SLUS491 – JULY 2001 FEATURES D Multifunction High-Accuracy Coulometric D D D D D D D D D Charge and Discharge Counter Ideal for Portable Applications With Nonremovable Rechargeable Battery Pack Resolves Signals Less Than 12.5 µV Internal Offset Calibration Improves Accuracy 128 Bytes of General-Purpose RAM Internal Temperature Sensor Eliminates the Need for an External Thermistor High-Accuracy Internal Timebase Eliminates External Crystal Oscillator Low Power Consumption: – Operating: < 80 µA – Sleep: < 10 µA Single-Wire HDQ Serial Interface Packaging: 8-Lead TSSOP the battery and the battery pack ground contact. By using the accumulated counts in the charge, discharge, and self-discharge registers, an intelligent host controller can determine battery state-of-charge information. To improve accuracy, an offset count register is available. The system host controller is responsible for the register maintenance by resetting the charge in/out and self-discharge registers as needed. The bq26231 features 13 bytes of registers, which contain the capacity monitoring and status information. The RBI input operates from an external power storage source such as a capacitor or a series cell in the battery pack, providing register nonvolatility for periods when the battery is shorted to ground or when the battery charge state is not sufficient to operate the bq26231. During this mode, the register backup current is less than 100 nA. Packaged in an 8-pin TSSOP, the bq26231 is small enough to fit in the crevice between two A-size cells or within the width of a prismatic cell. DESCRIPTION PW PACKAGE (TOP VIEW) The bq26231 is a low-cost charge/discharge counter peripheral in an 8-pin TSSOP. It works with an intelligent host controller, providing state-of-charge information for rechargeable Li-Ion, Li-Pol, or NiMH batteries. The bq26231 measures the voltage drop across a low-value series sense resistor between the negative terminal of NC VCC VSS HDQ 1 2 3 4 8 7 6 5 NC SR1 SR2 RBI AVAILABLE OPTIONS PACKAGE TOPR 8-Lead TSSOP (PW) –20°C to 70°C bq26231PW Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2001, Texas Instruments Incorporated !" # $%&" !# '%($!" )!"&* )%$"# $ " #'&$$!"# '& "+& "& # &,!# #"% &"# #"!)!) -!!".* )%$" '$&##/ )&# " &$&##!(. $(%)& "&#"/ !(( '!! &"&#* www.ti.com 1 SLUS491 – JULY 2001 functional block diagram SR1 Differential Dynamically Balanced VFC SR2 Calibration and Power Control System I/O and Control HDQ Registers RBI VCC TemperatureCompensated Precision Oscillator Bandgap Voltage Reference Timer Temperature Sensor VSS Terminal Functions TERMINAL 2 NAME NO. NC 1 VCC 2 I/O DESCRIPTION No connect. This pin must be left floating. I Supply voltage VSS 3 HDQ 4 I/O Ground RBI 5 I Register backup input SR1 6 I Current sense input 1 SR2 7 I Current sense input 2 NC 8 Single-wire HDQ interface No connect. This pin must be left floating. www.ti.com Counter Control SLUS491 – JULY 2001 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage (VCC with respect to VSS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to 6 V Input voltage: HDQ (all with respect to VSS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to 6 V RBI, SR1, and SR2 (with respect to VSS) . . . . . . . . . . . . . . . . . . . . . . . . . VSS – 0.3 V to VCC + 3 V Operating free-air temperature range, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –20°C to 70°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C Lead temperature (soldering, 10 s) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. recommended operating conditions Supply voltage, VCC MIN TYP MAX 2.8 4.25 5.5 60 70 70 80 VCC = 3.7 V, VI(HDQ) = 3.7 V VCC = 5.5 V, VI(HDQ) = 5.5 V Supply current current, II(OP) Sleep current, II(SLEEP) VCC = 5.5 V VCC < 