TI TPS2042BDRG4

DGN−8
D−8
TPS2041B,, TPS2042B
TPS2043B, TPS2044B, TPS2051B
DBV−5 TPS2052B, TPS2053B, TPS2054B
D−16
www.ti.com
SLVS514G – APRIL 2004 – REVISED OCTOBER 2006
CURRENT-LIMITED, POWER-DISTRIBUTION SWITCHES
FEATURES
APPLICATIONS
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
70-mΩ High-Side MOSFET
500-mA Continuous Current
Thermal and Short-Circuit Protection
Accurate Current Limit
(0.75 A min, 1.25 A max)
Operating Range: 2.7 V to 5.5 V
0.6-ms Typical Rise Time
Undervoltage Lockout
Deglitched Fault Report (OC)
No OC Glitch During Power Up
Maximum Standby Supply Current:
1-µA (Single, Dual) or 2-µA (Triple, Quad)
Bidirectional Switch
Ambient Temperature Range: -40°C to 85°C
ESD Protection
UL Recognized, File Number E169910
Heavy Capacitive Loads
Short-Circuit Protections
TPS2041B/TPS2051B
D AND DGN PACKAGES
(TOP VIEW)
TPS2041B/TPS2051B
DBV PACKAGE
(TOP VIEW)
OUT
GND
IN
IN
IN
GND
OC
EN
†
EN†
1
8
2
7
3
6
4
5
TPS2042B/TPS2052B
D AND DGN PACKAGES
(TOP VIEW)
OUT
OUT
OUT
OC
GND
IN
TPS2043B/TPS2053B
D PACKAGE
(TOP VIEW)
GND
IN1
EN1†
1
16
2
15
3
14
EN2†
GND
IN2
EN3†
4
13
5
12
6
11
7
10
NC
8
9
EN1†
EN2†
1
8
2
7
3
6
4
5
OC1
OUT1
OUT2
OC2
TPS2044B/TPS2054B
D PACKAGE
(TOP VIEW)
OC1
OUT1
OUT2
OC2
OC3
OUT3
NC
NC
GND
IN1
EN1†
1
16
2
15
3
14
EN2†
GND
IN2
EN3†
4
13
5
12
EN4†
6
11
7
10
8
9
OC1
OUT1
OUT2
OC2
OC3
OUT3
OUT4
OC4
†
All enable inputs are active high for the TPS205xB series.
NC − No connect
DESCRIPTION
The TPS204xB/TPS205xB power-distribution switches are intended for applications where heavy capacitive
loads and short circuits are likely to be encountered. These devices incorporates 70-mΩ N-channel MOSFET
power switches for power-distribution systems that require multiple power switches in a single package. Each
switch is controlled by a logic enable input. Gate drive is provided by an internal charge pump designed to
control the power-switch rise times and fall times to minimize current surges during switching. The charge pump
requires no external components and allows operation from supplies as low as 2.7 V.
When the output load exceeds the current-limit threshold or a short is present, the device limits the output
current to a safe level by switching into a constant-current mode, pulling the overcurrent (OCx) logic output low.
When continuous heavy overloads and short-circuits increase the power dissipation in the switch, causing the
junction temperature to rise, a thermal protection circuit shuts off the switch to prevent damage. Recovery from a
thermal shutdown is automatic once the device has cooled sufficiently. Internal circuitry ensures that the switch
remains off until valid input voltage is present. This power-distribution switch is designed to set current limit at 1
A typically.
GENERAL SWITCH CATALOG
33 mΩ, single TPS201xA 0.2 A − 2 A
TPS202x
TPS203x
80 mΩ, single TPS2014
TPS2042B
TPS2052B
TPS2046
TPS2056
TPS2062
TPS2066
TPS2060
TPS2064
80 mΩ, dual
0.2 A − 2 A
0.2 A − 2 A
600
TPS2015
1A
TPS2041B 500
TPS2051B 500
TPS2045
250
TPS2055
250
TPS2061
1A
TPS2065
1A
260 mΩ
mA
mA
mA
mA
mA
IN1
OUT
IN2
1.3 Ω
500 mA
500 mA
250 mA
250 mA
1A
1A
1.5 A
1.5 A
TPS2100/1
IN1 500 mA
IN2 10 mA
TPS2102/3/4/5
IN1
500 mA
IN2
100 mA
80 mΩ, dual
TPS2080
TPS2081
TPS2082
TPS2090
TPS2091
TPS2092
500 mA
500 mA
500 mA
250 mA
250 mA
250 mA
80 mΩ, triple
TPS2043B
TPS2053B
TPS2047
TPS2057
500
500
250
250
mA
mA
mA
mA
80 mΩ, quad
TPS2044B
TPS2054B
TPS2048
TPS2058
500
500
250
250
mA
mA
mA
mA
80 mΩ, quad
TPS2085
TPS2086
TPS2087
TPS2095
TPS2096
TPS2097
500 mA
500 mA
500 mA
250 mA
250 mA
250 mA
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2004–2006, Texas Instruments Incorporated
TPS2041B,, TPS2042B
TPS2043B, TPS2044B, TPS2051B
TPS2052B, TPS2053B, TPS2054B
www.ti.com
SLVS514G – APRIL 2004 – REVISED OCTOBER 2006
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
AVAILABLE OPTION AND ORDERING INFORMATION
TA
ENABLE
-40°C to 85°C
(1)
(2)
RECOMMENDED
MAXIMUM
CONTINUOUS
LOAD CURRENT
TYPICAL
SHORTCIRCUIT
CURRENT LIMIT
AT 25°C
PACKAGED DEVICES (1) (2)
NUMBER OF
SWITCHES
MSOP (DGN)
SOIC (D)
SOT-23 (DBV)
Active low
Single
TPS2041BDGN
TPS2041BD
TPS2041BDBV
Active high
Single
TPS2051BDGN
TPS2051BD
TPS2051BDBV
Active low
Dual
TPS2042BDGN
TPS2042BD
Active high
Dual
TPS2052BDGN
TPS2052BD
Triple
--
TPS2043BD
Active high
Triple
--
TPS2053BD
Active low
Quad
--
TPS2044BD
Active high
Quad
--
TPS2054BD
0.5 A
Active low
1A
The package is available taped and reeled. Add an R suffix to device types (e.g., TPS2042BDR)
For the most current package and ordering nformation, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted (1)
UNIT
Input voltage range, VI(IN), VI(INx) (2)
-0.3 V to 6 V
Output voltage range, VO(OUT), VO(OUTx) (2)
-0.3 V to 6 V
Input voltage range, VI(EN), VI(ENx), VI(EN), VI(ENx)
-0.3 V to 6 V
Voltage range, VI(/OC), VI(OCx)
-0.3 V to 6 V
Continuous output current, IO(OUT), IO(OUTx)
Internally limited
Continuous total power dissipation
See Dissipation Rating Table
Operating virtual junction temperature range, TJ
-40°C to 125°C
Storage temperature range, Tstg
-65°C to 150°C
Lead temperature soldering 1,6 mm (1/16 inch) from case for 10 seconds
Electrostatic discharge (ESD) protection
(1)
(2)
260°C
Human body model MIL-STD-883C
2 kV
Charge device model (CDM)
500 V
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to GND.
