EClamp1002A ESD/EMI Protection for Speaker Ports PRELIMINARY PROTECTION PRODUCTS - EMIClampTM Description Features The EClamp 1002A is a low pass filter array with integrated TVS diodes for ESD protection. It is designed to provide bidirectional filtering of EMI/RFI signals and electrostatic discharge (ESD) protection in portable electronic equipment. This state-of-the-art device utilizes solid-state silicon-avalanche technology for superior clamping performance and DC electrical characteristics. They have been optimized for use on a speaker port in cellular phones and other portable electronics. The EClamp1002A effectively replaces 10 discrete components in a small SC-89 package to provide ESD protection and EMI filtering. Each device requires less than 2.9mm2 of PCB area with a low profile of only 0.60mm. This small package will protect and filter up to two lines. This small outline makes the device especially well suited for portable applications. The TVS diodes are bidirectional for supporting bipolar audio signals without distortion. The TVS diodes provide effective suppression of ESD voltages in excess of 15kV (air discharge) and 8kV (contact discharge) per IEC 610004-2, level 4. The device has very low insertion loss in the pass band (to approximately 10MHz) and high attenuation at frequencies ranging from 800MHz to 3GHz. Each line features two stages of TVS diode protection. They feature large cross-sectional area junctions for conducting high transient currents. They offer desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. Transient protection for data lines to TM IEC 61000-4-2 (ESD) 15kV (air), 8kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) Bidirectional EMI/RFI filter with integrated ESD protection Protects two I/O lines 1.7 x 1.7 x 0.6mm Ultra-small SC-89 package (1.7 0.6mm) 2 requires less than 2.9mm of PCB area Working voltage: 5V Low leakage current Low operating and clamping voltages Solid-state silicon-avalanche technology Mechanical Characteristics SC-89 (SOT-666) package RoHS/WEEE Compliant Lead Finish: Matte Tin Molding compound flammability rating: UL 94V-0 Marking : Marking Code Weight: 2.9mg (typical) Packaging : Tape and Reel per EIA 481 Applications Dimensions Cellular Handsets & Accessories Cordless Phones Personal Digital Assistants (PDAs) Webpads & Handhelds Notebook Portable Instrumentation MP3 Players Schematic & Pin Configuration 1.70 0.50 1.25 1.70 0.30 0.60 SC-89 (Top View) Revision 01/12/2006 1 www.semtech.com EClamp1002A PRELIMINARY PROTECTION PRODUCTS Absolute Maximum Rating R ating Symbol Value Units Steady-State Power Pss 100 mW ESD p er IEC 61000-4-2 (Air) ESD p er IEC 61000-4-2 (Contact) VESD >16 >10 kV TJ -55 to +125 o TSTG -55 to +150 o Op erating Temp erature Storage Temp erature C C Electrical Characteristics (T=25oC) P a r a met er Symb ol C on d i t i on s T VS Reverse Stand-Of f Voltage VRWM T VS Reverse Breakdown Voltage VBR It = 1mA T VS Reverse Leakage Current IR VRWM = 5V, T=25°C Series Resistance R Each Line Total Capacitance CTOT Any I/O to Ground VR = 0V, f = 1MHz 2006 Semtech Corp. 2 Mi n i mu m Ty p i c a l M a xi m u m Un i ts 5 V 6 8 .5 V 10 5 µA 11.5 Ohms 160 pF www.semtech.com EClamp1002A PRELIMINARY PROTECTION PRODUCTS Typical Characteristics Typical Insertion loss CH1 S21 LOG Analog Crosstalk 6 dB / REF 0 dB CH1 S21 LOG 20 dB/ REF 0 dB 1: -3.9607 dB 42MHz 2: -22.231 dB 900 MHz 0 dB 3: -14.018 dB 1.8 GHz 1 -6 dB 4: -10.484 dB 2.5 GHz -12 dB 4 3 -18 dB -24 dB 2 -30 dB -36 dB -42 dB 1 MHz 10 MHz 100 MHz 3 1 GHz GHz STOP 3 000. 