2.4 V RBI current, II(RBI) Operating ambient temperature, TA –20 UNIT V A µA 10 µA 100 nA 70 °C dc electrical characteristics over recommended operating temperature and supply voltage (unless otherwise noted) PARAMETER VIl(HDQ) VIH(HDQ) TEST CONDITIONS MIN TYP Digital input low HDQ pin Digital input high HDQ pin SR1 and SR2 input impedance –200 mV < V(SR) < 200 mV MAX UNIT 0.8 V 2.5 V 10 MΩ timer characteristics over recommended operating temperature and supply voltage (unless otherwise noted) PARAMETER E(TMR) Timer accuracy error TEST CONDITIONS 3.5 V ≤ VCC ≤ 3.9 V, 0°C ≤ TA ≤ 70°C MIN TYP MAX –3% 1.5% 3% UNIT VFC characteristics over recommended operating temperature and supply voltage (unless otherwise noted) PARAMETER TEST CONDITIONS SR1 and SR2 input voltage MIN TYP –200 Offset voltage, V(OS) Integrated nonlinearity Add 0.05% per °C above or below 25°C and 0.5% per volt above or below 3.7 V Integrated nonrepeatability error Measured repeatability given similar operating conditions www.ti.com MAX UNIT 200 mV 500 µV 1% 2% 0.5% 1% 3 SLUS491 – JULY 2001 standard serial communication timing specification over recommended operating temperature and supply voltage, refer to Figure 1 (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT µs t(CYCH) t(CYCB) Cycle time, host to bq26231 (write) 190 Cycle time, bq26231 to host (read) 190 t(STRH) t(STRB) Start hold, host to bq26231 (write) 5 ns Start hold, bq26231 to host (read) 32 µs t(DSU) t(DSUB) Data setup (write) 50 µs Data setup (read) 50 µs t(DH) t(DV) Data hold 100 Data valid 80 t(SSUB) t(SSU) Stop setup (bq26231 to host) t(B) t(BR) Break t(RSPS) Response time, bq26231 to host Stop setup (host to bq26231) 205 250 µs µs 145 µs 145 µs µs 190 Break recovery µs 40 190 320 t(BR) t(B) Write 1 Write 0 t(STRH) t(DSU) t(DH) t(SSU) t(CYCH) Read 1 Read 0 t(STRB) t(DSUB) t(DV) t(SSUB) t(CYCB) Figure 1. Standard Serial Communication Timing Diagram 4 www.ti.com µs µs SLUS491 – JULY 2001 detailed description SR1–SR2 current sense inputs The bq26231 interprets charge and discharge activity by monitoring and integrating the voltage drop V(SR) across pins SR1 and SR2. The SR1 input connects to the sense resistor and the negative terminal of the battery. The SR2 input connects to the sense resistor and the negative terminal of the pack. V(SR1) < V(SR2) indicates discharge, and V(SR1) > V(SR2) indicates charge. The effective voltage drop, V(SRO), as seen by the bq26231, is V(SR) +V(OS). Valid input range is ±200 mV. A 100 kΩ series resistor is recommended to protect these inputs in case of a shorted battery. HDQ data input/output This bidirectional input/output communicates the register information to the host system. HDQ is open drain and requires a pullup/pulldown resistor in the battery pack to disable/enable sleep mode if the pack is removed from the system. RBI register backup input This input maintains the internal register states during periods when VCC is below the minimum operating voltage. www.ti.com 5 SLUS491 – JULY 2001 APPLICATION INFORMATION VCC U1 1 2 BAT+ R5 100 Ω R6 100 Ω HDQ C3 0.1 µF 3 4 NC VCC VSS HDQ NC SR1 SR2 RBI 8 R2 100 kΩ 7 BAT– C1 0.01 µF 6 R1 0.02 Ω 5 PACK– D2 5.6 V bq26231 R3 100 kΩ C2 0.01 µF RBI C4 0.1 µF D1 1N914 R4 1 MΩ Figure 2. Typical Application functional description The bq26231 measures the voltage drop across a low-value series current sense resistor between the SR1 and SR2 pins using a voltage-to-frequency converter. This information is placed into various internal counter and timer registers. Using information from the bq26231, the system host can determine the battery state-of-charge, estimate self-discharge, and calculate the average charge and discharge currents. During pack storage periods, the use of an internal