REGISTERS – PIC16F505 Register Address Power-on Reset MCLR Reset, WDT Time-out, Wake-up On Pin Change qqqq qqqu(1) qqqq qqqu(1) 00h xxxx xxxx uuuu uuuu TMR0 01h xxxx xxxx uuuu uuuu PC 02h 1111 1111 1111 1111 STATUS 03h 0001 1xxx q00q quuu(2), (3) FSR 04h 110x xxxx 11uu uuuu OSCCAL 05h 1111 111- uuuu uuu- PORTB 06h --xx xxxx --uu uuuu PORTC 07h --xx xxxx --uu uuuu OPTION — 1111 1111 1111 1111 TRISB — --11 1111 --11 1111 — --11 1111 --11 1111 W — INDF TRISC Legend: Note 1: 2: 3: u = unchanged, x = unknown, — = unimplemented bit, read as ‘0’, q = value depends on condition. Bits <7:2> of W register contain oscillator calibration values due to MOVLW XX instruction at top of memory. See Table 7-8 for Reset value for specific conditions. If Reset was due to wake-up on pin change, then bit 7 = 1. All other Resets will cause bit 7 = 0. TABLE 7-5: RESET CONDITION FOR SPECIAL REGISTERS STATUS Addr: 03h PCL Addr: 02h Power-on Reset 0001 1xxx 1111 1111 MCLR Reset during normal operation 000u uuuu 1111 1111 MCLR Reset during Sleep 0001 0uuu 1111 1111 WDT Reset during Sleep 0000 0uuu 1111 1111 WDT Reset normal operation 0000 uuuu 1111 1111 Wake-up from Sleep on pin change 1001 0uuu 1111 1111 Legend: u = unchanged, x = unknown, — = unimplemented bit, read as ‘0’. 2004 Microchip Technology Inc. Preliminary DS41236A-page 45 PIC12F508/509/16F505 7.3.2 MCLR ENABLE This configuration bit, when unprogrammed (left in the ‘1’ state), enables the external MCLR function. When programmed, the MCLR function is tied to the internal VDD and the pin is assigned to be a I/O. See Figure 7-7. FIGURE 7-7: MCLR SELECT GPWU/RBWU (GP3/RB3)/MCLR/VPP Internal MCLR MCLRE 7.4 Power-on Reset (POR) The PIC12F508/509/16F505 devices incorporate an on-chip Power-on Reset (POR) circuitry, which provides an internal chip Reset for most power-up situations. The on-chip POR circuit holds the chip in Reset until VDD has reached a high enough level for proper operation. To take advantage of the internal POR, program the (GP3/RB3)/MCLR/VPP pin as MCLR and tie through a resistor to VDD, or program the pin as (GP3/ RB3). An internal weak pull-up resistor is implemented using a transistor (refer to Table 10-2 for the pull-up resistor ranges). This will eliminate external RC components usually needed to create a Power-on Reset. A maximum rise time for VDD is specified. See Section 10.0 “Electrical Characteristics” for details. When the devices start normal operation (exit the Reset condition), device operating parameters (voltage, frequency, temperature,...) must be met to ensure operation. If these conditions are not met, the devices must be held in Reset until the operating parameters are met. The Power-on Reset circuit and the Device Reset Timer (see Section 7.5 “Device Reset Timer (DRT)”) circuit are closely related. On power-up, the Reset latch is set and the DRT is reset. The DRT timer begins counting once it detects MCLR to be high. After the time-out period, which is typically 18 ms, it will reset the Reset latch and thus end the on-chip Reset signal. A power-up example where MCLR is held low is shown in Figure 7-9. VDD is allowed to rise and stabilize before bringing MCLR high. The chip will actually come out of Reset TDRT msec after MCLR goes high. In Figure 7-10, the on-chip Power-on Reset feature is being used (MCLR and VDD are tied together or the pin is programmed to be (GP3/RB3). The VDD is stable before the Start-up timer times out and there is no problem in getting a proper Reset. However, Figure 7-11 depicts a problem situation where VDD rises too slowly. The time between when the DRT senses that MCLR is high and when MCLR and VDD actually reach their full value, is too long. In this situation, when the start-up timer times out, VDD has not reached the VDD (min) value and the chip may not function correctly. For such situations, we recommend that external RC circuits be used to achieve longer POR delay times (Figure 7-10). Note: When the devices start normal operation (exit the Reset condition), device operating parameters (voltage, frequency, temperature, etc.) must be met to ensure operation. If these conditions are not met, the device must be held in Reset until the operating conditions are met. For additional information, refer to Application Notes AN522 “Power-Up Considerations” (DS00522) and AN607 “Power-up Trouble Shooting” (DS00607). A simplified block diagram of the on-chip Power-on Reset circuit is shown in Figure 7-8. DS41236A-page 46 Preliminary 2004 Microchip Technology Inc. PIC12F508/509/16F505 FIGURE 7-8: SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT VDD Power-up Detect POR (Power-on Reset) (GP3/RB3)/MCLR/VPP MCLR Reset MCLRE WDT Reset WDT Time-out S Q R Q Start-up Timer CHIP Reset (10 µs or 18 ms) Pin Change Sleep Wake-up on pin Change Reset FIGURE 7-9: TIME-OUT SEQUENCE ON POWER-UP (MCLR PULLED LOW) VDD MCLR Internal POR TDRT DRT Time-out Internal Reset TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD): FAST VDD RISE TIME FIGURE 7-10: VDD MCLR Internal POR TDRT DRT Time-out Internal Reset 2004 Microchip Technology Inc. Preliminary DS41236A-page 47 PIC12F508/509/16F505 FIGURE 7-11: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD): SLOW VDD RISE TIME V1 VDD MCLR Internal POR TDRT DRT Time-out Internal Reset Note: When VDD rises slowly, the TDRT time-out expires long before VDD has reached its final value. In this example, the chip will reset properly if, and only if, V1 ≥ VDD min. DS41236A-page 48 Preliminary 2004 Microchip Technology Inc. PIC12F508/509/16F505 7.5 TABLE 7-6: Device Reset Timer (DRT) On the PIC12F508/509/16F505 devices, the DRT runs any time the device is powered up. DRT runs from Reset and varies based on oscillator selection and Reset type (see Table 7-6). The DRT operates on an internal RC oscillator. The processor is kept in Reset as long as the DRT is active. The DRT delay allows VDD to rise above VDD min. and for the oscillator to stabilize. Oscillator circuits based on crystals or ceramic resonators require a certain time after power-up to establish a stable oscillation. The on-chip DRT keeps the devices in a Reset condition for approximately 18 ms after MCLR has reached a logic high (VIH MCLR) level. Programming (GP3/RB3)/MCLR/VPP as MCLR and using an external RC network connected to the MCLR input is not required in most cases. This allows savings in cost-sensitive and/or space restricted applications, as well as allowing the use of the (GP3/RB3)/MCLR/VPP pin as a general purpose input. The Device Reset Time delays will vary from chip-tochip due to VDD, temperature and process variation. See AC parameters for details. The DRT will also be triggered upon a Watchdog Timer time-out from Sleep. This is particularly important for applications using the WDT to wake from Sleep mode automatically. Reset sources are POR, MCLR, WDT time-out and wake-up on pin change. See Section 7.9.2 “Wake-up from Sleep”, Notes 1, 2 and 3. 7.6 DRT (DEVICE RESET TIMER PERIOD) Oscillator Configuration POR Reset Subsequent Resets INTOSC, EXTRC 18 ms (typical) 10 µs (typical) HS(1) 18 ms (typical) 18 ms (typical) 18 ms (typical) 10 µs (typical) , XT, LP (1) EC Note 1: 7.6.1 PIC16F505 only. WDT PERIOD The WDT has a nominal time-out period of 18 ms, (with no prescaler). If a longer time-out period is desired, a prescaler with a division ratio of up to 1:128 can be assigned to the WDT (under software control) by writing to the Option register. Thus, a time-out period of a nominal 2.3 seconds can be realized. These periods vary with temperature, VDD and part-to-part process variations (see DC specs). Under worst case conditions (VDD = Min., Temperature = Max., max. WDT prescaler), it may take several seconds before a WDT time-out occurs. 7.6.2 WDT PROGRAMMING CONSIDERATIONS The CLRWDT instruction clears the WDT and the postscaler, if assigned to the WDT, and prevents it from timing out and generating a device Reset. The SLEEP instruction resets the WDT and the postscaler, if assigned to the WDT. This gives the maximum Sleep time before a WDT wake-up Reset. Watchdog Timer (WDT) The Watchdog Timer (WDT) is a free running on-chip RC oscillator, which does not require any external components. This RC oscillator is separate from the external RC oscillator of the (GP5/RB5)/OSC1/CLKIN pin and the internal 4 MHz oscillator. This means that the WDT will run even if the main processor clock has been stopped, for example, by execution of a SLEEP instruction. During normal operation or Sleep, a WDT Reset or wake-up Reset, generates a device Reset. The TO bit (Status<4>) will be cleared upon a Watchdog Timer Reset. The WDT can be permanently disabled by programming the configuration WDTE as a ‘0’ (see Section 7.1 “Configuration Bits”). Refer to the PIC12F508/509/ 16F505 Programming Specifications to determine how to access the configuration word. 2004 Microchip Technology Inc. Preliminary DS41236A-page 49 PIC12F508/509/16F505 FIGURE 7-12: WATCHDOG TIMER BLOCK DIAGRAM From Timer0 Clock Source (Figure 6-5) 0 1 Watchdog Time M U X Postscaler 8-to-1 MUX PS<2:0> PSA WDT Enable Configuration Bit To Timer0 (Figure 6-4) 0 1 MUX PSA WDT Time-out Note 1: TABLE 7-7: Address T0CS, T0SE, PSA, PS<2:0> are bits in the Option register. SUMMARY OF REGISTERS ASSOCIATED WITH THE WATCHDOG TIMER Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on Power-On Reset Value on All Other Resets N/A OPTION(1) GPWU GPPU T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111 N/A OPTION(2) RBPU T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111 RBWU Legend: Shaded boxes = Not used by Watchdog Timer. — = unimplemented, read as ‘0’, u = unchanged. Note 1: PIC12F508/509 only. 2: PIC16F505 only. DS41236A-page 50 Preliminary 2004 Microchip Technology Inc. PIC12F508/509/16F505 7.7 Time-out Sequence, Power-down and Wake-up from Sleep Status Bits (TO, PD, GPWUF/RBWUF) FIGURE 7-14: VDD VDD The TO, PD and (GPWUF/RBWUF) bits in the Status register can be tested to determine if a Reset condition has been caused by a Power-up condition, a MCLR or Watchdog Timer (WDT) Reset. TABLE 7-8: R1 TO PD 0 0 0 WDT wake-up from Sleep 0 0 u WDT time-out (not from Sleep) 0 1 0 MCLR wake-up from Sleep 0 1 1 Power-up 0 u u MCLR not during Sleep 1 1 0 Wake-up from Sleep on pin change Reset Caused By Note 1: 40k(1) This brown-out circuit is less expensive, although less accurate. Transistor Q1 turns off when VDD is below a certain level such that: R1 VDD • 2: To reset PIC12F508/509/16F505 devices when a Brown-out occurs, external Brown-out protection circuits may be built, as shown in Figure 7-13 and Figure 7-14. BROWN-OUT PROTECTION CIRCUIT 3 VDD MCP809 VSS RST Reset on Brown-out A Brown-out is a condition where device power (VDD) dips below its minimum value, but not to zero, and then recovers. The device should be reset in the event of a Brown-out. = 0.7V R1 + R2 Pin must be confirmed as MCLR. FIGURE 7-15: Legend: u = unchanged Note 1: The TO, PD and GPWUF/RBWUF bits maintain their status (u) until a Reset occurs. A low-pulse on the MCLR input does not change the TO, PD and GPWUF/RBWUF status bits. FIGURE 7-13: PIC16F505 PIC12F508 Q1 MCLR(2) PIC12F509 R2 TO/PD/(GPWUF/RBWUF) STATUS AFTER RESET GPWUF/ RBWUF 7.8 BROWN-OUT PROTECTION CIRCUIT 2 Bypass Capacitor VDD VDD MCLR PIC16F505 PIC12F508 PIC12F509 Note: This Brown-out Protection circuit employs Microchip Technology’s MCP809 microcontroller supervisor. There are 7 different trip point selections to accommodate 5V to 3V systems. BROWN-OUT PROTECTION CIRCUIT 1 VDD VDD 33k 10k Q1 MCLR PIC16F505 PIC12F508 (2) PIC12F509 40k(1) Note 1: 2: This circuit will activate Reset when VDD goes below Vz + 0.7V (where Vz = Zener voltage). Pin must be confirmed as MCLR. 2004 Microchip Technology Inc. Preliminary DS41236A-page 51 PIC12F508/509/16F505 7.9 Power-down Mode (Sleep) 7.10 A device may be powered down (Sleep) and later powered up (wake-up from Sleep). 