TI TPS79601DCQR

TPS796xx
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SLVS351I – SEPTEMBER 2002 – REVISED MAY 2006
ULTRALOW-NOISE, HIGH PSRR, FAST, RF, 1A
LOW-DROPOUT LINEAR REGULATORS
FEATURES
•
•
•
•
•
•
•
1A Low-Dropout Regulator With Enable
Available in Fixed and Adjustable (1.2V to
5.5V) Versions
High PSRR (53dB at 10kHz)
Ultralow-Noise (40µVRMS, TPS79630)
Fast Start-Up Time (50µs)
Stable With a 1µF Ceramic Capacitor
Excellent Load/Line Transient Response
Very Low Dropout Voltage (250mV at Full
Load, TPS79630)
3 × 3 SON, SOT223-6, and
DDPAK-5 Packages
The TPS796xx family of low-dropout (LDO)
low-power linear voltage regulators features high
power supply rejection ratio (PSRR), ultralow-noise,
fast start-up, and excellent line and load transient
responses in small outline, 3 × 3 SON, SOT223-6,
and DDPAK-5 packages. Each device in the family is
stable with a small 1µF ceramic capacitor on the
output. The family uses an advanced, proprietary
BiCMOS fabrication process to yield extremely low
dropout voltages (e.g., 250mV at 1A). Each device
achieves fast start-up times (approximately 50µs with
a 0.001µF bypass capacitor) while consuming very
low quiescent current (265 µA typical). Moreover,
when the device is placed in standby mode, the
supply current is reduced to less than 1µA. The
TPS79630 exhibits approximately 40µVRMS of output
voltage noise at 3.0V output, with a 0.1µF bypass
capacitor. Applications with analog components that
are noise sensitive, such as portable RF electronics,
benefit from the high PSRR, low noise features, and
the fast response time.
APPLICATIONS
•
•
•
•
•
RF: VCOs, Receivers, ADCs
Audio
Bluetooth™, Wireless LAN
Cellular and Cordless Telephones
Handheld Organizers, PDAs
DRB PACKAGE
3mm x 3mm SON
(TOP VIEW)
EN
IN
GND
OUT
NR/FB
IN 1
IN 2
OUT 3
OUT 4
1
2
3
4
5
8 EN
7 NC
KTT (DDPAK) PACKAGE
(TOP VIEW)
EN
IN
GND
OUT
NR/FB
1
2
3
4
5
0.7
70
5 NR
6
GND
TPS79630
OUTPUT SPECTRAL NOISE DENSITY
vs
FREQUENCY
80
6 GND
Ripple Rejection − dB
DCQ PACKAGE
SOT223-6
(TOP VIEW)
TPS79630
RIPPLE REJECTION
vs
FREQUENCY
IOUT = 1 mA
60
50
VIN = 4 V
COUT = 10 µF
CNR = 0.01 µF
Output Spectral Noise Density − µV/√Hz
•
•
DESCRIPTION
IOUT = 1 A
40
30
20
10
0
1
10
100
1k
10k 100k
Frequency (Hz)
1M
10M
0.6
VIN = 5.5 V
COUT = 2.2 µF
CNR = 0.1 µF
0.5
0.4
0.3
IOUT = 1 mA
0.2
0.1
IOUT = 1.5 A
0.0
100
1k
10k
100k
Frequency (Hz)
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Bluetooth is a trademark of Bluetooth SIG, Inc.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2002–2006, Texas Instruments Incorporated
TPS796xx
www.ti.com
SLVS351I – SEPTEMBER 2002 – REVISED MAY 2006
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
ORDERING INFORMATION (1)
VOUT (2)
PRODUCT
TPS796xxyyyz
(1)
(2)
XX is nominal output voltage (for example, 28 = 2.8V, 01 = Adjustable).
YYY is package designator.
Z is package quantity.
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Output voltages from 1.3V to 4.9V in 100mV increments are available; minimum order quantities may apply. Contact factory for details
and availability.
ABSOLUTE MAXIMUM RATINGS
over operating temperature range (unless otherwise noted) (1)
UNIT
VIN range
–0.3V to 6V
VEN range
–0.3V to VIN + 0.3V
VOUT range
6V
Peak output current
Internally limited
ESD rating, HBM
2kV
ESD rating, CDM
500V
Continuous total power dissipation
See Dissipation Ratings Table
Junction temperature range, TJ
–40°C to +150°C
Storage temperature range, Tstg
–65°C to +150°C
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
PACKAGE DISSIPATION RATINGS
(1)
(2)
2
PACKAGE
BOARD
RθJC
RθJA
DDPAK
High-K (1)
2°C/W
23°C/W
SOT223
Low-K (2)
15°C/W
53°C/W
3 × 3 SON
High-K (1)
1.2°C/W
40°C/W
The JEDEC high-K (2s2p) board design used to derive this data was a 3-inch × 3-inch (7,5-cm × 7,5-cm), multilayer board with 1-ounce
internal power and ground planes and 2-ounce copper traces on top and bottom of the board.
The JEDEC low-K (1s) board design used to derive this data was a 3-inch × 3-inch (7,5-cm × 7,5-cm), two-layer board with 2-ounce
copper traces on top of the board.