temperature sensor doubles the self-discharge count rate every 10° above 25°C. A register is available to store the calculated offset, allowing current calibration. The offset cancellation register is written by the bq26231 during pack assembly and is available to the host system to adjust the current measurements. By adding or subtracting the offset value stored in the OFR, the true charge and discharge counts can be calculated to a high degree of certainty. A typical application diagram is shown in Figure 2 and operation states are shown in Table 1. Table 1. bq26231 Operational States HDQ PIN DCR/CCR/SCR WOE OPERATING STATE HDQ high Yes Normal HDQ high Yes V(SRO) > V(WOE) V(SRO) < V(WOE) Normal HDQ low No V(SRO) < V(WOE) Sleep NOTE: V(SRO) is the voltage difference between SR1 and SR2 plus the offset voltage, V(OS). RBI input The RBI input pin is used with a storage capacitor or external supply to provide backup potential to the internal registers when VCC drops below 2.4 V. The maximum discharge current is 100 nA in this mode. The bq26231 outputs VCC on RBI when the supply is above 2.4 V; therefore, a diode is required to isolate an external supply. (See the application diagram.) 6 www.ti.com SLUS491 – JULY 2001 APPLICATION INFORMATION functional description (continued) charge and discharge count operation Table 2 shows the main counters and registers of the bq26231. The bq26231 accumulates charge and discharge counts into two main count registers the discharge count register (DCR) and the charge count register (CCR). The bq26231 produces charge and discharge counts by sensing the voltage difference across a low-value resistor between the negative terminal of the battery pack and the negative terminal of the battery. The DCR or CCR counts depending on the signal between SR1 and SR2. Table 2. bq26231 Counters NAME DESCRIPTION RANGE RAM SIZE DCR Discharge count register Charge count register V(SR1) < V(SR2) (max = –200 mV) 12.5 µV increments V(SR1) > V(SR2) (max = +200 mV) 12.5 µV increments 16 bit CCR SCR Self-discharge count register 1 count/hour at 25°C 16 bit DTC Discharge time counter 1 count/0.8789 s (default) 1 count/225 s if STD is set 16 bit CTC Charge time counter 1 count/0.8789 s (default) 1 count/225 s if STC is set 16 bit 16 bit During discharge, the DCR and the discharge time counter (DTC) are active. If V(SR1) is less than V(SR2), indicating a discharge, the DCR counts at a rate equivalent to 12.5 µV every hour, and the DTC counts at a rate of 1 count/0.8789 seconds (4096 counts per hour). For example, a –100 mV signal produces 8000 DCR counts and 4096 DTC counts each hour. The amount of charge removed from the battery is easily calculated. During charge, the CCR and the charge time counter (CTC) are active. If V(SR1) is greater than V(SR2), indicating a charge, the CCR counts at a rate equivalent to 12.5 µV every hour, and the CTC counts at a rate of 1 count/0.8789 seconds. For example, a +100 mV signal produces 8000 CCR counts and 4096 CTC counts each hour. The amount of charge added to the battery can easily be calculated. The DTC and the CTC are 16-bit registers, and roll over beyond FFFF hex. If a rollover occurs, the corresponding bit in the MODE/WOE register is set, and the counter will subsequently increment at 1/256 of the normal rate (16 counts/hr). Whenever the signal between SR1 and SR2 is above the wake-up output enable (WOE) threshold and the HDQ pin is high, the bq26231 is in its full operating state. In this state, the DCR, CCR, DTC, CTC, and SCR are fully operational, and the WAKE output is low. During this mode, the internal RAM registers of the bq26231 may be accessed over the HDQ pin, as described in the section Communicating With the 26230. If the signal between