7.9.1 SLEEP The Power-down mode is entered by executing a SLEEP instruction. If enabled, the Watchdog Timer will be cleared but keeps running, the TO bit (Status<4>) is set, the PD bit (Status<3>) is cleared and the oscillator driver is turned off. The I/O ports maintain the status they had before the SLEEP instruction was executed (driving high, driving low or high-impedance). Note: A Reset generated by a WDT time-out does not drive the MCLR pin low. For lowest current consumption while powered down, the T0CKI input should be at VDD or VSS and the (GP3/RB3)/MCLR/VPP pin must be at a logic high level if MCLR is enabled. 7.9.2 WAKE-UP FROM SLEEP Program Verification/Code Protection If the code protection bit has not been programmed, the on-chip program memory can be read out for verification purposes. The first 64 locations and the last location (OSCCAL) can be read, regardless of the code protection bit setting. The last memory location can be read regardless of the code protection bit setting on the PIC12F508/509/ 16F505 devices. 7.11 ID Locations Four memory locations are designated as ID locations where the user can store checksum or other code identification numbers. These locations are not accessible during normal execution, but are readable and writable during program/verify. Use only the lower 4 bits of the ID locations and always program the upper 8 bits as ‘0’s. The device can wake-up from Sleep through one of the following events: 7.12 1. The PIC12F508/509/16F505 microcontrollers can be serially programmed while in the end application circuit. This is simply done with two lines for clock and data, and three other lines for power, ground and the programming voltage. This allows customers to manufacture boards with unprogrammed devices and then program the microcontroller just before shipping the product. This also allows the most recent firmware, or a custom firmware, to be programmed. 2. 3. An external reset input on (GP3/RB3)/MCLR/VPP pin, when configured as MCLR. A Watchdog Timer time-out Reset (if WDT was enabled). A change on input pin GP0/RB0, GP1/RB1, GP3/RB3 or RB4 when wake-up on change is enabled. These events cause a device Reset. The TO, PD and GPWUF/RBWUF bits can be used to determine the cause of device Reset. The TO bit is cleared if a WDT time-out occurred (and caused wake-up). The PD bit, which is set on power-up, is cleared when SLEEP is invoked. The GPWUF/RBWUF bit indicates a change in state while in Sleep at pins GP0/RB0, GP1/RB1, GP3/RB3 or RB4 (since the last file or bit operation on GP/RB port). Note: Caution: Right before entering Sleep, read the input pins. When in Sleep, wake up occurs when the values at the pins change from the state they were in at the last reading. If a wake-up on change occurs and the pins are not read before reentering Sleep, a wake-up will occur immediately even if no pins change while in Sleep mode. In-Circuit Serial Programming™ The devices are placed into a Program/Verify mode by holding the GP1/RB1 and GP0/RB0 pins low while raising the MCLR (VPP) pin from VIL to VIHH (see programming specification). GP1/RB1 becomes the programming clock and GP0/RB0 becomes the programming data. Both GP1/RB1 and GP0/RB0 are Schmitt Trigger inputs in this mode. After Reset, a 6-bit command is then supplied to the device. Depending on the command, 14 bits of program data are then supplied to or from the device, depending if the command was a Load or a Read. For complete details of serial programming, please refer to the PIC12F508/509/16F505 Programming Specifications. A typical In-Circuit Serial Programming connection is shown in Figure 7-16. The WDT is cleared when the device wakes from Sleep, regardless of the wake-up source. DS41236A-page 52 Preliminary 2004 Microchip Technology Inc. PIC12F508/509/16F505 FIGURE 7-16: External Connector Signals TYPICAL IN-CIRCUIT SERIAL PROGRAMMING CONNECTION To Normal Connections PIC16F505 PIC12F508 PIC12F509 +5V VDD 0V VSS VPP MCLR/VPP CLK GP1/RB1 Data I/O GP0/RB0 VDD To Normal Connections 2004 Microchip Technology Inc. Preliminary DS41236A-page 53 PIC12F508/509/16F505 NOTES: DS41236A-page 54 Preliminary 2004 Microchip Technology Inc. PIC12F508/509/16F505 8.0 INSTRUCTION SET SUMMARY The PIC16 instruction set is highly orthogonal and is comprised of three basic categories. • Byte-oriented operations • Bit-oriented operations • Literal and control operations Each PIC16 instruction is a 12-bit word divided into an opcode, which specifies the instruction type, and one or more operands which further specify the operation of the instruction. The formats for each of the categories is presented in Figure 8-1, while the various opcode fields are summarized in Table 8-1. For byte-oriented instructions, ‘f’ represents a file register designator and ‘d’ represents a destination designator. The file register designator specifies which file register is to be used by the instruction. The destination designator specifies where the result of the operation is to be placed. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed in the file register specified in the instruction. For bit-oriented instructions, ‘b’ represents a bit field designator which selects the number of the bit affected by the operation, while ‘f’ represents the number of the file in which the bit is located. All instructions are executed within a single instruction cycle, unless a conditional test is true or the program counter is changed as a result of an instruction. In this case, the execution takes two instruction cycles. One instruction cycle consists of four oscillator periods. Thus, for an oscillator frequency of 4 MHz, the normal instruction execution time is 1 µs. If a conditional test is true or the program counter is changed as a result of an instruction, the instruction execution time is 2 µs. Figure 8-1 shows the three general formats that the instructions can have. All examples in the figure use the following format to represent a hexadecimal number: 0xhhh where ‘h’ signifies a hexadecimal digit. FIGURE 8-1: Byte-oriented file register operations 11 Bit-oriented file register operations 11 OPCODE 11 Register file address (0x00 to 0x7F) W Working register (accumulator) b Bit address within an 8-bit file register k Literal field, constant data or label x Don’t care location (= 0 or 1) The assembler will generate code with x = 0. It is the recommended form of use for compatibility with all Microchip software tools. Label name Top-of-Stack PC Program Counter WDT Watchdog Timer counter TO Time-out bit PD Power-down bit dest Destination, either the W register or the specified register file location [ ] Options ( ) Contents → < > ∈ italics 8 7 5 4 b (BIT #) 8 0 f (FILE #) 7 OPCODE 0 k (literal) k = 8-bit immediate value Literal and control operations – GOTO instruction Destination select; d = 0 (store result in W) d = 1 (store result in file register ‘f’) Default is d = 1 TOS 0 f (FILE #) Literal and control operations (except GOTO) Description label 4 b = 3-bit bit address f = 5-bit file register address f d 5 d d = 0 for destination W d = 1 for destination f f = 5-bit file register address OPCODE FIELD DESCRIPTIONS Field 6 OPCODE For literal and control operations, ‘k’ represents an 8 or 9-bit constant or literal value. TABLE 8-1: GENERAL FORMAT FOR INSTRUCTIONS 11 9 8 OPCODE 0 k (literal) k = 9-bit immediate value Assigned to Register bit field In the set of User defined term (font is courier) 2004 Microchip Technology Inc. Preliminary DS41236A-page 55 PIC12F508/509/16F505 TABLE 8-2: INSTRUCTION SET SUMMARY Mnemonic, Operands ADDWF ANDWF CLRF CLRW COMF DECF DECFSZ INCF INCFSZ IORWF MOVF MOVWF NOP RLF RRF SUBWF SWAPF XORWF 12-Bit Opcode Description Cycles MSb LSb Status Notes Affected f, d f, d f – f, d f, d f, d f, d f, d f, d f, d f – f, d f, d f, d f, d f, d 0001 11df ffff C, DC, Z 1, 2, 4 Add W and f 1 0001 01df ffff AND W with f 1 Z 2, 4 0000 011f ffff Clear f 1 Z 4 0000 0100 0000 Clear W 1 Z 0010 01df ffff Complement f 1 Z 0000 11df ffff Decrement f 1 Z 2, 4 0010 11df ffff Decrement f, Skip if 0 1(2) None 2, 4 1 0010 10df ffff Increment f Z 2, 4 1(2) 0011 11df ffff Increment f, Skip if 0 None 2, 4 1 0001 00df ffff Inclusive OR W with f Z 2, 4 1 0010 00df ffff Move f Z 2, 4 1 0000 001f ffff Move W to f None 1, 4 1 0000 0000 0000 No Operation None 1 0011 01df ffff Rotate left f through Carry C 2, 4 1 0011 00df ffff Rotate right f through Carry C 2, 4 1 0000 10df ffff C, DC, Z 1, 2, 4 Subtract W from f 1 0011 10df ffff Swap f None 2, 4 1 0001 10df ffff Exclusive OR W with f Z 2, 4 BIT-ORIENTED FILE REGISTER OPERATIONS 0100 bbbf ffff None 2, 4 1 Bit Clear f BCF f, b 0101 bbbf ffff None 2, 4 1 Bit Set f BSF f, b 0110 bbbf ffff None Bit Test f, Skip if Clear 1(2) BTFSC f, b 1(2) 0111 bbbf ffff None f, b Bit Test f, Skip if Set BTFSS LITERAL AND CONTROL OPERATIONS ANDLW k AND literal with W 1 1110 kkkk kkkk Z CALL 1 k Call Subroutine 2 1001 kkkk kkkk None CLRWDT – Clear Watchdog Timer 1 0000 0000 0100 TO, PD None GOTO k Unconditional branch 2 101k kkkk kkkk Z IORLW k Inclusive OR literal with W 1 1101 kkkk kkkk None MOVLW k Move literal to W 1 1100 kkkk kkkk None OPTION – Load Option register 1 0000 0000 0010 None RETLW k Return, place literal in W 2 1000 kkkk kkkk SLEEP – Go into Standby mode 1 0000 0000 0011 TO, PD None 3 TRIS f Load TRIS register 1 0000 0000 0fff Z XORLW k Exclusive OR literal to W 1 1111 kkkk kkkk Note 1: The 9th bit of the program counter will be forced to a ‘0’ by any instruction that writes to the PC except for GOTO. See Section 4.7 “Program Counter”. 