DISSIPATING RATING TABLE
2
PACKAGE
TA ≤ 25°C
POWER RATING
DERATING FACTOR
ABOVE TA = 25°C
TA = 70°C
POWER RATING
TA = 85°C
POWER RATING
DGN-8
1712.3 mW
17.123 mW/°C
941.78 mW
684.93 mW
D-8
585.82 mW
5.8582 mW/°C
322.20 mW
234.32 mW
D-16
898.47 mW
8.9847 mW/°C
494.15 mW
359.38 mW
DBV-5
285 mW
2.85 mW/°C
155 mW
114 mW
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TPS2041B,, TPS2042B
TPS2043B, TPS2044B, TPS2051B
TPS2052B, TPS2053B, TPS2054B
www.ti.com
SLVS514G – APRIL 2004 – REVISED OCTOBER 2006
RECOMMENDED OPERATING CONDITIONS
Input voltage, VI(IN), VI(INx)
MIN
MAX
UNIT
2.7
5.5
Input voltage, VI(EN), VI(ENx), VI(EN), VI(ENx)
0
5.5
V
Continuous output current, IO(OUT), IO(OUTx)
0
500
mA
-40
125
°C
Operating virtual junction temperature, TJ
V
ELECTRICAL CHARACTERISTICS
over recommended operating junction temperature range, VI(IN) = 5.5 V, IO = 0.5 A, VI(/ENx) = 0 V (unless otherwise noted)
TEST CONDITIONS (1)
PARAMETER
MIN
TYP MAX
UNIT
POWER SWITCH
rDS(on)
tr (2)
Static drain-source on-state
VI(IN) = 5 V or 3.3 V, IO = 0.5 A,
resistance, 5-V operation
-40°C ≤ TJ ≤ 125°C
and 3.3-V operation
70
135
DBV package only
95
140
D and DGN packages
75
150
VI(IN) = 5.5 V
0.6
1.5
VI(IN) = 2.7 V
0.4
Static drain-source on-state
VI(IN) = 2.7 V, IO = 0.5 A,
resistance, 2.7-V
-40°C ≤ TJ ≤ 125°C
operation (2)
Rise time, output
tf (2)
D and DGN packages
Fall time, output
CL = 1 µF,
RL = 10 Ω
VI(IN) = 5.5 V
TJ = 25°C
VI(IN) = 2.7 V
1
0.05
0.5
0.05
0.5
mΩ
mΩ
ms
ENABLE INPUT EN AND ENx
VIH
High-level input voltage
2.7 V ≤ VI(IN) ≤ 5.5 V
VIL
Low-level input voltage
2.7 V ≤ VI(IN) ≤ 5.5 V
II
Input current
VI(ENx) = 0 V or 5.5 V
ton (2)
Turnon time
CL = 100 µF, RL = 10 Ω
3
toff (2)
Turnoff time
CL = 100 µF, RL = 10 Ω
10
2
0.8
-0.5
0.5
V
µA
ms
CURRENT LIMIT
IOS
Short-circuit output current
VI(IN) = 5 V, OUT connected to GND,
device enabled into short-circuit
TJ = 25°C
-40°C ≤ TJ ≤ 125°C
0.75
1
1.25
0.7
1
1.3
A
SUPPLY CURRENT (TPS2041B, TPS2051B)
Supply current, low-level output
No load on OUT, VI(ENx) = 5.5 V,
or VI(ENx) = 0 V
TJ = 25°C
0.5
1
-40°C ≤ TJ ≤ 125°C
0.5
5
Supply current, high-level output
No load on OUT, VI(ENx) = 0 V,
or VI(ENx) = 5.5 V
TJ = 25°C
43
60
-40°C ≤ TJ ≤ 125°C
43
70
Leakage current
OUT connected to ground, VI(ENx) = 5.5 V,
or VI(ENx) = 0 V
-40°C ≤ TJ ≤ 125°C
1
µA
Reverse leakage current
VI(OUTx) = 5.5 V, IN = ground (2)
TJ = 25°C
0
µA
TJ = 25°C
0.5
1
-40°C ≤ TJ ≤ 125°C
0.5
5
TJ = 25°C
50
70
-40°C ≤ TJ ≤ 125°C
50
90
µA
µA
SUPPLY CURRENT (TPS2042B, TPS2052B)
Supply current, low-level output
No load on OUT, VI(ENx) = 5.5 V
Supply current, high-level output
No load on OUT, VI(ENx) = 0 V
Leakage current
OUT connected to ground, VI(ENx) = 5.5 V
-40°C ≤ TJ ≤ 125°C
Reverse leakage current
VI(OUTx) = 5.5 V, IN = ground (2)
TJ = 25°C
(1)
(2)
µA
µA
1
µA
0.2
µA
Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account
separately.
Not tested in production, specified by design.
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3
TPS2041B,, TPS2042B
TPS2043B, TPS2044B, TPS2051B
TPS2052B, TPS2053B, TPS2054B
www.ti.com
SLVS514G – APRIL 2004 – REVISED OCTOBER 2006
ELECTRICAL CHARACTERISTICS (continued)
over recommended operating junction temperature range, VI(IN) = 5.5 V, IO = 0.5 A, VI(/ENx) = 0 V (unless otherwise noted)
TEST CONDITIONS (1)
PARAMETER
MIN
TYP MAX
UNIT
SUPPLY CURRENT (TPS2043B, TPS2053B)
Supply current, low-level output
No load on OUT, VI(ENx) = 0 V
Supply current, high-level output
No load on OUT, VI(ENx) = 5.5 V
Leakage current
OUT connected to ground, VI(ENx) = 0 V
TJ = 25°C
0.5
2
-40°C ≤ TJ ≤ 125°C
0.5
10
TJ = 25°C
65
90
-40°C ≤ TJ ≤ 125°C
65
110
-40°C≤ TJ ≤ 125°C
1
µA
µA
µA
µA
ground (3)
TJ = 25°C
0.2
Supply current, low-level output
No load on OUT, VI(ENx) = 5.5 V,
or VI(ENx) = 0 V
TJ = 25°C
0.5
2
-40°C ≤ TJ ≤ 125°C
0.5
10
Supply current, high-level output
No load on OUT, VI(ENx) = 0 V,
or VI(ENx) = 5.5 V
TJ = 25°C
75
110
-40°C ≤ TJ ≤ 125°C
75
140
Leakage current
OUT connected to ground, VI(ENx) = 5.5 V,
or VI(ENx) = 0 V
-40°C≤ TJ ≤ 125°C
1
µA
Reverse leakage current
VI(OUTx) = 5.5 V, INx = ground (3)
TJ = 25°C
0.2
µA
Reverse leakage current
VI(OUTx) = 5.5 V, INx =
SUPPLY CURRENT (TPS2044B, TPS2054B)
µA
µA
UNDERVOLTAGE LOCKOUT
Low-level input voltage, IN, INx
Hysteresis, IN, INx
2
TJ = 25°C
2.5
75
V
mV
OVERCURRENT OC and OCx
Output low voltage, VOL(/OCx)
Off-state
current (3)
OC deglitch (3)
IO(OCx) = 5 mA
0.4
VO(OCx) = 5 V or 3.3 V
OCx assertion or deassertion
4
8
V
1
µA
15
ms
THERMAL SHUTDOWN (4)
Thermal shutdown threshold (3)
135
Recovery from thermal shutdown (3)
125
Hysteresis (3)
(3)
(4)
4
°C
°C
10
Not tested in production, specified by design.
The thermal shutdown only reacts under overcurrent conditions.