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SLVS351I – SEPTEMBER 2002 – REVISED MAY 2006
ELECTRICAL CHARACTERISTICS
over recommended operating temperature range (TJ = –40°C to +125°C), VEN = VIN,, VIN = VOUT(nom) + 1 V (1), IOUT = 1mA,
COUT = 10µF, and CNR = 0.01µF, unless otherwise noted. Typical values are at +25°C.
PARAMETER
TEST CONDITIONS
VIN Input voltage (1)
Accuracy
TPS79601
V
1.250
V
0
1
A
1.225
5.5 – VDD
V
1.02VOUT
V
1.225
0µA ≤ IOUT ≤ 1A, VOUT + 1V ≤ VIN ≤ 5.5V (1)
Fixed
VOUT < 5V
0µA ≤ IOUT ≤ 1A, VOUT + 1V ≤ VIN ≤
5.5V (1)
–2.0
+2.0
%
Fixed
VOUT = 5V
0µA ≤ IOUT ≤ 1A, VOUT + 1V ≤ VIN ≤ 5.5V (1)
–3.0
+3.0
%
0.12
%/V
VOUT + 1V ≤ VIN≤ 5.5V
Load regulation (∆VOUT%/∆IOUT)
0µA ≤ IOUT ≤ 1A
0.98VOUT
VOUT
0.05
5
IOUT = 1A
TPS79628DRB
IOUT = 250mA
52
90
TPS79630
IOUT = 1A
250
345
TPS79633
IOUT = 1A
220
325
TPS79650
IOUT = 1A
200
300
VOUT = 0V
Ground pin current
0µA ≤ IOUT ≤ 1A
Shutdown current (4)
VEN = 0V, 2.7V ≤ VIN ≤ 5.5V
FB pin current
VFB = 1.225V
TPS79630
Output noise voltage (TPS79630)
270
mV
TPS79628
Output current limit
Power-supply ripple
rejection
UNIT
TPS79601 (2)
Output voltage line regulation
(∆VOUT%/VIN) (1)
Dropout voltage (3)
(VIN = VOUT (nom)– 0.1V)
MAX
5.5
1.200
IOUT Continuous output current
Output
voltage
TYP
2.7
VFB Internal reference (TPS79601)
Output
voltage
range
MIN
2.4
mV
4.2
A
265
385
µA
0.07
1
µA
1
µA
f = 100Hz, IOUT = 10mA
59
f = 100Hz, IOUT = 1A
54
f = 10Hz, IOUT = 1A
53
f = 100Hz, IOUT = 1A
42
BW = 100Hz to 100kHz,
IOUT = 1A
365
CNR = 0.001µF
54
CNR = 0.0047µF
46
CNR = 0.01µF
41
CNR = 0.1µF
40
CNR = 0.001µF
50
CNR = 0.0047µF
75
dB
µVRMS
µs
Time, start-up (TPS79630)
RL = 3Ω, COUT = 1µF
EN pin current
VEN = 0V
–1
1
µA
High-level enable input voltage
2.7V ≤ VIN ≤ 5.5V
1.7
VIN
V
Low-level enable input voltage
2.7V ≤ VIN ≤ 5.5V
0
0.7
V
CNR = 0.01µF
(1)
(2)
(3)
(4)
110
Minimum VIN = VOUT + VDO or 2.7V, whichever is greater. TPS79650 is tested at VIN = 5.5V.
Tolerance of external resistors not included in this specification.
VDO is not measured for TPS79618 and TPS79625 because minimum VIN = 2.7V.
For adjustable version, this applies only after VIN is applied; then VEN transitions high to low.
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TPS796xx
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SLVS351I – SEPTEMBER 2002 – REVISED MAY 2006
FUNCTIONAL BLOCK DIAGRAM—ADJUSTABLE VERSION
IN
OUT
Current
Sense
UVLO
SHUTDOWN
ILIM
_
GND
R1
+
FB
EN
UVLO
R2
Thermal
Shutdown
Quickstart
Bandgap
Reference
1.225 V
VIN
250 kΩ
External to
the Device
VREF
FUNCTIONAL BLOCK DIAGRAM—FIXED VERSION
IN
OUT
UVLO
Current
Sense
GND
SHUTDOWN
ILIM
_
EN
R1
+
UVLO
Thermal
Shutdown
R2
Quickstart
VIN
Bandgap
Reference
1.225 V
R2 = 40k
250 kΩ
VREF
NR
Table 1. Terminal Functions
TERMINAL
NAME
FIXED
NR
N/A
5
Connecting an external capacitor to this pin bypasses noise generated by the internal bandgap. This
improves power-supply rejection and reduces output noise.
EN
1
1
Driving the enable pin (EN) high turns on the regulator. Driving this pin low puts the regulator into shutdown
mode. EN can be connected to IN if not used.
FB
5
N/A
3, Tab
3, Tab
IN
2
2
Unregulated input to the device.
OUT
4
4
Output of the regulator.
GND
4
DESCRIPTION
ADJ
This terminal is the feedback input voltage for the adjustable device.