2: When an I/O register is modified as a function of itself (e.g. MOVF PORTB, 1), the value used will be that value present on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input and is driven low by an external device, the data will be written back with a ‘0’. 3: The instruction TRIS f, where f = 6, causes the contents of the W register to be written to the tri-state latches of PORTB. A ‘1’ forces the pin to a high-impedance state and disables the output buffers. 4: If this instruction is executed on the TMR0 register (and, where applicable, d = 1), the prescaler will be cleared (if assigned to TMR0). DS41236A-page 56 Preliminary 2004 Microchip Technology Inc. PIC12F508/509/16F505 ADDWF Add W and f BCF Syntax: [ label ] ADDWF Syntax: [ label ] BCF Operands: 0 ≤ f ≤ 31 d ∈ [0,1] Operands: 0 ≤ f ≤ 31 0≤b≤7 Operation: (W) + (f) → (dest) Operation: 0 → (f<b>) Status Affected: C, DC, Z Status Affected: None Description: Description: Bit ‘b’ in register ‘f’ is cleared. BSF Bit Set f Syntax: [ label ] BSF Operands: 0 ≤ f ≤ 31 0≤b≤7 Status Affected: Z Operation: 1 → (f<b>) Description: The contents of the W register are AND’ed with the eight-bit literal ‘k’. The result is placed in the W register. Status Affected: None ANDWF AND W with f BTFSC Syntax: [ label ] ANDWF Operands: Operation: ANDLW Syntax: f,d Bit Clear f Add the contents of the W register and register ‘f’. If ‘d’ is’0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. AND literal with W [ label ] ANDLW k Operands: 0 ≤ k ≤ 255 Operation: (W).AND. (k) → (W) f,b f,b Description: Bit ‘b’ in register ‘f’ is set. Bit Test f, Skip if Clear Syntax: [ label ] BTFSC f,b 0 ≤ f ≤ 31 d ∈ [0,1] Operands: 0 ≤ f ≤ 31 0≤b≤7 (W) .AND. (f) → (dest) Operation: skip if (f<b>) = 0 Status Affected: Z Status Affected: None Description: Description: If bit ‘b’ in register ‘f’ is ‘0’, then the next instruction is skipped. If bit ‘b’ is ‘0’, then the next instruction fetched during the current instruction execution is discarded, and a NOP is executed instead, making this a 2-cycle instruction. f,d The contents of the W register are AND’ed with register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. 2004 Microchip Technology Inc. Preliminary DS41236A-page 57 PIC12F508/509/16F505 BTFSS Bit Test f, Skip if Set CLRW Syntax: [ label ] BTFSS f,b Syntax: [ label ] CLRW 0 ≤ f ≤ 31 0≤b<7 Operands: None Operation: 00h → (W); 1→Z Operands: Clear W Operation: skip if (f<b>) = 1 Status Affected: None Status Affected: Z Description: If bit ‘b’ in register ‘f’ is ‘1’, then the next instruction is skipped. If bit ‘b’ is ‘1’, then the next instruction fetched during the current instruction execution, is discarded and a NOP is executed instead, making this a 2-cycle instruction. Description: The W register is cleared. Zero bit (Z) is set. CALL Subroutine Call CLRWDT Clear Watchdog Timer Syntax: [ label ] CALL k Syntax: [ label ] CLRWDT Operands: 0 ≤ k ≤ 255 Operands: None Operation: (PC) + 1→ Top-of-Stack; k → PC<7:0>; (Status<6:5>) → PC<10:9>; 0 → PC<8> Operation: 00h → WDT; 0 → WDT prescaler (if assigned); 1 → TO; 1 → PD Status Affected: None Status Affected: TO, PD Description: Subroutine call. First, return address (PC + 1) is pushed onto the stack. The eight-bit immediate address is loaded into PC bits <7:0>. The upper bits PC<10:9> are loaded from Status<6:5>, PC<8> is cleared. CALL is a two-cycle instruction. Description: The CLRWDT instruction resets the WDT. It also resets the prescaler, if the prescaler is assigned to the WDT and not Timer0. Status bits TO and PD are set. CLRF Clear f COMF Complement f Syntax: [ label ] CLRF Syntax: [ label ] COMF Operands: 0 ≤ f ≤ 31 Operands: Operation: 00h → (f); 1→Z 0 ≤ f ≤ 31 d ∈ [0,1] Operation: (f) → (dest) Status Affected: Z Status Affected: Z Description: The contents of register ‘f’ are cleared and the Z bit is set. Description: The contents of register ‘f’ are complemented. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. DS41236A-page 58 f Preliminary f,d 2004 Microchip Technology Inc. PIC12F508/509/16F505 DECF Decrement f INCF Syntax: [ label ] DECF f,d Syntax: [ label ] Operands: 0 ≤ f ≤ 31 d ∈ [0,1] Operands: 0 ≤ f ≤ 31 d ∈ [0,1] Operation: (f) – 1 → (dest) Operation: (f) + 1 → (dest) Status Affected: Z Status Affected: Z Description: Decrement register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. Description: The contents of register ‘f’ are incremented. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. DECFSZ Decrement f, Skip if 0 INCFSZ Increment f, Skip if 0 Syntax: [ label ] DECFSZ f,d Syntax: [ label ] Operands: 0 ≤ f ≤ 31 d ∈ [0,1] Operands: 0 ≤ f ≤ 31 d ∈ [0,1] Operation: (f) – 1 → d; Operation: (f) + 1 → (dest), skip if result = 0 Status Affected: None Status Affected: None Description: The contents of register ‘f’ are decremented. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. If the result is ‘0’, the next instruction, which is already fetched, is discarded and a NOP is executed instead making it a two-cycle instruction. Description: The contents of register ‘f’ are incremented. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. If the result is ‘0’, then the next instruction, which is already fetched, is discarded and a NOP is executed instead making it a two-cycle instruction. GOTO Unconditional Branch IORLW Inclusive OR literal with W Syntax: [ label ] Syntax: [ label ] Operands: 0 ≤ k ≤ 511 Operands: 0 ≤ k ≤ 255 Operation: k → PC<8:0>; Status<6:5> → PC<10:9> Operation: (W) .OR. (k) → (W) Status Affected: Z Status Affected: None Description: Description: GOTO is an unconditional branch. The 9-bit immediate value is loaded into PC bits <8:0>. The upper bits of PC are loaded from Status<6:5>. GOTO is a two-cycle instruction. The contents of the W register are OR’ed with the eight bit literal ‘k’. The result is placed in the W register. skip if result = 0 GOTO k 2004 Microchip Technology Inc. Preliminary Increment f INCF f,d INCFSZ f,d IORLW k DS41236A-page 59 PIC12F508/509/16F505 IORWF Inclusive OR W with f MOVWF Syntax: [ label ] Syntax: [ label ] Operands: 0 ≤ f ≤ 31 d ∈ [0,1] Operands: 0 ≤ f ≤ 31 (W).OR. (f) → (dest) Operation: (W) → (f) Operation: Status Affected: None Status Affected: Z Description: Description: Inclusive OR the W register with register ‘f’. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. Move data from the W register to register ‘f’. MOVF Move f NOP No Operation Syntax: [ label ] Syntax: [ label ] Operands: 0 ≤ f ≤ 31 d ∈ [0,1] Operands: None Operation: No operation Status Affected: None Description: No operation. IORWF f,d MOVF f,d Move W to f MOVWF f NOP Operation: (f) → (dest) Status Affected: Z Description: The contents of register ‘f’ are moved to destination ‘d’. If ‘d’ is ‘0’, destination is the W register. If ‘d’ is ‘1’, the destination is file register ‘f’. ‘d’ = 1 is useful as a test of a file register, since status flag Z is affected. MOVLW Move Literal to W OPTION Load Option Register Syntax: [ label ] Syntax: [ label ] Operands: 0 ≤ k ≤ 255 Operands: None Operation: k → (W) Operation: (W) → Option Status Affected: None Status Affected: None Description: The content of the W register is loaded into the Option register. Description: DS41236A-page 60 MOVLW k The eight-bit literal ‘k’ is loaded into the W register. The don’t cares will assembled as ‘0’s. Preliminary Option 2004 Microchip Technology Inc. PIC12F508/509/16F505 RETLW Return with Literal in W SLEEP Enter SLEEP Mode Syntax: [ label ] Syntax: [label ] Operands: 0 ≤ k ≤ 255 Operands: None Operation: k → (W); TOS → PC Operation: 00h → WDT; 0 → WDT prescaler; 1 → TO; 0 → PD Status Affected: TO, PD, RBWUF Description: Time-out Status bit (TO) is set. The Power-down Status bit (PD) is cleared. RBWUF is unaffected. The WDT and its prescaler are cleared. The processor is put into Sleep mode with the oscillator stopped. See Section 7.9 “Power-down Mode (Sleep)” on Sleep for more details. SUBWF Subtract W from f RETLW k Status Affected: None Description: The W register is loaded with the eight-bit literal ‘k’. The program counter is loaded from the top of the stack (the return address). This is a two-cycle instruction. RLF Rotate Left f through Carry Syntax: [ label ] Operands: 0 ≤ f ≤ 31 d ∈ [0,1] RLF f,d SLEEP Syntax: [label ] Operands: 0 ≤ f ≤ 31 d ∈ [0,1] SUBWF f,d Operation: See description below Status Affected: C Operation: (f) – (W) → (dest) The contents of register ‘f’ are rotated one bit to the left through the Carry flag. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. Status Affected: C, DC, Z Description: Subtract (2’s complement method) the W register from register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. SWAPF Swap Nibbles in f Syntax: [ label ] SWAPF f,d Operands: 0 ≤ f ≤ 31 d ∈ [0,1] Operation: (f<3:0>) → (dest<7:4>); (f<7:4>) → (dest<3:0>) Status Affected: None Description: The upper and lower nibbles of register ‘f’ are exchanged. If ‘d’ is ‘0’, the result is placed in W register. If ‘d’ is ‘1’, the result is placed in register ‘f’. Description: register ‘f’ C RRF Rotate Right f through Carry Syntax: [ label ] Operands: 0 ≤ f ≤ 31 d ∈ [0,1] Operation: See description below Status Affected: C Description: The contents of register ‘f’ are rotated one bit to the right through the Carry flag. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. RRF f,d C 2004 Microchip Technology Inc. register ‘f’ Preliminary DS41236A-page 61 PIC12F508/509/16F505 TRIS Load TRIS Register XORWF Syntax: [ label ] TRIS Syntax: [ label ] XORWF Operands: f=6 Operands: Operation: (W) → TRIS register f 0 ≤ f ≤ 31 d ∈ [0,1] f Exclusive OR W with f f,d Status Affected: None Operation: (W) .XOR. (f) → (dest) Description: TRIS register ‘f’ (f = 6 or 7) is loaded with the contents of the W register Status Affected: Z Description: Exclusive OR the contents of the W register with register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. XORLW Exclusive OR literal with W Syntax: [label ] Operands: 0 ≤ k ≤ 255 Operation: (W) .XOR. k → (W) Status Affected: Z Description: The contents of the W register are XOR’ed with the eight-bit literal ‘k’. The result is placed in the W register. DS41236A-page 62 XORLW k Preliminary 2004 Microchip Technology Inc. PIC12F508/509/16F505 9.0 DEVELOPMENT SUPPORT 9.1 The PICmicro® microcontrollers are supported with a full range of hardware and software development tools: • Integrated Development Environment - MPLAB® IDE Software • Assemblers/Compilers/Linkers - MPASMTM Assembler - MPLAB C17 and MPLAB C18 C Compilers - MPLINKTM Object Linker/ MPLIBTM Object Librarian - MPLAB C30 C Compiler - MPLAB ASM30 Assembler/Linker/Library • Simulators - MPLAB SIM Software Simulator - MPLAB dsPIC30 Software Simulator • Emulators - MPLAB ICE 2000 In-Circuit Emulator - MPLAB ICE 4000 In-Circuit Emulator • In-Circuit Debugger - MPLAB ICD 2 • Device Programmers - PRO MATE® II Universal Device Programmer - PICSTART® Plus Development Programmer • Low Cost Demonstration Boards - PICDEMTM 1 Demonstration Board - PICDEM.netTM Demonstration Board - PICDEM 2 Plus Demonstration Board - PICDEM 3 Demonstration Board - PICDEM 4 Demonstration Board - PICDEM 17 Demonstration Board - PICDEM 18R Demonstration Board - PICDEM LIN Demonstration Board - PICDEM USB Demonstration Board • Evaluation Kits - KEELOQ® - PICDEM MSC - microID® - CAN - PowerSmart® - Analog MPLAB Integrated Development Environment Software The MPLAB IDE software brings an ease of software development previously unseen in the 8/16-bit microcontroller market. The MPLAB IDE is a Windows® based application that contains: • An interface to debugging tools - simulator - programmer (sold separately) - emulator (sold separately) - in-circuit debugger (sold separately) • A full-featured editor with color coded context • A multiple project manager • Customizable data windows with direct edit of contents • High level source code debugging • Mouse over variable inspection • Extensive on-line help The MPLAB IDE allows you to: • Edit your source files (either assembly or C) • One touch assemble (or compile) and download to PICmicro emulator and simulator tools (automatically updates all project information) • Debug using: - source files (assembly or C) - absolute listing file (mixed assembly and C) - machine code MPLAB IDE supports multiple debugging tools in a single development paradigm, from the cost effective simulators, through low cost in-circuit debuggers, to full-featured emulators. This eliminates the learning curve when upgrading to tools with increasing flexibility and power. 9.2 MPASM Assembler The MPASM assembler is a full-featured, universal macro assembler for all PICmicro MCUs. The MPASM assembler generates relocatable object files for the MPLINK object linker, Intel® standard HEX files, MAP files to detail memory usage and symbol reference, absolute LST files that contain source lines and generated machine code and COFF files for debugging. The MPASM assembler features include: • Integration into MPLAB IDE projects • User defined macros to streamline assembly code • Conditional assembly for multi-purpose source files • Directives that allow complete control over the assembly process 2004 Microchip Technology Inc. Preliminary DS41236A-page 63 PIC12F508/509/16F505 9.3 MPLAB C17 and MPLAB C18 C Compilers 9.6 The MPLAB C17 and MPLAB C18 Code Development Systems are complete ANSI C compilers for Microchip’s PIC17CXXX and PIC18CXXX family of microcontrollers. These compilers provide powerful integration capabilities, superior code optimization and ease of use not found with other compilers. For easy source level debugging, the compilers provide symbol information that is optimized to the MPLAB IDE debugger. 9.4 MPLINK Object Linker/ MPLIB Object Librarian The MPLINK object linker combines relocatable objects created by the MPASM assembler and the MPLAB C17 and MPLAB C18 C compilers. It can link relocatable objects from pre-compiled libraries, using directives from a linker script. The MPLIB object librarian manages the creation and modification of library files of pre-compiled code. When a routine from a library is called from a source file, only the modules that contain that routine will be linked in with the application. This allows large libraries to be used efficiently in many different applications. The object linker/library features include: • Efficient linking of single libraries instead of many smaller files • Enhanced code maintainability by grouping related modules together • Flexible creation of libraries with easy module listing, replacement, deletion and extraction 9.5 MPLAB C30 C Compiler MPLAB C30 is distributed with a complete ANSI C standard library. All library functions have been validated and conform to the ANSI C library standard. The library includes functions for string manipulation, dynamic memory allocation, data conversion, timekeeping, and math functions (trigonometric, exponential and hyperbolic). The compiler provides symbolic information for high level source debugging with the MPLAB IDE. DS41236A-page 64 MPLAB ASM30 assembler produces relocatable machine code from symbolic assembly language for dsPIC30F devices. MPLAB C30 compiler uses the assembler to produce it’s object file. The assembler generates relocatable object files that can then be archived or linked with other relocatable object files and archives to create an executable file. Notable features of the assembler include: • • • • • • Support for the entire dsPIC30F instruction set Support for fixed-point and floating-point data Command line interface Rich directive set Flexible macro language MPLAB IDE compatibility 9.7 MPLAB SIM Software Simulator The MPLAB SIM software simulator allows code development in a PC hosted environment by simulating the PICmicro series microcontrollers on an instruction level. On any given instruction, the data areas can be examined or modified and stimuli can be applied from a file, or user defined key press, to any pin. The execution can be performed in Single-Step, Execute Until Break, or Trace mode. The MPLAB SIM simulator fully supports symbolic debugging using the MPLAB C17 and MPLAB C18 C Compilers, as well as the MPASM assembler. The software simulator offers the flexibility to develop and debug code outside of the laboratory environment, making it an excellent, economical software development tool. 9.8 The MPLAB C30 C compiler is a full-featured, ANSI compliant, optimizing compiler that translates standard ANSI C programs into dsPIC30F assembly language source. The compiler also supports many commandline options and language extensions to take full advantage of the dsPIC30F device hardware capabilities, and afford fine control of the compiler code generator. MPLAB ASM30 Assembler, Linker, and Librarian MPLAB SIM30 Software Simulator The MPLAB SIM30 software simulator allows code development in a PC hosted environment by simulating the dsPIC30F series microcontrollers on an instruction level. On any given instruction, the data areas can be examined or modified and stimuli can be applied from a file, or user defined key press, to any of the pins. The MPLAB SIM30 simulator fully supports symbolic debugging using the MPLAB C30 C Compiler and MPLAB ASM30 assembler. The simulator runs in either a Command Line mode for automated tasks, or from MPLAB IDE. This high speed simulator is designed to debug, analyze and optimize time intensive DSP routines. Preliminary 2004 Microchip Technology Inc. PIC12F508/509/16F505 9.9 MPLAB ICE 2000 High Performance Universal In-Circuit Emulator 9.11 The MPLAB ICE 2000 universal in-circuit emulator is intended to provide the product development engineer with a complete microcontroller design tool set for PICmicro microcontrollers. Software control of the MPLAB ICE 2000 in-circuit emulator is advanced by the MPLAB Integrated Development Environment, which allows editing, building, downloading and source debugging from a single environment. The MPLAB ICE 2000 is a full-featured emulator system with enhanced trace, trigger and data monitoring features. Interchangeable processor modules allow the system to be easily reconfigured for emulation of different processors. The universal architecture of the MPLAB ICE in-circuit emulator allows expansion to support new PICmicro microcontrollers. The MPLAB ICE 2000 in-circuit emulator system has been designed as a real-time emulation system with advanced features that are typically found on more expensive development tools. The PC platform and Microsoft® Windows 32-bit operating system were chosen to best make these features available in a simple, unified application. 9.10 MPLAB ICE 4000 High Performance Universal In-Circuit Emulator The MPLAB ICE 4000 universal in-circuit emulator is intended to provide the product development engineer with a complete microcontroller design tool set for highend PICmicro microcontrollers. Software control of the MPLAB ICE in-circuit emulator is provided by the MPLAB Integrated Development Environment, which allows editing, building, downloading and source debugging from a single environment. The MPLAB ICD 4000 is a premium emulator system, providing the features of MPLAB ICE 2000, but with increased emulation memory and high speed performance for dsPIC30F and PIC18XXXX devices. Its advanced emulator features include complex triggering and timing, up to 2 Mb of emulation memory, and the ability to view variables in real-time. MPLAB ICD 2 In-Circuit Debugger Microchip’s In-Circuit Debugger, MPLAB ICD 2, is a powerful, low cost, run-time development tool, connecting to the host PC via an RS-232 or high speed USB interface. This tool is based on the FLASH PICmicro MCUs and can be used to develop for these and other PICmicro microcontrollers. The MPLAB ICD 2 utilizes the in-circuit debugging capability built into the FLASH devices. This feature, along with Microchip’s In-Circuit Serial ProgrammingTM (ICSPTM) protocol, offers cost effective in-circuit FLASH debugging from the graphical user interface of the MPLAB Integrated Development Environment. This enables a designer to develop and debug source code by setting breakpoints, single-stepping and watching variables, CPU status and peripheral registers. Running at full speed enables testing hardware and applications in real-time. MPLAB ICD 2 also serves as a development programmer for selected PICmicro devices. 9.12 PRO MATE II Universal Device Programmer The PRO MATE II is a universal, CE compliant device programmer with programmable voltage verification at VDDMIN and VDDMAX for maximum reliability. It features an LCD display for instructions and error messages and a modular detachable socket assembly to support various package types. In Stand-Alone mode, the PRO MATE II device programmer can read, verify, and program PICmicro devices without a PC connection. It can also set code protection in this mode. 9.13 PICSTART Plus Development Programmer The PICSTART Plus development programmer is an easy-to-use, low cost, prototype programmer. It connects to the PC via a COM (RS-232) port. MPLAB Integrated Development Environment software makes using the programmer simple and efficient. The PICSTART Plus development programmer supports most PICmicro devices up to 40 pins. Larger pin count devices, such as the PIC16C92X and PIC17C76X, may be supported with an adapter socket. The PICSTART Plus development programmer is CE compliant. The MPLAB ICE 4000 in-circuit emulator system has been designed as a real-time emulation system with advanced features that are typically found on more expensive development tools. The PC platform and Microsoft Windows 32-bit operating system were chosen to best make these features available in a simple, unified application. 