000000 MHz START . 030 MHz Capacitance vs. Reverse Voltage (Normalized to 0 volts) Clamping Voltage vs. Peak Pulse Current 14.000 1.6 12.000 1.4 1.2 10.000 CJ(VR) / CJ(VR=0)) Clamping Voltage - VC (V) STOP 3000. 000000 MHz START . 030 MHz 8.000 6.000 4.000 1 0.8 0.6 0.4 Waveform Parameters: tr = 8µs td = 20µs 2.000 0.2 f = 1 MHz 0 0.000 0 1 2 3 4 5 6 0 7 1 1.5 2 2.5 3 3.5 4 4.5 5 Reverse Voltage - VR (V) Peak Pulse Current - IPP (A) ESD Clamping (8kV Contact) 2006 Semtech Corp. 0.5 ESD Clamping (15kV Air) 3 www.semtech.com EClamp1002A PRELIMINARY PROTECTION PRODUCTS Applications Information Layout Examples Device Connection Options The EClamp1002A provides EMI filtering and ESD protection in a small SC-89 package for speaker port applications. The equivalent circuit diagram is shown below. The layout of the device is designed such that the data lines can be routed through the device. The first line pair enters at pins 1 and exits at pins 6. The second line pair enters at pins 3 and exits at pins 4. The device is symmetrical so the above connections may be reversed. Layout examples are shown to the right. 1 Speaker 3 Audio Codec 6 5 4 Option 1 Circuit Board Layout Recommendations for Suppression of ESD. Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: z Place the TVS near the input terminals or connectors to restrict transient coupling. z Minimize the path length between the TVS and the protected line. z Minimize all conductive loops including power and ground loops. z The ESD transient return path to ground should be kept as short as possible. z Never run critical signals near board edges. z Use ground planes whenever possible. Pin Identification 1 Line 1 In (From Speaker) 6 Line 1 Out (To Audio Circuit) 3 Line 2 In (From Speaker) 4 Line 2 Out (To Audio Circuit) 2, 5 Ground 4 Speaker 5 6 Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. 2006 Semtech Corp. 2 EClamp1002A EClamp1002A Audio Codec 3 2 1 Option 2 4 Pin Identification 6 Line 1 In (From Speaker) 1 Line 1 Out (To Audio Circuit) 4 Line 2 In (From Speaker) 3 Line 2 Out (To Audio Circuit) 2, 5 Ground www.semtech.com EClamp1002A PRELIMINARY PROTECTION PRODUCTS Outline Drawing- SC-89 (SOT-666) D A D N DIM A b c D E E1 e L L1 N aaa E/2 E1 E L c 2 1 e DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX .019 .024 .005 .012 .003 .007 .059 .063 .067 .061 .063 .067 .043 .047 .049 .020 BSC .003 .008 .012 .003 .006 .008 6 .004 0.50 0.60 0.15 0.30 0.10 0.18 1.50 1.60 1.70 1.55 1.60 1.70 1.10 1.20 1.25 0.50 BSC 0.10 0.20 0.30 0.10 0.15 0.20 6 0.10 Nxb aaa B A C A-B D C L1 NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. Land Pattern- SC-89 (SOT-666) X Y Z C DIM C P G X Y Z G Y DIMENSIONS INCHES MILLIMETERS (.057) .020 .024 .012 .033 .090 (1.45) 0.50 0.60 0.30 0.85 2.30 P NOTES: 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET 2006 Semtech Corp. 5 www.semtech.com EClamp1002A PRELIMINARY PROTECTION PRODUCTS Marking Code Ordering Information O Part Number Lead Finish Device Marking Qty per Reel Reel Size EClamp 1002A.TCT Pb Free O 3,000 7 Inch EClamp and EMIClamp are trademarks of Semtech Corporation Note: (1) Device is symmetrical so there is no pin 1 identifier. Tape and Reel Specification O O O Tape Specification and Device Orientation Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 2006 Semtech Corp. 6 www.semtech.com