Regulator ground
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TYPICAL CHARACTERISTICS
TPS79630
OUTPUT VOLTAGE
vs
OUTPUT CURRENT
TPS79628
OUTPUT VOLTAGE
vs
JUNCTION TEMPERATURE
TPS79628
GROUND CURRENT
vs
JUNCTION TEMPERATURE
2.795
4
3.05
VIN = 4 V
COUT = 10 µF
TJ = 25°C
3.04
3.03
350
VIN = 3.8 V
COUT = 10 µF
340
IOUT = 1 mA
3
2.790
3.02
330
VOUT (V)
3.00
2.99
2.98
IGND (µA)
3.01
VOUT (V)
VIN = 3.8 V
COUT = 10 µF
2
2.785
IOUT = 1 A
320
IOUT = 1 A
310
1
2.780
IOUT = 1 mA
2.97
300
2.96
2.95
0.2
0.4
0.6
0.8
0
2.775
−40 −25 −10 5
1.0
TJ (°C)
TJ (°C)
Figure 1.
Figure 2.
Figure 3.
TPS79630
OUTPUT SPECTRAL NOISE
DENSITY
vs
FREQUENCY
TPS79630
OUTPUT SPECTRAL NOISE
DENSITY
vs
FREQUENCY
TPS79630
OUTPUT SPECTRAL NOISE
DENSITY
vs
FREQUENCY
0.6
Output Spectral Noise Density − µV//Hz
Output Spectral Noise Density − µV//Hz
VIN = 5.5 V
COUT = 2.2 µF
CNR = 0.1 µF
0.5
0.4
0.3
IOUT = 1 mA
0.2
0.1
IOUT = 1.5 A
0.0
100
20 35 50 65 80 95 110 125
IOUT (A)
0.7
0.6
290
−40 −25 −10 5
20 35 50 65 80 95 110 125
1k
10k
Frequency (Hz)
Figure 4.
100k
2.5
Output Spectral Noise Density − µV//Hz
0.0
VIN = 5.5 V
COUT = 10 µF
CNR = 0.1 µF
0.5
0.4
0.3
IOUT = 1 mA
0.2
0.1
0.0
100
IOUT = 1 A
1k
10k
Frequency (Hz)
Figure 5.
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100k
2.0
CNR = 0.01 µF
VIN = 5.5 V
COUT = 10 µF
IOUT = 1 A
CNR = 0.1 µF
1.5
CNR = 0.0047 µF
1.0
CNR = 0.001 µF
0.5
0.0
100
1k
10k
100k
Frequency (Hz)
Figure 6.
5
TPS796xx
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SLVS351I – SEPTEMBER 2002 – REVISED MAY 2006
TYPICAL CHARACTERISTICS (continued)
TPS79628
DROPOUT VOLTAGE
vs
JUNCTION TEMPERATURE
80
VIN = 2.7 V
COUT = 10 µF
300
50
IOUT = 1 A
Ripple Rejection − dB
20
200
150
100
IOUT = 250 mA
COUT = 10 µF
BW = 100 Hz to 100 kHz
10
0
0.001 µF
0.0047 µF
50
30
20
10
IOUT = 250 mA
0
−40−25 −10 5 20 35 50 65 80 95 110 125
0.1 µF
0
1
Figure 8.
TPS79630
RIPPLE REJECTION
vs
FREQUENCY
TPS79630
RIPPLE REJECTION
vs
FREQUENCY
IOUT = 1 A
40
30
20
10M
START-UP TIME
VIN = 4 V
COUT = 2.2 µF
CNR = 0.01 µF
IOUT = 1 mA
60
VIN = 4 V,
COUT = 10 µF,
IOUT = 1.0 A
2.75
2.50
IOUT = 1 A
40
30
Enable
CNR =
0.001 µF
2
50
CNR =
0.0047 µF
2.25
VOUT (V)
50
1M
3
70
Ripple Rejection − dB
60
10k 100k
Figure 9.
80
VIN = 4 V
COUT = 10 µF
CNR = 0.1 µF
1k
100
Frequency (Hz)
Figure 7.
IOUT = 1 mA
10
TJ (_C)
CNR (µF)
70
IOUT = 1 A
40
50
0.01 µF
IOUT = 1 mA
60
250
30
VIN = 4 V
COUT = 10 µF
CNR = 0.01 µF
70
40
80
Ripple Rejection − dB
TPS79630
RIPPLE REJECTION
vs
FREQUENCY
350
60
VDO (mV)
RMS − Root Mean Squared Output Noise − µVRMS
TPS79630
ROOT MEAN SQUARED OUTPUT
NOISE
vs
BYPASS CAPACITANCE
1.75
1.50
CNR =
0.01 µF
1.25
1
20
10
10
0
0
0.75
0.50
0.25
1
10
100
1k
10k 100k
1M
10M
0
1
10k 100k
1M
10M
100
200
300
400
500
600
Figure 10.
Figure 11.
Figure 12.
TPS79618
LINE TRANSIENT RESPONSE
TPS79630
LINE TRANSIENT RESPONSE
TPS79628
LOAD TRANSIENT RESPONSE
4
5
1
3
dv
1V
+
ms
dt
IOUT = 1 A
COUT = 10 µF
CNR = 0.01 µF
IOUT (A)
2
4
IOUT = 1 A
COUT = 10 µF
CNR = 0.01 µF
3
∆VOUT (mV)
0
−20
dv
1V
+
ms
dt
150
20
0
−20
−40
−40
20 40 60 80 100 120 140 160 180 200
t (µs)
Figure 13.