2004 Microchip Technology Inc. Preliminary DS41236A-page 65 PIC12F508/509/16F505 9.14 PICDEM 1 PICmicro Demonstration Board 9.17 The PICDEM 1 demonstration board demonstrates the capabilities of the PIC16C5X (PIC16C54 to PIC16C58A), PIC16C61, PIC16C62X, PIC16C71, PIC16C8X, PIC17C42, PIC17C43 and PIC17C44. All necessary hardware and software is included to run basic demo programs. The sample microcontrollers provided with the PICDEM 1 demonstration board can be programmed with a PRO MATE II device programmer, or a PICSTART Plus development programmer. The PICDEM 1 demonstration board can be connected to the MPLAB ICE in-circuit emulator for testing. A prototype area extends the circuitry for additional application components. Features include an RS-232 interface, a potentiometer for simulated analog input, push button switches and eight LEDs. 9.15 PICDEM.net Internet/Ethernet Demonstration Board The PICDEM.net demonstration board is an Internet/ Ethernet demonstration board using the PIC18F452 microcontroller and TCP/IP firmware. The board supports any 40-pin DIP device that conforms to the standard pinout used by the PIC16F877 or PIC18C452. This kit features a user friendly TCP/IP stack, web server with HTML, a 24L256 Serial EEPROM for Xmodem download to web pages into Serial EEPROM, ICSP/MPLAB ICD 2 interface connector, an Ethernet interface, RS-232 interface, and a 16 x 2 LCD display. Also included is the book and CD-ROM “TCP/IP Lean, Web Servers for Embedded Systems,” by Jeremy Bentham. 9.16 PICDEM 2 Plus Demonstration Board The PICDEM 2 Plus demonstration board supports many 18-, 28-, and 40-pin microcontrollers, including PIC16F87X and PIC18FXX2 devices. All the necessary hardware and software is included to run the demonstration programs. The sample microcontrollers provided with the PICDEM 2 demonstration board can be programmed with a PRO MATE II device programmer, PICSTART Plus development programmer, or MPLAB ICD 2 with a Universal Programmer Adapter. The MPLAB ICD 2 and MPLAB ICE in-circuit emulators may also be used with the PICDEM 2 demonstration board to test firmware. A prototype area extends the circuitry for additional application components. Some of the features include an RS-232 interface, a 2 x 16 LCD display, a piezo speaker, an on-board temperature sensor, four LEDs, and sample PIC18F452 and PIC16F877 FLASH microcontrollers. DS41236A-page 66 PICDEM 3 PIC16C92X Demonstration Board The PICDEM 3 demonstration board supports the PIC16C923 and PIC16C924 in the PLCC package. All the necessary hardware and software is included to run the demonstration programs. 9.18 PICDEM 4 8/14/18-Pin Demonstration Board The PICDEM 4 can be used to demonstrate the capabilities of the 8-, 14-, and 18-pin PIC16XXXX and PIC18XXXX MCUs, including the PIC16F818/819, PIC16F87/88, PIC16F62XA and the PIC18F1320 family of microcontrollers. PICDEM 4 is intended to showcase the many features of these low pin count parts, including LIN and Motor Control using ECCP. Special provisions are made for low power operation with the supercapacitor circuit, and jumpers allow on-board hardware to be disabled to eliminate current draw in this mode. Included on the demo board are provisions for Crystal, RC or Canned Oscillator modes, a five volt regulator for use with a nine volt wall adapter or battery, DB-9 RS-232 interface, ICD connector for programming via ICSP and development with MPLAB ICD 2, 2x16 liquid crystal display, PCB footprints for H-Bridge motor driver, LIN transceiver and EEPROM. Also included are: header for expansion, eight LEDs, four potentiometers, three push buttons and a prototyping area. Included with the kit is a PIC16F627A and a PIC18F1320. Tutorial firmware is included along with the User’s Guide. 9.19 PICDEM 17 Demonstration Board The PICDEM 17 demonstration board is an evaluation board that demonstrates the capabilities of several Microchip microcontrollers, including PIC17C752, PIC17C756A, PIC17C762 and PIC17C766. A programmed sample is included. The PRO MATE II device programmer, or the PICSTART Plus development programmer, can be used to reprogram the device for user tailored application development. The PICDEM 17 demonstration board supports program download and execution from external on-board FLASH memory. A generous prototype area is available for user hardware expansion. Preliminary 2004 Microchip Technology Inc. PIC12F508/509/16F505 9.20 PICDEM 18R PIC18C601/801 Demonstration Board 9.23 The PICDEM 18R demonstration board serves to assist development of the PIC18C601/801 family of Microchip microcontrollers. It provides hardware implementation of both 8-bit Multiplexed/De-multiplexed and 16-bit Memory modes. The board includes 2 Mb external FLASH memory and 128 Kb SRAM memory, as well as serial EEPROM, allowing access to the wide range of memory types supported by the PIC18C601/801. 9.21 PICkitTM 1 Flash Starter Kit A complete “development system in a box”, the PICkit FLASH Starter Kit includes a convenient multi-section board for programming, evaluation, and development of 8/14-pin FLASH PIC® microcontrollers. Powered via USB, the board operates under a simple Windows GUI. The PICkit 1 Starter Kit includes the user’s guide (on CD ROM), PICkit 1 tutorial software and code for various applications. Also included are MPLAB® IDE (Integrated Development Environment) software, software and hardware “Tips ‘n Tricks for 8-pin FLASH PIC® Microcontrollers” Handbook and a USB Interface Cable. Supports all current 8/14-pin FLASH PIC microcontrollers, as well as many future planned devices. 2004 Microchip Technology Inc. The PICDEM USB Demonstration Board shows off the capabilities of the PIC16C745 and PIC16C765 USB microcontrollers. This board provides the basis for future USB products. 9.24 Evaluation and Programming Tools In addition to the PICDEM series of circuits, Microchip has a line of evaluation kits and demonstration software for these products. PICDEM LIN PIC16C43X Demonstration Board The powerful LIN hardware and software kit includes a series of boards and three PICmicro microcontrollers. The small footprint PIC16C432 and PIC16C433 are used as slaves in the LIN communication and feature on-board LIN transceivers. A PIC16F874 FLASH microcontroller serves as the master. All three microcontrollers are programmed with firmware to provide LIN bus communication. 9.22 PICDEM USB PIC16C7X5 Demonstration Board • KEELOQ evaluation and programming tools for Microchip’s HCS Secure Data Products • CAN developers kit for automotive network applications • Analog design boards and filter design software • PowerSmart battery charging evaluation/ calibration kits • IrDA® development kit • microID development and rfLabTM development software • SEEVAL® designer kit for memory evaluation and endurance calculations • PICDEM MSC demo boards for Switching mode power supply, high power IR driver, delta sigma ADC, and flow rate sensor Check the Microchip web page and the latest Product Line Card for the complete list of demonstration and evaluation kits. Preliminary DS41236A-page 67 PIC12F508/509/16F505 NOTES: DS41236A-page 68 Preliminary 2004 Microchip Technology Inc. PIC12F508/509/16F505 10.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings(†) Ambient temperature under bias.......................................................................................................... -40°C to +125°C Storage temperature ............................................................................................................................ -65°C to +150°C Voltage on VDD with respect to VSS ............................................................................................................... 0 to +6.5V Voltage on MCLR with respect to VSS..........................................................................................................0 to +13.5V Voltage on all other pins with respect to VSS ............................................................................... -0.3V to (VDD + 0.3V) Total power dissipation(1) .................................................................................................................................. 800 mW Max. current out of VSS pin ................................................................................................................................ 200 mA Max. current into VDD pin ................................................................................................................................... 150 mA Input clamp current, IIK (VI < 0 or VI > VDD)...................................................................................................................±20 mA Output clamp current, IOK (VO < 0 or VO > VDD) ...........................................................................................................±20 mA Max. output current sunk by any I/O pin .............................................................................................................. 25 mA Max. output current sourced by any I/O pin ......................................................................................................... 25 mA Max. output current sourced by I/O port .............................................................................................................. 75 mA Max. output current sunk by I/O port ................................................................................................................... 75 mA Note 1: Power dissipation is calculated as follows: PDIS = VDD x {IDD – ∑ IOH} + ∑ {(VDD – VOH) x IOH} + ∑(VOL x IOL) †NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. 2004 Microchip Technology Inc. Preliminary DS41236A-page 69 PIC12F508/509/16F505 PIC12F508/509/16F505 VOLTAGE-FREQUENCY GRAPH, -40°C ≤ TA ≤ +125°C FIGURE 10-1: 6.0 5.5 5.0 VDD (Volts) 4.5 4.0 3.5 3.0 2.5 2.0 0 4 10 20 25 Frequency (MHz) FIGURE 10-2: MAXIMUM OSCILLATOR FREQUENCY TABLE Oscillator Mode LP XT INTOSC XTRC EC HS 0 200 kHz 4 MHz 20 MHz Frequency (MHz) DS41236A-page 70 Preliminary 2004 Microchip Technology Inc. PIC12F508/509/16F505 10.1 DC Characteristics: PIC12F508/509/16F505 (Industrial) DC CHARACTERISTICS Standard Operating Conditions (unless otherwise specified) Operating Temperature -40°C ≤ TA ≤ +85°C (industrial) Param No. Min Sym Characteristic Typ(1) Max Units Conditions D001 VDD Supply Voltage 2.0 5.5 V See Figure 10-1 D002 VDR RAM Data Retention Voltage(2) — 1.5* — V Device in Sleep mode D003 VPOR VDD Start Voltage to ensure Power-on Reset — Vss — V See Section 7.4 "DC Characteristics" for details D004 SVDD VDD Rise Rate to ensure Power-on Reset 0.05 * — — V/ms See Section 7.4 "DC Characteristics" for details D010 IDD Supply Current(3) — — — — 170 0.4 1.7 15 TBD TBD TBD TBD µA mA mA µA FOSC = 4 MHz, VDD = 2.0V(4) FOSC = 10 MHz, VDD = 3.0V FOSC = 20 MHz, VDD = 5.0V FOSC = 32 kHz, VDD = 2.0V, WDT disabled D020 IPD Power-down Current(5) — 0.1 TBD µA VDD = 2.0V D022 ∆IWDT WDT Current(5) — 1.0 TBD µA VDD = 2.0V Legend: TBD = To Be Determined. * These parameters are characterized but not tested. Note 1: Data in the Typical (“Typ”) column is based on characterization results at 25°C. This data is for design guidance only and is not tested. 