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°C
TPS2041B,, TPS2042B
TPS2043B, TPS2044B, TPS2051B
TPS2052B, TPS2053B, TPS2054B
www.ti.com
SLVS514G – APRIL 2004 – REVISED OCTOBER 2006
DEVICE INFORMATION
Terminal Functions (TPS2041B and TPS2051B)
TERMINAL
D AND DGN PACKAGE
NAME
DBV PACKAGE
I/O
DESCRIPTION
TPS2041B
TPS2051B
TPS2041B
TPS2051B
EN
4
–
4
–
I
Enable input, logic low turns on power switch
EN
–
4
–
4
I
Enable input, logic high turns on power switch
GND
1
1
2
2
IN
2, 3
2, 3
5
5
I
Input voltage
OC
5
5
3
3
O
Overcurrent open-drain output, active-low
6, 7, 8
6, 7, 8
1
1
O
Power-switch output
OUT
Ground
Functional Block Diagram (TPS2041B and TPS2051B)
(See Note A)
CS
IN
OUT
Charge
Pump
EN
(See Note B)
Driver
Current
Limit
OC
UVLO
GND
Thermal
Sense
Deglitch
Note A: Current sense
Note B: Active low (EN) for TPS2041B; Active high (EN) for TPS2051B
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5
TPS2041B,, TPS2042B
TPS2043B, TPS2044B, TPS2051B
TPS2052B, TPS2053B, TPS2054B
www.ti.com
SLVS514G – APRIL 2004 – REVISED OCTOBER 2006
Terminal Functions (TPS2042B and TPS2052B)
TERMINAL
NAME
I/O
DESCRIPTION
TPS2042B
TPS2052B
EN1
3
-
I
Enable input, logic low turns on power switch IN-OUT1
EN2
4
-
I
Enable input, logic low turns on power switch IN-OUT2
EN1
-
3
I
Enable input, logic high turns on power switch IN-OUT1
EN2
-
4
I
Enable input, logic high turns on power switch IN-OUT2
GND
1
1
IN
2
2
I
Input voltage
OC1
8
8
O
Overcurrent, open-drain output, active low, IN-OUT1
OC2
5
5
O
Overcurrent, open-drain output, active low, IN-OUT2
OUT1
7
7
O
Power-switch output, IN-OUT1
OUT2
6
6
O
Power-switch output, IN-OUT2
Ground
Functional Block Diagram (TPS2042B and TPS2052B)
OC1
Thermal
Sense
GND
Deglitch
EN1
(See Note B)
Driver
Current
Limit
Charge
Pump
(See Note A)
CS
OUT1
UVLO
(See Note A)
IN
CS
OUT2
Charge
Pump
Driver
Current
Limit
OC2
EN2
(See Note B)
Thermal
Sense
Note A: Current sense
Note B: Active low (ENx) for TPS2042B; Active high (ENx) for TPS2052B
6
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Deglitch
TPS2041B,, TPS2042B
TPS2043B, TPS2044B, TPS2051B
TPS2052B, TPS2053B, TPS2054B
www.ti.com
SLVS514G – APRIL 2004 – REVISED OCTOBER 2006
Terminal Functions (TPS2043B and TPS2053B)
TERMINAL
NAME
I/O
DESCRIPTION
TPS2043B
TPS2053B
EN1
3
--
I
Enable input, logic low turns on power switch IN1-OUT1
EN2
4
--
I
Enable input, logic low turns on power switch IN1-OUT2
EN3
7
--
I
Enable input, logic low turns on power switch IN2-OUT3
EN1
--
3
I
Enable input, logic high turns on power switch IN1-OUT1
EN2
--
4
I
Enable input, logic high turns on power switch IN1-OUT2
EN3
--
7
I
Enable input, logic high turns on power switch IN2-OUT3
GND
1, 5
1, 5
IN1
2
2
I
Ground
Input voltage for OUT1 and OUT2
IN2
6
6
I
Input voltage for OUT3
NC
8, 9, 10
8, 9, 10
OC1
16
16
O
No connection
Overcurrent, open-drain output, active low, IN1-OUT1
OC2
13
13
O
Overcurrent, open-drain output, active low, IN1-OUT2
OC3
12
12
O
Overcurrent, open-drain output, active low, IN2-OUT3
OUT1
15
15
O
Power-switch output, IN1-OUT1
OUT2
14
14
O
Power-switch output, IN1-OUT2
OUT3
11
11
O
Power-switch output, IN2-OUT3
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7
TPS2041B,, TPS2042B
TPS2043B, TPS2044B, TPS2051B
TPS2052B, TPS2053B, TPS2054B
www.ti.com
SLVS514G – APRIL 2004 – REVISED OCTOBER 2006
Functional Block Diagram (TPS2043B and TPS2053B)
OC1
Thermal
Sense
GND
Deglitch
EN1
(See Note B)
Driver
Current
Limit
(See Note A)
CS
OUT1
UVLO
(See Note A)
IN1
OUT2
CS
Driver
Current
Limit
OC2
EN2
(See Note B)
VCC
Selector
Thermal
Sense
Deglitch
Charge
Pump
(See Note A)
IN2
CS
EN3
Driver
OUT3
Current
Limit
(See Note B)
OC3
UVLO
GND
Thermal
Sense
Note A: Current sense
Note B: Active low (ENx) for TPS2043B; Active high (ENx) for TPS2053B
8
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Deglitch
TPS2041B,, TPS2042B
TPS2043B, TPS2044B, TPS2051B
TPS2052B, TPS2053B, TPS2054B
www.ti.com
SLVS514G – APRIL 2004 – REVISED OCTOBER 2006
Terminal Functions (TPS2044B and TPS2054B)
TERMINAL
NAME
I/O
DESCRIPTION
TPS2044B
TPS2054B
EN1
3
-
I
Enable input, logic low turns on power switch IN1-OUT1
EN2
4
-
I
Enable input, logic low turns on power switch IN1-OUT2
EN3
7
-
I
Enable input, logic low turns on power switch IN2-OUT3
EN4
8
-
I
Enable input, logic low turns on power switch IN2-OUT4
EN1
-
3
I
Enable input, logic high turns on power switch IN1-OUT1
EN2
-
4
I
Enable input, logic high turns on power switch IN1-OUT2
EN3
-
7
I
Enable input, logic high turns on power switch IN2-OUT3
EN4
-
8
I
Enable input, logic high turns on power switch IN2-OUT4
GND
1, 5
1, 5
IN1
2
2
I
Input voltage for OUT1 and OUT2
IN2
6
6
I
Input voltage for OUT3 and OUT4
OC1
16
16
O
Overcurrent, open-drain output, active low, IN1-OUT1
OC2
13
13
O
Overcurrent, open-drain output, active low, IN1-OUT2
OC3
12
12
O
Overcurrent, open-drain output, active low, IN2-OUT3
OC4
9
9
O
Overcurrent, open-drain output, active low, IN2-OUT4
OUT1
15
15
O
Power-switch output, IN1-OUT1
OUT2
14
14
O
Power-switch output, IN1-OUT2
OUT3
11
11
O
Power-switch output, IN2-OUT3
OUT4
10
10
O
Power-switch output, IN2-OUT4
Ground
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9
TPS2041B,, TPS2042B
TPS2043B, TPS2044B, TPS2051B
TPS2052B, TPS2053B, TPS2054B
www.ti.com
SLVS514G – APRIL 2004 – REVISED OCTOBER 2006
Functional Block Diagram (TPS2044B and TPS2054B)
OC1
Thermal
Sense
GND
Deglitch
EN1
(See Note B)
Driver
Current
Limit
(See Note A)
CS
OUT1
UVLO
Power Switch
(See Note A)
IN1
CS
Driver
OUT2
Current
Limit