0
0
−1
∆VOUT (mV)
40
20
0
0
t (ms)
6
40
∆VOUT (mV)
1k
5
2
6
100
Frequency (Hz)
VIN (V)
VIN (V)
Frequency (Hz)
10
20 40 60 80 100 120 140 160 180 200
t (µs)
Figure 14.
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VIN = 3.8 V
COUT = 10 µF
CNR = 0.01 µF
di
1A
+
ms
dt
75
0
−75
−150
0
100 200 300 400 500 600 700 800 900 1000
t (µs)
Figure 15.
TPS796xx
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SLVS351I – SEPTEMBER 2002 – REVISED MAY 2006
TYPICAL CHARACTERISTICS (continued)
TPS79630
DROPOUT VOLTAGE
vs
OUTPUT CURRENT
TPS79625
POWER UP/POWER DOWN
VOUT = 2.5 V
RL = 10 Ω
CNR = 0.01 µF
3.5
3.0
300
250
TJ = 125°C
TJ = 125°C
250
2.5
2.0
200
VDO (mV)
200
VDO (mV)
TJ = 25°C
150
1.5
100
1.0
VOUT
0.5
2
3
4
5
6
7
8
9
0
2.5
0 100 200 300 400 500 600 700 800 9001000
10
IOUT = 1 A
COUT = 10 µF
CNR = 0.01 µF
50
0
1
TJ = −40°C
TJ = −40°C
50
0
0
TJ = 25°C
150
100
VIN
200 µs/Div
3.0
3.5
IOUT (mA)
4.0
4.5
5.0
VIN (V)
Figure 16.
Figure 17.
Figure 18.
TPS79630
TYPICAL REGIONS OF STABILITY
EQUIVALENT SERIES RESISTANCE
(ESR)
vs
OUTPUT CURRENT
TPS79630
TYPICAL REGIONS OF STABILITY
EQUIVALENT SERIES RESISTANCE
(ESR)
vs
OUTPUT CURRENT
TPS79630
TYPICAL REGIONS OF STABILITY
EQUIVALENT SERIES RESISTANCE
(ESR)
vs
OUTPUT CURRENT
100
Region of
Instability
10
1
Region of Stability
0.1
0.01
ESR − Equivalent Series Resistance − Ω
100
COUT = 1 µF
COUT = 2.2 µF
Region of
Instability
10
1
Region of Stability
0.1
10
30
60
125 250 500 750 1000
IOUT (mA)
Figure 19.
100
COUT = 10.0 µF
Region of
Instability
10
1
Region of Stability
0.1
0.01
1
0.01
1
ESR − Equivalent Series Resistance − Ω
500 mV/Div
300
350
4.0
ESR − Equivalent Series Resistance − Ω
TPS79601
DROPOUT VOLTAGE
vs
INPUT VOLTAGE
1
10
30
60
125 250 500 750 1000
10
30
60
125 250 500 750 1000
IOUT (mA)
IOUT (mA)
Figure 20.
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Figure 21.
7
TPS796xx
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SLVS351I – SEPTEMBER 2002 – REVISED MAY 2006
APPLICATION INFORMATION
The TPS796xx family of low-dropout (LDO)
regulators has been optimized for use in
noise-sensitive equipment. The device features
extremely low dropout voltages, high PSRR, ultralow
output noise, low quiescent current (265µA typically),
and enable input to reduce supply currents to less
than 1µA when the regulator is turned off.
A typical application circuit is shown in Figure 22.
VIN
IN
VOUT
OUT
TPS796xx
2.2µF
EN
GND
1 µF
NR
0.01µF
Figure 22. Typical Application Circuit
External Capacitor Requirements
Although not required, it is good analog design
practice to place a 0.1µF — 2.2µF capacitor near the
input of the regulator to counteract reactive input
sources. A 2.2µF or larger ceramic input bypass
capacitor, connected between IN and GND and
located close to the TPS796xx, is required for
stability and improves transient response, noise
rejection, and ripple rejection. A higher-value input
capacitor may be necessary if large, fast-rise-time
load transients are anticipated and the device is
located several inches from the power source.
Like most low dropout regulators, the TPS796xx
requires an output capacitor connected between
OUT and GND to stabilize the internal control loop.
The minimum recommended capacitor is 1µF. Any
1µF or larger ceramic capacitor is suitable.
The internal voltage reference is a key source of
noise in an LDO regulator. The TPS796xx has an
NR pin which is connected to the voltage reference
through a 250kΩ internal resistor. The 250kΩ
internal resistor, in conjunction with an external
bypass capacitor connected to the NR pin, creates a
low-pass filter to reduce the voltage reference noise
and, therefore, the noise at the regulator output. In
order for the regulator to operate properly, the
current flow out of the NR pin must be at a minimum,
because any leakage current creates an IR drop
across the internal resistor, thus creating an output
error. Therefore, the bypass capacitor must have
minimal leakage current. The bypass capacitor
should be no more than 0.1µF in order to ensure that
it is fully charged during the quickstart time provided
by the internal switch shown in the functional block
diagram.