2: This is the limit to which VDD can be lowered in Sleep mode without losing RAM data. 3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, oscillator type, bus rate, internal code execution pattern and temperature also have an impact on the current consumption. a) The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VSS, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled as specified. b) For standby current measurements, the conditions are the same, except that the device is in Sleep mode. 4: Does not include current through REXT (in EXTRC mode only). The current through the resistor can be estimated by the formula: I = VDD/2REXT (mA) with REXT in kΩ. 5: The Power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS. 2004 Microchip Technology Inc. Preliminary DS41236A-page 71 PIC12F508/509/16F505 10.2 DC Characteristics: PIC12F508/509/16F505 (Extended) DC CHARACTERISTICS Param No. Sym Characteristic Standard Operating Conditions (unless otherwise specified) Operating Temperature -40°C ≤ TA ≤ +125°C (Extended) Min Typ(1) Max Units Conditions D001 VDD Supply Voltage 2.0 5.5 V See Figure 10-1 D002 VDR RAM Data Retention Voltage(2) — 1.5* — V Device in Sleep mode D003 VPOR VDD Start Voltage to ensure Power-on Reset — Vss — V See Section 7.4 "DC Characteristics" for details D004 SVDD VDD Rise Rate to ensure Power-on Reset 0.05* — — V/ms See Section 7.4 "DC Characteristics" for details D010 IDD Supply Current(3) — — — — 170 0.4 1.7 15 TBD TBD TBD TBD µA mA mA µA FOSC = 4 MHz, VDD = 2.0V(4) FOSC = 10 MHz, VDD = 3.0V FOSC = 20 MHz, VDD = 5.0V FOSC = 32 kHz, VDD = 2.0V, WDT disabled D020 IPD Power-down Current(5) — 0.1 TBD µA VDD = 2.0V D022 ∆IWDT WDT Current(5) — 1.0 TBD µA VDD = 2.0V Legend: TBD = To Be Determined. * These parameters are characterized but not tested. Note 1: Data in the Typical (“Typ”) column is based on characterization results at 25°C. This data is for design guidance only and is not tested. 2: This is the limit to which VDD can be lowered in Sleep mode without losing RAM data. 3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, oscillator type, bus rate, internal code execution pattern and temperature also have an impact on the current consumption. a) The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VSS, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled as specified. a) For standby current measurements, the conditions are the same, except that the device is in Sleep mode. 4: Does not include current through REXT (in EXTRC mode only). The current through the resistor can be estimated by the formula: I = VDD/2REXT (mA) with REXT in kΩ. 5: The Power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS. DS41236A-page 72 Preliminary 2004 Microchip Technology Inc. PIC12F508/509/16F505 DC CHARACTERISTICS: PIC12F508/509/16F505 (Industrial, Extended) TABLE 10-1: Standard Operating Conditions (unless otherwise specified) Operating temperature -40°C ≤ TA ≤ +85°C (industrial) -40°C ≤ TA ≤ +125°C (extended) Operating voltage VDD range as described in DC specification DC CHARACTERISTICS Param Sym No. VIL Characteristic Min Typ† Max Units Conditions Input Low Voltage I/O ports: D030 with TTL buffer D030A D031 with Schmitt Trigger buffer Vss — 0.8V V For all 4.5 ≤ VDD ≤ 5.5V Vss — 0.15 VDD V Otherwise Vss — 0.15 VDD V D032 MCLR, T0CKI Vss — 0.15 VDD V D033 OSC1 (in EXTRC) Vss — 0.15 VDD V (Note1) D033 OSC1 (in HS) Vss — 0.3 VDD V (Note1) D033 OSC1 (in XT and LP) Vss — 0.3 V (Note1) VIH Input High Voltage I/O ports: D040 with TTL buffer D040A D041 with Schmitt Trigger buffer — 2.0 — VDD V 4.5 ≤ VDD ≤ 5.5V 0.25 VDD + 0.8 VDD — VDD V Otherwise For entire VDD range 0.85 VDD — VDD V MCLR, T0CKI 0.85 VDD — VDD V D043 OSC1 (in EXTRC) 0.85 VDD — VDD V (Note1) D043 OSC1 (in HS) 0.7 VDD — VDD V (Note1) D043 OSC1 (in XT and LP) 1.6 — VDD V TBD 250 TBD µA D042 IPUR GPIO weak pull-up current(4) D070 IIL VDD = 5V, VPIN = VSS Input Leakage Current(2), (3) D060 I/O ports — — ±1 µA Vss ≤ VPIN ≤ VDD, Pin at high-impedance D061 GP3/RB3/MCLRI(5) — — ± 30 µA Vss ≤ VPIN ≤ VDD D061A GP3/RB3/MCLRI(6) — — ±5 µA Vss ≤ VPIN ≤ VDD D063 OSC1 — — ±5 µA Vss ≤ VPIN ≤ VDD, XT, HS and LP oscillator configuration D080 I/O ports/CLKOUT — — 0.6 V IOL = 8.5 mA, VDD = 4.5V, -40°C to +85°C — — 0.6 V IOL = 7.0 mA, VDD = 4.5V, -40°C to +125°C — — 0.6 V IOL = 1.6 mA, VDD = 4.5V, -40°C to +85°C — — 0.6 V IOL = 1.2 mA, VDD = 4.5V, -40°C to +125°C VDD – 0.7 — — V IOH = -3.0 mA, VDD = 4.5V, -40°C to +85°C VDD – 0.7 — — V IOH = -2.5 mA, VDD = 4.5V, -40°C to +125°C VDD – 0.7 — — V IOH = -1.3 mA, VDD = 4.5V, -40°C to +85°C VDD – 0.7 — — V IOH = -1.0 mA, VDD = 4.5V, -40°C to +125°C OSC2 pin — — 15 pF In XT, HS and LP modes when external clock is used to drive OSC1. All I/O pins and OSC2 — — 50 pF Output Low Voltage D080A D083 OSC2 D083A Output High Voltage I/O ports/CLKOUT(3) D090 D090A D092 OSC2 D092A Capacitive Loading Specs on Output Pins D100 D101 Legend: Note † 1: 2: 3: 4: 5: 6: TBD = To Be Determined. Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. In EXTRC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the PIC12F508/509/ 16F505 be driven with external clock in RC mode. The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. Negative current is defined as coming out of the pin. Does not include GP3/RB3. For GP3/RB3 see parameters D061 and D061A. This specification applies to GP3/RB3/MCLR configured as external MCLR and GP3/RB3/MCLR configured as input with internal pull-up enabled. This specification applies when GP3/RB3/MCLR is configured as an input with pull-up disabled. The leakage current of the MCLR circuit is higher than the standard I/O logic. 2004 Microchip Technology Inc. Preliminary DS41236A-page 73 PIC12F508/509/16F505 TABLE 10-2: VDD (Volts) PULL-UP RESISTOR RANGES – PIC12F508/509/16F505 Temperature (°C) Min Typ Max Units RB0/RB1/RB4 2.0 5.5 -40 TBD TBD TBD Ω 25 TBD TBD TBD Ω 85 TBD TBD TBD Ω 125 TBD TBD TBD Ω -40 TBD TBD TBD Ω 25 TBD TBD TBD Ω 85 TBD TBD TBD Ω 125 TBD TBD TBD Ω -40 TBD TBD TBD Ω 25 TBD TBD TBD Ω 85 TBD TBD TBD Ω RB3 2.0 5.5 125 TBD TBD TBD Ω -40 TBD TBD TBD Ω 25 TBD TBD TBD Ω 85 TBD TBD TBD Ω 125 TBD TBD TBD Ω Legend: TBD = To Be determined. * These parameters are characterized but not tested. DS41236A-page 74 Preliminary 2004 Microchip Technology Inc. PIC12F508/509/16F505 10.3 Timing Parameter Symbology and Load Conditions – PIC12F508/509/16F505 The timing parameter symbols have been created following one of the following formats: 1. TppS2ppS 2. TppS T F Frequency T Time Lowercase subscripts (pp) and their meanings: pp 2 to mc MCLR ck CLKOUT osc Oscillator cy Cycle time os OSC1 drt Device Reset Timer t0 T0CKI io I/O port wdt Watchdog Timer Uppercase letters and their meanings: S F Fall P Period H High R Rise I Invalid (high-impedance) V Valid L Low Z High-impedance FIGURE 10-3: LOAD CONDITIONS – PIC12F508/509/16F505 Legend: CL pin CL = 50 pF for all pins except OSC2 15 pF for OSC2 in XT, HS or LP modes when external clock is used to drive OSC1 VSS FIGURE 10-4: EXTERNAL CLOCK TIMING – PIC12F508/509/16F505 Q4 Q1 Q3 Q2 Q4 Q1 OSC1 1 3 3 4 4 2 2004 Microchip Technology Inc. Preliminary DS41236A-page 75 PIC12F508/509/16F505 TABLE 10-3: EXTERNAL CLOCK TIMING REQUIREMENTS – PIC12F508/509/16F505 AC CHARACTERISTICS Standard Operating Conditions (unless otherwise specified) Operating Temperature -40°C ≤ TA ≤ +85°C (industrial), -40°C ≤ TA ≤ +125°C (extended) Operating Voltage VDD range is described in Section 10.1 "DC Characteristics" Param No. Characteristic Min Typ(1) External CLKIN Frequency(2) DC — 4 MHz XT Oscillator mode DC — 20 MHz HS Oscillator mode (PIC16F505 only) DC — 200 — — 4 1A Sym FOSC Oscillator Frequency(2) 1 TOSC External CLKIN Period(2) Oscillator Period(2) Max Units kHz Conditions LP Oscillator mode MHz EXTRC Oscillator mode 0.1 — 4 MHz XT Oscillator mode 4 — 20 MHz HS Oscillator mode (PIC16F505 only) — — 200 kHz LP Oscillator mode 250 — — ns XT Oscillator mode 50 — — ns HS Oscillator mode (PIC16F505 only) 5 — — µs LP Oscillator mode 250 — — ns EXTRC Oscillator mode 250 — 10,000 ns XT Oscillator mode 50 — 250 ns HS Oscillator mode (PIC16F505 only) LP Oscillator mode 5 — — µs 2 TCY Instruction Cycle Time 200 4/FOSC — ns 3 TosL, TosH Clock in (OSC1) Low or High Time 50* — — ns XT Oscillator 2* — — µs LP Oscillator 10* — — ns HS Oscillator (PIC16F505 only) TosR, TosF Clock in (OSC1) Rise or Fall Time — — 25* ns XT Oscillator — — 50* ns LP Oscillator — — 15* ns HS Oscillator (PIC16F505 only) 4 * Note 1: 2: These parameters are characterized but not tested. Data in the Typical (“Typ”) column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. When an external clock input is used, the “max” cycle time limit is “DC” (no clock) for all devices. DS41236A-page 76 Preliminary 2004 Microchip Technology Inc. PIC12F508/509/16F505 TABLE 10-4: CALIBRATED INTERNAL RC FREQUENCIES – PIC12F508/509/16F505 AC CHARACTERISTICS Standard Operating Conditions (unless otherwise specified) Operating Temperature -40°C ≤ TA ≤ +85°C (industrial), -40°C ≤ TA ≤ +125°C (extended) Operating Voltage VDD range is described in Section 10.1 "DC Characteristics" Param No. Freq Min Tolerance F10 Sym FOSC Characteristic Internal Calibrated INTOSC Frequency(1) Typ† Max Units Conditions ± 1% TBD 4.00 TBD MHz VDD and Temperature TBD ± 2% TBD 4.00 TBD MHz 2.5V ≤ VDD ≤ 5.5V 0°C ≤ TA ≤ +85°C ± 5% TBD 4.00 TBD MHz 2.0V ≤ VDD ≤ 5.5V -40°C ≤ TA ≤ +85°C (Ind.) -40°C ≤ TA ≤ +125°C (Ext.) Legend: TBD = To Be Determined. * These parameters are characterized but not tested. † Data in the Typical (“Typ”) column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: To ensure these oscillator frequency tolerances, VDD and VSS must be capacitively decoupled as close to the device as possible. 0.1 uF and 0.01 uF values in parallel are recommended. FIGURE 10-5: I/O TIMING – PIC12F508/509/16F505 Q1 Q4 Q2 Q3 OSC1 I/O Pin (input) 17 I/O Pin (output) 19 18 New Value Old Value 20, 21 Note: All tests must be done with specified capacitive loads (see data sheet) 50 pF on I/O pins and CLKOUT. 