OC2
EN2
(See Note B)
Thermal
Sense
VCC
Selector
Deglitch
Charge
Pump
OC3
Thermal
Sense
Deglitch
EN3
(See Note B)
Driver
Current
Limit
(See Note A)
CS
OUT3
UVLO
Power Switch
(See Note A)
IN2
CS
Driver
OUT4
Current
Limit
OC4
EN4
(See Note B)
GND
Thermal
Sense
Note A: Current sense
Note B: Active low (ENx) for TPS2044B; Active high (ENx) for TPS2054B
10
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TPS2041B,, TPS2042B
TPS2043B, TPS2044B, TPS2051B
TPS2052B, TPS2053B, TPS2054B
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SLVS514G – APRIL 2004 – REVISED OCTOBER 2006
PARAMETER MEASUREMENT INFORMATION
OUT
RL
tf
tr
CL
VO(OUT)
90%
10%
90%
10%
TEST CIRCUIT
50%
VI(EN)
50%
toff
ton
VO(OUT)
50%
VI(EN)
90%
50%
toff
ton
90%
VO(OUT)
10%
10%
VOLTAGE WAVEFORMS
Figure 1. Test Circuit and Voltage Waveforms
VI(EN)
VI(EN)
5 V/div
RL = 10 W,
CL = 1 mF
TA = 255C
VI(EN)
VI(EN)
5 V/div
RL = 10 W,
CL = 1 mF
TA = 255C
VO(OUT)
2 V/div
VO(OUT)
2 V/div
t − Time − 500 ms/div
t − Time − 500 ms/div
Figure 2. Turnon Delay and Rise Time With 1-µF Load
Figure 3. Turnoff Delay and Fall Time With 1-µF Load
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SLVS514G – APRIL 2004 – REVISED OCTOBER 2006
PARAMETER MEASUREMENT INFORMATION (continued)
VI(EN)
VI(EN)
5 V/div
RL = 10 W,
CL = 100 mF
TA = 255C
VI(EN)
VI(EN)
5 V/div
RL = 10 W,
CL = 100 mF
TA = 255C
VO(OUT)
2 V/div
VO(OUT)
2 V/div
t − Time − 500 ms/div
t − Time − 500 ms/div
Figure 4. Turnon Delay and Rise Time With 100-µF Load
Figure 5. Turnoff Delay and Fall Time With 100-µF Load
VI = 5 V,
RL = 10 W,
TA = 255C
VI(EN)
VI(EN)
5 V/div
VI(EN)
VI(EN)
5 V/div
220 mF
470 mF
IO(OUT)
500 mA/div
IO(OUT)
500 mA/div
100 mF
t − Time − 500 ms/div
t − Time − 500 ms/div
Figure 6. Short-Circuit Current,
Device Enabled Into Short
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Figure 7. Inrush Current With Different
Load Capacitance
TPS2041B,, TPS2042B
TPS2043B, TPS2044B, TPS2051B
TPS2052B, TPS2053B, TPS2054B
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SLVS514G – APRIL 2004 – REVISED OCTOBER 2006
PARAMETER MEASUREMENT INFORMATION (continued)
VO(OC)
2 V/div
VO(OC)
2 V/div
IO(OUT)
500 mA/div
IO(OUT)
500 mA/div
t − Time − 2 ms/div
t − Time − 2 ms/div
Figure 8. 3-Ω Load Connected to Enabled Device
Figure 9. 2-Ω Load Connected to Enabled Device
TYPICAL CHARACTERISTICS
TURNON TIME
vs
INPUT VOLTAGE
TURNOFF TIME
vs
INPUT VOLTAGE
1.0
3.3
CL = 100 mF,
RL = 10 W,
TA = 255C
0.9
0.8
CL = 100 mF,
RL = 10 W,
TA = 255C
3.2
Turnoff Time − ms
Turnon Time − ms
0.7
0.6
0.5
0.4
3.1
3
0.3
0.2
2.9
0.1
0
2
3
4
5
VI − Input Voltage − V
6
2.8
2
Figure 10.
3
4
5
6
VI − Input Voltage − V
Figure 11.
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SLVS514G – APRIL 2004 – REVISED OCTOBER 2006
TYPICAL CHARACTERISTICS (continued)
RISE TIME
vs
INPUT VOLTAGE
FALL TIME
vs
INPUT VOLTAGE
0.25
0.6
0.5
0.2
0.4
Fall Time − ms
Rise Time − ms
CL = 1 mF,
RL = 10 W,
TA = 255C
CL = 1 mF,
RL = 10 W,
TA = 255C
0.3
0.15
0.1
0.2
0.05
0.1
0
2
3
4
5
VI − Input Voltage − V
0
6
2
Figure 13.
TPS2041B/2051B
SUPPLY CURRENT, OUTPUT ENABLED
vs
JUNCTION TEMPERATURE
TPS2042B/TPS2052B
SUPPLY CURRENT, OUTPUT ENABLED
vs
JUNCTION TEMPERATURE
I I (IN) − Supply Current, Output Enabled − µ A
I I (IN) − Supply Current, Output Enabled − µ A
6
70
VI = 5.5 V
50
VI = 5 V
40
30
VI = 2.7 V
20
VI = 3.3 V
10
0
50
100
150
VI = 5.5 V
60
50
VI = 5 V
VI = 3.3 V
40
30
VI = 2.7 V
20
10
0
−50
TJ − Junction Temperature − 5C
Figure 14.
14
4
5
VI − Input Voltage − V
Figure 12.
60
0
−50
3
0
50
Figure 15.
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100
TJ − Junction Temperature − 5C
150
TPS2041B,, TPS2042B
TPS2043B, TPS2044B, TPS2051B
TPS2052B, TPS2053B, TPS2054B
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SLVS514G – APRIL 2004 – REVISED OCTOBER 2006
TYPICAL CHARACTERISTICS (continued)
TPS2043B/TPS2053B
SUPPLY CURRENT, OUTPUT ENABLED
vs
JUNCTION TEMPERATURE
TPS2044B/2054B
SUPPLY CURRENT, OUTPUT ENABLED
vs
JUNCTION TEMPERATURE
120
80
I I (IN) − Supply Current, Output Enabled − µ A
I I (IN) − Supply Current, Output Enabled − µ A
90
VI = 5.5 V
70
VI = 5 V
60
VI = 3.3 V
50
40
VI = 2.7 V
30
20
10
0
−50
150
80
60
VI = 2.7 V
40
VI = 3.3 V
20
−50
0
50
100
Figure 16.
Figure 17.
TPS2041B/2051B
SUPPLY CURRENT, OUTPUT DISABLED
vs
JUNCTION TEMPERATURE
TPS2042B/TPS2052B
SUPPLY CURRENT, OUTPUT DISABLED
vs
JUNCTION TEMPERATURE
VI = 5.5 V
0.45
VI = 5 V
0.4
0.35
0.3
VI = 2.7 V
VI = 3.3 V
0.25
0.2
0.15
0.1
0.05
0
50
100
150
TJ − Junction Temperature − 5C
I I (IN) − Supply Current, Output Disabled − µ A
I I (IN) − Supply Current, Output Disabled − µ A
VI = 5 V
0
0
50
100
TJ − Junction Temperature − 5C
0.5
0
−50
VI = 5.5 V
100
150
0.5
VI = 5.5 V
0.45
VI = 5 V
0.4
0.35
0.3
VI = 2.7 V
VI = 3.3 V
0.25
0.2
0.15
0.1
0.05
0
−50
TJ − Junction Temperature − 5C
Figure 18.
0
50
100
TJ − Junction Temperature − 5C
150
Figure 19.
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SLVS514G – APRIL 2004 – REVISED OCTOBER 2006
TYPICAL CHARACTERISTICS (continued)
TPS2043B/TPS2053B
SUPPLY CURRENT, OUTPUT DISABLED
vs
JUNCTION TEMPERATURE
TPS2044B/2054B
SUPPLY CURRENT, OUTPUT DISABLED
vs
JUNCTION TEMPERATURE
0.45
VI = 5 V
0.4
0.35
VI = 3.3 V
0.3
VI = 2.7 V
0.25
0.2
0.15
0.1
0.05
0
−50
r DS(on) − Static Drain-Source On-State Resistance − m Ω
I I (IN) − Supply Current, Output Disabled − µ A
0.5
VI = 5.5 V
0
50
100
TJ − Junction Temperature − 5C
0.45
VI = 5 V
0.35
0.3
VI = 2.7 V
VI = 3.3 V
0.25
0.2
0.15
0.1
0.05
0
50
100
TJ − Junction Temperature − 5C
Figure 20.
Figure 21.