SR1 and SR2 is below the WOE threshold (refer to the Mode/Wake-Up Enable Register section for details) and HDQ remains low for greater than 10 seconds, the bq26231 enters a sleep mode where all register counting is suspended. The bq26231 remains in this mode until HDQ returns high. For self-discharge calculation, the self-discharge count register (SCR) counts at a rate equivalent to 1 count every hour at a nominal 25°C. This rate and doubles approximately every 10°C up to 60°C. The SCR count rate is halved every 10°C below 25°C down to 0°C. The value in SCR is useful in determining an estimation of the battery self-discharge based on capacity and storage temperature conditions. At any time during pack assembly, by invoking the calibration mode, the bq26231 may be programmed to measure the voltage offset between SR1 and SR2. The offset register (OFR) stores the bq26231 offset. The bit 2s complement value stored in the OFR is scaled the same units as the DCR and CCR, representing the amount of positive or negative offset in the bq26231. The maximum offset for the bq26231 is specified as ± 500 µV. Care should be taken to ensure proper PCB layout. Using OFR, the system host can cancel most of the effects of bq26231 offset for greater resolution and accuracy. www.ti.com 7 SLUS491 – JULY 2001 APPLICATION INFORMATION charge and discharge count operation (continued) Figure 3 shows the bq26231 register address map. The bq26231 uses the upper 13 locations. The remaining memory can store user-specific information such as chemistry, serial number, and manufacturing date. 7F 7F Discharge Count High Byte 7E Discharge Count Low Byte 7D Charge Count High Byte 7C Charge Count Low Byte 7B Self-Discharge High Byte 7A Self-Discharge Low Byte 73 79 Discharge Time High Byte 78 Discharge Time Low Byte 77 Charge Time High Byte 76 Charge Time Low Byte 75 Mode / WOE 74 Temperature / Clear 73 Offset Register Figure 3. bq26231 Register Map temperature The bq26231 has an internal temperature sensor to set the value in the temperature register (TMP/CLR) and to set the self-discharge count rate value. The register reports the temperature in 8 steps of 10°C from < 0°C to > 60°C as Table 3 specifies. The bq26231 temperature sensor has typical accuracy of ±2°C at 25°C. See the TMP/CLR register description for more details. Table 3. Temperature Steps 8 TEMPERATURE VALUE (hex) SDR COUNT RATE < 0°C 0h × 1/8 0–10°C 1h × 1/4 10–20°C 2h × 1/2 20–30°C 3h 1 count/hr 30–40°C 4h ×2 40–50°C 5h ×c4 50–60°C 6h ×8 >60°C 7h × 16 www.ti.com SLUS491 – JULY 2001 APPLICATION INFORMATION CLEAR register The host system is responsible for register maintenance. To facilitate this maintenance, the bq26231 has a clear register (TMP/CLR) designed to reset the specific counter or register pair to zero. The host system clears a register by writing the corresponding register bit to 1. When the bq26231 completes the reset, the corresponding bit in the TMP/CLR register is automatically reset to 0, which saves the host an extra write/read cycle. Clearing the DTC register clears the STD bit and sets the DTC count rate to the default value of 1 count per 0.8789 s. Clearing the CTC register clears the STC bit and sets the CTC count rate to the default value of 1 count per 0.8789 s. calibration mode The system can enable bq26231 V(OS) calibration by setting the calibration bit in the MODE/WOE register (bit 6) to 1. The bq26231 then enters calibration mode when the HDQ line is low for greater than 10 seconds and when the signal between SR1 and SR2 pins is below V(WOE). CAUTION: Ensure that no low-level external signal is present between SR1 and SR2, because it affects the calibration value that the bq26231 calculates. If HDQ remains low for one hour and |V(SR)| < V(WOE) for the entire time, the measured V(OS) is latched into the OFR register, and the calibration bit is reset to zero, indicating to the system that the calibration cycle is complete. Once calibration is complete, the bq26231 enters a low-power mode until HDQ goes high, indicating that an external system is ready to access the bq26231. If HDQ transitions high before completion of the V(OS) calculation or if |V(SR)| > V(WOE), then the calibration cycle is reset. The bq26231 then postpones the calibration cycle until the conditions are met. The calibration bit does not reset to zero until a valid calibration cycle is completed. The requirement for HDQ to remain low for the calibration cycle can be disabled by setting the OVRDQ bit to 1. In this case, calibration continues as long as |V(SR)| < V(WOE). The OVRDQ bit is reset to zero at the end of a valid calibration cycle. communicating with the bq26231 The bq26231 includes a simple single-wire (referenced to VSS) serial data interface. A host processor uses the interface to access various bq26231 registers. NOTE: The HDQ pin requires an external pullup or pulldown resistor. The interface uses a command-based protocol, where the host processor sends a command byte to the bq26231. The command directs the bq26231 either to store the next eight bits of data received to a register specified by the command byte or to output the eight bits of data from a register specified by the command byte. The communication protocol is asynchronous return-to-one. Command and data bytes consist of a stream of eight bits that have a maximum transmission rate of 5K bits/s. The least-significant bit of a command or data byte is transmitted first. The protocol is simple enough that it can be implemented by most host processors using either polled or interrupt processing. Data input from the bq26231 may be sampled using the pulse-width capture timers available on some microcontrollers. A UART may also be used to communicate through the HDQ pin. If a communication timeout occurs (i.e., if the host waits longer than t(CYCB) for the bq26231 to respond, or if this is the first access command), then a break should be sent by the host. The host may then resend the command. The bq26231 detects a break when the HDQ pin is driven to a logic-low state for time t(B) or greater. The HDQ pin then returns to its normal ready-high logic state for a time, t(BR). The bq26231 is then ready to receive a command from the host processor. www.ti.com 9 SLUS491 – JULY 2001 APPLICATION INFORMATION communicating with the bq26231 (continued) The return-to-one data bit frame consists of three distinct sections. The first section is used to start the transmission by either the host or the bq26231 taking the HDQ pin to a logic-low state for a period t(STRH,B). The next section is the actual data transmission, where the data should be valid by a period t(DSU,B) after the negative edge used to start communication. The data should be held for a period t(DV) / t(DH), to allow the host or bq26231 to sample the data bit. The final section is used to stop the transmission by returning the HDQ pin to a logic-high state by at least a period t(SSU,B) after the negative edge used to start communication. The final logic-high state should be held for a period t(CYCH,B), to allow the bit transmission to cease properly. The Standard Serial Communication Timing Specification table and Figure 1 give the timings for data and break communication. Communication with the bq26231 always occurs with the least-significant bit being transmitted first. Figure 4 shows an example of a communication sequence to read the bq26231 OFR register. Written by Host to bq26231 Received by Host from bq26231 CMDR = 73h Data (OFR) = 