2004 Microchip Technology Inc. Preliminary DS41236A-page 77 PIC12F508/509/16F505 TABLE 10-5: TIMING REQUIREMENTS – PIC12F508/509/16F505 Standard Operating Conditions (unless otherwise specified) AC Operating Temperature -40°C ≤ TA ≤ +85°C (industrial) CHARACTERISTIC -40°C ≤ TA ≤ +125°C (extended) S Operating Voltage VDD range is described in Section 10.1 "DC Characteristics" Param No. Sym Characteristic TOSH2IOV OSC1↑ (Q1 cycle) to Port Out Valid(2), (3) 17 (2) 18 TOSH2IOI 19 TIOV2OSH Port Input Valid to OSC1↑ (I/O in setup time) 20 TIOR 21 TIOF Legend: * ** Note 1: 2: 3: OSC1↑ (Q2 cycle) to Port Input Invalid (I/O in hold time) Port Output Rise Time(3) Port Output Fall Time (3) Min Typ(1) Max Units — — 100* ns TBD — — ns TBD — — ns — 10 25** ns — 10 25** ns TBD = To Be Determined. These parameters are characterized but not tested. These parameters are design targets and are not tested. Data in the Typical (“Typ”) column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Measurements are taken in EXTRC mode. See Figure 10-3 for loading conditions. FIGURE 10-6: RESET, WATCHDOG TIMER AND DEVICE RESET TIMER TIMING – PIC12F508/509/16F505 VDD MCLR 30 Internal POR 32 32 32 DRT Timeout(2) Internal Reset Watchdog Timer Reset 31 34 34 I/O pin(1) Note 1: 2: I/O pins must be taken out of High-impedance mode by enabling the output drivers in software. Runs in MCLR or WDT Reset only in XT, LP and HS (PIC16F505) modes. DS41236A-page 78 Preliminary 2004 Microchip Technology Inc. PIC12F508/509/16F505 TABLE 10-6: RESET, WATCHDOG TIMER AND DEVICE RESET TIMER – PIC12F508/509/16F505 Standard Operating Conditions (unless otherwise specified) Operating Temperature -40°C ≤ TA ≤ +85°C (industrial) -40°C ≤ TA ≤ +125°C (extended) Operating Voltage VDD range is described in Section 10.1 "DC Characteristics" AC CHARACTERISTICS Param No. Max Units Conditions Characteristic 30 TMCL MCLR Pulse Width (low) 2000* — — ns VDD = 5.0V 31 TWDT Watchdog Timer Time-out Period (no prescaler) 9* 9* 18* 18* 30* 40* ms ms VDD = 5.0V (Industrial) VDD = 5.0V (Extended) 32 TDRT Device Reset Timer Period(2) 9* 9* 18* 18* 30* 40* ms ms VDD = 5.0V (Industrial) VDD = 5.0V (Extended) 34 TIOZ I/O High-impedance from MCLR low — — 2000* ns * Note 1: Min Typ(1) Sym These parameters are characterized but not tested. Data in the Typical (“Typ”) column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. 2004 Microchip Technology Inc. Preliminary DS41236A-page 79 PIC12F508/509/16F505 FIGURE 10-7: TIMER0 CLOCK TIMINGS – PIC12F508/509/16F505 T0CKI 40 41 42 TABLE 10-7: TIMER0 CLOCK REQUIREMENTS – PIC12F508/509/16F505 Standard Operating Conditions (unless otherwise specified) Operating Temperature -40°C ≤ TA ≤ +85°C (industrial) -40°C ≤ TA ≤ +125°C (extended) Operating Voltage VDD range is described in Section 10.1 "DC Characteristics" AC CHARACTERISTICS Param Sym No. Characteristic 40 Tt0H T0CKI High Pulse Width 41 Tt0L T0CKI Low Pulse Width 42 Tt0P T0CKI Period * Note 1: Min No Prescaler With Prescaler No Prescaler With Prescaler 0.5 TCY + 20* 10* 0.5 TCY + 20* 10* 20 or TCY + 40* N Typ(1) Max Units — — — — — — — — — — ns ns ns ns ns Conditions Whichever is greater. N = Prescale Value (1, 2, 4,..., 256) These parameters are characterized but not tested. Data in the Typical (“Typ”) column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. DS41236A-page 80 Preliminary 2004 Microchip Technology Inc. PIC12F508/509/16F505 11.0 DC AND AC CHARACTERISTICS GRAPHS AND CHARTS Graphs and charts are not available at this time. 2004 Microchip Technology Inc. Preliminary DS41236A-page 81 PIC12F508/509/16F505 NOTES: DS41236A-page 82 Preliminary 2004 Microchip Technology Inc. PIC12F508/509/16F505 12.0 PACKAGING INFORMATION 12.1 Package Marking Information 8-Lead PDIP Example 12F508-I /P017 0410 XXXXXXXX XXXXXNNN YYWW 8-Lead SOIC (.150”) Example XXXXXXXX XXXXYYWW NNN 12F509-I /SN0410 017 8-Lead MSOP Example 12F509 0431017 XXXXXX YWWNNN Legend: XX...X Y YY WW NNN Note: * Customer specific information* Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. Standard PICmicro device marking consists of Microchip part number, year code, week code, and traceability code. For PICmicro device marking beyond this, certain price adders apply. Please check with your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price. 2004 Microchip Technology Inc. Preliminary DS41236A-page 83 PIC12F508/509/16F505 12.1 Package Marking Information (Cont’d) 14-Lead PDIP (300 mil) Example XXXXXXXXXXXXXX XXXXXXXXXXXXXX YYWWNNN PIC16F505-I/PG 0215 0410017 Example 14-Lead SOIC (150 mil) PIC16F505-E /SLG0125 0431017 XXXXXXXXXXX XXXXXXXXXXX YYWWNNN Example 14-Lead TSSOP (150 mil) 16F505-I 0431 017 XXXXXXXX YYWW NNN DS41236A-page 84 Preliminary 2004 Microchip Technology Inc. PIC12F508/509/16F505 8-Lead Plastic Dual In-line (P) – 300 mil (PDIP) E1 D 2 n 1 α E A2 A L c A1 β B1 p eB B Units Dimension Limits n p Number of Pins Pitch Top to Seating Plane Molded Package Thickness Base to Seating Plane Shoulder to Shoulder Width Molded Package Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Row Spacing Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic A A2 A1 E E1 D L c § B1 B eB α β MIN .140 .115 .015 .300 .240 .360 .125 .008 .045 .014 .310 5 5 INCHES* NOM MAX 8 .100 .155 .130 .170 .145 .313 .250 .373 .130 .012 .058 .018 .370 10 10 .325 .260 .385 .135 .015 .070 .022 .430 15 15 MILLIMETERS NOM 8 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 9.14 9.46 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40 5 10 5 10 MIN MAX 4.32 3.68 8.26 6.60 9.78 3.43 0.38 1.78 0.56 10.92 15 15 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-018 2004 Microchip Technology Inc. Preliminary DS41236A-page 85 PIC12F508/509/16F505 8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC) E E1 p D 2 B n 1 α h 45° c A2 A φ β L Units Dimension Limits n p Number of Pins Pitch Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic A A2 A1 E E1 D h L φ c B α β MIN .053 .052 .004 .228 .146 .189 .010 .019 0 .008 .013 0 0 A1 INCHES* NOM 8 .050 .061 .056 .007 .237 .154 .193 .015 .025 4 .009 .017 12 12 MAX .069 .061 .010 .244 .157 .197 .020 .030 8 .010 .020 15 15 MILLIMETERS NOM 8 1.27 1.35 1.55 1.32 1.42 0.10 0.18 5.79 6.02 3.71 3.91 4.80 4.90 0.25 0.38 0.48 0.62 0 4 0.20 0.23 0.33 0.42 0 12 0 12 MIN MAX 1.75 1.55 0.25 6.20 3.99 5.00 0.51 0.76 8 0.25 0.51 15 15 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-057 DS41236A-page 86 Preliminary 2004 Microchip Technology Inc. PIC12F508/509/16F505 8-Lead Plastic Micro Small Outline Package (MS) (MSOP) E E1 p D 2 B n 1 α A2 A c φ A1 (F) L β Units Dimension Limits n p MIN INCHES NOM MAX MILLIMETERS* NOM 8 0.65 BSC 0.75 0.85 0.00 4.90 BSC 3.00 BSC 3.00 BSC 0.40 0.60 0.95 REF 0° 0.08 0.22 5° 5° - MIN 8 Number of Pins Pitch .026 BSC A .043 Overall Height A2 Molded Package Thickness .030 .033 .037 A1 .000 .006 Standoff E Overall Width .193 TYP. E1 .118 BSC Molded Package Width D .118 BSC Overall Length L .016 .024 .031 Foot Length Footprint (Reference) F .037 REF φ 0° 8° Foot Angle c .003 .006 .009 Lead Thickness B .009 .012 .016 Lead Width α 5° 15° Mold Draft Angle Top β 5° 15° Mold Draft Angle Bottom *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. MAX 1.10 0.95 0.15 0.80 8° 0.23 0.40 15° 15° JEDEC Equivalent: MO-187 Drawing No. C04-111 2004 Microchip Technology Inc. Preliminary DS41236A-page 87 PIC12F508/509/16F505 14-Lead Plastic Dual In-line (P) – 300 mil (PDIP) E1 D 2 n 1 α E A2 A L c A1 β B1 eB p B Units Dimension Limits n p MIN INCHES* NOM 14 .100 .155 .130 MAX MILLIMETERS NOM 14 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 18.80 19.05 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40 5 10 5 10 MIN Number of Pins Pitch Top to Seating Plane A .140 .170 Molded Package Thickness A2 .115 .145 Base to Seating Plane A1 .015 Shoulder to Shoulder Width E .300 .313 .325 Molded Package Width .240 .250 .260 E1 Overall Length D .740 .750 .760 Tip to Seating Plane L .125 .130 .135 c Lead Thickness .008 .012 .015 Upper Lead Width B1 .045 .058 .070 Lower Lead Width B .014 .018 .022 Overall Row Spacing § eB .310 .370 .430 α Mold Draft Angle Top 5 10 15 β 5 10 15 Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-005 DS41236A-page 88 Preliminary MAX 4.32 3.68 8.26 6.60 19.30 3.43 0.38 1.78 0.56 10.92 15 15 2004 Microchip Technology Inc. PIC12F508/509/16F505 14-Lead Plastic Small Outline (SL) – Narrow, 150 mil (SOIC) E E1 p D 2 B n 1 α h 45° c A2 A φ A1 L β Units Dimension Limits n p Number of Pins Pitch Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic A A2 A1 E E1 D h L φ c B α β MIN .053 .052 .004 .228 .150 .337 .010 .016 0 .008 .014 0 0 INCHES* NOM 14 .050 .061 .056 .007 .236 .154 .342 .015 .033 4 .009 .017 12 12 MAX .069 .061 .010 .244 .157 .347 .020 .050 8 .010 .020 15 15 MILLIMETERS NOM 14 1.27 1.35 1.55 1.32 1.42 0.10 0.18 5.79 5.99 3.81 3.90 8.56 8.69 0.25 0.38 0.41 0.84 0 4 0.20 0.23 0.36 0.42 0 12 0 12 MIN MAX 1.75 1.55 0.25 6.20 3.99 8.81 0.51 1.27 8 0.25 0.51 15 15 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-065 2004 Microchip Technology Inc. Preliminary DS41236A-page 89 PIC12F508/509/16F505 14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP) E E1 p D 2 1 n B α A c φ β A1 L Units Dimension Limits n p Number of Pins Pitch Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width Molded Package Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic A A2 A1 E E1 D L φ c B α β MIN .033 .002 .246 .169 .193 .020 0 .004 .007 0 0 INCHES NOM 14 .026 .035 .004 .251 .173 .197 .024 4 .006 .010 5 5 A2 MAX .043 .037 .006 .256 .177 .201 .028 8 .008 .012 10 10 MILLIMETERS* NOM MAX 14 0.65 1.10 0.85 0.90 0.95 0.05 0.10 0.15 6.25 6.38 6.50 4.30 4.40 4.50 4.90 5.00 5.10 0.50 0.60 0.70 0 4 8 0.09 0.15 0.20 0.19 0.25 0.30 0 5 10 0 5 10 MIN Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005” (0.127mm) per side. JEDEC Equivalent: MO-153 Drawing No. C04-087 DS41236A-page 90 Preliminary 2004 Microchip Technology Inc. PIC12F508/509/16F505 INDEX A ALU ....................................................................................... 9 Assembler MPASM Assembler..................................................... 63 B Block Diagram On-Chip Reset Circuit ................................................. 47 Timer0......................................................................... 33 TMR0/WDT Prescaler................................................. 37 Watchdog Timer.......................................................... 50 Brown-Out Protection Circuit .............................................. 51 C C Compilers MPLAB C17 ................................................................ 64 MPLAB C18 ................................................................ 64 MPLAB C30 ................................................................ 64 Carry ..................................................................................... 9 Clocking Scheme ................................................................ 14 Code Protection ............................................................ 