STATIC DRAIN-SOURCE ON-STATE RESISTANCE
vs
JUNCTION TEMPERATURE
SHORT-CIRCUIT OUTPUT CURRENT
vs
JUNCTION TEMPERATURE
150
1.08
120
IO = 0.5 A
VI = 2.7 V
100
80
VI = 3.3 V
60
VI = 5 V
40
20
0
−50
0
50
100
150
1.06
1.04
VI = 2.7 V
VI = 3.3 V
1.02
1.0
0.98
VI = 5 V
0.96
VI = 5.5 V
0.94
0.92
0.9
−50
TJ − Junction Temperature − 5C
Figure 22.
16
VI = 5.5 V
0.4
0
−50
150
I OS − Short-Circuit Output Current − A
I I (IN) − Supply Current, Output Disabled − µ A
0.5
0
50
100
TJ − Junction Temperature − 5C
Figure 23.
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TPS2041B,, TPS2042B
TPS2043B, TPS2044B, TPS2051B
TPS2052B, TPS2053B, TPS2054B
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SLVS514G – APRIL 2004 – REVISED OCTOBER 2006
TYPICAL CHARACTERISTICS (continued)
THRESHOLD TRIP CURRENT
vs
INPUT VOLTAGE
THRESHOLD TRIP CURRENT
vs
INPUT VOLTAGE
2
2
TPS2041B,
TPS2042B,
TPS2051B,
TPS2052B
Threshold Trip Current − A
1.8
TA = 255C
Load Ramp = 1A/10 ms
Threshold Trip Current − A
TA = 255C
Load Ramp = 1A/10 ms
1.6
1.4
1.2
1
2.5
1.8
1.6
1.4
1.2
3
3.5
4
4.5
5
5.5
TPS2043B,
TPS2044B,
TPS2053B,
TPS2054B
1
2.5
6
3
3.5
4
4.5
5
VI − Input Voltage − V
VI − Input Voltage − V
Figure 24.
Figure 25.
UNDERVOLTAGE LOCKOUT
vs
JUNCTION TEMPERATURE
CURRENT-LIMIT RESPONSE
vs
PEAK CURRENT
VI = 5 V,
TA = 255C
UVLO Rising
2.26
Current-Limit Response − µ s
UVLO − Undervoltage Lockout − V
6
100
2.3
2.22
UVLO Falling
2.18
80
60
40
20
2.14
2.1
−50
5.5
0
0
50
100
TJ − Junction Temperature − 5C
150
0
Figure 26.
2.5
5
7.5
Peak Current − A
10
12.5
Figure 27.
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SLVS514G – APRIL 2004 – REVISED OCTOBER 2006
APPLICATION INFORMATION
POWER-SUPPLY CONSIDERATIONS
TPS2042B
2
Power Supply
2.7 V to 5.5 V
IN
OUT1
0.1 µF
8
3
5
4
7
Load
0.1 µF
22 µF
0.1 µF
22 µF
OC1
EN1
OUT2
6
OC2
Load
EN2
GND
1
Figure 28. Typical Application (Example, TPS2042B)
A 0.01-µF to 0.1-µF ceramic bypass capacitor between IN and GND, close to the device, is recommended.
Placing a high-value electrolytic capacitor on the output pin(s) is recommended when the output load is heavy.
This precaution reduces power-supply transients that may cause ringing on the input. Additionally, bypassing the
output with a 0.01-µF to 0.1-µF ceramic capacitor improves the immunity of the device to short-circuit transients.
OVERCURRENT
A sense FET is employed to check for overcurrent conditions. Unlike current-sense resistors, sense FETs do not
increase the series resistance of the current path. When an overcurrent condition is detected, the device
maintains a constant output current and reduces the output voltage accordingly. Complete shutdown occurs only
if the fault is present long enough to activate thermal limiting.
Three possible overload conditions can occur. In the first condition, the output has been shorted before the
device is enabled or before VI(IN) has been applied (see Figure 14 through Figure 17). The
TPS204xB/TPS205xB senses the short and immediately switches into a constant-current output.
In the second condition, a short or an overload occurs while the device is enabled. At the instant the overload
occurs, high currents may flow for a short period of time before the current-limit circuit can react. After the
current-limit circuit has tripped (reached the overcurrent trip threshold), the device switches into constant-current
mode.
In the third condition, the load has been gradually increased beyond the recommended operating current. The
current is permitted to rise until the current-limit threshold is reached or until the thermal limit of the device is
exceeded (see Figure 18 through Figure 21). The TPS204xB/TPS205xB is capable of delivering current up to
the current-limit threshold without damaging the device. Once the threshold has been reached, the device
switches into its constant-current mode.
OC RESPONSE
The OCx open-drain output is asserted (active low) when an overcurrent or overtemperature shutdown condition
is encountered after a 10-ms deglitch timeout. The output remains asserted until the overcurrent or
overtemperature condition is removed. Connecting a heavy capacitive load to an enabled device can cause a
momentary overcurrent condition; however, no false reporting on OCx occurs due to the 10-ms deglitch circuit.
The TPS204xB/TPS205xB is designed to eliminate false overcurrent reporting. The internal overcurrent deglitch
eliminates the need for external components to remove unwanted pulses. OCx is not deglitched when the switch
is turned off due to an overtemperature shutdown.
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SLVS514G – APRIL 2004 – REVISED OCTOBER 2006
APPLICATION INFORMATION (continued)
V+
TPS2042B
GND
Rpullup
OC1
IN
OUT1
EN1
OUT2
EN2
OC2
Figure 29. Typical Circuit for the OC Pin (Example, TPS2042B)
POWER DISSIPATION AND JUNCTION TEMPERATURE
The low on-resistance on the N-channel MOSFET allows the small surface-mount packages to pass large
currents. The thermal resistances of these packages are high compared to those of power packages; it is good
design practice to check power dissipation and junction temperature. Begin by determining the rDS(on) of the
N-channel MOSFET relative to the input voltage and operating temperature. As an initial estimate, use the
highest operating ambient temperature of interest and read rDS(on) from Figure 22. Using this value, the power
dissipation per switch can be calculated by:
PD = rDS(on)× I2
Multiply this number by the number of switches being used. This step renders the total power dissipation from
the N-channel MOSFETs.
Finally, calculate the junction temperature:
TJ = PD x RΘJA + TA
Where:
TA= Ambient temperature °C
RΘJA = Thermal resistance
PD = Total power dissipation based on number of switches being used.
Compare the calculated junction temperature with the initial estimate. If they do not agree within a few degrees,
repeat the calculation, using the calculated value as the new estimate. Two or three iterations are generally
sufficient to get a reasonable answer.
THERMAL PROTECTION
Thermal protection prevents damage to the IC when heavy-overload or short-circuit faults are present for
extended periods of time. The TPS204xB/TPS205xB implements a thermal sensing to monitor the operating
junction temperature of the power distribution switch. In an overcurrent or short-circuit condition, the junction
temperature rises due to excessive power dissipation. Once the die temperature rises to approximately 140°C
due to overcurrent conditions, the internal thermal sense circuitry turns the power switch off, thus preventing the
power switch from damage. Hysteresis is built into the thermal sense circuit, and after the device has cooled
approximately 10°C, the switch turns back on. The switch continues to cycle in this manner until the load fault or
input power is removed. The OCx open-drain output is asserted (active low) when an overtemperature shutdown
or overcurrent occurs.
UNDERVOLTAGE LOCKOUT (UVLO)
An undervoltage lockout ensures that the power switch is in the off state at power up. Whenever the input
voltage falls below approximately 2 V, the power switch is quickly turned off. This facilitates the design of
hot-insertion systems where it is not possible to turn off the power switch before input power is removed. The
UVLO also keeps the switch from being turned on until the power supply has reached at least 2 V, even if the
switch is enabled. On reinsertion, the power switch is turned on, with a controlled rise time to reduce EMI and
voltage overshoots.