65h LSB Break 0 1 MSB 1 1 2 3 0 0 4 1 5 MSB LSB 7 0 6 1 0 1 LSB 1 MSB 1 0 MSB 73h = 01110011 2 1 3 0 4 0 5 1 6 1 LSB 65h = 0 1 1 0 0 1 0 1 Figure 4. Typical Communication With the bq26231 Send Host to bq-HDQ Send Host to bq-HDQ or Receive From bq-HDQ Data CMDR Address Break R/W MSB Bit7 LSB Bit0 t(RSPS) Start-Bit Address-Bit/Data-Bit Stop-Bit Figure 5. Communication Frame Example 10 www.ti.com 7 0 SLUS491 – JULY 2001 APPLICATION INFORMATION bq26231 command and status registers The bq26231 command and status registers are listed and described in Table 4. command (CMDR) The write-only command register is accessed when the bq26231 has received eight contiguous valid command bits. The command register contains two fields: D W/R D Command address The W/R bit of the command register is used to select whether the received command is for a read or a write function. The W/R values are: CDMR BITS 7 6 5 4 3 2 1 0 W/R – – – – – – – where W/R is 0 The bq26231 outputs the requested register contents specified by the address portion of the CMDR. 1 The following eight bits should be written to the register specified by the address portion of the CMDR. Table 4. bq26231 Command and Status Registers HDQ Address (hex) Read/ Write Bit 7 (MSB) Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit0 (LSB) Command register – Write W/R AD6 AD5 AD4 AD3 AD2 AD1 AD0 DCRH Discharge count register high byte 7F Read DCRH7 DCRH6 DCRH5 DCRH4 DCRH3 DCRH2 DCRH1 DCRH0 DCRL Discharge count register low byte 7E Read DCRL6 DCRL5 DCRL4 DCRL3 DCRL2 DCRL1 DCRL0 CCRH Charge count register high byte 7D Read CCRH6 CCRH5 CCRH4 CCRH3 CCRH2 CCRH1 CCRH0 CCRL Charge count register low byte 7C Read CCRL6 CCRL5 CCRL4 CCRL3 CCRL2 CCRL1 CCRL0 SCRH Self-discharge count register high byte 7B Read SCRH7 SCRH6 SCRH5 SCRH4 SCRH3 SCRH2 SCRH1 SCRH0 SCRL Self-discharge count register low byte 7A Read SCRL7 SCRL6 SCRL5 SCRL4 SCRL3 SCRL2 SCRL1 SCRL0 DTCH Discharge time count high byte 79 Read DTCH7 DTCH6 DTCH5 DTCH4 DTCH3 DTCH2 DTCH1 DTCH0 DTCL Discharge time count low byte 78 Read DTCL7 DTCL6 DTCL5 DTCL4 DTCL3 DTCL2 DTCL1 DTCL0 CTCH Charge time count high byte 77 Read CTCH7 CTCH6 CTCH5 CTCH4 CTCH3 CTCH2 CTCH1 CTCH0 CTCL Charge time count low byte 76 Read CTCL7 CTCL6 CTCL5 CTCL4 CTCL3 CTCL2 CTCL1 CTCL0 Mode/WOE register 75 Read/ Write OVERDQ CAL STC STD WOE3 WOE2 WOE1 0 TMP/ CLR Temperature/clear register 74 Read/ Write TMP2 TMP1 TMP0 CTC DTC SCR CCR DCR OFR Offset register 73 Read/ Write OFR7 OFR6 OFR5 OFR4 OFR3 OFR2 OFR1 OFR0 Symbol Register Name CMDR MODE/ WOE DCRL7 CCRH7 CCRL7 www.ti.com 11 SLUS491 – JULY 2001 APPLICATION INFORMATION command (CMDR) (continued) The lower seven-bit field of CMDR contains the address portion of the register to be accessed. CDMR BITS 7 6 5 4 3 2 1 0 – AD6 AD5 AD4 AD3 AD2 AD1 AD0 discharge count registers (DCRH/DCRL) The DCRH high-byte register (address = 7F hex) and the DCRL low-byte register (address = 7E hex) contain the count of the discharge and are incremented whenever V(SR1) < V(SR2). These registers continue to count beyond FFFF hex, so proper register maintenance should be done by the host system. The TMP/CLR register is used to force the reset of both the DCRH and DCRL to zero. charge count registers (CCRH/CCRL) The CCRH high-byte register (address = 7D hex) and the CCRL low-byte register (address = 7C hex) contain the count of the charge, and are incremented whenever V(SR1) > V(SR2). These registers continue to count beyond FFFF hex, so proper register maintenance should be done by the host system. The TMP/CLR register is used to force the reset of both the CCRH and CCRL to zero. self-discharge count registers (SCRH/SCRL) The SCRH high-byte register (address = 7B hex) and the SCRL low-byte register (address = 