8
For example, the TPS79630 exhibits 40µVRMS of
output voltage noise using a 0.1µF ceramic bypass
capacitor and a 10µF ceramic output capacitor. Note
that the output starts up slower as the bypass
capacitance increases due to the RC time constant
at the bypass pin that is created by the internal
250kΩ resistor and external capacitor.
Board Layout Recommendation to Improve
PSRR and Noise Performance
To improve ac measurements like PSRR, output
noise, and transient response, it is recommended
that the board be designed with separate ground
planes for VIN and VOUT, with each ground plane
connected only at the ground pin of the device. In
addition, the ground connection for the bypass
capacitor should connect directly to the ground pin of
the device.
Regulator Mounting
The tab of the SOT223-6 package is electrically
connected to ground. For best thermal performance,
the tab of the surface-mount version should be
soldered directly to a circuit-board copper area.
Increasing the copper area improves heat
dissipation.
Solder pad footprint recommendations for the
devices are presented in an application bulletin
Solder Pad Recommendations for Surface-Mount
Devices, literature number AB-132, available for
download from the TI web site (www.ti.com).
Programming the TPS79601 Adjustable LDO
Regulator
The output voltage of the TPS79601 adjustable
regulator is programmed using an external resistor
divider as shown in Figure 28. The output voltage is
calculated using Equation 1:
V OUT + VREF
1) R1
R2
(1)
ǒ
Ǔ
where:
• VREF = 1.2246V typ (the internal reference
voltage)
Resistors R1 and R2 should be chosen for
approximately 40µA divider current. Lower value
resistors can be used for improved noise
performance, but the device wastes more power.
Higher values should be avoided, as leakage current
at FB increases the output voltage error.
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Regulator Protection
The recommended design procedure is to choose
R2 = 30.1kΩ to set the divider current at 40µA, C1 =
15pF for stability, and then calculate R1 using
Equation 2:
R1 +
ǒVV
OUT
REF
Ǔ
*1
The TPS796xx PMOS-pass transistor has a built-in
back diode that conducts reverse current when the
input voltage drops below the output voltage (e.g.,
during power-down). Current is conducted from the
output to the input and is not internally limited. If
extended reverse voltage operation is anticipated,
external limiting might be appropriate.
R2
(2)
In order to improve the stability of the adjustable
version, it is suggested that a small compensation
capacitor be placed between OUT and FB. The
approximate value of this capacitor can be calculated
as Equation 3:
(3 x 10 –7) x (R1 ) R2)
C1 +
(R1 x R2)
(3)
The TPS796xx features internal current limiting and
thermal protection. During normal operation, the
TPS796xx limits output current to approximately
2.8A. When current limiting engages, the output
voltage scales back linearly until the overcurrent
condition ends. While current limiting is designed to
prevent gross device failure, care should be taken
not to exceed the power dissipation ratings of the
package. If the temperature of the device exceeds
approximately +165°C, thermal-protection circuitry
shuts it down. Once the device has cooled down to
below approximately +140°C, regulator operation
resumes.
The suggested value of this capacitor for several
resistor ratios is shown in the table below (see
Figure 23). If this capacitor is not used (such as in a
unity-gain configuration) then the minimum
recommended output capacitor is 2.2µF instead of
1µF.
VIN
IN
2.2 µF
OUT
TPS79601
EN
GND
OUTPUT VOLTAGE
PROGRAMMING GUIDE
VOUT
R1
FB
C1
1 µF
OUTPUT
VOLTAGE
R2
R1
R2
C1
1.8 V
14.0 kΩ
30.1 kΩ
33 pF
3.6V
57.9 kΩ
30.1 kΩ
15 pF
Figure 23. TPS79601 Adjustable LDO Regulator Programming
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TPS796xx
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SLVS351I – SEPTEMBER 2002 – REVISED MAY 2006
THERMAL INFORMATION
The amount of heat that an LDO linear regulator
generates is directly proportional to the amount of
power it dissipates during operation. All integrated
circuits have a maximum allowable junction
temperature (TJmax) above which normal operation
is not assured. A system designer must design the
operating environment so that the operating junction
temperature (TJ) does not exceed the maximum
junction temperature (TJmax). The two main
environmental variables that a designer can use to
improve thermal performance are air flow and
external heatsinks. The purpose of this information is
to aid the designer in determining the proper
operating environment for a linear regulator that is
operating at a specific power level.
In general, the maximum expected power (PD(max))
consumed by a linear regulator is computed as
Equation 4:
P D max + ǒV IN(avg)* V OUT(avg)Ǔ
I OUT(avg))V IN(avg)
I (Q)
(4)
where:
• VIN(avg) is the average input voltage.
• VOUT(avg) is the average output voltage.
• IOUT(avg) is the average output current.
• I(Q) is the quiescent current.
For most TI LDO regulators, the quiescent current is
insignificant compared to the average output current;
therefore, the term VIN(avg) × I(Q) can be neglected.
The operating junction temperature is computed by
adding the ambient temperature (TA) and the
increase in temperature due to the regulator's power
A
CIRCUIT BOARD COPPER AREA
dissipation. The temperature rise is computed by
multiplying the maximum expected power dissipation
by the sum of the thermal resistances between the
junction and the case (RθJC), the case to heatsink
(RθCS), and the heatsink to ambient (RθSA). Thermal
resistances are measures of how effectively an
object dissipates heat. Typically, the larger the
device, the more surface area available for power
dissipation and the lower the object's thermal
resistance.