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SLVS514G – APRIL 2004 – REVISED OCTOBER 2006
APPLICATION INFORMATION (continued)
UNIVERSAL SERIAL BUS (USB) APPLICATIONS
The universal serial bus (USB) interface is a 12-Mb/s, or 1.5-Mb/s, multiplexed serial bus designed for
low-to-medium bandwidth PC peripherals (e.g., keyboards, printers, scanners, and mice). The four-wire USB
interface is conceived for dynamic attach-detach (hot plug-unplug) of peripherals. Two lines are provided for
differential data, and two lines are provided for 5-V power distribution.
USB data is a 3.3-V level signal, but power is distributed at 5 V to allow for voltage drops in cases where power
is distributed through more than one hub across long cables. Each function must provide its own regulated 3.3 V
from the 5-V input or its own internal power supply.
The USB specification defines the following five classes of devices, each differentiated by power-consumption
requirements:
• Hosts/self-powered hubs (SPH)
• Bus-powered hubs (BPH)
• Low-power, bus-powered functions
• High-power, bus-powered functions
• Self-powered functions
Self-powered and bus-powered hubs distribute data and power to downstream functions.
TPS204xB/TPS205xB can provide-power distribution solutions to many of these classes of devices.
The
HOST/SELF-POWERED AND BUS-POWERED HUBS
Hosts and self-powered hubs have a local power supply that powers the embedded functions and the
downstream ports (see Figure 30 and Figure 31). This power supply must provide from 5.25 V to 4.75 V to the
board side of the downstream connection under full-load and no-load conditions. Hosts and SPHs are required
to have current-limit protection and must report overcurrent conditions to the USB controller. Typical SPHs are
desktop PCs, monitors, printers, and stand-alone hubs.
Power Supply
3.3 V
Downstream
USB Ports
5V
TPS2041B
2, 3
IN
D+
D−
6, 7, 8
0.1 µF
VBUS
OUT
0.1 µF
5
USB
Control
4
120 µF
OC
EN
GND
1
Figure 30. Typical One-Port USB Host / Self-Powered Hub
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GND
TPS2041B,, TPS2042B
TPS2043B, TPS2044B, TPS2051B
TPS2052B, TPS2053B, TPS2054B
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SLVS514G – APRIL 2004 – REVISED OCTOBER 2006
APPLICATION INFORMATION (continued)
Downstream
USB Ports
D+
Power Supply
D−
3.3 V
5V
+
TPS2044B
2
6
IN1
OUT1
IN2
VBUS
33 µF
15
D+
0.1 µF
D−
14
OUT2
16
3
13
USB
Controller
4
12
7
9
8
OC1
OUT3
GND
+
VBUS
33 µF
GND
11
EN1
D+
OC2
D−
EN2
+
10
OC3
VBUS
33 µF
GND
OUT4
EN3
OC4
D+
EN4
D−
GND GND
1
5
+
VBUS
33 µF
GND
Figure 31. Typical Four-Port USB Host / Self-Powered Hub
Bus-powered hubs obtain all power from upstream ports and often contain an embedded function. The hubs are
required to power up with less than one unit load. The BPH usually has one embedded function, and power is
always available to the controller of the hub. If the embedded function and hub require more than 100 mA on
power up, the power to the embedded function may need to be kept off until enumeration is completed. This can
be accomplished by removing power or by shutting off the clock to the embedded function. Power switching the
embedded function is not necessary if the aggregate power draw for the function and controller is less than one
unit load. The total current drawn by the bus-powered device is the sum of the current to the controller, the
embedded function, and the downstream ports, and it is limited to 500 mA from an upstream port.
LOW-POWER BUS-POWERED AND HIGH-POWER BUS-POWERED FUNCTIONS
Both low-power and high-power bus-powered functions obtain all power from upstream ports; low-power
functions always draw less than 100 mA; high-power functions must draw less than 100 mA at power up and
can draw up to 500 mA after enumeration. If the load of the function is more than the parallel combination of 44
Ω and 10 µF at power up, the device must implement inrush current limiting (see Figure 32).
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TPS2052B, TPS2053B, TPS2054B
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SLVS514G – APRIL 2004 – REVISED OCTOBER 2006
APPLICATION INFORMATION (continued)
Power Supply
3.3 V
D+
D−
VBUS
TPS2042B
2
10 µF
0.1 µF
IN
OUT1
GND
8
USB
Control
3
5
4
7
0.1 µF
10 µF
Internal
Function
0.1 µF
10 µF
Internal
Function
OC1
EN1
OC2
EN2
OUT2
GND
1
6
Figure 32. High-Power Bus-Powered Function (Example, TPS2042B)
USB POWER-DISTRIBUTION REQUIREMENTS
USB can be implemented in several ways, and, regardless of the type of USB device being developed, several
power-distribution features must be implemented.
• Hosts/self-powered hubs must:
– Current-limit downstream ports
– Report overcurrent conditions on USB VBUS
• Bus-powered hubs must:
– Enable/disable power to downstream ports
– Power up at <100 mA
– Limit inrush current (<44 Ω and 10 µF)
• Functions must:
– Limit inrush currents
– Power up at <100 mA
The feature set of the TPS204xB/TPS205xB allows them to meet each of these requirements. The integrated
current-limiting and overcurrent reporting is required by hosts and self-powered hubs. The logic-level enable and
controlled rise times meet the need of both input and output ports on bus-powered hubs, as well as the input
ports for bus-powered functions (see Figure 33 through Figure 36).
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TPS2043B, TPS2044B, TPS2051B
TPS2052B, TPS2053B, TPS2054B
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SLVS514G – APRIL 2004 – REVISED OCTOBER 2006
APPLICATION INFORMATION (continued)
TUSB2041B
Hub Controller
Upstream
Port
SN75240
BUSPWR
A C
B D
GANGED
D+
D−
DP0
DP1
DM0
DM1
Tie to TPS2041B EN Input
D+
A C
B D
GND
OC
5V
IN
33 µF†
DM3
A C
B D
TPS76333
4.7 µF
5V
DP3
OUT
0.1 µF
SN75240
D+
D−
Ferrite Beads
GND
DP4
IN
3.3 V
4.7 µF
D−
GND
DM2
5-V Power
Supply
EN
1 µF
Ferrite Beads
SN75240
DP2
TPS2041B
Downstream
Ports
DM4
VCC
5V
TPS2041B
GND
GND
PWRON1
EN
OVRCUR1
OC
IN
33 µF†
0.1 µF
OUT
D+
TPS2041B
48-MHz
Crystal
XTAL1
Tuning
Circuit
XTAL2
PWRON2
EN
OVRCUR2
OC
D−
IN
Ferrite Beads
0.1 µF
GND
OUT
OCSOFF
5V
TPS2041B
PWRON3
EN
OVRCUR3
OC
IN
33 µF†
0.1 µF
OUT
D+
GND
TPS2041B
PWRON4
EN
OVRCUR4
OC
Ferrite Beads
IN
0.1 µF
OUT
D−
GND
5V
33 µF†
†
USB rev 1.1 requires 120 µF per hub.
Figure 33. Hybrid Self / Bus-Powered Hub Implementation, TPS2041B/TPS2051B
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23
TPS2041B,, TPS2042B
TPS2043B, TPS2044B, TPS2051B
TPS2052B, TPS2053B, TPS2054B
www.ti.com
SLVS514G – APRIL 2004 – REVISED OCTOBER 2006
APPLICATION INFORMATION (continued)
TUSB2040
Hub Controller
Upstream
Port
SN75240
BUSPWR
A C
B D
GANGED
D+
D−
DP0
DP1
DM0
DM1
Tie to TPS2041B EN Input
D+
A C
B D
GND
OC
5V
IN
5V
33 µF†
DP3
OUT
DM3
A C
B D
1 µF
TPS76333
4.7 µF
SN75240
D+
D−
Ferrite Beads
GND
DP4
IN
3.3 V
4.7 µF
DM4
VCC
5V
TPS2042B
GND
GND
48-MHz
Crystal
XTAL1
PWRON1
EN1 OUT1
OVRCUR1
OC1 OUT2
PWRON2
EN2
OVRCUR2
OC2
33 µF†
D+
IN
0.1 µF
Tuning
Circuit
D−
GND
DM2
5-V Power
Supply
EN
0.1 µF
Ferrite Beads
SN75240
DP2
TPS2041B
Downstream
Ports
XTAL2
OCSOFF
GND
D−
Ferrite Beads
GND
TPS2042B
PWRON3
EN1 OUT1
OVRCUR3
OC1 OUT2
PWRON4
EN2
OVRCUR4
OC2
5V
33 µF†
IN
D+
0.1 µF
Ferrite Beads
D−
GND
5V
†
33 µF†
USB rev 1.1 requires 120 µF per hub.