7A hex) contain the self-discharge count. These registers are continually updated when the bq26231 is in its normal operating mode. The counts in these registers are incremented based on time and temperature. The SCR counts at a rate of 1 count per hour at 20–30°C and doubles every 10°C to greater than 60°C (16 counts/hour). The count will halve every 10°C below 20–30°C to less than 0°C (1 count/8 hours). These registers continue to count beyond FFFF hex, so proper register maintenance should be done by the host system. The TMP/CLR register is used to force the reset of both the SCRH and SCRL to zero. discharge time count registers (DTCH/DTCL) The DTCH high-byte register (address = 79 hex) and the DTCL low-byte register (address = 78 hex) are used to determine the length of time the V(SR1) < V(SR2), indicating a discharge. The counts in these registers are incremented at a rate of 4096 counts per hour. If the DTCH/DTCL register continues to count beyond FFFF hex, the STD bit is set in the MODE/WOE register, indicating a rollover. Once set, DTCH and DTCL increment at a rate of 16 counts per hour. The TMP/CLR register is used to force the reset of both the DTCH and DTCL to zero. NOTE: If a second rollover occurs, STD is cleared. Access to the bq26231 should be timed to clear DTCH/DTCL more often than every 170 days. charge time count registers (CTCH/CTCL) The CTCH high-byte register (address = 77 hex) and the CTCL low-byte register (address = 76 hex) are used to determine the length of time the V(SR1) > V(SR2), indicating a charge. The counts in these registers are incremented at a rate of 4096 counts per hour. If the CTCH/CTCL registers continue to count beyond FFFF hex, the STC bit is set in the MODE/WOE register, indicating a rollover. Once set, DTCH and DTCL increment at a rate of 16 counts per hour. The TMP/CLR register is used to force the reset of both the CTCH and CTCL to zero. NOTE: If a second rollover occurs, STD is cleared. Access to the bq26231 should be timed to clear CTCH/CTCL more often than every 170 days. 12 www.ti.com SLUS491 – JULY 2001 APPLICATION INFORMATION mode/wake-up enable register The Mode/WOE register (address = 75 hex) contains the calibration and wake-up enable information, and the STC and STD bits as described below. The override DQ (OVRDQ) bit (bit 7) is used to override the requirement for HDQ to be low before initiating V(OS) calibration. This bit is normally set to zero. If OVRDQ is written to one, the bq26231 begins offset calibration when |V(SR)| < V(WOE) where HDQ = Don’t care. The OVRDQ location is MODE/WOE BITS 7 6 5 4 3 2 1 0 OVERDQ – – – – – – – where OVRDQ is 0 1 HDQ = 0 and |V(SR)| < V(WOE) for V(OS) calibration to begin HDQ = Don’t care and |V(SR)| < V(WOE) for V(OS) calibration to begin NOTE: The OVRDQ bit should only be used in conjunction with a calibration cycle. Normal operation of the bq26231 is not ensured when this bit is set. After a valid calibration cycle, bit 7 is reset to zero. The calibration (CAL) bit 6 is used to enable the bq26231 offset calibration test. Setting this bit to 1 enables a V(OS) calibration whenever HDQ is low (default), and |V(SR)| < V(WOE). This bit is cleared to 0 by the bq26231 whenever a valid V(OS) calibration is completed, and the OFR register is updated with the new calculated offset. The bit remains 1 if the offset calibration was not completed. The CAL location is MODE/WOE BITS 7 6 5 4 3 2 1 0 – CAL – – – – – – where CAL is 0 1 Valid offset calibration Offset calibration pending The slow time charge (STC) and slow time discharge (STD) flags indicate if the CTC or DTC registers have rolled over beyond FFFF hex. STC set to 1 indicates a CTC rollover; STD set to 1 indicates a DTC rollover. The STC and STD locations