Figure 24 illustrates these thermal resistances for (a)
a SOT223 package mounted in a JEDEC low-K
board, and (b) a DDPAK package mounted on a
JEDEC high-K board.
Equation 5 summarizes the computation:
T
J
ǒ
+ T ) PDmax x R
) R
) R
A
θJC
θCS
θSA
(5)
The RθJC is specific to each regulator as determined
by its package, lead frame, and die size provided in
the regulator's data sheet. The RθSA is a function of
the type and size of heatsink. For example, black
body radiator type heatsinks can have RθCS values
ranging from 5°C/W for very large heatsinks to
50°C/W for very small heatsinks. The RθCS is a
function of how the package is attached to the
heatsink. For example, if a thermal compound is
used to attach a heatsink to a SOT223 package,
RθCS of 1°C/W is reasonable.
TJ
A
RθJC
B
C
B
TC
B
RθCS
A
C
RθSA
SOT223 Package
(a)
TA
Figure 24. Thermal Resistances
10
Ǔ
Submit Documentation Feedback
DDPAK Package
(b)
C
TPS796xx
www.ti.com
SLVS351I – SEPTEMBER 2002 – REVISED MAY 2006
Equation 5 simplifies into Equation 6:
T + T ) PDmax x R
J
A
θJA
Rearranging Equation 6 gives Equation 7:
T –T
R
+ J A
θJA
P max
D
(6)
(7)
Using Equation 6 and the computer model generated
curves shown in Figure 25 and Figure 28, a designer
can quickly compute the required heatsink thermal
resistance/board area for a given ambient
temperature, power dissipation, and operating
environment.
DDPAK Power Dissipation
The DDPAK package provides an effective means of
managing power dissipation in surface mount
applications. The DDPAK package dimensions are
provided in the Mechanical Data section at the end
of the data sheet. The addition of a copper plane
directly underneath the DDPAK package enhances
the thermal performance of the package.
To illustrate, the TPS72525 in a DDPAK package
was chosen. For this example, the average input
voltage is 5V, the output voltage is 2.5V, the average
output current is 1A, the ambient temperature 55°C,
the air flow is 150 LFM, and the operating
environment is the same as documented below.
Neglecting the quiescent current, the maximum
average power is calculated as Equation 8:
P Dmax + (5 * 2.5) V x 1 A + 2.5 W
(8)
Substituting TJmax for TJ into Equation 6 gives
Equation 9:
R
θJA
max + (125 * 55)°Cń2.5 W + 28°CńW
(9)
From Figure 25, DDPAK Thermal Resistance vs
Copper Heatsink Area, the ground plane needs to be
1cm2 for the part to dissipate 2.5W. The operating
environment used in the computer model to construct
Figure 25 consisted of a standard JEDEC High-K
board (2S2P) with a 1-oz. internal copper plane and
ground plane. The package is soldered to a 2-oz.
copper pad. The pad is tied through thermal vias to
the 1-oz. ground plane. Figure 26 shows the side
view of the operating environment used in the
computer model.
40
° C/W
No Air Flow
Rθ JA − Thermal Resistance −
Even if no external black body radiator type heatsink
is attached to the package, the board on which the
regulator is mounted provides some heatsinking
through the pin solder connections. Some packages,
like the DDPAK and SOT223 packages, use a
copper plane underneath the package or the circuit
board's ground plane for additional heatsinking to
improve their thermal performance. Computer-aided
thermal modeling can be used to compute very
accurate approximations of an integrated circuit's
thermal
performance
in
different
operating
environments (e.g., different types of circuit boards,
different types and sizes of heatsinks, and different
air flows, etc.). Using these models, the three
thermal resistances can be combined into one
thermal resistance between junction and ambient
(RθJA). This RθJA is valid only for the specific
operating environment used in the computer model.
35
150 LFM
30
250 LFM
25
20
15
0.1
1
10
Copper Heatsink Area − cm2
100
Figure 25. DDPAK Thermal Resistance vs Copper
Heatsink Area
2 oz. Copper Solder Pad
with 25 Thermal Vias
1 oz. Copper
Power Plane
1 oz. Copper
Ground Plane
Thermal Vias, 0.3 mm
Diameter, 1,5 mm Pitch
Figure 26. DDPAK Thermal Resistance
From the data in Figure 27 and rearranging
Equation 6, the maximum power dissipation for a
different ground plane area and a specific ambient
temperature can be computed.
Submit Documentation Feedback
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TPS796xx
www.ti.com
SLVS351I – SEPTEMBER 2002 – REVISED MAY 2006
5
180
° C/W
TA = 55°C
250 LFM
Rθ JA − Thermal Resistance −
PD Maximum (W)
4
150 LFM
3
No Air Flow
2
No Air Flow
160
140
120
100
80
60
40
20
1
10
Copper Heatsink Area − cm2
0
0.1
100
SOT223 Power Dissipation
The SOT223 package provides an effective means
of managing power dissipation in surface mount
applications. The SOT223 package dimensions are
provided in the Mechanical Data section at the end
of the data sheet. The addition of a copper plane
directly underneath the SOT223 package enhances
the thermal performance of the package.