Figure 34. Hybrid Self / Bus-Powered Hub Implementation, TPS2042B/TPS2052B
24
Submit Documentation Feedback
TPS2041B,, TPS2042B
TPS2043B, TPS2044B, TPS2051B
TPS2052B, TPS2053B, TPS2054B
www.ti.com
SLVS514G – APRIL 2004 – REVISED OCTOBER 2006
APPLICATION INFORMATION (continued)
TUSB2040
Hub Controller
1/2 SN75240
BUSPWR
A C
B D
GANGED
Upstream
Port
D+
D−
DP0
DP1
DM0
DM1
Tie to TPS2041B EN Input
D+
A C
B D
GND
OC
5V
IN
5V
47 µF†
DP3
OUT
DM3
A C
B D
1 µF
TPS76333
4.7 µF
D−
GND
DM2
5-V Power
Supply
EN
0.1 µF
Ferrite Beads
SN75240
DP2
TPS2041B
Downstream
Ports
1/2 SN75240
D+
D−
Ferrite Beads
GND
IN
3.3 V
4.7 µF
VCC
5V
TPS2053B
GND
GND
48-MHz
Crystal
XTAL1
Tuning
Circuit
XTAL2
PWRON1
EN1 OUT1
OVRCUR1
OC1 OUT2
PWRON2
EN2
OVRCUR2
OC2
47 µF†
D+
IN1
0.1 µF
D−
Ferrite Beads
GND
PWRON3
OVRCUR3
EN3 OUT3
5V
OC3
47 µF†
OCSOFF
IN2
0.1 µF
GND
GND
GND
†
USB rev 1.1 requires 120 µF per hub.
Figure 35. Hybrid Self / Bus-Powered Hub Implementation, TPS2043B/TPS2053B
Submit Documentation Feedback
25
TPS2041B,, TPS2042B
TPS2043B, TPS2044B, TPS2051B
TPS2052B, TPS2053B, TPS2054B
www.ti.com
SLVS514G – APRIL 2004 – REVISED OCTOBER 2006
APPLICATION INFORMATION (continued)
TUSB2040
Hub Controller
Upstream
Port
SN75240
BUSPWR
A C
B D
GANGED
D+
D−
DP0
DP1
DM0
DM1
Tie to TPS2041B EN Input
D+
A C
B D
GND
OC
5V
IN
5V
33 µF†
DP3
OUT
DM3
A C
B D
1 µF
TPS76333
4.7 µF
SN75240
D+
D−
Ferrite Beads
GND
DP4
IN
3.3 V
4.7 µF
D−
GND
DM2
5-V Power
Supply
EN
0.1 µF
Ferrite Beads
SN75240
DP2
TPS2041B
Downstream
Ports
DM4
VCC
5V
TPS2044B
GND
GND
48-MHz
Crystal
XTAL1
Tuning
Circuit
XTAL2
PWRON1
EN1 OUT1
OVRCUR1
OC1 OUT2
PWRON2
EN2
OVRCUR2
OC2
33 µF†
D+
IN1
0.1 µF
D−
Ferrite Beads
GND
OCSOFF
PWRON3
EN3 OUT3
OVRCUR3
OC3 OUT4
PWRON4
EN4
OVRCUR4
OC4
5V
33 µF†
IN2
D+
0.1 µF
GND
Ferrite Beads
GND1
D−
GND
GND2
5V
†
33 µF†
USB rev 1.1 requires 120 µF per hub.
Figure 36. Hybrid Self / Bus-Powered Hub Implementation, TPS2044B/TPS2054B
26
Submit Documentation Feedback
TPS2041B,, TPS2042B
TPS2043B, TPS2044B, TPS2051B
TPS2052B, TPS2053B, TPS2054B
www.ti.com
SLVS514G – APRIL 2004 – REVISED OCTOBER 2006
APPLICATION INFORMATION (continued)
GENERIC HOT-PLUG APPLICATIONS
In many applications it may be necessary to remove modules or pc boards while the main unit is still operating.
These are considered hot-plug applications. Such implementations require the control of current surges seen by
the main power supply and the card being inserted. The most effective way to control these surges is to limit and
slowly ramp the current and voltage being applied to the card, similar to the way in which a power supply
normally turns on. Due to the controlled rise times and fall times of the TPS204xB/TPS205xB, these devices can
be used to provide a softer start-up to devices being hot-plugged into a powered system. The UVLO feature of
the TPS204xB/TPS205xB also ensures that the switch is off after the card has been removed, and that the
switch is off during the next insertion. The UVLO feature insures a soft start with a controlled rise time for every
insertion of the card or module.
PC Board
TPS2042B
OC1
GND
Power
Supply
2.7 V to 5.5 V
1000 µF
Optimum
0.1 µF
IN
EN1
EN2
Block of
Circuitry
OUT1
OUT2
OC2
Block of
Circuitry
Overcurrent Response
Figure 37. Typical Hot-Plug Implementation (Example, TPS2042B)
By placing the TPS204xB/TPS205xB between the VCC input and the rest of the circuitry, the input power
reaches these devices first after insertion. The typical rise time of the switch is approximately 1 ms, providing a
slow voltage ramp at the output of the device. This implementation controls system surge currents and provides
a hot-plugging mechanism for any device.
DETAILED DESCRIPTION
Power Switch
The power switch is an N-channel MOSFET with a low on-state resistance. Configured as a high-side switch,
the power switch prevents current flow from OUT to IN and IN to OUT when disabled. The power switch
supplies a minimum current of 500 mA.
Charge Pump
An internal charge pump supplies power to the driver circuit and provides the necessary voltage to pull the gate
of the MOSFET above the source. The charge pump operates from input voltages as low as 2.7 V and requires
little supply current.
Driver
The driver controls the gate voltage of the power switch. To limit large current surges and reduce the associated
electromagnetic interference (EMI) produced, the driver incorporates circuitry that controls the rise times and fall
times of the output voltage.
Enable (ENx)
The logic enable pin disables the power switch and the bias for the charge pump, driver, and other circuitry to
reduce the supply current. The supply current is reduced to less than 1 µA or 2 µA when a logic high is present
on EN. A logic zero input on EN restores bias to the drive and control circuits and turns the switch on. The
enable input is compatible with both TTL and CMOS logic levels.
Submit Documentation Feedback
27
TPS2041B,, TPS2042B
TPS2043B, TPS2044B, TPS2051B
TPS2052B, TPS2053B, TPS2054B
www.ti.com
SLVS514G – APRIL 2004 – REVISED OCTOBER 2006
DETAILED DESCRIPTION (continued)
Enable (ENx)
The logic enable disables the power switch and the bias for the charge pump, driver, and other circuitry to
reduce the supply current. The supply current is reduced to less than 1 µA or 2 µA when a logic low is present
on ENx. A logic high input on ENx restores bias to the drive and control circuits and turns the switch on. The
enable input is compatible with both TTL and CMOS logic levels.