are MODE/WOE BITS 7 6 5 4 3 2 1 0 – – STC STD – – – – where STC/STD is 0 1 No rollover Rollover occurred in the corresponding CTC/DTC register. The WOE bits (bits 3–1) are used in conjunction with the CAL bit for the calibration process. When the CAL bit is set to 1, the bq26231 enables a V(OS) calibration whenever HDQ is low (default), and |V(SR)| < V(WOE). On bq26231 initialization (power-on reset) the WOE bits are set to1. Setting all of these bits to zero is not valid. Refer to Table 5 for the various WOE values. www.ti.com 13 SLUS491 – JULY 2001 APPLICATION INFORMATION mode/wake-up enable register (continued) The WOE 3–1 locations are MODE/WOE BITS 7 6 5 4 3 2 1 0 – – – – WOE3 WOE2 WOE1 – where WOE3–1 is determined by dividing 3.84 mV by the value in WOE. NOTE: Bit 0 of the MODE/WOE register is reserved and must remain 0. Table 5. WOE Thresholds WOE3–1 (hex) 0 V(WOE) (mV) N/A 1 3.840 2 1.920 3 1.280 4 0.960 5 0.768 6 0.640 7 (default after POR) 0.549 temperature and clear register The TMP/CLR register (address = 74 hex) is used to give the present temperature step between < 0°C and > 60°C and clear the various count registers. The values of the TMP0–TMP2 (bits 5–7) denote the current temperature step sense by the bq26231 as outlined in Table 3. The bq26231 temperature sense is trimmed to ±2°C typical (±4°C maximum). The TMP2–0 locations are TMP/CLR BITS 7 6 5 4 3 2 1 0 TMP2 TMP1 TMP0 – – – – – where TMP2–0 is the temperature step sensed by this bq26231. The Clear bits (Bits 0–4) are used to reset the various bq26231 counters and STC and STD bits to zero. Writing the bits to 1 resets the corresponding register to 0. The clear bit resets to 0, indicating a successful register reset. Each clear bit is independent, so it is possible to clear the DCRH/DCRL registers without affecting the values in any other bq26231 register. The high-byte and low-byte registers are both cleared when the corresponding bit is written to 1. 14 www.ti.com SLUS491 – JULY 2001 APPLICATION INFORMATION temperature and clear register (continued) The clear bit locations are TMP/CLR BITS 7 6 5 4 3 2 1 0 – – – CTC DTC SCR CCR DCR Where: The CTC bit (bit 4) resets both the CTCH and CTCL registers and the STC bit to 0. The DTC bit (bit 3) resets both the DTCH and DTCL registers and the STD bit to 0. The SCR bit (bit 2) resets both the SCRH and SCRL registers to 0. The CCR bit (bit 1) resets both the CCRH and CCRL registers to 0. The DCR bit (bit 0) resets both the DCRH and DCRL registers to 0. offset register (OFR) The OFR register (address = 73 hex) is used to store the calculated V(OS) of the bq26231. The OFR value can be used to cancel the voltage offset between V(SR1) and V(SR2). The up/down offset counter is centered at zero. The actual offset is an 8-bit 2s complement value located in OFR. The OFR locations are TMP/CLR BITS 7 6 5 4 3 2 1 0 OFR7 OFR6 OFR5 OFR4 OFR3 OFR2 OFR1 OFR0 where OFR7 is 0 1 Discharge Charge www.ti.com 15 SLUS491 – JULY 2001 MECHANICAL DATA PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°–ā8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. 16 All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 www.ti.com PACKAGE OPTION ADDENDUM www.ti.com 18-Feb-2005 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty BQ26231PW ACTIVE TSSOP PW 8 150 None CU NIPDAU Level-1-220C-UNLIM BQ26231PWR ACTIVE TSSOP PW 8 2000 None CU NIPDAU Level-1-220C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. None: Not yet available Lead (Pb-Free). Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens, including bromine (Br) or antimony (Sb) above 0.1% of total product weight. (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder temperature. 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