To illustrate, the TPS72525 in a SOT223 package
was chosen. For this example, the average input
voltage is 3.3V, the output voltage is 2.5V, the
average output current is 1A, the ambient
temperature 55°C, no air flow is present, and the
operating environment is the same as documented
below. Neglecting the quiescent current, the
maximum average power is calculated as
Equation 10:
P Dmax + (3.3 * 2.5) V x 1 A + 800 mW
(10)
Substituting TJmax for TJ into Equation 6 gives
Equation 11:
R
max + (125 * 55)°Cń800 mW + 87.5°CńW
θJA
10
From the data in Figure 28 and rearranging
Equation 6, the maximum power dissipation for a
different ground plane area and a specific ambient
temperature can be computed (see Figure 29).
6
TA = 25°C
5
4
4 in2 PCB Area
3
0.5 in2 PCB Area
2
1
0
0
From Figure 28, RθJA vs PCB Copper Area, the
ground plane needs to be 0.55in2 for the part to
dissipate 800mW. The operating environment used
to construct Figure 28 consisted of a board with 1-oz.
copper planes. The package is soldered to a 1-oz.
copper pad on the top of the board. The pad is tied
through thermal vias to the 1-oz. ground plane.
25
50
75
100
125
TA (°C)
(11)
12
1
PCB Copper Area − in2
Figure 28. SOT223 Thermal Resistance vs PCB
Area
Figure 27. Maximum Power Dissipation vs
Copper Heatsink Area
PD Maximum (W)
1
0.1
Figure 29. SOT223 Power Dissipation
Submit Documentation Feedback
150
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
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TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
16-Mar-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TPS79601DCQ
ACTIVE
SOT-223
DCQ
6
78
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS79601DCQG4
ACTIVE
SOT-223
DCQ
6
78
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS79601DCQR
ACTIVE
SOT-223
DCQ
6
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS79601DCQRG4
ACTIVE
SOT-223
DCQ
6
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS79601KTT
OBSOLETE
DDPAK/
TO-263
KTT
5
TPS79601KTTR
ACTIVE
DDPAK/
TO-263
KTT
5
TPS79601KTTRG3
ACTIVE
DDPAK/
TO-263
KTT
TPS79601KTTT
ACTIVE
DDPAK/
TO-263
TPS79601KTTTG3
ACTIVE
TPS79613DRBR
PREVIEW
TPS79613DRBT
PREVIEW
TPS79618DCQ
ACTIVE
TPS79618DCQG4
ACTIVE
TPS79618DCQR
Lead/Ball Finish
MSL Peak Temp (3)
TBD
Call TI
Call TI
500
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
5
500
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
KTT
5
50
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
DDPAK/
TO-263
KTT
5
50
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
SON
DRB
8
TBD
Call TI
Call TI
SON
DRB
8
TBD
Call TI
Call TI
SOT-223
DCQ
6
78
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
SOT-223
DCQ
6
78
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
ACTIVE
SOT-223
DCQ
6
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS79618DCQRG4
ACTIVE
SOT-223
DCQ
6
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS79618KTT
OBSOLETE
DDPAK/
TO-263
KTT
5
TPS79618KTTR
ACTIVE
DDPAK/
TO-263
KTT
5
TPS79618KTTRG3
ACTIVE
DDPAK/
TO-263
KTT
TPS79618KTTT
ACTIVE
DDPAK/
TO-263
TPS79618KTTTG3
ACTIVE
TPS79625DCQ
TBD
Call TI
Call TI
500
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
5
500
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
KTT
5
50
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
DDPAK/
TO-263
KTT
5
50
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
ACTIVE
SOT-223
DCQ
6
78
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS79625DCQG4
ACTIVE
SOT-223
DCQ
6
78
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS79625DCQR
ACTIVE
SOT-223
DCQ
6
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS79625DCQRG4
ACTIVE
SOT-223
DCQ
6
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS79625KTT
OBSOLETE
DDPAK/
TO-263
KTT
5
TPS79625KTTR
ACTIVE
DDPAK/
KTT
5
500
Addendum-Page 1
TBD
Call TI
Call TI
Green (RoHS &
CU SN
Level-2-260C-1 YEAR
PACKAGE OPTION ADDENDUM
www.ti.com
16-Mar-2007
Orderable Device
Status (1)
Package
Type
TPS79625KTTRG3
ACTIVE
DDPAK/
TO-263
KTT
5
500
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
TPS79625KTTT
ACTIVE
DDPAK/
TO-263
KTT
5
50
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
TPS79625KTTTG3
ACTIVE
DDPAK/
TO-263
KTT
5
50
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
TPS79628DCQ
ACTIVE
SOT-223
DCQ
6
78
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS79628DCQG4
ACTIVE
SOT-223
DCQ
6
78
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS79628DCQR
ACTIVE
SOT-223
DCQ
6
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS79628DCQRG4
ACTIVE
SOT-223
DCQ
6
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS79628DRBR
ACTIVE
SON
DRB
8
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS79628DRBRG4