39, 52 Configuration Bits................................................................ 39 Configuration Word ............................................................. 40 D DC and AC Characteristics ................................................. 81 Demonstration Boards PICDEM 1 ................................................................... 66 PICDEM 17 ................................................................. 66 PICDEM 18R PIC18C601/801.................................... 67 PICDEM 2 Plus ........................................................... 66 PICDEM 3 PIC16C92X ............................................... 66 PICDEM 4 ................................................................... 66 PICDEM LIN PIC16C43X ........................................... 67 PICDEM USB PIC16C7X5.......................................... 67 PICDEM.net Internet/Ethernet .................................... 66 Development Support ......................................................... 63 Digit Carry ............................................................................. 9 Data Memory .............................................................. 16 Program Memory (PIC12F508/509) ........................... 15 Program Memory (PIC16F505) .................................. 16 MPLAB ASM30 Assembler, Linker, Librarian ..................... 64 MPLAB ICD 2 In-Circuit Debugger ..................................... 65 MPLAB ICE 2000 High Performance Universal In-Circuit Emulator..................................................... 65 MPLAB ICE 4000 High Performance Universal In-Circuit Emulator..................................................... 65 MPLAB Integrated Development Environment Software.... 63 MPLINK Object Linker/MPLIB Object Librarian .................. 64 O Option Register................................................................... 22 OSC selection..................................................................... 39 OSCCAL Register............................................................... 24 Oscillator Configurations..................................................... 41 Oscillator Types HS............................................................................... 41 LP ............................................................................... 41 RC .............................................................................. 41 XT ............................................................................... 41 P PIC12F508/509/16F505 Device Varieties ............................ 7 PICkit 1 FLASH Starter Kit.................................................. 67 PICSTART Plus Development Programmer....................... 65 POR Device Reset Timer (DRT) ................................... 39, 49 PD............................................................................... 51 Power-on Reset (POR)............................................... 39 TO............................................................................... 51 PORTB ............................................................................... 29 Power-down Mode.............................................................. 52 Prescaler ............................................................................ 36 PRO MATE II Universal Device Programmer ..................... 65 Program Counter ................................................................ 25 Q E Q cycles .............................................................................. 14 Errata .................................................................................... 3 Evaluation and Programming Tools .................................... 67 R F Family of Devices PIC16F505.................................................................... 5 FSR ..................................................................................... 26 I I/O Interfacing ..................................................................... 29 I/O Ports .............................................................................. 29 I/O Programming Considerations........................................ 31 ID Locations .................................................................. 39, 52 INDF.................................................................................... 26 Indirect Data Addressing..................................................... 26 Instruction Cycle ................................................................. 14 Instruction Flow/Pipelining .................................................. 14 Instruction Set Summary..................................................... 56 L Loading of PC ..................................................................... 25 RC Oscillator....................................................................... 42 Read-Modify-Write.............................................................. 31 Register File Map PIC12F508 ................................................................. 17 PIC12F509 ................................................................. 17 PIC16F505 ................................................................. 17 Registers Special Function ......................................................... 18 Reset .................................................................................. 39 Reset on Brown-Out ........................................................... 51 S Sleep ............................................................................ 39, 52 Software Simulator (MPLAB SIM) ...................................... 64 Software Simulator (MPLAB SIM30) .................................. 64 Special Features of the CPU .............................................. 39 Special Function Registers ................................................. 18 Stack................................................................................... 25 Status Register ............................................................... 9, 20 M Memory Organization.......................................................... 15 2004 Microchip Technology Inc. Preliminary DS41236A-page 91 PIC12F508/509/16F505 T Timer0 Timer0 ......................................................................... 33 Timer0 (TMR0) Module ............................................... 33 TMR0 with External Clock........................................... 35 Timing Diagrams and Specifications................................... 75 Timing Parameter Symbology and Load Conditions........... 75 TRIS Registers.................................................................... 29 W Wake-up from Sleep ........................................................... 52 Watchdog Timer (WDT) ................................................ 39, 49 Period.......................................................................... 49 Programming Considerations ..................................... 49 WWW, On-Line Support........................................................ 3 Z Zero bit .................................................................................. 9 DS41236A-page 92 Preliminary 2004 Microchip Technology Inc. PIC12F508/509/16F505 ON-LINE SUPPORT Microchip provides on-line support on the Microchip World Wide Web site. The web site is used by Microchip as a means to make files and information easily available to customers. To view the site, the user must have access to the Internet and a web browser, such as Netscape® or Microsoft® Internet Explorer. Files are also available for FTP download from our FTP site. SYSTEMS INFORMATION AND UPGRADE HOT LINE The Systems Information and Upgrade Line provides system users a listing of the latest versions of all of Microchip’s development systems software products. Plus, this line provides information on how customers can receive the most current upgrade kits. The Hot Line Numbers are: 1-800-755-2345 for U.S. and most of Canada, and 1-480-792-7302 for the rest of the world. Connecting to the Microchip Internet Web Site 042003 The Microchip web site is available at the following URL: www.microchip.com The file transfer site is available by using an FTP service to connect to: ftp://ftp.microchip.com The web site and file transfer site provide a variety of services. Users may download files for the latest Development Tools, Data Sheets, Application Notes, User’s Guides, Articles and Sample Programs. A variety of Microchip specific business information is also available, including listings of Microchip sales offices, distributors and factory representatives. Other data available for consideration is: • Latest Microchip Press Releases • Technical Support Section with Frequently Asked Questions • Design Tips • Device Errata • Job Postings • Microchip Consultant Program Member Listing • Links to other useful web sites related to Microchip Products • Conferences for products, Development Systems, technical information and more • Listing of seminars and events 2003 Microchip Technology Inc. Preliminary DS41236A-page 93 PIC12F508/509/16F505 READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. To: Technical Publications Manager RE: Reader Response Total Pages Sent ________ From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ FAX: (______) _________ - _________ Application (optional): Would you like a reply? Y Device: PIC12F508/509/16F505 N Literature Number: DS41236A Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? DS41236A-page 94 Preliminary 2003 Microchip Technology Inc. PIC12F508/509/16F505 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X /XX XXX Device Temperature Range Package Pattern Examples: a) b) Device c) PIC16F505 PIC12F508 PIC12F509 PIC16F505T (Tape & Reel) PIC12F508T (Tape & Reel) PIC12F509T (Tape & Reel) d) e) f) Temperature Range I E Package PG SLG SNG MSG STG Pattern Special Requirements Note: = = g) -40°C to +85°C (Industrial) -40°C to +125°C (Extended) = = = = = PIC16F505-I/PG = Industrial temp., PDIP package (Pb-free) PIC16F505T-I/SLG = Industrial temp., SOIC package (Pb-free), Tape and Reel PIC16F505T-I/SLG = Industrial temp., SOIC package (Pb-free), Tape and Reel PIC12F508T-I/SNG = Industrial temp., 150 mil SOIC package (Pb-free), Tape and Reel PIC12F508T-E/MSG = Extended temp., MSOP package (Pb-free), Tape and Reel PIC12F509-E/PG = Extended temp., PDIP package (Pb-free) PIC12F509-I/SMG = Industrial temp., 208 mil SOIC package (Pb-free) 300 mil PDIP (Pb-free) 150 mil SOIC, 14-LD (Pb-free) 150 mil SOIC, 8-LD (Pb-free) MSOP (Pb-free) TSSOP (Pb-free) Tape and Reel available for only the following packages: SOIC, MSOP and TSSOP. 2004 Microchip Technology Inc. Preliminary DS41236A-page 95 WORLDWIDE SALES AND SERVICE AMERICAS China - Beijing Korea Corporate Office Unit 706B Wan Tai Bei Hai Bldg. No. 6 Chaoyangmen Bei Str. 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