Overcurrent (OCx)
The OCx open-drain output is asserted (active low) when an overcurrent or overtemperature condition is
encountered. The output remains asserted until the overcurrent or overtemperature condition is removed. A
10-ms deglitch circuit prevents the OCx signal from oscillation or false triggering. If an overtemperature
shutdown occurs, the OCx is asserted instantaneously.
Current Sense
A sense FET monitors the current supplied to the load. The sense FET measures current more efficiently than
conventional resistance methods. When an overload or short circuit is encountered, the current-sense circuitry
sends a control signal to the driver. The driver in turn reduces the gate voltage and drives the power FET into its
saturation region, which switches the output into a constant-current mode and holds the current constant while
varying the voltage on the load.
Thermal Sense
The TPS204xB/TPS205xB implements a thermal sensing to monitor the operating temperature of the power
distribution switch. In an overcurrent or short-circuit condition, the junction temperature rises. When the die
temperature rises to approximately 140°C due to overcurrent conditions, the internal thermal sense circuitry
turns off the switch, thus preventing the device from damage. Hysteresis is built into the thermal sense, and after
the device has cooled approximately 10 degrees, the switch turns back on. The switch continues to cycle off and
on until the fault is removed. The open-drain false reporting output (OCx) is asserted (active low) when an
overtemperature shutdown or overcurrent occurs.
Undervoltage Lockout
A voltage sense circuit monitors the input voltage. When the input voltage is below approximately 2 V, a control
signal turns off the power switch.
28
Submit Documentation Feedback
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TPS2041BD
ACTIVE
SOIC
D
8
TPS2041BDBVR
ACTIVE
SOT-23
DBV
TPS2041BDBVRG4
ACTIVE
SOT-23
TPS2041BDBVT
ACTIVE
TPS2041BDBVTG4
75
Lead/Ball Finish
MSL Peak Temp (3)
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SOT-23
DBV
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ACTIVE
SOT-23
DBV
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS2041BDG4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS2041BDGN
ACTIVE
MSOPPower
PAD
DGN
8
80
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS2041BDGN-ASY
OBSOLETE
MSOPPower
PAD
DGN
8
TBD
Call TI
TPS2041BDGNG4
ACTIVE
MSOPPower
PAD
DGN
8
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS2041BDGNR
ACTIVE
MSOPPower
PAD
DGN
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS2041BDGNRG4
ACTIVE
MSOPPower
PAD
DGN
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS2041BDR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS2041BDRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS2042BD
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS2042BDG4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS2042BDGN
ACTIVE
MSOPPower
PAD
DGN
8
80
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS2042BDGNG4
ACTIVE
MSOPPower
PAD
DGN
8
80
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS2042BDGNR
ACTIVE
MSOPPower
PAD
DGN
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS2042BDGNRG4
ACTIVE
MSOPPower
PAD
DGN
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS2042BDR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS2042BDRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
80
Addendum-Page 1
Call TI
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TPS2043BD
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS2043BDG4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS2043BDR
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS2043BDRG4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS2044BD
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS2044BDG4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS2044BDR
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS2044BDRG4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS2051BD
ACTIVE
SOIC
D
8
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS2051BDBVR
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS2051BDBVRG4
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS2051BDBVT
ACTIVE
SOT-23
DBV
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS2051BDBVTG4
ACTIVE
SOT-23
DBV
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS2051BDG4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS2051BDGN
ACTIVE
MSOPPower
PAD
DGN
8
80
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS2051BDGNG4
ACTIVE
MSOPPower
PAD
DGN
8
80
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS2051BDGNR
ACTIVE
MSOPPower
PAD
DGN
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS2051BDGNRG4
ACTIVE
MSOPPower
PAD
DGN
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS2051BDR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS2051BDRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS2052BD
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS2052BDG4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS2052BDGN
ACTIVE
MSOPPower
PAD
DGN
8
80
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS2052BDGNG4
ACTIVE
MSOP-
DGN
8
80
Green (RoHS &
CU NIPDAU
Level-2-260C-1 YEAR
75
Addendum-Page 2
Lead/Ball Finish
MSL Peak Temp (3)
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
6-Dec-2006
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
Power
PAD
Lead/Ball Finish
MSL Peak Temp (3)
no Sb/Br)
TPS2052BDGNR
ACTIVE
MSOPPower
PAD
DGN
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS2052BDGNRG4
ACTIVE
MSOPPower
PAD
DGN
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TPS2052BDR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS2052BDRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS2053BD
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS2053BDG4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS2053BDR
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS2053BDRG4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS2054BD
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS2054BDG4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS2054BDR
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS2054BDRG4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
7-May-2007
TAPE AND REEL INFORMATION
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
Device
7-May-2007
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
TPS2041BDBVR
DBV
5
NSE
177
8
3.2
3.2
1.4
4
8
NONE
TPS2041BDBVT
DBV
5
NSE
177
8
3.2
3.2
1.4
4
8
NONE
TPS2041BDGNR
DGN
8
LEN
330
12
5.2
3.3
1.6
8
12
NONE
TPS2041BDR
D
8
TAI
330
12
6.4
5.2
2.1
8
12
Q1
TPS2041BDR
D
8
FMX
330
0
6.4
5.2
2.1
8
12
Q1
TPS2042BDGNR
DGN
8
LEN
330
12
5.2
3.3
1.6
8
12
NONE
TPS2042BDGNR
DGN
8
NSE
330
12
5.3
3.3
1.3
8
12
NONE
TPS2042BDR
D
8
TAI
330
12
6.4
5.2
2.1
8
12
Q1
TPS2042BDR
D
8
FMX
330
0
6.4
5.2
2.1
8
12
Q1
TPS2051BDBVR
DBV
5
NSE
177
8
3.2
3.2
1.4
4
8
NONE
TPS2051BDBVT
DBV
5
NSE
177
8
3.2
3.2
1.4
4
8
NONE
TPS2051BDGNR
DGN
8
LEN
330
12
5.2
3.3
1.6
8
12
NONE
TPS2051BDR
D
8
TAI
330
12
6.4
5.2
2.1
8
12
Q1
TPS2051BDR
D
8
FMX
330
0
6.4
5.2
2.1
8
12
Q1
TPS2052BDGNR
DGN
8
LEN
330
12
5.2
3.3
1.6
8
12
NONE
TPS2052BDR
D
8
TAI
330
12
6.4
5.2
2.1
8
12
Q1
TPS2052BDR
D
8
FMX
330
0
6.4
5.2
2.1
8
12
Q1
TAPE AND REEL BOX INFORMATION
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
TPS2041BDBVR
DBV
5
NSE
195.0
200.0
45.0
TPS2041BDBVT
DBV
5
NSE
195.0
200.0
45.0
TPS2041BDGNR
DGN
8
LEN
566.0
155.0
150.0
TPS2041BDR
D
8
TAI
346.0
346.0
61.0
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
7-May-2007
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
TPS2041BDR
D
8
FMX
342.9
336.6
20.6
TPS2042BDGNR
DGN
8
LEN
566.0
340.5
21.1
TPS2042BDGNR
DGN
8
NSE
370.0
355.0
75.0
TPS2042BDR
D
8
TAI
346.0
346.0
61.0
TPS2042BDR
D
8
FMX
342.9
336.6
20.6
TPS2051BDBVR
DBV
5
NSE
195.0
200.0
45.0
TPS2051BDBVT
DBV
5
NSE
195.0
200.0
45.0
TPS2051BDGNR
DGN
8
LEN
566.0
155.0
150.0
TPS2051BDR
D
8
TAI
346.0
346.0
61.0
TPS2051BDR
D
8
FMX
342.9
336.6
20.6
TPS2052BDGNR
DGN
8
LEN
566.0
340.5
21.1
TPS2052BDR
D
8
TAI
346.0
346.0
61.0
TPS2052BDR
D
8
FMX
342.9
336.6
20.6
Pack Materials-Page 3
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