ACTIVE
SON
DRB
8
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS79628DRBT
ACTIVE
SON
DRB
8
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS79628DRBTG4
ACTIVE
SON
DRB
8
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS79628KTT
OBSOLETE
DDPAK/
TO-263
KTT
5
TBD
Call TI
Call TI
TPS79628KTTR
ACTIVE
DDPAK/
TO-263
KTT
5
500
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
TPS79628KTTRG3
ACTIVE
DDPAK/
TO-263
KTT
5
500
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
TPS79628KTTT
ACTIVE
DDPAK/
TO-263
KTT
5
50
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
TPS79628KTTTG3
ACTIVE
DDPAK/
TO-263
KTT
5
50
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
TPS79630DCQ
ACTIVE
SOT-223
DCQ
6
78
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS79630DCQG4
ACTIVE
SOT-223
DCQ
6
78
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS79630DCQR
ACTIVE
SOT-223
DCQ
6
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS79630DCQRG4
ACTIVE
SOT-223
DCQ
6
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS79630KTT
OBSOLETE
DDPAK/
TO-263
KTT
5
TPS79630KTTR
ACTIVE
DDPAK/
TO-263
KTT
5
TPS79630KTTRG3
ACTIVE
DDPAK/
TO-263
KTT
TPS79630KTTT
ACTIVE
DDPAK/
TO-263
TPS79630KTTTG3
ACTIVE
DDPAK/
TO-263
Package
Drawing
Pins Package Eco Plan (2)
Qty
TO-263
Lead/Ball Finish
MSL Peak Temp (3)
no Sb/Br)
TBD
Call TI
Call TI
500
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
5
500
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
KTT
5
50
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
KTT
5
50
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
16-Mar-2007
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TPS79633DCQ
ACTIVE
SOT-223
DCQ
6
78
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS79633DCQG4
ACTIVE
SOT-223
DCQ
6
78
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS79633DCQR
ACTIVE
SOT-223
DCQ
6
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS79633DCQRG4
ACTIVE
SOT-223
DCQ
6
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS79633KTT
OBSOLETE
DDPAK/
TO-263
KTT
5
TPS79633KTTR
ACTIVE
DDPAK/
TO-263
KTT
5
TPS79633KTTRG3
ACTIVE
DDPAK/
TO-263
KTT
TPS79633KTTT
ACTIVE
DDPAK/
TO-263
TPS79633KTTTG3
ACTIVE
TPS79650DCQ
Lead/Ball Finish
MSL Peak Temp (3)
TBD
Call TI
Call TI
500
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
5
500
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
KTT
5
50
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
DDPAK/
TO-263
KTT
5
50
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
ACTIVE
SOT-223
DCQ
6
78
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS79650DCQG4
ACTIVE
SOT-223
DCQ
6
78
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS79650DCQR
ACTIVE
SOT-223
DCQ
6
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS79650DCQRG4
ACTIVE
SOT-223
DCQ
6
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS79650DRBR
ACTIVE
SON
DRB
8
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS79650DRBRG4
ACTIVE
SON
DRB
8
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS79650DRBT
ACTIVE
SON
DRB
8
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS79650DRBTG4
ACTIVE
SON
DRB
8
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
16-Mar-2007
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
15-May-2007
TAPE AND REEL INFORMATION
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
Device
15-May-2007
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
TPS79601DCQR
DCQ
6
HNT
330
8
6.8
7.3
1.88
8
12
Q3
TPS79618DCQR
DCQ
6
HNT
330
8
6.8
7.3
1.88
8
12
Q3
TPS79625DCQR
DCQ
6
HNT
330
8
6.8
7.3
1.88
8
12
Q3
TPS79628DCQR
DCQ
6
HNT
330
8
6.8
7.3
1.88
8
12
Q3
TPS79628DRBR
DRB
8
MLA
330
12
3.3
3.3
1.1
8
12
Q2
TPS79628DRBT
DRB
8
MLA
180
12
3.3
3.3
1.1
8
12
Q2
TPS79630DCQR
DCQ
6
HNT
330
8
6.8
7.3
1.88
8
12
Q3
TPS79633DCQR
DCQ
6
HNT
330
8
6.8
7.3
1.88
8
12
Q3
TPS79650DCQR
DCQ
6
HNT
330
8
6.8
7.3
1.88
8
12
Q3
TPS79650DRBR
DRB
8
MLA
330
12
3.3
3.3
1.1
8
12
Q2
TPS79650DRBT
DRB
8
MLA
180
12
3.3
3.3
1.1
8
12
Q2
TAPE AND REEL BOX INFORMATION
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
TPS79601DCQR
DCQ
6
HNT
358.0
335.0
35.0
TPS79618DCQR
DCQ
6
HNT
358.0
335.0
35.0
TPS79625DCQR
DCQ
6
HNT
358.0
335.0
35.0
TPS79628DCQR
DCQ
6
HNT
358.0
335.0
35.0
TPS79628DRBR
DRB
8
MLA
346.0
346.0
29.0
TPS79628DRBT
DRB
8
MLA
190.0
212.7
31.75
TPS79630DCQR
DCQ
6
HNT
358.0
335.0
35.0
TPS79633DCQR
DCQ
6
HNT
358.0
335.0
35.0
TPS79650DCQR
DCQ
6
HNT
358.0
335.0
35.0
TPS79650DRBR
DRB
8
MLA
346.0
346.0
29.0
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
15-May-2007
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
TPS79650DRBT
DRB
8
MLA
190.0
212.7
31.75
Pack Materials-Page 3
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